JP2012227373A - Imprint apparatus, mold, and jig for imprint - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an imprint apparatus which obtains a desired pattern shape with good reproductivity.SOLUTION: An imprint apparatus includes: a first stage 1 enabling a mold 10 having a protruding part 12 to be placed thereon; a second stage 2 facing the first stage and enabling a resin layer 20, in which the protruding part 12 is press-fitted, to be mounted thereon; and guides 3, each of which is disposed in at least one of the first and second stages 1, 2, is positioned at an outer periphery of a pattern transfer region of the resin layer 20 when the protruding part 12 of the mold 10 is press-fitted into the resin layer 20, and has a gap part 4 pushing out an extra part of the resin layer 20 to the exterior with a pressure applied to the resin layer 20 by the mold 10.

Description

  The present invention relates to an imprint apparatus, a mold, and an imprint jig.

  As electronic devices become smaller, thinner, and more functional, electronic components incorporated in electronic devices are also becoming smaller, and the patterns of printed circuit boards (printed wiring boards) on which electronic components are mounted have also been miniaturized. .

  As a pattern formation method by transfer, there are imprint methods such as nanoimprint (NIL), injection molding, hot embossing, and the like. In injection molding and hot embossing, since the resin is thick, the force applied to the mold is transmitted only to the resin. On the other hand, in NIL, a resin with a thickness of several tens of nanometers to several μm is usually placed on a stage, and the mold is pressed against the resin, so that the mold and the stage are almost in contact (in other words, the mold almost penetrates the resin). State, or a state in which the resin remains thin). It can be said that NIL is more technically difficult than other forming methods in that it is transferred to a thin resin.

  In order to uniformly transfer a large area by the imprint method, it is necessary that the parallelism and smoothness of the mold and the stage and the pressure applied to the resin are uniform. On the other hand, even if these are properly managed, the shape of the resin peripheral part is largely due to the viscosity and surface tension of the resin, so it is difficult to form a uniform shape every time, and the transfer pattern shape may be affected. There is.

  In order to obtain a desired resin pattern shape, a technique for preventing the displacement of the transfer pattern by using a material that is close to the linear expansion coefficient of the resin as the material of the base material of the mold is known (for example, Patent Documents). 1). However, even if this method is used, it is difficult to obtain a desired pattern shape with good reproducibility, particularly in the resin peripheral portion.

JP 2005-26412 A

  As described above, in the conventional imprint method, it is difficult to obtain a desired pattern shape with good reproducibility when transferring a large area uniformly.

  In view of the above problems, an object of the present invention is to provide an imprint apparatus, a mold, and an imprint jig that can obtain a desired pattern shape with good reproducibility.

  According to one aspect of the present invention, a first stage capable of placing a mold having a convex portion, a second stage facing the first stage and capable of placing a resin layer into which the convex portion is press-fitted, It is disposed on at least one of the first stage and the second stage, and is located on the outer periphery of the pattern transfer region of the resin layer when the convex portion of the mold is press-fitted into the resin layer. There is provided an imprint apparatus including a guide having a gap portion for extruding a part of the image to the outside.

  In one embodiment of the present invention, the guide may include at least one of a plate-shaped member, a rod-shaped member, and a spherical member.

  In one embodiment of the present invention, the guide may have a uniform height.

  One embodiment of the present invention may further include a substrate that is disposed on the second stage and can form a resin layer.

  In one aspect of the present invention, a sacrificial layer that is disposed on the second stage, can be mounted with a resin layer, and reaches a convex portion that penetrates the resin layer when the convex portion of the mold is press-fitted into the resin layer. May be.

  In one embodiment of the present invention, the guide is disposed on the second stage, and when the convex portion is press-fitted into the resin layer, the end portion on the first stage side of the guide contacts the surface of the first stage or the surface of the mold. May be.

  In one aspect of the present invention, the guide may be disposed on the first stage, and the end portion of the guide on the second stage side may contact the second stage surface when the convex portion is press-fitted into the resin layer.

  According to another aspect of the present invention, a support part that can be placed on the first stage and a resin layer that is placed on the support part and placed on the second stage facing the first stage are press-fitted. It is arranged on the outer periphery of the convex part and the convex part on the support part, and is located on the outer periphery of the pattern transfer region of the resin layer when the convex part of the mold is press-fitted into the resin layer. A mold is provided that includes a guide having a void that pushes an extra portion of the layer out.

