JP2013059940A - Liquid ejection head, image forming apparatus, and mounting structure of electric structure - Google Patents

Liquid ejection head, image forming apparatus, and mounting structure of electric structure Download PDF

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Publication number
JP2013059940A
JP2013059940A JP2011200567A JP2011200567A JP2013059940A JP 2013059940 A JP2013059940 A JP 2013059940A JP 2011200567 A JP2011200567 A JP 2011200567A JP 2011200567 A JP2011200567 A JP 2011200567A JP 2013059940 A JP2013059940 A JP 2013059940A
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piezoelectric
solder
chip size
size package
electrode
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JP2011200567A
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Japanese (ja)
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Takeshi Sano
武 佐野
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Ricoh Co Ltd
株式会社リコー
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Abstract

PROBLEM TO BE SOLVED: To solve the problem that productivity is deteriorated to secure electric connection reliability of a piezoelectric member and a wiring member.SOLUTION: An output terminal 162 of a CSP 16 and an individual external electrode 23 of a drive pillar 12A are joined to each other via a solder 41B made of a solder bump 164. An input terminal 161 of the CSP 16 and a wiring electrode of an FPC 15 are joined to each other via a solder 41A made of a solder bump 163. The solder 41B for joining the output terminal of the CSP 16 and the individual external electrode 23 of a piezoelectric member 12 is made to be thinner than the solder 41A for joining the input terminal of the CSP 16 and the wiring electrode 15A of the FPC 15.

Description

  The present invention relates to a liquid ejection head, an image forming apparatus, and an electrical structure mounting structure.
  As an image forming apparatus such as a printer, a facsimile, a copying machine, a plotter, or a complex machine of these, for example, a liquid discharge recording type image forming using a recording head composed of a liquid discharge head (droplet discharge head) that discharges ink droplets. As an apparatus, an ink jet recording apparatus or the like is known.
  As a liquid discharge head, for example, a groove is formed on a piezoelectric body as pressure generating means for generating pressure by applying ink, which is liquid in a liquid chamber, in particular, a laminated piezoelectric member in which piezoelectric layers and internal electrodes are alternately stacked. A piezoelectric actuator having a plurality of columnar piezoelectric elements (piezoelectric columns) applied thereto, and deforming an elastically deformable diaphragm member that forms a wall surface in the liquid chamber by displacement in the d33 or d31 direction of the laminated piezoelectric member; A so-called piezoelectric head that discharges droplets by changing the volume and pressure of a liquid chamber is known.
  In such a piezoelectric head, a common external electrode (also referred to as an end face electrode) serving as a common electrode in which an internal electrode of a piezoelectric column is drawn out to an end face and an individual external electrode serving as an individual electrode are respectively FPC (flexible substrate, flexible printed cable). Common wiring electrodes and individual wiring electrodes of a wiring member such as a flexible wiring board are joined, and a drive signal corresponding to an image signal is given to each piezoelectric column.
  However, the accumulated pitch variation of the terminals is caused by the expansion and contraction of the FPC, and there is a possibility that a joining shift occurs with respect to the individual pillars of the narrowed piezoelectric element, and a disconnection or a short circuit of the joining portion may occur.
  Therefore, conventionally, a three-dimensional wiring board in which external electrodes of piezoelectric elements formed on different surfaces as common electrodes and individual electrodes are formed on a molded resin and have a non-contact area with the resin extended from the end of the resin. A structure connected to an electrode portion located in the non-contact region is known (Patent Document 1).
JP 2010-000746 A
  However, in the configuration disclosed in Patent Document 1, when a plurality of piezoelectric columns are formed on a piezoelectric member by dicing, the piezoelectric member needs to be diced according to the wiring pattern. There is a risk that productivity is greatly reduced in order to ensure the alignment accuracy.
  The present invention has been made in view of the above points, and an object thereof is to ensure electrical connection reliability between a piezoelectric member and a wiring member without reducing productivity.
