JP2012502452A - 銅層処理 - Google Patents
銅層処理 Download PDFInfo
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- JP2012502452A JP2012502452A JP2011524972A JP2011524972A JP2012502452A JP 2012502452 A JP2012502452 A JP 2012502452A JP 2011524972 A JP2011524972 A JP 2011524972A JP 2011524972 A JP2011524972 A JP 2011524972A JP 2012502452 A JP2012502452 A JP 2012502452A
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- copper
- sulfur compound
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- copper layer
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- 239000010949 copper Substances 0.000 title claims abstract description 121
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 117
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 116
- 238000000034 method Methods 0.000 claims abstract description 61
- BWFPGXWASODCHM-UHFFFAOYSA-N copper monosulfide Chemical compound [Cu]=S BWFPGXWASODCHM-UHFFFAOYSA-N 0.000 claims abstract description 40
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 23
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims abstract description 21
- 229910052717 sulfur Inorganic materials 0.000 claims abstract description 21
- 239000011593 sulfur Substances 0.000 claims abstract description 21
- 239000007789 gas Substances 0.000 claims description 39
- 239000000758 substrate Substances 0.000 claims description 31
- 239000000460 chlorine Substances 0.000 claims description 20
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims description 15
- 229910052801 chlorine Inorganic materials 0.000 claims description 15
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 8
- MHKYLMHHWSWROQ-UHFFFAOYSA-N [O].[S].[Cu] Chemical compound [O].[S].[Cu] MHKYLMHHWSWROQ-UHFFFAOYSA-N 0.000 claims description 7
- 238000000151 deposition Methods 0.000 claims description 7
- 239000000203 mixture Substances 0.000 claims description 7
- 238000003672 processing method Methods 0.000 claims description 7
- 238000006243 chemical reaction Methods 0.000 claims description 6
- 239000008367 deionised water Substances 0.000 claims description 6
- 229910021641 deionized water Inorganic materials 0.000 claims description 6
- 239000011261 inert gas Substances 0.000 claims description 6
- 229910000365 copper sulfate Inorganic materials 0.000 claims description 4
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims description 4
- OMZSGWSJDCOLKM-UHFFFAOYSA-N copper(II) sulfide Chemical compound [S-2].[Cu+2] OMZSGWSJDCOLKM-UHFFFAOYSA-N 0.000 claims description 4
- 235000012239 silicon dioxide Nutrition 0.000 claims description 4
- 239000000377 silicon dioxide Substances 0.000 claims description 4
- 238000000059 patterning Methods 0.000 claims description 3
- 210000000232 gallbladder Anatomy 0.000 claims description 2
- 150000003464 sulfur compounds Chemical class 0.000 claims 4
- 230000001172 regenerating effect Effects 0.000 claims 1
- 239000010410 layer Substances 0.000 description 66
- 239000004065 semiconductor Substances 0.000 description 15
- 238000005530 etching Methods 0.000 description 13
- 230000008569 process Effects 0.000 description 13
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 9
- 239000001301 oxygen Substances 0.000 description 9
- 229910052760 oxygen Inorganic materials 0.000 description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 8
- 150000002500 ions Chemical class 0.000 description 8
- 229910052710 silicon Inorganic materials 0.000 description 8
- 239000010703 silicon Substances 0.000 description 8
- 238000001020 plasma etching Methods 0.000 description 7
- 238000009832 plasma treatment Methods 0.000 description 6
- 229910021591 Copper(I) chloride Inorganic materials 0.000 description 5
- OXBLHERUFWYNTN-UHFFFAOYSA-M copper(I) chloride Chemical compound [Cu]Cl OXBLHERUFWYNTN-UHFFFAOYSA-M 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 229920002120 photoresistant polymer Polymers 0.000 description 5
