JP2013004248A - Led lamp - Google Patents

Led lamp Download PDF

Info

Publication number
JP2013004248A
JP2013004248A JP2011132939A JP2011132939A JP2013004248A JP 2013004248 A JP2013004248 A JP 2013004248A JP 2011132939 A JP2011132939 A JP 2011132939A JP 2011132939 A JP2011132939 A JP 2011132939A JP 2013004248 A JP2013004248 A JP 2013004248A
Authority
JP
Japan
Prior art keywords
base
led
led lamp
connecting member
led substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2011132939A
Other languages
Japanese (ja)
Other versions
JP5298162B2 (en
Inventor
Akiya Kamura
晃弥 賀村
Katsuo Sawamoto
勝雄 澤本
Masatoshi Konishi
正峻 小西
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
OneA Co Ltd
Original Assignee
OneA Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by OneA Co Ltd filed Critical OneA Co Ltd
Priority to JP2011132939A priority Critical patent/JP5298162B2/en
Publication of JP2013004248A publication Critical patent/JP2013004248A/en
Application granted granted Critical
Publication of JP5298162B2 publication Critical patent/JP5298162B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Abstract

PROBLEM TO BE SOLVED: To provide an LED lamp 1 capable of efficiently performing heat radiation.SOLUTION: In the LED lamp 1 including a base 2 having a terminal section 11, a lens member 6, a connection member 7 for connecting the base 2 and the lens member 6, and an LED board 4 preparing LED elements 3, wherein a storage space for storing the LED board 4 is formed of at least the base 2 and the connection member 7, a communication port 14 for communicating the storage space and an external space is formed between the base 2 and the connection member 7, a part of the LED board 4 externally sticks out from the communication port 14, and an outer surface of the base 2 and a part of the LED board 4 are connected with a thermal conductive member 17.

Description

本発明は、例えばLEDを用いたランプに関する。   The present invention relates to a lamp using, for example, an LED.

従来、この種のランプについては、例えば、LEDチップが実装される基板と、基板が取り付けられる器具本体と、LEDチップから照射される光の配光を制御するレンズ部を保持する保持部材と、を有したものがある(例えば特許文献1の図1参照)。   Conventionally, for this type of lamp, for example, a substrate on which an LED chip is mounted, an instrument body to which the substrate is attached, a holding member that holds a lens unit that controls light distribution of light emitted from the LED chip, (For example, refer to FIG. 1 of Patent Document 1).

このような従来のランプにおいて、保持部材は、合成樹脂によって成形されており、略円板状の底部と、この底部の外縁から全周に渡って上方に延出する側部とを有する。   In such a conventional lamp, the holding member is formed of a synthetic resin, and has a substantially disk-shaped bottom portion and a side portion extending upward from the outer edge of the bottom portion over the entire circumference.

この従来のランプでは、LEDチップからの熱を外部に放出するために、保持部材の底部と側部に放熱孔が形成されている。このランプは、空気の対流によって、LEDチップの熱を放熱孔から外部に放出できるようになっている。   In this conventional lamp, in order to release heat from the LED chip to the outside, heat radiation holes are formed in the bottom and side portions of the holding member. This lamp can release the heat of the LED chip to the outside from the heat dissipation hole by air convection.

特開2008−186636号公報JP 2008-186636 A

従来のランプでは、保持部材に放熱孔を形成して、空気の対流によって内部のLEDチップの熱を放出しているため、LEDチップの熱が外部に放出されるまでに時間がかかってしまい、放熱の効率が低くなってしまっていた。   In a conventional lamp, a heat radiating hole is formed in the holding member and the heat of the internal LED chip is released by air convection, so it takes time until the heat of the LED chip is released to the outside. The efficiency of heat dissipation was low.

本発明は、上記の事情に鑑みてなされたものであり、放熱を効率良く行うことができるLEDランプを提供することを課題とする。   This invention is made | formed in view of said situation, and makes it a subject to provide the LED lamp which can perform heat dissipation efficiently.

本発明は、上記の課題を解決するためのものであって、端子部を有する口金と、レンズ部材と、口金及びレンズ部材を連結する連結部材と、LED素子が設けられるLED基板とを有し、少なくとも口金と連結部材とによってLED基板が収納される収納空間が形成されるLEDランプであって、口金と連結部材との間には、収納空間と外部の空間とを連通する連通口が形成され、この連通口からLED基板の一部が外部に突出するとともに、口金の外面と前記LED基板の一部とを熱伝導性部材で連結してなることを特徴とする。   This invention is for solving said subject, Comprising: It has a nozzle | cap | die which has a terminal part, a lens member, a connection member which connects a nozzle | cap | die and a lens member, and an LED board in which an LED element is provided. An LED lamp in which a storage space for storing the LED substrate is formed by at least the base and the connecting member, and a communication port that connects the storage space and the external space is formed between the base and the connecting member. In addition, a part of the LED board protrudes from the communication port, and the outer surface of the base and a part of the LED board are connected by a heat conductive member.

かかる構成によれば、LEDランプから外部に突出されるLED基板の一部と口金の外面とが熱伝導性部材によって連結されることにより、LED素子によって発せられる熱は、熱伝導性部材を介してLED基板から口金に直接伝達されることとなる。これにより、LEDランプは、効率の良い放熱を行うことができる。また、この熱伝導性部材は金属で構成されることが望ましい。   According to such a configuration, a part of the LED substrate protruding outside from the LED lamp and the outer surface of the base are connected by the heat conductive member, so that the heat generated by the LED element passes through the heat conductive member. Thus, the light is transmitted directly from the LED substrate to the base. Thereby, the LED lamp can perform efficient heat dissipation. Moreover, it is desirable that this heat conductive member is made of metal.

