JP2013000806A - Method for manufacturing liquid-filled package of microstructure - Google Patents

Method for manufacturing liquid-filled package of microstructure Download PDF

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JP2013000806A
JP2013000806A JP2011131078A JP2011131078A JP2013000806A JP 2013000806 A JP2013000806 A JP 2013000806A JP 2011131078 A JP2011131078 A JP 2011131078A JP 2011131078 A JP2011131078 A JP 2011131078A JP 2013000806 A JP2013000806 A JP 2013000806A
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liquid
film
fine
package
substrate
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JP5647077B2 (en
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Kazuhiko Takakawara
和彦 高河原
Hiroshi Kuwabara
啓 桑原
Yasuhiro Sato
康博 佐藤
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Nippon Telegr & Teleph Corp <Ntt>
日本電信電話株式会社
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Abstract

Disclosed is a method for manufacturing a liquid-sealed package of a microstructure that can reduce manufacturing costs.
By covering at least a part of a microstructure 2 formed on a substrate 1 with a liquid 3 and forming a sealing film 4 that covers at least the surface of the liquid 3, Manufacture liquid-filled packages. Thereby, it is not necessary to handle the liquid 3 in a low-pressure environment, and as a result, the manufacturing process is simplified and the manufacturing cost can be reduced.
[Selection] Figure 1

Description

  The present invention relates to a method for manufacturing a liquid-sealed package of a microstructure.

  Microstructures such as micro electrical elements and micro electro mechanical systems (MEMS) generally block the entry of outside air in order to prevent performance degradation due to oxidation of components and adhesion of dust in the atmosphere. It is provided in a state of being hermetically sealed in the package. Among them, a microstructure provided in a liquid sealed package in which a liquid is put in the package has been proposed (see, for example, Patent Document 1).

  For example, a package structure enclosing a liquid proposed in Patent Document 1 includes a substrate on which a fine structure is formed, a substrate disposed on the substrate, surrounding the fine structure, and partially having cracks. And a cover plate covering the upper part of the coupling ring. In this package, an inner space is formed by the upper surface of the substrate, the inner periphery of the coupling ring, and the lower surface of the cover plate, and a crack in the coupling ring serves as an inlet that communicates with the inner space.

  In such a package, the liquid is filled in the following procedure.

  First, the package is placed in a low-pressure environment, and a sufficient amount of liquid is disposed to fill the internal space in and around the inlet. Next, the pressure around the package is increased. Then, since the internal space of the package is still in a low pressure state, the liquid enters the internal space from the injection port due to the pressure difference between the internal space and its surroundings. As a result, the liquid is introduced into the internal space.

JP 2005-34987 A

Nguyen Binh-Khiem, Kiyoshi Matsumoto, and Lsao Shimoyama, Polymer thin film deposited on liquid for varifocal encapsulated liquid lenses, APPLIED PHYSICS LETTERS 93, 124101 (2008) Takamatsu Seiichi, Takano Naotonori, Nguyen Bin Kim, Eiwase Eiji, Matsumoto Kiyoshi, Shimoyama Isao, Glucose Oxidase Sealing Method Using Ionic Liquid and Parylene Direct Deposition, Electrology E, Vol. 130, No. 12, 562-569, 2010 Piu Francis Man, Bishnu P. Gogoi, and Carlos H. Mastrangelo, Elimination of Post-Release Adhesion in Microstructures Using Conformal Fluorocarbon Coatings, JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, VOL.6, NO.1, P.25-34, MARCH 1997

  However, since the liquid sealed package as described above handles the liquid in a low pressure environment, the manufacturing process is complicated and the manufacturing cost is high.

  Further, in the liquid sealed package as described above, when the temperature environment changes, the internal pressure of the internal space increases or decreases according to the difference between the thermal expansion coefficient of the package and the thermal expansion coefficient of the liquid filled in the internal space. As a result, stress may occur in the components of the package. At this time, if the stress exceeds the breaking stress of the component, the liquid-sealed package structure may be damaged and the liquid may leak, thereby impairing the function of the fine structure.

