JP2013113752A - Method for installing ultrasonic probe and monitoring system using ultrasonic probe - Google Patents

Abstract

PROBLEM TO BE SOLVED: To continuously monitor a state of a complicated shape part of a test object without removing a thermal insulation material.SOLUTION: A thin film sensor is installed on the complicated shape part of the test body by a first process (step P3) for applying a proper amount of an adhesive having thermal resistance to the complicated shape part of the test object and mounting the thin film sensor on the adhesive, a second process (step P5) for connecting an ultrasonic flaw detector to the thin film sensor to confirm a sensor signal waveform, measuring signal strength when the sensor signal waveform can be confirmed, and performing processing of the first process again when the sensor signal waveform cannot be confirmed, a third process (step S7) for releasing the connection between the thin film sensor and the ultrasonic flaw detector and curing the adhesive, and a fourth process (step S9) for connecting the ultrasonic flaw detector to the thin film sensor to confirm the sensor signal waveform, completing the installation of the thin film sensor when the strength of the sensor signal waveform is improved, and performing the processing of the first process again when the strength of the sensor signal waveform is not improved.

Description

  The present invention relates to an installation method of an ultrasonic probe and a monitoring system using the ultrasonic probe, and in particular, an ultrasonic probe for inspecting a state of thinning or a defect in a pipe of a nuclear power plant. The present invention relates to an installation method and a monitoring system using an ultrasonic probe.

  In the piping of a nuclear power plant, the inner wall is thinned by a high-temperature fluid (about 300 ° C.) flowing through the inside. Therefore, it is necessary to periodically inspect the thinning amount. This thinning phenomenon is conspicuous in a shape change portion such as a T-shaped tube or an elbow tube where the flow of the internal fluid changes, or a narrow portion (hereinafter referred to as a complex shape portion). The inspection of the thinning amount is performed by an ultrasonic flaw detection method (UT). The ultrasonic flaw detection method is a nondestructive test method that uses the acoustic properties of the member to be inspected when ultrasonic waves generated from the ultrasonic probe are transmitted to the member to be inspected. The ultrasonic probe is a transducer in which a vibrator having a sound absorbing material and a protective plate attached is inserted into a box.

  Conventionally, as a method of installing an ultrasonic probe on a straight pipe, a method of installing an ultrasonic probe on a subject via an adhesive is known (for example, see Patent Document 1). In Patent Document 1, an ultrasonic probe using a piezoelectric element is used.

JP 2011-47905 A

  However, although the one described in Patent Document 1 described above is effective when an ultrasonic probe is installed on a straight pipe, the ultrasonic probe is applied to a complicated shape portion (particularly concave surface) of a T-shaped tube or an elbow tube. When the child is installed, there has been a problem that the ultrasonic probe does not follow the curved surface of the subject and it is difficult to perform accurate measurement.

  In addition, conventionally, a method of measuring the thickness of a complex shape part of a T-shaped tube or an elbow tube at each periodic inspection has been taken, but an ultrasonic probe is installed on the subject for each periodic inspection to increase the thickness. When measuring the above, there were problems such as an increase in cost due to incidental work such as removing the pipe insulation, and a possibility that an error may occur in the measurement result due to a deviation in the installation position of the ultrasonic probe.

  Therefore, the present invention provides an ultrasonic probe installation method and a monitoring system using the ultrasonic probe that can constantly monitor the state of the complex shape portion of the subject. Objective.

  An ultrasonic probe installation method according to a first aspect of the present invention for solving the above-described problem is that an appropriate amount of a heat-resistant adhesive is applied to a complex shape portion of a subject, and a thin metal plate is applied to the adhesive. And a first step of placing a thin film sensor composed of a piezoelectric body and electrodes formed on the metal thin plate, and connecting an ultrasonic flaw detector to the thin film sensor with the thin film sensor placed on the adhesive Then, the sensor signal waveform is confirmed, and when the sensor signal waveform can be confirmed, the signal intensity is measured, and when the sensor signal waveform cannot be confirmed, the second process is performed again. The third step of releasing the connection between the thin film sensor and the ultrasonic flaw detector and curing the adhesive, and checking the sensor signal waveform by connecting the ultrasonic flaw detector to the thin film sensor, The signal intensity of the sensor signal waveform is the second When the signal strength measured in the process is improved, the installation of the thin film sensor is completed, while the signal strength of the sensor signal waveform is improved compared to the signal strength measured in the second process. If not, a fourth step of performing the process of the first step again is provided.

