JP2012099567A - Cleaning method and exposure device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an exposure device capable of cleaning a configuration member of an exposure device and starting exposure without deteriorating the exposure performance of the exposure device.SOLUTION: In a cleaning method for cleaning a configuration member that constitutes the exposure device and comes into contact with the immersion liquid in an exposure device that exposes a substrate through immersion liquid, the configuration member is cleaned using cleaning fluid, and the cleaning fluid is washed in a state where the liquid level of cleaning fluid in the cleaning fluid is higher than the liquid level of rinsing liquid using the rinsing liquid.

Description

  The present invention relates to a cleaning method and an exposure apparatus.

  As an exposure apparatus for manufacturing a fine semiconductor element, an immersion exposure apparatus that exposes a wafer through a liquid is used. As an immersion exposure system, I thought it would be bad to read that the entire wafer included the chuck. ⇒ Only the form in which the entire wafer is immersed in the immersion liquid filled in the wafer chuck tank and the distance between the wafer surface and the final optical element of the projection optical system facing it are locally immersed in the immersion liquid. There are forms to fill. For example, Patent Document 1 discloses an exposure apparatus that fills and exposes only a space between a wafer surface and a final lens of a projection optical system facing the wafer surface. Further, Patent Document 1 describes that when the surface of the final lens that comes into contact with the immersion liquid becomes dirty, it is necessary to periodically replace the lens.

  In addition to the case where the immersion liquid remains on the lens surface and a water mark remains, it may adhere to the lens surface due to a substance generated from the wafer or a substance generated from within the exposure apparatus. Further, the contamination may occur not only on the lens surface but also on the surface of the nozzle member and the surface of the wafer stage for forming the liquid immersion area. Patent Document 2 describes a cleaning system that uses a cleaning liquid to remove dirt on the final lens surface, and that the final lens surface is rinsed with a rinsing liquid.

International Publication No. 99/49504 Pamphlet JP 2006-032750 A

  When cleaning the member on the exposure apparatus, it is necessary to return to a state where the cleaning liquid does not remain on the constituent member that comes into contact with the immersion liquid and to resume normal exposure. In the invention described in the cited document 2, there is no description on how to rinse the cleaning liquid using the rinsing liquid. Therefore, there is a problem that the cleaning liquid remains when the level of the rinsing liquid is lower than the level of the cleaning liquid. As an adverse effect of the remaining cleaning liquid, the remaining cleaning liquid may be mixed with the immersion liquid to degrade the optical characteristics of the immersion liquid, resulting in poor resolution and exposure defects. In addition, the cleaning liquid remaining on the constituent member chemically reacts with the member to deteriorate the member, generating particles from the member, and an exposure defect occurs. Thus, if the cleaning liquid remains in the exposure apparatus, the exposure performance may be deteriorated (resolution failure or exposure defect).

  SUMMARY OF THE INVENTION An object of the present invention is to provide an exposure apparatus that can start exposure by cleaning constituent members of the exposure apparatus without deteriorating the exposure performance of the exposure apparatus.

  A cleaning method according to one aspect of the present invention is a cleaning method for cleaning a constituent member that constitutes the exposure apparatus and contacts the immersion liquid in an exposure apparatus that exposes a substrate through an immersion liquid. A cleaning step of cleaning the component using a cleaning liquid, and a rinsing step of rinsing the cleaning liquid using a rinsing liquid in a state in which the liquid level of the rinsing liquid is higher than the liquid level of the cleaning liquid at the time of the cleaning step It is characterized by having.

  In the present invention, since the cleaning liquid is washed away in a state in which the liquid level of the rinsing liquid is higher than the liquid level of the cleaning liquid at the time of the cleaning step, the components of the exposure apparatus are cleaned and exposed without deteriorating the exposure performance of the exposure apparatus. Can start.

