JP2012208521A - Liquid crystal display device - Google Patents

Liquid crystal display device Download PDF

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JP2012208521A
JP2012208521A JP2012157767A JP2012157767A JP2012208521A JP 2012208521 A JP2012208521 A JP 2012208521A JP 2012157767 A JP2012157767 A JP 2012157767A JP 2012157767 A JP2012157767 A JP 2012157767A JP 2012208521 A JP2012208521 A JP 2012208521A
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liquid crystal
display device
crystal display
back side
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JP5193380B2 (en
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Hideyuki Chikasawa
秀之 近澤
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Sharp Corp
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Abstract

PROBLEM TO BE SOLVED: To prevent deterioration in maintainability and occurrence of useless space in a liquid crystal display device arranging a plurality of LED substrates mounted with LEDs at a back side of a liquid crystal panel, and also to prevent LED light leakage and leakage of unnecessary radiation from the LED substrates.SOLUTION: A liquid crystal display device comprises: a plurality of LED substrates 30 arranged at a back side of a liquid crystal panel 20; a plurality of connection members 60 between substrates which electrically connect adjacent LED substrates 30 at each back; a back light chassis 40 for supporting a plurality of the LED substrates 30 at the back and having apertures 40a formed at a portion corresponding to each mounted position of the plurality of the substrate connection members 60 between substrates; and a removable chassis tray 50 covering the back light chassis 40 at the back to shade light leaked from the apertures 40a.

Description

本発明は、LEDの照射光により液晶パネルがその背面側から照明される液晶表示装置に関するものである。   The present invention relates to a liquid crystal display device in which a liquid crystal panel is illuminated from the back side by irradiation light of an LED.

近年、液晶テレビジョン受像機に代表される液晶表示装置においては、色再現範囲を拡大し、高画質化することへの要求が強まっている。この要求に対応するため、昨今、発光色の色純度が高いLEDを光源とするバックライトにより照明される液晶パネルを備えた液晶表示装置が普及しつつある。LEDをバックライト用光源とする液晶表示装置は、一般的なsRGB規格の規定よりも広い色再現範囲を実現し、従来よりも鮮やかな(彩度の高い)色の映像を表示可能である。
LEDをバックライト用光源とする液晶表示装置は、その前面側から背面側に向けて、液晶パネル、LEDの実装基板(以下、LED基板という)、該LED基板を背面側で支持するバックライトシャーシ(LED基板支持部材)が重なるよう配置された積層構造を有している。
In recent years, in a liquid crystal display device typified by a liquid crystal television receiver, there is an increasing demand for expanding the color reproduction range and improving the image quality. In order to meet this demand, recently, a liquid crystal display device including a liquid crystal panel illuminated by a backlight using an LED having high emission color purity as a light source is becoming widespread. A liquid crystal display device using an LED as a light source for backlight realizes a color reproduction range wider than that of the general sRGB standard, and can display an image of a brighter (higher saturation) color than the conventional one.
A liquid crystal display device using an LED as a light source for backlight is a backlight chassis that supports a liquid crystal panel, an LED mounting substrate (hereinafter referred to as an LED substrate), and the LED substrate on the back side from the front side to the back side. It has a laminated structure in which (LED substrate support members) are arranged to overlap.

また一方、液晶表示装置は、画面サイズ(液晶パネルのサイズ)の多様化が進み、様々な画面サイズの製品が市場に提供されている。
そこでLEDをバックライト用光源とする液晶表示装置においては、液晶パネルの背面側に対向配置するLED基板として、少数のLEDが実装された比較的小さなサイズの基板とし、このLED基板の数及び配置を画面サイズに応じて適宜に変更している。これにより、様々な画面サイズの液晶表示装置において、LED基板の共通化が図れ、設計期間の短縮、及びコスト抑制等の効果が得られるからである。
また、特許文献1には、表示パネルユニットが、上方に配置されるトップブラケットと下方に配置されるシャーシプレートとにより支持され、そのトップブラケット及びシャーシプレートの取り付け位置が、表示パネルのサイズに対応して選択される構成が示されている。
On the other hand, liquid crystal display devices have been diversified in screen size (the size of a liquid crystal panel), and products having various screen sizes are provided on the market.
Therefore, in a liquid crystal display device using LEDs as a light source for backlight, the LED substrate opposed to the back side of the liquid crystal panel is a relatively small-sized substrate on which a small number of LEDs are mounted, and the number and arrangement of the LED substrates. Is appropriately changed according to the screen size. This is because in various liquid crystal display devices having various screen sizes, the LED substrate can be used in common, and effects such as shortening the design period and cost reduction can be obtained.
In Patent Document 1, a display panel unit is supported by a top bracket disposed above and a chassis plate disposed below, and the mounting positions of the top bracket and the chassis plate correspond to the size of the display panel. The configuration to be selected is shown.