  An ultrasonic probe installation method according to a second aspect of the present invention for solving the above-described problem is the ultrasonic probe installation method according to the first aspect of the present invention, wherein the sensor is provided following the first step. A step of pressing and fixing the thin film sensor by a fixing means is provided.

  An ultrasonic probe installation method according to a third aspect of the present invention for solving the above-described problems is the ultrasonic probe installation method according to the second aspect of the present invention, wherein the sensor fixing means includes a samarium cobalt magnet and a buffer. The thin film sensor placed on the adhesive is pressed and fixed by the samarium cobalt magnet through the buffer material.

  A monitoring system using an ultrasonic probe according to a fourth aspect of the present invention for solving the above-described problem is that an appropriate amount of heat-resistant adhesive is applied to the attachment position of the thin film sensor, and a metal thin plate is applied to the adhesive. A first step of placing a thin film sensor composed of a piezoelectric body and an electrode formed on the thin metal plate; and connecting an ultrasonic flaw detector to the thin film sensor while the thin film sensor is placed on the adhesive. The sensor signal waveform is confirmed, and when the sensor signal waveform can be confirmed, the signal intensity is measured, and when the sensor signal waveform cannot be confirmed, the second process is performed again. The connection between the thin film sensor and the ultrasonic flaw detector is released, the third step of curing the adhesive, the ultrasonic flaw detector is connected to the thin film sensor and the sensor signal waveform is confirmed, Sensor signal waveform When the signal strength is improved compared to the signal strength measured in the second step, the installation of the thin film sensor is completed, while the signal strength of the sensor signal waveform is the signal measured in the second step. If the strength is not improved compared to the strength, the thickness of the complex shape portion of the subject is always measured using the ultrasonic probe installed in the fourth step of performing the processing of the first step again. It is characterized by monitoring.

  According to the installation method of the ultrasonic probe according to the present invention described above, the thin film sensor is fixed to the subject while following the shape of the subject without using a large-scale device for fixing the thin film sensor. Therefore, it is possible to perform construction under a pipe heat insulating material, and it is possible to permanently install a thin film sensor in a complicated shape portion of a T-shaped tube or an elbow tube and monitor the wall thickness.

  Further, according to the above-described monitoring system using the ultrasonic probe according to the present invention, monitoring (always monitoring) is performed during the operation period of plant piping, containers, etc. using the ultrasonic flaw detection method, and the thinning and grilling are performed. By inspecting cracks, not only reducing the wall thickness measurement work during regular inspections, but also expecting refinement of the prediction of thinning progress, etc., aiming to improve the reliability of plants that are aging and rationalize maintenance be able to.

It is explanatory drawing which shows the example of installation of the ultrasonic probe which concerns on embodiment of this invention. It is a flowchart which shows the flow of installation of the ultrasonic probe which concerns on embodiment of this invention. FIG. 3A is an explanatory view showing an example of fixing the ultrasonic probe according to the first embodiment of the present invention, and FIG. 3B is a partial sectional view of FIG. FIG. 4A is an explanatory view showing an example of fixing an ultrasonic probe according to the second embodiment of the present invention, and FIG. 4B is a partial sectional view of FIG. FIG. 5A is an explanatory view showing an example of fixing an ultrasonic probe according to the third embodiment of the present invention, and FIG. 5B is a partial sectional view of FIG. FIG. 6 (a) is an explanatory view showing an example of fixing an ultrasonic probe according to the fourth embodiment of the present invention, FIG. 6 (b) is a partial sectional view of FIG. 6 (a), and FIG. 6 (c). FIG. 3 is a perspective view showing a fixing portion of an ultrasonic probe. FIG. 7A is an explanatory view showing an example of fixing an ultrasonic probe according to the fifth embodiment of the present invention, and FIG. 7B is a partial sectional view of FIG. 7A. FIG. 8A is an explanatory view showing an example of fixing an ultrasonic probe according to the sixth embodiment of the present invention, and FIG. 8B is a partial sectional view of FIG. 8A.

  The details of an ultrasonic probe installation method and a monitoring system using an ultrasonic probe according to an embodiment of the present invention will be described below with reference to FIGS. 1 and 2.

  As shown in FIG. 1, the monitoring system using the ultrasonic probe according to this embodiment fixes a thin film sensor 2 to a complicated shape portion 1a of a subject 1 such as a T-shaped tube or an elbow tube. The thickness of the complex shape part 1a of the specimen 1 is constantly monitored.

