JP2013059932A - Piezoelectric actuator, method for manufacturing the same, liquid ejecting head and image forming apparatus - Google Patents

Piezoelectric actuator, method for manufacturing the same, liquid ejecting head and image forming apparatus Download PDF

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Publication number
JP2013059932A
JP2013059932A JP2011200281A JP2011200281A JP2013059932A JP 2013059932 A JP2013059932 A JP 2013059932A JP 2011200281 A JP2011200281 A JP 2011200281A JP 2011200281 A JP2011200281 A JP 2011200281A JP 2013059932 A JP2013059932 A JP 2013059932A
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Prior art keywords
piezoelectric
wiring pattern
solder
wiring
region
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JP2011200281A
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Japanese (ja)
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Yu Kimura
悠 木村
Takeshi Sano
武 佐野
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Ricoh Co Ltd
株式会社リコー
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Priority to JP2011200281A priority Critical patent/JP2013059932A/en
Publication of JP2013059932A publication Critical patent/JP2013059932A/en
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Abstract

PROBLEM TO BE SOLVED: To solve such a problem that it is difficult to repair a failure caused in a solder joint between a piezoelectric element and a wiring pattern.SOLUTION: In an FPC 15, a wiring pattern 42 is formed on a substrate 41 while corresponding to each individual outside electrode 23; a soldering 51 is provided in a joint region 43 where the piezoelectric member 12 and the wiring pattern 42 overlap on each other; and a solder pool 45 where an amount of soldering greater than that used in jointing the individual outside electrode 23 of the piezoelectric member 12 to the wiring pattern 42 is pooled, is provided in a wiring pattern part 44 that is a region other than the joint region 43.

Description

  The present invention relates to a piezoelectric actuator, a manufacturing method thereof, a liquid discharge head, and an image forming apparatus.
  As an image forming apparatus such as a printer, a facsimile, a copying machine, a plotter, or a complex machine of these, for example, a liquid discharge recording type image forming using a recording head composed of a liquid discharge head (droplet discharge head) that discharges ink droplets. As an apparatus, an ink jet recording apparatus or the like is known.
  As the liquid ejection head, for example, a piezoelectric element is used as pressure generating means (actuator means) for generating pressure by applying ink, which is liquid in the liquid chamber, and elastically forming a wall surface in the liquid chamber by displacement of the piezoelectric element. A so-called piezoelectric head is known in which a deformable diaphragm member is deformed and droplets are ejected by changing the volume and pressure of a liquid chamber.
  In a liquid discharge head using this piezoelectric element, the wiring pattern of a wiring member such as an FPC is joined to the individual electrodes of the piezoelectric elements arranged at a predetermined pitch by solder.
  Conventionally, a plurality of conductive bumps electrically connected to a plurality of individual electrodes are formed in a protruding shape, an uncured synthetic resin layer covering an FPC conductor is applied, and then an uncured synthetic resin A method of manufacturing a recording head is known in which a plurality of bumps are pressed against a layer to penetrate the synthetic resin layer, the plurality of bumps are brought into contact with the terminal portions of the conductor portions, and then the synthetic resin layer is cured. 1)
JP-A-11-34309
  By the way, in the liquid discharge head, in order to improve the image quality, it is necessary to arrange a large number of nozzles at a high density, and the number of piezoelectric elements to be bonded to the wiring pattern of the wiring member in one head increases. However, there is an increased risk of poor bonding.
  Moreover, since the space | interval of the wiring patterns of a wiring member becomes narrow in the high-density head, it is necessary to make the solder thin in order to avoid a short circuit. For this reason, a bonding failure between the piezoelectric element and the wiring pattern of the wiring member is likely to occur.
  The present invention has been made in view of the above points, and an object of the present invention is to easily repair a bonding failure between a piezoelectric element and a wiring pattern.
In order to solve the above problems, the piezoelectric actuator according to the present invention is:
A plurality of piezoelectric elements, and a wiring member having a plurality of wiring patterns joined to each of the piezoelectric elements,
The piezoelectric element and the wiring pattern are joined by solder,
On the wiring pattern of the wiring member, an amount of solder larger than the amount used for joining the piezoelectric element and the wiring pattern is stored in a portion other than a region where the piezoelectric element and the wiring pattern overlap. It was set as the structure which has a solder pool part.
  According to the present invention, it is possible to easily repair a bonding failure between a piezoelectric element and a wiring pattern.