In order to solve the above-described problem, a liquid discharge head according to the present invention includes:
A flow path member that forms a plurality of individual liquid chambers through which a plurality of nozzles for discharging droplets respectively communicate,
A diaphragm member forming a partial wall surface of the individual liquid chamber;
A piezoelectric member for displacing the diaphragm member;
A chip size package on which a drive circuit for driving the piezoelectric member is mounted;
A wiring member connected to the drive circuit,
The output terminal of the chip size package and the electrode of the piezoelectric member are joined by solder, the input terminal of the chip size package and the wiring electrode of the wiring member are joined by solder,
The thickness of the solder that joins the chip size package, the input terminal, and the wiring electrode of the wiring member is thicker than the thickness of the solder that joins the output terminal of the chip size package and the electrode of the piezoelectric member. The configuration.
  According to the liquid ejection head according to the present invention, even if there is a step between the bonding surface of the piezoelectric member and the bonding surface of the wiring member, it is possible to ensure the electrical connection reliability between them.
FIG. 3 is an external perspective view illustrating an example of a liquid discharge head according to the present invention. FIG. 2 is an explanatory cross-sectional view along a direction (liquid chamber longitudinal direction: line AA in FIG. 1) orthogonal to the nozzle arrangement direction of the head. It is sectional explanatory drawing which follows the nozzle arrangement | sequence direction (liquid chamber short direction: BB line of FIG. 1) of the head. It is a principal part expansion explanatory drawing which uses for description of 1st Embodiment of this invention. It is explanatory drawing with which description of an example of CSP is provided. It is plane explanatory drawing of CSP with which it uses for description of 2nd Embodiment of this invention. It is front explanatory drawing of FIG. 6 of the state which similarly provided the solder bump. It is explanatory drawing with which it uses for description of the relationship between a piezoelectric member and FPC, and CSP. It is explanatory drawing of the relationship between the piezoelectric member in the same nozzle arrangement direction (piezoelectric column arrangement direction), and FPC and CSP. It is a principal part enlarged explanatory view with which it uses for description of 3rd Embodiment of this invention. FIG. 4 is a side explanatory view of a mechanism unit of an example of an image forming apparatus according to the present invention. It is principal part plane explanatory drawing of the mechanism part.
  Embodiments of the present invention will be described below with reference to the accompanying drawings. An example of a liquid discharge head according to the present invention will be described with reference to FIGS. 1 is an external perspective view of the head, FIG. 2 is a cross-sectional explanatory view along a direction perpendicular to the nozzle arrangement direction of the head (longitudinal direction of the liquid chamber: line AA in FIG. 1), and FIG. It is sectional explanatory drawing which follows the nozzle arrangement direction (liquid chamber short side direction: BB line of FIG. 1) of a head.
  The liquid discharge head includes a flow path plate (flow path member, flow path substrate, liquid chamber substrate) 1 formed of a SUS substrate or the like, and a vibration plate member 2 that forms a vibration plate bonded to the lower surface of the flow path plate 1. And a nozzle plate 3 joined to the upper surface of the flow path plate 1.
  By these members, a plurality of liquid chambers (also referred to as a pressurized liquid chamber, a pressure chamber, a pressurizing chamber, a flow path, etc.) 6 as individual flow paths each communicating with a plurality of nozzles 4 that discharge droplets. A fluid resistance portion 7 that also serves as a supply path for supplying ink to the liquid chamber 6 and a liquid introduction portion 8 that communicates with the liquid chamber 6 through the fluid resistance portion 7 are formed, and the diaphragm member 2 is formed on the liquid introduction portion 8. Ink is supplied from a common liquid chamber 10 formed in a frame member 17 to be described later through the formed supply port 9.
  The flow path plate 1 forms openings such as the pressurized liquid chamber 6 and the fluid resistance portion 7 by etching the SUS substrate using an acidic etchant or machining such as punching (press). . The flow path plate 1 can be formed by etching a single crystal silicon substrate, for example.
  The diaphragm member 2 is formed of the first layer 2A and the second layer 2B, the first layer 2A forms a thin portion, and the first layer 2A and the second layer 2B form a thick portion. . And this diaphragm member 2 has each vibration field (diaphragm part) 2a formed in the 1st layer 2A which forms the wall surface corresponding to each liquid room 6, and in this vibration field 2a, An island-shaped convex portion 2b formed by the thick portion of the first layer 2A and the second layer 2B is provided on the outer surface (the side opposite to the liquid chamber 6), and a portion corresponding to the liquid chamber interval wall 30 is provided. Similarly, a thick portion 2c is provided.