  As the thin film sensor 2, an ultrasonic probe using a thin-film piezoelectric ceramic having flexibility and heat resistance is used. In the monitoring system using the ultrasonic probe according to the present embodiment, By attaching the thin film sensor 2 to the subject 1 using a heat-resistant adhesive (for example, a conductive adhesive, silver paste, etc.) and fixing the thin film sensor 2 on the subject 1, The thickness of the complex shape portion 1a of the subject 1 is constantly monitored.

  In the ultrasonic probe installation method and the monitoring system using the ultrasonic probe according to the present embodiment, the thin film sensor 2 includes a metal thin plate, a piezoelectric body formed on the metal thin plate, an electrode, The thin film sensor 2 is arranged so that the long side of the thin film sensor 2 follows the concave portion of the complex shape portion 1a.

  Next, a method for installing the ultrasonic probe according to the present embodiment will be described with reference to FIG. As shown in FIG. 2, when the thin film sensor 2 is fixed to the complicated shape portion 1a, first, as a sensor operation check, the signal waveform of the thin film sensor 2 is checked (step P1), and the subject preparation is performed on the subject 1. Dirt and rust on the surface are removed, and a sanding process is performed as necessary (step P2).

  Subsequently, an appropriate amount of heat-resistant adhesive is applied to the sensor mounting position that has been previously marked, and the thin film sensor 2 is placed on the adhesive (step P3). Thereafter, a buffer material (for example, a glass cloth having heat resistance, a heat-resistant sponge, etc.) is applied to the thin film sensor 2, and the thin film sensor 2 is pressed and fixed by the pressing means through the buffer material (step P4). In addition, as a press means, the metal band mentioned later, a self-bonding tape, a belt, a jacket system, spot welding, a magnet direct press etc. can be considered.

  Following step P4, an ultrasonic flaw detector is connected to the thin film sensor 2 while the thin film sensor 2 is pressed by the pressing means, and the sensor signal waveform is confirmed (step P5). As a result of confirmation, if multiple reflection echoes within the thickness of the subject 1 can be confirmed (YES), the signal intensity is measured (step P6). On the other hand, if the multiple reflection echo within the plate thickness of the subject 1 cannot be confirmed (NO), the pressing on the thin film sensor 2 by the pressing means is released, and the installation state of the thin film sensor 2 (for example, the position of the thin film sensor 2 or The inclination and the contact state with the adhesive (such as the presence or absence of bubbles) are corrected, and the process returns to step P4.

  Subsequent to Step P6, for example, if the adhesive is a heat-curable adhesive, the adhesive is cured in accordance with the specifications of the adhesive, such as heating and baking the adhesive (Step P7). In addition, when performing heat baking, as a heating method, the method of winding a tape heater, a rubber heater, etc. from the thin film sensor 2, the thing by an induction heating apparatus etc. can be considered. During heating, it is preferable not to lower the heating efficiency with a temporary heat insulating material or the like. Further, as the adhesive, in addition to the heat curable adhesive, for example, an ultraviolet curable adhesive or a room temperature curable adhesive can be used, and various modifications can be made without departing from the spirit of the present invention. Needless to say.

  Following step P7, the signal waveform of the thin film sensor 2 is confirmed in the same manner as in step P4 (step P8). If a multiple reflection echo within the thickness of the subject is confirmed as a result of the confirmation (YES), the process proceeds to step P9. On the other hand, if multiple reflection echoes within the plate thickness of the subject 1 cannot be confirmed (NO), it is assumed that the thin film sensor 2 is not sufficiently installed, and the process returns to step P2 and the thin film sensor 2 is installed again.

In Step P9, it is determined whether or not the signal intensity is improved from that before heating. If appropriate contact / pressing / heating is performed, the signal intensity should be improved. If the signal intensity is improved (YES), the installation of the thin film sensor 2 is completed (step P10). On the other hand, if the signal intensity is not improved (NO), it is considered that the distribution of the adhesive is uneven or there are voids such as pores. Return and install the thin film sensor 2 again.
As described above, the process of fixing the thin film sensor 2 to the subject 1 is performed.