FIG. 3 is an external perspective view illustrating an example of a liquid discharge head according to the present invention. FIG. 2 is an explanatory cross-sectional view along a direction (liquid chamber longitudinal direction: line AA in FIG. 1) orthogonal to the nozzle arrangement direction of the head. It is sectional explanatory drawing which follows the nozzle arrangement | sequence direction (liquid chamber short direction: BB line of FIG. 1) of the head. It is side surface explanatory drawing of the state before joining of the junction part of the wiring member and piezoelectric member in the piezoelectric actuator which concerns on 1st Embodiment of this invention. It is front explanatory drawing which looked at the same wiring member from the wiring pattern side. It is side explanatory drawing of the state after joining of the junction part of the wiring member provided for description of the manufacturing method of the liquid discharge head which concerns on this invention, and a piezoelectric member. It is side surface explanatory drawing of the state which the joining defect produced similarly. It is side explanatory drawing similarly used for description of repair of a joint failure location. It is side explanatory drawing similarly used for description of the other example of repair of a joint failure location. It is a perspective explanatory view explaining the state of the wiring member which repaired the poor joint location like a spot. It is side surface explanatory drawing of the state before joining of the junction part of the wiring member and piezoelectric member of a comparative example. It is side explanatory drawing of the state after joining similarly. It is front explanatory drawing which looked at the wiring member in the piezoelectric actuator which concerns on 2nd Embodiment of this invention from the wiring pattern side. It is front explanatory drawing which looked at the wiring member in the piezoelectric actuator which concerns on 3rd Embodiment of this invention from the wiring pattern side. It is front explanatory drawing which looked at the wiring member in the piezoelectric actuator which concerns on 4th Embodiment of this invention from the wiring pattern side. It is front explanatory drawing which looked at the wiring member in the piezoelectric actuator which concerns on 5th Embodiment of this invention from the wiring pattern side. It is front explanatory drawing which looked at the wiring member in the piezoelectric actuator which concerns on 6th Embodiment of this invention from the wiring pattern side. It is front explanatory drawing which looked at the wiring member in the piezoelectric actuator which concerns on 7th Embodiment of this invention from the wiring pattern side. It is front explanatory drawing which looked at the wiring member in the piezoelectric actuator which concerns on 8th Embodiment of this invention from the wiring pattern side. It is front explanatory drawing which looked at the wiring member in the piezoelectric actuator which concerns on 9th Embodiment of this invention from the wiring pattern side. FIG. 4 is a side explanatory view of a mechanism unit of an example of an image forming apparatus according to the present invention. It is principal part plane explanatory drawing of the mechanism part.
  Embodiments of the present invention will be described below with reference to the accompanying drawings. An example of a liquid discharge head according to the present invention will be described with reference to FIGS. FIG. 1 is an external perspective view of the head, FIG. 2 is a cross-sectional explanatory view along a direction (liquid chamber longitudinal direction: line AA in FIG. 1) perpendicular to the nozzle arrangement direction of the head, and FIG. It is sectional explanatory drawing which follows a nozzle arrangement | sequence direction (liquid chamber short side direction: the BB line of FIG. 1).
  The liquid discharge head includes a flow path plate (flow path member, flow path substrate, liquid chamber substrate) 1 formed of a SUS substrate or the like, and a vibration plate member 2 that forms a vibration plate bonded to the lower surface of the flow path plate 1. And a nozzle plate 3 joined to the upper surface of the flow path plate 1. By these members, a plurality of individual liquid chambers (also referred to as a pressurized liquid chamber, a pressure chamber, a pressure chamber, a flow path, etc.) 6 as individual flow paths through which the plurality of nozzles 4 for discharging droplets respectively communicate. A fluid resistance portion 7 also serving as a supply path for supplying ink to the individual liquid chamber 6, and a liquid introduction portion 8 communicating with the individual liquid chamber 6 through the fluid resistance portion 7 are formed, and a diaphragm member is formed in the liquid introduction portion 8. Ink is supplied from a common liquid chamber 10 formed in a frame member 17 described later through a supply port 9 formed in FIG.
  The flow path plate 1 forms openings such as the individual liquid chamber 6 and the fluid resistance portion 7 by etching the SUS substrate using an acidic etching solution or machining such as punching (pressing). The flow path plate 1 can be formed by etching a single crystal silicon substrate, for example.
  The diaphragm member 2 is formed of the first layer 2A and the second layer 2B, the first layer 2A forms a thin portion, and the first layer 2A and the second layer 2B form a thick portion. . And this diaphragm member 2 has each vibration field (diaphragm part) 2a formed in the 1st layer 2A which forms the wall surface corresponding to each liquid room 6, and in this vibration field 2a, An island-shaped convex portion 2b formed by the thick portion of the first layer 2A and the second layer 2B is provided on the outer surface (the side opposite to the liquid chamber 6), and a portion corresponding to the liquid chamber interval wall 30 is provided. Similarly, a thick portion 2c is provided.
