JP2013093362A - Capacitance element and resonant circuit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve a dielectric constant and increase capacitance by using the residual stress occurring at the time of burning, in a capacitance element.SOLUTION: A capacitive element (variable capacitance element 1) includes: a capacitive element body 2 that has a dielectric layer 5 and at least a pair of internal electrodes 10 formed to sandwich the dielectric layer 5; and external terminals 3 and 4 that are formed on side surfaces of the capacitive element body 2 and are electrically connected to the internal electrodes 10. The capacitive element is configured so that a stress occurring due to a difference of linear expansion coefficients of the dielectric layer 5 and the internal terminals 10 is concentrated on the center of a capacitor C configured by the dielectric layer 5 and the pair of internal electrodes 10 sandwiching the dielectric layer 5.

Description

  The present invention relates to a capacitive element and a resonance circuit including the capacitive element.

  In recent years, with the miniaturization and high reliability of electronic devices, there is a demand for the development of miniaturized capacitive elements as electronic components used in the electronic devices. In order to make the capacitive element smaller and higher in capacity, a capacitive element in which dielectric layers and internal electrodes are alternately stacked has been proposed.

  On the other hand, the inventors of the present invention provide a capacitor element formed by laminating a plurality of internal electrodes by providing an irrelevant internal electrode in the capacitor element body that forms a capacitance as a stress control unit, and by the residual stress generated during firing. A technique for improving electrical characteristics has been proposed (Patent Document 1). In the technique described in Patent Document 1, by providing a stress control unit formed by laminating internal electrodes on the upper and lower sides of a capacitive element body, internal stress caused by contraction of a dielectric layer during firing of the capacitive element is reduced. It can be generated in the dielectric layer of the body. As a result, the relative dielectric constant of the dielectric layer of the capacitive element body can be increased.

WO2011 / 013658 publication

  Thus, in the capacitive element formed by laminating the internal electrodes, the dielectric constant can be improved and the capacitance can be increased by utilizing the residual stress generated during firing. For this reason, if this residual stress can be further increased, the capacitance element can be further reduced in size.

  In view of the above points, the present disclosure aims to improve electrical characteristics in a capacitive element. It is another object of the present invention to provide a resonance circuit with excellent reliability by using the capacitance element.

  An electrostatic capacitance element of the present disclosure is formed on a side surface of a capacitive element body including a dielectric layer and at least a pair of internal electrodes formed with the dielectric layer interposed therebetween. External terminals connected to each other. The stress generated due to the difference in linear expansion coefficient between the dielectric layer and the internal electrode is concentrated at the center of the capacitor formed by the dielectric layer and the pair of internal electrodes sandwiching the dielectric layer. Has been.

  In the electrostatic capacitance element of the present disclosure, stress (residual) is concentrated at the center of the capacitor, so that the electrostatic capacitance per unit volume increases.

  A resonance circuit of the present disclosure includes a resonance capacitor including the capacitance element and a resonance coil connected to the resonance capacitor.

  According to the present disclosure, the residual stress in the electrostatic capacitance element increases, thereby improving the electrical characteristics.

FIG. 1A is a perspective view of a variable capacitance element according to the first embodiment of the present disclosure, and FIG. 1B is a cross-sectional configuration diagram of the variable capacitance element. FIG. 3 is a plan configuration diagram of an internal electrode constituting the variable capacitance element according to the first embodiment of the present disclosure. FIG. 3 is a plan view of two internal electrodes formed in the variable capacitance element according to the first embodiment of the present disclosure as seen from above. 6 is a plan configuration diagram of internal electrodes of a variable capacitance element according to Comparative Example 1. FIG. 6 is a plan configuration diagram of internal electrodes of a variable capacitance element according to Comparative Example 2. FIG. It is a plane block diagram of the internal electrode which comprises the variable capacitance element which concerns on the modification 1-1. It is a plane block diagram of the internal electrode which comprises the variable capacitance element which concerns on the modification 1-2. It is a plane block diagram of the internal electrode which comprises the variable capacitance element which concerns on the modification 1-3. It is a plane block diagram of the internal electrode which comprises the variable capacitance element which concerns on the modification 1-4. It is a plane lineblock diagram of an internal electrode which constitutes a variable capacity element concerning a 2nd embodiment of this indication. It is a plane block diagram of the internal electrode which comprises the variable capacitance element which concerns on the modification 2-1. It is a plane block diagram of the internal electrode which comprises the variable capacitance element which concerns on the modification 2-2. It is a plane lineblock diagram of the internal electrode which constitutes the variable capacity element concerning a 3rd embodiment of this indication. It is a plane block diagram of the internal electrode which comprises the variable capacitance element which concerns on modification 3-1. It is a plane block diagram of the internal electrode which comprises the variable capacitance element which concerns on modification 3-2. It is a plane block diagram of the internal electrode which comprises the variable capacitance element which concerns on modification 3-3. It is an external appearance perspective view of the variable capacitance element which concerns on 4th Embodiment of this indication. It is an external appearance perspective view of the variable capacitance element which concerns on the modification 4-1. It is a plane block diagram of the dielectric material layer and internal electrode which comprise the variable capacitance element which concerns on the modification 4-2. It is a plane block diagram of the dielectric material layer and internal electrode which comprise the variable capacitance element which concerns on the modification 4-3. It is a plane block diagram of the dielectric material layer and internal electrode which comprise the variable capacitance element which concerns on the modification 4-4. It is a plane block diagram of the dielectric material layer and internal electrode which comprise the variable capacitance element which concerns on the modification 4-5. It is a plane block diagram of the dielectric material layer and internal electrode which comprise the variable capacitance element which concerns on the modification 4-6. It is a plane block diagram of the dielectric material layer and internal electrode which comprise the variable capacitance element which concerns on the modification 4-7. It is a plane block diagram of the dielectric material layer and internal electrode which comprise the variable capacitance element which concerns on the modification 4-8. It is a plane lineblock diagram of the dielectric material layer and internal electrode which constitute the variable capacity element concerning a 5th embodiment of this indication. FIG. 11 is a plan configuration diagram of a dielectric layer and internal electrodes that constitute a variable capacitance element according to Modification 5-1. It is the top view which permeate | transmitted two internal electrodes of the variable capacitance element which concerns on modification 5-1 from the upper surface. It is a plane block diagram of the dielectric material layer and internal electrode which comprise the variable capacitance element which concerns on the modification 5-2. It is a plane block diagram of the dielectric material layer and internal electrode which comprise the variable capacitance element which concerns on the modification 5-3. It is an external appearance perspective view of the variable capacitance element concerning a 6th embodiment of this indication. It is a plane lineblock diagram of an internal electrode which constitutes a variable capacity element concerning a 6th embodiment of this indication. It is a figure when the variable capacitance element main body which concerns on 6th Embodiment of this indication is seen through from the upper surface. FIG. 10 is a plan configuration diagram of a dielectric layer and internal electrodes constituting a variable capacitance element according to Modification 6-1. It is a plane block diagram of the dielectric material layer and internal electrode which comprise the variable capacitance element which concerns on the modification 6-2. FIG. 36A is a schematic perspective view of a variable capacitance element according to a seventh embodiment of the present disclosure, and FIG. 36B is a cross-sectional configuration diagram of the variable capacitance element. It is an exploded view when the variable capacitance element main body which concerns on 7th Embodiment is seen from one side surface of a long side direction. FIG. 38A is a plan configuration diagram when the first internal electrode 88 is viewed from above, and FIG. 38B is a configuration diagram when the first internal electrode 88 is viewed from one side surface. FIG. 39A is a plan configuration diagram when the second internal electrode 89 is viewed from above, and FIG. 39B is a configuration diagram when the second internal electrode 89 is viewed from one side surface. FIG. 40A is a plan configuration diagram when the fourth internal electrode 91 is viewed from the top surface, and FIG. 40B is a configuration diagram when the fourth internal electrode 91 is viewed from one side surface. It is a circuit block diagram of the voltage control circuit incorporating the variable capacitance element which concerns on 7th Embodiment. It is an exploded view when the variable capacitance element main body of the variable capacitance element which concerns on modification 7-1 is seen from one side surface of the long side direction. It is an exploded view when the variable capacitance element main body of the variable capacitance element which concerns on modification 7-2 is seen from one side surface of the long side direction. FIG. 44A is a schematic perspective view of a variable capacitance element according to an eighth embodiment of the present disclosure, and FIG. 44B is a cross-sectional configuration diagram of the variable capacitance element. It is an exploded view when the variable capacitance element main body which concerns on 8th Embodiment of this indication is seen from one side surface of a long side direction. 46A is a plan configuration diagram when the first internal electrode 123 is viewed from the top surface, and FIG. 46B is a configuration diagram when the first internal electrode 123 is viewed from one side surface. 47A is a plan configuration diagram when the second internal electrode 124 is viewed from above, and FIG. 47B is a configuration diagram when the second internal electrode 124 is viewed from one side surface. 48A is a plan configuration diagram when the fourth internal electrode 126 is viewed from the top surface, and FIG. 48B is a configuration diagram when the fourth internal electrode 126 is viewed from one side surface. It is a block diagram at the time of seeing from the upper surface the 1st internal electrode-the 6th internal electrode of the variable capacitance element which concerns on 8th Embodiment of this indication. It is a circuit block diagram of the voltage control circuit incorporating the variable capacitance element which concerns on 8th Embodiment. It is an exploded view when the variable-capacitance element main body of the variable-capacitance element which concerns on the modification 8-1 is seen from one side surface of a long side direction. 52A is a schematic perspective view of a variable capacitance element according to the ninth embodiment of the present disclosure, and FIG. 52B is a cross-sectional configuration diagram of the variable capacitance element. It is an exploded view when the variable-capacitance element main body which concerns on 9th Embodiment of this indication is seen from one side surface of a long side direction. 54A is a plan configuration diagram when the first internal electrode 144 is viewed from above, and FIG. 53B is a configuration diagram when the first internal electrode 144 is viewed from one side surface. It is a block diagram at the time of seeing through the 1st internal electrode-6th internal electrode of the variable capacity element concerning a 9th embodiment of this indication from the upper surface. It is a circuit block diagram of the voltage control circuit incorporating the variable capacitance element which concerns on 9th Embodiment. It is an exploded view when the variable capacitance element main body of the variable capacitance element which concerns on modification 9-1 is seen from one side surface of a long side direction. It is a block block diagram of the receiving system circuit part of the non-contact IC card using the resonance circuit which concerns on 10th Embodiment of this indication.

Hereinafter, an example of a capacitance element according to an embodiment of the present disclosure and a resonance circuit including the capacitance element will be described with reference to the drawings. Embodiments of the present disclosure will be described in the following order. In the embodiments described below, a variable capacitance element whose capacitance value changes according to the applied voltage will be described as an example. Note that the present disclosure is not limited to the following examples.
1. 1. First embodiment: variable capacitance element with improved symmetry of electrode body constituting capacitance 2. Second embodiment: variable capacitance element in which symmetry of internal electrode is artificially increased 3. Third embodiment: variable capacitance element with improved symmetry by providing a floating electrode Fourth Embodiment: Variable Capacitance Element with Improved Symmetry of External Shape of Variable Capacitor Element Body5. 5. Fifth Embodiment: Variable capacitance element in which the outer shape of the variable capacitance element main body and the electrode main body constituting the capacitance have the same shape. 6. Sixth Embodiment: Variable capacitance element in which a plurality of connection electrodes are formed in one internal electrode. Seventh Embodiment: Variable Capacitor Element (Part 1) Constructing Multiple Capacitors Connected in Series in the Laminating Direction of Internal Electrodes
8). Eighth Embodiment: Variable Capacitor Element Constructing Plural Capacitors Connected in Series in the Stacking Direction of Internal Electrodes (Part 2)
9. Ninth Embodiment: Variable Capacitor Element Constructing Multiple Capacitors Connected in Series in the Stacking Direction of Internal Electrodes (Part 3)
10. Tenth Embodiment: Resonant circuit incorporating a variable capacitance element

<1. First Embodiment>
[Configuration of variable capacitance element]
First, the variable capacitance element according to the first embodiment of the present disclosure will be described. FIG. 1A is a perspective view of a variable capacitor according to this embodiment, and FIG. 1B is a cross-sectional configuration diagram of the variable capacitor according to this embodiment. FIG. 2 is a plan configuration diagram of internal electrodes constituting the variable capacitance element of this embodiment. 1A and 2, a line passing through the center of gravity of the internal electrode and the dielectric layer is indicated by a broken line. The same applies to the following drawings.

  As shown in FIG. 1A, the variable capacitance element 1 according to the present embodiment includes a variable capacitance element body 2 formed of a rectangular parallelepiped member and two external terminals 3 and 4.

  As shown in FIG. 1B, the variable capacitance element body 2 is composed of two internal electrodes 10 stacked via a dielectric layer 5, and a lower dielectric layer 6 is formed below the two internal electrodes 10. The upper dielectric layer 7 is laminated on the upper layer. In other words, in the present embodiment, the lower dielectric layer 6 and the upper dielectric layer 7 do not expose the surface of the internal electrode 10. The variable capacitance element body 2 has a structure in which a sheet-like dielectric layer 5 in which a conductive layer constituting the internal electrode 10 is formed on one surface is laminated, and each dielectric formed in a sheet shape. The layer 5 has a rectangular shape on a plane on which the internal electrode 10 is formed.

In this embodiment, the dielectric layer 5 is made of a ferroelectric material in order to constitute the variable capacitance element 1 whose capacitance changes according to the applied voltage. As such a ferroelectric material, specifically, a dielectric material that generates ionic polarization can be used. A ferroelectric material that causes ion polarization is a ferroelectric material that is made of an ionic crystal material and is electrically polarized by the displacement of positive and negative ion atoms. In general, a ferroelectric material that generates ionic polarization is represented by the chemical formula ABO ₃ (O is an oxygen element) and has a perovskite structure, where A and B are two predetermined elements. Examples of such a ferroelectric material include barium titanate (BaTiO ₃ ), potassium niobate (KNbO ₃ ), lead titanate (PbTiO ₃ ), and the like. Moreover, PZT (lead zirconate titanate) in which lead zirconate (PbZrO ₃ ) is mixed with lead titanate (PbTiO ₃ ) may be used as a material for forming the dielectric layer 5.

Further, as the ferroelectric material, a ferroelectric material that generates electronic polarization may be used. In this ferroelectric material, an electric dipole moment is generated in a portion biased to a positive charge and a portion biased to a negative charge, and polarization occurs. As such a material, a rare earth iron oxide having a ferroelectric property by forming polarization by forming a charge surface of Fe ^{2+ and} a charge surface of Fe ³⁺ has been reported. In this system, when the rare earth element is RE and the iron group element is TM, the material represented by the molecular formula (RE) · (TM) ₂ · O ₄ (O: oxygen element) has a high dielectric constant. It has been reported. Examples of rare earth elements include Y, Er, Yb, and Lu (particularly Y and heavy rare earth elements), and examples of iron group elements include Fe, Co, and Ni (particularly Fe). Examples of (RE) · (TM) ₂ · O ₄ include ErFe ₂ O ₄ , LuFe ₂ O ₄ , and YFe ₂ O ₄ .

  As shown in FIG. 2, the internal electrode 10 includes a circular electrode body 8, and a connection electrode 9 that is connected to the electrode body 8 and has an end portion exposed to the side surface of the variable capacitor element body 2. It consists of The center of gravity of the electrode body 8 of the internal electrode 10 is formed so as to be positioned at the center of the dielectric layer 5 formed in a sheet shape. The internal electrode 10 can be formed using, for example, a conductive paste containing fine metal powder (Pd, Pd / Ag, Ni, etc.). In the present embodiment example, the two internal electrodes 10 are formed of the same material. However, the present disclosure is not limited to this, and for example, the internal electrodes 10 formed of different materials may be stacked depending on applications.

  These two internal electrodes 10 are stacked via the dielectric layer 5 and are stacked so that each side and the center of gravity of the electrode body 8 overlap in the stacking direction. Further, the connection electrodes 9 constituting each internal electrode 10 are arranged so as to face each other. That is, one internal electrode 10 has a configuration in which the other internal electrode 10 is rotated 180 degrees around an axis perpendicular to the electrode surface. In the variable capacitor element body 2, the connection electrode 9 is provided on the opposite side surface. Exposed.

