JP2012146913A - Voltage conversion module element, and voltage conversion module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a voltage conversion module element of novel configuration in which an IC for voltage conversion is built in a multilayer wiring board without deteriorating the noise removal performance of the IC for voltage conversion, and to provide a voltage conversion module.SOLUTION: In the voltage conversion module element and the voltage conversion module comprising an IC for voltage conversion mounted on one wiring pattern located inward side of a plurality of wiring patterns in a multilayer wiring board and performing voltage conversion, and a capacitor mounted on at least one of the plurality of wiring patterns so as to electrically connect an input terminal on the input side of the IC for voltage conversion and a ground terminal, the total connection length of the capacitor to the input terminal and the ground terminal of the IC for voltage conversion is set equal to or shorter than 1 mm.

Description

  The present invention relates to a voltage conversion module element and a voltage conversion module that can be suitably used in information communication devices and mobile communication devices.

  In recent years, electronic devices are required to have higher density and higher functionality in the trend of higher performance and smaller size. From this point of view, even modules with circuit components are required to support high density and high functionality. In order to meet such demands, multilayer wiring boards are now being actively performed.

  In such a multilayer wiring board, a plurality of wiring patterns are disposed so as to be substantially parallel in the thickness direction, an insulating member is disposed between the wiring patterns, and an electronic component such as a semiconductor component is an insulating member. It is embedded so as to be electrically connected to at least one of the wiring patterns. Then, an interlayer connector (via) penetrating the insulating members in the thickness direction is formed, and a plurality of wiring patterns are electrically connected to each other (for example, see Patent Document 1).

  On the other hand, in the voltage conversion IC, a capacitor is arranged in parallel with the voltage conversion IC on the input side in order to sufficiently drive the voltage conversion IC. The capacitor has a capacity of about 2 μF, and further has a size of, for example, 1 mm × 0.5 mm, and is mainly used for stabilizing the input voltage to the voltage conversion IC and removing noise.

  In Patent Document 2, only a voltage conversion IC is built in a multilayer wiring board, and the capacitor is arranged in a capacitor built-in layer formed on the multilayer wiring board. However, the module configured as described in Patent Document 2 has a problem that the noise removal performance of the voltage conversion IC using the capacitor is not sufficiently exhibited.

JP 2003-197849 A JP 2003-115664 A

  An object of the present invention is to provide a voltage conversion module element and a voltage conversion module having a novel configuration in which a voltage conversion IC is built in a multilayer wiring board without deteriorating the noise removal performance of the voltage conversion IC. And

In order to achieve the above object, the present invention provides:
A multilayer wiring board having a plurality of wiring patterns stacked sequentially and spaced apart from each other, an insulating member positioned between each of the plurality of wiring patterns, and an interlayer connector electrically connecting the plurality of wiring patterns; ,
A voltage conversion IC for performing voltage conversion mounted on one of the wiring patterns located inward of the plurality of wiring patterns;
In at least one of the plurality of wiring patterns, including a capacitor mounted so as to be electrically connected to an input terminal and a ground terminal on the input side of the voltage conversion IC,
The total length of connection of the capacitor to the input terminal and the ground terminal of the voltage conversion IC is 1 mm or less.

  The inventor paid attention to the function of the capacitor on the input side of the voltage conversion IC, which was a problem in the past. As a result, it was found that the capacitor has both noise removal from the external power supply and noise removal from the voltage conversion IC. Therefore, the shorter the connection length between the capacitor and the voltage conversion IC, that is, the electrical connection length through the wiring or the like, the more the resistance (impedance) of the connection portion can be reduced. It was conceived that the noise removal function for the voltage conversion IC could be effectively exhibited.

  However, although the connection length between the capacitor and the voltage conversion IC was appropriately adjusted, the noise removal function for the voltage conversion IC could not be effectively exhibited, and the present inventor conducted further earnest studies. .

