JP2012214053A - Tablet molding die, tablet, method for manufacturing optical semiconductor element-mounting substrate, and optical semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a tablet molding die appropriate to prevent the surface of a tablet from colored black when a thermosetting light reflecting resin composition is molded into the tablet.SOLUTION: This tablet molding die is provided to mold the thermosetting light reflecting resin composition, containing at least a filling material and a thermosetting resin, into the tablet. An inner surface of the molding die which is brought into contact with at least the resin composition is constituted by a ceramic material or a fluorine material to have a Rockwell hardness R scale of ≥50.

Description

  The present invention relates to a tablet molding die, and more particularly to a tablet molding die suitable for tableting a thermosetting resin composition for light reflection. Furthermore, the present invention relates to a tablet using the molding die, a method for manufacturing an optical semiconductor element mounting substrate using the tablet, and an optical semiconductor device using the optical semiconductor element mounting substrate obtained by the manufacturing method.

  As a method for manufacturing an optical semiconductor device, a method of manufacturing a package (substrate for mounting an optical semiconductor element) using a thermosetting light reflecting resin composition is disclosed (Patent Documents 1 and 2). In this manufacturing method, a cylindrical or prismatic tablet obtained by pressure-molding a thermosetting light reflecting resin composition at room temperature using a tablet molding machine (tablet press) is used as a pot of a transfer molding machine. After insertion, the tablet is melted by pressurizing the plunger, and the melt (resin composition) is filled into the cavity in which the lead frame is set in advance through the runner and gate in the mold. It cures.

JP 2006-140207 A JP 2006-156704 A JP 2002-1733 A

  The thermosetting light reflecting resin composition usually contains a filler such as a white pigment and an inorganic filler in order to ensure light reflectance and moldability in addition to the thermosetting resin. Therefore, when such a composition is tablet-molded by a conventional tablet molding machine, the filler component may scrape the mold surface of the tablet molding machine, and as a result, the resulting tablet surface may be colored black. Since a colored tablet causes a decrease in light reflectance, it is not desirable to use it as a package for an optical semiconductor device. The above problems are considered to occur because the strength of the protective film such as hard chrome plating formed on the inner surface of the molding die of the tablet molding machine is weak. On the other hand, by providing an amorphous carbon film containing fluorine on the contact surface with the resin, a mold for tableting of a resin for semiconductor encapsulation, which has both mold release and wear resistance, is disclosed. (Patent Document 3). However, the disclosed mold is made of a WC-based cemented carbide that is weak against impact on the base material, and the mold tends to be damaged such as chipping.

  In view of the above, an object of the present invention is to provide a tablet mold suitable for preventing the tablet surface from being colored when the thermosetting light reflecting resin composition is molded into a tablet. To do. The present invention also provides a tablet using the molding die, an optical semiconductor element mounting substrate manufacturing method using the tablet, and an optical semiconductor device using the optical semiconductor element mounting substrate obtained by the manufacturing method. The purpose is to provide.

That is, the present invention is characterized by the following items (1) to (13).
(1) A tablet molding die for molding a thermosetting light reflecting resin composition containing at least a filler and a thermosetting resin into a tablet, wherein the molding die is in contact with at least the resin composition. A tablet mold having an inner surface made of a ceramic material or a fluorine material and having a specific hardness.

(2) The tablet molding die according to (1), wherein the inner surface is made of a ceramic material and has a hardness of 70 or more on a Rockwell hardness C scale.

(3) The tablet molding die according to (1), wherein the inner surface is made of a fluororesin material and has a Rockwell hardness R scale of 50 or more.

(4) A thermosetting light reflecting resin composition containing at least a filler and a thermosetting resin is molded using the tablet mold according to any one of (1) to (3) above. The resulting tablet.

(5) The tablet according to (4), wherein the filler contains at least one of an inorganic filler and a white pigment.

(6) The tablet according to (4), wherein the thermosetting light reflecting resin composition contains an epoxy resin, a curing agent, an inorganic filler, a white pigment, and a coupling agent.