  The external terminals 3 and 4 are formed on the side surfaces of the variable capacitance element body 2 and are formed so as to be electrically connected to the exposed connection electrodes 9. That is, in the present embodiment example, the two external terminals 3 and 4 are formed on two opposing sides of the variable capacitance element body 2. The two external terminals 3 and 4 are formed so as to cover the side surface of the variable capacitor element body 2 in the stacking direction of the internal electrodes 10 and to protrude from the upper surface and the lower surface of the variable capacitor element body 2.

  With the above configuration, in this embodiment, the capacitor C is formed between the two electrode bodies 8 facing each other. Then, by applying a desired voltage between the two external terminals 3 and 4, the relative dielectric constant of the dielectric layer 5 between the electrode bodies 8 can be varied.

[Production method]
An example of a method for manufacturing the variable capacitance element 1 having the above configuration will be described. First, a dielectric sheet made of a desired dielectric material is prepared. The dielectric sheet constitutes each dielectric layer 5 in the variable capacitance element body 2 and has a thickness of about 2.5 μm, for example. These dielectric sheets can be formed by applying a paste-like dielectric material on a PET (polyethylene terephthalate) film to a desired thickness. In addition, a mask is prepared in which a region corresponding to the formation region of the internal electrode 10 shown in FIG. 2 is opened.

  Next, for example, a conductive paste obtained by pasting metal fine powders such as Pt, Pd, Pd / Ag, Ni, and Ni alloy is prepared. Then, the conductive paste is applied (silk printing) to one surface of the dielectric sheet through the respective masks prepared in the previous stage. Thereby, the dielectric sheet | seat in which the internal electrode 10 was formed in one surface is created. At this time, the center (center of gravity) of the electrode body 8 of each electrode is formed so as to coincide with the center of the dielectric sheet.

  And each dielectric sheet | seat in which the internal electrode 10 was formed is laminated | stacked in the desired order, aligning the direction of the surface in which each electrode was printed. At this time, the two internal electrodes 10 are stacked so that the sides and the centers of the electrode bodies overlap in the stacking direction. Further, dielectric sheets on which no electrodes are printed are stacked on top and bottom of the stacked body and are bonded by pressure.

  Then, the pressure-bonded member is fired at a high temperature in a reducing atmosphere to integrate the dielectric sheet and each electrode formed of the conductive paste. Thereby, the variable capacitance element body 2 is manufactured. Thereafter, the two external terminals 3 and 4 are attached to predetermined positions on the side surface of the variable capacitance element body 2. In this embodiment, the variable capacitance element 1 is manufactured in this way.

  By the way, in the variable capacitance element 1 of the present embodiment example, residual stress (compressive stress) is generated due to a difference in shrinkage rate when the dielectric material and the electrode material are sintered. This residual stress is generated in the direction in which the electrode material and the dielectric material contract in each layer. On the other hand, in the variable capacitance element 1 of the present embodiment example, the two electrode bodies 8 constituting the capacitor C have the same shape, and are stacked so that each side and center overlap in the stacking direction of the internal electrodes 10. Furthermore, the electrode body 8 is formed so that the center thereof coincides with the center of the dielectric layer 5. For this reason, in the variable capacitance element 1 of the present embodiment example, each internal electrode 10 and the dielectric layer 5 contract toward the center thereof. Thereby, the residual stress generated at the time of sintering can be concentrated on the center of the capacitor C formed by the two internal electrodes 10.

  Furthermore, in the variable capacitance element 1 of the present embodiment, the electrode body 8 that forms the capacitor C is formed in a circular shape. Thereby, the residual stress which generate | occur | produces at the time of baking can be intensively generated toward the center. FIG. 3 is a plan view of the two internal electrodes 10 formed in the variable capacitance element 1 of this embodiment as seen through the top surface. In FIG. 3, the direction and magnitude of the residual stress generated in the lower internal electrode 10 is indicated by an arrow a, and the direction and magnitude of the residual stress generated in the upper internal electrode 10 is indicated by an arrow b.

  4 shows a planar configuration of the internal electrode 406 of the variable capacitance element according to Comparative Example 1, and FIG. 5 shows a planar configuration of the internal electrode 403 of the variable capacitance element according to Comparative Example 2. In Comparative Example 1 and Comparative Example 2, only the shape of the electrode main body forming the capacitor is different from that of the variable capacitance element 1 of the present embodiment. In Comparative Example 1, the shape of the electrode main body 404 is rectangular as shown in FIG. 4, and in Comparative Example 2, the shape of the electrode main body 401 is square as shown in FIG. In FIG. 4, the direction and magnitude of the residual stress generated during firing are indicated by an arrow c, and in FIG. 5, the direction and magnitude of the residual stress generated during firing are indicated by an arrow d.

  In Comparative Example 1, the shape of the electrode body 404 of the internal electrode 406 is rectangular as shown in FIG. For this reason, as shown by the arrow c, the magnitude of the residual stress generated during firing differs between the residual stress generated from the long side direction of the electrode body 404 and the residual stress generated from the short side direction. Further, since the electrode body 404 has a shape with low symmetry in the electrode surface, there are few components of the residual stress toward the center of gravity. Furthermore, when the magnitude of the residual stress generated on the side where the connection electrode 9 is formed is taken into consideration, the magnitude of the residual stress generated in the internal electrode 406 and the direction in which it occurs are varied.

  In Comparative Example 2, the shape of the electrode body 401 of the internal electrode 403 is square as shown in FIG. For this reason, the residual stress generated during firing is affected by the residual stress generated on the side where the connection electrode 9 is formed, as shown by an arrow d, and the residual stress generated in the internal electrode 403 is biased in the plane, It becomes larger on the connection electrode 9 side. Further, since the electrode body 404 has a shape with low symmetry in the electrode plane, the component of the residual stress toward the center of gravity is small.

  On the other hand, in this embodiment, the shape of the electrode body 8 of the internal electrode 10 is circular. For this reason, it is a shape with high in-plane symmetry, and the residual stress (compressive stress) which generate | occur | produces at the time of baking generate | occur | produces toward the gravity center from the edge | side of the electrode main body 8. FIG. In addition, when the magnitude of the residual stress generated on the side where the connection electrode 9 is formed is taken into account, the residual stress generated from the side where the connection electrode 9 is formed toward the center increases. However, since the shape of the electrode body 8 is formed in a circular shape, the change in the residual stress is gentle in the internal electrode 10, and the residual stress generated on the side where the connection electrode 9 is formed is also the center of gravity of the electrode body 8. Occurs towards.

  As a result, the residual stress concentrates toward the center of the electrode body 8 that forms the capacity of the internal electrode 10, so that the tensile stress in the stacking direction (electric field direction) of the internal electrode 10 can be further increased. As a result, electrical characteristics such as an increase in capacitance per unit volume of the capacitor and an increase in variable rate can be improved.

In the present embodiment, the shape of the electrode body 8 of the internal electrode 10 is formed in a circular shape, but the same effect can be obtained if the shape is highly symmetrical with respect to an axis that passes through the center of gravity of the electrode body 8 and is horizontal to the electrode surface. be able to. By the way, there are an infinite number of axes that pass through the center of gravity of the electrode body 8 and are horizontal to the electrode surface. Here, “high symmetry” means that the electrode shape overlaps with a smaller rotation angle (or substantially). It means an electrode shape that can be overlapped). In the present embodiment, as the shape of the electrode body 8 having high symmetry, in the case of a regular pentagon, it overlaps with the original electrode shape even when rotated by 72 degrees, and it can be said that the rotational symmetry is high. Therefore, it is preferable to have an arbitrary shape or a shape having a rotation of 72 degrees or less. Any shape that has high symmetry in either line symmetry or rotational symmetry may be used, but it is more preferable that both shapes have high symmetry.
Below, the modification of the variable capacitance element of this embodiment is shown.

[Modification 1-1]
FIG. 6 shows a planar configuration of the internal electrodes constituting the variable capacitance element according to Modification 1-1. In FIG. 6, parts corresponding to those in FIG.
In the variable capacitance element according to Modification 1-1, the electrode body 11 of the internal electrode 12 has an elliptical shape. In Modification 1-1, the major axis direction of the ellipse is the major axis direction of the dielectric layer 5, and the minor axis direction is the minor axis direction of the dielectric layer 5.

  Also in Modification 1-1, although not shown, the internal electrode 12 shown in FIG. 6 is laminated in two layers so that the sides and the center of the electrode body 11 overlap in the lamination direction, and the connection electrodes 9 face each other. The variable capacitance element body is configured so as to be exposed on the side surface. Then, by providing an external terminal that is electrically connected to each connection electrode 9 exposed at substantially the center in the major axis direction of the variable capacitor element body, the variable capacitor element of Modification 1-3 is formed. In the modified example 1-1, a capacitor is constituted by a pair of laminated electrode bodies 11.

  In the modified example 1-1, the electrode body 11 constituting the capacitor has an elliptical shape with high symmetry with respect to an axis that passes through the center of gravity of the electrode body 11 and is horizontal to the electrode surface. For this reason, the residual stress generated in the plane of the internal electrode 12 can be concentrated on the center of gravity, and the same effect as in this embodiment can be obtained.

[Modification 1-2]
FIG. 7 shows a planar configuration of the internal electrodes constituting the variable capacitance element according to Modification 1-2. In FIG. 7, parts corresponding to those in FIG.
In the variable capacitance element according to Modification 1-2, the electrode body 13 of the internal electrode 14 has an elliptical shape. In the second modification, the major axis direction of the ellipse is configured as the minor axis direction of the dielectric layer 5, and the minor axis direction is configured as the major axis direction of the dielectric layer 5.

  Also in Modification 1-2, although not shown, the internal electrode 14 shown in FIG. 7 is stacked in two layers so that the sides and the center of the electrode body 13 overlap in the stacking direction, and the connection electrodes 9 face each other. The variable capacitance element body is configured so as to be exposed on the side surface. Then, by providing an external terminal that is electrically connected to each connection electrode 9 exposed at substantially the center in the major axis direction of the variable capacitor element body, the variable capacitor element of Modification 1-2 is formed. In Modification 1-2, a capacitor is configured by the pair of electrode bodies 13 stacked.

  In Modification 1-2, the electrode body 13 constituting the capacitor has an elliptical shape with high symmetry with respect to an axis that passes through the center of gravity of the electrode body 13 and is horizontal to the electrode surface. For this reason, the residual stress generated in the plane of the internal electrode 14 can be concentrated on the center, and the same effect as in this embodiment can be obtained.

[Modification 1-3]
FIG. 8 shows a planar configuration of the internal electrodes constituting the variable capacitance element according to Modification 1-3. In FIG. 8, parts corresponding to those in FIG.
In the variable capacitance element according to Modification 1-3, the electrode body 15 of the internal electrode 16 has a regular hexagonal shape, and two vertices of the regular hexagonal shape overlap on a straight line in the minor axis direction passing through the center of the dielectric layer 5. It is configured as follows.

  Also in Modification 1-3, although not shown, the internal electrode 16 shown in FIG. 8 is stacked in two layers so that each side of the electrode body 15 and the center of gravity overlap in the stacking direction. The variable capacitance element body is configured so as to be exposed on the opposite side surfaces. Then, by providing an external terminal that is electrically connected to each connection electrode 9 exposed at substantially the center in the major axis direction of the variable capacitor element body, the variable capacitor element of Modification 1-3 is formed. In Modification 1-3, a capacitor is constituted by a pair of stacked electrode bodies 15.

  In Modification 1-3, the electrode body 15 constituting the capacitor has a regular hexagonal shape with high symmetry with respect to an axis that passes through the center of gravity of the electrode body 15 and is horizontal to the electrode surface. For this reason, the residual stress generated in the plane of the internal electrode 16 can be concentrated on the center, and the same effect as in this embodiment can be obtained.

[Modification 1-4]
FIG. 9 shows a planar configuration of the internal electrodes constituting the variable capacitance element according to Modification 1-4. In FIG. 9, parts corresponding to those in FIG.
In the variable capacitance element according to Modification 1-4, the electrode body 17 of the internal electrode 18 has a regular hexagonal shape, and two vertices of the regular hexagonal shape overlap on a straight line in the major axis direction passing through the center of the dielectric layer 5. It is configured as follows.

  Also in Modification 1-4, although not shown, the internal electrode 18 shown in FIG. 9 is laminated in two layers so that each side of the electrode body 17 and the center of gravity overlap in the laminating direction. The variable capacitance element body is configured so as to be exposed on the opposite side surfaces. Then, by providing an external terminal that is electrically connected to each connection electrode 9 exposed at substantially the center in the major axis direction of the variable capacitor element body, the variable capacitor element of Modification 1-4 is formed. In Modification 1-4, a capacitor is constituted by the pair of electrode bodies 17 stacked.

  In the modified example 1-4, the electrode body 17 constituting the capacitor has a regular hexagonal shape with high symmetry with respect to an axis that passes through the center of gravity of the electrode body 17 and is horizontal to the electrode surface. For this reason, the residual stress generated in the plane of the internal electrode 18 can be concentrated on the center, and the same effect as in this embodiment can be obtained.

  By the way, in modification 1-3 and 1-4, although the shape of the electrode main body was a regular hexagon, if it is a regular polygon more than a pentagon, the effect similar to this embodiment can be acquired, and it will become more circular shape. If the shape is close, a higher effect can be obtained. As described above, by making the shape of the electrode body constituting the capacitor a pentagonal or more regular polygonal shape, a circular shape, or an elliptical shape, the generated residual stress can be further increased compared to the case where the electrode body is square. It can be concentrated on the center of gravity of the body.

<2. Second Embodiment>
Next, a variable capacitance element according to the second embodiment of the present disclosure will be described. In the present embodiment example, only the connection electrode constituting the internal electrode is an example different from the first embodiment, and the outer shape and the cross-sectional configuration thereof are the variable capacitance element according to the first embodiment shown in FIGS. 1A and 1B. Since it is the same as that of FIG.
FIG. 10 is a plan configuration diagram of the internal electrodes constituting the variable capacitance element according to the present embodiment. 10, parts corresponding to those in FIG. 2 are denoted by the same reference numerals, and redundant description is omitted.

  As shown in FIG. 10, in the variable capacitor of this embodiment, the internal electrode 20 is connected to the circular electrode body 8 and the side of the electrode body 8, and is exposed to the side of the variable capacitor body to be external. The connection electrode 19 is connected to the terminal. The connection electrode 19 is formed in such a size that the residual stress generated around the connection electrode 19 during the sintering of the variable capacitance element body does not affect the residual stress generated in the electrode body 8 portion. . Accordingly, the area of the connection electrode 19 is formed to be sufficiently smaller than the area of the electrode body 8. In this embodiment, the width of the end connected to the external terminal of the connection electrode 19 is set to be larger than the diameter of the electrode body 8. It is formed small enough.

  Here, in order that the residual stress generated around the connection electrode 19 does not affect the residual stress generated in the electrode body 8 portion, the width of the end connected to the external terminal of the connection electrode 19 is, for example, The electrode body 8 is preferably set to a quarter or less of the diameter.

  Also in this embodiment, although not shown, the internal electrodes 20 shown in FIG. 10 are stacked so that the sides and the center of gravity of the electrode body 8 overlap in the stacking direction, and each of the stacked internal electrodes 20 is configured. The variable capacitance element body is configured such that the connection electrodes 19 are exposed on the opposite side surfaces. Then, by providing an external terminal that is electrically connected to each connection electrode 19 exposed at substantially the center in the major axis direction of the variable capacitance element body, the variable capacitance element of this embodiment is formed. In the present embodiment, a capacitor is constituted by a pair of stacked electrode bodies 8.

  In the present embodiment example, by reducing the width (area) of the connection electrode 19, the symmetry of the shape of the internal electrode 20 including the connection electrode 19 can be increased in a pseudo manner. Note that the “symmetry” here means symmetry with respect to an axis that passes through the center of gravity of the electrode body 8 and is horizontal to the electrode surface, as in the first embodiment.