  According to the ultrasonic probe installation method and the monitoring system using the ultrasonic probe according to the present embodiment described above, a narrow portion of the subject 1 having a complicated shape such as a T-shaped tube or an elbow tube. Since the thin film sensor 2 can be fixed to the subject 1 in a state following the three-dimensional curvature shape, the thickness of the complex shape portion 1a can be constantly monitored while obtaining a stable ultrasonic signal. Thus, more precise wall thickness management can be performed.

Further, since a large jig is not required after the adhesive is cured, it is only necessary to provide a simple jig that protects the connecting portion, and space saving is possible.
In addition, the thin film sensor 2 made of ceramic and metal has heat resistance, so it can withstand heating when curing the adhesive, and it can be applied under the existing heat insulating material when covering the piping with the heat insulating material during plant operation. It is also possible to do.

  A method for installing the ultrasonic probe according to the first embodiment of the present invention will be described with reference to FIG. This embodiment is an example in which the samarium cobalt magnet 11 shown in FIG. 3 is used as the pressing means used for pressing and fixing the thin film sensor 2 shown in FIG. Other configurations are the same as those of the ultrasonic probe installation method according to the above-described embodiment, and hereinafter, overlapping description will be omitted and different points will be mainly described.

  As shown in FIG. 3A, in the ultrasonic probe installation method according to this embodiment, when the thin film sensor 2 is installed, the thin film sensor 2 is magnetically covered by a samarium cobalt magnet 11 as a pressing means. It is pressed against the complex shape portion 1a of the sample (T-shaped tube in this embodiment). More specifically, as shown in FIG. 3 (b), an appropriate amount of thermosetting adhesive 3 is applied to the sensor mounting position where marking has been performed in advance, and after the thin film sensor 2 is placed on the adhesive 3, the thin film sensor is applied. A buffer material 12 made of a heat-resistant fiber (for example, glass fiber) is applied to 2, and the samarium cobalt magnet 11 presses the thin film sensor 2 with the magnetic force through the buffer material 12.

  The thin film sensor 2 has a structure in which a piezoelectric body 2b is formed on a thin substrate (metal thin plate) 2c mainly made of metal, and an upper electrode 2a is provided on the piezoelectric body 2b. The lower electrode is provided on the opposite side of the metal thin plate 2c from the piezoelectric body 2b, and is configured such that ultrasonic waves can be transmitted and received by connecting signal lines (not shown) to the upper electrode 2a and the lower electrode. FIG. 3B schematically shows the fixed state of the thin film sensor 2, which is different from the actual dimensions.

  Here, by using the thermosetting adhesive 3 as an adhesive, when the multiple reflection echo cannot be confirmed in the process of step P5 described above, the samarium cobalt magnet 11 and the buffer material 12 are temporarily removed, and the thin film sensor 2 is removed. The installation state of can be corrected. After the installation state of the thin film sensor 2 is corrected, the thin film sensor 2 is pressed again toward the subject 1 by the samarium cobalt magnet 11 through the buffer material 12.

  On the other hand, when multiple reflection echoes are confirmed in the process of step P5, the surface of the subject 1 is heated to cure the adhesive 3. At this time, since the samarium-cobalt magnet 11 has heat resistance, the thin film sensor 2 is attached to the subject 1 without lowering the magnetic force even during heating and baking for curing the adhesive 3 (for example, 150 ° C., 30 minutes). Can be pressed.

  According to the installation method of the ultrasonic probe according to the present example, in addition to the effects of the installation method of the ultrasonic probe according to the above-described embodiment, the fixing location of the thin film sensor 2 can be freely set. can do. For example, even if it is other than the complicated shape portion 1a, it is possible to install a plurality of thin film sensors 2 close to each other as indicated by a virtual line in FIG.

Further, by interposing the buffer material 12 between the thin film sensor 2 and the samarium cobalt magnet 11, the upper electrode of the thin film sensor 2 can be protected and the thin film sensor 2 can be pressed with a uniform pressure. The shape of the complicated shape portion 1a can be surely followed.
Note that it is not always necessary to remove the samarium cobalt magnet 11 after the adhesive 3 is cured, and depending on the construction conditions, the thin film sensor 2 can be applied under the existing heat insulating material with the samarium cobalt magnet 11 left. is there.

  An ultrasonic probe installation method according to the second embodiment of the present invention will be described with reference to FIG. This embodiment is an example in which the self-bonding tape 21 shown in FIG. 4 is used as the pressing means used for pressing and fixing the thin film sensor 2 shown in FIG. Other configurations are the same as those of the ultrasonic probe installation method according to the above-described embodiment and the first example, and hereinafter, overlapping description will be omitted and different points will be mainly described.

