JP2013012498A - 異方導電フィルム - Google Patents
異方導電フィルム Download PDFInfo
- Publication number
- JP2013012498A JP2013012498A JP2012219453A JP2012219453A JP2013012498A JP 2013012498 A JP2013012498 A JP 2013012498A JP 2012219453 A JP2012219453 A JP 2012219453A JP 2012219453 A JP2012219453 A JP 2012219453A JP 2013012498 A JP2013012498 A JP 2013012498A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive film
- conductive film
- anisotropic conductive
- connection terminal
- film layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002313 adhesive film Substances 0.000 claims abstract description 75
- 229920005989 resin Polymers 0.000 claims abstract description 56
- 239000011347 resin Substances 0.000 claims abstract description 56
- 239000002245 particle Substances 0.000 claims abstract description 35
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 29
- 239000003795 chemical substances by application Substances 0.000 claims description 20
- 238000006243 chemical reaction Methods 0.000 claims description 18
- 229920000642 polymer Polymers 0.000 claims description 7
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 5
- 238000010030 laminating Methods 0.000 claims description 4
- 230000020169 heat generation Effects 0.000 claims description 3
- 125000005439 maleimidyl group Chemical class C1(C=CC(N1*)=O)=O 0.000 claims description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 claims 1
- 239000004848 polyfunctional curative Substances 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 60
- 239000000243 solution Substances 0.000 description 15
- 229920002799 BoPET Polymers 0.000 description 13
- 239000011521 glass Substances 0.000 description 12
- 239000000758 substrate Substances 0.000 description 12
- 238000009413 insulation Methods 0.000 description 9
- -1 methacryloyl group Chemical group 0.000 description 9
- 239000004593 Epoxy Substances 0.000 description 8
- 239000007888 film coating Substances 0.000 description 8
- 238000009501 film coating Methods 0.000 description 8
- 239000010931 gold Substances 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- 239000003822 epoxy resin Substances 0.000 description 7
- 229920003192 poly(bis maleimide) Polymers 0.000 description 7
- 229920000647 polyepoxide Polymers 0.000 description 7
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 5
- ZNAAXKXXDQLJIX-UHFFFAOYSA-N bis(2-cyclohexyl-3-hydroxyphenyl)methanone Chemical compound C1CCCCC1C=1C(O)=CC=CC=1C(=O)C1=CC=CC(O)=C1C1CCCCC1 ZNAAXKXXDQLJIX-UHFFFAOYSA-N 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 229910052737 gold Inorganic materials 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000003825 pressing Methods 0.000 description 5
- 239000012790 adhesive layer Substances 0.000 description 4
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 229920006287 phenoxy resin Polymers 0.000 description 4
- 239000013034 phenoxy resin Substances 0.000 description 4
- WZESLRDFSNLECD-UHFFFAOYSA-N phenyl prop-2-eneperoxoate Chemical compound C=CC(=O)OOC1=CC=CC=C1 WZESLRDFSNLECD-UHFFFAOYSA-N 0.000 description 4