また、本発明に係るLEDランプは、前記連結部材は、口金の内部に挿入されるとともにこの口金の壁部と重なるように突出する突出部を有し、この突出部は、板状に構成されるとともに、板厚方向に貫通する貫通孔を有し、口金は、その外面から内面に向かって壁部を貫通する孔を有し、この孔は、その縁部に形成される突起部を有しており、口金の突起部が連結部材の突出部に形成される孔に挿通されることで、連結部材と口金が連結されていることが望ましい。   Further, in the LED lamp according to the present invention, the connecting member is inserted into the base and has a protrusion that protrudes so as to overlap the wall of the base, and the protrusion is configured in a plate shape. In addition, the base has a through-hole penetrating in the thickness direction, and the base has a hole penetrating the wall portion from the outer surface toward the inner surface, and the hole has a protrusion formed at the edge thereof. In addition, it is desirable that the connecting member and the base be connected by inserting the protrusion of the base into the hole formed in the protruding portion of the connecting member.

かかる構成によれば、連結部材と口金の連結が、口金の外面から貫通孔を形成するだけで行われることから、LEDランプの組み立ての作業性が良くなる。   According to such a configuration, since the connection between the connecting member and the base is performed simply by forming the through hole from the outer surface of the base, the workability of assembling the LED lamp is improved.

本発明に係るLEDランプによれば、放熱を効率良く行うことが可能になる。   With the LED lamp according to the present invention, it is possible to efficiently dissipate heat.

図1は、LEDランプの一実施形態における正面図である。FIG. 1 is a front view of an embodiment of an LED lamp. 図2は、同実施形態におけるLEDランプの断面図である。FIG. 2 is a cross-sectional view of the LED lamp in the same embodiment. 図3は、同実施形態におけるLEDランプの分解斜視図である。FIG. 3 is an exploded perspective view of the LED lamp in the same embodiment. 図4は、同実施形態におけるLEDランプの底面図である。FIG. 4 is a bottom view of the LED lamp in the same embodiment. 図5は、同実施形態におけるLEDランプの平面図である。FIG. 5 is a plan view of the LED lamp in the embodiment. 図6は、同実施形態におけるLEDランプの要部断面図である。FIG. 6 is a cross-sectional view of a main part of the LED lamp in the same embodiment. 図7は、同実施形態におけるLEDランプの要部断面図である。FIG. 7 is a cross-sectional view of a main part of the LED lamp in the same embodiment.

以下、本発明に係るLEDランプを実施するための形態について、図面を参照しながら説明する。図1〜図7は、本発明に係るLEDランプ1の一実施形態を示す。   Hereinafter, the form for implementing the LED lamp which concerns on this invention is demonstrated, referring drawings. 1-7 shows one Embodiment of the LED lamp 1 which concerns on this invention.

図1〜図3に示すように、LEDランプ1は、口金2と、LED素子3を搭載するLED基板と、このLED素子3を制御するための制御基板5と、レンズ部材6と、このレンズ部材6と口金2とを連結する連結部材(ジョイント)7とを備える。なお、本実施形態では、説明の便宜上、LEDランプ1のレンズ部材6側の部分を「上部」といい、口金2側の部分を下部という。また、口金2からレンズ部材6に向かう方向を「上方」といい、レンズ部材6から口金2に向かう方向を「下方」といい、これらに沿う方向を「上下方向」という場合がある。   As shown in FIGS. 1 to 3, the LED lamp 1 includes a base 2, an LED board on which the LED element 3 is mounted, a control board 5 for controlling the LED element 3, a lens member 6, and this lens. A connecting member (joint) 7 that connects the member 6 and the base 2 is provided. In the present embodiment, for convenience of explanation, the part on the lens member 6 side of the LED lamp 1 is referred to as “upper part” and the part on the base 2 side is referred to as lower part. Further, the direction from the base 2 toward the lens member 6 may be referred to as “upward”, the direction from the lens member 6 toward the base 2 may be referred to as “downward”, and the direction along these may be referred to as “vertical direction”.

口金2は、図1〜図3に示すように、金属製で円筒状に構成されている。この口金2は、筒心方向の一端部(下端部)が閉塞されており、この端面(底面)に2つの端子部11が設けられている(図4参照)。口金2は、筒心方向の他端部(上端部)にフランジ部12を有する。口金2の外面には、LEDランプ1が接続されるソケット等の機器と係合可能なように、外方に突出する突起部13が形成されている。   As shown in FIGS. 1 to 3, the base 2 is made of metal and has a cylindrical shape. The base 2 is closed at one end (lower end) in the tube center direction, and two terminal portions 11 are provided on the end face (bottom face) (see FIG. 4). The base 2 has a flange portion 12 at the other end portion (upper end portion) in the tube center direction. On the outer surface of the base 2, a protruding portion 13 that protrudes outward is formed so as to be engageable with a device such as a socket to which the LED lamp 1 is connected.

LED基板4は、略円形状の中央部4aと、この中央部4aから半径方向外方に突出する2つの突出部4b,4bとを有する。   The LED substrate 4 has a substantially circular central portion 4a and two projecting portions 4b and 4b projecting radially outward from the central portion 4a.

LED基板4の中央部4aには、LED素子3が搭載されている。この中央部4aには、制御基板5が電気的に接続されている。   The LED element 3 is mounted on the central portion 4 a of the LED substrate 4. A control board 5 is electrically connected to the central portion 4a.