(7) The above inorganic filler (5) or (5), wherein the inorganic filler is at least one selected from the group consisting of silica, aluminum hydroxide, magnesium hydroxide, barium sulfate, magnesium carbonate, and barium carbonate. The tablet according to (6).

(8) The white pigment is any one of (5) to (7), wherein the white pigment is at least one selected from the group consisting of alumina, magnesium oxide, antimony oxide, titanium oxide, zirconium oxide, and hollow particles. Tablet.

(9) The tablet according to any one of (5) to (8), wherein the white pigment has an average particle size in the range of 1 to 50 μm.

(10) The total amount of the inorganic filler and the white pigment is in the range of 10% by volume to 95% by volume with respect to the entire resin composition. Tablet.

(11) The tablet according to any one of (4) to (10), wherein the light reflectance at a wavelength of 800 nm to 350 nm is 80% or more.

(12) A method of manufacturing a substrate for mounting an optical semiconductor element in which one or more recesses to be an optical semiconductor element mounting region are formed, wherein at least the recess side wall is any one of the above (4) to (11) A method for producing a substrate for mounting an optical semiconductor element, which is formed by transfer molding using the tablet described above.

(13) An optical semiconductor element mounting substrate manufactured by the manufacturing method according to (12) above,
An optical semiconductor element mounted on the bottom surface of the recess of the optical semiconductor element mounting substrate;
An optical semiconductor device comprising: a phosphor-containing transparent sealing resin layer formed in the recess so as to cover the optical semiconductor element.

  ADVANTAGE OF THE INVENTION According to this invention, when shape | molding the thermosetting light reflection resin composition to a tablet, it becomes possible to provide the tablet molding die which suppresses coloring of the tablet surface. Furthermore, it is possible to obtain an optical semiconductor element mounting substrate and an optical semiconductor device having excellent optical characteristics, particularly light reflectance, by molding a tablet produced using the tablet molding die by transfer molding. Become.

It is typical sectional drawing which shows the structure of the tablet molding die of this invention. It is the schematic explaining the manufacturing method of the board | substrate for optical semiconductor element mounting of this invention, (a)-(c) respond | corresponds to each process of manufacturing a board | substrate by transfer molding. BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows one Embodiment of the optical semiconductor device of this invention, (a) And (b) is side sectional drawing which shows the structure of an apparatus typically, respectively.

Details of the present invention will be described below.
(Tablet mold)
The tablet molding die of the present invention is for molding a thermosetting light reflecting resin composition containing at least a filler and a thermosetting resin into a tablet, and has a pair of a mortar and a ridge or a recess. It has a structure consisting of a pair of upper mold and lower mold, etc., and the inner surface of the mold that comes into contact with the resin composition is composed of a ceramic material or a fluorine material and has a specific hardness. To do.

  One embodiment of the tablet molding die of the present invention is shown in FIG. As shown in FIG. 1, the tablet molding die 10 is composed of a mortar 10a, an upper barb 10b, and a lower barb 10c, and at least the inner surfaces of the mortar and the barb that are in contact with the resin composition 20 are filled with a filler hardness. Or a ceramic-based material or a fluorine-based material so as to have a hardness that does not deform during tablet molding.

  The ceramic material is not particularly limited. For example, oxides, carbides or nitrides such as aluminum, silicon, titanium, tungsten, tantalum, niobium, molybdenum, zirconium, and vanadium, and cobalt or nickel are added to these. Known high-hardness ceramic materials such as materials can be used.

  The fluorine-based resin material is not particularly limited, and examples thereof include fluorine-based resins exhibiting relatively high strength such as a tetrafluoroethylene-ethylene copolymer, a trifluorinated ethylene chloride resin, and a vinylidene fluoride resin. Further, a material obtained by adding a fibrous inorganic material such as glass fiber or whisker as a reinforcing material to these fluorine-based resins may be used.