  As a result, by reducing the distance between the capacitor and the voltage conversion IC to 1 mm or less, the resistance (impedance) of the wiring connecting the capacitor and the voltage conversion IC is remarkably reduced. It has been found that the noise removal function of the conversion IC can be sufficiently exerted.

  Therefore, according to the present invention, it is possible to provide a voltage conversion module element having a novel configuration in which the voltage conversion IC is built in the multilayer wiring board without deteriorating the noise removal performance of the voltage conversion IC.

  The present inventor has also found that the capacitor does not have to be a large-capacity capacitor in order to effectively remove the noise of the voltage conversion IC. That is, since the noise from the external power source is low frequency (several tens of Hz to several kHz), a large-capacitance capacitor is required, while the noise of the voltage conversion IC is high frequency (several tens of kHz to tens of MHz). Not much capacity is needed. Further, since the resonance frequency of the capacitor is higher as the capacitance is smaller, the impedance of the capacitor is reduced at a higher frequency, and the noise removal effect is improved.

  Therefore, in one example of the present invention, the capacitor can be miniaturized, so that among the plurality of wiring patterns constituting the multilayer wiring board, it can be mounted by being electrically connected to the wiring pattern positioned inward, In particular, it can be mounted on a wiring pattern on which the voltage conversion IC is mounted. In this case, since the voltage conversion IC and the capacitor can be arranged close to each other, the above-described connection length of 1 mm or less can be easily achieved.

  For example, a large-capacity capacitor for removing noise from the external power supply can be added to the original power supply or the like.

  In one example of the present invention, the capacitor is mounted on a wiring pattern located on the outermost layer of a plurality of wiring patterns, and the voltage conversion IC is one of the wiring patterns located on the inner side immediately below the capacitor. It can also be implemented in one. Also in this case, since the capacitor and the voltage conversion IC can be disposed relatively close to each other, the above-described connection length of 1 mm or less can be achieved relatively easily.

  In particular, if a wiring pattern located on the outermost layer and one of the wiring patterns located on the inner side are arranged adjacent to each other, a connection length of 1 mm or less can be achieved more easily.

  In order to allow the voltage conversion module element described above to function as an actual voltage conversion module, the output side of the voltage conversion IC on the main surface of the multilayer wiring board via a plurality of wiring patterns and interlayer connectors, The output of the voltage conversion IC via a plurality of wiring patterns and interlayer connectors or inductors on the main surface of the multilayer wiring board, and the inductor mounted so as to be electrically connected in series with the voltage conversion IC On the side, a second capacitor mounted so as to be electrically connected in parallel with the voltage conversion IC is provided.

  As described above, according to the present invention, a voltage conversion module element and a voltage conversion module having a novel configuration in which a voltage conversion IC is incorporated in a multilayer wiring board without deteriorating the noise removal performance of the voltage conversion IC are provided. can do.

It is a section lineblock diagram showing the voltage conversion module of a 1st embodiment. It is a figure which shows the connection state of IC for voltage conversion and a 1st capacitor | condenser of the voltage conversion module shown in FIG. It is an equivalent circuit diagram regarding the voltage conversion module shown in FIG. It is a section lineblock diagram showing the voltage conversion module of a 2nd embodiment. It is an upper top view which shows the voltage conversion module of 3rd Embodiment. FIG. 6 is a top plan view of the voltage conversion module shown in FIG. 5. It is an upper top view which shows the voltage conversion module of 4th Embodiment. It is a graph which shows the relationship between the connection length to the input terminal and ground terminal of voltage conversion IC of the capacitor | condenser in an Example, and the ratio of the high frequency noise component by switching with respect to an input voltage.

  Hereinafter, specific features of the present invention will be described based on embodiments for carrying out the invention.

(First embodiment)
FIG. 1 is a cross-sectional configuration diagram illustrating an example of the voltage conversion module of the present embodiment, and FIG. 2 is a diagram illustrating a connection state between a voltage conversion IC and a capacitor in the voltage conversion module illustrated in FIG.