  SUMMARY OF THE INVENTION Accordingly, a first object of the present invention is to provide a manufacturing method of a fine structure liquid sealed package that can reduce manufacturing costs.

  The second object of the present invention is to provide a method for manufacturing a liquid-sealed package that can prevent breakage.

  In order to solve the above-described problems, a manufacturing method of a liquid-sealed package of a microstructure according to the present invention includes a coating step of coating at least a part of a microstructure formed on a substrate with a liquid, And a sealing film forming step of forming a sealing film for covering the liquid surface and sealing the liquid.

  In the method for manufacturing a liquid-encapsulated package of the fine structure, the liquid is coated with the liquid before the covering step, and at least a part of the fine structure and a part of the region on the substrate have an affinity for the liquid. A lyophilic film forming step for forming a lyophilic film, and forming a lyophobic film having no affinity for the liquid in a region on the substrate where the lyophilic film is not formed You may make it have a step further.

  The method for manufacturing a liquid-sealed package of a fine structure may further include a sealing film removing step for removing a part of the sealing film covering the surface of the fine structure.

  The method for manufacturing a liquid-encapsulated package for a fine structure may further include a metal thin film forming step for forming a metal thin film on at least a part of the surface of the sealing film.

  Further, in the method for manufacturing a liquid-sealed package of the fine structure, the sealing film may be made of an organic resin.

  In the method for manufacturing a liquid-encapsulated package of the fine structure, the sealing film may be an aromatic organic compound polymer such as organosilicon polymers, polyxylylenes, polyvinyl resin, polyimide resin, fluororesin, and polybenzoxazole. And at least one of the derivatives of substances included in this group.

  In the method for manufacturing a liquid-encapsulated package of the fine structure, the liquid may be composed of one of an ionic liquid and silicon oil.

  Further, in the method for manufacturing a liquid encapsulated package of the fine structure, the liquid may be composed of one of silicon oils, fluoroethers, fluorocarbons, and pure water.

  According to the present invention, at least a part of a microstructure formed on a substrate is covered with a liquid, and a sealing film that covers at least the surface of the liquid is formed to manufacture a liquid-sealed package of the microstructure. Therefore, it is not necessary to handle the liquid in a low-pressure environment, and as a result, the manufacturing process becomes simple and the manufacturing cost can be reduced.

  Further, according to the present invention, since the flexible organic resin is used as the sealing film, the sealing film relieves stress even when stress is generated in the material constituting the package. Can be prevented from being damaged.

FIG. 1 is a plan view schematically showing a fine structure liquid-sealed package according to an embodiment of the present invention. 2 is a cross-sectional view taken along the line II of FIG. FIG. 3A is a diagram for explaining a method for manufacturing a liquid-encapsulated package of a fine structure according to an embodiment of the present invention. FIG. 3B is a diagram for explaining a method for manufacturing the liquid sealed package of the microstructure according to the embodiment of the present invention. FIG. 3C is a diagram for explaining a manufacturing method of the liquid-encapsulated package of the microstructure according to the embodiment of the present invention. FIG. 3D is a view for explaining a method for manufacturing the liquid sealed package of the microstructure according to the embodiment of the present invention. FIG. 3E is a view for explaining a method for manufacturing the liquid-encapsulated package of the microstructure according to the embodiment of the present invention. FIG. 3F is a view for explaining the method for manufacturing the liquid-encapsulated package of the microstructure according to the embodiment of the present invention. FIG. 4A is a diagram for explaining a liquid arrangement method in the manufacturing method of the liquid-sealed package of the microstructure according to the embodiment of the present invention. FIG. 4B is a diagram for explaining a liquid arrangement method in the manufacturing method of the liquid-encapsulated package of the microstructure according to the embodiment of the present invention. FIG. 4C is a diagram for explaining a liquid arrangement method in the manufacturing method of the liquid-encapsulated package of the microstructure according to the embodiment of the present invention. FIG. 5 is a diagram showing a modification of the arrangement of the fine structures on the substrate in the method for manufacturing the liquid-sealed package of fine structures according to the embodiment of the present invention. FIG. 6 is a view showing a modification of the arrangement of the fine structures on the substrate in the method for manufacturing the liquid-sealed package of fine structures according to the embodiment of the present invention. FIG. 7A is a diagram for explaining a method of arranging a liquid with respect to the modification shown in FIG. FIG. 7B is a diagram for explaining a method of arranging the liquid in the modification shown in FIG. FIG. 7C is a diagram for explaining a method of arranging the liquid in the modification shown in FIG.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

