JP2012182704A - Electronic imaging apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a technology which allows for compaction of a camera body while preventing the image of dust existing near the light-receiving surface of an image sensor from being captured.SOLUTION: The electronic imaging apparatus comprises: an image sensor 214 which converts the subject light entering through an imaging lens into an electric signal; a light transmission member 206 provided between the imaging lens and the image sensor 214; an excitation part 226 which excites the light transmission member 206 to perform flexural vibration; a physical property shutter 220 provided between the light transmission member 206 and the image sensor 214 and capable of switching between a light transmitting state where the subject light can enter the image sensor 214, and a light shielding state where the subject light entering the image sensor 214 is blocked; and an enclosing structure 210 which surrounds and encloses a space formed between the light transmission member 206 and the image sensor 214.

Description

  The present invention relates to an electronic photographing apparatus, and more particularly to an electronic photographing apparatus with an interchangeable photographing lens.

  Electronic photographing apparatuses, particularly electronic photographing apparatuses capable of still photographing, include mechanical shutters such as a lens shutter and a focal plane shutter. The image pickup device itself can also be provided with a so-called electronic shutter function. However, in order to suppress smear and image distortion, a mechanical shutter is often used in combination with an electronic photographing device that particularly requires high image quality. The

  In a photographing lens interchangeable electronic photographing apparatus, a focal plane shutter is often used as a shutter. The reason is that it becomes easy to obtain a relatively high shutter speed regardless of the opening of the setting aperture of the photographing lens. In addition, the provision of the shutter on the photographing apparatus main body side eliminates the need to provide the shutter on the photographing lens (interchangeable lens) side, which is advantageous for downsizing the photographing lens and reducing the manufacturing cost.

  By the way, in a photographing lens interchangeable electronic photographing apparatus, a problem of so-called sensor dust is likely to occur. This is because the shadow of fine dust (this is sensor dust) adhering to the surface of a cover glass covering the light receiving surface of the image sensor or an optical low-pass filter (OLPF) disposed in the vicinity thereof is reflected in the image. Phenomenon. In a photographing lens interchangeable electronic camera, it is difficult to provide a sealed structure between the imaging element and the photographing lens. Therefore, dust easily enters the camera body when the photographic lens is replaced. Further, fine dust generated by rubbing between mechanical parts due to the operation of the focal plane shutter, rubbing of the mount portion when the interchangeable lens is attached or detached, and the like can also contribute to sensor dust.

  In order to cope with the problem of the sensor dust, Patent Document 1 discloses a single-lens reflex electronic camera in which a glass plate is disposed between a mechanical focal plane shutter and an image sensor, and the glass plate is a piezoelectric body. A configuration is disclosed in which the dust adhering to the surface of the glass plate is splashed and removed by vibration.

  By the way, the mechanical focal plane shutter includes a front curtain and a rear curtain for defining an exposure time, and a drive mechanism for driving the front curtain and the rear curtain. In addition, it is necessary to provide a charge motor, a charge mechanism, and the like for charging a spring provided in the drive mechanism in the camera, resulting in an increase in the size of the camera. Patent Document 2 discloses a configuration that includes a liquid crystal shutter and can reduce the size of the camera by omitting a mechanical focal plane shutter, a charge motor, and a charge mechanism.

Japanese Patent No. 4282226 JP 2009-5262 A

  Since the electronic camera disclosed in Patent Document 1 is configured to include a mechanical focal plane shutter, it is difficult to reduce the size of the camera body. In this regard, the electronic camera disclosed in Patent Document 2 is advantageous in reducing the size of the camera body by using a liquid crystal shutter. However, the configuration for removing dust is not disclosed in Patent Document 2.

  In the liquid crystal shutter, a polarizing film made of resin is disposed on both outer surfaces of two glass plates that are sealed with a liquid crystal substance sealed therein. Resin films are easily charged, and dust that flies near the liquid crystal shutter may be adsorbed to the liquid crystal shutter by static electricity. Such a problem is not described in Patent Document 2.

  The present invention has been made in view of the above problems, and provides a technique capable of reducing the size of the main body of the electronic photographing apparatus and suppressing the presence of dust near the light receiving surface of the image sensor. With the goal.

A typical example of the present invention is as follows. That is, the electronic photographing device is
An image sensor that converts subject light incident through the taking lens into an electrical signal;
A light transmissive member provided between the imaging lens and the imaging device;
A vibration unit that vibrates and flexurally vibrates the light transmitting member;
A light-transmitting state is provided between the light-transmitting member and the image sensor, and allows the subject light to enter the image sensor by switching a voltage application state, and the subject light to the image sensor. A physical property shutter part that can be switched to a light-shielding state that prevents the incidence of light,
A sealing structure that surrounds and seals a space formed between the light transmission member and the imaging element.

  According to the present invention, it is possible to reduce the size of the main body of the electronic photographing apparatus, and it is possible to suppress the presence of dust in the vicinity of the light receiving surface of the image pickup device.

FIG. 5 is a five-side view illustrating a front surface, an upper surface, a left side surface, a right side surface, and a lower surface of the electronic camera. It is a figure which shows the back surface of an electronic camera. It is a cross-sectional view which shows the II-II cross section of the front view shown in FIG. 1A of an electronic camera. It is a figure which expands and shows the principal part of the cross section of the electronic camera shown by FIG. 2A. It is a cross-sectional view which shows the III-III cross section of the front view shown in FIG. 1A of an electronic camera. It is a longitudinal cross-sectional view which shows the IV-IV cross section of the front view shown in FIG. 1A of an electronic camera. It is a longitudinal cross-sectional view which shows a mode that the interchangeable lens was mounted | worn with the longitudinal cross-sectional view shown by FIG. It is a disassembled perspective view which shows the structure of the principal part of an electronic camera. It is a longitudinal cross-sectional view which shows the VII-VII cross section in the cross-sectional view of the principal part of the electronic camera shown by FIG. 2B. It is a longitudinal cross-sectional view which shows the VIII-VIII cross section in the cross-sectional view of the principal part of the electronic camera shown by FIG. 2B. It is a longitudinal cross-sectional view which shows the IX-IX cross section in the cross-sectional view of the principal part of the electronic camera shown by FIG. 2B. It is a longitudinal cross-sectional view which shows the XX cross section of the front view shown in FIG. 1A of an electronic camera. It is a figure which shows a mode that the front cover was seen from the back side. It is a block diagram explaining the internal structure of an electronic camera. It is a flowchart explaining the control procedure of the still image shooting operation | movement performed with the control part of the electronic camera which concerns on 1st Embodiment. It is a flowchart explaining the process procedure following the flowchart of FIG. 13A. It is a flowchart explaining the control procedure of the still image shooting operation | movement performed with the control part of the electronic camera which concerns on 2nd Embodiment. It is a flowchart explaining the process sequence following the flowchart of FIG. 14A. It is a flowchart explaining the control procedure of the still image shooting operation | movement performed with the control part of the electronic camera which concerns on 3rd Embodiment. It is a flowchart explaining the process procedure following the flowchart of FIG. 15A. It is a flowchart explaining the control procedure of the still image shooting operation | movement performed with the control part of the electronic camera which concerns on 4th Embodiment. It is a flowchart explaining the process procedure following the flowchart of FIG. 16A.

  In the following, an example in which the present invention is applied to a mirrorless electronic camera with an interchangeable taking lens as an electronic photographing apparatus will be described. 1A and 1B are diagrams schematically illustrating the appearance of an electronic camera 100 according to an embodiment of the present invention. FIG. 1A includes front, top, bottom, right side, and left side views. A five-sided view is shown. FIG. 1B shows a rear view. That is, a six-sided view is configured by FIGS. 1A and 1B.

  For the purpose of facilitating understanding when describing the arrangement of components of the electronic camera 100, an image generated by the electronic camera 100 will be described as having a horizontally long aspect ratio. The photographing posture of the electronic camera 100 that obtains a horizontally long image is referred to as a horizontal position, and the photographing posture that obtains a vertically long image is referred to as a vertical position.

  In FIG. 1A, the front view of the electronic camera 100 in the horizontal position is shown in the center of the five views, and the top view, the bottom view, the left side view, A right side view is drawn. In the front view, the X axis is drawn in the horizontal direction along the plane of FIG. 1A, and the Y axis is drawn in the vertical direction. In the front view in FIG. 1A, these X-axis and Y-axis are based on the position through which the optical axis of the photographic lens attached to the electronic camera 100 (hereinafter, the optical axis of the photographic lens is simply referred to as the optical axis). Assume that the coordinate systems are orthogonal to each other. That is, the position (X, Y) = (0, 0) is the position through which the optical axis passes. In addition, when the same kind of component is illustrated in FIG. 1A, a lead line and a reference numeral are attached to any one of the same kind of components for the purpose of making the drawing easier to see.

  In this specification, when the electronic camera 100 in the horizontal position is viewed from the subject side, the side toward the left of the Y axis is referred to as a grip side, and the side toward the right is referred to as an anti-grip side. Further, as shown in the right side view, with the X axis as a reference, the upward side is referred to as the upper side, and the downward side is referred to as the lower side. Furthermore, as shown in the top view, the direction approaching the subject is referred to as the front, and the direction away from the subject is referred to as the rear. A direction parallel to the X axis is referred to as an X axis direction, and a direction parallel to the Y axis is referred to as a Y axis direction. In addition, when describing the orientation of the surfaces of the electronic camera 100 and its components, the surface facing the subject side is the front side and the opposite direction when the electronic camera 100 is oriented toward the subject in the horizontal position. The surface facing upward is referred to as the upper surface, the surface facing downward as the lower surface, the surface facing left as the left side, and the surface facing right as the right side.

  The main body of the electronic camera 100 is covered with a front cover 102 and a rear cover 104. A release button 106 is provided on the upper surface of the electronic camera 100 on the grip side. Further, a flash light emitting unit 152 is provided on the front upper side on the anti-grip side, and an AF auxiliary light source 108 is provided on the upper front side on the grip side. The flash light emitting unit 152 emits a flash as necessary to illuminate the subject during still image shooting. The AF auxiliary light source 108 is configured to be able to irradiate auxiliary light toward the subject when the subject brightness is low and it is difficult to obtain sufficient focus adjustment accuracy.

  The electronic camera 100 includes a mount 110 for detachably mounting a photographic lens. Hereinafter, the mount 110 is referred to as a body mount 110 in order to distinguish it from the mount on the photographing lens side. The body mount 110 has an annular shape centering on the position where the optical axis passes, and is fixed to the mount holding part 200 with a plurality of screws 112. The body mount 110 is preferably formed of a material having relatively high strength and rigidity, such as a metal such as stainless steel or brass, or a thermoplastic resin reinforced with glass fiber or carbon fiber. Since the body mount 110 is made of a relatively high rigidity material, not only can the optical accuracy be maintained well between the photographing lens and the camera body, but also the mount holding that is fastened by the body mount 110 and the screw 112. The rigidity of the part 200 itself can be increased.

  On the back side (back side) of the surface to which the body mount 110 is attached of the mount holding part 200, a rear extension part 200a extending rearward is provided. In FIG. 1A, the rearward extending portion 200a is indicated by a broken line and is depicted as having a rectangular cross section. That is, the rearward extension 200a is drawn as a plurality of protrusions having a quadrangular prism shape. However, the shape of the rear extension 200a may be a columnar shape as necessary, or a combination of protrusions having different shapes. Alternatively, the rear extension part 200a may have a plate-like or box-like structure instead of a plurality of columnar ones standing upright. The mount holding unit 200 functions as a frame that maintains a positional relationship and a dimensional relationship between the body mount 110 and an optical element and an imaging element described later with high accuracy. The mount holding part 200 can be formed by injection molding using a thermoplastic resin reinforced with glass fiber or carbon fiber. Alternatively, it can be formed by casting using an aluminum alloy, a magnesium alloy, a zinc alloy, or the like.

  On the non-grip side, the front cover 102 and the mount holding part 200 are fixed by two screws 116. If the front cover 102 is formed by, for example, pressing a stainless steel plate or an aluminum alloy plate, or by casting using an aluminum alloy, a magnesium alloy, or the like, the front cover 102 and the mount holding portion 200 are screws 116. Therefore, the rigidity of the mount holding part 200 can be increased.

  When the front cover 102 and the mount holding part 200 are both formed by injection molding using a thermoplastic resin or die casting or thixo molding using a casting alloy, the front cover 102 and the mount holding part 200 are integrally formed. May be. In that case, the screw 116 becomes unnecessary.

  A plurality of signal contacts 118 are arranged in an arc shape on the inner side of the opening of the body mount 110 below the mount holding part 200. As will be described later, a signal contact is also provided on the photographic lens side, and the photographic lens and the electronic camera 100 are electrically connected to each other through lens contacts on both the body side and the lens side. Hereinafter, the signal contact 118 is referred to as a body-side signal contact 118 in order to distinguish from the signal contact provided on the lens side.

  A main capacitor 150 for temporarily storing energy used when flashing from the flash light emitting unit 152 is disposed at a position behind the body mount 110 on the side opposite to the grip of the electronic camera 100 (back side). The main capacitor 150 has a cylindrical shape, and is disposed below the flash light emitting unit 152 such that its cylindrical axis extends in the vertical direction (a direction parallel to the Y axis).

  A release button 106 is provided on the upper surface of the electronic camera 100 on the grip side. In the embodiment of the present invention, the electronic camera 100 is described as being provided with one release button 106, but a plurality of release buttons may be provided. In that case, a release button corresponding to the shooting function may be provided, such as for starting still image shooting or for starting moving image shooting, and each of the buttons can be easily operated according to the shooting posture of the horizontal position and the vertical position. A release button may be provided at the position.

  A battery chamber 122 is provided on the grip side of the electronic camera 100, more specifically on the grip side of the mount holding part 200. A dry battery or a rechargeable battery is mounted in the battery chamber 122. A lid 132 configured to be openable and closable by a user is provided at the bottom of the electronic camera 100, and the battery can be attached and detached by opening the lid 132. Further, the memory card for recording the image data generated by photographing with the electronic camera 100 is also configured to be able to be inserted and removed by opening the lid 132.

  As shown in the left side view, an external connector 126 and a control printed board 124 are disposed behind the battery chamber 122 on the grip side of the electronic camera 100. The external connector 126 conforms to a standard such as USB or HDMI (registered trademark), and is connected with a cable when image data or audio data is exchanged with an external device. The control printed board 124 controls the operation of the image processing unit that performs processing for generating, displaying, and recording image data based on the image signal output from the image sensor and the electronic camera 100 as a whole. A controller is implemented.

  A tripod attachment 130 is provided at the bottom of the electronic camera 100. A screw hole for screwing a tripod screw is formed in the tripod attachment part 130. In electronic camera 100 according to the present embodiment, the center of this screw hole is provided in the vicinity of the position through which the optical axis passes.

  With reference to FIG. 1B, components provided on the back surface of the electronic camera 100 will be described. An operation member 128 and a power switch 304 are provided on the grip side of the back surface of the electronic camera 100. The operation member 128 can be of various types such as a dial, a seesaw switch, and a slide switch, in addition to the push button switch type. Similarly to the operation member 128, the power switch 304 can be a switch having an arbitrary operation form.

  A display device 300 is provided on the back surface of the electronic camera 100. The display device 300 includes a TFT color liquid crystal display panel and a backlight device, and is configured to display moving images, still images, character information, icons, and the like. Alternatively, a self-luminous display panel such as a color organic EL display element may be provided. In addition, a touch panel may be provided on the surface of the display device 300, and the operation member 128 may be configured by the touch panel and a GUI (graphical user interface) displayed on the display device 300.

  An electronic viewfinder 302 is provided above the display device 300. The configuration of the electronic viewfinder 302 will be described later with reference to FIG.

  2A is a cross-sectional view taken along the line II-II of FIG. 1A, that is, a cross section along a horizontal plane including the optical axis. FIG. 2B is an enlarged view showing a main part in FIG. 2A. A camera shake correction unit 250 is disposed behind the body mount 110 and the mount holding unit 200 that holds the body mount 110. As described in detail later, the camera shake correction unit 250 is fixed to the rearward extension 200a of the mount holding unit 200.

  The image sensor 214 and the optical holding member 210 are fixed to a holding member 216 that is held by the camera shake correction unit 250 so as to be movable along the X-axis direction and the Y-axis direction. The holding member 216 also has a function as a heat radiating plate that absorbs and emits heat generated from the image sensor 214. The imaging element 214 is electrically connected to the imaging substrate 218 on the back surface of the holding member 216 (the surface opposite to the surface on which the imaging element 214 is mounted). The imaging substrate 218 is also fixed to the back surface of the holding member 216. The imaging board 218 is provided with a connector 222 on the back side surface (surface facing rearward) and a connector 224 on the front side surface (surface facing front). The imaging board 218 and one end of a flexible printed circuit board (FPC) 208 are electrically connected via the connector 222. Hereinafter, the flexible printed circuit board 208 is referred to as a connection FPC 208. The other end of the connection FPC 208 is electrically connected to the control printed board 124. That is, the connection FPC 208 electrically connects the imaging board 218 and the control printed board 124.

  The optical holding member 210 is fixed on the holding member 216 on the surface on which the image sensor 214 is mounted. The optical holding member 210 is a frame body that is formed so as to surround a light beam directed from the photographing lens toward the light receiving surface of the imaging element 214, and an optical low-pass filter (OLPF) is formed in a rectangular opening of the optical holding member 210. 212 and a physical property shutter 220 are arranged. In the present embodiment, the physical property shutter 220 is a liquid crystal shutter, and is hereinafter referred to as a liquid crystal shutter 220. A layer having a characteristic of cutting light in the infrared wavelength band can be formed on the surface of the OLPF 212 as necessary. Alternatively, an infrared cut filter may be disposed inside the optical holding member 210 separately from the OLPF 212.

  The liquid crystal shutter 220 is a shutter in which a liquid crystal material is sealed between two opposing transparent substrates such as glass. On the surface of the liquid crystal shutter 220, one polarizing filter is disposed on each of the front side surface (front side surface) and the back side surface (back side surface). Transparent electrodes are formed on the inner surfaces of the two opposing transparent substrates. By switching the voltage application state to these transparent electrodes, the liquid crystal shutter 220 is configured so that the entire planar surface through which the imaging light beam passes can be switched between a light-transmitting state and a light-blocking state all at once. The liquid crystal shutter 220 may be a so-called normally white one or a normally black one. When the liquid crystal shutter 220 is normally white, it is in a light-transmitting state when not energized. That is, the shutter is a normally open type shutter. When the liquid crystal shutter 220 is normally black, it is in a light shielding state when no power is supplied. That is, the shutter is a normally closed type shutter.

  One end of the shutter FPC 209 is electrically connected to the liquid crystal shutter 220, while the other end is electrically connected to the connector 224. Since each contact of the connector 224 and each contact of the connector 222 are electrically connected via the imaging substrate 218, the liquid crystal shutter 220 and the control printed board 124 are electrically connected via the shutter FPC 209 and the connection FPC 208. Is done.

  A vibration unit 226 is disposed on the surface of the optical holding member 210 located on the subject side via a support 228 having elasticity, and a diaphragm 206 formed of a light transmitting member such as a glass material is provided on the subject side. Be placed. In the present embodiment, the excitation unit 226 is assumed to be a piezoelectric element, and is hereinafter referred to as a piezoelectric element 226. The support body 228 and the piezoelectric element 226 have a frame shape surrounding the rectangular opening of the optical holding member 210. The piezoelectric element 226 is fixed to the back side surface (surface facing rearward) of the diaphragm 206, and is configured so that vibration (deformation) generated in the piezoelectric element 226 is more reliably transmitted to the diaphragm 206. The support body 228 and the diaphragm 206 are fixed to the optical holding member 210 by a method described later.

  One end of the piezoelectric element FPC 211 is electrically connected to the piezoelectric element 226, while the other end is electrically connected to the connector 224. As described above, since each contact of the connector 224 and each contact of the connector 222 are electrically connected via the imaging substrate 218, the piezoelectric element 226 and the control printed board 124 are connected to the piezoelectric element FPC 211, Electrical connection is established via the connection FPC 208.

  The support body 228 that elastically supports the vibration plate 206 and the piezoelectric element 226 suppresses the vibration generated in the piezoelectric element 226 from being transmitted to the components other than the vibration plate 206 in the electronic camera 100, and the piezoelectric element 226 and the vibration plate 206. It is desirable to have physical properties that do not hinder free vibration of the material as much as possible. Materials having such physical properties include materials such as gel materials and rubber. In the present embodiment, the support body 228 is formed of silicone rubber. Silicone rubber is excellent in that the change in hardness due to a change in temperature is relatively small and the deterioration over time is relatively small.

  The diaphragm 206 and the piezoelectric element 226 described above are attached to the optical holding member 210 via the support 228, and as a result, a sealed structure portion is formed. As a result, the liquid crystal shutter 220, the OLPF 212, and the image sensor 214 are sealed, and dust is prevented from entering the interior. The piezoelectric element 226 is driven for a certain period of time when the electronic camera 100 is turned on or at a timing before the power is turned off. Thereby, the diaphragm 206 is vibrated by the piezoelectric element 226. Therefore, even if dust adheres to the surface of the diaphragm 206, the dust is splashed and removed by the vibration of the diaphragm 206.

  As described above, components such as the image sensor 214, the OLPF 212, the liquid crystal shutter 220, the support 228, the piezoelectric element 226, and the diaphragm 206 are fixed on the holding member 216. In addition, the imaging substrate 218 is fixed on the back side of the holding member 216. When the camera shake correction unit 250 drives the holding member 216 in a plane parallel to the XY plane, the above-described components fixed on the holding member 216 are integrated and are parallel to the XY plane. Move in.

  The camera shake correction unit 250 includes a camera shake sensor that detects shaking of the electronic camera 100. Based on the signal from the camera shake sensor and the focal length of the photographic lens mounted, the magnitude of image blur occurring on the light receiving surface of the image sensor 214 is calculated. Then, the holding member 216 is driven in the X-axis direction and the Y-axis direction so that the calculated image blur is reduced. At this time, the relative position between the imaging board 218 and the control printed board 124 changes sequentially. In order to cope with the change in the relative position, the connection FPC 208 is provided with a slack portion 208a.

  The camera shake correction unit 250 includes a side extending part 250b, and the holding member 216 is driven in the side extending part 250b along the Y-axis direction (a direction orthogonal to the paper surface of FIG. 2). An actuator is built in. As this actuator, an ultrasonic actuator, a stepping motor, a moving coil actuator also called a VCM (voice coil motor), a moving magnet actuator, or the like can be used. The side extending portion 250b extends to a position covering the back surface of the main capacitor 150 on the non-grip side.

  The main capacitor 150 is bonded and fixed to the mount holding part 200 with a double-sided adhesive tape 252. The double-sided pressure-sensitive adhesive tape 252 may be a thin one based on paper, non-woven fabric, plastic film or the like, but a thick one based on a foam or the like can be used. When the double-sided adhesive tape 252 is thick, the double-sided adhesive tape 252 can absorb vibration generated by the main capacitor 150 due to light emission from the flash device. On the contrary, by bonding to the mount holding part 200 with the thin double-sided adhesive tape 252, it is possible to suppress the vibration generated by the main capacitor with the rigidity of the mount holding part 200.

  As shown in FIG. 2A, the main capacitor 150 is disposed on the back side of the mount holding part 200 where the body mount 110 is fixed (the back side behind the body mount mounting surface). In other words, the main capacitor 150 is fixed to a portion that is rigidly connected to the body mount 110 and has increased rigidity.

  As shown in FIG. 2A, the control printed board 124 and the battery chamber 122 are disposed on the grip side with respect to the optical axis. Further, the control printed board 124 is disposed behind the battery chamber 122. FIG. 2A shows a state where the battery B is mounted in the battery chamber 122. The memory card MC that is detachably attached to the electronic camera 100 is disposed between the battery chamber 122 and the control printed board 124. As described above, the battery B and the memory card MC can be attached and detached by opening the lid 132 provided at the bottom of the electronic camera 100. The arrangement position of the memory card MC may be behind the control printed board 124. Further, as a lid that opens and closes when the memory card MC is attached / detached, a lid other than the lid 132 may be provided.

  FIG. 3 is a cross-sectional view taken along the line III-III in FIG. 1, that is, a state in which two rearward extending portions 200a are provided on each of the upper side and the lower side. It is a cross-sectional view showing a cross section along a horizontal plane passing through the portion 200a. FIG. 3 shows a state in which the rear extension 200a provided on the lower side of the image sensor 214 is fixed to the lower extension 250a of the camera shake correction unit 250 and the screw 254. As is clear from FIG. 3, the body mount 110, the mount holding part 200, and the camera shake correction part 250 are integrated by screw fastening. In addition, the front cover 102 is fastened by a screw 116 on the front side of the portion where the main capacitor 150 is attached on the opposite side of the mount holding part 200. When the front cover 102 is made of metal, the front cover 102 and the mount holding part 200 are screwed together, whereby the rigidity of the mount holding part 200 can be increased.

  4 is a vertical cross-sectional view showing a cross section taken along the line IV-IV in FIG. 1, that is, a cross section along a vertical plane including the optical axis. The camera shake correction unit 250 includes a downward extending portion 250a, and an actuator for driving the holding member 216 along the X-axis direction (a direction orthogonal to the paper surface of FIG. 4) is provided in the downward extending portion 250a. Built in. This actuator can be the same as the actuator for driving the holding member 216 along the Y-axis direction. The downward extending portion 250a extends further below the lower end portion of the image sensor 214.

  An electronic viewfinder 302 is disposed above the camera shake correction unit 250. The electronic viewfinder 302 includes a small transmissive liquid crystal display unit, a backlight illumination device that illuminates the transmissive liquid crystal display unit from the back side, and an image formed on the liquid crystal display unit by a photographer. And a magnifying optical system for observation. By bringing the eye close to the eyepiece of the electronic viewfinder 302, the photographer can observe a live view image, a reproduced image, or photographing information.

  The tripod attachment part 130 is disposed in front of the downward extension part 250 a of the camera shake correction part 250. The body-side signal contact 118 is disposed in front of and above the tripod mounting portion 130.

  FIG. 5, like FIG. 4, shows a section taken along the line IV-IV in FIG. 1, and shows a state in which an interchangeable lens (photographing lens) 320 is mounted. The interchangeable lens 320 includes a lens element 324, a lens frame 326, a mount 322 (hereinafter referred to as a lens mount 322 to distinguish it from a body-side mount), a lens-side signal contact 328, a lens control unit 330, A focus actuator 332 and a diaphragm actuator 334 are provided.

  When the lens mount 322 is fitted and fastened to the body mount 110, the body side signal contact 118 and the lens side signal contact 328 come into contact with each other. When the power of the electronic camera 100 is turned on, power is supplied from the electronic camera 100 to the lens control unit 330, the focus actuator 332, and the aperture actuator 334. Then, communication is performed between the electronic camera 100 and the interchangeable lens 320, information is exchanged between the two, and an aperture control signal and a focus control signal are output from the electronic camera 100 to the interchangeable lens 320. The lens control unit 330 adjusts the aperture of the diaphragm based on the diaphragm control signal received from the electronic camera 100, and similarly drives the focus adjustment lens based on the focus control signal received from the electronic camera 100.

  FIG. 6 shows an essential part of the electronic camera 100, and is an exploded perspective view illustrating how the body mount 110, the camera shake correction unit 250, the optical holding member 210, the main capacitor 150 and the like are attached to the mount holding unit 200. It shows how it was seen from. In FIG. 6, four screws 112, 205, 230, and 254 are used, but only one screw is shown. Also, four pressing members 207 attached to the optical holding member 210 with screws 205 are used, but only one is shown. Similarly, the mount holding part 200 is shown with four rear extending parts 200a, but only one lead line and reference numeral are given.

  The body mount 110 is fixed to the front surface of the mount holding part 200 with four screws 112. The main capacitor 150 is bonded to a mounting surface 200 c provided on the back side of the mount holding part 200 via a double-sided adhesive tape 252.

  The imaging element 214 is mounted on the front side of the holding member 216, and the imaging substrate 218 is fixed on the back side. The imaging element 214 and the imaging substrate 218 are electrically connected. A connection FPC 208 is electrically connected to the imaging substrate 218 via a connector 222.

  An OLPF 212 and a liquid crystal shutter 220 (not shown in FIG. 6) are incorporated into a rectangular opening of the optical holding member 210 and fixed. The optical holding member 210 is fixed to the holding member 216 with four screws 230. The holding member 216 includes a downward extending portion 250a that is a portion extending to the lower side of the camera shake correction portion 250 and a side extending portion that is also a portion extending to the side opposite to the grip side of the camera shake correcting portion 250. It is mechanically connected to a camera shake correction actuator provided at 250b.

  On the front side of the optical holding member 210, a vibration plate 206 to which a piezoelectric element 226 is fixed is disposed via an elastic support body 228. Similarly, an elastic pressing member 207 connects the vibration plate 206 to the support body 228. It is fixed with screws 205 so as to be sandwiched. As a result, the piezoelectric element 226 and the diaphragm 206 are elastically held on the front side of the optical holding member 210 by the support 228 and the pressing member 207. For example, the pressing member 207 is formed from a rolled material such as a copper alloy or stainless steel having a spring property by pressing or the like. As described above, four pressing members 207 and four screws 205 are used, but only one set is shown in FIG.

  Two rear extending portions 200 a, which are portions extending rearward on the back side of the mount holding portion 200, are provided on the upper side and two on the lower side of the image sensor 214. The rear extension 200a provided so as to be located above the image sensor 214 is connected to the camera shake corrector 250 by a screw 254 inserted in a through hole provided at a position above the image sensor 214 in the camera shake corrector 250. It is concluded. On the other hand, the rear extension 200a provided to be positioned below the image sensor 214 is fastened to the camera shake correction unit 250 by a screw 254 inserted in a through hole provided in the lower extension 250a of the camera shake correction unit 250. Is done. Further, the tripod attachment part 130 is located between the two rear extension parts 200 a provided at a position below the image sensor 214.

  A structure for attaching the diaphragm 206 and the like to the optical holding member 210 will be described with reference to FIGS. 7, 8, and 9. 7, FIG. 8, and FIG. 9 show a section VII-VII, a section VIII-VIII, and a section IX-IX in FIG. 2B, respectively.

  In FIG. 7, the liquid crystal shutter 220 is inserted into the rectangular opening of the optical holding member 210 from the front side (left side in FIG. 7), and the support 228, the piezoelectric element 226, and the vibration plate 206 are arranged to arrange the liquid crystal shutter 220. Is shown. In addition, a state in which the OLPF 212 is inserted from the rear side of the optical holding member 210 (the right side in FIG. 7) and the imaging element 214 and the holding member 216 are arranged is shown.

  In FIG. 8, a state in which the support body 228, the piezoelectric element 226, and the diaphragm 206 disposed on the front side of the optical holding member 210 are fixed to the optical holding member 210 by the screw 205 through the pressing member 207 is shown. Yes. Further, the state in which the holding member 216 is fixed to the optical holding member 210 by the screw 230 is shown.

  FIG. 9 shows a structure for pulling out the shutter FPC 209 and the piezoelectric element FPC 211 to the outside of the optical holding member 210. A shallow groove 210c having substantially the same dimensions as the thickness and width of the shutter FPC 209 is formed on the front surface of the optical holding member 210. The shutter FPC 209 is pulled out of the optical holding member 210 through the groove 210c. On the other hand, the piezoelectric element FPC 211 is drawn from between the piezoelectric element 226 and the support 228. At this time, the support 228 is elastically deformed, and a space for pulling the piezoelectric element FPC 211 out of the optical holding member 210 is secured. Note that a groove similar to the groove 210c can be formed on the surface of the support 228. The diaphragm 206 is pressed by the pressing member 207 toward the optical holding member 210, and an airtight structure among the piezoelectric element 226, the piezoelectric element FPC 211, the support 228, the shutter FPC 209, and the optical holding member 210 is secured by the pressing force. . Further, in a portion where the shutter FPC 209 and the piezoelectric element FPC 211 are not present, the diaphragm 206 is pressed toward the optical holding member 210 by the pressing member 207, and the piezoelectric element 226, the support 228, and the optical holding member 210 are pressed by the pressing force. An airtight structure is ensured. With the above configuration, entry of dust into the optical holding member 210 is suppressed.

  As described above, the electronic camera 100 includes the focal plane type liquid crystal shutter 220 instead of the mechanical focal plane shutter. This eliminates the need for a drive mechanism for driving the curtain of the focal plane shutter and an actuator or mechanism for shutter charging, simplifying the configuration of the electronic camera 100 and making the electronic camera 100 smaller and lighter. .

  The image sensor 214 will be described. In the present embodiment, the image sensor 214 includes a switching element that can electrically control the start and end of an exposure operation, and is configured to be able to control the exposure operation by a so-called electronic shutter method. At this time, the image sensor 214 may be subjected to line-sequential exposure using a rolling shutter system, but it is desirable that exposure be performed using a global shutter system. The image sensor 214 that can be exposed by the global shutter method may be a CCD image sensor or a CMOS image sensor. The reason why it is desirable to perform exposure by the global shutter method is to minimize the influence of the light transmitted through the shutter.

  Here, the shutter transmitted light means light that is transmitted when the shutter is in a light shielding state. If the illuminance of subject light incident on the liquid crystal shutter 220 through the interchangeable lens 320 is extremely large, the influence of light that passes through and reaches the light receiving surface of the image sensor 214 cannot be ignored even when the liquid crystal shutter 220 is in a light-shielded state. . For example, when the image sensor 214 is of the rolling shutter type, if the amount of light transmitted through the shutter after the series of exposure operations is completed and the liquid crystal shutter 220 is in a light-shielded state, the image signal is still read out. The charge is increased in the non-pixel. In this regard, in the case where exposure using the global shutter method is performed, as described below, the charge obtained by the original exposure operation is stored, so that the photoelectric conversion unit of the pixel before the image signal is read after the exposure operation is completed Even if it hits the light, there is almost no effect.

  When an interline transfer type CCD (IT-CCD) of the type widely used for electronic cameras is used as the image sensor 214, global shutter type exposure can be performed. That is, unnecessary charges are discharged almost simultaneously in all the pixels, and after a predetermined exposure time has elapsed, the charges accumulated in the photoelectric conversion units of the respective pixels are transferred to the transfer channel all at once. It is possible to start and stop the accumulation operation almost simultaneously in all pixels. By using the IT-CCD, the charge obtained by the original exposure operation is transferred to the transfer channel (vertical CCD) when the exposure operation is completed, so that the shutter transmitted light enters the photoelectric conversion unit during the image signal output operation. Even if charges are generated in the photoelectric conversion portion, there is almost no influence.

  When the image sensor 214 is a CMOS sensor capable of global shutter exposure, it is configured to be able to clear charges existing in the photoelectric conversion unit and the floating diffusion region almost simultaneously in all pixels. In addition, switching elements are disposed between the photoelectric conversion unit and the floating diffusion region of each pixel, and these switching elements can be turned on / off substantially simultaneously. That is, the above-described charge clearing is performed almost simultaneously on all the pixels, and after a predetermined exposure time has elapsed, the switching elements are turned off almost simultaneously on all the pixels, so that the accumulation operation is performed on all the pixels on the image sensor almost simultaneously. It is configured to be able to start and stop. As described above, when the image sensor 214 is a CMOS sensor capable of global shutter exposure, the electric charge obtained in the photoelectric conversion unit of each pixel by the original exposure operation is sequentially transferred to the floating diffusion region of each pixel. The Then, with the completion of the exposure operation, the switching element provided between the photoelectric conversion unit and the floating diffusion region can be turned off, and the photoelectric conversion unit and the floating diffusion region can be cut off. Therefore, even if a charge is generated in the photoelectric conversion unit by the light transmitted through the shutter, the charge does not move to the floating diffusion region of the unread pixel, and the read image signal is hardly affected.

  The configuration of the global shutter type CMOS image sensor is disclosed in detail in, for example, Japanese Patent Application Laid-Open No. 2009-188650 filed by the applicant of the present invention. Therefore, detailed description thereof is omitted in this specification.

  FIG. 10 is a cross-sectional view taken along the line XX in FIG. 1, that is, a vertical cross section at a portion where the front cover 102 and the mount holding portion 200 are fastened with screws 116 on the non-grip side. The flash device includes a window member 154, a reflective umbrella 156, a xenon tube 158, a reflective umbrella holding member 160, a flash control unit 162, and a main capacitor 150. The flash light emitter 152 is disposed on the upper side of the main capacitor 150.

  The reflective umbrella holding member 160 holds the reflective umbrella 156 and the xenon tube 158. The reflector 156 reflects and collects light emitted from the xenon tube 158 toward the subject. The window member 154 uniformizes the light collected by the reflector 156 and determines the direction of the light so that a desired irradiation angle is obtained. The flash control unit 162 oscillates, boosts, and rectifies a DC voltage supplied from a power source, and accumulates charges in the main capacitor 150. The flash control unit 162 also starts discharging in the xenon tube 158 when receiving a light emission control signal emitted from the control unit of the electronic camera 100. First, pre-flash is emitted from the flash light emitting unit 152 toward the subject, the reflected light from the subject is measured, and an appropriate light emission time is calculated based on this. Subsequently, the main light emission is performed from the flash light emitting unit 152 toward the subject, and when the predetermined light emission amount is reached, the energization to the xenon tube 158 is stopped to stop the light emission.

  As is clear from the longitudinal sectional view of FIG. 10, the main capacitor 150 is disposed in the electronic camera 100 held in the horizontal position so that the cylindrical axis of the main capacitor is substantially parallel to the vertical direction. The main capacitor 150 is also disposed behind the body mount 110 and in front of the camera shake correction unit 250.

  In the present embodiment, the flash light emitting unit 152 is fixed, but the flash light emitting unit 152 is housed in the electronic camera 100 when the flash device is not used, and protrudes from the electronic camera 100 when used. You may have the structure of a type | formula.

  FIG. 11 is a diagram showing a state where the front cover 102 is viewed from the back side. The front cover 102 is provided with openings 102b and 102c. A window member 154 is attached to the opening 102b. The opening 102c is a part to which the body mount 110 is attached. The front cover 102 is also provided with two seats 102a protruding to the back side. In the center of the seat 102a, an opening for fitting with the screw 116 is provided. When the front cover 102 and the mount holding part 200 are fastened by the screws 116, the front cover 102 and the mount holding part 200 abut on the seat 102a.

  In FIG. 11, the arrangement position of the main capacitor 150 is drawn by a two-dot chain line. The main capacitor 150 is disposed behind a portion where the front cover 102 and the mount holding part 200 are fastened by the screws 116.

  FIG. 12 is a block diagram schematically illustrating the internal configuration of the electronic camera 100. The electronic camera 100 includes an imaging device 214, an imaging control unit 400, an SDRAM 402, an image processing unit 404, a compression / decompression processing unit 406, a system bus 408, a control unit (CPU) 410, a release button 106, , An operation member 128 and a power switch 304 are provided. The electronic camera 100 further includes a piezoelectric element drive circuit 412, a piezoelectric element 226, a liquid crystal shutter drive circuit 414, a liquid crystal shutter 220, a flash control unit 162, a flash light emission unit 152, a program / data storage unit 424, A display processing unit 418, a display device 300, an electronic viewfinder (EVF) 302, a recording / playback processing unit 420, and an image storage unit 422 are provided. Since the above-described constituent elements include those already described, the configuration of the electronic camera 100 will be described focusing on the constituent elements that have not been described below.

  The imaging control unit 400, control unit 410, image processing unit 404, SDRAM 402, program / data storage unit 424, display processing unit 418, compression / decompression processing unit 406, and recording / playback processing unit 420 are electrically connected via a system bus 408. Connected.

  The image sensor 214 is assumed to be a CMOS image sensor capable of global shutter exposure with a built-in analog front end. The image signal output from each pixel is subjected to processing such as amplification, noise reduction, and A / D conversion in the image sensor 214, and the image signal output from the image sensor 214 to the image processing unit 404 is It is assumed that it is a digital image signal. The imaging control unit 400 controls the operation timing of imaging performed by the imaging element 214 based on the control signal output from the control unit 410.

  The SDRAM 402 is a memory having a relatively high access speed, and is used as a storage area for temporarily storing a program executed by the control unit 410 and a digital image signal output from the image sensor 214. Access to the SDRAM 402 is configured to be possible from any of the image processing unit 404, the control unit 410, the compression / decompression processing unit 406, the display processing unit 418, and the recording / reproduction processing unit 420.

  The control unit 410 interprets and executes a program that is read from the program / data storage unit 424 and temporarily stored in the SDRAM 402, and performs overall control of the operation of the electronic camera 100. The control unit 410 is connected to the release button 106, the operation member 128, the power switch 304, the piezoelectric element driving circuit 412, the liquid crystal shutter driving circuit 414, and the flash control unit 162. The control unit 410 outputs a control signal to the imaging control unit 400, the piezoelectric element drive circuit 412, the liquid crystal shutter drive circuit 414, the flash control unit 162, and the like based on the operation of the power switch 304, the operation member 128, and the release button 106 by the user. To do.

  The piezoelectric element driving circuit 412 generates a high-voltage alternating voltage based on the control signal output from the control unit 410 and applies it to the piezoelectric element 226. As a result, the piezoelectric element 226 generates vibration. The liquid crystal shutter drive circuit 414 applies a voltage having a predetermined waveform to the liquid crystal shutter 220 based on a control signal output from the control unit 410 or cancels the application of the voltage. As a result, the liquid crystal shutter 220 is switched to a translucent state that guides the subject light onto the light receiving surface of the image sensor 214 or a light shielding state that prevents the subject light from entering the image sensor 214.

  Based on the control signal output from the control unit 410, the flash control unit 162 performs the charging operation to the main capacitor 150, the flash operation in the flash light emitting unit 152 as described above with reference to FIG. Controls the amount of light emitted when flashing.

  An example of the control operation of the electronic camera 100 performed by the control unit 410 will be described later with reference to flowcharts shown in FIG.

  The image processing unit 404 performs processing such as white balance, demosaicing, shading correction, hue correction, saturation correction, contrast correction, and sharpness correction on the digital image signal obtained from the image sensor 214 to generate image data. . In this specification, a signal output from the image sensor 214 before being demosaiced is referred to as an image signal, and a signal after being processed by the image processing unit 404 is referred to as image data. The image processing unit 404 also sequentially generates image data for live view display and temporarily records it in a VRAM area reserved in the SDRAM 402 when the electronic camera 100 is operating in the shooting mode. . The display processing unit 418 outputs a live view image based on display image data recorded in the VRAM area of the SDRAM 402 to the display device 300 or the electronic viewfinder 302.

  The compression / decompression processing unit 406 performs compression / decompression processing of still image data and moving image data. When the electronic camera 100 is set to the shooting mode and still images and moving images are recorded, the compression / decompression processing unit 406 performs compression processing on the image data temporarily stored in the SDRAM 402. The recording / playback processing unit 420 adds metadata or the like to the image data compressed by the compression / decompression processing unit 406 to generate an image file of a predetermined format, and outputs the image file to the image storage unit 422. The image storage unit 422 is configured by a non-volatile memory such as a flash memory. The image storage unit 422 may be configured to be removable from the electronic camera 100 as a memory card, or may be configured as a built-in memory of the electronic camera 100. In that case, the image storage unit 422 and the program / data storage unit 424 may be integrally configured.

  On the other hand, when the electronic camera 100 is set to the playback mode and the user selects a desired image, the recording / playback processing unit 420 reads the corresponding image file from the image storage unit 422. The compression / decompression processing unit 406 performs decompression processing on the compressed image data stored in the read image file, and temporarily records it in a VRAM area secured on the SDRAM 402. The display processing unit 418 outputs an image based on the image data recorded in the VRAM area of the SDRAM 402 to the display device 300 or the electronic viewfinder 302.

− First embodiment −
FIGS. 13A and 13B are flowcharts schematically illustrating a control procedure of a still image shooting operation executed by the control unit 410 of the electronic camera 100 according to the first embodiment of the present invention. The electronic camera 100 has the configuration described above with reference to FIGS. The process shown in the flowchart of FIG. 13 is executed by the control unit 410 when the power switch 304 of the electronic camera 100 in the power-off state is operated to switch to the power-on state.

  In the first embodiment, the liquid crystal shutter 220 is a so-called normally open type shutter. That is, it is assumed that the shutter is in a translucent state when not energized. That is, it is assumed that the liquid crystal shutter 220 is in a light-transmitting state at the time when the processing shown in the flowchart of FIG. 13 is started. Further, although processing for automatic focus adjustment and live view image display is actually performed, illustration and description of those processing steps are omitted in order to simplify the explanation and facilitate understanding.

  In S <b> 1300, the control unit 410 outputs a control signal to the piezoelectric element driving circuit 412, drives the piezoelectric element 226 for a certain time, and vibrates the diaphragm 206. That is, when dust adheres to the surface of the diaphragm 206, an operation for removing it is performed.

  In step S1302, the control unit 410 determines whether the current operation mode is the shooting mode. If the determination in step S1302 is affirmed, the process proceeds to step S1304. If the determination is negative, the process branches to step S1370.

  If the determination in S1302 is affirmed, the control unit 410 determines in S1304 whether a release operation by the user has been detected. If the determination in S1304 is affirmative, the process proceeds to S1306, and if negative, the process branches to S1350.

  In S1306, which is a branch destination when the determination in S1304 is affirmed, the control unit 410 acquires a photometric value. When acquiring a photometric value, if the electronic camera 100 is provided with a dedicated photometric sensor, the control unit 410 inputs a signal output from the photometric sensor and acquires the photometric value. Alternatively, when the imaging operation for live view display is repeatedly performed by the imaging device 214, it is also possible to process the image signal obtained from the imaging device 214 and acquire a photometric value.

  In S1308, the control unit 410 determines the result of the photometric value acquisition process in S1306, the exposure mode set in the electronic camera 100, the focal length of the interchangeable lens 320 (when the interchangeable lens 320 has a variable magnification optical system). The set aperture value and the exposure time (shutter speed) are derived according to the set focal length), the set sensitivity, and the like. The set aperture value and the exposure time are derived by referring to a calculation or a lookup table.

  In step S <b> 1310, the control unit 410 outputs information on the set aperture value and a control signal for starting the aperture to the interchangeable lens 320. In step S1312, the control unit 410 determines whether or not a narrowing operation completion signal has been received from the photographing lens 320. While this determination is negative, the processing of step S1312 is repeated to wait for the completion of the narrowing operation. If the determination in S1312 is affirmative, the process proceeds to S1314.

  In step S <b> 1314, the control unit 410 outputs a control signal to the imaging control unit 400 to start exposure with the imaging element 214. As described above, since the liquid crystal shutter 220 is already in a light-transmitting state, the process in S1314 is a process for resetting the image sensor 214. That is, a reset signal is output from the imaging control unit 400 to the imaging element 214, and in accordance with this, a process of discharging charges existing in the photoelectric conversion unit and the floating diffusion region in each pixel in the imaging element 214 is performed. Thereafter, a new charge accumulation operation (exposure operation) is started in the image sensor 214.

  In S1316, the control unit 410 determines whether or not the time since the exposure has started in S1314 has reached the exposure time derived in S1308, and repeats the process of S1316 while this determination is denied. Do. If the determination in S1316 is affirmative, the process proceeds to S1318.

  In step S1318, the control unit 410 outputs a control signal to the imaging control unit 400 so as to stop the exposure operation in the imaging device 214. The imaging control unit 400 outputs a control signal to the imaging element 214. In each pixel in the image sensor 214, the switching element between the photoelectric conversion unit and the floating diffusion region is cut off, and subsequent charge transfer from the photoelectric conversion unit to the floating diffusion region is prevented.

  In step S1320, the control unit 410 outputs a control signal to the liquid crystal shutter drive circuit 414 so as to switch the liquid crystal shutter 220 to the light shielding state. The liquid crystal shutter drive circuit 414 applies a voltage having a predetermined waveform pattern to the liquid crystal shutter 220 to switch the liquid crystal shutter 220 in the translucent state to the light shielding state.

  In S1322, the control unit 410 outputs a control signal to the imaging control unit 400 so as to start transfer of the digital image signal from the imaging element 214 to the image processing unit 404. The imaging control unit 400 outputs a control signal to the imaging device 214, and transfer of the digital image signal from the imaging device 214 to the image processing unit 404 is started.

  In S1324, the control unit 410 determines whether or not the transfer of the digital image signal from the image sensor 214 to the image processing unit 404 is completed, and repeats the process of S1324 while this determination is denied. If the determination in S1324 is affirmative, the process proceeds to S1326.

  In step S1326, the control unit 410 outputs a control signal to the liquid crystal shutter drive circuit 414 so as to switch the liquid crystal shutter to the light-transmitting state. The liquid crystal shutter drive circuit 414 releases the voltage application to the liquid crystal shutter 220 and switches the liquid crystal shutter 220 in the light shielding state to the light transmitting state.

  In S1328, the control unit 410 outputs an aperture opening control signal to the interchangeable lens 320. In the interchangeable lens 320, an operation of opening the aperture is started.

  In step S <b> 1330, the control unit 410 outputs a control signal to the image processing unit 404 so that pixel defect correction is performed on the digital image signal output from the image sensor 214. The image processing unit 404 corresponds to a defective pixel (defective image) based on information on a pixel defect portion stored in the program / data storage unit 424 (hereinafter, this information is referred to as “defective pixel information”). The pixel value is replaced (complemented) with a value obtained from pixel values of pixels existing around the defective pixel. This is pixel defect correction processing.

  Pixel defects include hot pixels and dead pixels. A defective pixel exhibiting a hot pixel symptom always outputs a pixel value of a certain size even though no light is incident on the pixel. When an image obtained from an image sensor having hot pixels is viewed, the presence of an unnatural bright spot may be recognized. A defective pixel exhibiting a dead pixel symptom does not output a pixel value corresponding to the amount of incident light, even though a sufficient amount of light is incident on the pixel. When an image obtained from an image sensor having a dead pixel is viewed, the presence of an unnatural dark spot may be recognized. Information regarding the position of the pixel in which these pixel defects have occurred is stored in the program / data storage unit 424 as defective pixel information.

  In step S1332, the control unit 410 outputs a control signal to the image processing unit 404 so as to perform image processing. Upon receiving this control signal, the image processing unit 404 performs demosaicing, white balance, hue correction, saturation correction, contrast correction, noise reduction, sharpness correction, and the like on the digital image signal temporarily stored in the SDRAM 402. Processing is performed to generate digital image data.

  In step S1334, the control unit 410 outputs a control signal to the compression / decompression processing unit 406 so as to perform compression processing, and outputs a control signal to the recording / playback processing unit 420 so as to record the image file in the image storage unit 422. To do. The compression / decompression processing unit 406 performs compression processing on the digital image data temporarily stored on the SDRAM 402 according to a preset compression method and compression rate. The recording / playback processing unit 420 records the compressed image data in the image storage unit 422.

  In step S1336, the control unit 410 determines whether an aperture opening completion signal has been received from the interchangeable lens 320. In other words, the aperture opening operation is performed by the interchangeable lens 320 based on the aperture opening control signal output to the interchangeable lens 320 in S1328. When the operation is completed, the aperture opening operation completion signal output from the interchangeable lens 320 is received. It is determined in S1336 whether or not it has been done. This determination process is repeated until the determination in S1336 is affirmed. If the determination in S1336 is affirmative, the process proceeds to S1338.

  In S1338, the control unit 410 determines whether or not an operation for turning off the power of the electronic camera 100 has been performed by the user. If this determination is negative, the process returns to S1302, and the above-described series of processing is repeated. On the other hand, when the determination in S1338 is affirmed, the control unit 410 stops the operation of the electronic camera 100, turns off the power, and enters the standby operation mode.

  In S1370, which is a branch destination when the determination as to whether or not the current operation mode is the shooting mode is negative in S1302, the control unit 410 performs a series of processes related to image reproduction, and the process proceeds to S1338.

  Processing after S1350 executed after branching when no release operation is detected in S1304 will be described. In step S1350, the control unit 410 determines whether pixel defect detection processing has been set. The electronic camera 100 is configured such that when a user operates the operation member 128, an operation for calling a menu screen or the like and instructing execution of a pixel defect detection process can be performed. The determination process of S1350 is a process of detecting the above operation by the user. The pixel defect detection process is a process for checking the presence / absence of the hot pixel described above and, if present, recording the pixel position where the hot pixel exists in the program / data storage unit 424. A hot pixel is a pixel defect that may newly occur due to the influence of cosmic rays after the electronic camera 100 reaches the user's hand. Therefore, it is possible to obtain a more preferable photographing result by periodically performing the pixel defect detection process. If the determination in S1350 is negative, the process proceeds to S1338. If the determination is positive, pixel defect detection processes in S1352 and subsequent steps are performed.

  In step S1352, the control unit 410 outputs a control signal to the liquid crystal shutter drive circuit 414 so that the liquid crystal shutter 220 is in a light shielding state. In response to this control signal, the liquid crystal shutter drive circuit 414 applies a voltage having a predetermined waveform pattern to the liquid crystal shutter 220 to switch the liquid crystal shutter 220 in the translucent state to the light shielding state.

  In S1354, the control unit 410 outputs a control signal to the imaging control unit 400 so that the accumulation operation is performed in the imaging element 214 for a predetermined time. The image sensor 214 performs an accumulation operation based on a control signal output from the imaging control unit 400. Since the accumulation operation performed by the image sensor 214 by the processing of S1354 is performed when the liquid crystal shutter 220 is in the light-shielded state, charge accumulation at the dark current noise level is performed. If the influence of the light transmitted through the shutter described above cannot be ignored, the aperture of the interchangeable lens 320 is reduced to the minimum aperture during the processing in S1352, or the user is prompted to attach the lens cap to the display device 300. It is also possible to display.

  In S1356, the control unit 410 outputs a control signal to the imaging control unit 400 so that the image signal is output from the imaging element 214 to the image processing unit 404. Upon receiving the control signal from the imaging control unit 400, the imaging device 214 outputs an image signal to the image processing unit 404.

  In step S <b> 1358, the control unit 410 outputs a control signal to the image processing unit 404 so as to perform processing for detecting a position where a bright pixel, that is, a hot pixel is present. Upon receiving this control signal, the image processing unit 404 performs processing for confirming the presence / absence of a hot pixel and detecting a pixel position where the hot pixel exists.

  In S1360, when a new hot pixel is detected in the process of S1358, the control unit 410 adds information regarding the pixel position to the defective pixel information recorded in the program / data storage unit 424.

  In step S <b> 1362, the control unit 410 outputs a control signal to the liquid crystal shutter drive circuit 414 so that the liquid crystal shutter 220 is in a translucent state. In response to this control signal, the liquid crystal shutter drive circuit 414 releases the application of voltage to the liquid crystal shutter 220 and switches the liquid crystal shutter 220 in the light shielding state to the light transmitting state. After the process in S1362, the process in S1338 is performed.

  Through the above-described processing described with reference to FIG. 13, if dust adheres to the diaphragm 206, it is removed. Further, when a new pixel defect occurs, the defective pixel information recorded in the program / data storage unit 424 is updated by performing the processing from S1352 to S1362. Then, it is possible to obtain an image in which the influence of the defective pixel is reduced by the pixel defect correction process performed in S1330.

− Second Embodiment −
In the first embodiment, the control procedure of the still image shooting operation in the case where the liquid crystal shutter 220 provided in the electronic camera 100 is a normally open type, that is, a shutter that enters a light-transmitting state when not energized has been described. In contrast, in the second embodiment, an example in which a normally closed type, that is, a shutter that is in a light-shielded state in a non-energized state is used as the liquid crystal shutter 220 will be described.

  FIGS. 14A and 14B are flowcharts schematically illustrating a control procedure of a still image shooting operation executed by the control unit 410 of the electronic camera 100 according to the second embodiment of the present invention. The process shown in the flowchart of FIG. 14 is the same as the process shown in the flowchart of FIG. 13 when the power switch 304 of the electronic camera 100 in the power-off state is operated and switched to the power-on state. 410 is executed. In each processing step in the flowchart of FIG. 14, the same processing steps as those shown in the flowchart of FIG. 13 are denoted by the same step symbols, and detailed description thereof is omitted. The explanation will focus on the differences.

  In step S1400, the control unit 410 outputs a control signal to the liquid crystal shutter drive circuit 414 so that the liquid crystal shutter 220 is in a translucent state. In response to this control signal, the liquid crystal shutter drive circuit 414 applies a voltage having a predetermined waveform pattern to the liquid crystal shutter 220 to switch the liquid crystal shutter 220 in the light shielding state to the light transmitting state.

  Thereafter, the processing from S1300 to S1318 is the same as that described in the first embodiment, including the processing in S1370 when the determination in S1302 is denied. Then, instead of the process of S1320 in FIG. 13, the process of S1402 is performed in the second embodiment. In step S1402, the control unit 410 outputs a control signal to the liquid crystal shutter drive circuit 414 so that the liquid crystal shutter 220 is in a light shielding state. In response to this control signal, the liquid crystal shutter drive circuit 414 cancels the application of the voltage to the liquid crystal shutter 220 and switches the liquid crystal shutter 220 in the translucent state to the light shielding state.

  Subsequent to the process of S1402, the processes of S1322 and S1324 are performed. If it is determined in S1324 that the transfer of the image signal from the image sensor 214 to the image processing unit 404 is completed, the process of S1408 is performed in the second embodiment instead of the process of S1326 in FIG. Is called. In step S1408, the control unit 410 outputs a control signal to the liquid crystal shutter drive circuit 414 so that the liquid crystal shutter 220 is in a translucent state. In response to this control signal, the liquid crystal shutter drive circuit 414 applies a voltage having a predetermined waveform pattern to the liquid crystal shutter 220 to switch the liquid crystal shutter 220 in the light shielding state to the light transmitting state.

  Following the switching of the liquid crystal shutter 220 to the light-transmitting state in the process of S1408, the processes of S1328, S1330, S1332, S1334, S1336, and S1338 are performed as in the first embodiment. At the time when the determination process in S1338 is performed, a voltage having a predetermined waveform pattern is applied to the liquid crystal shutter 220. Therefore, the determination in S1338 is affirmed, the operation of the electronic camera 100 is stopped, and the process of canceling the voltage application to the liquid crystal shutter 220 is performed in S1410 before turning off the power and entering the standby operation mode. That is, in S1410, the control unit 410 outputs a control signal to the liquid crystal shutter drive circuit 414 so that the liquid crystal shutter 220 is in a light shielding state. In response to this control signal, the liquid crystal shutter drive circuit 414 cancels the application of the voltage to the liquid crystal shutter 220 and switches the liquid crystal shutter 220 in the translucent state to the light shielding state.

  In S1350, which is a branch destination when no release operation is detected in S1304, the control unit 410 determines whether or not pixel defect detection processing is set. If the determination in S1350 is negative, the process proceeds to S1338 as in the first embodiment. On the other hand, if the determination in S1350 is affirmed, pixel defect detection processing is performed in S1404, S1356, S1358, S1360, and S1406.

  The difference between the pixel defect detection processing in the second embodiment and the processing from S1352 to S1362 in FIG. 13 in the first embodiment is as follows. That is, the process of S1352 of the first embodiment is replaced with S1402 in the second embodiment, and the process of S1362 of the first embodiment is replaced with S1406 in the second embodiment. The point is different.

  In step S1404, the control unit 410 outputs a control signal to the liquid crystal shutter drive circuit 414 so that the liquid crystal shutter 220 is in a light shielding state. In response to this control signal, the liquid crystal shutter drive circuit 414 releases the application of the voltage to the liquid crystal shutter 220 and switches the liquid crystal shutter 220 in the translucent state to the light shielding state.

  Thereafter, as in the first embodiment, a series of processing relating to pixel defect detection is performed from S1354 to S1360.

  In step S1406, the control unit 410 outputs a control signal to the liquid crystal shutter drive circuit 414 so that the liquid crystal shutter 220 is in a translucent state. In response to this control signal, the liquid crystal shutter drive circuit 414 applies a voltage having a predetermined waveform pattern to the liquid crystal shutter 220 to switch the liquid crystal shutter 220 in the light shielding state to the light transmitting state. After the process in S1406, the process in S1338 is performed.

  As described above, also in the second embodiment, as in the first embodiment, if dust adheres to the diaphragm 206, it is removed. Also, when a new pixel defect occurs, the defective pixel information recorded in the program / data storage unit 424 is updated. Then, it is possible to obtain an image in which the influence of the defective pixel is reduced by the pixel defect correction process performed in S1330.

  In addition to the above effects, the liquid crystal shutter 220 is in a light-shielded state when not energized, and therefore the following effects can be achieved. That is, when strong light such as sunlight is incident on the inside of the electronic camera 100 through the interchangeable lens 320, strong light may strike the light receiving surface of the image sensor 214. In particular, when sunlight enters the electronic camera 100 and the focal length of the interchangeable lens 320 is close to infinity, light energy is concentrated in a narrow area on the light receiving surface of the image sensor 214. To do. Although there is no problem in a short time, if the electronic camera 100 is left outdoors and strong light continues to enter the electronic camera 100, the image sensor 214 may be deteriorated. In this respect, since the liquid crystal shutter 220 is in a light-shielded state when not energized, it is possible to suppress the deterioration of the image sensor 214.

− Third embodiment −
In the first and second embodiments, the example in which the pixel defect detection process is performed when the user performs an operation to instruct the execution of the pixel defect detection process has been described. In contrast, in the third embodiment, an example in which pixel defect detection processing is automatically performed when the power of the electronic camera 100 is turned on will be described. In the third embodiment, as in the first embodiment, the liquid crystal shutter 220 will be described as an example in which a normally open type, that is, a shutter that is in a light-transmitting state in a non-energized state is used. Of course, a normally closed type shutter may be used.

  15A and 15B are flowcharts schematically illustrating a control procedure of a still image shooting operation executed by the control unit 410 of the electronic camera 100 according to the third embodiment of the present invention. The process shown in the flowchart of FIG. 15 is similar to the process shown in the flowchart of FIG. 13 when the power switch 304 of the electronic camera 100 in the power-off state is operated and switched to the power-on state. 410 is executed. In each processing step in the flowchart of FIG. 15, the same processing steps as those shown in the flowchart of FIG. 13 are denoted by the same step symbols, and detailed description thereof is omitted. The explanation will focus on the differences.

  In S1500 immediately after the electronic camera 100 is turned on, the control unit 410 outputs a control signal to the liquid crystal shutter drive circuit 414 so that the liquid crystal shutter 220 is in a light shielding state. In response to this control signal, the liquid crystal shutter drive circuit 414 applies a voltage having a predetermined waveform pattern to the liquid crystal shutter 220 to switch the liquid crystal shutter 220 in the translucent state to the light shielding state.

  The processes of S1502, S1504, S1506, and S1508 following the process of S1500 correspond to the processes of S1354, S1356, S1358, and S1360 in FIG. That is, the exposure (accumulation) operation is performed by the image sensor 214 with the liquid crystal shutter 220 in a light-shielded state (S1502), an image signal is output from the image sensor 214 to the image processing unit 404 (S1504), and the image processing unit 404 shines. A process of detecting the position of the point pixel is performed (S1506). When a new hot pixel is detected in the process of S1506, a process of adding information related to the pixel position to the defective pixel information recorded in the program / data storage unit 424 is performed in S1508.

  In step S1510, the control unit 410 outputs a control signal to the liquid crystal shutter drive circuit 414 so that the liquid crystal shutter 220 is in a translucent state. In response to this control signal, the liquid crystal shutter drive circuit 414 cancels the application of the voltage to the liquid crystal shutter 220 and switches the liquid crystal shutter 220 in the light shielding state to the light transmitting state.

  Subsequent to the pixel defect detection process described above, the processes from S1300 to S1338 and 1370 are performed. In the processing after S1300, the difference from the first embodiment is the processing at the branch destination when the determination of whether or not the release operation in S1304 has been detected. That is, in the first embodiment, as shown in FIG. 13, if the determination in S1304 is negative, the presence or absence of a user operation instructing execution of the pixel defect detection process is determined in S1350, and this determination is positive. If so, the processing from S1352 to S1362 is performed. These processes are omitted in the third embodiment because they have already been performed from S1500 to S1510 as shown in FIG.

  With the above-described processing described with reference to FIG. 15, the following effects can be obtained in addition to the same effects as those of the first embodiment. That is, when the power of the electronic camera 100 is turned on, the pixel defect detection process is automatically performed, so that it is possible to deal with pixel defects that have newly occurred in the past and obtain a more preferable image. it can. In addition, even if the user of the electronic camera 100 does not have knowledge of pixel defect detection processing, the functions provided in the electronic camera 100 can be used effectively.

-Fourth embodiment-
In the fourth embodiment, similarly to the third embodiment, the pixel defect detection process is automatically performed. At this time, in the third embodiment, pixel defect detection processing is performed immediately after the electronic camera 100 is turned on, whereas in the fourth embodiment, the electronic camera 100 is turned off. A pixel defect detection process is performed before this.

  Also in the fourth embodiment, as in the first and third embodiments, the liquid crystal shutter 220 will be described as an example in which a normally open type, that is, a shutter that is in a non-energized state and is in a light-transmitting state is used. Of course, a normally closed type shutter may be used.

  FIGS. 16A and 16B are flowcharts schematically illustrating a control procedure of a still image shooting operation executed by the control unit 410 of the electronic camera 100 according to the fourth embodiment of the present invention. The process shown in the flowchart of FIG. 16 is the same as the process shown in the flowchart of FIG. 13 when the power switch 304 of the electronic camera 100 in the power-off state is operated and switched to the power-on state. 410 is executed. In each processing step in the flowchart of FIG. 16, the same processing steps as those shown in the flowchart of FIG. 13 are denoted by the same step symbols, and detailed description thereof is omitted. The explanation will focus on the differences.

  When the power of the electronic camera 100 is turned on, the processing from S1300 to S1338 and 1370 is performed. In the processing after S1300, the difference from the first embodiment is that the processing at the branch destination when the determination as to whether or not the release operation in S1304 has been detected is negative as in the third embodiment. It is. That is, in the first embodiment, as shown in FIG. 13, if the determination in S1304 is negative, the presence or absence of a user operation instructing execution of the pixel defect detection process is determined in S1350, and this determination is positive. If so, the processing from S1352 to S1362 is performed. These processes are omitted in the fourth embodiment because they are performed in the processes from S1600 to S1610 before the electronic camera 100 is turned off, as shown in FIG.

  In S1338, the control unit 410 determines whether or not an operation for turning off the power of the electronic camera 100 has been performed by the user. If this determination is negative, the process returns to S1302, and the above-described series of processing is repeated. On the other hand, if the determination in S1338 is affirmative, the process branches to S1600.

  In step S1600, the control unit 410 outputs a control signal to the liquid crystal shutter drive circuit 414 so that the liquid crystal shutter 220 is in a light shielding state. In response to this control signal, the liquid crystal shutter drive circuit 414 applies a voltage having a predetermined waveform pattern to the liquid crystal shutter 220 to switch the liquid crystal shutter 220 in the translucent state to the light shielding state.

  The processes of S1602, S1604, S1606, and S1608 following the process of S1600 correspond to the processes of S1354, S1356, S1358, and S1360 in FIG. That is, an exposure (accumulation) operation in a light-shielded state is performed by the image sensor 214 (S1602), an image signal is output from the image sensor 214 to the image processing unit 404 (S1604), and the position of the bright spot pixel is detected by the image processing unit 404. Is detected (S1606). When a new hot pixel is detected in the process of S1606, a process of adding information regarding the pixel position to the defective pixel information recorded in the program / data storage unit 424 is performed in S1608.

  In step S1610, the control unit 410 outputs a control signal to the liquid crystal shutter drive circuit 414 so that the liquid crystal shutter 220 is in a translucent state. In response to this control signal, the liquid crystal shutter drive circuit 414 cancels the application of the voltage to the liquid crystal shutter 220 and switches the liquid crystal shutter 220 in the light shielding state to the light transmitting state. Thereafter, the control unit 410 stops the operation of the electronic camera 100, turns off the power, and enters the standby operation mode.

  With the processing described above with reference to FIG. 16, the same effects as those of the third embodiment can be obtained. In addition, since the pixel defect detection process is performed before the power of the electronic camera 100 is turned off, it is possible to shorten the time from when the electronic camera 100 is turned on until it can be released.

  In the above description, the electronic camera 100 has been described as including the camera shake correction unit 250 (in-body camera shake correction unit) that reduces the camera shake by moving the image sensor 214 along a plane orthogonal to the optical axis of the imaging lens. The present invention can also be applied to a device that does not include the camera shake correction unit 250. Alternatively, the present invention can also be applied to an electronic camera that corrects camera shake by moving an optical element in a photographing lens. Furthermore, the present invention can be applied to a movie camera that can also shoot still images.

  Further, the example using the liquid crystal shutter 220 as the physical property shutter has been described above. However, an apparatus using an electrochromic element (ECD) or the like may be provided.

  The present invention is not limited to the above-described embodiments as they are, and can be variously embodied by modifying the constituent elements without departing from the gist of the present invention. Further, various inventions can be formed by appropriately combining a plurality of constituent elements disclosed in the embodiment. The following is an example.

[Additional notes]
[1] An imaging device that converts subject light incident through a photographic lens into an electrical signal, and configured to be capable of starting and stopping accumulation operations at substantially the same time in all pixels on the imaging device. Elements,
Provided on the subject side of the image sensor and switching the voltage application state to prevent the subject light from entering the image sensor and to prevent the subject light from entering the image sensor A physical property shutter that can be switched to a light-shielding state;
A defective pixel information storage unit for storing defective pixel information including information on the position of a pixel having a defect in the image sensor;
An image processing unit that corrects a signal value corresponding to a pixel specified by the defective pixel information with respect to an image signal obtained from the image sensor, and generates image data;
A defective pixel detection processing unit that detects a defective pixel that may exist in the image sensor and generates the defective pixel information based on the detection result;
The defective pixel detection processing unit analyzes an image signal output from the image sensor after a photoelectric conversion operation is performed in the image sensor for a certain period of time when the physical property shutter unit is in the light shielding state. An electronic photographing apparatus configured to detect a pixel from which a signal value having a magnitude exceeding a predetermined reference is obtained as the defective pixel.

[2] A user operation detection unit that detects a user operation instructing a defective pixel detection operation is further provided,
The defective pixel detection processing unit is configured to start an operation of detecting the defective pixel when a user operation instructing the defective pixel detection operation is detected by the user operation detection unit. The electronic photographing apparatus according to [1].

[3] A power operation unit configured to be capable of accepting a user operation for switching on / off the power of the electronic photographing apparatus.
The defective pixel detection processing unit is configured to start the defective pixel detection process when a user operation to switch from OFF to ON is received by the power operation unit and the power is turned on. The electronic photographing apparatus according to [1].

[4] A power operation unit configured to be capable of accepting a user operation for switching on / off the power of the electronic photographing apparatus,
The defective pixel detection processing unit is configured to start detection processing of the defective pixel before turning off the power when a user operation to switch from on to off is received by the power operation unit. The electronic photographing apparatus according to [1].

  [5] Any one of [1] to [4], wherein the physical property shutter unit is configured by a liquid crystal shutter, and is switched to the translucent state when a voltage is applied to the liquid crystal shutter. The electronic imaging device described in 1.

  [6] In any one of [1] to [4], the physical property shutter unit is configured by a liquid crystal shutter, and is switched to the light shielding state when a voltage is applied to the liquid crystal shutter. The electronic photographing apparatus described.

DESCRIPTION OF SYMBOLS 100 ... Electronic camera 102 ... Front cover 104 ... Rear cover 108 ... AF auxiliary light source 110 ... Body mount 112, 116, 205, 230, 254, 256 ... Screw 118 ... Body side signal contact 122 ... Battery chamber 124 ... Control printed board 130 ... Tripod mounting part 150 ... Main condenser 152 ... Flash light emitting part 156 ... Reflector umbrella 158 ... Xenon tube 200 ... Mount holding part 200a ... Back extension part 206 ... Diaphragm 207 ... Pressing member 208 ... Connection FPC
209 ... Shutter FPC
210 ... Optical holding member 211 ... Piezoelectric element FPC
212… OLPF
214 ... Imaging element 216 ... Holding member 218 ... Imaging substrate 220 ... Liquid crystal shutter 222, 224 ... Connector 226 ... Piezoelectric element 228 ... Support body 250 ... Shake correction part 250a ... Downward extension part 250b ... Side extension part 252 ... Both sides Adhesive tape 300 ... Display device 302 ... Electronic viewfinder 304 ... Power switch 320 ... Interchangeable lens 328 ... Lens-side signal contact 330 ... Lens controller 400 ... Imaging controller 404 ... Image processor 410 ... Controller 412 ... Piezoelectric element drive circuit 414 ... Liquid crystal shutter drive circuit

Claims (7)

An image sensor that converts subject light incident through the taking lens into an electrical signal;
A light transmissive member provided between the imaging lens and the imaging device;
A vibration unit that vibrates and flexurally vibrates the light transmitting member;
A light-transmitting state is provided between the light-transmitting member and the image sensor, and allows the subject light to enter the image sensor by switching a voltage application state, and the subject light to the image sensor. A physical property shutter part that can be switched to a light-shielding state that prevents the incidence of light,
An electronic imaging apparatus comprising: a sealed structure that surrounds and seals a space formed between the light transmitting member and the imaging element. An image processing unit that processes an image signal output from the image sensor to generate an image file;
A shutter control unit for controlling the physical property shutter unit, wherein when the exposure operation of the image sensor is completed, the physical property shutter unit is switched from the light transmitting state to the light shielding state, and an image signal generated by the image sensor The electronic photographing apparatus according to claim 1, further comprising: a shutter control unit that switches from the light shielding state to the light transmitting state after the output to the image processing unit is completed. An elastic support part that is arranged on the side of the sealed structure part where the light transmission member is arranged and elastically supports the light transmission member;
A first wiring member for guiding electricity to the excitation unit is drawn from a side of the elastic support unit facing the light transmission member;
3. The electronic photographing apparatus according to claim 1, wherein a second wiring member that guides electricity to the physical property shutter part is pulled out from a side of the elastic support part that is in contact with the sealing structure part.   The physical property shutter unit includes a transmissive liquid crystal panel, and is configured to switch to the light-shielding state when a voltage is applied and to the light-transmitting state when the voltage application is released. The electronic imaging device according to claim 1.   The physical property shutter unit includes a transmissive liquid crystal panel, and is configured to switch to the light-transmitting state when a voltage is applied and to the light-shielding state when the voltage application is released. The electronic imaging device according to claim 1.   The electronic imaging apparatus according to claim 1, wherein the excitation unit includes a piezoelectric element.   The electronic imaging apparatus according to claim 1, wherein the imaging element is configured to be able to start and stop the accumulation operation substantially simultaneously in all pixels.

Images