  In addition, the tablet molding die of the present invention includes, for example, the above ceramic material and fluorine on the inner surface of a mortar and heel made of a known metal, alloy, cemented carbide, etc., in contact with at least the thermosetting light reflecting resin composition. It may be a structure in which a coating of a resin material or the like is formed. As another embodiment, all of the molding dies may be made of the ceramic material or the fluorine resin material. The ceramic-based material or the fluorine-based resin material to be used is not particularly limited, but it is preferably prepared as a white material that has no fear of coloring the tablet.

  As one embodiment of the tablet molding die of the present invention, when the inner surface of the mold that comes into contact with the resin composition at the time of molding is made of a ceramic material, the inner surface has a hardness of 70 or more on the Rockwell hardness C scale. It is preferable to have. As another embodiment, when the inner surface of the mold is made of a fluororesin material, the inner surface preferably has a hardness of 50 or more on the Rockwell hardness R scale.

The “Rockwell hardness” described in the present invention means a value obtained by testing the inner surface of a mold according to the following method.
(Rockwell hardness scale C)
Using a diamond conical indenter with an apex angle of 120 ° and a tip radius of 0.2 mm, a weight of 10 kgf was applied to the inner surface of the mold, then a weight of 150 kgf was added, and the weight was again returned to a weight of 10 kgf. This is a value measured by using a linear gauge to determine the depth of the indenter that has entered the inner surface by weighting.
(Rockwell hardness scale R)
Using a 1/2 inch diameter steel ball, a weight of 10 kgf was applied to the inner surface of the mold, then a weight of 60 kgf was applied, and the weight was returned to 10 kgf again. This is a value obtained by measuring the depth of the indenter with a linear gauge.

(Thermosetting resin composition for light reflection)
Although it does not specifically limit as a shaping | molding object of the tablet molding die of this invention, The tablet molding die of this invention tablet-molds the thermosetting light reflection resin composition containing a filler and a thermosetting resin at least. It is suitable for. In addition, this thermosetting resin composition for light reflection is pressure-molded under conditions of 0.5 to 2 MPa for about 1 to 5 seconds at room temperature (0 to 35 ° C.) before thermosetting. It is desired that the tablet can be formed. Further, it is desirable that the light reflectance at a wavelength of 350 nm to 800 nm after the thermosetting of the thermosetting light reflecting resin composition is 80% or more. If the light reflectance is less than 80%, there is a tendency that it cannot sufficiently contribute to the improvement in luminance of the optical semiconductor device. Moreover, as for the heat conductivity after hardening of this thermosetting light reflecting resin composition, it is desirable that it is the range of 1-10 W / mK. If the thermal conductivity is less than 1 W / mK, the heat generated from the optical semiconductor element cannot be sufficiently released, and the sealing resin or the like may be deteriorated.

Hereinafter, each component which comprises the said thermosetting light reflection resin composition is explained in full detail.
Examples of the thermosetting resin include an epoxy resin, a modified epoxy resin, a silicone resin, a modified silicone resin, an acrylate resin, and a urethane resin, and an epoxy resin is particularly preferable. As the epoxy resin, those generally used for epoxy resin molding materials for electronic component sealing can be used, and are not particularly limited. Examples thereof include phenol novolac epoxy resins and orthocresol novolac epoxy resins. Epoxidized phenol and aldehyde novolak resin, glycidylamine type obtained by reaction of polychlorinated diglycidyl ether such as bisphenol A, bisphenol F, bisphenol S, alkyl-substituted biphenol, diaminodiphenylmethane, isocyanuric acid and epichlorohydrin There are epoxy resins, linear aliphatic epoxy resins obtained by oxidizing olefinic bonds with peracids such as peracetic acid, and alicyclic epoxy resins, and these may be used alone or in combination of two or more. In addition, it is preferable that the epoxy resin used is relatively uncolored, and examples of such an epoxy resin include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, and triglycidyl isocyanate. Nurate can be mentioned.