  A piezoelectric actuator 11 including an electromechanical transducer as a driving means (actuator means, pressure generating means) for deforming the vibration region 2a is arranged on the opposite side of the diaphragm member 2 from the liquid chamber 6.
  The piezoelectric actuator 11 has a plurality of (here, two) laminated piezoelectric members 12 which are laminated piezoelectric elements according to the present invention, which are adhesively bonded onto a base member 13, and the piezoelectric member 12 has a half cut. Grooves are formed by dicing, and the piezoelectric pillars 12A and 12B, which are a required number of columnar piezoelectric elements, are formed in a comb-like shape at a predetermined interval for one piezoelectric member 12.
  The piezoelectric columns 12A and 12B of the piezoelectric member 12 are the same, but the piezoelectric column that is driven by applying a driving waveform is the driving column 12A, and the piezoelectric column that is used as a mere support column without driving waveform is not driven. It is distinguished as a pillar 12B. That is, a so-called bi-pitch configuration is adopted.
  Then, the upper end surface (joint surface) of the drive column 12 </ b> A is joined and joined to the island-shaped convex portion 2 b of the diaphragm member 2. Further, the upper end surface of the non-driven column 12B is joined to the thick portion 2c of the diaphragm member 2 at a position corresponding to the liquid chamber interval wall 30.
  Here, the piezoelectric member 12 is formed by alternately laminating piezoelectric material layers (piezoelectric layers) 21 and internal electrodes 22A and 22B. The internal electrodes 22A and 22B are respectively end surfaces, that is, the diaphragm member 2 of the piezoelectric member 12. Is pulled out to a side surface (surface along the stacking direction) substantially perpendicular to the surface, connected to the individual external electrode 23 and the common external electrode 24 which are end surface electrodes formed on this side surface, and a voltage is applied between the external electrodes 23 and 24. This causes displacement in the stacking direction. In addition, the common external electrode 24 is drawn out to an end face on the individual external electrode 23 side through an internal electrode (not shown) and to an end portion of the piezoelectric member 12 in the nozzle arrangement direction.
  Further, for example, FPC 15 which is a flexible wiring board as a wiring member is provided on both side surfaces of the base member 13 in a direction orthogonal to the nozzle arrangement direction. Then, a common external electrode for extraction (not shown) that is electrically connected to the individual external electrode 23 and the common external electrode 24 of the drive column 12A of the piezoelectric member 12 and is drawn to the FPC 15 side, and a wiring electrode of the FPC 15 (hereinafter referred to as “wiring pattern”). The FPC 15 is mounted with a drive circuit (driver IC) that gives a drive signal to the drive column 12A.
  The nozzle plate 3 is formed from a nickel (Ni) metal plate, and is manufactured by an electroforming method (electroforming). In this nozzle plate 3, nozzles 4 having a diameter of 10 to 35 μm are formed corresponding to the respective liquid chambers 6 and bonded to the flow path plate 1 with an adhesive. A water repellent layer is provided on the droplet discharge side surface (surface in the discharge direction: discharge surface or surface opposite to the liquid chamber 6 side) of the nozzle plate 3.
  Further, a frame member 17 formed by injection molding with an epoxy resin or polyphenylene sulfite is joined to the outer peripheral side of the piezoelectric actuator 11 composed of the piezoelectric member 12, the base member 13, the FPC 15, and the like. The frame member 17 is formed with the above-described common liquid chamber 10 and further has a supply port for supplying ink to the common liquid chamber 10 from the outside. The supply port 19 is further provided with a sub-tank and an ink cartridge (not shown). Connected to an ink supply source.
  In this head, the piezoelectric pillars 12A and 12B are diced at an interval of 300 dpi. It is arranged in two rows facing each other, and the individual liquid chambers 6 and the nozzles 4 are arranged in a staggered arrangement with two rows at intervals of 150 dpi, so that a resolution of 300 dpi can be obtained in one scan. Yes.
  In the liquid discharge head configured as described above, for example, the drive column 12A contracts by lowering the voltage applied to the drive column 12A from the reference potential, and the vibration region 2a forming the liquid chamber wall surface of the diaphragm member 2 is lowered. As the volume of the individual liquid chamber 6 expands, the ink flows into the individual liquid chamber 6, and then the voltage applied to the drive column 12A is increased to extend the drive column 12A in the stacking direction. By deforming the vibration region 2 a in the direction of the nozzle 4 and contracting the volume of the liquid chamber 6, the ink in the liquid chamber 6 is pressurized and ink droplets are ejected (jetted) from the nozzle 4.