[Configuration of liquid-sealed package]
As shown in FIGS. 1 and 2, the liquid-sealed package of the fine structure according to the present embodiment includes a substrate 1, a fine structure 2 formed on the upper surface of the substrate 1, and the fine structure 2. A liquid 3 that covers a part and the surrounding substrate 1, a sealing film 4 that covers at least the surface of the liquid 3, and a metal film 5 that covers a part of the sealing film 4 are provided. Further, a lyophilic film 6 is formed on the surface of the substrate 1 and the fine structure 2 covered with the liquid 3, and a liquid repellent film 7 is formed on the surface of the substrate 1 and the fine structure 2 not covered with the liquid 3. Is formed.

  The substrate 1 is made of a material capable of forming a fine structure on its surface, such as a silicon substrate, a silicon substrate having an oxide film formed on its surface, an SOI (Silicon On Insulator) substrate, an alumina substrate, or a glass substrate.

  The fine structure 2 is composed of a structure made of metal or the like, and is formed by a known LSI (Large Scale Integration) manufacturing technique or micromachining technique. In the present embodiment, the microstructure 2 is erected from a rod-shaped base member 21 formed on the substrate 1, an electrode member 22 provided at one end of the base member 21, and the other end of the base member 21. The rod-shaped column member 23 is formed, and a rod-shaped beam member 24 having one end connected to the upper end of the column member 23 and extending along the planar direction of the substrate 1. Among these, the lyophilic film 6 is formed on the surface of the base member 21 in the vicinity of the column member 23, the column member 23, and the beam member 24. A liquid repellent film 7 is formed in the vicinity of the electrode member 22 of the base member 21. The electrode member 22 has a surface exposed. In addition to the above-described components, other members such as wiring and electrode pads may be provided as the fine structure 2. For example, a switch can be configured by providing wiring below the other end of the beam member 24 and providing an electrode for operating the beam member 24 in the vertical direction on the lower surface or side portion of the beam member. is there.

  The liquid 3 is disposed in a region where the lyophilic film 6 is provided, and is made of a liquid such as water, ionic liquids, silicon oils, fluoroethers, or fluorocarbons.

  The sealing film 4 is made of a flexible material, and is disposed over the entire top surface of the substrate 1. Further, the sealing film 4 contacts the liquid repellent film 7 disposed on the substrate 1 and also contacts the liquid 3 disposed in the region where the lyophilic film 6 is provided. Sealed on top. Further, the sealing film 4 is formed with an opening 41 for exposing the electrode member 22 of the fine structure 2 in a part thereof. Such a sealing film 4 is composed of various organic resins, in particular, organosilicon polymers such as polysiloxanes and polysilanes, polyxylylenes, polyvinyl resins, polyimide resins, fluororesins, and polybenzoxazoles. It is desirable to be composed of at least one of the group consisting of the above-mentioned aromatic organic compound polymers and derivatives of substances included in this group. The material of the sealing film 4 is not limited by the polarity of the liquid 3 and can be appropriately selected from various organic resins as described above (for example, see Non-Patent Documents 1 and 2).

  The metal film 5 is disposed on the upper surface of the region of the sealing film 4 that is in contact with the liquid 3. Such a metal film 5 is composed of a thin film of metal such as gold, titanium, or aluminum.