  Moreover, when the said thermosetting resin is an epoxy resin, you may use a hardening | curing agent and a hardening accelerator together. Any curing agent can be used without particular limitation as long as it reacts with the epoxy resin. For example, an acid anhydride curing agent, a phenol curing agent, and the like can be given. Examples of the acid anhydride curing agent include phthalic anhydride, maleic anhydride, trimellitic anhydride, pyromellitic anhydride, hexahydrophthalic anhydride, tetrahydrophthalic anhydride, methyl nadic anhydride, nadic anhydride, glutaric anhydride. Examples thereof include acid, methylhexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, and the like. These may be used alone or in combination of two or more. Among these acid anhydride curing agents, phthalic anhydride, hexahydrophthalic anhydride, tetrahydrophthalic anhydride, and methylhexahydrophthalic anhydride are preferably used. The acid anhydride curing agent preferably has a molecular weight of about 140 to 200, and is preferably a colorless or light yellow acid anhydride.

  Moreover, the said hardening | curing agent is set so that the active group (an acid anhydride group or a hydroxyl group) which can react with the epoxy group in a hardening | curing agent will be 0.5-1.5 equivalent with respect to 1 equivalent of epoxy groups in an epoxy resin. It is preferable to mix | blend and it is more preferable to mix | blend so that it may become 0.7-1.2 equivalent. When the active group is less than 0.5 equivalent, the curing rate of the epoxy resin composition is slowed, and the glass transition temperature of the resulting cured product may be lowered. The moisture resistance may be reduced.

  The curing accelerator is not particularly limited. For example, 1,8-diaza-bicyclo (5,4,0) undecene-7, triethylenediamine, tri-2,4,6-dimethylaminomethylphenol Tertiary amines such as 2-ethyl-4-methylimidazole, imidazoles such as 2-methylimidazole, triphenylphosphine, tetraphenylphosphonium tetraphenylborate, tetra-n-butylphosphonium-o, o-diethylphosphoro Examples thereof include phosphorus compounds such as dithioate, quaternary ammonium salts, organometallic salts, and derivatives thereof. These may be used alone or in combination. Among these curing accelerators, it is preferable to use tertiary amines, imidazoles, and phosphorus compounds.

  Moreover, it is preferable that the content rate of a hardening accelerator is 0.01 to 8.0 weight% with respect to an epoxy resin, More preferably, it is 0.1 to 3.0 weight%. When the content of the curing accelerator is less than 0.01% by weight, a sufficient curing acceleration effect may not be obtained. When the content exceeds 8.0% by weight, discoloration is observed in the obtained cured product. There is.

  Although it does not specifically limit as a filler, For example, a white pigment for improving an inorganic filler and light reflectivity can be used.

  As the inorganic filler, for example, at least one selected from the group consisting of silica, aluminum hydroxide, magnesium hydroxide, barium sulfate, magnesium carbonate, and barium carbonate can be used. In view of reflection characteristics, moldability, and flame retardancy, it is preferable to use aluminum hydroxide in combination. The average particle diameter of the inorganic filler is not particularly limited, but is preferably in the range of 1 to 100 μm in consideration of packing efficiency with the white pigment.

  Examples of the white pigment include alumina, magnesium oxide, antimony oxide, titanium oxide, zirconium oxide, and hollow particles, and these may be used alone or in combination. Examples of the hollow particles include sodium silicate glass, aluminum silicate glass, borosilicate soda glass, and shirasu. From the viewpoint of thermal conductivity and light reflection characteristics, it is preferable to use at least alumina or magnesium oxide or a combination thereof. Moreover, it is preferable that the average particle diameter of a white pigment has a center particle diameter in the range of 0.1-50 micrometers. If the average particle size is less than 0.1 μm, the particles tend to aggregate and the dispersibility tends to deteriorate, and if it exceeds 50 μm, the reflection characteristics tend not to be sufficiently obtained.