  A piezoelectric actuator 11 including an electromechanical transducer as a driving means (actuator means, pressure generating means) for deforming the vibration region 2a is arranged on the opposite side of the diaphragm member 2 from the liquid chamber 6.
  This piezoelectric actuator 11 has a plurality of (here, two) laminated piezoelectric members 12 bonded to an adhesive on a base member 13, and the piezoelectric member 12 is grooved by half-cut dicing to form one piezoelectric member. A required number of columnar piezoelectric elements (hereinafter referred to as “piezoelectric columns”) 12A and 12B with respect to 12 are formed in a comb shape at a predetermined interval.
  The piezoelectric columns 12A and 12B of the piezoelectric member 12 are the same, but the piezoelectric column that is driven by applying a driving waveform is the driving column 12A, and the piezoelectric column that is used as a mere support column without driving waveform is not driven. It is distinguished as a pillar 12B. That is, a so-called bi-pitch configuration is adopted.
  Then, the upper end surface (joint surface) of the drive column 12 </ b> A is joined and joined to the island-shaped convex portion 2 b of the diaphragm member 2. Further, the upper end surface of the non-driven column 12B is joined to the thick portion 2c of the diaphragm member 2 at a position corresponding to the liquid chamber interval wall 30.
  Here, the piezoelectric member 12 is obtained by alternately stacking the piezoelectric material layers 21 and the internal electrodes 22A and 22B. The internal electrodes 22A and 22B are respectively substantially perpendicular to the end face, that is, the diaphragm member 2 of the piezoelectric member 12. Pulled out to the side surface (surface along the stacking direction), connected to the individual external electrode 23 and the common external electrode 24, which are end surface electrodes formed on this side surface, and a voltage is applied between the external electrodes 23 and 24 in the stacking direction Cause displacement. In addition, the common external electrode 24 is drawn out to an end face on the individual external electrode 23 side through an internal electrode (not shown) and to an end portion of the piezoelectric member 12 in the nozzle arrangement direction.
  Further, FPCs 15 which are flexible wiring boards as wiring members are provided on both side surfaces of the base member 13 in the direction orthogonal to the nozzle arrangement direction. A chip size package (hereinafter referred to as “CSP”) 16 is provided between the piezoelectric member 12 and the FPC 15. The chip size package (hereinafter, referred to as “CSP”) 16 is provided with a drive circuit that supplies a drive signal to the drive column 12 </ b> A of the piezoelectric member 12.
  The output terminal of the CSP 16 and the individual external electrode 23 of the drive column 12A of the piezoelectric member 12 and a common external electrode for extraction (not shown) (hereinafter simply described as “individual external electrode”) are joined by soldering. The input terminal and the wiring electrode of the FPC 15 are joined with solder.
  The nozzle plate 3 is formed from a nickel (Ni) metal plate, and is manufactured by an electroforming method (electroforming). In this nozzle plate 3, nozzles 4 having a diameter of 10 to 35 μm are formed corresponding to the respective liquid chambers 6 and bonded to the flow path plate 1 with an adhesive. A water repellent layer is provided on the droplet discharge side surface (surface in the discharge direction: discharge surface or surface opposite to the liquid chamber 6 side) of the nozzle plate 3.
  Further, a frame member 17 formed by injection molding with an epoxy resin or polyphenylene sulfite is joined to the outer peripheral side of the piezoelectric actuator 11 composed of the piezoelectric member 12, the base member 13, the FPC 15, and the CSP 16. . The frame member 17 is formed with the above-described common liquid chamber 10 and further has a supply port for supplying ink to the common liquid chamber 10 from the outside. The supply port 19 is further provided with a sub-tank and an ink cartridge (not shown). Connected to an ink supply source.