  According to still another aspect of the present invention, the first portion can be placed on the first stage, and is disposed on the outer periphery of the fixing portion for fixing the mold having the convex portion, and the region where the mold of the fixing portion is fixed. When the mold is press-fitted into the resin layer placed on the second stage facing the stage, it is positioned on the outer periphery of the pattern transfer region of the resin layer, and an extra part of the resin layer is removed by the pressure applied from the mold to the resin layer. There is provided an imprinting jig including a guide having a gap portion to be pushed out.

  According to the present invention, it is possible to provide an imprint apparatus, a mold, and an imprint jig that can obtain a desired pattern shape with good reproducibility.

It is the schematic which shows an example of the imprint apparatus which concerns on the 1st Embodiment of this invention. FIG. 2A is a top view showing an example of a guide according to the first embodiment of the present invention. FIG.2 (b) is sectional drawing along the AA line of Fig.2 (a). It is sectional drawing for demonstrating an example of the imprint method which concerns on the 1st Embodiment of this invention. FIG. 4 is a cross-sectional view subsequent to FIG. 3 for explaining an example of the imprint method according to the first embodiment of the present invention. FIG. 5 is a cross-sectional view subsequent to FIG. 4 for describing an example of the imprint method according to the first embodiment of the present invention. It is sectional drawing for demonstrating an example of the imprint method which concerns on the 1st modification of the 1st Embodiment of this invention. FIG. 7 is a cross-sectional view subsequent to FIG. 6 for describing an example of an imprint method according to a first modification of the first embodiment of the present invention. Fig.8 (a) is a front view which shows an example of the guide which concerns on the 2nd modification of the 1st Embodiment of this invention. FIG. 8B is a top view showing the guide shown in FIG. FIG.8 (c) is sectional drawing along the AA line of FIG.8 (b). Fig.9 (a) is a front view which shows another example of the guide which concerns on the 2nd modification of the 1st Embodiment of this invention. FIG. 9B is a top view showing the guide shown in FIG. FIG.9 (c) is sectional drawing along the AA line of FIG.9 (b). It is sectional drawing which shows another example of the guide which concerns on the 2nd modification of the 1st Embodiment of this invention. It is sectional drawing which shows an example of the imprint apparatus which concerns on the 3rd modification of the 1st Embodiment of this invention. It is the schematic which shows an example of the imprint apparatus which concerns on the 2nd Embodiment of this invention. FIG. 13A is a bottom view showing an example of a mold according to the second embodiment of the present invention. FIG.13 (b) is sectional drawing along the AA line of Fig.13 (a). It is sectional drawing for demonstrating an example of the imprint method which concerns on the 2nd Embodiment of this invention. FIG. 15 is a cross-sectional view subsequent to FIG. 14 for explaining an example of the imprint method according to the second embodiment of the present invention. It is process sectional drawing for demonstrating another example of the imprint method which concerns on the 2nd Embodiment of this invention. FIG. 17 is a process cross-sectional view subsequent to FIG. 16 for describing another example of the imprint method according to the second embodiment of the present invention. It is the schematic which shows an example of the imprint apparatus which concerns on the 3rd Embodiment of this invention. FIG. 19A is a bottom view showing an example of an imprinting jig according to the third embodiment of the present invention. FIG. 19B is a cross-sectional view taken along the line AA in FIG. It is process sectional drawing for demonstrating an example of the imprint method which concerns on the 3rd Embodiment of this invention. FIG. 21 is a process cross-sectional view subsequent to FIG. 20 for describing an example of the imprint method according to the third embodiment of the present invention. It is a top view which shows an example of the guide which concerns on other embodiment of this invention. It is sectional drawing for demonstrating an example of the imprint method which concerns on a comparative example. It is sectional drawing for demonstrating another example of the imprint method which concerns on a comparative example.

  Next, first to third embodiments of the present invention will be described with reference to the drawings. In the following description of the drawings, the same or similar parts are denoted by the same or similar reference numerals. However, it should be noted that the drawings are schematic, and the relationship between the thickness and the planar dimensions, the ratio of the thickness of each layer, and the like are different from the actual ones. Therefore, specific thicknesses and dimensions should be determined in consideration of the following description. Moreover, it is a matter of course that portions having different dimensional relationships and ratios are included between the drawings.