  The total amount of the inorganic filler and the white pigment is preferably in the range of 10% by volume to 95% by volume, and in the range of 85% by weight to 95% by weight with respect to the entire resin composition. Is more preferable. If this blending amount is less than 10% by volume, the light reflection characteristics of the cured product may be insufficient. On the other hand, if it exceeds 95% by volume, the moldability of the resin composition deteriorates, making it difficult to produce a substrate for mounting an optical semiconductor element.

  You may add additives, such as a coupling agent, antioxidant, a mold release agent, and an ion supplement agent, to the said thermosetting resin composition for light reflections as needed.

  The coupling agent is not particularly limited, and for example, a silane coupling agent or a titanate coupling agent can be used. Examples of the silane coupling agent include epoxy silane, amino silane, and cationic. A silane system, a vinyl silane system, an acrylic silane system, a mercapto silane system, a composite system thereof, or the like can be used. The type of the coupling agent and the treatment conditions are not particularly limited, but the amount of the coupling agent is preferably 5% by weight or less with respect to the entire resin composition.

  The thermosetting light reflecting resin composition can be obtained by uniformly dispersing and mixing the various components described above, and means and conditions thereof are not particularly limited. As a general method, a predetermined amount of ingredients are sufficiently uniformly stirred and mixed by a mixer or the like, then kneaded by a mixing roll, an extruder, a kneader, a roll, an extruder, etc., and cooled and pulverized as necessary. A method can be mentioned.

  The tablet of the present invention is formed by molding a molding material such as the thermosetting light reflecting resin composition as described above using the tablet molding die of the present invention. Various conditions for molding may be appropriately determined according to the composition of the molding material and the like, and are not particularly limited, but are preferably performed at room temperature under conditions of about 0.5 to 2 MPa and about 1 to 5 seconds. Further, the shape and size of the tablet may be determined as appropriate according to the application and the like, and are not particularly limited. For example, in the case of a tablet used by setting it in a pot of a general transfer molding machine, it is typically formed into a cylindrical shape, the size is φ13 mm, and the thickness varies depending on the molding volume, but is in the range of 10 to 50 mm. It is desirable.

  The substrate for mounting an optical semiconductor element according to the present invention has a configuration in which one or more recesses to be an optical semiconductor element mounting region and a wiring pattern (lead frame) are integrated, and at least the recess side walls are tablets of the present invention. It is formed by transfer molding using FIG. 2 is a schematic diagram for explaining a method for producing a substrate for mounting an optical semiconductor element according to the present invention, wherein (a) to (c) correspond to respective steps for producing a substrate by transfer molding. More specifically, for example, as shown in FIG. 2A, the substrate for mounting an optical semiconductor element is formed with a metal wiring 105 by a known method such as punching or etching from a metal foil, and then the metal wiring 105. Is placed in a mold 301 having a predetermined shape (FIG. 2B), and a thermosetting light reflecting resin composition is injected from a resin injection port 300 of the mold 301. Subsequently, the injected resin composition is preferably cured at a mold temperature of 170 to 190 ° C. and a molding pressure of 2 to 8 MPa for 60 to 120 seconds, then the mold 301 is removed, and the after cure temperature is 120 to 180 ° C. Heat cure for ~ 3 hours. Next, the Ni / silver plating 104 is applied by electroplating to a predetermined position of the concave portion 200 which is surrounded by the reflector 103 made of the cured thermosetting light reflecting resin composition and becomes the optical semiconductor element mounting region. (Fig. 2 (c)).