The lyophilic film 6 is made of a material having an affinity for the liquid 3 and is provided in a region where the liquid 3 is to be disposed, such as a part of the fine structure 2 and the upper surface of the substrate 1 around the fine structure 2. The material of such a lyophilic film 6 is set according to the polarity of the liquid 3. For example, when the liquid 3 has a polarity such as pure water, a material having affinity with a liquid having polarity, such as a SiO 2 film, is used. On the other hand, when the liquid 3 is nonpolar, such as silicon oil, self-assembled monomolecules such as octadecylsiloxane film (ODS film: Octa Decyl Siloxane), trimethylsiloxane film (TMS film: Tri Methyl Siloxane), etc. A material having an affinity for a nonpolar liquid such as a film (SAM film: Self-Assembled Monolayer) is used. In the present embodiment, a case where pure water is used as the liquid 3 and SiO 2 is used as the lyophilic film 6 will be described as an example.

The liquid repellent film 7 is provided in a region where the lyophilic film 6 is not disposed and is made of a material having no affinity with the liquid 3. As the material of the liquid repellent film 7, when the liquid 3 has a polarity, a material having no affinity with a polar liquid such as a SAM film is used, and when the liquid 3 is nonpolar, for example. For example, a material having no affinity with a nonpolar liquid such as a SiO 2 thin film is used. Furthermore, polytetrafluoroethylene may be used as a material that exhibits liquid repellency regardless of the polarity of the liquid 3. In the present embodiment, a case where a SAM film is used as the liquid repellent film 7 will be described as an example.

[Manufacturing method of liquid sealed package]
Next, with reference to FIGS. 3A to 4C, a method for manufacturing the liquid sealed package according to the present embodiment will be described.

  First, the substrate 1 is prepared, and the fine structure 2 is formed on the upper surface of the substrate 1 as shown in FIG. 3A. The fine structure 2 is formed by a known LSI manufacturing technique or micromachining technique.

  After forming the fine structure 2, as shown in FIG. 3B, a lyophilic film 6 is formed on a part of the fine structure 2 and the substrate 1 around the fine structure 2, and the lyophilic film 6 is formed. A liquid repellent film 7 is formed in a region on the substrate 1 other than the above.

In the present embodiment, since pure water having polarity is used as the liquid 3, an SiO 2 thin film having affinity for pure water is formed as the lyophilic film 6. This SiO 2 thin film can be formed, for example, by a known plasma CVD method and photolithography technique (see, for example, Non-Patent Document 3). As a specific example, a SiO 2 thin film is first formed on the entire upper surface of the substrate 1 and the microstructure 2 by plasma CVD using tetraethoxysilane (TEOS), and then a resist material is applied on the SiO 2 thin film. By applying and exposing the resist material using a mask having a desired pattern, a resist pattern having openings at desired positions is formed. Then, after removing the SiO 2 thin film exposed from the opening of the resist pattern, for example, by wet etching using hydrofluoric acid, the resist pattern is removed. By this, the SiO 2 thin film is formed at a desired position.

  On the other hand, as the liquid repellent film 7, since pure water having polarity is used as the liquid 3, a SAM film having no affinity for pure water is formed. This SAM film can be formed by, for example, a known photolithography technique and vapor deposition method. As a specific example, first, a resist material is applied onto the substrate 1 and the fine structure 2, and an opening is formed at a desired position by exposing the resist material using a mask having a desired pattern. A resist pattern is formed. Hexamethyldisilazane (HMDS: Hexamethyldisilazane) is put in a sealed container together with the substrate 1 provided with this resist pattern, and the substrate 1 and the fine structure exposed from the opening of the photoresist by heating and vapor-depositing HMDS. After the TMS film is formed on the surface of the body 2, the resist pattern is removed. As a result, a SAM film made of a TMS film is formed at a desired location.

  After forming the lyophilic film 6 and the lyophobic film 7, the liquid 3 is disposed on the lyophilic film 6 as shown in FIG. 3C. The amount of the liquid 3 is sufficient to cover the entire region of the substrate 1 and the fine structure 2 on which the lyophilic film 6 is formed. The arrangement of the liquid 3 can be realized by various methods. For example, as shown in FIG. 4A, the substrate 1 on which the lyophilic film 6 and the lyophobic film 7 are formed can be performed by immersing the substrate 1 in the liquid 3 and then pulling it up. Also, as shown in FIG. 4B, the liquid 3 is held in the carrier 10 composed of pins, capillaries, nozzles, etc., and the carrier 10 is moved to the vicinity of the lyophilic film 6 so that the liquid 3 is transferred to the lyophilic film 6. It can also be carried out by contact. Furthermore, as shown in FIG. 4C, the carrier 10 can be moved above the lyophilic film 6, and the liquid 3 can be dropped from here toward the lyophilic film 6.