  Then, by returning the voltage applied to the drive column 12A to the reference potential, the vibration region 2a of the diaphragm member 2 is restored to the initial position, and the liquid chamber 6 expands to generate a negative pressure. Ink is filled into the liquid chamber 6 from the chamber 10. Therefore, after the vibration of the meniscus surface of the nozzle 4 is attenuated and stabilized, the operation proceeds to the next droplet discharge.
  Note that the driving method of the head is not limited to the above example (pulling-pushing), and it is also possible to perform striking or pushing depending on the direction to which the driving waveform is given.
  Next, the piezoelectric actuator according to the first embodiment of the present invention will be described with reference to FIGS. FIG. 4 illustrates a wiring member in the embodiment with reference to FIGS. 4 and 5. FIG. 5 is an explanatory side view of the wiring member and the piezoelectric member before joining, and FIG. 5 is a front explanatory view of the wiring member as viewed from the wiring pattern side.
  In the FPC 15 as the wiring member, a wiring pattern 42 is formed on the base 41 corresponding to each individual external electrode 23. A solder 51 is provided in a region 43 (hereinafter referred to as “joining region”) where the piezoelectric element (piezoelectric member 12) and the wiring pattern 42 overlap.
  Further, in the FPC 15, a portion 44, which is an area other than the bonding area 43 on the wiring pattern, stores an amount of solder that is equal to or larger than that used for bonding the individual external electrode 23 of the piezoelectric member 12 and the wiring pattern 42. A solder reservoir 45. When the shape of the FPC 15 viewed from the wiring pattern side is the front shape, the solder pool portion 45 is a front shape and is formed in a rectangular shape having the same width as the wiring pattern 42.
  Next, a manufacturing method of the liquid discharge head according to the present invention for manufacturing the head by bonding the FPC 15 as the wiring member to the piezoelectric member 12 will be described with reference to FIGS.
  First, the solder 51 is disposed in the joint region 43 and the solder pool 45 on the wiring pattern 42 of the FPC 15 (see FIG. 4). Then, the FPC 15 and the piezoelectric member 12 are brought into close contact with each other, and the solder 51 is melted by irradiating the bonding region 43 with laser from the base material 41 side of the FPC 15 to be bonded to the wiring pattern 42 and the individual external electrode 23 of the piezoelectric member 12 (first). 1 step).
  At this time, if the wiring pattern 42 and the individual external electrode 23 of the piezoelectric member 12 can be satisfactorily bonded with the solder 51, the entire surface of the wiring pattern 42 and the individual external electrode 23 are bonded with the solder 51 as shown in FIG.
  On the other hand, if the adhesion between the FPC 15 and the piezoelectric member 12 is insufficient, or if the amount of solder in the joining region 43 varies from wiring pattern to wiring pattern, as shown in FIG. The melted solder 51 is not joined to the individual external electrode 23 between the individual external electrode 23 and a joint failure between the wiring pattern 42 and the individual external electrode 23 may occur.
  Therefore, in this case, the solder 51 collected in the solder reservoir 45 of the wiring pattern portion 44 is melted and moved to the joining region 43 side, thereby joining the wiring pattern 42 and the individual external electrode 23 (second second). Step).
  In this case, the solder 51 melted from the solder reservoir 45 is moved toward the joining region 43 by the following method.
  For example, as shown in FIG. 8, the melted solder 51 is moved by applying air pressure from the wiring pattern portion 44 side. Alternatively, as shown in FIG. 9, the solder 51 melted by gravity is moved from the wiring pattern portion 44 side upside down of the work composed of the piezoelectric member 12 and the FPC 15.
  Thus, by having a solder pool part, when a joint failure occurs, the solder in the solder pool part can be remelted and moved to the joint region, and the joint defect can be easily repaired and trusted. High performance bonding can be performed.
  Here, the second step may be performed not only on the wiring pattern with poor bonding but on all wiring patterns. In this case, since the solder in the solder pool portion is arranged at a position different from the joining region, only the amount that fills the gap between the FPC wiring pattern and the piezoelectric member is supplied without being pressurized. Even if the second step is applied to the region where the bonding is completed, there is no problem in the bonding property.
  Alternatively, after the first step is completed, a joint failure location may be detected, and only the solder reservoir corresponding to the joint failure location may be spot-melted to repair the joint failure location. In this case, since the solder in the solder pool part flows out only in the spot-melted portion, in the piezoelectric actuator manufactured in this way, the amount of solder in the spot-soldered solder pool part is the other solder. It is formed less than the amount of solder in the reservoir.