ところで、複数のLED基板が液晶パネルの背面側に配列された場合、それらLED基板各々を電気的に接続する部材(以下、基板間接続部材という)、例えば、LED基板に対する接続用のコネクタが設けられたFPC(Flexible Printed Circuits )やハーネス等を設ける必要がある。
また、装置の薄型化の要請から、液晶パネルとLED基板との間のスペースは非常に狭く、この狭いスペースに光拡散用の導光板等が配置される。そのため、前記基板間接続部材は、LED基板の背面側、即ち、液晶パネルが位置する側(前面側)に対して反対側に装着されることになる。
By the way, when a plurality of LED substrates are arranged on the back side of the liquid crystal panel, a member (hereinafter referred to as an inter-substrate connecting member) for electrically connecting each LED substrate, for example, a connector for connecting to the LED substrate is provided. FPCs (Flexible Printed Circuits), harnesses, etc. must be provided.
In addition, due to the demand for thinning the device, the space between the liquid crystal panel and the LED substrate is very narrow, and a light guide plate for light diffusion is arranged in this narrow space. Therefore, the inter-substrate connecting member is mounted on the back side of the LED substrate, that is, on the side opposite to the side where the liquid crystal panel is located (front side).

特開2007−334244号公報JP 2007-334244 A

しかしながら、LED基板を背面側に装着した基板間接続部材で接続した場合、この基板間接続部材の部分がLED基板の背面側に突出する。そのためLED基板は、バックライトシャーシの支持面上から、基板間接続部材の突出高さ分の間隔を隔てて配置されることとなり、バックライトシャーシの前面側(LED基板の支持面側)に無駄なスペースが発生し、液晶表示装置の薄型化要求に応えることが難しいという問題点がある。さらにこの場合、バックライトのメンテナンスに際し、バックライトシャーシからLED基板一つ一つを取り外さなければ基板間接続部材の着脱が行えず、メンテナンス性が悪いという問題点もある。
この問題点は、バックライトシャーシの基板間接続部材の装着位置に対応する部分に開口を設け、この開口から基板間接続部材を突出させることで解決可能である。この場合、バックライトシャーシをLED基板に近接配置することができ、バックライトシャーシの前面側に無駄なスペースが生じず、また、開口を通してバックライトシャーシの背面側から基板間接続部材を着脱することができ、メンテナンス性が良好となる。
しかしながら、バックライトシャーシに開口を設けると、バックライトシャーシ内のLEDの発光が、各LED基板の隙間及び前記バックライトシャーシの開口を通じて背面側に漏れ出すという問題がある。さらにこの漏れ出し光は、背面側のキャビネット(外装)の放熱孔を通じて装置の外部にまで漏れ出すため、製品としての品位が低下するという問題がある。また、LEDの発光が装置の外部に漏れる状態は、ホコリやカルキ(石灰)等の浮遊物質が装置の外部からバックライトシャーシ内に浸入しやすい状態であり、このような浮遊物質の侵入は、液晶パネルの照明性能の低下にもつながる。
さらに、高周波数でのPWM制御がなされるLED基板から発生した不要輻射が、バックライトシャーシの開口から外部に漏れ、他の機器のノイズとなり得るという問題点もある。
本発明は上記事情に鑑みてなされたものであり、その目的とするところは、LEDが実装された複数のLED基板を液晶パネルの背面側に並べて配列し、隣り合うLED基板同士を基板間接続部材で接続してある液晶表示装置において、メンテナンス性の悪化及び無駄なスペースの発生を防止できるとともに、LEDの光の漏れ出し、LED基板からの不要輻射の漏れを防止することにある。
However, when the LED substrate is connected by the inter-substrate connecting member mounted on the back side, the inter-substrate connecting member portion protrudes to the back side of the LED substrate. For this reason, the LED board is disposed on the support surface of the backlight chassis at a distance corresponding to the protruding height of the inter-board connection member, and is wasted on the front side of the backlight chassis (the support surface side of the LED board). There is a problem that a large space is generated and it is difficult to meet the demand for thinning the liquid crystal display device. Further, in this case, when the backlight is maintained, the inter-substrate connecting member cannot be attached / detached unless the LED substrates are removed from the backlight chassis, resulting in poor maintenance.
This problem can be solved by providing an opening in a portion corresponding to the mounting position of the inter-substrate connecting member of the backlight chassis and projecting the inter-substrate connecting member from this opening. In this case, the backlight chassis can be arranged close to the LED board, no useless space is generated on the front side of the backlight chassis, and the inter-board connecting member can be detached from the back side of the backlight chassis through the opening. And maintainability is improved.
However, if an opening is provided in the backlight chassis, there is a problem in that light emitted from the LEDs in the backlight chassis leaks to the back side through the gaps between the LED boards and the openings in the backlight chassis. Further, since the leaked light leaks to the outside of the apparatus through the heat radiating hole of the back side cabinet (exterior), there is a problem that the quality of the product is lowered. In addition, the state where the light emission of the LED leaks to the outside of the device is a state in which floating substances such as dust and lime (lime) are likely to enter the backlight chassis from the outside of the device. It also leads to a decline in the lighting performance of the LCD panel.
Further, there is a problem that unnecessary radiation generated from the LED substrate that is subjected to PWM control at a high frequency leaks to the outside from the opening of the backlight chassis and may become noise of other devices.
The present invention has been made in view of the above circumstances, and an object thereof is to arrange a plurality of LED substrates on which LEDs are mounted side by side on the back side of a liquid crystal panel, and connect adjacent LED substrates to each other. In a liquid crystal display device connected by members, it is possible to prevent deterioration of maintainability and generation of useless space, and also prevent leakage of LED light and unnecessary radiation from the LED substrate.