- 239000004793 Polystyrene Substances 0.000 description 3
- 239000007983 Tris buffer Substances 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 125000000524 functional group Chemical group 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 238000007602 hot air drying Methods 0.000 description 3
- 230000001678 irradiating effect Effects 0.000 description 3
- 229920003986 novolac Polymers 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 229920002223 polystyrene Polymers 0.000 description 3
- 239000001294 propane Substances 0.000 description 3
- 230000035939 shock Effects 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- LEJBBGNFPAFPKQ-UHFFFAOYSA-N 2-(2-prop-2-enoyloxyethoxy)ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOC(=O)C=C LEJBBGNFPAFPKQ-UHFFFAOYSA-N 0.000 description 2
- KUDUQBURMYMBIJ-UHFFFAOYSA-N 2-prop-2-enoyloxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC(=O)C=C KUDUQBURMYMBIJ-UHFFFAOYSA-N 0.000 description 2
- VVBLNCFGVYUYGU-UHFFFAOYSA-N 4,4'-Bis(dimethylamino)benzophenone Chemical compound C1=CC(N(C)C)=CC=C1C(=O)C1=CC=C(N(C)C)C=C1 VVBLNCFGVYUYGU-UHFFFAOYSA-N 0.000 description 2
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000003094 microcapsule Substances 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical group C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- DKEGCUDAFWNSSO-UHFFFAOYSA-N 1,8-dibromooctane Chemical compound BrCCCCCCCCBr DKEGCUDAFWNSSO-UHFFFAOYSA-N 0.000 description 1
- IPJGAEWUPXWFPL-UHFFFAOYSA-N 1-[3-(2,5-dioxopyrrol-1-yl)phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC(N2C(C=CC2=O)=O)=C1 IPJGAEWUPXWFPL-UHFFFAOYSA-N 0.000 description 1
- AQGZJQNZNONGKY-UHFFFAOYSA-N 1-[4-(2,5-dioxopyrrol-1-yl)phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=C(N2C(C=CC2=O)=O)C=C1 AQGZJQNZNONGKY-UHFFFAOYSA-N 0.000 description 1
- DHXGUMVPQRWQPI-UHFFFAOYSA-N 1-[4-[4-[1-[4-[4-(2,5-dioxopyrrol-1-yl)phenoxy]phenyl]decyl]phenoxy]phenyl]pyrrole-2,5-dione Chemical compound C=1C=C(OC=2C=CC(=CC=2)N2C(C=CC2=O)=O)C=CC=1C(CCCCCCCCC)C(C=C1)=CC=C1OC(C=C1)=CC=C1N1C(=O)C=CC1=O DHXGUMVPQRWQPI-UHFFFAOYSA-N 0.000 description 1
- XAZPKEBWNIUCKF-UHFFFAOYSA-N 1-[4-[4-[2-[4-[4-(2,5-dioxopyrrol-1-yl)phenoxy]phenyl]propan-2-yl]phenoxy]phenyl]pyrrole-2,5-dione Chemical compound C=1C=C(OC=2C=CC(=CC=2)N2C(C=CC2=O)=O)C=CC=1C(C)(C)C(C=C1)=CC=C1OC(C=C1)=CC=C1N1C(=O)C=CC1=O XAZPKEBWNIUCKF-UHFFFAOYSA-N 0.000 description 1
- BTFWJAUZPQUVNZ-UHFFFAOYSA-N 1-methyl-3-[(3-methylphenyl)methyl]benzene Chemical compound CC1=CC=CC(CC=2C=C(C)C=CC=2)=C1 BTFWJAUZPQUVNZ-UHFFFAOYSA-N 0.000 description 1
- PIZHFBODNLEQBL-UHFFFAOYSA-N 2,2-diethoxy-1-phenylethanone Chemical compound CCOC(OCC)C(=O)C1=CC=CC=C1 PIZHFBODNLEQBL-UHFFFAOYSA-N 0.000 description 1
- 150000003923 2,5-pyrrolediones Chemical class 0.000 description 1
- MZFVCCRPWKQNTF-UHFFFAOYSA-N 2-(dimethylamino)-2-[(4-morpholin-4-ylphenyl)methyl]-1-phenylbutan-1-one Chemical compound C=1C=CC=CC=1C(=O)C(CC)(N(C)C)CC(C=C1)=CC=C1N1CCOCC1 MZFVCCRPWKQNTF-UHFFFAOYSA-N 0.000 description 1