[Modification 2-1]
FIG. 11 shows a planar configuration of the internal electrodes constituting the variable capacitance element according to Modification 2-1. In FIG. 11, parts corresponding to those in FIG.
In the variable capacitance element according to Modification 2-1, the electrode body 21 of the internal electrode 22 is square. Also in the modified example 2-1, the area of the connection electrode 19 is formed to be sufficiently smaller than the area of the electrode body 21, and the width of the connection electrode 19 is formed to be sufficiently smaller than the square width. ing. In the modified example 2-1, in order that the residual stress generated around the connection electrode 19 does not affect the residual stress generated in the electrode body 21 portion, the end of the connection electrode 19 connected to the external terminal The width is preferably set to be less than or equal to one-minute of the maximum width of the electrode body 21.

  Also in the modified example 2-1, although not shown, the internal electrode 22 shown in FIG. 11 is laminated so that the sides and the center of gravity of the electrode body 21 overlap in the laminating direction, and the connection electrodes 19 are arranged on the opposite side surfaces. The variable capacitance element body is configured so as to be exposed. Then, by providing an external terminal that is electrically connected to each connection electrode 19 exposed at substantially the center in the major axis direction of the variable capacitance element body, the variable capacitance element of this embodiment is formed. In this embodiment, a capacitor is constituted by a pair of laminated electrode bodies 21.

  Also in the modified example 2-1, the symmetry of the internal electrode 22 can be artificially increased by reducing the area of the connection electrode 19. That is, the symmetry of the internal electrode 22 itself is higher than that of the comparative example 2 in which the width of the connection electrode is substantially the same as the width of the electrode body. For this reason, since the residual stress generated in the plane of the internal electrode 22 can be concentrated from each apex of the internal electrode 22 to the center, the same effect as the present embodiment can be obtained.

  By the way, in the second embodiment example and the modified example 2-1, the shape of the electrode body is a circle and a square, but the same effect can be obtained even if it is a pentagon or more regular polygon or an ellipse. . Even in that case, as long as the width of the connection electrode is formed to be sufficiently smaller than the width of the electrode body, the shape can pass through the center of gravity of the electrode body and can increase the symmetry with respect to the axis parallel to the electrode surface. Similar effects can be obtained.

[Modification 2-2]
FIG. 12 shows a planar configuration of the internal electrodes constituting the variable capacitance element according to Modification 2-2. In FIG. 12, parts corresponding to those in FIG.
In the internal electrode 20 of the variable capacitance element shown in FIG. 10, the connection electrode 19 is formed so as to be exposed at substantially the center of the side surface in the major axis direction of the variable capacitance element body. On the other hand, in the modified example 2-2, the connection electrode 23 constituting the internal electrode 24 is formed so as to be exposed at a position off the center of the side surface in the major axis direction of the variable capacitance element body.

In Modification 2-2, as shown in FIG. 12, the connection electrode 23 constituting the internal electrode 24 is arranged on an axis passing through the center of gravity of the electrode body 8.
As shown in Modification 2-2, the connection electrode 23 is arranged on an axis passing through the center of gravity of the electrode body 8 constituting the capacitor, so that the symmetry of the residual stress can be reduced without much loss. The degree of freedom can be increased.
In addition, the same effects as those of the first embodiment and the second embodiment can be obtained.

<3. Third Embodiment>
Next, a variable capacitance element according to the third embodiment of the present disclosure will be described. In the present embodiment example, only the configuration of the internal electrode is different from the first embodiment, and the outer shape and cross-sectional configuration thereof are the same as those of the variable capacitor according to the first embodiment shown in FIGS. 1A and 1B. Because of this, illustration is omitted.
FIG. 13 is a plan configuration diagram of the internal electrode 28 constituting the variable capacitance element of the present embodiment. In FIG. 13, parts corresponding to those in FIG.

  As shown in FIG. 13, in the variable capacitor of this embodiment, the internal electrode 28 is connected to the square electrode body 25 and the sides of the electrode body 25, and is exposed to the side of the variable capacitor element body. A connection electrode 26 connected to the terminal and a floating electrode 27 are included.

The electrode body 25 is formed substantially at the center of the dielectric layer 5, and is formed so that the square center coincides with the center of the dielectric layer 5.
The connection electrode 26 is connected to one side of the electrode body 25 and is formed so that the end is exposed on the side surface of the capacitor element body.

  The floating electrode 27 is formed in a region opposite to the connection electrode 26 across the electrode body 25. The floating electrode 27 has substantially the same shape as the connection electrode 26 and is formed so as to be substantially symmetric with respect to the connection electrode 26 with respect to an axis passing through the center of gravity of the electrode body 25. However, the floating electrode 27 is not connected to the electrode body 25 and is formed so as not to be exposed on the side surface of the variable capacitance element body. Therefore, no potential is supplied to the floating electrode 27 from the outside when the variable capacitance element is driven.

  Also in this embodiment, although not shown, the internal electrode 28 shown in FIG. 13 is laminated in two layers so that the sides and the center of gravity of the electrode body 25 overlap in the lamination direction, and the connection electrodes 26 face each other. The variable capacitance element body is configured so as to be exposed on the side surface. Then, by providing an external terminal that is electrically connected to each connection electrode 26 exposed at substantially the center in the major axis direction of the variable capacitor element body, the variable capacitor of this embodiment is formed. In this embodiment, a capacitor is constituted by a pair of electrode bodies 25 that are stacked.

In the present embodiment, the symmetry of the entire internal electrode can be enhanced by providing the floating electrode 27 so as to be symmetric with respect to the connection electrode 26 across the electrode body 25. Thereby, the residual stress generated with the shrinkage at the time of baking can be concentrated on the center and can be made uniform in the plane. As a result, the electrical characteristics can be improved.
In addition, the same effects as those of the first embodiment can be obtained.

[Modification 3-1]
FIG. 14 shows a planar configuration of the internal electrodes constituting the variable capacitance element according to Modification 3-1. In FIG. 14, parts corresponding to those in FIG.
The variable capacitance element according to Modification 3-1 is an example in which the shape of the electrode body 29 of the internal electrode 32 is different from that of the third embodiment.

  The internal electrode 32 includes a circular electrode body 29, a connection electrode 30 connected to the side of the electrode body 29, exposed on the side surface of the variable capacitance element body and connected to an external terminal, and a floating electrode 31. ing.

The electrode body 29 is formed substantially at the center of the dielectric layer 5, and the center of gravity of the electrode body 29 is formed to coincide with the center of the dielectric layer 5.
The connection electrode 30 is formed so as to be connected to one side of the electrode main body 29 and to be exposed at the side surface of the capacitive element main body.

  The floating electrode 31 is formed in a region opposite to the connection electrode 30 with the electrode body 29 interposed therebetween. The floating electrode 31 has substantially the same shape as the connection electrode 30 and is formed so as to be symmetric with respect to the connection electrode 30 with respect to an axis passing through the center of gravity of the electrode body 29. However, the floating electrode 31 is not connected to the electrode body 29 and is formed so as not to be exposed on the side surface of the variable capacitance element body. Therefore, no potential is supplied to the floating electrode 31 from the outside when the variable capacitance element is driven.

  Also in the modified example 3-1, although not shown, the internal electrode 32 shown in FIG. 14 is laminated in two layers so that the sides of the electrode body 29 and the center of gravity overlap in the lamination direction, and the connection electrodes 30 face each other. The variable capacitance element body is configured so as to be exposed on the side surface. Then, by providing an external terminal that is electrically connected to each connection electrode 30 exposed on the side surface of the variable capacitance element body, the variable capacitance element of Modification 3-1 is formed. In Modification 3-1, a capacitor is constituted by a pair of stacked electrode bodies 29.

  Also in the modified example 3-1, the floating electrode 31 is provided so as to be symmetric with respect to the connection electrode 30 with the electrode body 29 interposed therebetween. For this reason, the effect similar to 3rd Embodiment can be acquired. Furthermore, in the modified example 3-1, since the electrode main body 29 constituting the capacitor is circular, the residual stress generated in the plane can be concentrated on the center.

[Modification 3-2]
FIG. 15 shows a planar configuration of an internal electrode constituting the variable capacitance element according to Modification 3-2. In FIG. 15, parts corresponding to those in FIG.
In Modification 3-2, the internal electrode 35 includes a square electrode body 25, a connection electrode 33 connected to the side of the electrode body 25, exposed to the side surface of the variable capacitance element body, and connected to an external terminal. It consists of two floating electrodes 27 and 34. The connection electrode 33 is formed with a sufficiently narrow width compared to the width of the electrode body 25. The two floating electrodes 27 and 34 are formed in both regions sandwiching the connection electrode 33 and the electrode main body 25, and are formed symmetrically with respect to an axis passing through the center of gravity of the electrode main body 25.

  Although not shown in the modified example 3-2, the internal electrode 35 shown in FIG. 15 is stacked in two layers so that the sides and the center of gravity of the electrode body 25 overlap in the stacking direction, and the connection electrodes 33 face each other. The variable capacitance element body is configured so as to be exposed on the side surface. Then, by providing an external terminal that is electrically connected to each connection electrode 33 exposed on the side surface of the variable capacitor element body, the variable capacitor element of Modification 3-2 is formed. In Modification 3-2, a capacitor is configured by a pair of stacked electrode bodies 25.

  In the modified example 3-2, since the width of the connection electrode 33 is formed to be ten parts smaller than the width of the electrode body 25, the residual stress generated in the connection electrode 33 portion can be reduced. Furthermore, in the modified example 3-2, by forming the floating electrodes 27 and 34 that do not form a capacitance symmetrically in both regions sandwiching the electrode body 25, the residual stress generated at the center of the capacitor can be increased. . Therefore, the electrical characteristics of the variable capacitance element can be improved. In addition, the same effects as those of the third embodiment can be obtained.

[Modification 3-3]
FIG. 16 shows a planar configuration of the internal electrodes constituting the variable capacitance element according to Modification 3-3. In the figure, parts corresponding to those in FIG.
In Modification 3-3, the internal electrode 38 includes a circular electrode body 29, a connection electrode 36 connected to the side of the electrode body 29, exposed to the side surface of the variable capacitance element body, and connected to an external terminal; It consists of two floating electrodes 31 and 37. The connection electrode 36 has a width that is sufficiently narrower than the diameter of the electrode body 29. The two floating electrodes 31 and 37 are formed in both regions sandwiching the connection electrode 36 and the electrode main body 29, and are formed symmetrically with respect to an axis passing through the center of gravity of the electrode main body 29.

  Also in Modification 3-3, although not shown, the internal electrode 38 shown in FIG. 16 is stacked in two layers so that the sides and the center of gravity of the electrode body 29 overlap in the stacking direction, and the connection electrodes 36 face each other. The variable capacitance element body is configured so as to be exposed on the side surface. Then, by providing an external terminal that is electrically connected to each connection electrode 36 exposed on the side surface of the variable capacitance element body, the variable capacitance element of Modification 3-3 is formed. In Modification 3-3, a capacitor is constituted by a pair of stacked electrode bodies 29.

  In the modified example 3-3, since the width of the connection electrode 36 is formed to be smaller than the width of the electrode body 29, the residual stress generated in the connection electrode 36 portion can be reduced. Further, in the modified example 3-3, the residual stress generated at the center of the capacitor can be increased by forming the floating electrodes 31 and 37 that do not form a capacitance symmetrically in both regions sandwiching the electrode body 29. . Therefore, the electrical characteristics of the variable capacitance element can be improved. In addition, the same effects as those of the third embodiment can be obtained.

<4. Fourth Embodiment>
Next, a variable capacitor according to the fourth embodiment of the present disclosure will be described. In the present embodiment example, the shape of the variable capacitance element body is different from that of the first embodiment, and the shape and cross-sectional configuration of the internal electrode are the same as those of the variable capacitance element according to the first embodiment shown in the drawing. The illustration is omitted.
FIG. 17 is an external perspective view of the variable capacitor according to this embodiment.

  As shown in FIG. 17, the variable capacitance element 40 of the present exemplary embodiment includes a variable capacitance element body 41 and two external terminals 42 and 43. The variable capacitance element body 41 is configured as a rectangular parallelepiped (or a cube) whose planar shape parallel to the surface on which the internal electrodes are formed is a square shape. That is, in this embodiment, as shown in FIG. 17, the plane parallel to the surface on which the internal electrode is formed is a square shape having a lateral width W and a longitudinal width W.

In the variable capacitance element 40 of the present embodiment example, the surface on which the internal electrode is formed is a square shape, so that the symmetry of the shape of the variable capacitance element body 41 is enhanced. Residual stress generated during firing of the variable capacitance element body 41 is generated due to a difference in shrinkage rate (linear expansion coefficient) between the electrode material and the dielectric material. Therefore, the residual stress can be more concentrated toward the center by improving the symmetry of the internal electrodes and improving the symmetry of the outer shape of the variable capacitance element body 41. Thereby, the electrical characteristics of the capacitor formed by the internal electrodes can be improved.
In addition, the same effects as those of the first embodiment can be obtained.

[Modification 4-1]
FIG. 18 is an external perspective view of a variable capacitance element according to Modification 4-1. Modification 4-1 is an example in which the shape of the variable capacitance element body is different from that of the first embodiment, and the shape and cross-sectional configuration of the internal electrode are the same as those of the variable capacitance element according to the first embodiment shown in the drawing. Because of this, illustration is omitted.

  As shown in FIG. 18, the variable capacitance element 44 according to Modification 4-1 includes a variable capacitance element main body 45 and two external terminals 46 and 47. The variable capacitance element body 45 is formed in a cylindrical shape such that a planar shape parallel to the surface on which the internal electrode is formed is a circular shape.

  In the modified example 4-1, the outer shape of the variable capacitor element body 45 is formed in a cylindrical shape, so that the symmetry of the outer shape of the variable capacitor element body 45 with respect to the straight line in the stacking direction passing through the center of the electrode body of the internal electrode is enhanced. . Thereby, the residual stress which generate | occur | produces inside the variable capacitance element main body 45 can be increased more, and the effect similar to 4th Embodiment can be acquired.

[Modification 4-2]
FIG. 19 shows a planar configuration of a dielectric layer and internal electrodes that constitute a variable capacitance element according to Modification 4-2. In the variable capacitance element according to Modification Example 4-2, the internal electrode 51 is formed so as to be connected to one side of the electrode body 49 that is a square, and to be exposed to the side surface of the capacitance element body. The connection electrode 50 is formed. Further, the planar shape in which the internal electrode 51 of the variable capacitance element body is formed, that is, the planar shape of the dielectric layer 48 is an elliptical shape, and the connection electrode 50 constituting the internal electrode 51 is an elliptical dielectric layer. 48 are formed in the minor axis direction.

  Also in Modification 4-2, although not shown, the internal electrode 51 shown in FIG. 19 is laminated in two layers so that the sides and the center of gravity of the electrode body 49 overlap in the lamination direction, and the connection electrodes 50 face each other. The variable capacitance element body is configured so as to be exposed on the side surface. Then, by providing an external terminal that is electrically connected to each connection electrode 50 exposed on the side surface of the variable capacitance element body, the variable capacitance element of Modification 4-2 is formed. In Modification 4-2, a capacitor is configured by the pair of electrode bodies 49 stacked.

  In Modification 4-2, the outer shape of the variable capacitance element body is formed in a columnar shape having an elliptical cross section, so that the symmetry of the outer shape of the variable capacitance element body can be increased, and is the same as in the fourth embodiment. The effect of can be obtained.

[Modification 4-3]
FIG. 20 shows a planar configuration of a dielectric layer and internal electrodes that constitute a variable capacitance element according to Modification 4-3. In the variable capacitance element according to Modification 4-3, the internal electrode 51 is the same as that in Modification 4-2. Further, the planar shape in which the internal electrode 51 of the variable capacitance element body is formed, that is, the dielectric layer 52 is elliptical, and the connection electrode 50 constituting the internal electrode 51 is the major axis of the elliptical dielectric layer 52. It is formed in the direction.