  In this head, the piezoelectric pillars 12A and 12B are diced at an interval of 300 dpi. It is arranged in two rows facing each other, and the individual liquid chambers 6 and the nozzles 4 are arranged in a staggered arrangement with two rows at intervals of 150 dpi, so that a resolution of 300 dpi can be obtained in one scan. Yes.
  In the liquid discharge head configured as described above, for example, the drive column 12A contracts by lowering the voltage applied to the drive column 12A from the reference potential, and the vibration region 2a forming the liquid chamber wall surface of the diaphragm member 2 is lowered. As the volume of the individual liquid chamber 6 expands, the ink flows into the individual liquid chamber 6, and then the voltage applied to the drive column 12A is increased to extend the drive column 12A in the stacking direction. By deforming the vibration region 2 a in the direction of the nozzle 4 and contracting the volume of the liquid chamber 6, the ink in the liquid chamber 6 is pressurized and ink droplets are ejected (jetted) from the nozzle 4.
  Then, by returning the voltage applied to the drive column 12A to the reference potential, the vibration region 2a of the diaphragm member 2 is restored to the initial position, and the liquid chamber 6 expands to generate a negative pressure. Ink is filled into the liquid chamber 6 from the chamber 10. Therefore, after the vibration of the meniscus surface of the nozzle 4 is attenuated and stabilized, the operation proceeds to the next droplet discharge.
  Note that the driving method of the head is not limited to the above example (pulling-pushing), and it is also possible to perform striking or pushing depending on the direction to which the driving waveform is given.
  Next, a first embodiment of the present invention will be described with reference to FIGS. FIG. 4 is an enlarged explanatory view of a main part for explaining the embodiment, and FIG. 5 is an explanatory view for explaining an example of the CSP.
  First, CSP is a semiconductor device in which electrode terminals of the semiconductor element are formed even in the active region, so that the terminal pitch can be increased (staggered arrangement) or the electrode terminal area can be increased. Is a generic name for a package structure formed by stacking layers as rewiring.
  The CSP 16 of the present embodiment forms the wiring pattern of the input terminal 161 and the wiring pattern of the output terminal 162 of the driver IC 160 that drives the driving column 12A of the piezoelectric member 12 up to the active region, and each of the input terminal 161 and the output terminal 162 has the wiring pattern. Solder bumps 163 and 164 are formed.
  The output terminal 162 of the CSP 16 and the individual external electrode 23 of the drive column 12A are joined by solder 164A by the solder bump 164, and the input terminal 161 of the CSP 16 and the wiring electrode of the FPC 15 are joined by solder 163A by the solder bump 163. Yes.
  Here, the thickness of the solder 164A for joining the output terminal of the CSP 16 and the individual external electrode 23 of the piezoelectric member 12 is made thinner than the thickness of the solder 163A for joining the input terminal of the CSP 16 and the wiring electrode 15A of the FPC 15. .
  In other words, the solder bump on the FPC 15 side (input terminal 161 side) is formed higher than the solder bump height on the piezoelectric member 12 side (output terminal 162 side) of the CSP 16. In this case, as the electrode terminal of the CSP 16, the output terminal 162 side is preferably formed in a line shape corresponding to the drive column 12 </ b> A of the piezoelectric member 12. On the other hand, it is preferable to make the electrode shape larger than the output terminal 162 in order to form a high solder bump on the input terminal 161 side of the CSP 16.
  That is, there is a step between the piezoelectric member 12 to which the base member 13 is bonded and the FPC 15 disposed on the base member 13, and variations in parallelism also occur. Therefore, by increasing the height of the solder bump on the input terminal 161 side (FPC 15 side) of the CSP 16, it is possible to absorb the step and absorb the inclination.
  Moreover, as a joining structure of the output terminal 162 of CSP16, it joins so that the gap with the piezoelectric member 12 may become large as it goes to the input terminal 161 side. Thereby, the fillet can be formed by utilizing the wetness of the solder. In addition, reliable solder wetting and bonding can be ensured at the end of the gap portion, and high bonding reliability with respect to thermal stress or the like of the fine solder bonding portion between the piezoelectric member 12 and the CSP 16 in a region where the gap is formed large. Sex can be secured.