  As shown in FIG. 4A, in the ultrasonic probe installation method according to the present embodiment, when the thin film sensor 2 is installed, the thin film sensor 2 has a heat-resistant self-bonding tape 21 as a pressing means. Is pressed against the complicated shape portion 1a of the subject (T-shaped tube in this embodiment). More specifically, as shown in FIG. 4B, an appropriate amount of a thermosetting adhesive 3 is applied to the sensor mounting position where marking has been performed in advance, and after the thin film sensor 2 is placed on the adhesive 3, the thin film sensor is applied. The self-bonding tape 21 is wound around the subject 1 so that 2 is pressed against the complicated shape portion 1a.

  Here, by using the thermosetting adhesive 3 as the adhesive, when the multiple reflection echo cannot be confirmed in the process of step P5 described above, the self-bonding tape 21 is temporarily removed and the thin film sensor 2 is installed. Can be corrected. After the installation state of the thin film sensor 2 is corrected, the thin film sensor 2 is again pressed toward the subject 1 by the self-bonding tape 21.

  On the other hand, when multiple reflection echoes are confirmed in the process of step P5, the surface of the subject 1 is heated to cure the adhesive 3. At this time, since the self-bonding tape 21 has heat resistance, the thin film sensor 2 should be pressed against the subject 1 even during heating and baking for curing the adhesive 3 (for example, 150 ° C., 30 minutes). Can do.

  According to the installation method of the ultrasonic probe according to this example, in addition to the effect of the installation method of the ultrasonic probe according to the above-described embodiment, the thin film sensor 2 can be easily attached to the subject 1 side. The thin film sensor 2 can surely follow the shape of the complicated shape portion 1a.

  Note that it is not always necessary to remove the self-bonding tape 21 after the adhesive 3 is cured, and the thin film sensor 2 may be applied to the existing heat insulating material with the self-bonding tape 21 left depending on the application conditions. Is possible.

  An ultrasonic probe installation method according to the third embodiment of the present invention will be described with reference to FIG. In this embodiment, as the pressing means used for pressing and fixing the thin film sensor 2 shown in FIG. 2, three heat-resistant belts (for example, Tinest-Z belt (registered trademark)) 31 and two triangular rings 32 shown in FIG. 5 are used. It is an example using. Other configurations are the same as those of the ultrasonic probe installation method according to the above-described embodiment and the first example, and hereinafter, overlapping description will be omitted and different points will be mainly described.

  As shown in FIG. 5A, in the ultrasonic probe installation method according to the present embodiment, when the thin film sensor 2 is installed, the thin film sensor 2 is connected to two triangular rings 31 as pressing means. The heat-resistant belt 31 is pressed against the complex shape portion 1 a of the subject (T-shaped tube in this embodiment) 1. More specifically, as shown in FIG. 5 (b), an appropriate amount of a thermosetting adhesive 3 is applied to a sensor mounting position that has been previously marked, and after the thin film sensor 2 is placed on the adhesive 3, the thin film sensor is applied. 2 is pressed by a heat-resistant belt 31 connected to two triangular rings 32.

  The three heat-resistant belts 31 are connected by two triangular rings 32, and the two heat-resistant belts 31 are arranged so as to straddle the two complex-shaped portions 1a of the subject 1 (T-shaped tube), respectively. 31 is arranged so as to straddle the bottom 1b of the subject 1 (T-shaped tube), and is configured such that the fastening force can be adjusted by the buckle 33. The heat-resistant belt 31 is configured to be detachable from the triangular ring 32.

  Here, by using the thermosetting adhesive 3 as the adhesive, when the multiple reflection echo cannot be confirmed in the process of Step P5 described above, the heat-resistant belt 31 is temporarily removed and the installation state of the thin film sensor 2 is corrected. can do. After the installation state of the thin film sensor 2 is corrected, the thin film sensor 2 is pressed again toward the subject 1 by the heat-resistant belt 31.

  On the other hand, when multiple reflection echoes are confirmed in the process of step P5, the surface of the subject 1 is heated to cure the adhesive 3. At this time, since the heat-resistant belt 31, the triangular ring 32, and the buckle 33 have heat resistance, the thin film sensor 2 is attached to the subject 1 even during heating and baking for curing the adhesive 3 (for example, 150 ° C., 30 minutes). Can be pressed.