  When the liquid 3 is disposed, as shown in FIG. 3D, an organosilicon polymer precursor of polysiloxane is applied to the upper surface of the substrate 1 on which the liquid 3 and the liquid repellent film 7 are disposed, and then cured, thereby sealing film 4 is formed. In addition, in this Embodiment, although the sealing film 4 is formed over the whole board | substrate 1, what is necessary is just to cover the surface of the liquid 3 at least.

  When the sealing film 4 is formed, an opening 41 is formed in the sealing film 4 to expose the electrode member 22 of the microstructure 2 as shown in FIG. 3E. The opening 41 is formed by, for example, depositing a hard mask made of, for example, aluminum on the surface of the sealing film 4 excluding the opening 41 by a vapor deposition method using a stencil mask, and then performing a wet etching method using an appropriate agent. Alternatively, it is formed by a gas plasma etching method. At this time, the liquid repellent film 7 inside the opening 41 is also removed together with the sealing film 4.

When the opening 41 is formed, a metal film 5 that covers a part of the surface of the sealing film 4 is formed as shown in FIG. 3F. The metal film 5 is formed by a vapor deposition method using a stencil.
Thereby, a liquid sealed package in which the fine structure 2 is covered with the liquid 3 is generated.

  As described above, in the present embodiment, at least a part of the microstructure 2 formed on the substrate 1 is covered with the liquid 3, and the sealing film 4 that covers at least the surface of the liquid 3 is formed. As a result, since the liquid-sealed package of the fine structure 2 is manufactured, it is not necessary to handle the liquid 3 in a low-pressure environment, and as a result, the manufacturing process becomes simple and the manufacturing cost can be reduced.

  In the present embodiment, the affinity between the substrate 1 and the fine structure 2 and the liquid 3 in the region is formed by forming the lyophilic film 6 in the region where the liquid 3 of the substrate 1 and the fine structure 2 is disposed. Since the property increases, the region where the liquid 3 is to be disposed can be easily covered with the liquid 3. Further, by forming the lyophilic film 6 not only on the fine structure 2 in which the liquid 3 is disposed but also on the substrate 1 around the fine structure 2, the liquid 3 is easily collected around the fine structure 2. As a result, the fine structure 2 on which the liquid 3 is to be disposed can be easily covered with the liquid 3.

  In the present embodiment, since the liquid repellent film 7 is formed in the region where the liquid 3 is not disposed in the substrate 1 and the fine structure 2, the affinity with the liquid 3 is reduced in that region. Since it is difficult to stay in the region and moves to the region where the lyophilic film 6 is formed, as a result, the region of the fine structure 2 where the liquid 3 is to be disposed can be easily covered with the liquid 3.

In the present embodiment, the case where the liquid 3 is composed of pure water has been described as an example. However, for example, the liquid 3 may be composed of ionic liquids, silicon oils, fluoroethers, fluorocarbons, and the like. Good.
Here, since ionic liquids and silicon oils have a low vapor pressure, when used as the liquid 3, the amount of reduction of the liquid 3 due to evaporation during the manufacturing process of the liquid sealed package structure can be reduced. Thereby, since management of the liquid amount of the liquid 3 becomes unnecessary, as a result, the liquid sealed package structure can be manufactured more easily.
Silicon oils, fluoroethers, fluorocarbons, and pure water are all highly insulating liquids. Therefore, when the liquid 3 is made of the material, the liquid-encapsulated package structure can be manufactured without hindering the electrical operation of the fine structure.