  As described above, the chip-size package having the drive circuit for driving the piezoelectric member is mounted, and the output terminal of the chip-size package and the electrode of the piezoelectric member are joined by solder, and the input terminal of the chip-size package and the wiring member The wiring electrode is joined by solder, and the chip size package, the input terminal, and the wiring electrode of the wiring member are joined rather than the thickness of the solder that joins the output terminal of the chip size package and the electrode of the piezoelectric member. By adopting a configuration in which the thickness of the solder is thick, even if there is a step between the joining surface of the piezoelectric member and the joining surface of the wiring member, it is possible to ensure the electrical connection reliability between them.
  Next, a second embodiment of the present invention will be described with reference to FIGS. 6 is a plan view of a CSP used for explaining the embodiment, FIG. 7 is a front view of FIG. 6 in a state where solder bumps are also provided, and FIG. 8 is a view showing the relationship between the piezoelectric member and the FPC and CSP. FIG. 9 is an explanatory diagram for explaining the relationship between the piezoelectric member and the FPC and CSP in the nozzle arrangement direction (piezoelectric column arrangement direction).
  The CSP 16 is provided with an input terminal 161 connected to the wiring electrode 15 </ b> A of the FPC 15 and an output terminal 162 connected to the individual external electrode 23 of the piezoelectric member 12. The output terminal 162 of the CSP 16 is arranged in a line so as to face the individual external electrode 23 of the piezoelectric member 12.
  In addition, when the output terminal 162 of the CSP 16 is the tip side on the side connected to the individual external electrode 23 of the piezoelectric member 12, and the opposite side, that is, the input terminal 161 side is the root side, the area of the root side is larger than the tip side. Widely formed. Specifically, the wide portion 165 is formed on the input terminal 161 side of the output terminal 162.
  The wide portion 165 has a circular shape in this example, but the wide portion 165 is formed for the purpose of adjusting the amount of solder supplied to the joint between the output terminal 162 and the individual external electrode 23. Any other shape may be used. However, as shown in FIG. 8, in order to prevent a short circuit between adjacent individual external electrodes 23 or patterns of the output terminal 162, it is a condition that the bonding portion facing the piezoelectric member 12 does not overlap.
  Here, the parallelism between the piezoelectric member 12 on which the CSP 16 is mounted and the FPC 15 is not guaranteed. That is, in the joining of the output terminals 162 that require fine joining, the joining height varies between the output terminals 162 and 162 at both ends in the arrangement direction (nozzle arrangement direction) of the output terminals 162.
  At this time, since the wide portion 165 is formed in the output terminal 162, when the solder amount of the joint portion between the output terminal 162 and the individual external electrode 23 is insufficient, it is joined by surface tension from the solder pool of the wide portion 165. When solder is supplied to the portion and excess solder is generated at the joint, it can be absorbed by the solder pool.
  This point will be specifically described with reference to FIG. As shown in FIG. 9, the piezoelectric member 12 and the FPC 15 may not be parallel in the nozzle arrangement direction. When mounting the CSP 16, the side parallelism is adjusted based on the side of the piezoelectric member 12 having a narrow terminal pitch. As a result, the FPC 15 and the CSP 16 are joined with an inclination.
  Therefore, in order to absorb the inclination of the CSP 16 in the nozzle arrangement direction, the height of the solder bump 163 on the input terminal 161 side is increased, so that the bonding can be reliably performed with the inclination.
  In addition, since the piezoelectric member 12 and the FPC 15 are composed of different structures, the height of the joint surface also varies. Therefore, in order to absorb the variation in height of the joint surface, the amount of solder to the joint portion can be adjusted in the wide portion 165 of the output terminal 162.
  Thereby, it is possible to prevent the occurrence of disconnection, short circuit or the like at the joint between the output terminal 162 and the individual external electrode 23 and to improve the joint reliability.
Next, a third embodiment of the present invention will be described with reference to FIG. Note that FIG. 10 is an enlarged explanatory view of a main part for explaining the embodiment.