  The first to third embodiments described below exemplify apparatuses and methods for embodying the technical idea of the present invention, and the technical idea of the present invention is the component parts. The material, shape, structure, arrangement, etc. are not specified below. The technical idea of the present invention can be variously modified within the scope of the claims.

(First embodiment)
As shown in FIG. 1, the imprint apparatus according to the first embodiment of the present invention includes a first stage 1 on which a mold (imprint mold) 10 having a convex portion 12 can be placed, and a first stage 1. And the second stage 2 on which the resin layer 20 into which the convex portion 12 is press-fitted can be placed, and the resin layer when the convex portion 12 of the mold 10 is press-fitted into the resin layer 20. And a guide 3 having a gap portion 4 which is located on the outer periphery of the pattern transfer region 20 and pushes an extra part of the resin layer 20 to the outside by pressure applied to the resin layer 20 from the mold 10.

  Here, the “pattern transfer region” means a region of the surface of the resin layer 20 where the convex portion 12 of the mold 10 is press-fitted and the pattern is transferred. In the first embodiment of the present invention, a case where the “pattern transfer region” coincides with the entire surface of the resin layer 20 will be described, but it does not necessarily have to coincide with the entire surface of the resin layer 20. For example, the central portion of the surface of the resin layer 20 may be a “pattern transfer region”, and a region where the pattern is not transferred may exist on the outer peripheral portion thereof.

  The upper part of the first stage 1 is held by a stage holding unit 5. The stage holding unit 5 is held at the upper part by the drive shaft 6 and is moved up and down by the drive unit 7. A drive shaft 8 is connected to the upper portion of the drive unit 7. On the other hand, the lower part of the second stage 2 is held by the base 9. A substrate 21 is disposed on the second stage 2, and the resin layer 20 is placed on the substrate 21. Note that the resin layer 20 may be directly placed on the second stage 2 without the substrate 21.

  The first stage 1 and the second stage 2 may each have a built-in heater, and the heater may be disposed above the first stage 1 and below the second stage 2, respectively. Alternatively, the resin layer 20 may be disposed on the first stage 1 and the mold 10 may be disposed on the second stage 2. Moreover, the structure which the 2nd stage 2 raises / lowers, and the structure which both the 1st stage 1 and the 2nd stage 2 raise / lower may be sufficient.

  The mold 10 includes a support portion 11 and a convex portion 12 that is disposed on the support portion 11 and press-fitted into the resin layer 20. As a material of the mold 10, for example, silicon (Si), nickel (Ni), copper (Cu) or the like can be used, and a mold release agent is applied to the surface layer or a diamond-like carbon (DLC) film is formed. Release properties may be improved.

  As an example, the height Hm of the support portion 11 of the mold 10 can be set to about 600 μm, the height Hp of the convex portion 12 can be set to about 10 μm, and the width can be set to about 3 to 50 μm. The height Hp, width, shape, position, and number of the protrusions 12 are not particularly limited. Moreover, although the case where the convex part 12 has the mutually same height Hp is demonstrated, you may have a mutually different height.

  As the resin layer 20, for example, a thermoplastic resin such as a thermoplastic polyimide or a liquid crystal polymer can be used. In addition, the kind of resin layer 20 is not specifically limited, According to it, the hardening method of the resin layer 20 may also be thermosetting, room temperature hardening, or ultraviolet-ray (UV) hardening.

  The thickness Tr1 of the resin layer 20 may be the same as the height Hp of the convex portion 12 of the mold 10, or may be thicker than the height Hp of the convex portion 12. In addition, the thickness Tr1 of the resin layer 20 before pattern transfer may be the same as the desired film thickness after pattern transfer, or may be thicker than the desired film thickness after pattern transfer.

  The height Hg of the guide 3 on the second stage 2 can be arbitrarily set so that the resin layer 20 has a desired film thickness. For example, when the thickness Tr1 of the resin layer 20 before pattern transfer is the same as the desired film thickness after pattern transfer, the height Hg of the guide 3 on the second stage 2 is set to the thickness Tr1 of the resin layer 20 and the substrate 21. And the sum of the thickness Ts and the height Hm of the support portion 11 of the mold 10 may be made to coincide with each other. In this case, if the thickness Tr1 of the resin layer 20 is 25 μm, the thickness Ts of the substrate 21 is 100 μm, and the height Hm of the support portion 11 of the mold 10 is 600 μm, the height Hg of the guide 3 is 725 μm.