  In this way, when only the solder pool portion corresponding to the joint failure location is spot-melted to repair the joint failure location, as shown in FIG. 10, the solder pool portion 45A corresponding to the repaired wiring pattern 42 is stored. The amount of solder 51 to be applied is smaller than the amount of solder 51 used for joining the piezoelectric member 12 and the wiring pattern 42.
  Here, a comparative example will be described with reference to FIGS.
  In this comparative example, as shown in FIG. 11, solder 51 is arranged on the wiring pattern 42 with the same thickness. In such a configuration, at the time of joining, as described above, the melted solder 51 may not be joined to the individual external electrode 23, and a joint failure between the wiring pattern 42 and the individual external electrode 23 may occur. .
  Even if remelting is performed in such a state, the above-described defects that cause poor bonding (adhesion between the FPC 15 and the piezoelectric member 12 is insufficient, or the amount of solder in the bonding region 43 depends on the wiring pattern). (Since it varies depending on the situation) is not improved, there is a high possibility that similar joint failure will be reproduced, and the joint failure cannot be improved.
  Next, a piezoelectric actuator according to a second embodiment of the present invention will be described with reference to FIG. FIG. 13 is an explanatory front view of the wiring member according to the embodiment as viewed from the wiring pattern side.
  In the present embodiment, the FPC 15 has a solder pool portion 45 wider than the wiring pattern 42 in the wiring pattern portion 44. When the shape of the FPC 15 viewed from the wiring pattern side is the front shape, the solder pool portion 45 is formed in a substantially rectangular shape with the front shape.
  By enlarging the area of the solder pool portion 45, more solder 51 can be pooled, and rejoining of the joint failure portion can be easily performed.
  Next, a piezoelectric actuator according to a third embodiment of the present invention will be described with reference to FIG. FIG. 14 is an explanatory front view of the wiring member in the same embodiment as viewed from the wiring pattern side.
  In the present embodiment, the solder reservoir 45 of the FPC 15 has a front shape and has a triangular shape that narrows toward the joining region 43 side.
  As a result, the solder 51 melted in the solder reservoir 45 is easily moved toward the joining region 43.
  Next, a piezoelectric actuator according to a fourth embodiment of the present invention will be described with reference to FIG. FIG. 15 is an explanatory front view of the wiring member in the same embodiment as viewed from the wiring pattern side.
  In the present embodiment, the solder reservoir 45 of the FPC 15 has a front shape and a rectangular shape that is long in the direction in which the wiring patterns 42 are arranged (direction perpendicular to the forming direction). The solder pool portions 45 of the wiring patterns 42 are arranged in a staggered manner in the arrangement direction of the wiring patterns 42 (so that the positions in the formation direction of the wiring patterns 42 are staggered).
  That is, it is preferable that the solder pool portion 45 has as large an area as possible, but it must be prevented from being short-circuited with the adjacent wiring pattern 42. By arranging the solder reservoirs 45 in a staggered manner, a short circuit with the adjacent wiring pattern 42 can be prevented while securing the area of the solder reservoirs 45.
  Next, a piezoelectric actuator according to a fifth embodiment of the present invention will be described with reference to FIG. FIG. 16 is an explanatory front view of the wiring member in the embodiment as viewed from the wiring pattern side.
  In this embodiment, the solder reservoir 45 of the FPC 15 has a front shape and a parallelogram shape. Thereby, even if it does not make staggered arrangement | positioning, a short circuit with the adjacent wiring pattern 42 can be prevented, ensuring the area of the solder pool part 45. FIG.
  Next, a piezoelectric actuator according to a sixth embodiment of the present invention will be described with reference to FIG. FIG. 17 is an explanatory front view of the wiring member in the same embodiment as viewed from the wiring pattern side.
  In the present embodiment, in the FPC 15 of the second embodiment, the bonding region 43 of the wiring pattern 42 with the piezoelectric member 12 is the front end side (downstream side), and the wiring pattern portion 44 side is the rear end side (upstream side). In this case, a resist pattern 47 covering the wiring pattern 42 is formed on the entire surface on the rear end side (upstream side) of the solder reservoir 45.
  That is, in the FPC 15 that is a wiring member, a region overlapping the piezoelectric member 12 of the wiring pattern 42 and a region on the opposite side across the solder reservoir 45 are covered with the resist pattern 47.