  Also in Modification 4-3, although not shown, the internal electrode 51 shown in FIG. 20 is laminated in two layers so that the sides and the center of gravity of the electrode body 49 overlap in the laminating direction, and the connection electrodes 50 face each other. The variable capacitance element body is configured so as to be exposed on the side surface. And the variable capacitance element of the modification 4-3 is formed by providing the external terminal electrically connected to each connection electrode 50 exposed on the side surface of the variable capacitance element body. In Modification 4-3, a capacitor is configured by the pair of electrode bodies 49 stacked.

  In Modified Example 4-3, the outer shape of the variable capacitance element body is formed in a columnar shape having an elliptical cross section, so that the symmetry of the outer shape of the variable capacitance element body can be enhanced, which is the same as in the fourth embodiment. The effect of can be obtained.

[Modification 4-4]
FIG. 21 shows a planar configuration of a dielectric layer and internal electrodes that constitute a variable capacitance element according to Modification 4-4. In the variable capacitance element according to Modification 4-4, the internal electrode 51 is the same as that in Modification 4-2. Further, the planar shape in which the internal electrode 51 of the variable capacitance element body is formed, that is, the dielectric layer 53 has a rounded rectangular shape (oval type), and the connection electrode 50 constituting the internal electrode 51 has a rounded rectangular shape. The dielectric layer 53 is formed in the major axis direction.

  Also in Modification 4-4, although not shown, the internal electrode 51 shown in FIG. 21 is stacked in two layers so that the sides and the center of gravity of the electrode body 49 overlap in the stacking direction, and the connection electrodes 50 face each other. The variable capacitance element body is configured so as to be exposed on the side surface. And the variable capacitance element of the modification 4-4 is formed by providing the external terminal electrically connected to each connection electrode 50 exposed on the side surface of the variable capacitance element body. In Modification 4-4, a capacitor is constituted by a pair of stacked electrode bodies 49.

  In Modification 4-4, since the outer shape of the variable capacitance element body is formed in a columnar shape having an oval cross section, the symmetry of the outer shape of the variable capacitance element body can be enhanced, and is the same as in the fourth embodiment. The effect of can be obtained.

[Modification 4-5]
FIG. 22 shows a planar configuration of a dielectric layer and internal electrodes that constitute a variable capacitance element according to Modification 4-5. In the variable capacitance element according to Modification 4-5, the internal electrode 51 is the same as that of Modification 4-2. In addition, the planar shape in which the internal electrode of the variable capacitance element body is formed, that is, the dielectric layer is formed in a quadrangular shape in which two corners positioned on both sides of one side of the square shape are rounded.

  Also in Modification 4-5, although illustration is omitted, the internal electrodes shown in FIG. 22 are laminated so that the sides and the center of gravity of the electrode body overlap in the laminating direction, and the respective connections constituting the laminated internal electrodes The variable capacitance element body is configured such that the electrodes are exposed on the opposite side surfaces. And the variable capacitance element of the modification 4-5 is formed by providing the external terminal electrically connected to each connection electrode exposed on the side surface of the variable capacitance element body. In Modification 4-5, a capacitor is formed by the stacked square electrode bodies.

  In Modification 4-5, since the outer shape of the variable capacitor element body is formed in a prismatic shape with one corner being rounded, the planar shape of the dielectric layer and the symmetry of the variable capacitor element body are improved. And the same effects as in the fourth embodiment can be obtained.

[Modification 4-6]
FIG. 23 shows a planar configuration of a dielectric layer and internal electrodes that constitute a variable capacitance element according to Modification 4-6. In the variable capacitance element according to Modification 4-6, the internal electrode 51 is the same as that in Modification 4-2. In addition, the planar shape in which the internal electrode 51 of the variable capacitance element body is formed, that is, the dielectric layer 55 is formed in a rounded square shape in which four square corners are rounded.

  Also in Modification 4-6, although not shown, the internal electrode 51 shown in FIG. 23 is stacked in two layers so that the sides and the center of gravity of the electrode body 49 overlap in the stacking direction, and the connection electrodes 50 face each other. The variable capacitance element body is configured so as to be exposed on the side surface. Then, by providing an external terminal that is electrically connected to each connection electrode 50 exposed on the side surface of the variable capacitor element body, the variable capacitor element of Modification 4-6 is formed. In Modification 4-6, a capacitor is configured by the pair of electrode bodies 49 stacked.

  In Modification 4-6, since the outer shape of the variable capacitor element body is formed in a columnar shape with a rounded square cross section, the symmetry of the variable capacitor element body can be increased. Similar effects can be obtained.

[Modification 4-7]
FIG. 24 shows a planar configuration of a dielectric layer and internal electrodes that constitute a variable capacitance element according to Modification 4-7. In the variable capacitance element according to Modification 4-7, the internal electrode 51 is the same as that of Modification 4-2. The planar shape on which the internal electrode 51 of the variable capacitance element body is formed, that is, the dielectric layer 56 is formed in an octagonal shape.

  Also in Modification 4-7, although not shown, the internal electrode 51 shown in FIG. 24 is laminated in two layers so that the sides and the center of gravity of the electrode body overlap in the lamination direction, and the connection electrodes 50 face each other. The variable capacitance element body is configured so as to be exposed on the side surface. Then, by providing an external terminal that is electrically connected to each connection electrode 50 exposed on the side surface of the variable capacitor element body, the variable capacitor element of Modification 4-7 is formed. In Modification 4-7, a capacitor is constituted by a pair of stacked electrode bodies 49.

  In Modified Example 4-7, the outer shape of the variable capacitor element body is formed in a columnar shape having an octagonal cross section, so that the symmetry of the outer shape of the variable capacitor element body can be increased, and is the same as in the fourth embodiment. The effect of can be obtained.

[Modification 4-8]
FIG. 25 shows a planar configuration of a dielectric layer and internal electrodes constituting a variable capacitance element according to Modification 4-8. In the variable capacitance element according to Modification 4-8, the internal electrode 51 is the same as that in Modification 4-2. The planar shape on which the internal electrode 51 of the variable capacitance element body is formed, that is, the dielectric layer 57 is formed in a regular hexagonal shape.

  Also in Modification 4-8, although not shown in the figure, the internal electrode 51 shown in FIG. The variable capacitance element body is configured so as to be exposed on the side surface. Then, by providing an external terminal that is electrically connected to each connection electrode 50 exposed on the side surface of the variable capacitor element body, the variable capacitor element of Modification 4-8 is formed. In Modification 4-8, a capacitor is configured by the pair of electrode bodies 49 stacked.

  In Modified Example 4-8, the outer shape of the variable capacitor element body is formed in a columnar shape having a regular hexagonal cross section, so that the symmetry of the outer shape of the variable capacitor element body can be increased. Similar effects can be obtained.

<5. Fifth Embodiment>
Next, a variable capacitor according to a fifth embodiment of the present disclosure will be described. FIG. 26 is a plan configuration diagram of a dielectric layer and internal electrodes constituting the variable capacitance element of the present embodiment. In the present embodiment example, the outer shape of the variable capacitance element body is an example different from that of the first embodiment. In FIG. 26, parts corresponding to those in FIG.

  In the variable capacitance element according to the present embodiment, the internal electrode 10 is formed so as to be connected to one side of the electrode body 8 having a circular shape and the electrode body 8 so that the end portion is exposed on the side surface of the capacitance element body. And the connection electrode 9. The planar shape on which the internal electrode 10 of the variable capacitance element body is formed, that is, the dielectric layer 58 is formed in a circular shape. The center of gravity of the electrode body 8 of the internal electrode 10 is formed so as to be positioned at the center of the dielectric layer 58.

  Also in this embodiment, although not shown, the internal electrode 10 shown in FIG. 26 is laminated in two layers so that the sides and the center of gravity of the electrode body 8 overlap in the lamination direction, and the connection electrodes 9 face each other. The variable capacitance element body is configured so as to be exposed on the side surface. Then, by providing an external terminal that is electrically connected to each connection electrode 9 exposed on the side surface of the variable capacitance element body, the variable capacitance element of this embodiment is formed. In the present embodiment, a capacitor is constituted by a pair of stacked electrode bodies 8.

In this embodiment, since the shape of the electrode body 8 constituting the capacitance of the internal electrode 10 and the planar shape of the dielectric layer 58 are the same, the symmetry of the outer shape of the electrode body 8 and the variable capacitance element body is the same. Is increased. Thereby, the residual stress generated at the time of firing the variable capacitance element body can be concentrated in the central direction, and the electrical characteristics of the capacitor constituted by the pair of electrode bodies 8 can be improved.
In addition, the same effects as those of the first embodiment can be obtained.

[Modification 5-1]
FIG. 27 shows a planar configuration of a dielectric layer and internal electrodes that constitute a variable capacitance element according to Modification 5-1. In FIG. 27, parts corresponding to those in FIG. In the variable capacitance element according to Modification 5-1, the internal electrode 20 has the same configuration as that of the internal electrode 20 of the second embodiment.

  Also in the modified example 5-1, although not shown, the internal electrode shown in FIG. 27 is laminated in two layers so that the side and the center of gravity of the electrode body 8 overlap in the lamination direction, and the connection electrodes 19 face each other. The variable capacitance element body is configured so as to be exposed on the side surface. Then, by providing an external terminal electrically connected to each connection electrode 19 exposed on the side surface of the variable capacitor element body, the variable capacitor element of Modification 5-1 is formed. In the modified example 5-1, a capacitor is constituted by the pair of electrode bodies 8 stacked.

  In the modified example 5-1, the area of the connection electrode 19 connected to the electrode body 8 in the internal electrode 20 is sufficiently smaller than that of the electrode body 8. For this reason, the shape of the dielectric layer 58 and the internal electrode 20 can be brought closer to a similar relationship.

  FIG. 28 is a plan view of the two internal electrodes 20 of the variable capacitance element according to Modification 5-1 as seen through the top surface. In FIG. 28, the residual stress generated in the lower internal electrode 20 is indicated by an arrow e, and the residual stress generated in the upper internal electrode 20 is indicated by an arrow f.

  As shown in FIG. 28, in the modified example 5-1, since the area of the connection electrode 19 is formed sufficiently smaller than the area of the electrode body 8, the contribution to the residual stress in the connection electrode 19 portion is reduced. For this reason, compared with the internal electrode 10 according to the first embodiment in which the width of the connection electrode 9 is formed to be substantially the same as the diameter of the electrode body 8, the residual stress generated toward the center of the electrode body 8 is entirely present. Will be equal. As a result, the tensile stress in the stacking direction (electric field direction) of the internal electrode 20 is further increased, and the electrical characteristics of the capacitor are improved.

  Furthermore, in the modified example 5-1, since the shape of the electrode body 8 constituting the capacitance of the internal electrode 20 and the planar shape of the dielectric layer 58 are the same shape, the outer shape of the electrode body 8 and the variable capacitance element body. And the same effects as those of the fifth embodiment can be obtained.

[Modification 5-2]
FIG. 29 shows a planar configuration of a dielectric layer and internal electrodes that constitute a variable capacitance element according to Modification 5-2. In Modification 5-2, the internal electrode 51 is connected to one side of the electrode body 49 having a square shape and the electrode body 49, and the connection electrode is formed so that the end portion is exposed on the side surface of the capacitor element body. And 50. In addition, the planar shape in which the internal electrode 51 of the variable capacitance element body is formed, that is, the planar shape of the dielectric layer 59 is a square shape. The center of gravity of the electrode body 49 of the internal electrode 51 is formed so as to be positioned at the center of the dielectric layer 59.

  Also in Modification 5-2, although not shown, the internal electrode 51 shown in FIG. 29 is stacked in two layers so that the sides and the center of gravity of the electrode body 49 overlap in the stacking direction, and the connection electrodes 50 face each other. The variable capacitance element body is configured so as to be exposed on the side surface. And the variable capacitance element of the modification 5-2 is formed by providing the external terminal electrically connected to each connection electrode exposed to the side surface of the variable capacitance element body. In Modification 5-2, a capacitor is constituted by a pair of stacked electrode bodies 49.

  In Modification 5-2, the shape of the electrode body 49 constituting the capacitance of the internal electrode 51 and the planar shape of the dielectric layer 59 are the same, and therefore the outer shapes of the electrode body 49 and the variable capacitor element body are symmetrical. Therefore, the same effect as that of the fifth embodiment can be obtained.

[Modification 5-3]
FIG. 30 shows a planar configuration of a dielectric layer and internal electrodes that constitute a variable capacitance element according to Modification 5-3. In FIG. 30, parts corresponding to those in FIG. In the variable capacitance element according to Modification 5-3, the internal electrode 22 has the same configuration as that of the internal electrode 22 of Modification 2-1 shown in FIG.

  Also in Modification 5-3, although not shown, the internal electrode 22 shown in FIG. 30 is laminated in two layers so that the sides and the center of gravity of the electrode body 21 overlap in the lamination direction, and the connection electrodes 19 face each other. The variable capacitance element body is configured so as to be exposed on the side surface. Then, by providing an external terminal electrically connected to each connection electrode 19 exposed on the side surface of the variable capacitor element body, the variable capacitor element of Modification 5-3 is formed. In Modification 5-3, a capacitor is formed by the stacked circular electrode bodies.

In Modification 5-3, in the internal electrode 22, the area of the connection electrode 19 connected to the electrode body 21 is sufficiently smaller than that of the electrode body 21. For this reason, the shape of the dielectric layer 59 and the internal electrode 22 can be brought closer to a similar relationship. Thereby, the residual stress generated at the time of firing the variable capacitance element body can be concentrated more toward the center, and the electrical characteristics of the capacitor can be improved.
In addition, the same effects as those of the fifth embodiment can be obtained.

<6. Sixth Embodiment> Three Terminals Next, a variable capacitance element according to a sixth embodiment of the present disclosure will be described. FIG. 31 is a perspective view of a variable capacitor according to this embodiment. FIG. 32 is a plan configuration diagram of internal electrodes constituting the variable capacitance element according to the present embodiment.

  As shown in FIG. 31, the variable capacitance element according to the present embodiment includes a variable capacitance element main body 62 formed of a rectangular parallelepiped member and three external terminals 63a and 63b formed respectively. The external terminals 63a and 63b are provided apart from each other on the side surface of the variable capacitance element body. Further, the variable capacitance element main body 62 has a configuration in which two internal electrodes 67 shown in FIG.

  In the present embodiment example, as shown in FIG. 32, the internal electrode 67 includes a circular electrode body 65 and three connections that are connected to the electrode body 65 and formed at equal intervals in the circumferential direction of the electrode body 65. An electrode 66 is included. The dielectric layer 64 has a rectangular plane on which the internal electrodes 67 are formed.

  In this embodiment, the three connection electrodes 66 are each formed in a strip shape that is thinner than the diameter of the electrode body 65, and are formed so as to be exposed on the side surface of the variable capacitance element body 62. Further, when the internal electrode 67 shown in FIG. 32 and the internal electrode 67 in a state where the internal electrode 67 shown in FIG. 32 is rotated 180 degrees about the axis perpendicular to the electrode surface are stacked, the connection electrode 66 is stacked in the stacking direction. It is formed so as not to overlap.

  In this embodiment, the variable capacitance element is formed by stacking the internal electrode 67 shown in FIG. 32 and the internal electrode 67 in a state where the internal electrode 67 shown in FIG. 32 is rotated 180 degrees about an axis perpendicular to the electrode surface. The body can be configured. FIG. 33 is a view of the variable capacitor element body 62 of this embodiment as seen through the top surface.

  As shown in FIG. 33, a total of six connection electrodes 66 formed on the two stacked internal electrodes 32 do not overlap each other in the stacking direction. For this reason, in this embodiment, no capacitor is formed between the connection electrodes 66 to be stacked, and a capacitor is constituted by the electrode body 65 overlapping in the stacking direction. Then, by providing the external terminals 63a and 63b connected to the six connection electrodes 66 exposed on the side surface of the variable capacitor element body 62 of the present embodiment example, the variable capacitor element 61 of the present embodiment example is formed. .