  According to the installation method of the ultrasonic probe according to this example, in addition to the effects of the installation method of the ultrasonic probe according to the above-described embodiment, the three heat resistant belts 31 and the triangular ring 32 are provided. Can be used to press the thin film sensor 2 perpendicularly to the subject 1a in the complex shape portion 1a of the subject 1, and the complex shape portion 1a of the subject 1 (T-shaped in this embodiment). The thin film sensor 2 can be made to follow the shape of the tube shoulder).

  Further, by using the heat-resistant belt 31 having high-temperature heat resistance, application to high-temperature piping becomes possible, and by using the buckle 33, it is possible to adjust the tightening force at the time of belt tightening. . Moreover, the thin film sensor 2 can be installed between the heat-resistant belt 31 and the subject 1 other than the complicated shape portion 1a.

  Note that it is not always necessary to remove the heat-resistant belt 31 after the adhesive 3 is cured, and the thin-film sensor 2 can be applied to the existing heat insulating material with the heat-resistant belt 31 left depending on the application conditions.

  An installation method of an ultrasonic probe according to the fourth embodiment of the present invention will be described with reference to FIG. This embodiment is an example in which an aluminum plate 41 shown in FIG. 6 is used as pressing means used for fixing the thin film sensor 2 shown in FIG. Other configurations are the same as those of the ultrasonic probe installation method according to the above-described embodiment and the first example, and hereinafter, overlapping description will be omitted and different points will be mainly described.

  As shown in FIG. 6 (a), in the ultrasonic probe installation method according to the present embodiment, when the thin film sensor 2 is installed, the thin film sensor 2 is subjected to an object by a foil-like aluminum plate 41 as a pressing means. (T-shaped tube in this embodiment) 1 is pressed against the complicated shape portion 1a. More specifically, as shown in FIGS. 6B and 6C, an appropriate amount of thermosetting adhesive 3 is applied to the sensor mounting position where marking has been performed in advance, and the thin film sensor 2 is applied to the adhesive 3. After the placement, the thin film sensor 2 is covered with an aluminum plate 41 that is formed wider than the thin film sensor 2, and at least four corners of the aluminum plate 41 are spot-welded as indicated by reference numeral 42 in the figure, whereby the aluminum plate 41 Is configured to press the thin film sensor 2.

  Here, by using the thermosetting adhesive 3 as the adhesive, when the multiple reflection echo cannot be confirmed in the process of step P5 described above, the aluminum plate 41 is temporarily removed, and the installation state of the thin film sensor 2 is corrected. can do. After the installation state of the thin film sensor 2 is corrected, the thin film sensor 2 is covered again with the aluminum plate 41, and the aluminum plate 41 is spot welded to press the thin film sensor 2 toward the subject 1.

  On the other hand, when multiple reflection echoes are confirmed in the process of step P5, the surface of the subject 1 is heated to cure the adhesive 3. At this time, since the aluminum plate 41 has heat resistance, the thin film sensor 2 can be pressed against the subject 1 even during heating and baking for curing the adhesive 3 (for example, 150 ° C., 30 minutes). .

  According to the installation method of the ultrasonic probe according to the present example, in addition to the effects of the installation method of the ultrasonic probe according to the above-described embodiment, the fixing location of the thin film sensor 2 can be freely set. can do. For example, even if it is other than the complicated shape portion 1a, it is possible to install a plurality of thin film sensors 2 close to each other as indicated by a virtual line in FIG.

  Moreover, since the thin film sensor 2 is fixed with the aluminum plate 41 and the spot weld 42 which are metal, application at an ultra high temperature is attained.

  Note that it is not always necessary to remove the aluminum plate 43 after the adhesive 3 is cured, and it is possible to construct the thin film sensor 2 under the existing heat insulating material while leaving the aluminum plate 41 depending on the construction conditions.

  An ultrasonic probe installation method according to the fifth embodiment of the present invention will be described with reference to FIG. This embodiment is an example in which the jacket 51, the bolt 52, and the buffer material 53 shown in FIG. 7 are used as the pressing means used for pressing and fixing the thin film sensor 2 shown in FIG. Other configurations are the same as those of the ultrasonic probe installation method according to the above-described embodiment and the first example, and hereinafter, overlapping description will be omitted and different points will be mainly described.