  Accordingly, it is possible to prevent the melted solder 51 from flowing out to the side opposite to the joining region 43 with the piezoelectric member 12 when the solder in the solder pool portion 45 is melted. That is, the resist pattern 47 constitutes a restricting means for restricting the flow of the solder 51.
  Next, a piezoelectric actuator according to a seventh embodiment of the present invention will be described with reference to FIG. FIG. 18 is an explanatory front view of the wiring member in the same embodiment as viewed from the wiring pattern side.
  In the present embodiment, in the FPC 15 of the fourth embodiment, similarly to the sixth embodiment, a region where the solder 51 of the wiring pattern 42 is not disposed, that is, the rear end side (upstream side) of the solder reservoir 45. A resist pattern 47 covering the wiring pattern 42 is formed on the entire surface. Thereby, the same effect as that of the sixth embodiment can be obtained.
  Next, a piezoelectric actuator according to an eighth embodiment of the present invention will be described with reference to FIG. FIG. 19 is an explanatory front view of the wiring member in the same embodiment as viewed from the wiring pattern side.
  In this embodiment, in the FPC 15 of the sixth embodiment, a resist pattern 47 that covers the wiring pattern 42 is formed on the wiring pattern 42. Even if comprised in this way, the outflow of the molten solder 51 can be prevented.
  Next, a piezoelectric actuator according to a ninth embodiment of the present invention will be described with reference to FIG. FIG. 20 is an explanatory front view of the wiring member in the same embodiment as viewed from the wiring pattern side.
  In this embodiment, in the FPC 15 of the seventh embodiment, a resist pattern 47 that covers the wiring pattern 42 is formed on the wiring pattern 42. Even if comprised in this way, the outflow of the molten solder 51 can be prevented.
  In the embodiment of the piezoelectric actuator described above, the solder reservoir 45 may be disposed on all the wiring patterns of the FPC 15 or only on a specific wiring pattern. For example, when a long piezoelectric actuator is formed and the FPC 15 and the piezoelectric member 12 are joined, the end portion of the actuator can be relatively easily pressed to ensure the close contact between the FPC 15 and the piezoelectric member 12. It is difficult to uniformly pressurize the vicinity, and poor bonding is likely to occur. Therefore, by providing the solder pool portion 45 only in the wiring pattern near the center of the FPC 15, the amount of solder attached to the FPC 15 by plating or the like can be reduced, and the manufacturing cost can be reduced.
  The liquid discharge head according to the present invention can include the piezoelectric actuator according to each of the above embodiments. Thereby, a highly reliable head can be obtained. An ink tank integrated head can be configured by integrating a tank for supplying ink to the liquid discharge head of the embodiment including the piezoelectric actuator of each of the above embodiments.
  Next, an example of the image forming apparatus according to the present invention including the liquid discharge head according to the present invention will be described with reference to FIGS. 21 is an explanatory side view of the mechanism of the apparatus, and FIG. 22 is an explanatory plan view of the main part of the mechanism.
  This image forming apparatus is a serial type image forming apparatus, and a carriage 233 is slidably held in the main scanning direction by main and slave guide rods 231 and 232 which are guide members horizontally mounted on the left and right side plates 221A and 221B. The main scanning motor that does not perform moving scanning in the direction indicated by the arrow (carriage main scanning direction) via the timing belt.
  The carriage 233 is supplied with ink supplied to the same head as the liquid discharge head according to the present invention for discharging ink droplets of each color of yellow (Y), cyan (C), magenta (M), and black (K). A recording head 234 with an integrated tank is arranged in a sub-scanning direction orthogonal to the main scanning direction with a nozzle row composed of a plurality of nozzles, and is mounted with the ink droplet ejection direction facing downward.
  Each of the recording heads 234 has two nozzle rows, and one nozzle row of one recording head 234a has a black (K) droplet, the other nozzle row has a cyan (C) droplet, and the other nozzle row has the other nozzle row. One nozzle row of the recording head 234b discharges magenta (M) droplets, and the other nozzle row discharges yellow (Y) droplets. Here, a configuration in which droplets of four colors are ejected in a two-head configuration is used, but it is also possible to arrange four nozzle rows per head and eject each of the four colors with one head.
  Further, the ink of each color is replenished and supplied from the ink cartridge 210 of each color to the tank 235 of the recording head 234 via the supply tube 236 of each color.
  On the other hand, as a paper feeding unit for feeding the paper 242 stacked on the paper stacking unit (pressure plate) 241 of the paper feed tray 202, a half-moon roller (feeding) that separates and feeds the paper 242 one by one from the paper stacking unit 241. A separation pad 244 made of a material having a large coefficient of friction is provided opposite to the sheet roller 243 and the sheet feeding roller 243, and the separation pad 244 is urged toward the sheet feeding roller 243 side.