  The voltage conversion module 10 shown in FIG. 1 includes a first wiring pattern 111, a second wiring pattern 112, a third wiring pattern 113, a fourth wiring pattern 114, a fifth wiring pattern 115, a first wiring pattern in order from the bottom. 6 wiring patterns 116 and a seventh wiring pattern 117.

  Further, the first insulating member 121 to the sixth insulating member 126 are interposed between the adjacent wiring patterns in the first wiring pattern 111 to the seventh wiring pattern 117, respectively.

  Specifically, the first insulating member 121 exists between the first wiring pattern 111 and the second wiring pattern 112, and the second insulating film 121 is interposed between the second wiring pattern 112 and the third wiring pattern 113. An insulating member 122 exists, and a third insulating member 123 exists between the third wiring pattern 113 and the fourth wiring pattern 114. Further, the fourth insulating member 124 exists between the fourth wiring pattern 114 and the fifth wiring pattern 115, and the fifth insulating member 125 is interposed between the fifth wiring pattern 115 and the sixth wiring pattern 116. The sixth insulating member 126 exists between the sixth wiring pattern 116 and the seventh wiring pattern 117.

  Further, the adjacent wiring patterns in the first wiring pattern 111 to the seventh wiring pattern 117 are electrically connected to each other by the first interlayer connection body 131 to the sixth interlayer connection body 136.

  The first wiring pattern 111 to the seventh wiring pattern 117, the first insulating member 121 to the sixth insulating member 126, and the first interlayer connector 131 to the sixth interlayer connector 136 are multilayer wiring boards. Constitute.

  A resist layer 191 is formed on the first wiring pattern 111 so that a part of the wiring pattern 111 is exposed. One of the wiring patterns 117 is formed on the seventh wiring pattern 117. A resist layer 192 is formed so that the portion is exposed.

  In FIG. 1, the first insulating member 121 to the sixth insulating member 126 are described so as to be distinguishable. However, since they are actually fused to each other, it is difficult to identify these insulating members. In this embodiment, in order to clarify the features of the present invention, these insulating members are described so as to be identifiable for convenience.

  Moreover, although the voltage conversion module 10 shown in FIG. 1, ie, the multilayer wiring board which comprises this, is made into seven layers in this embodiment, it can be made into arbitrary numbers as needed.

  In the voltage conversion module 10 shown in FIG. 1, the second wiring pattern 112 functions as a component mounting wiring pattern, and the voltage conversion IC 15 is electrically and mechanically connected to the wiring pattern 112 via the solder balls 15C. Has been implemented. Further, on the same component mounting wiring pattern, that is, the second wiring pattern 112, the capacitor 16 is connected and mounted on the input side of the voltage conversion IC 15 so as to be adjacent to and electrically connected to the voltage conversion IC 15. Has been.

  The capacitance of the capacitor 16 can be set to, for example, 0.1 μF or less, preferably 10 nF or more, from the viewpoint of noise removal of the voltage conversion IC 15. Such a relatively small capacitor has a sufficiently small size of, for example, about 0.6 mm × 0.3 mm. Therefore, the voltage conversion IC 15 and the multi-layer wiring board can be used without increasing the size of the multilayer wiring board. It can be easily built in the wiring board.

  As shown in FIG. 2, the portion of the second wiring pattern 112 where the voltage conversion IC 15 is mounted is branched into an input terminal pattern 112A and a ground pattern 112B, and the capacitor 16 is connected to these input terminal patterns. It is mounted across 112A and the ground terminal pattern 112B and is electrically connected to the voltage conversion IC 15. The ground pattern 112B is installed in the voltage conversion IC 15 from the viewpoint of setting a reference for determining the voltage value of the voltage input to the voltage conversion IC 15.

