JP2012235080A - チップ型コイル部品 - Google Patents
チップ型コイル部品 Download PDFInfo
- Publication number
- JP2012235080A JP2012235080A JP2011274221A JP2011274221A JP2012235080A JP 2012235080 A JP2012235080 A JP 2012235080A JP 2011274221 A JP2011274221 A JP 2011274221A JP 2011274221 A JP2011274221 A JP 2011274221A JP 2012235080 A JP2012235080 A JP 2012235080A
- Authority
- JP
- Japan
- Prior art keywords
- main body
- length
- chip
- external electrode
- type coil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims abstract description 26
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000010030 laminating Methods 0.000 abstract description 2
- 239000002184 metal Substances 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000000047 product Substances 0.000 description 7
- 239000006247 magnetic powder Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 230000007257 malfunction Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 238000000498 ball milling Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0033—Printed inductances with the coil helically wound around a magnetic core
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2011-0040829 | 2011-04-29 | ||
| KR1020110040829A KR101219003B1 (ko) | 2011-04-29 | 2011-04-29 | 칩형 코일 부품 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2012235080A true JP2012235080A (ja) | 2012-11-29 |
| JP2012235080A5 JP2012235080A5 (https=) | 2013-05-16 |
Family
ID=47054975
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011274221A Pending JP2012235080A (ja) | 2011-04-29 | 2011-12-15 | チップ型コイル部品 |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US8482371B2 (https=) |
| JP (1) | JP2012235080A (https=) |
| KR (1) | KR101219003B1 (https=) |
| CN (1) | CN102760553B (https=) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015142124A (ja) * | 2014-01-27 | 2015-08-03 | サムソン エレクトロ−メカニックス カンパニーリミテッド. | チップインダクタ |
| JP2015142127A (ja) * | 2014-01-27 | 2015-08-03 | サムソン エレクトロ−メカニックス カンパニーリミテッド. | インダクタアセンブリー |
| JP2016092404A (ja) * | 2014-11-04 | 2016-05-23 | サムソン エレクトロ−メカニックス カンパニーリミテッド. | チップ電子部品及びその製造方法 |
| JP2017073536A (ja) * | 2015-10-07 | 2017-04-13 | 株式会社村田製作所 | 積層インダクタ |
| JP2018534773A (ja) * | 2015-10-16 | 2018-11-22 | モダ−イノチップス シーオー エルティディー | パワーインダクター |
| KR20190015738A (ko) | 2019-01-31 | 2019-02-14 | 삼성전기주식회사 | 칩 전자부품 |
| JP2019050278A (ja) * | 2017-09-08 | 2019-03-28 | Tdk株式会社 | 電子部品及び電子部品装置 |
| JP2019061997A (ja) * | 2017-09-25 | 2019-04-18 | 太陽誘電株式会社 | 積層セラミックコンデンサ |
| WO2023149240A1 (ja) * | 2022-02-04 | 2023-08-10 | 株式会社村田製作所 | 電子部品 |
| US11830653B2 (en) | 2019-03-06 | 2023-11-28 | Samsung Electro-Mechanics Co., Ltd. | Coil electronic component |