本発明に係る液晶表示装置は、LEDの照射光により液晶パネルがその背面側から照明される液晶表示装置であって、それぞれ前記LEDが実装され、前記液晶パネルの背面側に並べて配列される複数のLED基板と、該複数のLED基板それぞれの背面に装着され、隣り合うLED基板と電気的に接続する複数の基板間接続部材と、前記複数のLED基板を背面側から支持する部材であり、前記複数の基板間接続部材それぞれの装着位置に対応する部分に開口が設けられたLED基板支持部材と、該LED基板支持部材に背面側を覆うように装着され、前記開口からの漏れ出し光を遮光する遮光部材とを備えることを特徴とする。   The liquid crystal display device according to the present invention is a liquid crystal display device in which a liquid crystal panel is illuminated from the back side thereof by irradiation light of the LED, each of which is mounted with a plurality of LEDs arranged side by side on the back side of the liquid crystal panel. LED substrates, a plurality of inter-substrate connection members that are mounted on the back surfaces of the LED substrates and electrically connected to adjacent LED substrates, and a member that supports the plurality of LED substrates from the back surface side, An LED board support member having an opening provided in a portion corresponding to the mounting position of each of the plurality of inter-board connection members, and the LED board support member is mounted so as to cover the back side, and leaks light from the openings. And a light shielding member that shields light.

本発明においては、基板間接続部材に対応する位置に開口を設けたLED基板支持部材の背面側を覆うように遮光部材を装着したから、LED基板支持部材内のLEDの光が、LED基板それぞれの隙間及びLED基板支持部材に設けた開口から背面側に漏れることを防ぐことができる。遮光部材は、LED基板からの不要輻射の漏れ出しを防止する作用もなす。LED基板支持部材は、バックライトシャーシに相当する部材である。
また、遮光部材を取り外すことにより、LED基板それぞれの背面に装着された基板間接続部材をLED基板支持部材の開口から見通し、接続状態、損傷の有無等を確認することができ、LED基板支持部材からLED基板一つ一つを取り外す必要がなく、メンテナンス性の悪化を招かない。
また、隣り合うLED基板を基板間接続部材は、LED基板支持部材に設けた開口を通して背面側に突出させることができ、LED基板をLED基板支持部材に近接配置することが可能となって無駄なスペースを排除し、装置の薄型化要求に応えることができる。
In the present invention, since the light shielding member is mounted so as to cover the back side of the LED substrate support member provided with an opening at a position corresponding to the inter-substrate connection member, the LED light in the LED substrate support member It is possible to prevent leakage from the gap and the opening provided in the LED substrate support member to the back side. The light shielding member also serves to prevent leakage of unnecessary radiation from the LED substrate. The LED substrate support member is a member corresponding to the backlight chassis.
Moreover, by removing the light shielding member, the inter-board connecting member mounted on the back surface of each LED substrate can be seen from the opening of the LED substrate supporting member, and the connection state, the presence or absence of damage, etc. can be confirmed. There is no need to remove each LED substrate from the main body, so that the maintainability is not deteriorated.
In addition, the inter-substrate connecting members of the adjacent LED substrates can be protruded to the back side through the openings provided in the LED substrate supporting member, and the LED substrate can be disposed close to the LED substrate supporting member, which is useless. It can eliminate the space and meet the demand for thinner equipment.

また本発明に係る液晶表示装置は、前記LED基板支持部材が、前記LED基板を支持する面と反対側の面に回路基板の取り付け部を有しており、前記遮光部材が、前記取り付け部に対応する位置に設けた開口と、該開口を塞ぐ着脱可能なカバー部材とを備えることを特徴とする。
LED基板支持部材の背面(LED基板の支持面と反対側の面)を、LED制御基板、LED給電基板、パネル制御基板等の回路基板の取り付けスペースとして有効活用することができ、装置のスペース効率がより高まる。
LED基板支持部材の背面に取り付けた回路基板は、取り付け部に対応するように設けた開口を経て遮光部材を取り外さずに点検することができる。また遮光部材の開口は、着脱可能なカバー部材により塞ぐことにより、光、不要輻射等の外部への漏れ出しを防止することが可能できる。
また本発明に係る液晶表示装置は、前記遮光部材が、前記LED基板支持部材に対し、該LED基板支持部材の開口から前記基板間接続部材が突出可能な範囲を規制する間隔を隔てて配置してあることを特徴とする。
基板間接続部材がLED基板から浮き上がって外れるか、又は外れかけた状態となることを遮光部材の規制により防止でき、基板間接続部材のLED基板に対する接触不良が生じ難い。
Further, in the liquid crystal display device according to the present invention, the LED board support member has a circuit board attachment portion on a surface opposite to the surface supporting the LED substrate, and the light shielding member is provided on the attachment portion. An opening provided at a corresponding position and a removable cover member that closes the opening are provided.
The back surface of the LED substrate support member (the surface opposite to the support surface of the LED substrate) can be effectively used as a mounting space for circuit boards such as LED control boards, LED power supply boards, and panel control boards. Will increase.
The circuit board attached to the back surface of the LED board support member can be inspected without removing the light shielding member through the opening provided to correspond to the attachment portion. Further, the opening of the light shielding member can be blocked by a detachable cover member, thereby preventing leakage of light, unwanted radiation, etc. to the outside.
Further, in the liquid crystal display device according to the present invention, the light shielding member is arranged at an interval that regulates a range in which the inter-substrate connecting member can protrude from the opening of the LED substrate supporting member with respect to the LED substrate supporting member. It is characterized by being.
It is possible to prevent the inter-substrate connecting member from being lifted off from the LED substrate, or coming out of the LED substrate by the restriction of the light shielding member, and it is difficult for the inter-substrate connecting member to contact the LED substrate.