  In this embodiment, the wiring pattern for mounting the voltage conversion IC 15 and the like is the second wiring pattern. However, other wiring patterns can be used as the component mounting wiring layer. Furthermore, although the voltage conversion IC 15 and the capacitor 16 are mounted on the second wiring pattern 112, they may be mounted on different wiring patterns positioned inward.

  Further, the seventh wiring pattern 117 also functions as a component mounting wiring layer, and the second capacitor 17 and the inductor 18 are adjacent to each other on the seventh wiring pattern 117, that is, on the main surface of the multilayer wiring board. It is implemented like this. The second capacitor 17 and the inductor 18 are connected to the seventh wiring pattern 117 by solder materials 17A and 18A on the bottom and side surfaces thereof.

  The capacitance of the second capacitor 17 is preferably 4 μF or more, and is preferably 10 μF or less in view of cost and size. Therefore, such a relatively large capacitor has a sufficiently large size, for example, about 2 mm × 1.25 mm. Therefore, as shown in FIG. 1, it is preferable to mount on the main surface without incorporating in the multilayer wiring board described above. The same applies to the inductor 18.

  The inductor 18 passes through the seventh wiring pattern 117 and the first interlayer connection body 131 to the sixth interlayer connection body 136, that is, the remaining wiring patterns, that is, the first wiring pattern 111 to the sixth wiring pattern 116. Thus, on the output side of the voltage conversion IC 15, the voltage conversion IC 15 is connected in series with the voltage conversion IC 15.

  The second capacitor 17 also has the remaining wiring patterns, that is, the first wiring pattern 111 to the first wiring through the seventh wiring pattern 117 and the first interlayer connection body 131 to the sixth interlayer connection body 136. 6 is electrically connected to the voltage conversion IC 15 on the output side of the voltage conversion IC 15 so as to be in parallel with the voltage conversion IC 15.

  The second capacitor 17 mounted on the main surface of the multilayer wiring board, that is, on the seventh wiring pattern 117 can function together with the inductor 18 mainly for stabilizing the output voltage from the voltage conversion IC 15. .

  Therefore, the voltage conversion module 10 shown in FIG. 1 forms an equivalent circuit as shown in FIG.

  In the voltage conversion module 10 shown in FIG. 1, for example, a capacitor for removing external power supply noise can be added to a power supply (not shown), etc., so that the capacitor 16 has sufficient noise removal function of the voltage conversion IC 15. It can be demonstrated. However, in order to exhibit the function, the total of the connection length 2d = (d + d) of the capacitor 16 to the input terminal 15A and the ground terminal 15B of the voltage conversion IC 15 is 1 mm or less. In this case, the resistance (impedance) of the input terminal pattern 112A connecting the capacitor 16 and the voltage conversion IC 15 and the ground pattern is remarkably reduced, and the noise removal function of the voltage conversion IC of the capacitor 16 is sufficiently exhibited. Can do.

  Therefore, according to the present embodiment, it is possible to provide the voltage conversion module element, that is, the voltage conversion module 10 in which the voltage conversion IC 15 is built in the multilayer wiring board without deteriorating the noise removal performance of the voltage conversion IC 15. .

  The wiring pattern located on the lowermost layer of the multilayer wiring board, that is, the back surface opposite to the main surface, that is, the first wiring pattern 111 can function as a terminal layer. Accordingly, the voltage conversion module 10 shown in FIG. 1 can be easily connected to an external circuit or an external device, and a voltage conversion function can be added to the external circuit or the external device.

(Second Embodiment)
FIG. 4 is a cross-sectional configuration diagram illustrating an example of the voltage conversion module of the present embodiment. Note that the same reference numerals are used for components similar or identical to those of the voltage conversion module 10 shown in FIG.

  The voltage conversion module 20 shown in FIG. 4 is an electric circuit in which the voltage conversion IC 15 and the capacitor 16 are turned upside down on the seventh wiring pattern 117 in the multilayer wiring board constituting the voltage conversion module 10 shown in FIG. Connected and implemented.