- 239000000523 sample Substances 0.000 description 5
- 239000003574 free electron Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 239000013068 control sample Substances 0.000 description 3
- -1 copper halides Chemical class 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 239000003989 dielectric material Substances 0.000 description 3
- 230000005684 electric field Effects 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 238000000231 atomic layer deposition Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- TXKMVPPZCYKFAC-UHFFFAOYSA-N disulfur monoxide Inorganic materials O=S=S TXKMVPPZCYKFAC-UHFFFAOYSA-N 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 238000001459 lithography Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- XTQHKBHJIVJGKJ-UHFFFAOYSA-N sulfur monoxide Chemical compound S=O XTQHKBHJIVJGKJ-UHFFFAOYSA-N 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 229910003902 SiCl 4 Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 150000001805 chlorine compounds Chemical class 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- FMWMEQINULDRBI-UHFFFAOYSA-L copper;sulfite Chemical compound [Cu+2].[O-]S([O-])=O FMWMEQINULDRBI-UHFFFAOYSA-L 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000003795 desorption Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000010849 ion bombardment Methods 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 230000002085 persistent effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000027756 respiratory electron transport chain Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- NVSDADJBGGUCLP-UHFFFAOYSA-N trisulfur Chemical compound S=S=S NVSDADJBGGUCLP-UHFFFAOYSA-N 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F4/00—Processes for removing metallic material from surfaces, not provided for in group C23F1/00 or C23F3/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3065—Plasma etching; Reactive-ion etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
- H01L21/32133—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only
- H01L21/32134—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by liquid etching only
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- Condensed Matter Physics & Semiconductors (AREA)
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- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Plasma & Fusion (AREA)
- Drying Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
- Manufacture And Refinement Of Metals (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
Abstract
【選択図】図1
Description
結論
Claims (29)
- 銅処理方法であって、
銅を硫黄を含むプラズマガスと反応させて銅硫黄化合物を形成することと、
水を用いて銅硫黄化合物の少なくとも一部を除去することと、を含む方法。 - 前記銅硫黄化合物が硫酸銅(CuSO4)である、請求項1に記載の方法。
- 前記銅硫黄化合物が硫化銅(CuxSx)である、請求項1に記載の方法。
- 前記プラズマガスが硫黄化合物および不活性ガスを含む、請求項1〜請求項3のいずれかに記載の方法。
- 前記プラズマガスが銅酸素硫黄化合物を含む、請求項1〜請求項3のいずれかに記載の方法。
- 前記プラズマガスがチャンバー内にて1000ワット(W)の電力供給を受ける、請求項1〜請求項3のいずれかに記載の方法。
- 前記プラズマガスが前記チャンバー内にて250Wの高周波数(RF)バイアス電源により120秒間電力供給を受ける、請求項6に記載の方法。
- コンピュータで読み込み可能な媒体であって、
銅層を基板に蒸着することと、
二酸化ケイ素層を前記銅層に蒸着すること、
前記二酸化ケイ素層をパターン化して前記銅層の1部を露出することと、
プラズマ硫黄混合ガスで前記銅層の前記露出部分を反応させて銅硫黄化合物を形成することと、を含む方法をデバイスに実施させるために、そこに記憶した指示を有し、プロセッサにより実行可能な媒体。 - 前記銅硫黄化合物が水中で可溶である、請求項8に記載のコンピュータ読み込み可能な媒体。
- 前記銅硫黄化合物が胆礬である、請求項8に記載のコンピュータ読み込み可能な媒体。
- 前記方法が脱イオン水により前記銅硫黄化合物を除去することを含む、請求項8〜請求項10のいずれかに記載のコンピュータ読み込み可能な媒体。
- 前記硫黄混合ガスが銅酸素硫黄化合物を含む、請求項8〜請求項10のいずれかに記載のコンピュータ読み込み可能な媒体。
- 前記銅酸素硫黄化合物が塩素を含む、請求項12に記載のコンピュータ読み込み可能な媒体。
- 銅平担化方法であって、
銅層を基板に蒸着することと、
前記銅層の一部を所望の深さまでプラズマ硫黄混合ガスと反応させて前記所望の深さまで銅硫黄化合物を形成することと、
水で前記銅硫黄化合物を除去して前記銅層の前記表面を平坦化することと、を含む方法。 - 前記銅硫黄化合物が硫酸銅(CuSO4)である、請求項14に記載の方法。
- 前記銅硫黄化合物が硫化銅(CuxSx)である、請求項14に記載の方法。
- 前記方法が硫黄化合物および不活性ガスを含む前記硫黄混合ガスで前記銅層の前記一部に反応を起こさせることを含む、請求項14〜請求項16のいずれかに記載の方法。
- 前記方法が200オングストローム(Å)の深さまで前記銅硫黄化合物を除去することを含む、請求項14〜請求項16のいずれかに記載の方法。
- 前記硫黄混合ガスが銅酸素硫黄化合物を含む、請求項14〜請求項16のいずれかに記載の方法。