また本発明に係る液晶表示装置は、前記LED基板支持部材と前記遮光部材との間に挟持されたシート状の伝熱部材を備えることを特徴とする。
LEDの発光によるLED基板の発熱は、LED基板支持部材から伝熱部材を介して遮光部材に伝わり、該遮光部材から外気に効果的に放熱することができ、LED基板支持部材と遮光部材との間のスペースが過温状態となることを防止できる。
さらに本発明に係る液晶表示装置は、前記LED基板支持部材及び遮光部材が、金属製の部材であることを特徴とする。
金属製のLED基板支持部材及び遮光部材は、LED基板の発熱の外部への放熱を促進し、またLED基板からの不要輻射が外部に漏れ出すことをより確実に防止できる。
In addition, the liquid crystal display device according to the present invention includes a sheet-like heat transfer member sandwiched between the LED substrate support member and the light shielding member.
The heat generation of the LED substrate due to the light emission of the LED is transmitted from the LED substrate support member to the light shielding member via the heat transfer member, and can be effectively radiated from the light shielding member to the outside air. It is possible to prevent the space between them from being overheated.
Furthermore, the liquid crystal display device according to the present invention is characterized in that the LED substrate support member and the light shielding member are metal members.
The metal LED substrate support member and the light shielding member can promote the heat radiation of the LED substrate to the outside, and can more reliably prevent unnecessary radiation from leaking to the outside.

本発明によれば、LEDを実装した複数のLED基板が液晶パネルの背面側に並べて配列された液晶表示装置において、メンテナンス性の悪化及び無駄なスペースの発生を防止できるとともに、LEDの光、LED基板からの不要輻射の外部への漏れ出しを防止することができる。   According to the present invention, in a liquid crystal display device in which a plurality of LED substrates mounted with LEDs are arranged side by side on the back side of the liquid crystal panel, it is possible to prevent deterioration of maintainability and generation of useless space, Leakage of unwanted radiation from the substrate to the outside can be prevented.

実施形態に係る液晶表示装置の分解図である。It is an exploded view of the liquid crystal display device concerning an embodiment. 液晶表示装置における前面パネルユニットの分解図である。It is an exploded view of the front panel unit in a liquid crystal display device. LED基板を支持するバックライトシャーシの平面図である。It is a top view of the backlight chassis which supports an LED board. 前面パネルユニットの要部の断面図である。It is sectional drawing of the principal part of a front panel unit. バックライトシャーシに設けた開口部分の拡大図である。It is an enlarged view of the opening part provided in the backlight chassis.

以下添付図面を参照しながら、本発明の実施の形態について説明し、本発明の理解に供する。尚、以下の実施の形態は、本発明を具体化した一例であって、本発明の技術的範囲を限定する性格のものではない。
ここに、図1は、実施形態に係る液晶表示装置の分解図である。図2は、液晶表示装置における前面パネルユニットの分解図である。図3は、LED基板を支持するバックライトシャーシの平面図であり、図3(a)は、前面側から見た図、図3(b)は、背面側から見た図である。図4は、前面パネルユニットの要部の断面図である。図5は、バックライトシャーシに設けた開口部分の拡大図である。
Embodiments of the present invention will be described below with reference to the accompanying drawings for understanding of the present invention. In addition, the following embodiment is an example which actualized this invention, Comprising: It is not the thing of the character which limits the technical scope of this invention.
FIG. 1 is an exploded view of the liquid crystal display device according to the embodiment. FIG. 2 is an exploded view of the front panel unit in the liquid crystal display device. FIG. 3 is a plan view of a backlight chassis that supports the LED substrate. FIG. 3A is a view from the front side, and FIG. 3B is a view from the back side. FIG. 4 is a cross-sectional view of a main part of the front panel unit. FIG. 5 is an enlarged view of an opening provided in the backlight chassis.