In this embodiment, the withstand voltage against the input signal voltage can be improved by increasing the number of connection electrodes 66 connected to one electrode body 65.
In this embodiment, the electrode body 65 forming the capacitor is formed in a circular shape, and the connection electrodes 66 connected to the electrode body 65 are formed in three equally spaced directions, whereby the symmetry of the internal electrode 67 is achieved. Can be increased. Thereby, the residual stress generated during firing of the variable capacitance element body 62 can be concentrated toward the center, and the electrical characteristics of the capacitor can be improved.
In addition, the same effects as those of the first embodiment can be obtained.

[Modification 6-1]
FIG. 34 shows a planar configuration of a dielectric layer and internal electrodes that constitute a variable capacitance element according to Modification 6-1. In FIG. 34, parts corresponding to those in FIG. In the modified example 6-1, the internal electrode 70 includes a circular electrode main body 65 and three connection electrodes 69 connected to the electrode main body 65 and formed at equal intervals in the circumferential direction of the electrode main body 65. ing. The dielectric layer 68 has a square surface on which the internal electrode 70 is formed.

  In the modified example 6-1, the three connection electrodes 69 are formed to be wide from the side connected to the electrode main body 65 to the end side exposed to the side surface of the variable capacitance element main body. Further, when the internal electrode 70 shown in FIG. 34 and the internal electrode 70 shown in FIG. 34 rotated by 180 degrees about an axis perpendicular to the electrode surface are stacked, the connection electrode 69 is stacked in the stacking direction. Form so as not to overlap.

  In the modified example 6-1, the internal electrode 70 shown in FIG. 34 and the internal electrode 70 shown in FIG. 34 are laminated by laminating the internal electrode 70 in a state where the internal electrode 70 is rotated 180 degrees about an axis perpendicular to the electrode surface. A capacitive element body can be configured. By doing so, a total of six connection electrodes 69 formed on the two stacked internal electrodes 70 are exposed on the side surfaces that do not overlap in the stacking direction. Further, since the connection electrodes 69 formed in the stacking direction do not overlap in the stacking direction, no capacitance is formed between the stacked connection electrodes 69. And the variable capacitance element of the modification 6-1 is formed by providing the external terminal connected to each of the six connection electrodes 69 exposed on the side surface of the variable capacitance element body.

  In the modified example 6-1, the connection electrode 69 is formed wider toward the side connected to the external terminal. Therefore, the breakdown voltage can be further improved as compared with the variable capacitance element 61 according to the sixth embodiment. In addition, the same effects as those of the sixth embodiment can be obtained.

[Modification 6-2]
FIG. 35 shows a planar configuration of a dielectric layer and internal electrodes that constitute a variable capacitance element according to Modification 6-2. In FIG. 35, portions corresponding to those in FIG. Modification 6-2 is an example in which the planar shape of the dielectric layer is different from that of the sixth embodiment.

  In Modification 6-2, the planar shape of the dielectric layer 71 is a regular hexagon. The three connection electrodes 66 are formed so as to be exposed on every other side surface of the regular hexagonal dielectric layer 71. Also in the modified example 6-2, the internal electrode 67 shown in FIG. 35 and the internal electrode 67 in a state where the internal electrode 67 shown in FIG. 35 is rotated by 180 degrees about an axis perpendicular to the electrode surface are laminated. Thus, the variable capacitance element body can be configured. In addition, by providing external terminals connected to the six connection electrodes 66 exposed on the side surface of the variable capacitance element body, the variable capacitance element according to Modification 6-2 is formed. At this time, the variable capacitance element body has a regular hexagonal cross section and is formed in a columnar shape.

  In the variable capacitance element according to Modification 6-2, the internal electrode 67 and the variable capacitance element main body are highly symmetrical, and the residual stress generated during firing of the variable capacitance element main body can be further increased. The same effect as that of the sixth embodiment can be obtained.

  In the variable capacitance elements according to the first to sixth embodiments described above and the variable capacitance elements according to the modification examples, the stacked internal electrodes have been described as having the same shape. However, the present disclosure is not limited to this, and an effect of improving electrical characteristics due to an increase in residual stress can be obtained even when internal electrodes having different shapes are stacked in combination. When the electrode bodies of the stacked internal electrodes have the same shape as in the first to sixth embodiments described above, the electrical characteristics can be further improved.

  Based on the example of the shape of the internal electrode according to the above embodiment and the planar shape of the dielectric layer, the configuration of the variable capacitor obtained by stacking the internal electrodes having different shapes will be described below. In the following embodiments, a variable capacitance element including a plurality of capacitors connected in series in the stacking direction of internal electrodes will be described as an example.

<7. Seventh Embodiment>
FIG. 36A is a schematic perspective view of a variable capacitance element 81 according to the seventh embodiment of the present disclosure, and FIG. 36B is a cross-sectional configuration diagram of the variable capacitance element 81. In the following, a description will be given assuming that the stacking direction of internal electrodes described later is the z direction, one direction of the variable capacitance element 81 orthogonal to the stacking direction is the x direction, and the other direction of the variable capacitance element 81 orthogonal to the stacking direction is the y direction. In addition, one surface constituted by the xy plane of the variable capacitance element 81 will be described as an “upper surface” and the other surface constituted by the xy plane will be described as a “lower surface”. Further, a description will be given assuming that the surfaces perpendicular to the upper surface and the lower surface of the variable capacitor 1 are “side surfaces”.

  As shown in FIG. 36A, the variable capacitance element 1 according to the present embodiment includes a variable capacitance element main body 82 formed of a rectangular parallelepiped member having an xy plane that is square and six external terminals (hereinafter, first external terminals 83a respectively). To sixth external terminal 83f).

The first external terminal 83a is formed on one side surface constituted by the yz surface of the variable capacitance element main body 82, and the sixth external terminal 83f is formed on the other side surface constituted by the yz surface of the variable capacitance element main body 82. Has been. The second external terminal 83b and the fourth external terminal 83d are formed to be separated from each other on one side formed by the xz plane of the variable capacitance element body 82, and the third external terminal 83c and the fifth external terminal 83e are variable. The capacitor element main body 82 is formed on the other side surface constituted by the xz plane so as to be separated from each other. When viewed in the xy plane, the second external terminal 83b and the third external terminal 83c are positioned diagonally, and the fourth external terminal 83d and the fifth external terminal 83e are positioned diagonally. Yes.
The first external terminal 83a to the sixth external terminal 83f are formed so as to cover the side surface of the variable capacitance element main body 82 in the z direction and to protrude from the upper surface and the lower surface of the variable capacitance element main body 82, respectively.

  As shown in FIG. 36B, the variable capacitance element main body 82 includes a dielectric layer 85 and six internal electrodes 88 to 93 stacked via the dielectric layer 85. In the following description, for the sake of convenience, the six internal electrodes will be described as the first internal electrode 88 to the sixth internal electrode 93, respectively. The variable capacitor element body 82 of the present embodiment is configured such that the first internal electrode 88 to the sixth internal electrode 93 are laminated in this order from the lower surface to the upper surface. The lower dielectric layer 86 is laminated below the first internal electrode 88, and the upper dielectric layer 87 is laminated above the sixth internal electrode 93.

  FIG. 37 is an exploded view of the variable capacitor element body 82 when viewed from one side surface in the long side direction. FIG. 38A is a plan configuration diagram when the first internal electrode 88 is viewed from above, and FIG. 38B is a configuration diagram when the first internal electrode 88 is viewed from one side surface. FIG. 39A is a plan configuration diagram when the second internal electrode 89 is viewed from above, and FIG. 39B is a configuration diagram when the second internal electrode 89 is viewed from one side surface. 40A is a plan configuration diagram when the fourth internal electrode 91 is viewed from the top surface, and FIG. 40B is a configuration diagram when the fourth internal electrode 91 is viewed from one side surface. In FIGS. 37 to 40, a line passing through the dielectric layer 85 and the center (center of gravity) of each internal electrode is indicated by a broken line.

  As shown in FIG. 37, the variable capacitance element body 2 has a structure in which a sheet-like dielectric layer 85 having an internal electrode formed on one surface is laminated. Each dielectric layer 85 formed in a sheet shape has a square planar shape. In the variable capacitor element body 82, each dielectric layer 85 is laminated so that the side on which the internal electrode is formed faces the upper surface. Yes.

  In the present embodiment, a plurality of dielectric layers 85 on which no electrodes are formed are provided on the lower layer of the first internal electrode 88 and the upper layer of the sixth internal electrode 93. This dielectric layer 85 constitutes a lower dielectric layer 86 and an upper dielectric layer 87. The lower dielectric layer 86 and the upper dielectric layer 87 constituted by the plurality of dielectric layers 85 can prevent the electrodes from being exposed on the upper surface and the lower surface of the variable capacitance element body 82.

  In this embodiment, the dielectric layer 85 is made of a ferroelectric material in order to constitute the variable capacitance element 1 whose capacitance changes according to the applied voltage. Also in this embodiment, the same ferroelectric material as that in the first embodiment can be used.

  As shown in FIGS. 38A and 38B, the first internal electrode 88 includes an electrode body 94 and a connection electrode 95. The electrode body 94 has a square shape in plan view, and is smaller than the area of the dielectric layer 85 formed in a sheet shape, that is, the area of the xy plane of the variable capacitor element body 82 and is exposed on the side surface of the variable capacitor element body 82. It is formed so as not to. The electrode body 94 is formed such that the center of gravity thereof coincides with the center of the dielectric layer 85.

  The connection electrode 95 is formed so as to be connected to one side extending in the y direction of the electrode body 94 and is exposed to the side surface of the variable capacitance element body 82. The width of the connection electrode 95 in the x direction is the same as the width of the electrode body 94 in the x direction. The end portion of the connection electrode 95 exposed on the side surface of the variable capacitance element body 82 is electrically connected to the first external terminal 83a.

  As shown in FIGS. 39A and 39B, the second internal electrode 89 includes an electrode body 96 and a connection electrode 97. The electrode main body 96 has the same size and the same shape as the electrode main body 94 constituting the first internal electrode 88 and is formed so that the center thereof coincides with the center of the dielectric layer 85.

  The connection electrode 97 is formed so as to be connected to the side extending in the x direction of the electrode main body 96 and is formed so as to be exposed on the side surface of the variable capacitance element main body 82. Further, the width of the connection electrode 97 in the y direction is sufficiently smaller than the width of the electrode body 96 in the y direction, and is formed so as to be connected to one end of the side of the electrode body 96 in the y direction. . The end portion of the connection electrode 97 exposed on the side surface of the variable capacitance element body 82 is electrically connected to the second external terminal 83b.

  As shown in FIGS. 40A and 40B, the fourth internal electrode 91 includes an electrode body 98 and a connection electrode 99. The electrode main body 98 has the same size and the same shape as the electrode main body 94 constituting the first internal electrode 88, and is formed so that its center of gravity coincides with the center of the dielectric layer 85.

  The connection electrode 99 is formed so as to be connected to the side extending in the y direction of the electrode body 98 and is formed so as to be exposed on the side surface of the variable capacitance element body 82. In addition, the width of the connection electrode 99 in the y direction is sufficiently smaller than the width of the electrode body 98 in the y direction, and is spaced apart from the connection electrode 97 of the second internal electrode 89 when viewed in the xy plane. The electrode body 98 is formed so as to be connected to the other end of the side in the y direction. The end portion of the connection electrode 99 exposed on the side surface of the variable capacitance element body 82 is electrically connected to the fourth external terminal 83d.

  The third internal electrode 90 has a configuration in which the second internal electrode 89 shown in FIG. 39A is rotated by 180 degrees about an axis perpendicular to the electrode surface. 97. Accordingly, the connection electrode 97 of the third internal electrode 90 is formed at a position diagonal to the connection electrode 97 of the second internal electrode 89 when viewed in the xy plane. The connection electrode 97 of the third internal electrode 90 exposed on the side surface of the variable capacitance element body 82 is electrically connected to the third external terminal 83c.

  The fifth internal electrode 92 has a configuration in which the fourth internal electrode 91 shown in FIG. 40A is rotated 180 degrees around an axis perpendicular to the electrode surface, and the same electrode body 98 and connection electrode as the fourth internal electrode 91 99. Therefore, the connection electrode 99 of the fifth internal electrode 92 is formed at a position diagonal to the connection electrode 99 of the fourth internal electrode 91 when viewed in the xy plane. The connection electrode 99 of the fifth internal electrode 92 exposed on the side surface of the variable capacitance element body 82 is electrically connected to the fifth external terminal 83e.

The sixth internal electrode 93 has a configuration in which the first internal electrode 88 shown in FIG. 38A is rotated 180 degrees about an axis perpendicular to the electrode surface, and the same electrode body 94 and connection electrode as the first internal electrode 88 are formed. 95. Therefore, the connection electrode 95 of the sixth internal electrode 93 is formed at a position facing the connection electrode 95 of the first internal electrode 88 when viewed in the xy plane. The connection electrode 95 of the sixth internal electrode 93 exposed on the side surface of the variable capacitance element body 82 is electrically connected to the sixth external terminal 83f.
The first internal electrode 88 to the sixth internal electrode 93 of the present embodiment example can be formed using the same material as in the first embodiment.

  The variable capacitance element 81 of the present embodiment example can also be formed by the same manufacturing process as in the first embodiment. That is, the variable capacitance element body 82 is formed by laminating and firing the dielectric sheets on which the internal electrodes are formed so that the electrode formation surface is the upper surface, and forming the external terminals at desired positions on the side surfaces. Thus, the variable capacitance element 81 of the present embodiment example is manufactured. In the variable capacitance element 81 of this embodiment, the first internal electrode 88 and the sixth internal electrode 93, the second internal electrode 89 and the third internal electrode 90, the fourth internal electrode 91 and the fifth internal electrode 92 are provided. Since they have the same shape, they can be formed with the same mask.

  Next, an example of a voltage control circuit using the variable capacitance element 81 of the present embodiment will be described. FIG. 41 shows a circuit configuration of the voltage control circuit. A voltage control circuit 200 shown in FIG. 41 is provided, for example, between an AC power supply 201 and a circuit such as a rectifier circuit, and receives an AC voltage (input signal) input from the AC power supply 201 to a circuit such as a rectifier circuit. Adjust to voltage value. Note that the first external terminal 83a to the sixth external terminal 83f in FIG. 41 correspond to the first external terminal 83a to the sixth external terminal 83f in FIG.

  In the present embodiment example, the stacked first internal electrode 88 to sixth internal electrode 93 are connected to different external terminals (first external terminal 83a to sixth external terminal 83f), respectively. Therefore, the first capacitor C <b> 1 is formed between the first internal electrode 88 and the second internal electrode 89. A second capacitor C <b> 2 is formed between the second internal electrode 89 and the third internal electrode 90. A third capacitor C3 is formed between the third internal electrode 90 and the fourth internal electrode 91. A fourth capacitor C4 is formed between the fourth internal electrode 91 and the fifth internal electrode 92. A fifth capacitor C <b> 5 is formed between the fifth internal electrode 92 and the sixth internal electrode 93. The variable capacitance element 81 of the present embodiment is a circuit in which the first capacitor C1 to the fifth capacitor C5 are connected in series in this order.

  In this embodiment, the second capacitor C2, the third capacitor C3, and the fourth capacitor C4 are used as variable capacitors, and the first capacitor C1 and the fifth capacitor C5 are used as DC removal capacitors. Therefore, the first external terminal 83 a of the variable capacitance element 81 is connected to one output terminal of the AC power supply 201, and the sixth external terminal 83 f is connected to the other output terminal of the AC power supply 201. That is, a series circuit including the first capacitor C1 to the fifth capacitor C5 is connected in parallel to the AC power supply 201. Although not shown in FIG. 41, a circuit such as a rectifier circuit to which a signal from the AC power supply 201 is input is connected in parallel between the first external terminal 83a and the sixth external terminal 83f of the variable capacitance element 81.

  Further, the second external terminal 83b and the fourth external terminal 83d are connected to the negative terminal of the control power source 202 via the DC removal resistors 203 and 205, respectively. Further, the third external terminal 83c and the fifth external terminal 83e are connected to the positive terminal of the control power source 202 via the DC removal resistors 204 and 206, respectively. That is, in the variable capacitance element 81 of the present embodiment example, the control power source 202 is connected in parallel to the second capacitor C2, the third capacitor C3, and the fourth capacitor C4. The capacities of the second capacitor C2, the third capacitor C3, and the fourth capacitor C4 are adjusted by a DC signal (control signal) input from the control power source 202.