  In the present embodiment, since the voltage conversion IC 15 is disposed in proximity to the second capacitor 17 and the inductor 18 for stabilizing the output voltage, the inductance value and resistance component of the wiring interposed therebetween are Compared to the voltage conversion module 10 according to the first embodiment shown in FIG. Therefore, the effect of stabilizing the output voltage of the second capacitor 17 and the inductor 18 with respect to the voltage conversion IC 15 can be more effectively achieved.

  The other configuration is the same as that of the voltage conversion module 10 shown in FIG. 1 and will not be described. However, the same function and effect are obtained based on having the same configuration as that of the voltage conversion module 10 shown in FIG. Play. That is, the input terminal for connecting the capacitor 16 and the voltage conversion IC 15 by setting the total of the connection length 2d = (d + d) of the capacitor 16 to the input terminal 15A of the voltage conversion IC 15 and the ground terminal 15B to 1 mm or less. The resistance (impedance) of the pattern 112A and the ground pattern is significantly reduced, and the function of the capacitor 16 for removing the noise of the voltage conversion IC can be sufficiently exhibited.

(Third embodiment)
FIG. 5 is a cross-sectional configuration diagram illustrating an example of the voltage conversion module of the present embodiment, and FIG. 6 is a top plan view of the voltage conversion module illustrated in FIG. 5. Note that the same reference numerals are used for components similar or identical to those of the voltage conversion module 10 shown in FIG.

  In the voltage conversion module 30 shown in FIG. 5, the sixth wiring pattern 116 functions as a component mounting wiring layer in the multilayer wiring board constituting the voltage conversion module 10 shown in FIG. 1, and voltage conversion is performed on the wiring pattern 116. IC 15 is electrically and mechanically connected and mounted via solder balls 15C.

  The seventh wiring pattern 117 also functions as a component mounting wiring layer. On the seventh wiring pattern 117, that is, on the main surface of the multilayer wiring board, a capacitor 16, a second capacitor 17, and an inductor 18 are provided. It is mounted so as to be adjacent to each other. At this time, the length direction defined between the electrode portions 161 and 162 located at both ends of the capacitor 16, the length direction defined between the electrode portions 171 and 172 located at both ends of the second capacitor 17, and the inductor 18 Are arranged in parallel so that the length directions defined between the electrode portions 181 and 182 located at both ends of the two are parallel to each other.

  The capacitor 16 is positioned on the input side with respect to the voltage conversion IC 15 in the voltage conversion module 30 of the present embodiment. The second capacitor 17 and the inductor 18 are located on the output side with respect to the voltage conversion IC 15.

  The electrode part 162 of the capacitor 16 constitutes an input part in the voltage conversion module 30 shown in FIGS. 5 and 6, and the potential of the electrode part 161 is set to the ground. Further, the electrode portion 172 of the second capacitor 17 facing the electrode portion 162 constituting the input portion of the capacitor 16 is set to the ground. Furthermore, the electrode part 181 of the inductor 18 constitutes an output part in the voltage conversion module 30, and the electrode part 182 is set to the ground.

  The electrode portion 171 of the second capacitor 17 and the electrode portion 181 constituting the output portion of the inductor 18 are electrically connected by a wiring pattern 19 made of a good electrical conductor, for example, Au, Ag, Cu or the like. Therefore, the second capacitor 17 and the inductor 18 are electrically connected in series.

  The capacitor 16 and the inductor 18 are electrically connected to the seventh wiring pattern 117 via a solder material (not shown).

  Further, the voltage conversion IC 15 includes the remaining wiring patterns, that is, the first wiring pattern 111 and the first wiring pattern 112 via the second wiring pattern 112 and the first interlayer connection body 131 to the sixth interlayer connection body 136. The third wiring pattern 113 to the seventh wiring pattern 117 are electrically connected. The capacitor 16 and the inductor 18 are connected to the remaining wiring patterns, that is, the first wiring pattern 111 to the first wiring pattern via the seventh wiring pattern 117 and the first interlayer connection body 131 to the sixth interlayer connection body 136. 6 wiring patterns 116 are electrically connected.