  An optical semiconductor device using the optical semiconductor element mounting substrate of the present invention includes, for example, the optical semiconductor element mounting substrate of the present invention, an optical semiconductor element mounted on the bottom surface of the recess of the optical semiconductor element mounting substrate, and an optical semiconductor. And a phosphor-containing transparent sealing resin layer formed in the recess so as to cover the element. FIG. 3A and FIG. 3B are side sectional views showing an embodiment of the optical semiconductor device of the present invention. More specifically, the optical semiconductor device shown in FIG. 3 has an optical semiconductor at a predetermined position at the bottom of a concave portion (reference numeral 200 in FIG. 2) which is an optical semiconductor element mounting region of the optical semiconductor element mounting substrate 110 of the present invention. An element 100 is mounted, and the optical semiconductor element 100 and the metal wiring 105 are electrically connected through a Ni / silver plating 104 by a known method such as a bonding wire 102 or a solder bump 107, and the optical semiconductor element 100 is It is covered with a transparent sealing resin 101 containing a known phosphor 106.

EXAMPLES Hereinafter, although an Example explains in full detail this invention, the scope of the present invention is not limited to these Examples.
Example 1
Example 1 relates to the production of the tablet of the present invention. First, a thermosetting light reflecting resin composition was prepared by roll kneading the components shown below under conditions of a kneading temperature of 20 to 30 ° C. and a kneading time of 10 minutes.
(Curable resin composition for light reflection)
Epoxy resin:
100 parts by weight of triglycidyl isocyanurate
(Epoxy equivalent 100)
Curing agent:
Hexahydrophthalic anhydride 140 parts by weight Curing accelerator:
Tetra-n-butylphosphonium 2.4 parts by weight
o, o-Diethyl phosphorodithioate Inorganic filler:
Fused silica (average particle size 20 μm) 600 parts by weight Alumina (average particle size 1 μm) 890 parts by weight White pigment:
185 parts by weight of hollow particles (average particle size 27 μm) (“Glass Bubbles S60HS (trade name)” manufactured by 3M)
Coupling agent:
19 parts by weight of epoxy silane Antioxidant:
9,10-dihydro-9-oxa-10-1 part by weight phosphaphenanthrene-10-oxide Next, the above thermosetting light reflecting resin composition was used at room temperature (25 ° C.) using a molding die made of alumina. Molding was performed under conditions of a molding pressure of 2 MPa for 3 seconds to produce a cylindrical tablet having a diameter of 13 mm and a thickness of 15 mm. The molding die has a structure composed of a pair of pestle and mortar (see FIG. 1), and the hardness of the surface in contact with the resin composition during molding (hereinafter referred to as “surface hardness”) is a lock. It was 80.0 on the well hardness C scale.

(Example 2)
A tablet was produced in the same manner as in Example 1 except that a molding die made of a tetrafluoroethylene-ethylene copolymer was used instead of the molding die made of alumina. The surface hardness of the molding die was 50 on the Rockwell hardness R scale.

(Example 3)
A tablet was produced in the same manner as in Example 1 except that a molding die made of a trifluoroethylene chloride resin was used instead of the molding die made of alumina. The surface hardness of the molding die was 93 on the Rockwell hardness R scale.

Example 4
A tablet was produced in the same manner as in Example 1 except that a molding die made of vinylidene fluoride resin was used instead of the molding die made of alumina. The surface hardness of the molding die was 110 on the Rockwell hardness R scale.

(Comparative Example 1)
A tablet was produced in the same manner as in Example 1 except that a molding die whose main body was made of an iron-nickel alloy and whose surface in contact with the resin composition was chrome-plated was used instead of the molding die made of alumina. . The surface hardness of the molding die was 65 on the Rockwell hardness R scale.

(Comparative Example 2)
A tablet was produced in the same manner as in Example 1 except that a molding die whose main body was made of an iron-nickel alloy and whose surface in contact with the resin composition was die-chromon plated was used instead of the molding die made of alumina. . The surface hardness of the molding die was 68 on the Rockwell hardness R scale.

(Comparative Example 3)
A tablet was produced in the same manner as in Example 1 except that a molding die made of tetrafluoroethylene resin was used instead of the molding die made of alumina. However, the molding die is soft, and the collar portion of the molding die is deformed at the time of molding, so that a tablet cannot be produced. The surface hardness of the molding die was 18 on the Rockwell hardness R scale.

