JP2012212623A - Socket for electric component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a socket for electric component which can stabilize the seating height of a unit even if it is difficult to finish the thickness of the unit with high accuracy.SOLUTION: An IC socket 11 has a socket body 14 fixed to a wiring board P and in which an IC package 12 is housed, and a unit 13 in which multiple contact pins 20 are arranged. The unit 13 is provided to move up and down freely for the socket body 14, and the multiple contact pins 20 are configured so that a plunger 26 on the underside abuts against the wiring board P with a predetermined contact pressure while being urged downward. A coil spring 24 which presses the unit 13 downward is provided between the socket body 14 and the unit 13.

Description

  The present invention relates to a socket for an electric component that is disposed on a wiring board and accommodates the electric component in order to test an electric component such as a semiconductor device (hereinafter referred to as “IC package”).

  Conventionally, as this type of “electrical component socket”, for example, there is an IC socket that detachably accommodates an IC package as an “electrical component” (see, for example, Patent Document 1).

  As shown in FIGS. 4 and 5, the IC socket 11 is provided with a large number of contact pins 20 in the unit 13. The unit 13 is sandwiched by the socket body 14 and fixed to the wiring board P by light press-fitting. It has a structure. In the IC socket 11 having such a structure, in order to allow the unit 13 to be easily assembled to the socket main body 14, a predetermined amount (for example, between the recessed portion 14a of the socket main body 14 and the sandwiched portion 13a of the unit 13). , About 0.1 mm) is formed in the height direction (vertical direction). In particular, when the unit 13 is manufactured by cutting or the like, it is difficult to finish the thickness dimension T1 of the sandwiched portion 13a of the unit 13 with high accuracy as designed, and thus the clearance C1 must be increased.

JP 2007-311170 A

  However, in such a conventional IC socket 11, since the clearance C1 is formed between the socket body 14 and the unit 13, the IC socket 11 is attached to the wiring board P as shown in FIG. When mounted, the entire unit 13 is lifted from the wiring board P by a height equal to the clearance C1 due to the reaction force of the lower plunger 26 of the contact pin 20 in contact with a pad (not shown) of the wiring board P. Therefore, the seating height (height of the seating surface G) of the unit 13 is higher than the design value by that amount.

  As a result, a pressing member (not shown) having a rotating structure, for example, provided for pressing the IC package 12 accommodated in the socket body 14 from above interferes with the IC package 12, and the IC package 12 is normally operated by this pressing member. There was a risk of being unable to press.

  Further, since the unit 13 is provided with a large number of contact pins 20, foreign matters are caught between the pads of the wiring board P and the lower plungers 26 of the contact pins 20 due to the floating of the unit 13. There is a possibility that a contact failure occurs between the pad of the wiring board P and the contact pin 20 or a short circuit occurs between the adjacent pad and the contact pin 20 in the portion where the pin is sandwiched.

  Accordingly, an object of the present invention is to provide an electrical component socket capable of stabilizing the seating height of the unit even when it is difficult to finish the thickness dimension of the unit with high accuracy.

  In order to achieve the above object, the present invention includes a socket body fixed to a wiring board and accommodating an electrical component, and a unit in which a plurality of contact pins are disposed, and the unit includes the socket body The plurality of contact pins are configured to contact the wiring board with a predetermined contact pressure in a state where the lower contact portion is biased downward, and the socket body An electrical component socket provided with an elastic member for pressing the unit downward is provided between the unit and the unit.

  Another feature is that the pressing force of the elastic member is such that the lower surface of the unit contacts the upper surface of the wiring board when the socket body is fixed to the wiring board. This is because it is set to be larger than the reaction force of the contact portion.

  Another feature is that the elastic member is provided with a stopper member that restrains the unit from moving downward from a predetermined lowest position.

  According to the present invention, since the unit is pressed downward by the elastic member, even when the reaction force of the contact portion of the contact pin is generated when the IC socket is mounted on the wiring board, the unit is prevented from being lifted. be able to. Therefore, even when it is difficult to finish the thickness dimension of the unit with high accuracy, the seating height of the unit can be stabilized. As a result, for example, even when an electrical component is pressed obliquely from above with a rotary pressing member, the electrical component can be normally pressed, and contact pins that cause poor contact with the pads of the wiring board are generated. It can be avoided.