Families Citing this family (58)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130271251A1 (en) * | 2012-04-12 | 2013-10-17 | Cyntec Co., Ltd. | Substrate-Less Electronic Component |
| KR101983135B1 (ko) * | 2012-12-27 | 2019-05-28 | 삼성전기주식회사 | 인덕터 및 그의 갭층 제조를 위한 조성물 |
| KR101983146B1 (ko) | 2013-08-14 | 2019-05-28 | 삼성전기주식회사 | 칩 전자부품 |
| KR20150080797A (ko) * | 2014-01-02 | 2015-07-10 | 삼성전기주식회사 | 세라믹 전자 부품 |
| KR101994730B1 (ko) | 2014-01-02 | 2019-07-01 | 삼성전기주식회사 | 인덕터 |
| KR20150089279A (ko) * | 2014-01-27 | 2015-08-05 | 삼성전기주식회사 | 칩형 코일 부품 |
| KR101548862B1 (ko) * | 2014-03-10 | 2015-08-31 | 삼성전기주식회사 | 칩형 코일 부품 및 그 제조 방법 |
| KR20160000329A (ko) * | 2014-06-24 | 2016-01-04 | 삼성전기주식회사 | 적층 인덕터, 적층 인덕터의 제조방법 및 적층 인덕터의 실장 기판 |
| KR102052596B1 (ko) * | 2014-06-25 | 2019-12-06 | 삼성전기주식회사 | 칩형 코일 부품 및 그 제조방법 |
| JP6206349B2 (ja) * | 2014-07-08 | 2017-10-04 | 株式会社村田製作所 | インダクタ部品およびその製造方法 |
| KR20160008318A (ko) * | 2014-07-14 | 2016-01-22 | 삼성전기주식회사 | 칩형 코일 부품 |
| KR101686989B1 (ko) | 2014-08-07 | 2016-12-19 | 주식회사 모다이노칩 | 파워 인덕터 |
| KR20160019265A (ko) * | 2014-08-11 | 2016-02-19 | 삼성전기주식회사 | 칩형 코일 부품 및 그 제조방법 |
| KR101681201B1 (ko) | 2014-09-11 | 2016-12-01 | 주식회사 모다이노칩 | 파워 인덕터 |
| WO2016039518A1 (ko) * | 2014-09-11 | 2016-03-17 | 주식회사 이노칩테크놀로지 | 파워 인덕터 및 그 제조 방법 |
| KR101607027B1 (ko) * | 2014-11-19 | 2016-03-28 | 삼성전기주식회사 | 칩 전자 부품 및 칩 전자 부품의 실장 기판 |
| KR101630090B1 (ko) | 2014-12-24 | 2016-06-13 | 삼성전기주식회사 | 적층 전자부품 및 그 제조방법 |
| KR102109634B1 (ko) * | 2015-01-27 | 2020-05-29 | 삼성전기주식회사 | 파워 인덕터 및 그 제조 방법 |
| KR20160098780A (ko) | 2015-02-11 | 2016-08-19 | 삼성전기주식회사 | 전자부품 및 전자부품의 실장 기판 |
| KR101659216B1 (ko) | 2015-03-09 | 2016-09-22 | 삼성전기주식회사 | 코일 전자부품 및 그 제조방법 |
| JP6341138B2 (ja) * | 2015-04-10 | 2018-06-13 | 株式会社村田製作所 | 面実装インダクタ及びその製造方法 |
| KR20160124328A (ko) * | 2015-04-16 | 2016-10-27 | 삼성전기주식회사 | 칩 부품 및 그 제조방법 |
| KR102171676B1 (ko) | 2015-05-26 | 2020-10-29 | 삼성전기주식회사 | 칩 전자 부품 |
| US10147533B2 (en) | 2015-05-27 | 2018-12-04 | Samsung Electro-Mechanics Co., Ltd. | Inductor |
| KR101670184B1 (ko) * | 2015-08-24 | 2016-10-27 | 삼성전기주식회사 | 적층 전자부품 및 그 제조방법 |
| KR101900880B1 (ko) | 2015-11-24 | 2018-09-21 | 주식회사 모다이노칩 | 파워 인덕터 |
| KR101832589B1 (ko) | 2016-01-19 | 2018-02-26 | 삼성전기주식회사 | 코일 부품 및 그 제조 방법 |
| JP6536437B2 (ja) * | 2016-03-04 | 2019-07-03 | 株式会社村田製作所 | 電子部品 |
| JP6484194B2 (ja) | 2016-03-18 | 2019-03-13 | 太陽誘電株式会社 | 電子部品及びその製造方法 |
| JP6547683B2 (ja) * | 2016-05-26 | 2019-07-24 | 株式会社村田製作所 | コイル部品 |
| KR101823246B1 (ko) | 2016-06-21 | 2018-01-29 | 삼성전기주식회사 | 적층 세라믹 전자 부품 및 그 실장 기판 |
| KR102345106B1 (ko) * | 2016-07-27 | 2021-12-30 | 삼성전기주식회사 | 인덕터 |