<Tablet evaluation test>
The surface coloring and light reflectance of the tablets prepared in each Example and each Comparative Example were evaluated as follows. The results are shown in Table 1.
(Surface coloring)
○: Coloring cannot be confirmed visually
X: Coloration is observed visually (light reflectance)
Each tablet was set in a pot of a transfer molding machine and melted under pressure with a plunger. Then, this tablet was cured and molded under conditions of a mold temperature of 180 ° C., a molding pressure of 6.9 MPa, and a curing time of 90 seconds, and 150 Post-curing was performed at 2 ° C. for 2 hours to prepare a test piece for light reflectance measurement having a thickness of 1.0 mm. About each produced test piece, the light reflectivity in wavelength 350-800 nm was each measured using the integrating sphere type spectrophotometer V-750 type (made by JASCO Corporation), and it evaluated according to the following. The results are shown in Table 1.
Evaluation criteria for light reflectance
○: Light reflectance of 80% or more
Δ: Light reflectance 70% or more and less than 80%
×: Less than 70% light reflectance

  As shown in Table 1, the surface (side wall) of the tablet of each example is not colored, and the light reflectance of the molded product (test piece) produced from the tablet of each example is all It was 80% or more.

DESCRIPTION OF SYMBOLS 10 Tablet shaping | molding die 10a Mortar 10b Upper gutter 10c Lower gutter 20 Resin composition 100 Optical semiconductor element (LED element)
101 transparent sealing resin 102 bonding wire 103 reflector (thermosetting resin composition for light reflection)
104 Ni / Ag plating 105 Metal wiring 106 Phosphor 107 Solder bump 110 Optical semiconductor element mounting substrate 200 Optical semiconductor element mounting region (recess)
300 Resin inlet 301 Mold

Claims (11)

  A tablet molding die for molding a thermosetting light reflecting resin composition containing at least a white pigment and a thermosetting resin into a tablet, wherein at least the inner surface of the molding die in contact with the resin composition is A tablet molding die comprising a fluorine material and having a Rockwell hardness R scale of 50 or more.   A tablet obtained by molding a thermosetting light reflecting resin composition containing at least a white pigment and a thermosetting resin, using the tablet molding die according to claim 1.   The tablet according to claim 2, wherein the thermosetting light reflecting resin composition further contains an inorganic filler.   The tablet according to claim 2, wherein the thermosetting light reflecting resin composition contains an epoxy resin, a curing agent, an inorganic filler, a white pigment, and a coupling agent.   The inorganic filler is at least one selected from the group consisting of silica, aluminum hydroxide, magnesium hydroxide, barium sulfate, magnesium carbonate, and barium carbonate. Tablet.   The tablet according to any one of claims 2 to 5, wherein the white pigment is at least one selected from the group consisting of alumina, magnesium oxide, antimony oxide, titanium oxide, zirconium oxide, and hollow particles.   The tablet according to any one of claims 2 to 6, wherein an average particle diameter of the white pigment is in a range of 1 to 50 µm.   The tablet according to any one of claims 3 to 7, wherein a total amount of the inorganic filler and the white pigment is in a range of 10% by volume to 95% by volume with respect to the entire resin composition.   The tablet according to any one of claims 2 to 8, wherein the light reflectance at a wavelength of 800 nm to 350 nm is 80% or more.   It is a manufacturing method of the board | substrate for optical semiconductor element mounting in which one or more recessed parts used as an optical semiconductor element mounting area | region are formed, Comprising: At least the said recessed part side wall WHEREIN: A method for producing a substrate for mounting an optical semiconductor element, wherein the substrate is formed by transfer molding used. An optical semiconductor element mounting substrate manufactured by the manufacturing method according to claim 10;
An optical semiconductor element mounted on the bottom of the recess of the optical semiconductor element mounting substrate;
An optical semiconductor device comprising: a phosphor-containing transparent sealing resin layer formed in the recess so as to cover the optical semiconductor element.

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