  The first capacitor C1 and the fifth capacitor C5 used as the DC removal capacitor and the three DC removal resistors are affected by interference between the DC bias current flowing from the control power source 202 and the AC current from the AC power source 201. Provided to suppress. In the present embodiment, an inductance (coil) for removing DC may be used instead of the resistor for removing DC.

  In the present embodiment, the shape of the internal electrode constituting each capacitor and the shape of the dielectric layer with respect to the internal electrode are highly symmetric. Therefore, the electrical characteristics can be improved, such as improvement of the capacitance variable rate of the variable capacitance element 81 and improvement of the capacitance.

[Modification 7-1]
Next, the variable capacitance element according to Modification 7-1 will be described. In the variable capacitance element of the modified example 7-1, the external configuration, the cross-sectional configuration, and the circuit configuration are the same as those in FIGS. 36A, 36B, and 41 shown in the seventh embodiment. Duplicate explanation is omitted.

  FIG. 42 is an exploded view of the variable capacitance element body 110 of the variable capacitance element according to Modification 7-1 when viewed from one side surface in the long side direction. The modified example 7-1 is an example in which the fourth internal electrode 91 and the fifth internal electrode 92 are formed using a mask used when the second internal electrode 89 and the third internal electrode 90 are manufactured. In FIG. 42, parts corresponding to those in FIG.

  In Modification 7-1, the fourth internal electrode 91 is 180 degrees around the axis in the x direction that passes through the center of gravity of the electrode main body 96 and passes through the second internal electrode 89 shown in FIG. The configuration is rotated. In other words, the second internal electrode 89 shown in FIG. 39A is turned upside down around the x-direction axis. Therefore, the connection electrode 97 of the fourth internal electrode 91 is disposed apart from the connection electrode 97 of the second internal electrode 89 when viewed in the xy plane. As in the seventh embodiment, the fourth external terminal 83 d is connected to the connection electrode 97 of the fourth internal electrode 91.

  The fifth internal electrode 92 rotates the second internal electrode 89 shown in FIG. 39A by 180 degrees about the y-direction axis passing through the center of gravity of the electrode body 96, and in the x direction passing through the center of gravity of the electrode body 96. It is the structure rotated 180 degree | times centering on the axis | shaft. That is, the fifth internal electrode 92 of Modification 7-1 has a configuration in which the third internal electrode 90 in the seventh embodiment is turned over around the axis in the y direction. As in the seventh embodiment, the fifth external terminal 83e is connected to the connection electrode 97 of the fifth internal electrode 92.

  In Modification 7-1, the second internal electrode 89 to the fourth internal electrode 91 are formed with the same mask, and the sheet-like dielectric layer on which each internal electrode is formed is stacked while being rotated and / or turned over. Thus, the variable capacitance element 81 similar to that in FIG. 36 can be formed. Specifically, as shown in FIG. 42, the first internal electrode 88 to the third internal electrode 90 are laminated so that the electrode surfaces face the upper surface, and the fourth internal electrode 91 to the sixth internal electrode 93 are Lamination is performed so that the electrode surface faces the lower surface. Further, by sandwiching the dielectric layer 85 in which no electrode is formed between the dielectric layer 85 in which the third internal electrode 90 is formed and the dielectric layer 85 in which the fourth internal electrode 91 is formed, A dielectric layer 85 is formed between the third internal electrode 90 and the fourth internal electrode 91.

  In this way, by stacking the second internal electrode 89 to the fourth internal electrode 91 formed with the same mask while rotating and / or turning them over, the respective connection electrodes 97 are exposed at different positions on the side surface of the variable capacitor element body. Can be configured to. Then, by connecting the respective external terminals to these connection electrodes 97, different potentials can be supplied to the respective internal electrodes, and they are connected in series in the stacking direction of the internal electrodes as in the seventh embodiment. Capacitors can be configured.

  As described above, in the modified example 7-1, the second internal electrode 89 to the fifth internal electrode 92 can be formed using the same mask, so that the cost can be reduced. In addition, the same effects as those of the seventh embodiment are obtained.

[Modification 7-2]
Next, a variable capacitance element according to Modification 7-2 will be described. Since the external configuration, the cross-sectional configuration, and the circuit configuration of the variable capacitance element of Modification 7-2 are the same as those in FIGS. 36A, 36B, and 41 shown in the seventh embodiment, the illustration is omitted. Duplicate explanation is omitted.

  FIG. 43 is an exploded view of the variable capacitance element body 111 of the variable capacitance element according to Modification 7-2 when viewed from one side surface in the long side direction. In the modified example 7-2, the stress control units 100 and 101 are provided in the lower layer of the first internal electrode 88 and the upper layer of the sixth internal electrode 93. In FIG. 43, parts corresponding to those in FIG.

As shown in FIG. 43, in Modification 7-2, the first stress control unit 100 is formed in the lower layer of the first internal electrode 88, and the second stress control unit 101 is formed in the upper layer of the sixth internal electrode 93. ing.
The first stress control unit 100 includes a plurality of first internal electrodes 88 stacked via a dielectric layer 85, and the first internal electrode 88 that configures the first stress control unit 100 configures a first capacitor C1. Similarly to the first internal electrode 88, the first external terminal 83a is connected. Accordingly, since the first internal electrode 88 constituting the first capacitor C1 and the first internal electrode 88 constituting the first stress control unit 100 are set to the same potential, no capacitor is formed between the electrodes. Furthermore, since the plurality of first internal electrodes 88 formed in the first stress control unit 100 are also at the same potential, no capacitor is formed in the first stress control unit 100.

  The second stress control unit 101 includes a plurality of sixth internal electrodes 93 stacked via a dielectric layer 85, and the sixth internal electrode 93 included in the second stress control unit 101 includes a fifth capacitor C5. The sixth internal electrode 93 is connected to the sixth external terminal 83f in the same manner as the sixth internal electrode 93. Therefore, since the sixth internal electrode 93 constituting the fifth capacitor C5 and the sixth internal electrode 93 constituting the second stress control unit 101 are set to the same potential, no capacitor is formed between the electrodes. Furthermore, since the plurality of sixth internal electrodes 93 formed in the second stress control unit 101 are also at the same potential, no capacitor is formed in the second stress control unit 101.

In the variable capacitance element of the modified example 7-2, the residual stress is also generated in the first stress control unit 100 and the second stress control unit 101 due to the difference in shrinkage rate when the electrode material and the dielectric material are fired. . Therefore, since the residual stress increases by the first stress control unit 100 and the second stress control unit 101, it is possible to increase the capacitance value and increase the capacity variable rate compared to the case where the stress control unit is not formed. it can.
In addition, the same effects as those of the seventh embodiment can be obtained.

<8. Eighth Embodiment>
44A is a schematic perspective view of a variable capacitance element 121 according to the eighth embodiment of the present disclosure, and FIG. 44B is a cross-sectional configuration diagram of the variable capacitance element 121. 44A and 44B, parts corresponding to those in FIGS. 36A and 36B are denoted by the same reference numerals, and redundant description is omitted.

  As shown in FIG. 44A, the variable capacitance element 121 of this embodiment includes a variable capacitance element main body 122 composed of a rectangular parallelepiped member whose xy plane is a square and 10 external terminals (hereinafter referred to as first external terminals respectively). 129a to 10th external terminal 129j).

The first external terminal 129 a to the tenth external terminal 129 j are arranged on the four side surfaces of the variable capacitance element body 122 so as to be separated from each other. The first external terminal 129a and the eighth external terminal 129h, the second external terminal 129b and the third external terminal 129c, and the ninth external terminal 129i and the tenth external terminal 129j face each other when viewed in the xy plane. Placed in position. The fourth external terminal 129d and the seventh external terminal 129g, and the fifth external terminal 129e and the sixth external terminal f are disposed at positions facing each other when viewed in the xy plane.
The first external terminal 129a to the tenth external terminal 129j are formed so as to cover the side surface of the variable capacitor element body 122 in the z direction and to protrude from the upper surface and the lower surface of the variable capacitor element body 122, respectively.

  As shown in FIG. 44B, the variable capacitance element main body 122 includes a dielectric layer 85 and six internal electrodes 123 to 128 stacked via the dielectric layer 85. In the following description, for convenience, the three internal electrodes will be described as the first internal electrode 123 to the sixth internal electrode 128, respectively. The variable capacitance element main body 122 of the present embodiment is configured such that the first internal electrode 123 to the sixth internal electrode 128 are laminated in this order from the lower surface to the upper surface.

  FIG. 45 is an exploded view of the variable capacitor element body 122 when viewed from one side surface in the long side direction. 46A is a plan configuration diagram when the first internal electrode 123 is viewed from the top surface, and FIG. 46B is a configuration diagram when the first internal electrode 123 is viewed from one side surface. 47A is a plan configuration diagram when the second internal electrode 124 is viewed from the top surface, and FIG. 47B is a configuration diagram when the second internal electrode 124 is viewed from one side surface. 48A is a plan configuration diagram when the fourth internal electrode 126 is viewed from above, and FIG. 48B is a configuration diagram when the fourth internal electrode 126 is viewed from one side surface. In FIGS. 45 to 48, a line passing through the dielectric layer 85 and the center (center of gravity) of each internal electrode is indicated by a broken line.

  As shown in FIG. 45, the variable capacitance element body 122 has a structure in which a sheet-like dielectric layer 85 having an internal electrode formed on one surface is laminated. Each dielectric layer 85 formed in a sheet shape has a square shape in plan view, and in the variable capacitor element body 122, each dielectric layer 85 is laminated so that the side on which the internal electrode is formed faces the upper surface. .

  As shown in FIGS. 46A and 46B, the first internal electrode 123 includes an electrode body 130 and a connection electrode 131. The electrode body 130 has a circular planar shape and is smaller than the area of the dielectric layer 85 formed in a sheet shape, that is, the area of the xy plane of the variable capacitor element body 122 and is exposed to the side surface of the variable capacitor element body 122. It is formed so as not to. The electrode body 130 is formed such that the center of gravity thereof coincides with the center of the dielectric layer 85.

  Three connection electrodes 131 are connected to the electrode main body 130 and are formed at equal intervals in the circumferential direction of the electrode main body 130. Each connection electrode 131 is formed in a strip shape having a width smaller than the diameter of the electrode body 130 formed in a circular shape. That is, the first internal electrode 123 in the present embodiment example has the same configuration as that of the internal electrode 67 according to the sixth embodiment shown in FIG.

  The three connection electrodes 131 constituting the first internal electrode 123 are exposed on the side surfaces of the variable capacitance element body 122, and are connected to different first external terminals 129a to 129c, respectively.

  As shown in FIGS. 47A and 48B, the second internal electrode 124 includes an electrode body 132 and a connection electrode 133. The electrode main body 132 has the same size and the same shape as the electrode main body 130 constituting the first internal electrode 123, and is formed so that the center of gravity coincides with the center of the dielectric layer 85.

  The connection electrode 133 is connected to the electrode body 132 and arranged on a straight line passing through the center of gravity (center) of the electrode body 132. The connection electrode 133 is formed so as to be exposed at a position off the center of the side surface constituted by the xz plane of the variable capacitance element body 122. Further, the connection electrode 133 is formed in a strip shape having a width smaller than the diameter of the electrode body 132 formed in a circular shape. That is, the second internal electrode 124 in the present embodiment example has the same configuration as the internal electrode 20 according to the modified example 2-2 shown in FIG. The connection electrode 133 constituting the second internal electrode 124 is exposed on one side surface constituted by the xz plane of the variable capacitance element body 122, and the end thereof is electrically connected to the fourth external terminal 129d. Yes.

  As shown in FIGS. 48A and 48B, the fourth internal electrode 126 includes an electrode body 134 and a connection electrode 135. The electrode main body 134 has the same size and the same shape as the electrode main body 130 constituting the first internal electrode 123, and is formed so that the center of gravity coincides with the center of the dielectric layer 85.

  The connection electrode 135 is connected to the electrode body 134 and is disposed on a straight line passing through the center of gravity (center) of the electrode body 134. The connection electrode 135 is formed so as to be exposed at a position off the center of the side surface constituted by the xz plane of the variable capacitance element body 122. The connection electrode 135 is formed in a strip shape having a width smaller than the diameter of the electrode body 134 formed in a circular shape. That is, the fourth internal electrode 126 in the present embodiment is configured similarly to the internal electrode 20 according to the modified example 2-2 shown in FIG.

  Further, in the present embodiment example, the connection electrode 135 of the fourth internal electrode 126 is formed so as to be symmetrical with the connection electrode 133 of the second internal electrode 124 with respect to the y-direction axis passing through the center of gravity of the electrode body 134. Has been. The connection electrode 135 constituting the fourth internal electrode 126 is exposed on one side surface constituted by the xz plane of the variable capacitance element body 122, and its end is electrically connected to the sixth external terminal 129f. Yes.

  The third internal electrode 125 is configured such that the second internal electrode 124 shown in FIG. 46A is rotated 180 degrees around the axis in the z direction passing through the center of gravity of the electrode body 132, and the same electrode as the second internal electrode 124 The main body 132 and the connection electrode 133 are included. Therefore, the connection electrode 133 of the third internal electrode 125 is formed at a position diagonal to the connection electrode 133 of the second internal electrode 124 when viewed in the xy plane. The connection electrode 133 of the third internal electrode 125 exposed on the side surface of the variable capacitance element body 122 is electrically connected to the fifth external terminal 129e.

  The fifth internal electrode 127 is configured such that the fourth internal electrode 126 shown in FIG. 47A is rotated 180 degrees around the axis in the z direction passing through the center of gravity of the electrode body 134, and the same electrode as the fourth internal electrode 126 A main body 134 and a connection electrode 135 are included. Therefore, the connection electrode 135 of the fifth internal electrode 127 is formed at a position diagonal to the connection electrode 135 of the fourth internal electrode 126 when viewed in the xy plane. The connection electrode 135 of the fifth internal electrode 127 exposed on the side surface of the variable capacitance element body 122 is electrically connected to the seventh external terminal 129g.

The sixth internal electrode 128 is configured such that the first internal electrode 123 shown in FIG. 46A is rotated 180 degrees around the axis in the z direction passing through the center of gravity of the electrode body 130, and the same electrode as the first internal electrode 123 It consists of a main body 130 and connection electrodes 131. Accordingly, the three connection electrodes 131 of the sixth internal electrode 128 are formed at positions facing the three connection electrodes 131 of the first internal electrode 123 when viewed in the xy plane. The three connection electrodes 131 of the sixth internal electrode 128 exposed on the side surface of the variable capacitance element body 122 are electrically connected to the eighth external terminal 129h to the tenth external terminal 129j, respectively.
The first internal electrode 123 to the sixth internal electrode 128 of the present embodiment example can be formed using the same material as in the first embodiment.

  The variable capacitance element 121 of the present embodiment example can also be formed by the same manufacturing process as that of the first embodiment. That is, the variable capacitance element body is formed by laminating and firing the dielectric sheets on which the internal electrodes are formed so that the electrode formation surface is the upper surface, and the external terminals are formed at desired positions on the side surfaces. Thus, the variable capacitance element of the present embodiment example is manufactured. In the variable capacitor 121 according to this embodiment, the first internal electrode 123 and the sixth internal electrode 128, the second internal electrode 124 and the third internal electrode 125, and the fourth internal electrode 126 and the fifth internal electrode 127 are included. Since they have the same shape, they can be formed with the same mask.

  FIG. 49 is a configuration diagram when the first internal electrode 123 to the sixth internal electrode 128 of the variable capacitance element 121 of the present embodiment example are seen through from the upper surface. As shown in FIG. 49, in this embodiment, all the connection electrodes in the first internal electrode 123 to the sixth internal electrode 128 are arranged so as not to overlap in the stacking direction. For this reason, no capacitance is formed between the stacked connection electrodes.

  Next, an example of a voltage control circuit using the variable capacitance element 121 of this embodiment will be described. FIG. 50 shows a circuit configuration of the voltage control circuit 207. In FIG. 50, parts corresponding to those in FIG.