  According to another feature, the pressing force of the elastic member causes the reaction force of the contact portions of the plurality of contact pins so that the lower surface of the unit comes into contact with the upper surface of the wiring board when the socket body is fixed to the wiring board. Since it is set larger, the height of the bottom surface of the socket body and the height of the bottom surface of the unit are more accurately matched when the IC socket is mounted on the wiring board, regardless of the magnitude of the reaction force of this contact part. Can be made.

  According to another feature, the elastic member is provided with a stopper member that restrains the downward movement of the unit from a predetermined lowest level, thereby preventing the unit from being separated from the socket body, and the wiring board of the IC socket. Can be implemented smoothly.

It is sectional drawing of the socket for electrical components which concerns on embodiment of this invention. It is an expanded sectional view which shows the unit of the socket for electrical components which concerns on the embodiment. It is sectional drawing which shows the state which mounted the socket for electrical components which concerns on the embodiment on the wiring board. It is sectional drawing of the conventional socket for electrical components. It is sectional drawing which shows the state which mounted the conventional socket for electrical components in the wiring board.

  Embodiments of the present invention will be described below.

  1 to 3 show an embodiment of the present invention.

  First, the configuration will be described. Reference numeral 11 in FIG. 1 denotes an IC socket as a “socket for electrical components”. The IC socket 11 is arranged on the wiring board P. In order to perform a burn-in test or the like of the IC package 12 (see FIG. 3) or the like, electrical connection between the plurality of spherical terminals 12a of the IC package 12 and the wiring board P is intended.

  As shown in FIGS. 1 and 3, the IC socket 11 is fixed on the wiring board P and is disposed on the wiring board P and the socket main body 14 in which the IC package 12 is accommodated. Unit 13.

  As shown in FIG. 1, the unit 13 includes a flat plate-like first plate 16, a flat plate-like second plate 17 disposed above the first plate 16, and the second plate 17. A floating plate 18 disposed and a columnar positioning pin 19 disposed below the first plate 16 are provided. The first plate 16 and the second plate 17 are fixed by a countersunk screw 21 and a nut 22 in a state where a predetermined interval is maintained by the spacer 23. A floating plate 18 is urged upward by a spring (not shown) above the second plate 17. The first plate 16, the second plate 17, and the floating plate 18 are formed with a large number of through holes 16a, 17c, and 18a penetrating in the vertical direction, as shown in FIGS. Contact pins 20 are disposed in the through holes 16a, 17c, and 18a.

  As shown in FIG. 2, each contact pin 20 is attached to a lower plunger 26 as an electrically conductive “contact portion”, an upper plunger 27, and the plungers 26, 27 in the vertical direction separating from each other. And an electrically conductive spring 29.

  Further, as shown in FIG. 1, the socket body 14 has a rectangular frame shape, and a recess 14 a is formed in the lower part. An upper wall 15 is formed on the upper side of the recess 14a, and the unit 13 is supported on the upper wall 15 so as to be movable up and down by a rivet 25 as a “stopper member”. In addition, a coil spring 24 as an “elastic member” is disposed between the upper wall portion 15 and the unit 13 so as to be stretchable so as to urge the upper wall portion 15 and the unit 13 in the vertical direction away from each other. It is installed.

  More specifically, as shown in FIG. 1, a recess 17a is formed in the peripheral portion of the second plate 17 of the unit 13, and a recess 15a is formed in the upper wall portion 15 of the socket body 14, and these recesses 17a, 17a, A coil spring 24 is fitted to 15a to urge the upper wall portion 15 and the second plate 17 (accordingly, the unit 13) in the vertical direction away from each other. Further, a through hole 17b is formed in the peripheral portion of the second plate 17 of the unit 13, and a through hole 15b is formed in the upper wall portion 15 of the socket body 14. The shaft of the rivet 25 is formed in these through holes 17b and 15b. The portion 25 a is penetrated, and the lower and upper flange portions 25 b and 25 c of the rivet 25 are in contact with the lower surface of the second plate 17 and the upper surface of the upper wall portion 15, respectively. Therefore, the unit 13 is restrained from moving downward from a predetermined lowest position (position shown in FIG. 1) by the flange portion 25 b of the rivet 25.

  The pressing force of the coil spring 24 is such that when the socket body 14 is fixed to the wiring board P, the plunger on the lower side of the contact pin 20 so that the lower surface 13b of the unit 13 contacts the upper surface of the wiring board P. It is set to be larger than the reaction force 26 (the urging force of the spring 29).