- QIRNGVVZBINFMX-UHFFFAOYSA-N 2-allylphenol Chemical compound OC1=CC=CC=C1CC=C QIRNGVVZBINFMX-UHFFFAOYSA-N 0.000 description 1
- ZCDADJXRUCOCJE-UHFFFAOYSA-N 2-chlorothioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(Cl)=CC=C3SC2=C1 ZCDADJXRUCOCJE-UHFFFAOYSA-N 0.000 description 1
- SJEBAWHUJDUKQK-UHFFFAOYSA-N 2-ethylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC=C3C(=O)C2=C1 SJEBAWHUJDUKQK-UHFFFAOYSA-N 0.000 description 1
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- MUZDXNQOSGWMJJ-UHFFFAOYSA-N 2-methylprop-2-enoic acid;prop-2-enoic acid Chemical compound OC(=O)C=C.CC(=C)C(O)=O MUZDXNQOSGWMJJ-UHFFFAOYSA-N 0.000 description 1
- CFVWNXQPGQOHRJ-UHFFFAOYSA-N 2-methylpropyl prop-2-enoate Chemical compound CC(C)COC(=O)C=C CFVWNXQPGQOHRJ-UHFFFAOYSA-N 0.000 description 1
- KTALPKYXQZGAEG-UHFFFAOYSA-N 2-propan-2-ylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C(C)C)=CC=C3SC2=C1 KTALPKYXQZGAEG-UHFFFAOYSA-N 0.000 description 1
- LYJHVEDILOKZCG-UHFFFAOYSA-N Allyl benzoate Chemical compound C=CCOC(=O)C1=CC=CC=C1 LYJHVEDILOKZCG-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- CUVUTNSJEZHLAZ-UHFFFAOYSA-N C1(C=CC(N1C1=CC=C(OC2=CC=C(C=C2)C(C(F)(F)F)(C(F)(F)F)C2=CC=C(C=C2)OC2=CC=C(C=C2)N2C(C=CC2=O)=O)C=C1)=O)=O.C1(C=CC(N1C1=CC=C(OC2=C(C=CC=C2)C2CCCCC2)C=C1)=O)=O Chemical compound C1(C=CC(N1C1=CC=C(OC2=CC=C(C=C2)C(C(F)(F)F)(C(F)(F)F)C2=CC=C(C=C2)OC2=CC=C(C=C2)N2C(C=CC2=O)=O)C=C1)=O)=O.C1(C=CC(N1C1=CC=C(OC2=C(C=CC=C2)C2CCCCC2)C=C1)=O)=O CUVUTNSJEZHLAZ-UHFFFAOYSA-N 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- KGQLBLGDIQNGSB-UHFFFAOYSA-N benzene-1,4-diol;methoxymethane Chemical compound COC.OC1=CC=C(O)C=C1 KGQLBLGDIQNGSB-UHFFFAOYSA-N 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 230000009172 bursting Effects 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000006356 dehydrogenation reaction Methods 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 1
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 150000002734 metacrylic acid derivatives Chemical class 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- YLHXLHGIAMFFBU-UHFFFAOYSA-N methyl phenylglyoxalate Chemical compound COC(=O)C(=O)C1=CC=CC=C1 YLHXLHGIAMFFBU-UHFFFAOYSA-N 0.000 description 1
- LUCXVPAZUDVVBT-UHFFFAOYSA-N methyl-[3-(2-methylphenoxy)-3-phenylpropyl]azanium;chloride Chemical compound Cl.C=1C=CC=CC=1C(CCNC)OC1=CC=CC=C1C LUCXVPAZUDVVBT-UHFFFAOYSA-N 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- 229940059574 pentaerithrityl Drugs 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- POSICDHOUBKJKP-UHFFFAOYSA-N prop-2-enoxybenzene Chemical compound C=CCOC1=CC=CC=C1 POSICDHOUBKJKP-UHFFFAOYSA-N 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- LYBIZMNPXTXVMV-UHFFFAOYSA-N propan-2-yl prop-2-enoate Chemical compound CC(C)OC(=O)C=C LYBIZMNPXTXVMV-UHFFFAOYSA-N 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229940096522 trimethylolpropane triacrylate Drugs 0.000 description 1