  When the thickness Tr1 of the resin layer 20 before pattern transfer is different from the desired thickness after pattern transfer, the height Hg of the guide 3 on the second stage 2 is set to the desired height after pattern transfer of the resin layer 20. The thickness, the thickness Ts of the substrate 21, and the sum of the height Hm of the support portion 11 of the mold 10 may be made to coincide with each other.

  When the substrate 21 is not provided, the height Hg of the guide 3 on the second stage 2 is set to the thickness Tr1 of the resin layer 20 (or a desired thickness after pattern transfer) and the height of the support portion 11 of the mold 10. You may make it correspond with the sum of Hm.

  As a material of the guide 3, silver (Ag), gold (Au), palladium (Pd), platinum (Pt), copper (Cu), nickel (Ni), aluminum (Al), or an alloy thereof can be used. is there. In the case of copper (Cu), nickel (Ni), aluminum (Al) or the like, it is preferable that rust prevention treatment is performed.

  As shown in FIG. 2A, the guide 3 has a plurality of (four) plate-like members having a uniform height. When viewed from above, the guide 3 has a substantially square frame shape as a whole, and each member has a “<” shape.

  A slit-like gap 4 is formed at the center of each side of the guide 3. The voids 4 are provided at an arbitrary number and at arbitrary positions so that the excess resin layer 20 can be discharged to the outside when the convex portion 12 of the mold 10 is press-fitted into the resin layer 20 and has an arbitrary size. The shape of the gap 4 is not particularly limited to a slit shape, and various shapes such as a circular or rectangular opening can be employed.

  As shown in FIG. 2 (b), the second stage 2 is provided with a groove 22 for fixing the guide 3. The guide 3 may be bonded to the groove 22 using an adhesive such as an epoxy resin. The guide 3 may be directly bonded to the surface of the second stage 2 without providing the groove 22 in the second stage 2.

  The guide 3 may be provided on at least one of the first stage 1 and the second stage 2. For example, the first stage 1 may be provided, a part of the guide 3 may be provided on the first stage 1, and the other part of the guide 3 may be provided on the second stage 2.

  Next, an example of a method for manufacturing a wiring board including an imprint method using the imprint apparatus according to the first embodiment of the present invention will be described with reference to FIGS.

  (A) As shown in FIG. 3, first, a groove portion 22 is formed in the second stage 2, and a separately prepared guide 3 is provided in the groove portion 22.

  (B) A mold 10 having a convex portion 12 is attached to the first stage 1. Further, the substrate 21 is placed on the second stage 2, and the resin layer 20 is placed on the substrate 21.

  (C) As shown in FIG. 4, the first stage 1 is lowered. For example, when the resin layer 20 is a thermoplastic resin, the first stage 1 is heated to a glass transition temperature or higher and softened, and the convex portion 12 of the mold 10 is formed on the resin layer 20. Press fit. At this time, the upper end of the guide 3 is in contact with the first stage 1, and the guide 3 is positioned on the outer periphery of the pattern transfer region of the resin layer 20. By providing the guide 3, pressure is uniformly applied from the mold 10 to the resin layer 20, and an extra part of the resin layer 20 is pushed out from the gap portion 4 shown in FIGS. 1 and 2A. As a result, as shown in FIG. 4, the resin layer 20 has a desired film thickness Tr <b> 2 and a recess 23 is formed in the resin layer 20. Thereafter, the resin layer 20 is cured by cooling.

  (D) As shown in FIG. 5, the first stage 1 is raised and the mold 10 is released from the resin layer 20. If necessary, the resin residue at the bottom of the recess 23 is removed by plasma ashing or the like. Subsequently, the recess 23 is filled with a conductive material such as copper (Cu) or silver (Ag) by plating or the like to form a conductive pattern such as a wiring. Then, a wiring board is produced by appropriately forming a wiring pattern on the upper and lower surfaces of the resin layer 20 by plating or the like.