  Next, a method of using the IC socket 11 will be described with reference to FIG.

  First, as shown in FIG. 3, the IC socket 11 is mounted on the wiring board P, and the socket body 14 is fixed to the wiring board P. As a result, each contact pin 20 rises against the elasticity of the spring 29 in such a manner that the lower plunger 26 contacts each pad (not shown) of the wiring board P and is pushed up by this pad. Moreover, the pressing force of the coil spring 24 pressing the unit 13 downward is larger than the reaction force of the plunger 26 on the lower side of the contact pin 20 as described above. For this reason, the lower surface 13 b of the unit 13 does not float from the wiring substrate P and maintains a state in which it abuts on the upper surface of the wiring substrate P. Accordingly, the height of the lower surface 13b of the unit 13 substantially matches the height of the lower surface 14b of the socket body 14, and the seating height of the unit 13 (the height of the seating surface G) matches the design value. Therefore, even when it is difficult to finish the thickness dimension of the unit 13 with high accuracy (for example, when the unit 13 is manufactured by cutting), the seating height of the unit 13 can be stabilized.

  Subsequently, as shown in FIG. 3, the IC package 12 is accommodated on the floating plate 18 of the IC socket 11, and a pressing member (not shown) is rotated to press the IC package 12 downward. As a result, the floating plate 18 moves down together with the IC package 12, and each spherical terminal 12 a of the IC package 12 contacts the plunger 27 on the upper side of each contact pin 20. As a result, the spherical terminals 12a of the IC package 12 and the pads of the wiring board P are electrically connected to each other through the contact pins 20.

  At this time, as described above, since the seating height of the unit 13 matches the design value, for example, when the IC package 12 is pressed by the rotary pressing member, the pressing member may interfere with the IC package 12. The IC package 12 can be normally pressed with a predetermined pressing force. In addition, since the unit 13 does not float from the wiring board P, no foreign matter is caught between the pads of the wiring board P and the lower plungers 26 of the contact pins 20, and all the contact pins 20 and the wiring board are not caught. The contact state with the pad of P can be kept good.

  Moreover, since the rivet 25 is attached to the coil spring 24 as described above, it is possible to prevent the unit 13 from being separated from the socket body 14. As a result, the IC socket 11 can be smoothly mounted on the wiring board P.

  In this state, a current is passed through the IC package 12 to perform a burn-in test or the like. At this time, as described above, the IC package 12 is normally pressed with a predetermined pressing force, and the contact state between all the contact pins 20 and the pads of the wiring board P is maintained well. Etc. can be performed without hindrance.

  In the above embodiment, the present invention is applied to the IC socket 11 as the “electrical component socket”. However, the present invention is not limited to this and can be applied to other devices.

  In the above embodiment, the contact pin 20 composed of the three components of the lower plunger 26, the upper plunger 27, and the spring 29 has been described. However, the present invention is also applied to the contact pin 20 having other configurations. can do.

  Furthermore, in the above-described embodiment, the unit 13 composed of the first plate 16, the second plate 17, the floating plate 18 and the like has been described. However, the present invention can be applied to units 13 having other configurations. .

11 IC socket (socket for electrical parts)
12 IC package (electrical parts)
13 units
13b bottom
14 Socket body
20 Contact pin
24 Coil spring (elastic member)
25 Rivet (stopper member)
26 Lower plunger (contact part)
P Wiring board

Claims (3)

A socket body fixed to the wiring board and containing electrical components, and a unit in which a plurality of contact pins are disposed;
The unit is provided to be movable up and down with respect to the socket body,
The plurality of contact pins are configured to abut on the wiring board with a predetermined contact pressure in a state where the lower contact portion is biased downward,
An electrical component socket, wherein an elastic member for pressing the unit downward is provided between the socket body and the unit.   The pressing force of the elastic member is a reaction force of the contact portions of the plurality of contact pins such that when the socket body is fixed to the wiring board, the lower surface of the unit comes into contact with the upper surface of the wiring board. The electrical component socket according to claim 1, wherein the electrical component socket is set larger.   The electrical component socket according to claim 1, wherein the elastic member is provided with a stopper member that restrains the unit from moving downward from a predetermined lowest position.

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