  In the present embodiment example, the stacked first internal electrode 123 to sixth internal electrode 128 are connected to different external terminals (first external terminal 129a to 10th external terminal 129j), respectively. Accordingly, the first capacitor C <b> 1 is formed between the first internal electrode 123 and the second internal electrode 124. In addition, a second capacitor C <b> 2 is formed between the second internal electrode 124 and the third internal electrode 125. A third capacitor C3 is formed between the third internal electrode 125 and the fourth internal electrode 126. A fourth capacitor C4 is formed between the fourth internal electrode 126 and the fifth internal electrode 127. A fifth capacitor C5 is formed between the fifth internal electrode 127 and the sixth internal electrode 128. The variable capacitance element 121 of the present embodiment is a circuit in which the first capacitor C1 to the fifth capacitor C5 are connected in series in this order.

  In this embodiment, the second capacitor C2, the third capacitor C3, and the fourth capacitor C4 are used as variable capacitors, and the first capacitor C1 and the fifth capacitor C5 are used as DC removal capacitors. Therefore, the first external terminal 129 a to the third external terminal 129 c connected to the first internal electrode 123 are connected to one output terminal of the AC power supply 201. On the other hand, the eighth external terminal 129h to the tenth external terminal 129j connected to the sixth internal electrode 128 are connected to the other output terminal of the AC power supply 201.

  In addition, the fourth external terminal 129d and the sixth external terminal 129f are connected to the negative terminal of the control power source 202 via the DC removal resistors 203 and 205, respectively. Further, the fifth external terminal 129e and the seventh external terminal 129g are connected to the positive terminal of the control power source 202 via the DC removal resistors 204 and 206, respectively. That is, in the variable capacitance element 121 of the present embodiment example, the control power source 202 is connected in parallel to the second capacitor C2, the third capacitor C3, and the fourth capacitor C4. The capacities of the second capacitor C2, the third capacitor C3, and the fourth capacitor C4 are adjusted by a DC signal (control signal) input from the control power source 202.

In the present embodiment example, the first internal electrode 123 and the sixth internal electrode 128 are each supplied with an AC power signal from three connection electrodes. Therefore, the withstand voltage against the signal input from the AC power supply is improved.
In addition, the same effects as those of the seventh embodiment can be obtained. Also in the variable capacitance element of the present embodiment example, the stress control unit can be provided in the same manner as in the modification example 7-2 according to the seventh embodiment.

[Modification 8-1]
Next, a variable capacitor according to Modification 8-1 will be described. The variable capacitance element of Modification 8-1 has the same external configuration, cross-sectional configuration, and circuit configuration as those in FIGS. 44A, 44B, and 50 shown in the eighth embodiment, and is not shown. The duplicated explanation is omitted.

  FIG. 51 is an exploded view of the variable capacitance element body 140 of the variable capacitance element according to Modification 8-1 when viewed from one side surface in the long side direction. Modification 8-1 is an example in which the fourth internal electrode 126 and the fifth internal electrode 127 are formed using a mask used when the second internal electrode 124 and the third internal electrode 125 are manufactured. In FIG. 51, parts corresponding to those in FIG.

  In the modified example 8-1, the fourth internal electrode 126 is configured by rotating the second internal electrode 124 shown in FIG. 47A by 180 degrees about the axis in the y direction passing through the center of gravity of the electrode body 132. That is, the fourth internal electrode 126 has a configuration in which the second internal electrode 124 shown in FIG. 47A is turned upside down around the y-direction axis. Accordingly, the connection electrode 133 of the fourth internal electrode 126 is disposed apart from the connection electrode 133 of the second internal electrode 124 when viewed from the xy plane. As in the eighth embodiment, the sixth external terminal 129 f is connected to the connection electrode 133 of the fourth internal electrode 126.

  The fifth internal electrode 127 rotates the second internal electrode 124 shown in FIG. 47A by 180 degrees around the axis in the y direction passing through the center of gravity of the electrode body 132 and the axis in the z direction passing through the center of gravity of the electrode body 132. It is set as the structure rotated 180 degree | times centering on this. That is, the fifth internal electrode 127 has a configuration in which the third internal electrode 125 in the eighth embodiment is turned upside down with respect to the axis in the y direction. As in the eighth embodiment, the seventh external terminal 129g is connected to the connection electrode 133 of the fifth internal electrode 127.

  In the modified example 8-1, the second internal electrode 124 to the fifth internal electrode 127 are formed with the same mask, and the sheet-like dielectric layer on which each internal electrode is formed is stacked while being rotated and / or turned over. Thus, the variable capacitance element 121 similar to that shown in FIG. 44B can be formed. Specifically, as shown in FIG. 51, the first internal electrode 123 to the third internal electrode 125 are laminated so that the electrode surfaces face the upper surface, and the fourth internal electrode 126 to the sixth internal electrode 128 are Lamination is performed so that the electrode surface faces the lower surface. Further, by sandwiching the dielectric layer 85 in which no electrode is formed between the dielectric layer 85 in which the third internal electrode 125 is formed and the dielectric layer 85 in which the fourth internal electrode 126 is formed, A dielectric layer 85 is formed between the third internal electrode 125 and the fourth internal electrode 126.

Thus, in the modified example 8-1, since the second internal electrode 124 to the fifth internal electrode 127 can be formed with the same mask, the cost can be reduced. In addition, the same effects as those of the eighth embodiment are obtained.
Also, the variable capacitance element of Modification 8-1 can be an example in which a stress control unit is provided in the seventh embodiment like the variable capacitance element according to Modification 7-2.

<9. Ninth Embodiment>
FIG. 52A is a schematic perspective view of a variable capacitance element 141 according to the ninth embodiment of the present disclosure, and FIG. 52B is a cross-sectional configuration diagram of the variable capacitance element 141. The variable capacitance element 141 according to the present embodiment is an example different from the variable capacitance element 121 according to the seventh embodiment only in the configuration of the first internal electrode 144 and the sixth internal electrode 149. 52A and 52B, parts corresponding to those in FIGS. 36A and 36B are denoted by the same reference numerals, and redundant description is omitted.

  As shown in FIG. 52A, the variable capacitance element 141 according to the present embodiment includes a variable capacitance element main body 142 composed of a rectangular parallelepiped member whose xy plane is a square and eight external terminals (hereinafter referred to as first external terminals respectively). 143a to eighth external terminal 143h).

The first external terminal 143 a to the eighth external terminal 143 h are disposed on the four side surfaces of the variable capacitance element body 142 so as to be separated from each other. The first external terminal 143a and the second external terminal 143b are the third external terminal 143c and the sixth external terminal 143f, the fourth external terminal 143d and the fifth external terminal 143e, and the seventh external terminal 143g and the eighth external terminal 143h. Are arranged at positions facing each other when viewed in the xy plane.
The first external terminal 143a to the eighth external terminal 143h are formed so as to cover the side surface of the variable capacitor element body 142 in the z direction and to protrude from the upper surface and the lower surface of the variable capacitor element body 142, respectively.

  As shown in FIG. 52B, the variable capacitance element body 142 includes a dielectric layer 85 and six internal electrodes stacked via the dielectric layer 85. In the following description, for the sake of convenience, the six internal electrodes will be described as first internal electrode 144 to sixth internal electrode 149, respectively. The variable capacitance element main body 142 of the present embodiment is configured such that the first internal electrode 144 to the sixth internal electrode 149 are stacked in this order from the lower surface to the upper surface.

  FIG. 53 is an exploded view of the variable capacitor element body 142 when viewed from one side surface in the long side direction. 54A is a plan configuration diagram when the first internal electrode 144 is viewed from the top surface, and FIG. 53B is a configuration diagram when the first internal electrode 144 is viewed from one side surface.

  As shown in FIGS. 54A and 54B, the first internal electrode 144 includes an electrode body 150, two connection electrodes 151, and a dummy electrode 152. The electrode body 150 has a circular planar shape and is smaller than the area of the dielectric layer 85 formed in a sheet shape, that is, the area of the xy plane of the variable capacitor element body 142 and is exposed to the side surface of the variable capacitor element body 142. It is formed so as not to. The electrode body 150 is formed so that its center of gravity coincides with the center of the dielectric layer 85.

  The connection electrode 151 and the dummy electrode 152 are formed at substantially equal intervals in the circumferential direction of the electrode body 150. Further, the two connection electrodes 151 are formed so as to be exposed on the opposite side surfaces of the variable capacitance element body 142. The dummy electrode 152 is formed toward the side surface of the variable capacitance element main body 142 and is formed so as not to be exposed on the side surface. The connection electrode 151 and the dummy electrode 152 are formed so as to become wider from the electrode body 150 side toward the side surface side of the variable capacitance element body 142. One of the two connection electrodes 151 constituting the first internal electrode 144 is connected to the first external terminal 143a, and the other is connected to the second external terminal 143b.

  The sixth internal electrode 149 is configured by rotating the first internal electrode 144 shown in FIG. 54A through the center of gravity of the electrode body 150 and rotating 180 degrees about the axis in the z direction, and is similar to the first internal electrode 144. The electrode body 150, the connection electrode 151, and the dummy electrode 152 are configured. The two connection electrodes 151 of the sixth internal electrode 149 exposed on the side surface of the variable capacitance element body 142 are electrically connected to the seventh external terminal 143g and the eighth external terminal h, respectively.

  In the present embodiment, the second internal electrode 145 to the fifth internal electrode 148 have the same configuration as the second internal electrode 124 to the fifth internal electrode 127 in the seventh embodiment. That is, the second internal electrode 145 and the third internal electrode 146 include the electrode body 132 and the connection electrode 133 in the same manner as the second internal electrode 124 and the third internal electrode 125 shown in FIGS. 47A and 47B. Further, the fourth internal electrode 147 and the fifth internal electrode 148 include the electrode body 134 and the connection electrode 135 shown in FIGS. 48A and 48B. The second internal electrode 145 to the fifth internal electrode 148 are connected to the third external terminal 143c to the sixth external terminal 143f, respectively.

  The variable capacitance element 141 of the present embodiment example can also be formed by the same manufacturing process as that of the first embodiment. That is, the variable capacitance element main body 142 is formed by laminating and firing the dielectric sheet on which each internal electrode is formed so that the electrode formation surface becomes the upper surface, and the external terminal is formed at a desired position on the side surface. As a result, the variable capacitance element 141 according to this embodiment is manufactured. In the variable capacitance element 141 according to this embodiment, the first internal electrode 144 and the sixth internal electrode 149, the second internal electrode 145 and the third internal electrode 146, the fourth internal electrode 147 and the fifth internal electrode 148 are provided. Since they have the same shape, they can be formed with the same mask.

  FIG. 55 is a configuration diagram when the first internal electrode 144 to the sixth internal electrode 149 of the variable capacitance element 141 of the present embodiment example are seen through from the upper surface. As shown in FIG. 55, in this embodiment, all the connection electrodes in the first internal electrode 144 to the sixth internal electrode 149 are arranged so as not to overlap in the stacking direction. For this reason, no capacitance is formed between the stacked connection electrodes.

  Next, an example of a voltage control circuit using the variable capacitance element 141 of this embodiment will be described. FIG. 56 shows a circuit configuration of the voltage control circuit 208. In FIG. 56, portions corresponding to those in FIG.

  In the present embodiment example, the stacked first internal electrode 144 to sixth internal electrode 149 are connected to different external terminals (first external terminal 143a to eighth external terminal 143h), respectively. Accordingly, the first capacitor C1 is formed between the first internal electrode 144 and the second internal electrode 145. A second capacitor C2 is formed between the second internal electrode 145 and the third internal electrode 146. A third capacitor C3 is formed between the third internal electrode 146 and the fourth internal electrode 147. A fourth capacitor C4 is formed between the fourth internal electrode 147 and the fifth internal electrode 148. A fifth capacitor C5 is formed between the fifth internal electrode 148 and the sixth internal electrode 149. The variable capacitance element 141 according to the present embodiment is a circuit in which the first capacitor C1 to the fifth capacitor C5 are connected in series in this order.

  In this embodiment, the second capacitor C2, the third capacitor C3, and the fourth capacitor C4 are used as variable capacitors, and the first capacitor C1 and the fifth capacitor C5 are used as DC removal capacitors. Therefore, the first external terminal 143 a and the second external terminal 143 b connected to the first internal electrode 144 are connected to one output terminal of the AC power supply 201. On the other hand, the seventh external terminal 143g and the eighth external terminal 143h connected to the sixth internal electrode 149 are connected to the other output terminal of the AC power supply 201.

  In addition, the third external terminal 143c and the fifth external terminal 143e are connected to the negative terminal of the control power source 202 via the DC removal resistors 203 and 205, respectively. Further, the fourth external terminal 143d and the sixth external terminal 143f are connected to the positive terminal of the control power source 202 via the DC removal resistors 204 and 206, respectively. That is, in the variable capacitance element 141 according to the present embodiment, the control power source 202 is connected in parallel to the second capacitor C2, the third capacitor C3, and the fourth capacitor C4. The capacities of the second capacitor C2, the third capacitor C3, and the fourth capacitor C4 are adjusted by a DC signal (control signal) input from the control power source 202.

  In the present embodiment, the first internal electrode 144 and the sixth internal electrode 149 are supplied with signals of AC power from two connection electrodes. Therefore, the withstand voltage against the signal input from the AC power supply is improved. In the present embodiment, the side of the first internal electrode 144 and the sixth internal electrode 149 connected to the external terminal of the connection electrode 151 is wide. Therefore, the withstand voltage can be further improved in the variable capacitor 141. Further, by forming the dummy electrode 152 in the first internal electrode 144 and the sixth internal electrode 149, the symmetry of the internal electrode can be improved and the residual stress can be improved.

In the present embodiment example, the dummy electrode 152 is provided. However, similarly to the sixth embodiment, three connection electrodes are provided so as to be exposed on the side surface of the variable capacitance element main body 142 and connected to an external terminal. Good. In this case, since the number of external electrodes connected to the AC power supply increases, the breakdown voltage can be further improved.
In addition, the variable capacitance element 141 according to the present embodiment may be configured to include a stress control unit in the same manner as the modification example 7-2.

[Modification 9-1]
Next, a variable capacitor according to Modification 9-1 will be described. The variable capacitance element of Modification 9-1 has the same external configuration, sectional configuration, and circuit configuration as those in FIGS. 52A, 52B, and 56 shown in the ninth embodiment. Description is omitted.

  FIG. 57 is an exploded view of the variable capacitor element body 153 of the variable capacitor according to Modification 9-1 when viewed from one side surface in the long side direction. The modification example 9-1 is an example in which the fourth internal electrode 147 and the fifth internal electrode 148 are formed using a mask used when the second internal electrode 145 and the third internal electrode 146 are manufactured. In FIG. 57, parts corresponding to those in FIG.

  In the modified example 9-1, the fourth internal electrode 147 has a configuration in which the second internal electrode 145 is rotated by 180 degrees around the axis in the y direction passing through the center of gravity of the electrode main body 132. That is, the second internal electrode 145 is turned upside down around the y-direction axis. Therefore, the connection electrode 133 of the fourth internal electrode 147 is disposed on the same side as the connection electrode 133 of the second internal electrode 145 when viewed in the xy plane, and is disposed apart from each other. As in the ninth embodiment, the fifth external terminal 143e is connected to the connection electrode 133 of the fourth internal electrode 147.

  The fifth internal electrode 148 rotates the second internal electrode 145 by 180 degrees around the y-direction axis passing through the center of gravity of the electrode body 132 and 180 degrees around the z-direction axis passing through the center of gravity of the electrode body 132. The configuration is rotated. In other words, the fifth internal electrode 148 has a configuration in which the third internal electrode 146 in the eighth embodiment is turned upside down around the axis in the y direction. As in the eighth embodiment, the sixth external terminal 143f is connected to the connection electrode 133 of the fifth internal electrode 148.