  A guide 245 for guiding the paper 242, a counter roller 246, a conveyance guide member 247, and a tip pressure roller 249 are used to feed the paper 242 fed from the paper feeding unit to the lower side of the recording head 234. And a holding belt 251 which is a conveying means for electrostatically attracting the fed paper 242 and conveying it at a position facing the recording head 234.
  The conveyor belt 251 is an endless belt, and is configured to wrap around the conveyor roller 252 and the tension roller 253 so as to circulate in the belt conveyance direction (sub-scanning direction). In addition, a charging roller 256 that is a charging unit for charging the surface of the transport belt 251 is provided. The charging roller 256 is disposed so as to come into contact with the surface layer of the conveyor belt 251 and to rotate following the rotation of the conveyor belt 251. The transport belt 251 rotates in the belt transport direction when the transport roller 252 is rotationally driven through timing by a sub-scanning motor (not shown).
  Further, as a paper discharge unit for discharging the paper 242 recorded by the recording head 234, a separation claw 261 for separating the paper 242 from the transport belt 251, a paper discharge roller 262, and a paper discharge roller 263 are provided. A paper discharge tray 203 is provided below the paper discharge roller 262.
  A double-sided unit 271 is detachably attached to the back surface of the apparatus main body. The duplex unit 271 takes in the paper 242 returned by the reverse rotation of the transport belt 251, reverses it, and feeds it again between the counter roller 246 and the transport belt 251. The upper surface of the duplex unit 271 is a manual feed tray 272.
  Further, a maintenance / recovery mechanism 281 that is a head maintenance / recovery device according to the present invention includes a recovery means for maintaining and recovering the nozzle state of the recording head 234 in the non-printing area on one side of the carriage 233 in the scanning direction. Is arranged. The maintenance / recovery mechanism 281 includes cap members (hereinafter referred to as “caps”) 282a and 282b (hereinafter referred to as “caps 282” when not distinguished) for capping each nozzle surface of the recording head 234, and nozzle surfaces. A wiper blade 283 that is a blade member for wiping the ink, and an empty discharge receiver 284 that receives liquid droplets for discharging the liquid droplets that do not contribute to recording in order to discharge the thickened recording liquid. ing.
  Further, in the non-printing area on the other side in the scanning direction of the carriage 233, there is an empty space for receiving a liquid droplet when performing an empty discharge for discharging a liquid droplet that does not contribute to the recording in order to discharge the recording liquid thickened during the recording. A discharge receiver 288 is disposed, and the idle discharge receiver 288 is provided with an opening 289 along the nozzle row direction of the recording head 234 and the like.
  In this image forming apparatus configured as described above, the sheets 242 are separated and fed one by one from the sheet feeding tray 202, and the sheet 242 fed substantially vertically upward is guided by the guide 245, and is conveyed to the conveyor belt 251 and the counter. It is sandwiched between the rollers 246 and conveyed, and further, the leading end is guided by the conveying guide 237 and pressed against the conveying belt 251 by the leading end pressing roller 249, and the conveying direction is changed by approximately 90 °.
  At this time, a positive output and a negative output are alternately applied to the charging roller 256, that is, an alternating voltage is applied, and a charging voltage pattern in which the conveying belt 251 alternates, that is, in the sub-scanning direction that is the circumferential direction. , Plus and minus are alternately charged in a band shape with a predetermined width. When the sheet 242 is fed onto the conveyance belt 251 charged alternately with plus and minus, the sheet 242 is attracted to the conveyance belt 251, and the sheet 242 is conveyed in the sub scanning direction by the circumferential movement of the conveyance belt 251.
  Therefore, by driving the recording head 234 according to the image signal while moving the carriage 233, ink droplets are ejected onto the stopped paper 242 to record one line, and after the paper 242 is conveyed by a predetermined amount, Record the next line. Upon receiving a recording end signal or a signal that the trailing edge of the paper 242 has reached the recording area, the recording operation is finished and the paper 242 is discharged onto the paper discharge tray 203.
  As described above, since the image forming apparatus includes the liquid discharge head according to the present invention as a recording head, a high-quality image can be stably formed.
  In the present application, the “paper” is not limited to paper, but includes OHP, cloth, glass, a substrate, etc., and means a material to which ink droplets or other liquids can be attached. , Recording media, recording paper, recording paper, and the like. In addition, image formation, recording, printing, printing, and printing are all synonymous.