| KR101823267B1 (ko) | 2016-11-01 | 2018-01-29 | 삼성전기주식회사 | 박막 인덕터 및 그 제조 방법 |
| KR20180054266A (ko) * | 2016-11-15 | 2018-05-24 | 삼성전기주식회사 | 칩 전자부품 |
| JP6575773B2 (ja) * | 2017-01-31 | 2019-09-18 | 株式会社村田製作所 | コイル部品、及び該コイル部品の製造方法 |
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| KR101952873B1 (ko) * | 2017-07-05 | 2019-02-27 | 삼성전기주식회사 | 박막형 인덕터 |
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| KR102335428B1 (ko) * | 2019-12-30 | 2021-12-06 | 삼성전기주식회사 | 코일 부품 |
| CN113035529B (zh) * | 2019-12-24 | 2024-06-07 | 三星电机株式会社 | 线圈组件 |
| KR102409325B1 (ko) * | 2020-05-08 | 2022-06-15 | 삼성전기주식회사 | 코일 부품 |
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| KR20220041508A (ko) * | 2020-09-25 | 2022-04-01 | 삼성전기주식회사 | 코일 부품 |
| KR102906502B1 (ko) * | 2020-12-04 | 2026-01-02 | 삼성전기주식회사 | 코일 부품 |
Citations (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS618574Y2 (https=) * | 1980-06-25 | 1986-03-17 | ||
| JPS6223065Y2 (https=) * | 1981-06-01 | 1987-06-12 | ||
| JPS6322665Y2 (https=) * | 1982-09-16 | 1988-06-22 | ||
| JPH0312446B2 (https=) * | 1982-09-16 | 1991-02-20 | Tdk Electronics Co Ltd | |
| JPH05283556A (ja) * | 1992-03-31 | 1993-10-29 | Matsushita Electric Ind Co Ltd | 電子部品及びその製造方法 |
| JPH06120071A (ja) * | 1992-09-30 | 1994-04-28 | Toshiba Lighting & Technol Corp | チップ部品 |
| JPH06196332A (ja) * | 1992-12-24 | 1994-07-15 | Kyocera Corp | 積層インダクタ |
| JPH0757935A (ja) * | 1993-08-12 | 1995-03-03 | Hitachi Metals Ltd | 積層チップインダクタ |
| JPH07320939A (ja) * | 1994-05-19 | 1995-12-08 | Matsushita Electric Ind Co Ltd | インダクタンス部品およびその製造方法 |
| JPH08130118A (ja) * | 1994-10-31 | 1996-05-21 | Taiyo Yuden Co Ltd | チップ形インピーダンス素子 |
| JPH09219333A (ja) * | 1996-02-13 | 1997-08-19 | Koa Corp | チップインダクタおよびその製造方法 |
| JPH11265823A (ja) * | 1998-03-17 | 1999-09-28 | Tokin Corp | 積層型インダクタ及びその製造方法 |
| JP2000138120A (ja) * | 1998-11-02 | 2000-05-16 | Murata Mfg Co Ltd | 積層型インダクタ |
| JP2001155938A (ja) * | 1999-09-17 | 2001-06-08 | Fdk Corp | 積層インダクタおよびその製造方法 |
| JP2002198229A (ja) * | 2000-12-25 | 2002-07-12 | Fdk Corp | チップ部品およびその製造方法 |
| JP2005191256A (ja) * | 2003-12-25 | 2005-07-14 | Murata Mfg Co Ltd | コイル部品 |
| JP2006114626A (ja) * | 2004-10-13 | 2006-04-27 | Tdk Corp | インダクタ部品及びインダクタ部品の製造方法 |
| JP2009026897A (ja) * | 2007-07-18 | 2009-02-05 | Tdk Corp | コイル部品 |
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| JPH04342108A (ja) * | 1991-05-17 | 1992-11-27 | Tokin Corp | チップ部品電極の製造方法 |
| EP0921542B1 (en) * | 1997-03-28 | 2005-11-09 | Matsushita Electric Industrial Co., Ltd. | Chip inductor and method for manufacturing the same |
| JP2003203813A (ja) * | 2001-08-29 | 2003-07-18 | Matsushita Electric Ind Co Ltd | 磁性素子およびその製造方法、並びにそれを備えた電源モジュール |
