JP2013019010A5 - - Google Patents

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Publication number
JP2013019010A5
JP2013019010A5 JP2011152275A JP2011152275A JP2013019010A5 JP 2013019010 A5 JP2013019010 A5 JP 2013019010A5 JP 2011152275 A JP2011152275 A JP 2011152275A JP 2011152275 A JP2011152275 A JP 2011152275A JP 2013019010 A5 JP2013019010 A5 JP 2013019010A5
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JP
Japan
Prior art keywords
sputtering
copper material
hot
producing
hot working
Prior art date
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Application number
JP2011152275A
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English (en)
Japanese (ja)
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JP2013019010A (ja
JP5787647B2 (ja
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Priority to JP2011152275A priority Critical patent/JP5787647B2/ja
Priority claimed from JP2011152275A external-priority patent/JP5787647B2/ja
Publication of JP2013019010A publication Critical patent/JP2013019010A/ja
Publication of JP2013019010A5 publication Critical patent/JP2013019010A5/ja
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Publication of JP5787647B2 publication Critical patent/JP5787647B2/ja
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JP2011152275A 2011-07-08 2011-07-08 スパッタリングターゲット用銅材料の製造方法 Active JP5787647B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011152275A JP5787647B2 (ja) 2011-07-08 2011-07-08 スパッタリングターゲット用銅材料の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011152275A JP5787647B2 (ja) 2011-07-08 2011-07-08 スパッタリングターゲット用銅材料の製造方法

Publications (3)

Publication Number Publication Date
JP2013019010A JP2013019010A (ja) 2013-01-31
JP2013019010A5 true JP2013019010A5 (ru) 2014-04-03
JP5787647B2 JP5787647B2 (ja) 2015-09-30

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ID=47690724

Family Applications (1)

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JP2011152275A Active JP5787647B2 (ja) 2011-07-08 2011-07-08 スパッタリングターゲット用銅材料の製造方法

Country Status (1)

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JP (1) JP5787647B2 (ru)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5882248B2 (ja) * 2013-03-21 2016-03-09 Ｊｘ金属株式会社 Ｃｕ−Ｇａ合金スパッタリングターゲット、同スパッタリングターゲット用鋳造品及びこれらの製造方法
JPWO2015099119A1 (ja) * 2013-12-27 2017-03-23 Ｊｘ金属株式会社 高純度銅又は銅合金スパッタリングターゲット及びその製造方法
JP6067927B2 (ja) * 2014-03-31 2017-01-25 Ｊｘ金属株式会社 銅又は銅合金スパッタリングターゲット
US10844475B2 (en) 2015-12-28 2020-11-24 Jx Nippon Mining & Metals Corporation Method for manufacturing sputtering target
TWI663274B (zh) * 2017-03-30 2019-06-21 日商Ｊｘ金屬股份有限公司 Sputtering target and manufacturing method thereof
JP7131376B2 (ja) * 2018-12-27 2022-09-06 三菱マテリアル株式会社 スパッタリングターゲット用銅素材
KR102249087B1 (ko) * 2019-11-13 2021-05-07 (주)하나금속 판형 구리 스퍼터링 타겟 및 그 제조 방법
KR102476165B1 (ko) * 2020-08-10 2022-12-08 오리엔탈 카퍼 씨오., 엘티디. 열간 압출 공정을 통해 스퍼터링에 의한 박막 코팅 기술용 구리 타겟을 제조하는 방법
JP2022042859A (ja) * 2020-09-03 2022-03-15 オリエンタル コッパー シーオー．エルティーディー． 熱間押出プロセスからのスパッタリング法による薄膜コーティング技術のための銅ターゲットの製造

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10195609A (ja) * 1996-12-27 1998-07-28 Dowa Mining Co Ltd 結晶方位の制御されたｆｃｃ金属及びその製造方法
JP2000239836A (ja) * 1999-02-23 2000-09-05 Japan Energy Corp 高純度銅または銅合金スパッタリングターゲットおよびその製造方法
US6946039B1 (en) * 2000-11-02 2005-09-20 Honeywell International Inc. Physical vapor deposition targets, and methods of fabricating metallic materials
KR101515341B1 (ko) * 2009-09-18 2015-04-24 후루카와 덴키 고교 가부시키가이샤 스퍼터링 타겟에 사용되는 구리재료의 제조방법

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