  In the present embodiment, since the organic resin having high flexibility such as organosilicon polymer made of polysiloxane is used as the sealing film 4, even when stress is generated in the material constituting the package. Since the sealing film 4 relieves stress, the package can be prevented from being damaged. In the present embodiment, the case where the sealing film 4 is formed by applying the precursor and then curing is described as an example, but the method of forming the sealing film 4 is not limited to this. For example, it may be formed by chemical vapor deposition, laser ablation, air spray, or the like.

  In this embodiment, the case where polysiloxanes are used as the sealing film 4 has been described as an example. However, if the organic resin is rich in flexibility, for example, organosilicon polymers such as polysilanes are used. The sealing film 4 may be made of an aromatic organic compound polymer such as polyxylylenes, polyvinyl resin, polyimide resin, fluororesin, polybenzoxazole, or the like. Since these materials can be formed at a low temperature among organic resins, it is possible to prevent the fine structure 2 from being affected by heat. In addition, since these materials all have excellent gas barrier properties, it is possible to prevent the penetration of gas into the package and the deterioration of the microstructure 2 due to the gas that has penetrated into the package. Furthermore, since these materials are chemically stable, they can maintain their excellent properties over a long period of time.

  Moreover, in this Embodiment, the opening part 41 is formed by removing a part of area | region which is not contacting the liquid 3 of the sealing film 4, and the electrode member 22 of the microstructure 2 is exposed. Thereby, in the fine structure 2, the electrical signal can be easily exchanged between the inside and the outside of the liquid sealed package.

  Further, in the present embodiment, by forming the metal film 5 that covers at least a part of the surface of the sealing film 4, it is possible to more effectively prevent the influence of the outside air on the fine structure 2.

In the present embodiment, the case where one fine structure 2 is provided on one substrate 1 has been described, but the number of fine structures 2 formed on one substrate 1 is one. It is not limited and can be set freely as appropriate. For example, as shown in FIG. 5, a plurality of fine structures 2 may be provided in an array on a single substrate 1, and a liquid sealed package equivalent to that described above may be formed on each.
In the present embodiment, the case where one fine structure 2 is covered with the liquid 3 has been described as an example. However, the number of the fine structures 2 covered with the liquid 3 is not limited to one, and can be freely set as appropriate. Can be set. For example, as shown in FIG. 6, the two microstructures 2 may be simultaneously covered with the liquid 3.

  Here, when the microstructures 2 are formed in an array on the substrate 1, the arrangement of the liquid 3 in the manufacturing method is, for example, after the substrate 1 is immersed in the liquid 3 as shown in FIG. 7A. This can be done by pulling up. Further, as shown in FIG. 7B, the liquid 3 is held in a plurality of carriers 10 arranged in an array corresponding to the arrangement of the fine structures 2, and the carriers 10 are moved to the vicinity of the lyophilic film 6 so that the liquid 3 can also be carried out by contacting the lyophilic film 6. Furthermore, as shown in FIG. 4C, the support 10 arranged in the array can be moved above the lyophilic film 6, and the liquid 3 can be dropped from here toward the lyophilic film 6.

  In the present embodiment, the case where the lyophilic film 6 and the lyophobic film 7 are formed after the fine structure 2 is formed has been described as an example. However, the lyophilic film 6 and the lyophobic film formed on the surface of the substrate 1 are described. 7 may be formed before the fine structure 2 is formed.

  In this embodiment, the case where the lyophobic film 7 is formed after the lyophilic film 6 is formed has been described as an example. However, the lyophilic film 6 may be formed after the lyophobic film 7 is formed. Good.

In the present embodiment, the case where pure water having polarity is used as the liquid 3 has been described as an example. However, a nonpolar material such as silicon oil may be used as the liquid 3. In this case, the lyophilic film 6 is formed of a material having affinity for a nonpolar liquid such as a SAM film. The liquid repellent film 7 is formed of a material that does not have an affinity for a nonpolar liquid such as a SiO 2 thin film. The SAM film and the SiO 2 thin film are formed by the same method as in the case where the SAM film is formed as the liquid repellent film 7 and the case where the SiO 2 thin film is formed as the lyophilic film 6 described above. be able to.