  In the modified example 9-1, the second internal electrode 145 to the fifth internal electrode 148 are formed with the same mask, and the sheet-like dielectric layer 85 on which each internal electrode is formed is stacked while being rotated and / or turned over. Thus, the variable capacitor element body 153 similar to that shown in FIG. 52B can be formed. Specifically, as shown in FIG. 57, the first internal electrode 144 to the third internal electrode 146 are laminated so that their electrode surfaces face the upper surface, and the fourth internal electrode 147 to the sixth internal electrode 149, Laminate so that the electrode surface faces the lower surface. Further, by sandwiching the dielectric layer 85 in which no electrode is formed between the dielectric layer 85 in which the third internal electrode 146 is formed and the dielectric layer 85 in which the fourth internal electrode 147 is formed, A dielectric layer 85 is formed between the third internal electrode 146 and the fourth internal electrode 147.

Thus, in the modified example 9-1, since the second internal electrode 145 to the fifth internal electrode 148 can be formed with the same mask, the cost can be reduced. In addition, the same effects as those of the eighth embodiment are obtained.
Also, the variable capacitance element according to Modification 9-1 may have a configuration in which a stress control unit is provided in the same manner as Modification 7-2.

  In the first to ninth embodiments, the width of the end connected to the external terminal of the connection electrode is formed smaller than the width of the electrode body in each of the internal electrodes, but can be changed as appropriate. For example, for an electrode to which only a DC voltage is applied, the electrical resistance of the connection electrode may be high, so the width of the connection electrode relative to the electrode body may be formed small. From the viewpoint of resistance, it is preferable to form the connection electrode with a large width. In addition, when the residual stress is dominated by the stress control unit or the electrodes stacked in multiple layers, the width of the connection electrode of the outermost electrode may be increased. Further, as a method of reducing the electrode resistance of the connection electrode, in addition to increasing the electrode width, there are methods such as shortening the length or increasing the thickness. Can be taken.

  In the first to ninth embodiments described above, the variable capacitance element whose capacitance changes according to the voltage applied as the capacitance element has been described as an example. However, the present disclosure is not limited to this. The configurations described in the first to ninth embodiments can be similarly applied to a capacitive element whose capacitance hardly changes regardless of the type of input signal and its signal level (hereinafter referred to as a constant capacitive element). is there.

However, in this case, the dielectric layer is formed of a paraelectric material having a low relative dielectric constant. The paraelectric material may be used, for example, paper, polyethylene terephthalate, polypropylene, polyphenylene sulfide, _{polystyrene, TiO 2, MgTiO 2, MgTiO 3} , SrMgTiO 2, Ai 2 O 3, Ta 2 O 5 or the like. Such a constant capacitance element can also be manufactured in the same manner as the variable capacitance element of the first embodiment.

  Note that the capacitance C (F) of the capacitive element suitable for the present disclosure also depends on the frequency f (Hz) to be used. The present disclosure is suitable for a capacitor element having a capacitance C (F) in which impedance Z (ohm) (Z = 1 / 2πfc) is 2 ohms or more, preferably 15 ohms or more, and more preferably 100 ohms or more.

<10. Tenth Embodiment: Resonant Circuit>
Next, a resonant circuit according to a tenth embodiment of the present invention will be described. The present embodiment is an example in which the capacitive element of the present invention is applied to a resonant circuit, and particularly shows an example in which the variable capacitive element 1 in the first embodiment is applied. In this embodiment, an example in which a resonance circuit is used for a non-contact IC card is shown.

  FIG. 58 is a block diagram of the receiving system circuit section of the non-contact IC card 530 using the resonance circuit of the present embodiment. In the present embodiment, a signal transmission system (modulation system) circuit unit is omitted in order to simplify the description. The configuration of the transmission system circuit unit is the same as that of a conventional non-contact IC card or the like.

  As shown in FIG. 58, the non-contact IC card includes a receiving unit 531 (antenna), a rectifying unit 532, and a signal processing unit 533.

  The receiving unit 531 includes a resonance circuit including a resonance coil 534 and a resonance capacitor 535, and receives a signal transmitted from the R / W (not shown) of the non-contact IC card 530 by the resonance circuit. In FIG. 58, the resonance coil 534 is divided into an inductance component 534a (L) and a resistance component 534b (r: about several ohms).

  The resonance capacitor 535 is connected in parallel with a capacitor 535a having a capacitance Co and a variable capacitance element 1 whose capacitance Cv changes according to the voltage value (reception voltage value) of the received signal. That is, in the present embodiment, the variable capacitance element 1 is connected in parallel to a conventional antenna (a resonance circuit including a resonance coil 534 and a capacitor 535a).

  As the capacitor 535a, a capacitor formed of a paraelectric material is used as in the conventional antenna. Capacitor 535a formed of a paraelectric material has a low relative dielectric constant, and its capacitance hardly changes regardless of the type of input voltage (AC or DC) and its voltage value. Therefore, the capacitor 535a has a very stable characteristic with respect to the input signal. In the conventional antenna, in order to prevent the resonance frequency of the antenna from shifting, a capacitor formed of a paraelectric material having high stability with respect to such an input signal is used.

  Note that, on an actual circuit, there is capacitance variation (about several pF) of the receiving unit 531 due to variations in the inductance component L of the resonance coil 534 and parasitic capacitance of the input terminal of the integrated circuit in the signal processing unit 533. The amount of change differs for each non-contact IC card 530. Therefore, in the present embodiment, in order to suppress (correct) these effects, the capacitance Co is appropriately adjusted by trimming the electrode pattern of the capacitor 535a.

  The rectification unit 532 is configured by a half-wave rectification circuit including a rectification diode 536 and a rectification capacitor 537, and rectifies and outputs the AC voltage received by the reception unit 531 to a DC voltage.

  The signal processing unit 533 is mainly configured by a semiconductor element integrated circuit (LSI: Large Scale Integration), and demodulates the AC signal received by the receiving unit 531. The LSI in the signal processing unit 533 is driven by a DC voltage supplied from the rectifying unit 532. Note that the same LSI as a conventional non-contact IC card can be used.

  In the present embodiment, the variable capacitance element 1 used in the receiving unit has a larger residual stress because the center (center of gravity) of the stacked internal electrodes is arranged on a straight line in the stacking direction. Thereby, electrical characteristics are improved, and a large variable width can be obtained at a lower voltage. Further, since the burden of change on the resonance capacitor can be reduced by the increase in the variable width, the dielectric strength of the resonance capacitor is increased, so that the withstand voltage is improved and a larger AC voltage can be handled.

  In the present embodiment example, the variable capacitor element 1 of the first embodiment is used as the variable capacitor element of the resonance circuit, but the variable capacitor elements of the second to ninth embodiments may be used.

  Moreover, this indication can take the following structures.

(1)
A dielectric layer;
A capacitive element body comprising at least a pair of internal electrodes formed across the dielectric layer;
An external terminal formed on a side surface of the capacitive element body and electrically connected to the internal electrode;
Stress generated due to a difference in coefficient of linear expansion between the dielectric layer and the internal electrode is concentrated at the center of the capacitor formed by the dielectric layer and a pair of internal electrodes sandwiching the dielectric layer. Capacitance element configured to.

(2)
The internal electrode is composed of an electrode main body constituting a capacitor, and a connection electrode connected to the electrode main body and connected to the external terminal,
The electrostatic capacitance element according to (1), wherein a planar shape of an electrode main body of at least one internal electrode constituting the capacitor is a circular shape.

(3)
The capacitance element according to (1) or (2), wherein a width of an end portion of the connection electrode connected to the external terminal is equal to or less than a quarter of a diameter of the electrode body.

(4)
The capacitive element according to any one of (1) to (3), wherein a shape of a surface parallel to a surface on which the internal electrode of the capacitive element body is formed is a circular shape.

(5)
The electrostatic capacitance element according to any one of (1) to (4), wherein an outer shape of the capacitive element body is a cylindrical shape.

(6)
The internal electrode is composed of an electrode main body constituting a capacitor, and a connection electrode connected to the electrode main body and connected to an external terminal,
The capacitive element according to any one of (1) to (5), wherein a planar shape of an electrode body of at least one internal electrode constituting the capacitor is an elliptical shape.

(7)
The internal electrode is composed of an electrode main body constituting a capacitor, and a connection electrode connected to the electrode main body and connected to an external terminal,
The capacitance element according to any one of (1) to (5), wherein a planar shape of an electrode main body of at least one internal electrode constituting the capacitor is a regular polygon shape of a pentagon or more.

(8)
The internal electrode is composed of an electrode main body constituting a capacitor, a connection electrode connected to the electrode main body and connected to an external terminal, and a floating electrode not connected to the electrode main body and the external terminal. The electrostatic capacitance element in any one of 1)-(7).

(9)
The internal electrode comprises an electrode main body constituting a capacitor and a plurality of connection electrodes connected to the electrode main body and connected to the external terminal. (1) to (7) Capacitance element.

(10)
The capacitance element according to (9), wherein the electrode body is formed in a circular shape, and the plurality of connection electrodes are formed at equal intervals in a circumferential direction of the electrode body.

(11)
The external shape of the said capacitive element main body is made into the column shape. The electrostatic capacitance element in any one of (1)-(3).

(12)
The external shape of the said capacitive element main body is made into columnar shape with a square-shaped cross section. The electrostatic capacitance element in any one of (1)-(3).

(13)
The electrostatic capacitance element according to any one of (1) to (3), wherein an outer shape of the capacitive element body is a columnar shape having an elliptical cross section.

(14)
The external shape of the said capacitive element main body is made into the column shape of a cross-sectional polygonal shape. The electrostatic capacitance element in any one of (1)-(3).

(15)
The external shape of the said capacitive element main body is made into the column shape of a cross-sectional regular polygon shape. The electrostatic capacitance element in any one of (1)-(3).

(16)
The capacitance element according to any one of (1) to (15), wherein a planar shape of the capacitor element body on which the internal electrode is formed and an electrode body shape of the internal electrode are the same.

(17)
The capacitance element according to (1), wherein the planar shape of the capacitive element body on which the internal electrode is formed and the shape of the electrode body of the internal electrode are circular.

(18)
The internal electrode is stacked in a plurality of layers via a dielectric layer, and a plurality of capacitors formed by the plurality of internal electrodes are connected in series in the stacking direction of the internal electrodes (1) to (17) The electrostatic capacitance element of description.

(19)
Each of the stacked internal electrodes includes an electrode body constituting a capacitor, and a plurality of connection electrodes connected to the electrode body and connected to the external terminal,
The capacitive element according to (18), wherein the electrode body of each internal electrode has the same shape, and the center of gravity of the electrode body of each internal electrode is arranged on a straight line in the stacking direction.

(20)
A dielectric layer;
A capacitive element body comprising at least a pair of internal electrodes formed across the dielectric layer;
An external terminal formed on a side surface of the capacitive element body and electrically connected to the internal electrode;
Stress generated due to a difference in coefficient of linear expansion between the dielectric layer and the internal electrode is concentrated at the center of the capacitor formed by the dielectric layer and a pair of internal electrodes sandwiching the dielectric layer. A resonant capacitor including a capacitive element configured in
A resonance circuit comprising: a resonance coil connected to the resonance capacitor.

  1, 40, 44, 61... Variable capacitance element, 2, 42, 45, 62... Variable capacitance element body, 3, 4, 42, 46... External terminal, 5, 52, 53, 55, 56, 57, 58, 59, 64, 68, 71, 85 ... dielectric layer, 6, 86 ... lower dielectric layer, 7, 87 ... upper dielectric layer, 8, 11, 13, 15, 17, 21, 25, 29 ... electrode body, 9, 19, 23, 26, 30, 33, 36, 50, 66 ... connection electrodes, 10, 12, 14, 16, 18, 20, 22, 24, 28, 32, 38, 51, 67, 70 ... internal electrodes, 27, 31 ... floating electrodes, 200, 207, 208 ... voltage control circuits, 201 ... AC power supply, 202 ... Control power supply, 203,204 ... DC removal resistor, 530 ... Non-contact IC car 531: Reception unit, 532 ... Rectification unit, 533 ... Signal processing unit, 534 ... Resonance coil, 534a ... Inductance component, 534b ... Resistance component, 535 ... Resonance capacitor 535a ... capacitor, 536 ... rectifier diode, 537 ... rectifier capacitor

Claims (20)

A dielectric layer;
A capacitive element body comprising at least a pair of internal electrodes formed across the dielectric layer;
An external terminal formed on a side surface of the capacitive element body and electrically connected to the internal electrode;
Stress generated due to a difference in coefficient of linear expansion between the dielectric layer and the internal electrode is concentrated at the center of the capacitor formed by the dielectric layer and a pair of internal electrodes sandwiching the dielectric layer. Capacitance element configured to. The internal electrode is composed of an electrode main body constituting a capacitor, and a connection electrode connected to the electrode main body and connected to the external terminal,
The capacitive element according to claim 1, wherein a planar shape of an electrode body of at least one internal electrode constituting the capacitor is a circular shape. The capacitance element according to claim 2, wherein a width of an end portion of the connection electrode connected to the external terminal is equal to or less than a quarter of a diameter of the electrode body. The capacitive element according to claim 3, wherein a shape of a surface parallel to a surface on which the internal electrode of the capacitive element body is formed is a circular shape. The capacitive element according to claim 4, wherein an outer shape of the capacitive element body is a cylindrical shape. The internal electrode is composed of an electrode main body constituting a capacitor, and a connection electrode connected to the electrode main body and connected to an external terminal,
The capacitive element according to claim 1, wherein a planar shape of an electrode body of at least one internal electrode constituting the capacitor is an ellipse. The internal electrode is composed of an electrode main body constituting a capacitor, and a connection electrode connected to the electrode main body and connected to an external terminal,
The electrostatic capacitance element according to claim 1, wherein a planar shape of an electrode main body of at least one internal electrode constituting the capacitor is a pentagonal or more regular polygon. The internal electrode includes an electrode main body constituting a capacitor, a connection electrode connected to the electrode main body and connected to an external terminal, and a floating electrode not connected to the electrode main body and the external terminal. Item 14. The capacitance element according to Item 1. The electrostatic capacitance element according to claim 1, wherein the internal electrode includes an electrode main body constituting a capacitor and a plurality of connection electrodes connected to the electrode main body and connected to the external terminal. The capacitive element according to claim 9, wherein the electrode body is formed in a circular shape, and the plurality of connection electrodes are formed at equal intervals in a circumferential direction of the electrode body. The capacitive element according to claim 1, wherein an outer shape of the capacitive element body is a cylindrical shape. The capacitive element according to claim 1, wherein an outer shape of the capacitive element body is a column having a square cross section. The capacitive element according to claim 1, wherein an outer shape of the capacitive element body is a column having an elliptical cross section. The capacitive element according to claim 1, wherein an outer shape of the capacitive element body is a columnar shape having a polygonal cross section. The capacitive element according to claim 1, wherein an outer shape of the capacitive element body is a columnar shape having a regular polygonal cross section. The electrostatic capacitance element according to claim 1, wherein a planar shape in which the internal electrode of the capacitive element body is formed and an electrode body of the internal electrode are the same shape. The electrostatic capacitance element according to claim 1, wherein a planar shape in which the internal electrode of the capacitive element body is formed and a shape of the electrode body of the internal electrode are circular. The capacitive element according to claim 1, wherein the internal electrodes are stacked in a plurality of layers via a dielectric layer, and a plurality of capacitors formed by the plurality of internal electrodes are connected in series in the stacking direction of the internal electrodes. Each of the stacked internal electrodes includes an electrode body constituting a capacitor, and a plurality of connection electrodes connected to the electrode body and connected to the external terminal,
The capacitive element according to claim 18, wherein the electrode main body of each internal electrode has the same shape, and the center of gravity of the electrode main body of each internal electrode is arranged on a straight line in the stacking direction. A dielectric layer;
A capacitive element body comprising at least a pair of internal electrodes formed across the dielectric layer;
An external terminal formed on a side surface of the capacitive element body and electrically connected to the internal electrode;
Stress generated due to a difference in coefficient of linear expansion between the dielectric layer and the internal electrode is concentrated at the center of the capacitor formed by the dielectric layer and a pair of internal electrodes sandwiching the dielectric layer. A resonant capacitor including a capacitive element configured in
A resonance circuit comprising: a resonance coil connected to the resonance capacitor.

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