  As shown in FIG. 7A, in the ultrasonic probe installation method according to the present embodiment, the thin film sensor 2 is pressed against the complicated shape portion 1a of the subject (T-shaped tube in this embodiment). It is pressed and fixed by a jacket 51, a bolt 52 and a buffer material 53 as means. The jacket 51 is made of a metal or a resin having high temperature heat resistance, and is configured to be detachable from the subject 1, and a through hole 51a (see FIG. 7B) is formed at a portion corresponding to the sensor mounting position. Has been.

  When the thin film sensor 2 is fixed to the subject 1, as shown in FIG. 7B, an appropriate amount of a thermosetting adhesive 3 is applied to the sensor mounting position where marking has been performed in advance, and the thin film sensor is applied to the adhesive 3. 2, the jacket 51 is attached to the subject 1 with the buffer material 53 interposed, and the bolt 52 presses the thin film sensor 2 through the buffer material 53 by the fastening force through the buffer material 53. It is configured to do.

  Here, by using the thermosetting adhesive 3 as the adhesive, the bolt 52, the jacket 51, and the buffer material 53 are once removed when the multiple reflection echo cannot be confirmed in the process of step P5 described above, and the thin film The installation state of the sensor 2 can be corrected. After the installation state of the thin film sensor 2 is corrected, the jacket 51 is attached to the subject 1 again with the buffer material 53 interposed, and the bolt 51 is fastened to the through hole 51a to attach the thin film sensor 2 to the subject 1. Press to the side.

  On the other hand, when multiple reflection echoes are confirmed in the process of step P5, the surface of the subject 1 is heated to cure the adhesive 3. At this time, since the jacket 51, the bolt 52, and the buffer material 53 have heat resistance, the magnetic force does not decrease even during heating and baking for curing the adhesive 3 (for example, 150 ° C., 30 minutes). 2 can be pressed against the subject 1.

  According to the installation method of the ultrasonic probe according to the present example, in addition to the effects of the installation method of the ultrasonic probe according to the above-described embodiment, the fixing location of the thin film sensor 2 can be freely set. can do. For example, it is possible to install a plurality of thin film sensors 2 close to each other as shown by a virtual line in FIG.

  Moreover, since the jacket 51 can be reused, cost reduction can be achieved. Furthermore, since the thin film sensor 2 is pressed using the bolt 52, the pressing force on the thin film sensor 2 can be adjusted.

  In addition, the upper electrode of the thin film sensor 2 can be protected by interposing the cushioning material 53 between the thin film sensor 2 and the bolt 52, and the thin film sensor 2 can be made to follow the shape of the complicated shape portion 1a. Can.

  After the adhesive 3 is cured, it is not always necessary to remove the jacket 51, the bolt 52, and the buffering agent 53. Depending on the construction conditions, the thin film sensor 2 can be mounted with the jacket 51, the bolt 52, and the buffering agent 53 remaining. It is also possible to construct under heat insulation.

  An ultrasonic probe installation method according to the sixth embodiment of the present invention will be described with reference to FIG. This embodiment is an example in which a metal band 61 shown in FIG. 8 is used as the pressing means used for pressing and fixing the thin film sensor 2 shown in FIG. Other configurations are the same as those of the ultrasonic probe installation method according to the above-described embodiment and the first example, and hereinafter, overlapping description will be omitted and different points will be mainly described.

  As shown in FIG. 8A, in the method of installing the ultrasonic probe according to the present embodiment, when the thin film sensor 2 is installed, the thin film sensor 2 is subjected to a subject (this embodiment) by a metal band 61 as a pressing means. In the example, the elbow pipe 1 is pressed against the complicated shape portion 1a. More specifically, as shown in FIG. 8B, an appropriate amount of a thermosetting adhesive 3 is applied to a sensor mounting position that has been previously marked, and after the thin film sensor 2 is placed on the adhesive 3, the thin film sensor is applied. 2 is covered with a buffer material 62 made of heat-resistant fiber (for example, glass fiber), and the metal band 61 presses the thin film sensor 2 through the buffer material 62.

  Here, by using the thermosetting adhesive 3 as the adhesive, when the multiple reflection echo cannot be confirmed in the process of step P5 described above, the metal band 61 and the buffer material 62 are once removed, and the thin film sensor 2 is removed. The installation state can be corrected. After correcting the installation state of the thin film sensor 2, the thin film sensor 2 is covered again with the buffer material 62, and the thin film sensor 2 is pressed toward the subject 1 by the metal band 61.