  The voltage conversion IC 15 is electrically connected in parallel to the capacitor 16 and electrically connected in series to the inductor 18 via the wiring patterns 111 to 117 and the interlayer connectors 131 to 136 described above. .

  Also in the voltage conversion module 30 shown in FIGS. 5 and 6, for example, a capacitor for removing external power supply noise can be added to a power supply (not shown). Can be fully exhibited. However, in order to perform this function, the input terminal 15A of the voltage conversion IC 15 via the electrical path including the thickness of the wiring patterns 116 to 117, the wiring pattern 116, and the interlayer connector 136 of the capacitor 16 and The total of the connection length 2d = (d + d) to the ground terminal 15B is 1 mm or less. In this case, the resistance (impedance) of the electrical path connecting the capacitor 16 and the voltage conversion IC 15 is remarkably reduced, and the function of the capacitor 16 for removing the noise of the voltage conversion IC can be fully exhibited. .

  In the present embodiment, the voltage conversion IC 15 is mounted on the sixth wiring pattern 116, and the capacitor 16 is mounted on the seventh wiring pattern 117 of the outermost layer. In this case, since the sixth wiring pattern 116 and the seventh wiring pattern 117 are adjacent to each other, the total of the connection length 2d of the capacitor 16 to the input terminal 15A and the ground terminal 15B of the voltage conversion IC 15 is relatively large. It can be simply 1 mm or less.

  Therefore, according to the present embodiment, it is possible to provide the voltage conversion module element, that is, the voltage conversion module 30, in which the voltage conversion IC 15 is incorporated in the multilayer wiring board without deteriorating the noise removal performance of the voltage conversion IC 15. .

(Fourth embodiment)
FIG. 7 is an upper plan view showing an example of the voltage conversion module of the present embodiment. Note that the same reference numerals are used for components similar or identical to those of the voltage conversion module 10 shown in FIG.

  As shown in FIG. 7, the voltage conversion module 40 of this embodiment is configured such that the voltage conversion IC 15 is positioned directly below the capacitor 16 mounted on the multilayer wiring board in the multilayer wiring board. In this case, since the length of the wiring connecting the voltage conversion IC 15 and the capacitor 16 can be shortened, the thickness of the wiring patterns 116 to 117 of the capacitor 16 and the electrical path formed by the interlayer connector 136. The total of the connection lengths 2d = (d + d) to the input terminal 15A and the ground terminal 15B of the voltage conversion IC 15 via can be set to 1 mm or less relatively easily. As a result, the resistance (impedance) of the electrical path connecting the capacitor 16 and the voltage conversion IC 15 is remarkably reduced, and the function of the capacitor 16 for removing the noise of the voltage conversion IC can be fully exhibited. .

  Therefore, according to the present embodiment, it is possible to provide the voltage conversion module element, that is, the voltage conversion module 40 in which the voltage conversion IC 15 is built in the multilayer wiring board without deteriorating the noise removal performance of the voltage conversion IC 15. .

  In this example, in the voltage conversion module 10 according to the first embodiment, the connection length 2d of the capacitor 16 to the input terminal 15A and the ground terminal 15B of the voltage conversion IC 15 and the high-frequency noise component due to switching with respect to the input voltage. The relationship with the ratio (noise / input voltage) was investigated. The results are shown in FIG.

  The capacitance of the capacitor 16 was 0.1 μF, the capacitance of the second capacitor 17 was 4.7 μF, and the inductance of the inductor 18 was 0.47 μH. The voltage conversion IC 15 is a synchronous rectification step-down DC / DC converter with an oscillation frequency of 6 MHz and a driver ON resistance of 0.5Ω.