実施形態に係る液晶表示装置Xは、LEDの照射光により液晶パネルがその背面側から照明される液晶表示装置である。
まず、図1〜図3を参照しつつ、液晶表示装置Xの概略構成について説明する。
図1に示されるように、液晶表示装置Xは、液晶パネル20が組み込まれた前面パネルユニット2と、その背面側を覆うように装着されて外装を形成する背面パネルユニット1とを備えている。以下の説明では、液晶パネル20が位置する側を前面側、背面パネルユニット1が位置する側を背面側と称する。
図2に示されるように前面パネルユニット2は、前面パネル枠10、液晶パネル20、LED基板30、バックライトシャーシ40及びシャーシトレイ50が一体に組み付けられたユニットである。
液晶パネル20は、液晶が組み込まれたガラスパネル、光拡散板、光学シート等により構成されており、前面パネル枠10の内側に取り付けられている。
LED基板30は、バックライトシャーシ40の前面側に支持されている。図2においてLED基板30は、バックライトシャーシ40の前面側に隠れた状態となっている。
The liquid crystal display device X according to the embodiment is a liquid crystal display device in which a liquid crystal panel is illuminated from the back side by irradiation light of an LED.
First, a schematic configuration of the liquid crystal display device X will be described with reference to FIGS.
As shown in FIG. 1, the liquid crystal display device X includes a front panel unit 2 in which a liquid crystal panel 20 is incorporated, and a back panel unit 1 that is mounted so as to cover the back side thereof and forms an exterior. . In the following description, the side on which the liquid crystal panel 20 is located is referred to as the front side, and the side on which the back panel unit 1 is located is referred to as the back side.
As shown in FIG. 2, the front panel unit 2 is a unit in which the front panel frame 10, the liquid crystal panel 20, the LED substrate 30, the backlight chassis 40 and the chassis tray 50 are assembled together.
The liquid crystal panel 20 includes a glass panel, a light diffusion plate, an optical sheet, and the like in which liquid crystal is incorporated, and is attached to the inside of the front panel frame 10.
The LED substrate 30 is supported on the front side of the backlight chassis 40. In FIG. 2, the LED substrate 30 is hidden on the front side of the backlight chassis 40.

図3(a)に示されるようにLED基板30は、バックライト用の光源である複数のLED31が実装された比較的小さな基板である。液晶表示装置Xにおいて複数のLED基板30は、液晶パネル20の背面側に並んで配列された状態でバックライトシャーシ40の前面に支持されている。
LED基板30の数及び配置は、液晶表示装置Xの画面サイズ(液晶パネル20のサイズ)に応じて定まる。液晶表示装置Xにおいては、画面サイズの大小に拘らず共通のLED基板30が使用されている。
図3(b)に示されるように、隣り合うLED基板30は、基板間接続部材60により接続されている。基板間接続部材60は、LED基板30それぞれの背面に対して着脱可能に装着される。図3(b)に示されるように基板間接続部材60は、複数設けられ、その各々が左右に隣り合う2つのLED基板30を電気的に接続する。
As shown in FIG. 3A, the LED substrate 30 is a relatively small substrate on which a plurality of LEDs 31 that are light sources for a backlight are mounted. In the liquid crystal display device X, the plurality of LED substrates 30 are supported on the front surface of the backlight chassis 40 in a state of being arranged side by side on the back side of the liquid crystal panel 20.
The number and arrangement of the LED substrates 30 are determined according to the screen size of the liquid crystal display device X (the size of the liquid crystal panel 20). In the liquid crystal display device X, a common LED substrate 30 is used regardless of the screen size.
As shown in FIG. 3B, adjacent LED substrates 30 are connected by an inter-substrate connection member 60. The inter-substrate connecting member 60 is detachably attached to the back surface of each LED substrate 30. As shown in FIG. 3B, a plurality of inter-substrate connection members 60 are provided, and each of them electrically connects two LED substrates 30 adjacent to each other on the left and right.

図3に示されるように、バックライトシャーシ40(LED基板支持部材の一例)は、前述のように配列される複数のLED基板30の背面側を支持する金属製の部材であり、このバックライトシャーシ40には、隣り合うLED基板30を接続する複数の基板間接続部材60それぞれの装着位置に対応する部分に開口40aが設けられている。
図5に示されるように、基板間接続部材60は、例えば、LED基板30に対する接続用の2つのコネクタ61と、その2つのコネクタ61の間を電気的に接続する導通部62とを備えている。この導通部62は、例えば、FPC(Flexible Printed Circuits )により構成されている。
基板間接続部材60の導通部62は、両端にコネクタ61をバックライトシャーシ40に支持されたLED基板30に接続した基板間接続部材60の装着状態において、図5に示されるように、対応する部分に設けた開口40aを通じてバックライトシャーシ40の背面側に突出する。
なお、基板間接続部材60のコネクタ61は、各LED基板30に対し、それぞれの背面に設けた受け側コネクタ32(図4参照)に差し込むことで接続される。
As shown in FIG. 3, the backlight chassis 40 (an example of an LED board support member) is a metal member that supports the back side of the plurality of LED boards 30 arranged as described above. The chassis 40 is provided with openings 40 a at portions corresponding to the mounting positions of the plurality of inter-substrate connection members 60 that connect the adjacent LED substrates 30.
As shown in FIG. 5, the inter-substrate connection member 60 includes, for example, two connectors 61 for connection to the LED substrate 30 and a conductive portion 62 that electrically connects the two connectors 61. Yes. The conductive portion 62 is configured by, for example, FPC (Flexible Printed Circuits).
As shown in FIG. 5, the conducting portion 62 of the inter-substrate connection member 60 corresponds to the mounting state of the inter-substrate connection member 60 in which the connector 61 is connected to the LED substrate 30 supported by the backlight chassis 40 at both ends, as shown in FIG. 5. It protrudes to the back side of the backlight chassis 40 through an opening 40a provided in the portion.
Note that the connector 61 of the inter-board connection member 60 is connected to each LED board 30 by being inserted into a receiving connector 32 (see FIG. 4) provided on the back surface thereof.