  On the other hand, when multiple reflection echoes are confirmed in the process of step P5, the surface of the subject 1 is heated to cure the adhesive 3. At this time, since the metal band 61 has heat resistance, the thin film sensor 2 can be pressed against the subject 1 even during heating and baking for curing the adhesive 3 (for example, 150 ° C., 30 minutes). .

  According to the installation method of the ultrasonic probe according to this example, in addition to the effect of the installation method of the ultrasonic probe according to the above-described embodiment, between the thin film sensor 2 and the metal band 61. The upper electrode of the thin film sensor 2 can be protected by interposing the buffer material 62 on the thin film sensor 2, and the thin film sensor 2 can be uniformly pressed even when the subject 1 is thermally expanded. 2 can be made to closely follow the shape of the complicated shape portion 1a.

  After the adhesive 3 is cured, it is not always necessary to remove the metal band 61 and the buffering agent 62. Depending on the construction conditions, the thin film sensor 2 is placed under the existing heat insulating material with the metal band 61 and the buffering agent 62 left. Construction is also possible. Moreover, although the example which provides the buffer material 62 over the circumferential direction of the subject 1 was shown in the present embodiment, the range in which the buffer material 62 is provided is not limited to the above-described range, and the thin film sensor 2, the metal band 61, and the like. Any structure may be used as long as the cushioning material 62 is interposed therebetween.

  The present invention is suitable for application to an ultrasonic probe installation method and a constant monitoring apparatus using an ultrasonic probe.

DESCRIPTION OF SYMBOLS 1 Subject 1a Complicated shape part 2 Thin film sensor 2a Upper electrode 2b Piezoelectric body 2c Metal thin plate 3 Adhesive 11 Samarium cobalt magnet 12 Buffer material 21 Self-bonding tape 31 Heat-resistant belt 32 Triangle ring 33 Buckle 41 Aluminum plate 42 Spot welding part 51 Jacket 52 Bolt 53 Holding material 61 Metal band 62 Buffer material

Claims (4)

First, an appropriate amount of heat-resistant adhesive is applied to the complex shape portion of the subject, and a thin film sensor composed of a metal thin plate, a piezoelectric body formed on the metal thin plate, and an electrode is placed on the adhesive. And the process of
An ultrasonic flaw detector is connected to the thin film sensor in a state where the thin film sensor is placed on the adhesive, and a sensor signal waveform is confirmed. If the sensor signal waveform is confirmed, the signal intensity is measured. If the signal waveform cannot be confirmed, the second step to perform the processing of the first step again,
A third step of releasing the connection between the thin film sensor and the ultrasonic flaw detector and curing the adhesive;
The ultrasonic flaw detector is connected to the thin film sensor to check the sensor signal waveform, and when the signal strength of the sensor signal waveform is improved compared to the signal strength measured in the second step, While completing the installation of the thin film sensor, if the signal strength of the sensor signal waveform is not improved compared to the signal strength measured in the second step, the fourth step is performed again. And an ultrasonic probe installation method comprising: a step.   The ultrasonic probe installation method according to claim 1, further comprising a step of pressing and fixing the thin film sensor by a sensor fixing unit following the first step. The sensor fixing means is a samarium cobalt magnet and a buffer material,
The ultrasonic probe installation method according to claim 2, wherein the thin film sensor placed on the adhesive is pressed and fixed by the samarium cobalt magnet through the buffer material. A first step of applying an appropriate amount of heat-resistant adhesive to the attachment position of the thin film sensor, and placing a thin film sensor composed of a thin metal plate, a piezoelectric body and an electrode formed on the thin metal plate on the adhesive; ,
An ultrasonic flaw detector is connected to the thin film sensor in a state where the thin film sensor is placed on the adhesive, and a sensor signal waveform is confirmed. If the sensor signal waveform is confirmed, the signal intensity is measured. If the signal waveform cannot be confirmed, the second step to perform the processing of the first step again,
A third step of releasing the connection between the thin film sensor and the ultrasonic flaw detector and curing the adhesive;
The ultrasonic flaw detector is connected to the thin film sensor to check the sensor signal waveform, and when the signal strength of the sensor signal waveform is improved compared to the signal strength measured in the second step, While completing the installation of the thin film sensor, if the signal strength of the sensor signal waveform is not improved compared to the signal strength measured in the second step, the fourth step is performed again. A monitoring system using an ultrasonic probe, wherein the thickness of the complex shape portion of the subject is constantly monitored using an ultrasonic probe installed in a process.

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