Landscapes
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
【解決手段】相対峙する回路電極間に介在され、相対向する回路電極を加圧し、加圧方向の電極間を電気的に接続する異方導電フィルムであって、重合された光重合性樹脂、熱硬化性樹脂、熱硬化性樹脂用硬化剤、及び導電粒子を含有する第1接着フィルム層と、熱硬化性樹脂及び熱硬化性樹脂用硬化剤を含有する第2接着フィルム層とが積層されてなる、異方導電フィルム。
【選択図】なし
Description
フェノキシアクリレート30g、ヒドロキシシクロヘキシルフェニルケトン0.3g、重量平均分子量40,000のフェノキシ樹脂20gを酢酸エチル50gに溶解した接着剤組成溶液を作製した。
フェノキシアクリレート30g、ヒドロキシシクロヘキシルフェニルケトン0.3g、重量平均分子量40,000のフェノキシ樹脂20gを酢酸エチル50gに溶解した接着剤組成溶液を作製した。
フェノキシアクリレート、ヒドロキシシクロヘキシルフェニルケトンを溶解せず、分子量40,000のフェノキシ樹脂を50gにする以外は実施例1と同様な方法で作製した第1接着フィルム用フィルム塗工溶液を、厚み50μmの片面を表面処理したPETフィルムに塗工装置を用いて塗布し、70℃、10分の熱風乾燥により、接着フィルムの厚みが10μmの接着フィルムAを作製した。この接着フィルムのDSC測定での反応開始温度は80℃、硬化反応の80%が終了する反応終了温度は200℃であった。
Claims (10)
- 相対峙する回路電極間に介在され、相対向する回路電極を加圧し、加圧方向の電極間を電気的に接続する異方導電フィルムであって、
重合された光重合性樹脂、熱硬化性樹脂、熱硬化性樹脂用硬化剤、及び導電粒子を含有する第1接着フィルム層と、熱硬化性樹脂及び熱硬化性樹脂用硬化剤を含有する第2接着フィルム層とが積層されてなる、異方導電フィルム。 - 前記光重合性樹脂が、アクリレート、メタクリレート及びマレイミド化合物からなる群より選択される少なくとも1種である、請求項1に記載の異方導電フィルム。
- 前記第1接着フィルム層及び第2接着フィルム層のDSCでの発熱開始温度が60℃以上でかつ硬化反応の80%が終了する温度が260℃以下である、請求項1又は2に記載の異方導電フィルム。
- 前記熱硬化性樹脂用硬化剤が潜在性硬化剤からなる、請求項1〜3のいずれか一項に記載の異方導電フィルム。
- 前記第1接着フィルム層中に分散されている前記導電粒子の充填量が、0.2〜30体積%である、請求項1〜4のいずれか一項に記載の異方導電フィルム。
- 前記第1接着フィルム層及び第2接着フィルム層中にフィルム形成性高分子が含有されている、請求項1〜5のいずれか一項に記載の異方導電フィルム。
- 前記第1接着フィルム層における前記光重合性樹脂に対する前記熱硬化性樹脂と前記熱硬化性樹脂用硬化剤を合わせた合計の使用量が、前記光重合性樹脂100重量部に対して60〜400重量部である、請求項1〜6のいずれか一項に記載の異方導電フィルム。
- 第一の接続端子を有する第一の回路部材と、
第二の接続端子を有する第二の回路部材とを、
前記第一の接続端子と前記第二の接続端子を対向して配置し、
対向配置した前記第一の接続端子と前記第二の接続端子の間に異方導電フィルムを介在させ、加熱加圧して、対向配置した前記第一の接続端子と前記第二の接続端子を電気的に接続させてなる回路板であって、
前記異方導電フィルムが請求項1〜7のいずれか一項に記載の異方導電フィルムである、回路板。 - 前記第一の接続端子及び前記第二の接続端子がそれぞれ複数の電極であり、当該複数の電極同士の間のスペースが15μm以下である、請求項8に記載の回路板。
- 前記第一の接続端子及び前記第二の接続端子が2600μm2以下のサイズの電極を有する、請求項8又は9に記載の回路板。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012219453A JP5868823B2 (ja) | 2012-10-01 | 2012-10-01 | 異方導電フィルム |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012219453A JP5868823B2 (ja) | 2012-10-01 | 2012-10-01 | 異方導電フィルム |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010140573A Division JP5218482B2 (ja) | 2010-06-21 | 2010-06-21 | 異方導電フィルムの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013012498A true JP2013012498A (ja) | 2013-01-17 |
JP5868823B2 JP5868823B2 (ja) | 2016-02-24 |
Family
ID=47686177
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012219453A Expired - Lifetime JP5868823B2 (ja) | 2012-10-01 | 2012-10-01 | 異方導電フィルム |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5868823B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014162990A1 (ja) | 2013-04-02 | 2014-10-09 | 昭和電工株式会社 | 導電性接着剤、異方性導電フィルム及びそれらを使用した電子機器 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08279371A (ja) * | 1995-02-07 | 1996-10-22 | Hitachi Chem Co Ltd | 接続部材および該接続部材を用いた電極の接続構造並びに接続方法 |
JPH1116621A (ja) * | 1997-06-23 | 1999-01-22 | Hitachi Chem Co Ltd | 電極の接続方法 |
JP2001052778A (ja) * | 1999-08-06 | 2001-02-23 | Hitachi Chem Co Ltd | 異方導電性接着フィルムおよびその製造方法 |
JP2001323249A (ja) * | 2000-05-17 | 2001-11-22 | Hitachi Chem Co Ltd | 回路接続用接着剤 |