また、LED基板4には、LED素子3から発生する熱を伝熱するための伝熱パターン15が形成されている(図6参照)。この伝熱パターン15は、LED基板4の表面と裏面とに繋がって形成されている。本実施形態では、この伝熱パターン15は、金属(例えば銅)による薄膜をLED基板4の両面に形成することによって構成される。   Moreover, the heat transfer pattern 15 for transferring the heat generated from the LED element 3 is formed on the LED substrate 4 (see FIG. 6). The heat transfer pattern 15 is formed so as to be connected to the front surface and the back surface of the LED substrate 4. In the present embodiment, the heat transfer pattern 15 is configured by forming a thin film made of metal (for example, copper) on both surfaces of the LED substrate 4.

LED基板4の各突出部4bには、その先端から中央部4aに向かって凹む凹部23が形成されている。図6に示すように、前記LED基板4の伝熱パターン15は、凹部23を跨いでLED基板4の表面側と裏面側とに連続的に形成されている。より具体的には、この伝熱パターン15は、LED基板4の表面(上面)側のパターンと、裏面(下面)側のパターンとを連結する連結部16を有する。この連結部16は、LED基板4の凹部23を構成する面に設けられている。換言すると、この伝熱パターン15は、LED基板4の凹部23を経由してLED基板4の表面側と裏面側とに繋がって形成されている。   Each protrusion 4b of the LED substrate 4 is formed with a recess 23 that is recessed from its tip toward the center 4a. As shown in FIG. 6, the heat transfer pattern 15 of the LED substrate 4 is continuously formed on the front surface side and the back surface side of the LED substrate 4 across the recess 23. More specifically, the heat transfer pattern 15 includes a connecting portion 16 that connects a pattern on the front surface (upper surface) side of the LED substrate 4 and a pattern on the rear surface (lower surface) side. The connecting portion 16 is provided on a surface constituting the concave portion 23 of the LED substrate 4. In other words, the heat transfer pattern 15 is formed so as to be connected to the front surface side and the back surface side of the LED substrate 4 via the concave portion 23 of the LED substrate 4.

LED基板4は、口金2のフランジ部12に載置されるように、その長さ(一方の突出部4bから他方の突出部4bまでの長さ)がフランジ部12の外径よりも大きく設定されている。このことから、LED基板4が口金2のフランジ部12に載置された場合、各突出部4bの下面がフランジ部12に接触する。この状態において、各突出部4bは、口金2のフランジ部12から外方に突出する(露出する)こととなる。   The LED substrate 4 is set so that its length (the length from one projecting portion 4b to the other projecting portion 4b) is larger than the outer diameter of the flange portion 12 so as to be placed on the flange portion 12 of the base 2. Has been. From this, when the LED substrate 4 is placed on the flange portion 12 of the base 2, the lower surface of each protruding portion 4 b comes into contact with the flange portion 12. In this state, each protrusion 4b protrudes outward from the flange 12 of the base 2 (exposed).

このLED基板4は、半田17によって口金2に固定されている。具体的には、図1、図6に示すように、口金2のフランジ部12に載置されて外方に突出する突出部4bの凹部23と、その直下の口金2の一部とが半田17によって連結される。LED基板4の口金2への固定については、半田17のような合金の他、銅その他の金属が使用されてもよい。   The LED substrate 4 is fixed to the base 2 with solder 17. Specifically, as shown in FIGS. 1 and 6, the concave portion 23 of the protruding portion 4 b that is placed on the flange portion 12 of the base 2 and protrudes outward, and a part of the base 2 immediately below the solder 2 are soldered. 17 are connected. For fixing the LED substrate 4 to the base 2, copper or other metal may be used in addition to the alloy such as the solder 17.

制御基板5は、LED素子3を制御するためのICチップ19等の素子を搭載している。この制御基板5は、その一端部にLED基板4に接続される2つの突起部5a,5aを有する。制御基板5の他端部には、口金2の各端子部11に接続される2つの電極20,20が設けられている。   The control board 5 is mounted with elements such as an IC chip 19 for controlling the LED elements 3. The control board 5 has two protrusions 5a and 5a connected to the LED board 4 at one end thereof. Two electrodes 20, 20 connected to the respective terminal portions 11 of the base 2 are provided at the other end portion of the control board 5.

レンズ部材6は、透明又は半透明の樹脂によって平面視円形状(図5参照)に構成されている。このレンズ部材6は、レンズ部21と、レンズ部21の下部に形成されるとともに、連結部材7に連結される連結部22とを有する。   The lens member 6 is configured in a circular shape in plan view (see FIG. 5) with a transparent or translucent resin. The lens member 6 includes a lens portion 21 and a connecting portion 22 that is formed below the lens portion 21 and connected to the connecting member 7.

図2に示すように、レンズ部21の外面には、上端から下方に凹む凹部21aが形成されている。レンズ部材6は、LED素子3からの光を透過し、この光をレンズ部21の凹部21a及びその側面から外部に照射することができる。   As shown in FIG. 2, a concave portion 21 a that is recessed downward from the upper end is formed on the outer surface of the lens portion 21. The lens member 6 can transmit the light from the LED element 3 and irradiate the light to the outside from the concave portion 21 a of the lens portion 21 and its side surface.