  Here, an imprint method when the guide 3 is not provided will be described as a comparative example. As shown in FIG. 23, in the imprint method according to the comparative example, the convex portion 112 on the support portion 111 of the mold 110 fixed to the first stage 101 is press-fitted into the resin layer 120 placed on the second stage 102. . At this time, the resin layer 120 may flow irregularly, and the pattern shape of the resin layer 120 may be deformed. On the other hand, according to the imprint apparatus according to the first embodiment of the present invention, the convex portion 12 of the mold 10 is press-fitted into the resin layer 20 by providing the guide 3 as shown in FIG. Sometimes it is possible to prevent an excessive part of the resin layer 20 from being pushed out of the gap 4 and flow out irregularly, and to obtain a desired pattern shape of the resin layer 20 with good reproducibility. Can do.

  Further, as shown in FIG. 24, when there is no guide 3 and the convex portion 112 of the mold 110 has a variation in height, or when there is an in-plane variation in the transfer pressure, the convex portion 112 is replaced with the resin layer 120. In some cases, the mold 110 is tilted when the resin layer 120 is press-fitted, and the pattern shape of the resin layer 120 is deformed. On the other hand, according to the imprint apparatus according to the first embodiment of the present invention, the guide 3 has a uniform height, as shown in FIG. Even when there is a variation in thickness or when there is an in-plane variation in the transfer pressure, the height of the resin layer 20 can be made uniform and the film thickness Tr2 can be made uniform.

(First modification)
In the first embodiment of the present invention, as shown in FIG. 4, the case where the upper end of the guide 3 contacts the first stage 1 when the convex portion 12 of the mold 10 is press-fitted into the resin layer 20 has been described. . As a first modification of the first embodiment of the present invention, the case where the upper end of the guide 3 contacts the support portion 11 of the mold 10 when the convex portion 12 of the mold 10 is press-fitted into the resin layer 20 will be described. To do.

  As shown in FIG. 6, the thickness Tr1 of the resin layer 20 is the same as the desired film thickness after pattern transfer. The height Hg of the guide 3 on the second stage 2 is set to coincide with the sum of the thickness Tr1 of the resin layer 20 and the thickness Ts of the substrate 21. For example, when the thickness Tr1 of the resin layer 20 is 25 μm and the thickness Ts of the substrate 21 is 100 μm, the height Hg of the guide 3 is 125 μm. If there is no substrate 21, the height Hg of the guide 3 on the second stage 2 may be made to coincide with the thickness Tr 1 of the resin layer 20.

  As shown in FIG. 7, when the convex portion 12 of the mold 10 is press-fitted into the resin layer 20, the upper end of the guide 3 comes into contact with the support portion 11 of the mold 10. In this case, the same effect as that obtained when the upper end of the guide 3 is in contact with the first stage 1 can be obtained. Furthermore, damage to the first stage 1 due to contact between the upper end of the guide 3 and the first stage 1 can be prevented.

(Second modification)
Another example of the shape of the guide 3 will be described as a second modification of the first embodiment of the present invention.

  For example, the guide 3 shown in FIG. 2A has straight sides when viewed from above, but the shape of the guide 3 may be curved or bellows.

  Further, as shown in FIGS. 8A to 8C, the guide 3 may be a plurality of rod-shaped members. Each member is arranged on the outer periphery of the pattern transfer region, extends in the direction perpendicular to the surface of the second stage 2, and the gaps 4 form the gaps between the members. As shown in FIG. 8C, the second stage 2 may be formed with groove portions 22 for fixing the guides 3 respectively.

  Moreover, as shown in FIGS. 9A to 9C, the guide 3 may be a plurality of spherical members made of microballs such as solder and copper, which are arranged on the outer periphery of the pattern transfer region. good. As shown in FIG. 9B, each member is disposed in the groove portion 22 that has a “<” shape in a top view. The guide 3 has a square frame shape as a whole, and has a gap 4 at the center of each side. Further, an excessive part of the resin layer 20 can be discharged also from the gap between adjacent spherical members. In addition, the some groove part which arrange | positions the some spherical member which comprises the guide 3 separately may be formed. The second stage 2 may be a plurality of hemispherical members in which the groove 22 is not provided and the guide 3 is disposed on the second stage 2.

  As shown in FIG. 10, the guide 3 may cover the end of the second stage 2 from the end of the pattern transfer region on the second stage 2. Further, the guide 3 shown in FIG. 10 may be equivalent to a part of the second stage 2 and the central part of the second stage 2 being depressed.