JP2003064324A (ja) * | 2001-06-11 | 2003-03-05 | Hitachi Chem Co Ltd | 異方導電性接着フィルム及びそれを用いた回路基板の接続方法、回路基板接続体 |
-
2012
- 2012-10-01 JP JP2012219453A patent/JP5868823B2/ja not_active Expired - Lifetime
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08279371A (ja) * | 1995-02-07 | 1996-10-22 | Hitachi Chem Co Ltd | 接続部材および該接続部材を用いた電極の接続構造並びに接続方法 |
JPH1116621A (ja) * | 1997-06-23 | 1999-01-22 | Hitachi Chem Co Ltd | 電極の接続方法 |
JP2001052778A (ja) * | 1999-08-06 | 2001-02-23 | Hitachi Chem Co Ltd | 異方導電性接着フィルムおよびその製造方法 |
JP2001323249A (ja) * | 2000-05-17 | 2001-11-22 | Hitachi Chem Co Ltd | 回路接続用接着剤 |
JP2003064324A (ja) * | 2001-06-11 | 2003-03-05 | Hitachi Chem Co Ltd | 異方導電性接着フィルム及びそれを用いた回路基板の接続方法、回路基板接続体 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014162990A1 (ja) | 2013-04-02 | 2014-10-09 | 昭和電工株式会社 | 導電性接着剤、異方性導電フィルム及びそれらを使用した電子機器 |
US9701874B2 (en) | 2013-04-02 | 2017-07-11 | Showa Denko K.K. | Conductive adhesive, anisotropic conductive film, and electronic device using same |
Also Published As
Publication number | Publication date |
---|---|
JP5868823B2 (ja) | 2016-02-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI445792B (zh) | 黏著劑組成物、連接結構體、連接結構體的製造方法以及黏著劑組成物的應用 | |
JP5594359B2 (ja) | 接着剤組成物及びその使用、並びに、回路部材の接続構造体及びその製造方法 | |
US9540549B2 (en) | Anisotropic conductive film and semiconductor device bonded by the same | |
KR20090042865A (ko) | 회로 접속 재료, 회로 부재의 접속 구조 및 회로 부재의 접속 구조의 제조 방법 | |
KR101243554B1 (ko) | 접착제 조성물, 회로 접속용 접착제, 접속체 및 반도체 장치 | |
JP7347576B2 (ja) | 接着剤フィルム | |
JP4907840B2 (ja) | 異方導電フィルム及びこれを用いた回路板 | |
JP2009242508A (ja) | 接着剤及び接合体 | |
JP5844588B2 (ja) | 回路接続材料及びそれを用いた接続方法並びに接続構造体 | |
JP5956362B2 (ja) | 異方性導電フィルム、接続方法、及び接合体 | |
JP2013214417A (ja) | 回路接続材料、回路部材接続構造体及び回路部材接続構造体の製造方法 | |
JP5868823B2 (ja) | 異方導電フィルム | |
KR100922658B1 (ko) | 이방도전 필름 및 이를 이용한 회로판 | |
JP5218482B2 (ja) | 異方導電フィルムの製造方法 | |
KR100731667B1 (ko) | 이방도전 필름 및 이를 이용한 회로판 | |
WO2016052130A1 (ja) | 異方性導電フィルム、及び接続方法 | |
JP2009161684A (ja) | 回路接続用接着剤組成物、この接着剤組成物用いた回路部材の接続構造及び回路部材の接続方法 | |
KR100902454B1 (ko) | 이방도전 필름 및 이를 이용한 회로판 | |
KR100751452B1 (ko) | 이방도전 필름 및 이를 이용한 회로판 | |
JP2009024149A (ja) | 接着剤及び接合体 | |
CN101600294B (zh) | 各向异性导电薄膜及使用该薄膜的电路板 | |
TWI451154B (zh) | Anisotropic conductive film and a circuit board using the same | |
KR100924889B1 (ko) | 이방도전 필름 및 이를 이용한 회로판 | |
TWI493245B (zh) | Anisotropic conductive film and a circuit board using the same | |
CN101600295B (zh) | 各向异性导电薄膜及使用该薄膜的电路板 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20130829 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130910 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20131017 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20140318 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20141007 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20150925 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20160106 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5868823 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
EXPY | Cancellation because of completion of term |