連結部22は、レンズ部21の下部から下方に突出する円環状(又は円筒状)に形成される。この連結部22の外面には、このレンズ部材6を連結部材7に連結するための突起部24が形成されている。この突起部24は、連結部22の半径方向外方に突出して形成される。   The connecting portion 22 is formed in an annular shape (or cylindrical shape) that protrudes downward from the lower portion of the lens portion 21. A protrusion 24 for connecting the lens member 6 to the connecting member 7 is formed on the outer surface of the connecting portion 22. The protruding portion 24 is formed to protrude outward in the radial direction of the connecting portion 22.

連結部材7は、図2、図3に示すように、環状の本体部31と、この本体部31から下方に突出する突出部32a〜32dとを有する。   As shown in FIGS. 2 and 3, the connecting member 7 includes an annular main body 31 and protrusions 32 a to 32 d that protrude downward from the main body 31.

本体部31は、レンズ部材6の連結部22が内側に入るように、その内径が連結部22の外径よりも大きく形成されている。この本体部31の内面には、レンズ部材6の連結部22に形成される突起部24を係止する突起部33が形成されている。この突起部33は、本体部31の半径方向内方に突出して形成される。   The main body 31 is formed so that the inner diameter thereof is larger than the outer diameter of the connecting part 22 so that the connecting part 22 of the lens member 6 enters inside. A protrusion 33 is formed on the inner surface of the main body 31 to lock the protrusion 24 formed on the connecting portion 22 of the lens member 6. The protrusion 33 is formed to protrude inward in the radial direction of the main body 31.

また、本体部31には、その下面から上方に向かって凹む2つの凹部34,34が形成されている。この凹部34は、本体部31の周方向において所定間隔をおいて形成される。具体的には、2つの凹部34,34は、本体部31の半径方向に沿う直線上に位置している。   The main body 31 is formed with two recesses 34, 34 that are recessed upward from the lower surface thereof. The recesses 34 are formed at predetermined intervals in the circumferential direction of the main body 31. Specifically, the two concave portions 34 are located on a straight line along the radial direction of the main body portion 31.

本体部31の下面31aは、口金2の上部のフランジ部12に当接するように構成される。本体部31の下面31aが口金2のフランジ部12に当接した状態では、本体部31の凹部34の縁部と口金2のフランジ部12との一部との間に内外を連通する連通口14が形成される(図1参照)。この連通口14は、LED基板4や制御基板5を収納するためにLEDランプ1内に形成される収納空間とLEDランプ1の外部の空間とを連通している。   The lower surface 31 a of the main body 31 is configured to abut on the flange portion 12 on the upper portion of the base 2. In a state where the lower surface 31 a of the main body 31 is in contact with the flange portion 12 of the base 2, a communication port that communicates the inside and the outside between the edge of the concave portion 34 of the main body 31 and a part of the flange portion 12 of the base 2. 14 is formed (see FIG. 1). The communication port 14 communicates a storage space formed in the LED lamp 1 for storing the LED board 4 and the control board 5 with a space outside the LED lamp 1.

この連通口14は、口金2のフランジ部12に載置されるLED基板4に本体部31を接触させないようにするためのものでもある。具体的には、図1、図6に示すように、LED基板4が口金2のフランジ部12に載置された状態において、LED基板4の突出部4bは、本体部31に接触することなく、この連通口14を通じて外側に突出している。   The communication port 14 is also for preventing the main body portion 31 from coming into contact with the LED substrate 4 placed on the flange portion 12 of the base 2. Specifically, as shown in FIGS. 1 and 6, in a state where the LED substrate 4 is placed on the flange portion 12 of the base 2, the protruding portion 4 b of the LED substrate 4 does not contact the main body portion 31. , Projecting outward through the communication port 14.

本体部31の外面には、半径方向外方に突出する2つの突起部35,35が形成されている。この突起部35は、本体部31の上下方向に沿って所定の長さを有する直線状に構成される。   On the outer surface of the main body 31, two protrusions 35, 35 that protrude outward in the radial direction are formed. The protrusion 35 is configured in a straight line having a predetermined length along the vertical direction of the main body 31.

連結部材7の突出部32a〜32dは、本体部31の内面に対応する位置から下方に突出して形成される。本実施形態において、連結部材7には、4つの突出部32a〜32dが形成されている。各突出部32a〜32dは、断面視円弧状の板形状に構成される。4つの突出部32a〜32dのうち、2つの突出部32a,32bは、本体部31に形成される2つの凹部34のうちの一方の凹部34を挟むように、この凹部34の側縁部34aに対応して形成されている。同様の他の2つの突出部32c、32dは他方の凹部34を挟むように、この凹部34の側縁部34aに対応して形成されている。   The protruding portions 32 a to 32 d of the connecting member 7 are formed to protrude downward from a position corresponding to the inner surface of the main body portion 31. In the present embodiment, the projecting member 32 a to 32 d is formed on the connecting member 7. Each protrusion part 32a-32d is comprised by the cross-sectional arc-shaped plate shape. Of the four protrusions 32 a to 32 d, the two protrusions 32 a and 32 b have a side edge 34 a of the recess 34 so as to sandwich one of the two recesses 34 formed in the main body 31. It is formed corresponding to. Two other similar projecting portions 32c and 32d are formed corresponding to the side edge portion 34a of the recess 34 so as to sandwich the other recess 34.

連結部材7の突出部32a〜32dは、口金2の内部に挿入されて、口金2と連結部材7とを連結するためのものである。したがって、円弧状に構成される突出部32a〜32dの曲率半径は、口金2の中途部の内径よりも小さく設定されている。   The protrusions 32 a to 32 d of the connecting member 7 are inserted into the base 2 to connect the base 2 and the connecting member 7. Therefore, the radius of curvature of the projecting portions 32 a to 32 d configured in an arc shape is set smaller than the inner diameter of the midway portion of the base 2.