  Although not shown, the guide may be formed of a single plate-like member that covers the entire periphery of the pattern transfer region, and the lower side of the member may form a gap over the entire periphery.

  Moreover, the guide 3 may be comprised by combining a plate-shaped member, a rod-shaped member, and a spherical member.

  Moreover, although the case where the guide 3 has a uniform height has been described, the height of the uppermost part and a part of the height may be different.

  Thus, according to the second modification of the first embodiment of the present invention, the material, shape, and configuration of the members of the guide 3 according to the size of the mold 10 and the type and size of the resin layer 20. The number, size, or the like of the member can be selected as appropriate, and the shape, number, position, size, or the like of the gap 4 can also be selected as appropriate.

(Third Modification)
In the first embodiment of the present invention, the case where the substrate 21 is arranged on the second stage 2 as shown in FIG. 1 has been described. As a third modification of the first embodiment of the present invention, as shown in FIG. 11, the imprint apparatus further includes a sacrificial layer 24 disposed on the second stage 2 instead of the substrate 21. Explain the case.

  As a material of the sacrificial layer 24, for example, a film or a porous member made of polyimide, polytetrafluoroethylene (PTFE), or the like can be used.

  As shown in FIG. 11, when the convex portion 12 of the mold 10 is press-fitted into the resin layer 20, it penetrates the resin layer 20 and reaches the sacrificial layer 24 (projects). The thickness Tr2 after the pattern transfer of the resin layer 20 is set to be equal to or less than the height Hp of the convex portion 12. Thereafter, the mold 10 is released from the resin layer 20, and at the same time, the sacrificial layer 24 is peeled from the resin layer 20.

  As shown in FIG. 24, in the case where there is no guide 3, especially when the convex portion 112 of the mold 110 has a height variation or when the transfer pressure has an in-plane variation, the resin residue variation at the bottom of the concave portion 123. The resin residue may partially remain even after ashing (ashing).

  On the other hand, according to the 3rd modification of the 1st Embodiment of this invention, as shown in FIG. 11, by providing the sacrificial layer 24 arrange | positioned at the lower surface of the resin layer 20, the convex part 12 is provided. Can penetrate through the resin layer 20 and eliminate resin residues in the recesses 23 of the resin layer 20. Therefore, the ashing (ashing) process for removing the resin residue can be eliminated.

  Although the case where the sacrificial layer 24 is directly disposed on the second stage 2 has been described, a substrate may be disposed on the second stage 2 and the sacrificial layer 24 may be disposed on the substrate.

(Second Embodiment)
The imprint apparatus according to the second embodiment of the present invention is different from the first embodiment of the present invention in that the mold 10x has a guide 3 as shown in FIG.

  As shown in FIGS. 12, 13 (a) and 13 (b), the mold 10 x includes a support portion 11, a convex portion 12 that is disposed on the support portion 11 and press-fitted into the resin layer 20, and the support portion 11. It is arranged on the outer periphery of the upper convex portion 12 and is located on the outer periphery of the pattern transfer region of the resin layer 20 when the convex portion 12 of the mold 10x is press-fitted into the resin layer 20, and the resin is applied by the pressure applied to the resin layer 20 from the mold 10x. And a guide 3 having a gap 4 that pushes an extra portion of the layer 20 to the outside.

  The height Hg of the guide 3 is matched with the sum of the thickness Ts of the substrate 21 and the thickness Tr1 of the resin layer 20 shown in FIG.

  In the second embodiment of the present invention, the case where the lower end of the guide 3 is in contact with the second stage 2 will be described. However, when the lower end of the guide 3 is in contact with the substrate 21 or when the substrate 21 is not present. The height Hg of the guide 3 may be matched with the thickness Tr1 of the resin layer 20.

  Since the other configuration of the imprint apparatus according to the second embodiment of the present invention is substantially the same as that of the first embodiment of the present invention, a duplicate description is omitted.

  Next, an example of a method for manufacturing a wiring board including an imprint method using the imprint apparatus according to the second embodiment of the present invention will be described with reference to FIGS.

  (A) As shown in FIG. 14, a mold 10x with a guide 3 is prepared. For example, after the convex portion 12 is formed on the support portion 11, the guide 3 is formed by plating using copper (Cu), nickel (Ni), or the like. The support 11 is filled with resin, and the height of the guide 3 is made uniform by polishing or the like. Thereafter, the mold 10x can be manufactured by peeling the resin.