  The “image forming apparatus” means an apparatus that forms an image by discharging liquid onto a medium such as paper, thread, fiber, fabric, leather, metal, plastic, glass, wood, ceramics, etc. “Formation” means not only giving an image having a meaning such as a character or a figure to a medium but also giving an image having no meaning such as a pattern to the medium (simply causing a droplet to land on the medium). ) Also means.
  The “ink” is not limited to an ink unless otherwise specified, but includes any liquid that can form an image, such as a recording liquid, a fixing processing liquid, or a liquid. Used generically, for example, includes DNA samples, resists, pattern materials, resins, and the like.
  In addition, the “image” is not limited to a planar image, and includes an image given to a three-dimensionally formed image and an image formed by three-dimensionally modeling a solid itself.
  Further, the image forming apparatus includes both a serial type image forming apparatus and a line type image forming apparatus, unless otherwise limited.
DESCRIPTION OF SYMBOLS 1 Flow path plate 2 Vibrating plate member 3 Nozzle plate 4 Nozzle 5 Nozzle communication path 6 Pressurized liquid chamber (individual liquid chamber, individual liquid chamber)
DESCRIPTION OF SYMBOLS 10 Common liquid chamber 12 Piezoelectric member 12A, 12B Piezoelectric column 15 FPC (wiring member)
23 Individual external electrode 41 Base material 42 Wiring pattern 43 Area where piezoelectric element and wiring pattern overlap (joining area)
44 Region other than region where piezoelectric element and wiring pattern overlap 45 Solder reservoir portion 47 Resist pattern 51 Solder 233 Carriage 234a, 234b Recording head

Claims (9)

  1. A plurality of piezoelectric elements, and a wiring member having a plurality of wiring patterns joined to each of the piezoelectric elements,
    The piezoelectric element and the wiring pattern are joined by solder,
    On the wiring pattern of the wiring member, an amount of solder larger than the amount used for joining the piezoelectric element and the wiring pattern is stored in a portion other than a region where the piezoelectric element and the wiring pattern overlap. A piezoelectric actuator having a solder reservoir.
  2.   Of the plurality of wiring patterns provided on the wiring member, the amount of solder stored in the solder reservoir corresponding to a part of the wiring patterns is stored in the solder reservoir corresponding to another wiring pattern. The piezoelectric actuator according to claim 1, wherein the amount is less than the amount of solder to be used.
  3.   The amount of solder stored in the solder pool corresponding to the part of the wiring pattern is smaller than the amount of solder used for joining the piezoelectric element and the wiring pattern. The piezoelectric actuator as described.
  4.   4. The solder pool portion having a width wider than that of the wiring pattern is provided in the wiring pattern portion other than a region where the piezoelectric element and the wiring pattern overlap with each other. 5. Piezoelectric actuator.
  5.   5. The piezoelectric actuator according to claim 4, wherein the solder pool portions respectively provided in the plurality of wiring pattern portions are arranged in a staggered manner in the direction in which the wiring patterns are arranged.
  6.   6. The wiring member according to claim 1, wherein a region overlapping the piezoelectric element of the wiring pattern and a region on the opposite side across the solder reservoir are covered with a resist pattern. Piezoelectric actuator.
  7.   A liquid discharge head comprising the piezoelectric actuator according to claim 1.
  8.   An image forming apparatus comprising the liquid discharge head according to claim 7.
  9. A plurality of piezoelectric elements, and a wiring member having a plurality of wiring patterns joined to each of the piezoelectric elements,
    In the piezoelectric actuator manufacturing method in which the piezoelectric element and the wiring pattern are joined by solder,
    A first step of melting the solder disposed in a region where the piezoelectric element and the wiring pattern overlap, and joining the piezoelectric element and the wiring pattern;
    For the joint failure location where the piezoelectric element and the wiring pattern are not solder-bonded, the solder provided in the wiring pattern portion other than the region where the piezoelectric element and the wiring pattern overlap is melted, and the piezoelectric element and the wiring pattern And a second step of performing bonding by moving the wiring pattern to the overlapping region.
JP2011200281A 2011-09-14 2011-09-14 Piezoelectric actuator, method for manufacturing the same, liquid ejecting head and image forming apparatus Withdrawn JP2013059932A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011200281A JP2013059932A (en) 2011-09-14 2011-09-14 Piezoelectric actuator, method for manufacturing the same, liquid ejecting head and image forming apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011200281A JP2013059932A (en) 2011-09-14 2011-09-14 Piezoelectric actuator, method for manufacturing the same, liquid ejecting head and image forming apparatus

Publications (1)

Publication Number Publication Date
JP2013059932A true JP2013059932A (en) 2013-04-04

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