一方の凹部34に対応して設けられる2つの突出部32a,32bのうち、一方の突出部32aには、その厚さ方向(板厚方向)に貫通する孔36が形成されている。また、他方の凹部34に対応して設けられる2つの突出部32c,32dのうち、一方の突出部32cにも、同様な孔(図示略)が形成されている。   Of the two protrusions 32a and 32b provided corresponding to the one recess 34, the one protrusion 32a is formed with a hole 36 penetrating in the thickness direction (plate thickness direction). Of the two protrusions 32c and 32d provided corresponding to the other recess 34, a similar hole (not shown) is also formed in one protrusion 32c.

この孔36は、本体部31の外面に形成されている直線状の突起部35の長手方向(上下方向)に沿う位置に形成されている。すなわち、直線状の突起部35から下方に延長する延長線を引いたとき、この孔36は、この延長線上に位置している。LEDランプ1を組み立てたときに、口金2の内側に挿入されることから、外側から視認できなくなる。このとき、この突起部35は、その直下に孔36が存在することを確認するための目印として機能する。   The hole 36 is formed at a position along the longitudinal direction (vertical direction) of the linear protrusion 35 formed on the outer surface of the main body 31. That is, when an extension line extending downward from the linear protrusion 35 is drawn, the hole 36 is positioned on the extension line. When the LED lamp 1 is assembled, the LED lamp 1 is inserted into the base 2 so that it cannot be seen from the outside. At this time, the protruding portion 35 functions as a mark for confirming that the hole 36 exists immediately below the protruding portion 35.

各突出部32a,32cに形成される孔36は、連結部材7と口金2との連結のために用いられる。図7(a)に示すように、連結部材7と口金2との連結は、尖端状の工具41を口金2の外面から内方に貫通させることによって行われる。具体的には、連結部材7の突出部32a〜32dが口金2の内部に挿入され、これらが口金2の側壁部と重なるように位置する状態において、連結部材7の突出部32a,32cに形成された孔36に対応する口金2の所定の位置に、尖端状の工具41によって、口金2の外面側から内面側に向かって貫通孔42が形成される。このとき、貫通孔42には、その縁部から内方に突出する筒状の突起部43が形成される(図7(b)参照)。この筒状の突起部43は、連結部材7の突出部32a,32cの孔36に挿入され、これによって口金2と連結部材7とが連結される。   The holes 36 formed in the protrusions 32 a and 32 c are used for connecting the connecting member 7 and the base 2. As shown in FIG. 7A, the connecting member 7 and the base 2 are connected by passing a pointed tool 41 inward from the outer surface of the base 2. Specifically, the protrusions 32 a to 32 d of the connecting member 7 are inserted into the base 2 and formed in the protrusions 32 a and 32 c of the connecting member 7 in a state where they are positioned so as to overlap the side wall of the base 2. A through-hole 42 is formed at a predetermined position of the base 2 corresponding to the formed hole 36 by a pointed tool 41 from the outer surface side to the inner surface side of the base 2. At this time, a cylindrical projection 43 is formed in the through hole 42 so as to project inward from the edge thereof (see FIG. 7B). The cylindrical projection 43 is inserted into the hole 36 of the projecting portions 32 a and 32 c of the connecting member 7, thereby connecting the base 2 and the connecting member 7.

以下、本実施形態におけるLEDランプ1の製造方法(組み立て方法)について説明する。LEDランプ1を製造するには、まず、LED基板4と制御基板5とが電気的に接続され、これによってLEDユニットが構成される。次に、このLEDユニットは、口金2内に収容される。このとき、LED基板4の突出部4bが口金2のフランジ部12に載置される。そして、制御基板5の電極20と口金2の底部に形成される端子部11,11とが電気的に接続される。   Hereinafter, the manufacturing method (assembly method) of the LED lamp 1 in this embodiment is demonstrated. In order to manufacture the LED lamp 1, first, the LED board 4 and the control board 5 are electrically connected to each other, thereby forming an LED unit. Next, the LED unit is accommodated in the base 2. At this time, the protruding portion 4 b of the LED substrate 4 is placed on the flange portion 12 of the base 2. And the electrode 20 of the control board 5 and the terminal parts 11 and 11 formed in the bottom part of the nozzle | cap | die 2 are electrically connected.

次に、LED基板4の凹部23と口金2とが半田17によって連結される。その後、連結部材7の突出部32a〜32dが口金2の内側に挿入される。   Next, the concave portion 23 of the LED substrate 4 and the base 2 are connected by the solder 17. Thereafter, the protruding portions 32 a to 32 d of the connecting member 7 are inserted inside the base 2.

連結部材7の突出部32a〜32dが口金2の内側に挿入されると、本体部31の下面31aが口金2のフランジ部12に載置される。このとき、本体部31とLED基板4の突出部4bとが接触しないように、本体部31に形成される凹部34とLED基板4の突出部4bとが重なるようにすることが望ましい。   When the protruding portions 32 a to 32 d of the connecting member 7 are inserted inside the base 2, the lower surface 31 a of the main body portion 31 is placed on the flange portion 12 of the base 2. At this time, it is desirable that the concave portion 34 formed in the main body 31 and the protrusion 4b of the LED substrate 4 overlap each other so that the main body 31 and the protrusion 4b of the LED substrate 4 do not contact each other.