  As is apparent from FIG. 8, when the connection length 2d of the capacitor 16 to the input terminal 15A and the ground terminal 15B of the voltage conversion IC 15 is 1 mm or less, the level of the high-frequency noise component with respect to the input voltage is 0.1. Although it is stable at 10% or less, it can be seen that when the connection length 2d exceeds 1 mm, the level of the high-frequency noise component rapidly increases.

  Therefore, when the connection length 2d is 1 mm or less, the resistance (impedance) of the input terminal pattern 112A and the ground pattern connecting the capacitor 16 and the voltage conversion IC 15 is remarkably low, and the noise removal of the voltage conversion IC of the capacitor 16 is performed. It can be seen that the function of can be fully exerted.

  Although not particularly shown, similar results could be obtained for the voltage conversion modules of the second to fourth embodiments.

  The present invention has been described in detail based on the above specific examples. However, the present invention is not limited to the above specific examples, and various modifications and changes can be made without departing from the scope of the present invention.

10, 20, 30, 40 Voltage conversion module 111-117 Wiring pattern 121-126 Insulating member 131-136 Interlayer connector 15 Voltage conversion IC
16 capacitor 17 second capacitor 18 inductor

Claims (8)

A multilayer wiring board having a plurality of wiring patterns stacked sequentially and spaced apart from each other, an insulating member positioned between each of the plurality of wiring patterns, and an interlayer connector electrically connecting the plurality of wiring patterns; ,
A voltage conversion IC for performing voltage conversion mounted on one of the wiring patterns located inward of the plurality of wiring patterns;
In at least one of the plurality of wiring patterns, including a capacitor mounted so as to be electrically connected to an input terminal and a ground terminal on the input side of the voltage conversion IC,
The voltage conversion module element, wherein a total connection length of the capacitor to the input terminal and the ground terminal of the voltage conversion IC is 1 mm or less.   2. The voltage conversion module element according to claim 1, wherein the capacitor is mounted on one of the wiring patterns on which the voltage conversion IC is mounted.   The capacitor is mounted on a wiring pattern located on the outermost layer of the plurality of wiring patterns, and the voltage conversion IC is mounted on one of the wiring patterns located on the inner side immediately below the capacitor. The voltage conversion module element according to claim 1, wherein:   The voltage conversion module element according to claim 3, wherein the wiring pattern located on the outermost layer and one of the wiring patterns located on the inner side are arranged adjacent to each other. A multilayer wiring board having a plurality of wiring patterns stacked sequentially and spaced apart from each other, an insulating member positioned between each of the plurality of wiring patterns, and an interlayer connector electrically connecting the plurality of wiring patterns; ,
A voltage conversion IC for performing voltage conversion mounted on one of the wiring patterns located inward of the plurality of wiring patterns;
In at least one of the plurality of wiring patterns, a capacitor mounted so as to be electrically connected in parallel with the input terminal and the ground terminal of the voltage conversion IC;
Mounted on the main surface of the multilayer wiring board so as to be electrically connected in series with the voltage conversion IC on the output side of the voltage conversion IC via the plurality of wiring patterns and the interlayer connector. Inductor, and
On the main surface of the multilayer wiring board, electrically connected in parallel with the voltage conversion IC on the output side of the voltage conversion IC via the plurality of wiring patterns and the interlayer connector or the inductor. A second capacitor mounted in this manner,
The voltage conversion module, wherein the total connection length of the capacitor to the input terminal and the ground terminal of the voltage conversion IC is 1 mm or less.   The voltage conversion module according to claim 5, wherein the capacitor is mounted on one of the wiring patterns on which the voltage conversion IC is mounted.   The capacitor is mounted on a wiring pattern located on the outermost layer of the plurality of wiring patterns, and the voltage conversion IC is mounted on one of the wiring patterns located on the inner side immediately below the capacitor. The voltage conversion module according to claim 5, wherein:   The voltage conversion module according to claim 7, wherein the wiring pattern located on the outermost layer and one of the wiring patterns located on the inner side are disposed adjacent to each other.

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