In the present embodiment, one side 166 on the piezoelectric member 12 side of the surface on the output terminal side of the CSP 16 is parallel to the electrode surface of the individual external electrode 23 of the piezoelectric member 12. The one side 166 of the CSP 16 is brought into contact with and contacted with the electrode surface of the individual external electrode 23 of the piezoelectric member 12 to ensure parallelism between the output terminal 162 of the CSP 16 and the individual external electrode 23 of the piezoelectric member 12.
  By arranging the output terminal 162 of the CSP 16 and the individual external electrode 23 of the piezoelectric member 12 in parallel, it is possible to make the joint gap of the joint portions at the left and right ends in the nozzle arrangement direction of the CSP 16 uniform, and uniform the joining state of the fine solder can do.
  Further, by adopting a configuration in which one side 166 of the CSP 16 is brought into contact with the electrode surface of the individual external electrode 23 of the piezoelectric member 12, parallelism can be easily ensured.
  Here, the junction gap between the output terminal 162 of the CSP 16 and the individual external electrode 23 of the piezoelectric member 12 becomes wider as it approaches the input terminal 161 side. On the other hand, in the joint portion on the input terminal 161 side to be joined to the FPC 15, the parallelism may not be ensured. However, since the solder bump 163 is formed high, the dispersion is absorbed and stable joint reliability is achieved. Sex can be secured.
  The ink tank integrated head can also be configured by integrating the tank for supplying ink to the liquid ejection heads of the above embodiments.
  In the above-described embodiment, the example in which the piezoelectric member and the wiring member of the liquid discharge head, which are two electrical structures, are connected via the CSP is described, but the present invention is not limited to this.
  That is, when a chip size package is mounted between two electrical structures, the chip size package is soldered to each of the two electrical structures, and the terminal pitch of the chip size package is smaller than the solder thickness on the terminal side. The gap between the chip size package and the two electrical structures becomes wider as the solder on the terminal side with a wider pitch is thicker and the junction on the terminal side with a narrower terminal pitch goes to the side with the wider terminal pitch. For example, the connection reliability between the two electrical structures can be improved.
  Next, an example of the image forming apparatus according to the present invention including the liquid discharge head according to the present invention will be described with reference to FIGS. 11 is an explanatory side view of the mechanism of the apparatus, and FIG. 12 is an explanatory plan view of the main part of the mechanism.
  This image forming apparatus is a serial type image forming apparatus, and a carriage 233 is slidably held in the main scanning direction by main and slave guide rods 231 and 232 which are guide members horizontally mounted on the left and right side plates 221A and 221B. The main scanning motor that does not perform moving scanning in the direction indicated by the arrow (carriage main scanning direction) via the timing belt.
  The carriage 233 is supplied with ink supplied to the same head as the liquid discharge head according to the present invention for discharging ink droplets of each color of yellow (Y), cyan (C), magenta (M), and black (K). A recording head 234 with an integrated tank is arranged in a sub-scanning direction orthogonal to the main scanning direction with a nozzle row composed of a plurality of nozzles, and is mounted with the ink droplet ejection direction facing downward.
  Each of the recording heads 234 has two nozzle rows, and one nozzle row of one recording head 234a has a black (K) droplet, the other nozzle row has a cyan (C) droplet, and the other nozzle row has the other nozzle row. One nozzle row of the recording head 234b discharges magenta (M) droplets, and the other nozzle row discharges yellow (Y) droplets. Here, a configuration in which droplets of four colors are ejected in a two-head configuration is used, but it is also possible to arrange four nozzle rows per head and eject each of the four colors with one head.
  Further, the ink of each color is replenished and supplied from the ink cartridge 210 of each color to the tank 235 of the recording head 234 via the supply tube 236 of each color.
  On the other hand, as a paper feeding unit for feeding the paper 242 stacked on the paper stacking unit (pressure plate) 241 of the paper feed tray 202, a half-moon roller (feeding) that separates and feeds the paper 242 one by one from the paper stacking unit 241. A separation pad 244 made of a material having a large coefficient of friction is provided opposite to the sheet roller 243 and the sheet feeding roller 243, and the separation pad 244 is urged toward the sheet feeding roller 243 side.