  (B) The mold 10x is attached to the first stage 1 of the imprint apparatus. On the other hand, the substrate 21 is placed on the second stage 2, and the resin layer 20 to be a pattern transfer target is placed on the substrate 21.

  (C) As shown in FIG. 15, the first stage 1 is lowered, and the convex portion 12 of the mold 10 x is press-fitted into the resin layer 20. The lower end of the guide 3 is in contact with the second stage 2, and the guide 3 is located on the outer periphery of the pattern transfer region of the resin layer 20. At this time, pressure is uniformly applied from the mold 10x to the resin layer 20, and an extra part of the resin layer 20 is pushed out from the gap portion 4 shown in FIGS. 12 and 13A. As a result, as shown in FIG. 15, the resin layer 20 has a desired thickness, and the recess 23 is formed in the resin layer 20. Subsequent steps are substantially the same as those in the first embodiment of the present invention, and thus redundant description is omitted.

  According to the imprint apparatus according to the second embodiment of the present invention, since the mold 10x includes the guide 3, the convex portion 12 of the mold 10x is made of resin as in the case where the guide 3 is provided in the imprint apparatus. The resin layer 20 can be prevented from flowing out irregularly when pressed into the layer 20, and a desired pattern shape can be obtained in the resin layer 20 with good reproducibility.

  Furthermore, since the mold 10x has the guide 3, it can be set according to the size of the mold 10x and the resin layer 20, and can be efficiently maintained.

  In addition, as shown in FIG. 16, you may provide the dummy area | region where a pattern is not transferred around the pattern transfer area | region of the resin layer 20. As shown in FIG. As shown in FIG. 17, when the convex portion 12 is press-fitted into the resin layer 20, the tip of the guide 3 may be press-fitted into the dummy region of the resin layer 20.

(Third embodiment)
The imprint apparatus according to the third embodiment of the present invention is different from the first embodiment of the present invention in that it includes an imprint jig 16 having a guide 3 as shown in FIG.

  As shown in FIGS. 18, 19A and 19B, the imprint jig 16 can be placed on the first stage 1, and is a fixing portion for fixing the mold 10 having the convex portion 12. 15 and the outer periphery of the pattern transfer region of the resin layer 20 when the mold 10 is press-fitted into the resin layer 20 placed on the second stage 2. And a guide 3 having a gap 4 that pushes an extra part of the resin layer 20 to the outside by the pressure applied to the resin layer 20 from the mold 10.

  The guide 3 is provided in the groove portion 17 of the fixed portion 15. Note that the guide 3 may be provided on the surface of the fixed portion 15 without the groove portion 17. Moreover, you may provide the groove part in the area | region where the mold 10 of the fixing | fixed part 15 is fixed.

  Since the other configuration of the imprint apparatus according to the third embodiment of the present invention is substantially the same as that of the first embodiment of the present invention, a duplicate description is omitted.

  Next, an example of a method for manufacturing a wiring board including an imprint method using the imprint apparatus according to the third embodiment of the present invention will be described with reference to FIGS.

  (A) As shown in FIG. 20, a guide 3 is provided on a plate-like fixing portion 15 such as silicon (Si), stainless steel, or copper (Cu). In addition, you may provide the groove part for fixing the mold 10 in the center part of the fixing | fixed part 15 by etching etc., for example.

  (B) The mold 10 is fixed to the fixing portion 15, and the surface of the fixing portion 15 opposite to the side where the mold 10 is fixed is attached to the stage. Further, the substrate 21 is placed on the second stage 2, and the resin layer 20 is placed on the substrate 21.

  (C) As shown in FIG. 21, the first stage 1 is lowered and the convex portion 12 of the mold 10 is press-fitted into the resin layer 20. The lower end of the guide 3 is in contact with the substrate 21, and the guide 3 is located on the outer periphery of the pattern transfer region of the resin layer 20. At this time, pressure is uniformly applied from the mold 10 to the resin layer 20, and an extra part of the resin layer 20 is pushed out from the gap portion 4 shown in FIGS. 18 and 19A. As a result, the resin layer 20 has a desired thickness, and the recess 23 is formed in the resin layer 20. Subsequent steps are substantially the same as those in the first embodiment of the present invention, and thus redundant description is omitted.