シャーシトレイ50(遮光部材の一例)は、バックライトシャーシ40の背面(LED基板30の支持面と反対側の面)を覆うように装着される金属製の板状部材である。このシャーシトレイ50は、バックライトシャーシ40に設けた開口40aからの漏れ出し光を遮光する部材であって、バックライトシャーシ40に対してビス等により着脱可能に取り付けてある。
図2に示されているように、シャーシトレイ50の背面(バックライトシャーシ40に対向する面と反対側の面)には、外部電源(商用電源)からの交流電力を入力して整流する電源入力基板51、用途に応じた電圧への変圧及び給電を行う電源基板52、外部装置との間で制御信号、AV信号のやりとりを行う信号インターフェース基板53が取り付けてある。
また、シャーシトレイ50背面の信号インターフェース基板53の取り付け部分には、その熱を効率的に放熱させるための金属製のヒートシンク56が取り付けられている。このヒートシンク56は、信号インターフェース基板53からの不要輻射を遮断するシールド部材としても機能する。
The chassis tray 50 (an example of a light shielding member) is a metal plate-like member that is mounted so as to cover the back surface of the backlight chassis 40 (the surface opposite to the support surface of the LED substrate 30). The chassis tray 50 is a member that blocks light leaking from the opening 40a provided in the backlight chassis 40, and is detachably attached to the backlight chassis 40 with screws or the like.
As shown in FIG. 2, a power source that rectifies by inputting AC power from an external power source (commercial power source) to the rear surface of the chassis tray 50 (a surface opposite to the surface facing the backlight chassis 40). An input board 51, a power supply board 52 that performs voltage transformation and power supply according to the application, and a signal interface board 53 that exchanges control signals and AV signals with external devices are attached.
Further, a metal heat sink 56 for efficiently radiating the heat is attached to the attachment portion of the signal interface board 53 on the rear surface of the chassis tray 50. The heat sink 56 also functions as a shield member that blocks unnecessary radiation from the signal interface board 53.

またバックライトシャーシ40の背面(LED基板30の支持面と反対側の面)には、例えば、LED基板30に対してPWM信号(LED31の点滅を制御する信号)を出力するLED制御基板41、LED基板30に対して電力を供給するLED給電基板42、液晶パネル20を制御するパネル制御基板43等の回路基板が取り付けてある。
また、バックライトシャーシ40の背面のパネル制御基板43の部分には、その熱を効率的に放熱させるための金属製のヒートシンク44が取り付けられている。このヒートシンク44は、パネル制御基板43からの不要輻射を遮断するシールド部材としても機能する。
さらにシャーシトレイ50には、バックライトシャーシ40の背面のLED制御基板41、LED給電基板42の取り付け部分に対応する位置に開口50a、50bが設けられており、それぞれの開口50a、50bには、夫々を塞ぐ着脱可能な金属製のカバー部材54、55が設けられている。カバー部材54、55は、ビス等によりシャーシトレイ50に対して取り付けられており、バックライトシャーシ40側からの光の漏れを遮断するとともに、不要輻射を遮断し、外部への漏れ出しを防止するシールド部材としても機能する。
Further, on the back surface of the backlight chassis 40 (surface opposite to the support surface of the LED board 30), for example, an LED control board 41 that outputs a PWM signal (signal for controlling blinking of the LED 31) to the LED board 30, Circuit boards such as an LED power supply board 42 that supplies power to the LED board 30 and a panel control board 43 that controls the liquid crystal panel 20 are attached.
Further, a metal heat sink 44 for efficiently radiating the heat is attached to the panel control board 43 on the back surface of the backlight chassis 40. The heat sink 44 also functions as a shield member that blocks unnecessary radiation from the panel control board 43.
Furthermore, the chassis tray 50 is provided with openings 50a and 50b at positions corresponding to the mounting portions of the LED control board 41 and the LED power supply board 42 on the back surface of the backlight chassis 40, and the openings 50a and 50b are respectively provided with openings 50a and 50b. Removable metal cover members 54 and 55 are provided to close each of them. The cover members 54 and 55 are attached to the chassis tray 50 by screws or the like, and block light leakage from the backlight chassis 40 side, block unnecessary radiation, and prevent leakage to the outside. Also functions as a shield member.