  A guide 245 for guiding the paper 242, a counter roller 246, a conveyance guide member 247, and a tip pressure roller 249 are used to feed the paper 242 fed from the paper feeding unit to the lower side of the recording head 234. And a holding belt 251 which is a conveying means for electrostatically attracting the fed paper 242 and conveying it at a position facing the recording head 234.
  The conveyor belt 251 is an endless belt, and is configured to wrap around the conveyor roller 252 and the tension roller 253 so as to circulate in the belt conveyance direction (sub-scanning direction). In addition, a charging roller 256 that is a charging unit for charging the surface of the transport belt 251 is provided. The charging roller 256 is disposed so as to come into contact with the surface layer of the conveyor belt 251 and to rotate following the rotation of the conveyor belt 251. The transport belt 251 rotates in the belt transport direction when the transport roller 252 is rotationally driven through timing by a sub-scanning motor (not shown).
  Further, as a paper discharge unit for discharging the paper 242 recorded by the recording head 234, a separation claw 261 for separating the paper 242 from the transport belt 251, a paper discharge roller 262, and a paper discharge roller 263 are provided. A paper discharge tray 203 is provided below the paper discharge roller 262.
  A double-sided unit 271 is detachably attached to the back surface of the apparatus main body. The duplex unit 271 takes in the paper 242 returned by the reverse rotation of the transport belt 251, reverses it, and feeds it again between the counter roller 246 and the transport belt 251. The upper surface of the duplex unit 271 is a manual feed tray 272.
  Further, a maintenance / recovery mechanism 281 that is a head maintenance / recovery device according to the present invention includes a recovery means for maintaining and recovering the nozzle state of the recording head 234 in the non-printing area on one side of the carriage 233 in the scanning direction. Is arranged. The maintenance / recovery mechanism 281 includes cap members (hereinafter referred to as “caps”) 282a and 282b (hereinafter referred to as “caps 282” when not distinguished) for capping each nozzle surface of the recording head 234, and nozzle surfaces. A wiper blade 283 that is a blade member for wiping the ink, and an empty discharge receiver 284 that receives liquid droplets for discharging the liquid droplets that do not contribute to recording in order to discharge the thickened recording liquid. ing.
  Further, in the non-printing area on the other side in the scanning direction of the carriage 233, there is an empty space for receiving a liquid droplet when performing an empty discharge for discharging a liquid droplet that does not contribute to the recording in order to discharge the recording liquid thickened during the recording. A discharge receiver 288 is disposed, and the idle discharge receiver 288 is provided with an opening 289 along the nozzle row direction of the recording head 234 and the like.
  In this image forming apparatus configured as described above, the sheets 242 are separated and fed one by one from the sheet feeding tray 202, and the sheet 242 fed substantially vertically upward is guided by the guide 245, and is conveyed to the conveyor belt 251 and the counter. It is sandwiched between the rollers 246 and conveyed, and further, the leading end is guided by the conveying guide 237 and pressed against the conveying belt 251 by the leading end pressing roller 249, and the conveying direction is changed by approximately 90 °.
  At this time, a positive output and a negative output are alternately applied to the charging roller 256, that is, an alternating voltage is applied, and a charging voltage pattern in which the conveying belt 251 alternates, that is, in the sub-scanning direction that is the circumferential direction. , Plus and minus are alternately charged in a band shape with a predetermined width. When the sheet 242 is fed onto the conveyance belt 251 charged alternately with plus and minus, the sheet 242 is attracted to the conveyance belt 251, and the sheet 242 is conveyed in the sub scanning direction by the circumferential movement of the conveyance belt 251.
  Therefore, by driving the recording head 234 according to the image signal while moving the carriage 233, ink droplets are ejected onto the stopped paper 242 to record one line, and after the paper 242 is conveyed by a predetermined amount, Record the next line. Upon receiving a recording end signal or a signal that the trailing edge of the paper 242 has reached the recording area, the recording operation is finished and the paper 242 is discharged onto the paper discharge tray 203.
  As described above, since the image forming apparatus includes the liquid discharge head according to the present invention as a recording head, a high-quality image can be stably formed.