  According to the imprint jig 16 according to the third embodiment of the present invention, when the convex portion 12 of the mold 10 is press-fitted into the resin layer 20 as in the case where the guide 3 is provided in the imprint apparatus. The resin layer 20 can be prevented from flowing out irregularly, and a desired pattern shape can be obtained on the resin layer 20 with good reproducibility.

  Furthermore, since the imprint jig 16 has the guide 3, it can be set according to the size of the mold 10 and the resin layer 20 placed on the imprint jig 16, and can be efficiently maintained. .

(Other embodiments)
As described above, the present invention has been described according to the first to third embodiments. However, it should not be understood that the description and drawings constituting a part of this disclosure limit the present invention. From this disclosure, various alternative embodiments, examples and operational techniques will be apparent to those skilled in the art.

  For example, the guide 3 is provided on the outer periphery of the pattern transfer region as shown in FIG. 22 instead of having the gap 4 that discharges an extra part of the resin layer 20 to the outside, and the extra part of the resin layer 20 is removed. You may have the space 4x to accumulate.

  Further, a groove is provided in a portion that contacts the upper end of the guide 3 of the first stage 1 shown in FIG. 4, and the upper end of the guide 3 fits into the groove of the first stage 1 when the convex portion 12 is press-fitted into the resin layer 20. You may do it.

  As described above, the present invention naturally includes various embodiments not described herein. Therefore, the technical scope of the present invention is defined only by the invention specifying matters according to the scope of claims reasonable from the above description.

DESCRIPTION OF SYMBOLS 1 ... 1st stage 2 ... 2nd stage 3 ... Guide 4 ... Gap part 4x ... Space 5 ... Stage holding part 6, 8 ... Drive shaft 7 ... Drive part 9 ... Base 10, 10x ... Mold 11 ... Support part 12 ... Convex part 15 ... Fixing part 16 ... Imprint jig 17, 22 ... Groove part 20 ... Resin layer 21 ... Substrate 23 ... Concave part 24 ... Sacrificial layer

Claims (9)

A first stage on which a mold having a convex portion can be placed;
A second stage facing the first stage and capable of placing a resin layer into which the convex portion is press-fitted,
Pressure placed on at least one of the first and second stages, located on the outer periphery of the pattern transfer region of the resin layer when the convex portion is press-fitted into the resin layer, and applied to the resin layer from the mold An imprinting apparatus comprising: a guide having a gap portion that pushes an extra portion of the resin layer to the outside.   The imprint apparatus according to claim 1, wherein the guide includes at least one of a plate-shaped member, a rod-shaped member, and a spherical member.   The imprint apparatus according to claim 1, wherein the guide has a uniform height.   The imprint apparatus according to claim 1, further comprising a substrate that is disposed on the second stage and on which the resin layer can be placed.   A sacrificial layer that is disposed on the second stage, is capable of placing the resin layer, and reaches the convex portion penetrating the resin layer when the convex portion of the mold is press-fitted into the resin layer; The imprint apparatus according to any one of claims 1 to 3, wherein the apparatus is an imprint apparatus. The guide is disposed on the second stage;
The end of the guide on the first stage side is in contact with the surface of the first stage or the surface of the mold when the convex portion is press-fitted into the resin layer. The imprint apparatus according to claim 1. The guide is disposed on the first stage;
The end portion on the second stage side of the guide is in contact with the surface of the second stage when the convex portion is press-fitted into the resin layer. Imprint device. A support that can be placed on the first stage;
A convex portion arranged on a support portion and press-fitted into a resin layer placed on a second stage facing the first stage;
It is arranged on the outer periphery of the convex part on the support part, and is located on the outer periphery of the pattern transfer region of the resin layer when the convex part is press-fitted into the resin layer, and the pressure applied to the resin layer from the convex part A mold comprising: a guide having a gap that pushes an extra part of the resin layer to the outside. A fixing portion that can be placed on the first stage and fixes a mold having a convex portion;
When the mold is press-fitted into the resin layer placed on the second stage that is disposed on the outer periphery of the area where the mold of the fixing part is fixed and is opposed to the first stage, the pattern transfer area of the resin layer An imprinting jig comprising: a guide that is located on an outer periphery and has a gap that pushes an extra part of the resin layer to the outside by pressure applied to the resin layer from the mold.

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