次に、図4に示される断面図を参照しつつ、前面パネルユニット2の内部構造について説明する。なお、図4の下側及び上側は、それぞれ液晶表示装置Xにおける前面側及び背面側である。図4に示されるように、LED基板30は、バックライトシャーシ40の前面に支持されており、シャーシトレイ50は、バックライトシャーシ40の背面に所定の間隔を隔てて対向している。
また図4に示されるように、LED基板30の背面には、基板間接続部材60のコネクタ61が接続される受け側コネクタ32が設けられている。基板間接続部材60は、バックライトシャーシ40に設けた開口40aを利用し、バックライトシャーシ40の背面側からLED基板30に接続することができる。
図4(a)に示されるように、バックライトシャーシ40に設けられた開口40aは、バックライトシャーシ40の背面側に対向するシャーシトレイ50により覆われており、LED基板30に実装されたLED31の光が、複数のLED基板30それぞれの隙間及び前記開口40aを通ってバックライトシャーシ40の背面側に漏れることを防止することができる。
また、バックライトシャーシ40は、多数の開口40aが設けられることにより強度及び剛性が不足しがちとなる。バックライトシャーシ40の背面に取り付けられるシャーシトレイ50は、バックライトシャーシ40を背面側から支え、強度及び剛性の不足を補う機能を果たす。これにより、バックライトシャーシ40には、多数のLED基板30と、LED制御基板41、LED給電基板42、パネル制御基板43等の回路基板を支持する部材として十分な強度及び剛性が確保される。
また、シャーシトレイ50が取り外された場合、隣り合うLED基板30,30を接続する基板間接続部材60は、バックライトシャーシ40に設けた対応する開口40aを経て通じて背面側の突出する。そのため、基板間接続部材60の操作(着脱)は、それぞれの開口40aを利用してバックライトシャーシ40の背面側から実施することができ、LED基板30を取り外しが不要であり、メンテナンス性の悪化を招かない。
Next, the internal structure of the front panel unit 2 will be described with reference to the cross-sectional view shown in FIG. In addition, the lower side and upper side of FIG. 4 are the front side and the back side in the liquid crystal display device X, respectively. As shown in FIG. 4, the LED substrate 30 is supported on the front surface of the backlight chassis 40, and the chassis tray 50 faces the back surface of the backlight chassis 40 with a predetermined interval.
As shown in FIG. 4, a receiving connector 32 to which the connector 61 of the inter-substrate connecting member 60 is connected is provided on the back surface of the LED substrate 30. The inter-substrate connecting member 60 can be connected to the LED substrate 30 from the back side of the backlight chassis 40 using the opening 40 a provided in the backlight chassis 40.
As shown in FIG. 4A, the opening 40 a provided in the backlight chassis 40 is covered by a chassis tray 50 facing the back side of the backlight chassis 40, and the LED 31 mounted on the LED substrate 30. Can be prevented from leaking to the back side of the backlight chassis 40 through the gaps between the LED substrates 30 and the openings 40a.
Further, the backlight chassis 40 tends to be insufficient in strength and rigidity due to the provision of many openings 40a. The chassis tray 50 attached to the back surface of the backlight chassis 40 functions to support the backlight chassis 40 from the back surface side and compensate for lack of strength and rigidity. As a result, the backlight chassis 40 has sufficient strength and rigidity as a member for supporting a number of LED boards 30 and circuit boards such as the LED control board 41, the LED power supply board 42, and the panel control board 43.
When the chassis tray 50 is removed, the inter-board connection member 60 that connects the adjacent LED boards 30, 30 protrudes through the corresponding opening 40 a provided in the backlight chassis 40 on the back side. Therefore, the operation (detachment) of the inter-substrate connecting member 60 can be performed from the back side of the backlight chassis 40 using the respective openings 40a, the LED substrate 30 is not required to be removed, and the maintainability is deteriorated. Not invited.

また図4に示されているように、基板間接続部材60は、それぞれの開口40aを通してバックライトシャーシ40の背面側に突出するので、バックライトシャーシ40とLED基板30とを近接配置することができ、バックライトシャーシ40の前面側に無駄なスペースが生じない。
またシャーシトレイ50には、LED制御基板41、LED給電基板42を背面側へ通す開口50a、50bが設けられているので、シャーシトレイ50とバックライトシャーシ40とを近接配置することができ、シャーシトレイ50の前面側にも無駄なスペースが生じない。
Further, as shown in FIG. 4, the inter-board connection member 60 protrudes to the back side of the backlight chassis 40 through the respective openings 40a, so that the backlight chassis 40 and the LED board 30 can be disposed close to each other. And no useless space is created on the front side of the backlight chassis 40.
In addition, since the chassis tray 50 is provided with openings 50a and 50b that allow the LED control board 41 and the LED power supply board 42 to pass to the back side, the chassis tray 50 and the backlight chassis 40 can be disposed close to each other. There is no wasted space on the front side of the tray 50.

またシャーシトレイ50は、前記開口40aを通してバックライトシャーシ40の背面側に突出する基板間接続部材60の近くに位置し、基板間接続部材60の突出可能な範囲を規制する間隔で配置されている。
これにより、図4(b)に示されるように、基板間接続部材60がLED基板30から浮き上がり始めた場合に、その初期の段階でシャーシトレイ50の前面に当接し、基板間接続部材60がそれ以上に浮き上がって外れるか、または外れかけた状態となることが防がれる。その結果、基板間接続部材60のLED基板30に対する接触不良を防止することができる。
The chassis tray 50 is located near the inter-board connecting member 60 that protrudes toward the back side of the backlight chassis 40 through the opening 40a, and is disposed at an interval that regulates the range in which the inter-substrate connecting member 60 can be protruded. .
As a result, as shown in FIG. 4B, when the inter-board connecting member 60 starts to float from the LED board 30, it contacts the front surface of the chassis tray 50 at the initial stage, and the inter-board connecting member 60 It is prevented that it floats off further or becomes detached. As a result, contact failure of the inter-substrate connection member 60 with respect to the LED substrate 30 can be prevented.