この状態において、連結部材7の突出部32a,32cに形成されている孔36に対応する口金2の位置に外側から貫通孔42が形成され、その縁部に筒状の突起部43が形成される。この筒状の突起部43が前記突出部32a,32cの孔36に挿通されることで、連結部材7と口金2との連結が行われる。このように、連結部材7と口金2との連結が完了すると、これらの内側にLED基板4及び制御基板5を収納する収納空間が形成される。   In this state, a through-hole 42 is formed from the outside at the position of the base 2 corresponding to the hole 36 formed in the protrusions 32a and 32c of the connecting member 7, and a cylindrical projection 43 is formed at the edge thereof. The The cylindrical projection 43 is inserted into the holes 36 of the protrusions 32a and 32c, whereby the connection member 7 and the base 2 are connected. Thus, when the connection between the connecting member 7 and the base 2 is completed, a storage space for storing the LED board 4 and the control board 5 is formed inside these.

その後、レンズ部材6が連結部材7に固定される。この固定は、レンズ部材6の連結部22を連結部材7の本体部31に上方から挿入し、本体部31の突起部33と連結部22の突起部24とを掛止させることにより行われる。これにより、LEDランプ1内の収納空間は、レンズ部材6によって、その上側が覆われた状態となる。以上によってLEDランプ1が完成する。   Thereafter, the lens member 6 is fixed to the connecting member 7. This fixing is performed by inserting the connecting portion 22 of the lens member 6 into the main body portion 31 of the connecting member 7 from above and hooking the protruding portion 33 of the main body portion 31 and the protruding portion 24 of the connecting portion 22. Thereby, the storage space in the LED lamp 1 is in a state where the upper side is covered by the lens member 6. Thus, the LED lamp 1 is completed.

以上説明したLEDランプ1によれば、LED基板4の一部である突出部4bが内部の収納空間から外部に突出し、半田17によって突出部4bと口金2が連結されることにより、LED基板4は、口金2に確実に固定されることとなる。さらに、この構成により、LED素子3から発せられる熱は、熱伝導性部材である半田17を介して、LED基板4から口金2に直接伝達される。これによって、LEDランプ1は効率の良い放熱を行うことができる。また、外部から半田付けを行うことでLED基板4を口金2に固定できるので、LEDランプ1の製造も容易に行うことができる。   According to the LED lamp 1 described above, the protruding portion 4b, which is a part of the LED substrate 4, protrudes from the internal storage space to the outside, and the protruding portion 4b and the base 2 are connected by the solder 17, whereby the LED substrate 4 Is securely fixed to the base 2. Furthermore, with this configuration, the heat generated from the LED element 3 is directly transmitted from the LED substrate 4 to the base 2 via the solder 17 that is a heat conductive member. Thereby, the LED lamp 1 can perform efficient heat dissipation. Further, since the LED substrate 4 can be fixed to the base 2 by soldering from the outside, the LED lamp 1 can be easily manufactured.

また、半田17によってLED基板4を口金2に固定する場合、このLED基板4の突出部4bには凹部23が形成されていることから、この凹部23に半田17が留まり易くなる。また、凹部23により、半田17を付ける範囲を限定でき、半田17が余計な範囲にまで及ぶことはない。さらに、口金2の上部にフランジ部12が形成されることにより、半田17が接触する面積が大きく確保される。これらの構成により、LEDランプ1は、LED基板4と口金2とを連結する半田17の連結力を十分に確保できる。   Further, when the LED substrate 4 is fixed to the base 2 with the solder 17, since the concave portion 23 is formed in the protruding portion 4 b of the LED substrate 4, the solder 17 easily stays in the concave portion 23. Moreover, the range to which the solder 17 is applied can be limited by the recess 23, and the solder 17 does not reach an excessive range. Furthermore, since the flange portion 12 is formed on the upper portion of the base 2, a large area for contact with the solder 17 is ensured. With these configurations, the LED lamp 1 can sufficiently secure the connecting force of the solder 17 that connects the LED substrate 4 and the base 2.

さらに、LED基板4に形成される伝熱パターン15は、凹部23に形成される連結部16を介してLED基板4の両面に形成されていることから、LED基板4の両面の伝熱パターン15を伝わる熱が、半田17を介して口金2に同時に伝達されることとなる。これによっても、LEDランプ1は効率の良い放熱を行うことができる。   Furthermore, since the heat transfer patterns 15 formed on the LED substrate 4 are formed on both surfaces of the LED substrate 4 via the connecting portions 16 formed in the recesses 23, the heat transfer patterns 15 on both surfaces of the LED substrate 4. Is transmitted to the base 2 through the solder 17 at the same time. Also by this, the LED lamp 1 can perform efficient heat dissipation.

また、口金2と連結部材7の本体部31との間に連通口14が形成されていることから、この連通口14を通じて空気の対流による放熱も可能になる。   Further, since the communication port 14 is formed between the base 2 and the main body portion 31 of the connecting member 7, heat can be radiated by convection of air through the communication port 14.

また、口金2の外部から貫通孔42を形成するだけで、連結部材7と口金2とを連結することができることから、LEDランプ1は、組み立てにおける作業性が良いものとなる。   Further, since the connecting member 7 and the base 2 can be connected only by forming the through hole 42 from the outside of the base 2, the LED lamp 1 has good workability in assembly.

なお、本発明は上記の実施形態に限定されず、種々の変更・変形が可能である。   In addition, this invention is not limited to said embodiment, A various change and deformation | transformation are possible.