| JP4736311B2 (ja) * | 2003-07-14 | 2011-07-27 | パナソニック株式会社 | 磁性フェライトおよびそれを用いた磁性素子 |
| JP4851062B2 (ja) * | 2003-12-10 | 2012-01-11 | スミダコーポレーション株式会社 | インダクタンス素子の製造方法 |
| US7119649B2 (en) * | 2004-05-28 | 2006-10-10 | Matsushita Electric Industrial Co., Ltd. | Common mode noise filter |
| CN101911221B (zh) * | 2008-01-08 | 2012-11-07 | 株式会社村田制作所 | 开磁路型层叠线圈部件及其制造方法 |
| JP5195904B2 (ja) * | 2008-09-24 | 2013-05-15 | 株式会社村田製作所 | 積層コイル部品 |
-
2011
- 2011-04-29 KR KR1020110040829A patent/KR101219003B1/ko not_active Expired - Fee Related
- 2011-12-15 JP JP2011274221A patent/JP2012235080A/ja active Pending
- 2011-12-20 US US13/331,673 patent/US8482371B2/en not_active Expired - Fee Related
- 2011-12-28 CN CN201110447748.2A patent/CN102760553B/zh not_active Expired - Fee Related
-
2013
- 2013-07-08 US US13/937,050 patent/US8810351B2/en active Active
Patent Citations (18)
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| JPS618574Y2 (https=) * | 1980-06-25 | 1986-03-17 | ||
| JPS6223065Y2 (https=) * | 1981-06-01 | 1987-06-12 | ||
| JPS6322665Y2 (https=) * | 1982-09-16 | 1988-06-22 | ||
| JPH0312446B2 (https=) * | 1982-09-16 | 1991-02-20 | Tdk Electronics Co Ltd | |
| JPH05283556A (ja) * | 1992-03-31 | 1993-10-29 | Matsushita Electric Ind Co Ltd | 電子部品及びその製造方法 |
| JPH06120071A (ja) * | 1992-09-30 | 1994-04-28 | Toshiba Lighting & Technol Corp | チップ部品 |
| JPH06196332A (ja) * | 1992-12-24 | 1994-07-15 | Kyocera Corp | 積層インダクタ |
| JPH0757935A (ja) * | 1993-08-12 | 1995-03-03 | Hitachi Metals Ltd | 積層チップインダクタ |
| JPH07320939A (ja) * | 1994-05-19 | 1995-12-08 | Matsushita Electric Ind Co Ltd | インダクタンス部品およびその製造方法 |
| JPH08130118A (ja) * | 1994-10-31 | 1996-05-21 | Taiyo Yuden Co Ltd | チップ形インピーダンス素子 |
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| JP2016092404A (ja) * | 2014-11-04 | 2016-05-23 | サムソン エレクトロ−メカニックス カンパニーリミテッド. | チップ電子部品及びその製造方法 |
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| JP2021073710A (ja) * | 2015-10-16 | 2021-05-13 | モダ−イノチップス シーオー エルティディー | パワーインダクター |
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| JP7017893B2 (ja) | 2017-09-25 | 2022-02-09 | 太陽誘電株式会社 | 積層セラミックコンデンサ |
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| WO2023149240A1 (ja) * | 2022-02-04 | 2023-08-10 | 株式会社村田製作所 | 電子部品 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102760553A (zh) | 2012-10-31 |
| US20130293339A1 (en) | 2013-11-07 |
| KR101219003B1 (ko) | 2013-01-04 |
| KR20120122589A (ko) | 2012-11-07 |
| US8482371B2 (en) | 2013-07-09 |
| CN102760553B (zh) | 2015-11-18 |
| US20120274432A1 (en) | 2012-11-01 |
| US8810351B2 (en) | 2014-08-19 |
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