また、図4に示されるように、バックライトシャーシ40とシャーシトレイ50との間には、両者に挟持されるようにシート状の伝熱部材70が介装されている。
これにより、LED31の発光によりLED基板30で発生した熱が、バックライトシャーシ40及び伝熱部材70を経てシャーシトレイ50に良好に伝わり、該シャーシトレイ50を通じて放熱されやすくなり、バックライトシャーシ40とシャーシトレイ50との間のスペースが過温状態となることを防止できる。
As shown in FIG. 4, a sheet-like heat transfer member 70 is interposed between the backlight chassis 40 and the chassis tray 50 so as to be sandwiched between the two.
Thereby, the heat generated in the LED substrate 30 due to the light emission of the LED 31 is favorably transmitted to the chassis tray 50 through the backlight chassis 40 and the heat transfer member 70 and is easily radiated through the chassis tray 50. It is possible to prevent the space between the chassis tray 50 from being overheated.

X 液晶表示装置
1 背面パネルユニット
2 前面パネルユニット
10 前面パネル枠
20 液晶パネル
30 LED基板
31 LED
40 バックライトシャーシ(LED支持部材)
40a 開口
41 LED制御基板
42 LED給電基板
43 パネル制御基板
44 ヒートシンク
50 シャーシトレイ(遮光部材)
51 電源入力基板
52 電源基板
53 信号インターフェース基板
54,55 カバー部材
56 ヒートシンク
50a,50b 開口
60 基板間接続部材
61 コネクタ
62 導通部
70 伝熱部材
X liquid crystal display device 1 rear panel unit 2 front panel unit 10 front panel frame 20 liquid crystal panel 30 LED substrate 31 LED
40 Backlight chassis (LED support member)
40a Opening 41 LED control board 42 LED power supply board 43 Panel control board 44 Heat sink 50 Chassis tray (light shielding member)
51 Power Input Board 52 Power Supply Board 53 Signal Interface Board 54, 55 Cover Member 56 Heat Sink 50a, 50b Opening 60 Inter-board Connection Member 61 Connector 62 Conducting Part 70 Heat Transfer Member

Claims (5)

LEDの照射光により液晶パネルがその背面側から照明される液晶表示装置であって、 それぞれ前記LEDが実装され、前記液晶パネルの背面側に並べて配列される複数のLED基板と、
該複数のLED基板それぞれの背面に装着され、隣り合うLED基板と電気的に接続する複数の基板間接続部材と、
前記複数のLED基板を背面側から支持する部材であり、前記複数の基板間接続部材それぞれの装着位置に対応する部分に開口が設けられたLED基板支持部材と、
該LED基板支持部材に背面側を覆うように装着され、前記開口からの漏れ出し光を遮光する遮光部材と
を備えることを特徴とする液晶表示装置。
A liquid crystal display device in which a liquid crystal panel is illuminated from the back side thereof by irradiation light of the LED, each of the LEDs being mounted, and a plurality of LED substrates arranged side by side on the back side of the liquid crystal panel;
A plurality of inter-substrate connection members mounted on the back surfaces of the plurality of LED substrates and electrically connected to adjacent LED substrates;
An LED substrate support member that supports the plurality of LED substrates from the back side, and an opening is provided in a portion corresponding to the mounting position of each of the plurality of inter-substrate connection members;
A liquid crystal display device comprising: a light shielding member which is attached to the LED substrate support member so as to cover a back side and shields light leaking from the opening.
前記LED基板支持部材は、前記LED基板を支持する面と反対側の面に回路基板の取り付け部を有しており、
前記遮光部材は、前記取り付け部に対応する位置に設けた開口と、該開口を塞ぐ着脱可能なカバー部材とを備える請求項1に記載の液晶表示装置。
The LED board support member has a circuit board mounting portion on a surface opposite to a surface supporting the LED board,
The liquid crystal display device according to claim 1, wherein the light shielding member includes an opening provided at a position corresponding to the attachment portion, and a detachable cover member that closes the opening.
前記遮光部材は、前記LED基板支持部材に対し、該LED基板支持部材の開口から前記基板間接続部材が突出可能な範囲を規制する間隔を隔てて配置してある請求項1又は2に記載の液晶表示装置。   The said light shielding member is arrange | positioned at the space | interval which regulates the range which the said board | substrate connection member can project from the opening of this LED board support member with respect to the said LED board support member. Liquid crystal display device. 前記LED基板支持部材と前記遮光部材との間に挟持されたシート状の伝熱部材を備える請求項1から請求項3のいずれか1つに記載の液晶表示装置。   The liquid crystal display device according to any one of claims 1 to 3, further comprising a sheet-like heat transfer member sandwiched between the LED substrate support member and the light shielding member. 前記LED基板支持部材及び遮光部材は、金属製の部材である請求項1から請求項4のいずれか1つに記載の液晶表示装置。   The liquid crystal display device according to claim 1, wherein the LED substrate support member and the light shielding member are metal members.
JP2012157767A 2012-07-13 2012-07-13 Liquid crystal display Expired - Fee Related JP5193380B2 (en)

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JP2006136428A (en) * 2004-11-10 2006-06-01 Samii Kk Board mounting structure and game machine
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