例えば、上記実施形態では、口金2の上部にフランジ部12が形成された例を示したが、これに限らず、口金2の上部にフランジ部12を形成しなくてもよい。   For example, in the above-described embodiment, an example in which the flange portion 12 is formed on the upper portion of the base 2 has been described. However, the present invention is not limited thereto, and the flange portion 12 may not be formed on the upper portion of the base 2.

上記の実施形態では、LED基板4の突出部4bに凹部23が形成された例を示したが、これに限らず、突出部4bに凹部23を形成することなく、この突出部4bの先端と口金2の外面とを半田17によって連結してもよい。   In the above-described embodiment, the example in which the concave portion 23 is formed in the protruding portion 4b of the LED substrate 4 is shown. However, the present invention is not limited to this, and the tip of the protruding portion 4b is not formed without forming the concave portion 23 in the protruding portion 4b. The outer surface of the base 2 may be connected by solder 17.

上記の実施形態では、半田17によってLED基板4と口金2の外面とを連結した例を示したが、これに限らず、金属片をLED基板4と口金2の外面とに接触させた状態で接着剤等の手段によって固定するようにしてもよい。   In the above embodiment, the example in which the LED substrate 4 and the outer surface of the base 2 are connected by the solder 17 has been shown. However, the present invention is not limited thereto, and the metal piece is in contact with the LED substrate 4 and the outer surface of the base 2. You may make it fix by means, such as an adhesive agent.

上記の実施形態では、口金2の外面に突起部13を形成し、この突起部13がソケット等の機器に保持されるように構成された例を示したが、これに限らず、例えば、口金2の外周面に雄ネジ部を形成し、この雄ネジ部がソケット等の機器の雌ねじ部に螺合されるような構成を採用できる。   In the above embodiment, the projection 13 is formed on the outer surface of the base 2 and the projection 13 is held by a device such as a socket. However, the present invention is not limited to this. It is possible to adopt a configuration in which a male screw portion is formed on the outer peripheral surface of the two and this male screw portion is screwed into a female screw portion of a device such as a socket.

上記の実施形態では、口金2の底部に2つの端子部11が形成された例を示したが、これに限らず、口金2の底部に1つの端子部11を設け、口金2の側壁部が他の端子となるようにした構成を採用してもよい。   In the above embodiment, the example in which the two terminal portions 11 are formed on the bottom portion of the base 2 has been shown. However, the present invention is not limited thereto, and one terminal portion 11 is provided on the bottom portion of the base 2, and the side wall portion of the base 2 is You may employ | adopt the structure made to become another terminal.

本発明に係るLEDランプは、いわゆるウェッジ電球タイプのものにも対応可能である。この場合、口金2は、円筒状ではなく、LED電球の基部の形状に対応して、扁平な形の筒形状に構成される。   The LED lamp according to the present invention is also applicable to a so-called wedge bulb type. In this case, the base 2 is not cylindrical, but is formed in a flat cylindrical shape corresponding to the shape of the base of the LED bulb.

1…LEDランプ、2…口金、3…LED素子、4…LED基板、4a…中央部、4b…突出部、5…制御基板、5a…突起部、6…レンズ部材、7…連結部材、11…端子部、12…フランジ部、13…突起部、14…連通口、15…伝熱パターン、16…連結部、17…半田、19…ICチップ、20…電極、21…レンズ部、21a…凹部、22…連結部、23…凹部、24…突起部、31…本体部、32a〜32d…突出部、33…突起部、34…凹部、34a…側縁部、35…突起部、36…孔、41…工具、42…貫通孔、43…突起部   DESCRIPTION OF SYMBOLS 1 ... LED lamp, 2 ... Base, 3 ... LED element, 4 ... LED board, 4a ... Center part, 4b ... Projection part, 5 ... Control board, 5a ... Projection part, 6 ... Lens member, 7 ... Connection member, 11 ... Terminal part, 12 ... Flange part, 13 ... Projection part, 14 ... Communication port, 15 ... Heat transfer pattern, 16 ... Connection part, 17 ... Solder, 19 ... IC chip, 20 ... Electrode, 21 ... Lens part, 21a ... Recessed part, 22 ... Connection part, 23 ... Recessed part, 24 ... Projection part, 31 ... Main body part, 32a to 32d ... Projection part, 33 ... Projection part, 34 ... Recessed part, 34a ... Side edge part, 35 ... Projection part, 36 ... Hole 41 ... Tool 42 ... Through hole 43 ... Projection

Claims (3)