  Further, as the liquid repellent film 7, a material having no affinity for the liquid 3 regardless of the polarity of the liquid 3 may be used. In this case, for example, a resist pattern in which an opening is formed at a desired location is formed on the substrate 1 and the fine structure 2 by a known photolithography technique, and a polycrystal is formed in the opening of the resist pattern by an air spray method. After forming a tetrafluoroethylene (PTFE) thin film, the resist pattern is removed by a lift-off method. Thereby, a PTFE thin film having no affinity for the liquid 3 can be formed at a desired location regardless of the polarity of the liquid 3.

  The present invention can be applied to a microelectric element, a MEMS element, and the like provided by being enclosed in a package.

  DESCRIPTION OF SYMBOLS 1 ... Substrate, 2 ... Fine structure, 3 ... Liquid, 4 ... Sealing film, 5 ... Metal film, 6 ... Lipophilic film, 7 ... Liquid repellent film, 10 ... Carrier, 21 ... Base member, 22 ... Electrode member , 23 ... pillar members, 24 ... beam members, 41 ... openings.

Claims (8)

  1. A coating step of coating at least a portion of the microstructure formed on the substrate with a liquid;
    And a sealing film forming step for forming a sealing film for sealing the liquid by covering at least the surface of the liquid.
  2. In the manufacturing method of the liquid enclosure package of the fine structure according to claim 1,
    Before the coating step,
    A lyophilic film forming step of forming a lyophilic film having affinity for the liquid in at least a part of the fine structure and a part of the substrate covered with the liquid;
    And a liquid repellent film forming step of forming a liquid repellent film having no affinity for the liquid in a region on the substrate where the lyophilic film is not formed. Package manufacturing method.
  3. In the manufacturing method of the liquid enclosure package of the fine structure according to claim 1 or 2,
    A method for producing a liquid-sealed package of a fine structure, further comprising: a sealing film removing step of removing a part of the sealing film covering a surface of the fine structure.
  4. In the manufacturing method of the liquid enclosure package of the fine structure according to any one of claims 1 to 3,
    A method for producing a liquid-sealed package of a microstructure, further comprising a metal thin film forming step of forming a metal thin film on at least a part of the surface of the sealing film.
  5. In the manufacturing method of the liquid enclosure package of the fine structure according to any one of claims 1 to 4,
    The sealing film is made of an organic resin. A method for manufacturing a liquid-sealed package of a fine structure.
  6. In the manufacturing method of the liquid enclosure package of the fine structure according to any one of claims 1 to 5,
    The sealing film is composed of an organic silicon polymer, a polyxylylene, a polyvinyl resin, a polyimide resin, a fluororesin, a group of aromatic organic compounds such as polybenzoxazole, and a derivative of a substance included in this group It is comprised from at least 1 of these. The manufacturing method of the liquid enclosure package characterized by the above-mentioned.
  7. In the manufacturing method of the liquid enclosure package of the fine structure according to any one of claims 1 to 6,
    The liquid is composed of one of an ionic liquid and silicon oil.
  8. In the manufacturing method of the liquid enclosure package of the fine structure according to any one of claims 1 to 6,
    The liquid is composed of one of silicon oils, fluoroethers, fluorocarbons, and pure water.
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8008A (en) * 1851-04-01 hollingsworth
US10019A (en) * 1853-09-13 Improvement in the manufacture of plain and figured fabrics
JP2005034987A (en) * 2003-07-15 2005-02-10 Hewlett-Packard Development Co Lp Fluidic mems device
JP2008310126A (en) * 2007-06-15 2008-12-25 Univ Of Tokyo Microdevice for display

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8008A (en) * 1851-04-01 hollingsworth
US10019A (en) * 1853-09-13 Improvement in the manufacture of plain and figured fabrics
JP2005034987A (en) * 2003-07-15 2005-02-10 Hewlett-Packard Development Co Lp Fluidic mems device
JP2008310126A (en) * 2007-06-15 2008-12-25 Univ Of Tokyo Microdevice for display

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