- 前記方法が前記硫黄化合物と水との溶液から銅を再生させることを含む、請求項14〜請求項16のいずれかに記載の方法。
- 反応チャンバーを操作する方法であって、
銅層を前記チャンバー内で基板上に蒸着することと、
前記銅層をプラズマ硫黄混合ガスと反応させて銅硫黄化合物を形成することと、
水を用いて前記銅硫黄化合物を除去してパターン化した銅層を形成することと、を含む方法。 - 前記方法が前記銅層をハードマスクで覆うことを含む、請求項21に記載の方法。
- 前記銅硫黄化合物が硫酸銅である、請求項21に記載の方法。
- 前記硫黄混合ガスが硫黄化合物および不活性ガスを含む、請求項21〜請求項23のいずれかに記載の方法。
- 前記硫黄混合ガスが銅酸素硫黄化合物を含む、請求項21〜請求項23のいずれかに記載の方法。
- 前記パターン化した銅層が記憶装置の一部を形成する、請求項21〜請求項23のいずれかに記載の方法。
- 前記パターン化した銅層が前記記憶装置内の接続線を形成する、請求項26に記載の方法。
- 前記接続線が前記記憶装置内のデータ線である、請求項27に記載の方法。
- 前記接続線が前記記憶装置内のアクセス線である、請求項27に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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US12/203,460 | 2008-09-03 | ||
US12/203,460 US20100051577A1 (en) | 2008-09-03 | 2008-09-03 | Copper layer processing |
PCT/US2009/004693 WO2010027406A2 (en) | 2008-09-03 | 2009-08-17 | Copper layer processing |
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Publication Number | Publication Date |
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JP2012502452A true JP2012502452A (ja) | 2012-01-26 |
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JP2011524972A Pending JP2012502452A (ja) | 2008-09-03 | 2009-08-17 | 銅層処理 |
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US (1) | US20100051577A1 (ja) |
EP (1) | EP2321843A2 (ja) |
JP (1) | JP2012502452A (ja) |
KR (1) | KR20110052729A (ja) |
CN (1) | CN102144282A (ja) |
TW (1) | TW201017764A (ja) |
WO (1) | WO2010027406A2 (ja) |
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US8679359B2 (en) * | 2010-05-10 | 2014-03-25 | Georgia Tech Research Corporation | Low temperature metal etching and patterning |
US8241944B2 (en) | 2010-07-02 | 2012-08-14 | Micron Technology, Inc. | Resistive RAM devices and methods |
CN104261458B (zh) * | 2014-10-20 | 2015-09-23 | 安徽工业大学 | 一种带有硫化铝外壳的硫化铜纳米粉末材料及其制备方法 |
US20160351733A1 (en) | 2015-06-01 | 2016-12-01 | International Business Machines Corporation | Dry etch method for texturing silicon and device |
CN105632892A (zh) * | 2015-11-30 | 2016-06-01 | 东莞酷派软件技术有限公司 | Ito图案的制备方法、基板的制备方法及基板和终端 |
US11312638B2 (en) | 2019-03-14 | 2022-04-26 | Kolon Glotech, Inc. | Method for synthesizing copper sulfide nano powder using plasma synthesis |
KR102014382B1 (ko) * | 2019-03-14 | 2019-08-26 | 코오롱글로텍주식회사 | 플라즈마 합성을 이용한 나노 황화구리 파우더의 합성방법 |
KR102050097B1 (ko) * | 2019-03-14 | 2019-11-28 | 코오롱글로텍주식회사 | 플라즈마 합성을 이용하여 산화구리로부터 나노 황화구리 파우더의 합성방법 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH01283936A (ja) * | 1988-05-11 | 1989-11-15 | Hitachi Ltd | 表面処理方法および装置 |
JPH07201819A (ja) * | 1993-12-28 | 1995-08-04 | Kawasaki Steel Corp | 銅薄膜のエッチング方法 |
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JP2926864B2 (ja) * | 1990-04-12 | 1999-07-28 | ソニー株式会社 | 銅系金属膜のエッチング方法 |
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2008
- 2008-09-03 US US12/203,460 patent/US20100051577A1/en not_active Abandoned
-
2009
- 2009-08-17 CN CN2009801345529A patent/CN102144282A/zh active Pending
- 2009-08-17 JP JP2011524972A patent/JP2012502452A/ja active Pending
- 2009-08-17 EP EP09811798A patent/EP2321843A2/en not_active Withdrawn
- 2009-08-17 WO PCT/US2009/004693 patent/WO2010027406A2/en active Application Filing
- 2009-08-17 KR KR1020117007557A patent/KR20110052729A/ko active IP Right Grant
- 2009-08-31 TW TW098129282A patent/TW201017764A/zh unknown
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JPH01283936A (ja) * | 1988-05-11 | 1989-11-15 | Hitachi Ltd | 表面処理方法および装置 |
JPH07201819A (ja) * | 1993-12-28 | 1995-08-04 | Kawasaki Steel Corp | 銅薄膜のエッチング方法 |
Also Published As
Publication number | Publication date |
---|---|
CN102144282A (zh) | 2011-08-03 |
US20100051577A1 (en) | 2010-03-04 |
WO2010027406A3 (en) | 2010-05-14 |
KR20110052729A (ko) | 2011-05-18 |
WO2010027406A2 (en) | 2010-03-11 |
EP2321843A2 (en) | 2011-05-18 |
TW201017764A (en) | 2010-05-01 |
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