端子部を有する口金と、レンズ部材と、口金及びレンズ部材を連結する連結部材と、LED素子が設けられるLED基板とを有し、少なくとも口金と連結部材とによってLED基板が収納される収納空間が形成されるLEDランプであって、
口金と連結部材との間には、収納空間と外部の空間とを連通する連通口が形成され、この連通口からLED基板の一部が外部に突出するとともに、口金の外面と前記LED基板の一部とを熱伝導性部材で連結してなることを特徴とするLEDランプ。
There is a base having a terminal portion, a lens member, a connecting member that connects the base and the lens member, and an LED substrate on which the LED element is provided, and a storage space in which the LED substrate is stored by at least the base and the connecting member. An LED lamp formed,
A communication port is formed between the base and the connecting member so as to communicate the storage space and the external space. A part of the LED substrate protrudes from the communication port, and the outer surface of the base and the LED substrate are connected to each other. An LED lamp characterized in that a part thereof is connected by a heat conductive member.
前記熱伝導性部材は金属である請求項1に記載のLEDランプ。   The LED lamp according to claim 1, wherein the heat conductive member is a metal. 前記連結部材は、口金の内部に挿入されるとともにこの口金の壁部と重なるように突出する突出部を有し、
この突出部は、板状に構成されるとともに、板厚方向に貫通する貫通孔を有し、
口金は、その外面から内面に向かって壁部を貫通する孔を有し、この孔は、その縁部に形成される突起部を有しており、
口金の突起部が連結部材の突出部に形成される孔に挿通されることで、連結部材と口金が連結されてなる請求項1または2に記載のLEDランプ。
The connecting member has a protrusion that is inserted into the base and protrudes so as to overlap the wall of the base;
The projecting portion is configured in a plate shape and has a through hole penetrating in the plate thickness direction.
The base has a hole penetrating the wall portion from the outer surface toward the inner surface, and the hole has a protrusion formed on the edge thereof,
3. The LED lamp according to claim 1, wherein the protrusion of the base is inserted into a hole formed in the protruding portion of the connecting member so that the connecting member and the base are connected.
JP2011132939A 2011-06-15 2011-06-15 LED lamp Expired - Fee Related JP5298162B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011132939A JP5298162B2 (en) 2011-06-15 2011-06-15 LED lamp

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011132939A JP5298162B2 (en) 2011-06-15 2011-06-15 LED lamp

Publications (2)

Publication Number Publication Date
JP2013004248A true JP2013004248A (en) 2013-01-07
JP5298162B2 JP5298162B2 (en) 2013-09-25

Family

ID=47672640

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011132939A Expired - Fee Related JP5298162B2 (en) 2011-06-15 2011-06-15 LED lamp

Country Status (1)

Country Link
JP (1) JP5298162B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014207103A (en) * 2013-04-11 2014-10-30 サイキット株式会社 Luminaire with light emitter and base
US9348548B2 (en) 2013-11-01 2016-05-24 Seiko Epson Corporation Print control system
US9542133B2 (en) 2013-11-01 2017-01-10 Seiko Epson Corporation Print control system and print control method
JP7091655B2 (en) 2017-12-26 2022-06-28 東芝ライテック株式会社 Vehicle lighting equipment

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6099710U (en) * 1983-12-14 1985-07-08 松下電工株式会社 fluorescent light fixtures
JPS6454224U (en) * 1987-09-25 1989-04-04
JPH0742194U (en) * 1993-12-21 1995-07-21 株式会社富士通ゼネラル Shield plate mounting structure
JP2004165053A (en) * 2002-11-14 2004-06-10 Matsushita Electric Ind Co Ltd Circuit integrated discharge tube, and manufacturing method of same
JP2008204665A (en) * 2007-02-16 2008-09-04 Xikit Inc Illumination device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6099710U (en) * 1983-12-14 1985-07-08 松下電工株式会社 fluorescent light fixtures
JPS6454224U (en) * 1987-09-25 1989-04-04
JPH0742194U (en) * 1993-12-21 1995-07-21 株式会社富士通ゼネラル Shield plate mounting structure
JP2004165053A (en) * 2002-11-14 2004-06-10 Matsushita Electric Ind Co Ltd Circuit integrated discharge tube, and manufacturing method of same
JP2008204665A (en) * 2007-02-16 2008-09-04 Xikit Inc Illumination device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014207103A (en) * 2013-04-11 2014-10-30 サイキット株式会社 Luminaire with light emitter and base
US9348548B2 (en) 2013-11-01 2016-05-24 Seiko Epson Corporation Print control system
US9542133B2 (en) 2013-11-01 2017-01-10 Seiko Epson Corporation Print control system and print control method
US9804809B2 (en) 2013-11-01 2017-10-31 Seiko Epson Corporation Print control system
US10091388B2 (en) 2013-11-01 2018-10-02 Seiko Epson Corporation Print control system and print control method
JP7091655B2 (en) 2017-12-26 2022-06-28 東芝ライテック株式会社 Vehicle lighting equipment

Also Published As

Publication number Publication date
JP5298162B2 (en) 2013-09-25

Similar Documents

Publication Publication Date Title
JP4612120B2 (en) Light bulb shaped lamp and lighting device
JP2011530788A (en) LED module
JP5298162B2 (en) LED lamp
JP2014154230A (en) Lamp device, light-emitting device, and lighting device
JP6837059B2 (en) LED bulb assembly and methods for manufacturing it
EP3172481B1 (en) Rotationally adjustable lamp and manufacturing method
JP2014222625A (en) Lamp
JP2017183220A (en) Luminaire
JP2012119230A (en) Led lamp and led lighting device
JPWO2016060069A1 (en) Semiconductor laser equipment
JP2014137897A (en) Lamp
JP2012044176A (en) Light-emitting diode lamp
JP6171215B2 (en) LED lamp
JP5777530B2 (en) lighting equipment
JP2013073696A (en) Light source unit, light source device, and lighting fixture using light source device
JP6819442B2 (en) Light emitting unit
JP2011040188A (en) Vehicle lamp
JP2017183221A (en) Lighting device
JP2014229394A (en) Lamp
JP6979771B2 (en) Lighting equipment and lighting equipment
JP2022133237A (en) Lighting device having mounting guide structure
JP5822068B2 (en) Lighting device
JP6183644B2 (en) LED bulb
EP2896873A1 (en) Lamp
WO2017068739A1 (en) Semiconductor light emitting element holder and semiconductor light emitting element module

Legal Events

Date Code Title Description
A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20130524

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20130531

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20130617

R150 Certificate of patent or registration of utility model

Ref document number: 5298162

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees