JP2012169373A - Wiring board manufacturing method and wiring board - Google Patents

Wiring board manufacturing method and wiring board Download PDF

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Publication number
JP2012169373A
JP2012169373A JP2011027747A JP2011027747A JP2012169373A JP 2012169373 A JP2012169373 A JP 2012169373A JP 2011027747 A JP2011027747 A JP 2011027747A JP 2011027747 A JP2011027747 A JP 2011027747A JP 2012169373 A JP2012169373 A JP 2012169373A
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JP
Japan
Prior art keywords
conductor pattern
wiring board
ceramic
ink
pattern forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2011027747A
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Japanese (ja)
Inventor
Naoyuki Toyoda
Kentaro Tanabe
Yoshikazu Hama
佳和 ▲濱▼
健太郎 田邉
直之 豊田
Original Assignee
Seiko Epson Corp
セイコーエプソン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp, セイコーエプソン株式会社 filed Critical Seiko Epson Corp
Priority to JP2011027747A priority Critical patent/JP2012169373A/en
Publication of JP2012169373A publication Critical patent/JP2012169373A/en
Withdrawn legal-status Critical Current

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