  In the present application, the “paper” is not limited to paper, but includes OHP, cloth, glass, a substrate, etc., and means a material to which ink droplets or other liquids can be attached. , Recording media, recording paper, recording paper, and the like. In addition, image formation, recording, printing, printing, and printing are all synonymous.
  The “image forming apparatus” means an apparatus that forms an image by discharging liquid onto a medium such as paper, thread, fiber, fabric, leather, metal, plastic, glass, wood, ceramics, etc. “Formation” means not only giving an image having a meaning such as a character or a figure to a medium but also giving an image having no meaning such as a pattern to the medium (simply causing a droplet to land on the medium). ) Also means.
  The “ink” is not limited to an ink unless otherwise specified, but includes any liquid that can form an image, such as a recording liquid, a fixing processing liquid, or a liquid. Used generically, for example, includes DNA samples, resists, pattern materials, resins, and the like.
  In addition, the “image” is not limited to a planar image, and includes an image given to a three-dimensionally formed image and an image formed by three-dimensionally modeling a solid itself.
  Further, the image forming apparatus includes both a serial type image forming apparatus and a line type image forming apparatus, unless otherwise limited.
DESCRIPTION OF SYMBOLS 1 Flow path plate 2 Vibrating plate member 3 Nozzle plate 4 Nozzle 5 Nozzle communication path 6 Pressurized liquid chamber (individual liquid chamber, individual liquid chamber)
DESCRIPTION OF SYMBOLS 10 Common liquid chamber 12 Piezoelectric member 12A, 12B Piezoelectric column 15 FPC (wiring member)
15 Wiring electrode 16 CSP
23 Individual external electrode 160 Driver IC (Drive circuit)
161 Input terminal 162 Output terminal 163, 164 Solder bump 163A, 164A Solder 165 Wide portion 233 Carriage 234a, 234b Recording head

Claims (6)

  1. A flow path member that forms a plurality of individual liquid chambers through which a plurality of nozzles for discharging droplets respectively communicate,
    A diaphragm member forming a partial wall surface of the individual liquid chamber;
    A piezoelectric member for displacing the diaphragm member;
    A chip size package on which a drive circuit for driving the piezoelectric member is mounted;
    A wiring member connected to the drive circuit,
    The output terminal of the chip size package and the electrode of the piezoelectric member are joined by solder, the input terminal of the chip size package and the wiring electrode of the wiring member are joined by solder,
    The thickness of the solder that joins the chip size package, the input terminal, and the wiring electrode of the wiring member is thicker than the thickness of the solder that joins the output terminal of the chip size package and the electrode of the piezoelectric member. A liquid discharge head.
  2.   The output terminals of the chip size package are arranged in a line, and when the portion joined to the electrode of the piezoelectric member is the tip side and the side opposite to the tip side is the root side, the root side is more than the tip side. The liquid discharge head according to claim 1, wherein the liquid discharge head has a wide area.
  3.   3. The liquid ejection head according to claim 2, wherein one side of the bonding surface on the output terminal side of the chip size package is parallel to the bonding surface of the electrode of the piezoelectric member.
  4.   4. The liquid ejection head according to claim 3, wherein one side of the bonding surface side of the output terminal side of the chip size package is in contact with the bonding surface of the electrode of the piezoelectric member.
  5.   An image forming apparatus comprising the liquid discharge head according to claim 1.
  6. An electrical structure mounting structure in which a chip size package is mounted between two electrical structures,
    The chip size package is soldered to each of the two electrical structures,
    Compared to the thickness of the solder on the terminal side where the terminal pitch of the chip size package is narrow, the thickness of the solder on the terminal side where the terminal pitch is wide is thick,
    A mounting structure of an electric structure, wherein a gap between the chip size package and the two electric structures is widened from a joint portion on the terminal side with a narrow terminal pitch toward a wide side with the terminal pitch. body.
JP2011200567A 2011-09-14 2011-09-14 Liquid ejection head, image forming apparatus, and mounting structure of electric structure Withdrawn JP2013059940A (en)

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JP2013059940A true JP2013059940A (en) 2013-04-04

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