1 is an overall schematic diagram of an exposure apparatus. (A) It is a schematic sectional drawing around a liquid immersion area | region. (B) It is the schematic which looked at the projection optical system and the nozzle from the immersion area. FIG. 6 is a schematic cross-sectional view around the liquid immersion area when the wafer stage is driven. It is a flowchart of cleaning maintenance. It is the whole schematic figure at the time of the cleaning maintenance in an exposure apparatus. 2 is a schematic cross-sectional view around a cleaning liquid region during cleaning in Example 1. FIG. 2 is a schematic cross-sectional view around a rinse liquid region at the time of rinsing in Example 1. FIG. 6 is a schematic cross-sectional view around a rinsing liquid region at the time of rinsing in Example 2. FIG. (A) It is a schematic sectional drawing around the immersion liquid area | region at the time of exposure in Example 3. FIG. (B) It is a schematic sectional drawing around the washing | cleaning-liquid area | region at the time of washing | cleaning in Example 3. FIG. (C) It is a schematic sectional drawing around the rinse liquid area | region at the time of the rinse in Example 3. FIG. FIG. 6 is a schematic cross-sectional view around a rinsing liquid region at the time of rinsing in Example 4. 10 is a flowchart of cleaning maintenance in the fifth embodiment. FIG. 10 is a schematic cross-sectional view around a cleaning liquid region at the time of cleaning in Example 5. (A) It is a schematic sectional drawing around the washing | cleaning-liquid area | region at the time of washing | cleaning in Example 7. FIG. (B) It is a schematic sectional drawing around the rinse liquid area | region at the time of the rinse in Example 7. FIG. FIG. 10 is a schematic cross-sectional view around a rinsing liquid region at the time of rinsing in Example 8.

  Embodiments of the present invention will be described below with reference to the drawings. In addition, in each figure, about the same member, the same reference number is attached | subjected and the overlapping description is abbreviate | omitted.

  FIG. 1 is a diagram showing a schematic configuration of a step-and-scan type immersion exposure apparatus. The immersion exposure apparatus includes an illumination optical system 12, a reticle stage 22, a projection optical system 31, a wafer stage 53, an immersion liquid supply apparatus 101 that supplies an immersion liquid 100 between the projection optical system 31 and the wafer stage 53, An immersion liquid recovery apparatus 102 that recovers the immersion liquid 100 from between the projection optical system 31 and the wafer stage 53 is provided.

  As described above, in the immersion exposure apparatus, the wafer side surface (final surface) of the final lens closest to the wafer 51 of the projection optical system 31 is in contact with the immersion liquid 100 in whole or in part. An image of a pattern formed on the reticle 21 via the liquid 100 is projected onto the wafer 51 to expose the wafer (substrate).

  The illumination optical system 12 uses the light from the light source 11 to illuminate the reticle 21 on which a transfer circuit pattern is formed. For example, an ArF excimer laser having a wavelength of about 193 nm can be used as the light source 11.

  Reticle (mask) 21 was deleted because almost the same contents are written on the 3rd line. It is supported and driven by the reticle stage 22. Diffracted light from the reticle 21 passes through the projection optical system 31 and is projected onto the wafer 51. The reticle 21 and the wafer 51 are arranged in an optically conjugate relationship.

  The projection optical system 31 can be a refractive optical system composed of a plurality of lens elements, a catadioptric optical system having a plurality of lens elements and at least one mirror element, or the like.

  A resist is applied to a wafer 51 as an object to be exposed (substrate) and is supported on a wafer stage 53 via a holding unit 52 such as a chuck.

  An immersion liquid is supplied from the immersion liquid supply apparatus 101 to the immersion area (area filled with the immersion liquid) between the final surface of the projection optical system 31 and the wafer 51, and the immersion liquid recovery apparatus 102 receives the immersion liquid. Collected. As the material of the immersion liquid, a substance that has good transmittance of exposure light, good matching with the resist process, and does not adhere dirt to the projection optical system 31 is selected. For example, there are water and organic liquid, which is selected according to the relationship between the wavelength of exposure light and the resist applied to the wafer 51.

  FIG. 2A shows a schematic sectional view around the immersion area. FIG. 2B shows a schematic view of the final lens 32 and the nozzle 41 of the projection optical system 31 viewed from the liquid immersion area side. The nozzle 41 has an annular shape so as to surround the projection optical system 31. The nozzle 41 is supported by a support member 42 separately from the projection optical system 31 and can be moved up and down by a drive mechanism. The immersion liquid supply port 111 of the nozzle 41 is arranged in an annular shape around the final lens 32 (projection optical system) and communicates with the immersion liquid supply apparatus 101. The immersion liquid supply port 112 of the nozzle 41 is arranged in an annular shape so as to surround the projection optical system 31 and communicates with the immersion liquid supply apparatus 101. Further, the immersion liquid recovery port 113 of the nozzle 41 is arranged in an annular shape around the final lens 32 (projection optical system) and communicates with the immersion liquid recovery apparatus 102. The immersion liquid recovery port 114 of the nozzle 41 is arranged in an annular shape on the upper surface side of the nozzle 41 and communicates with the immersion liquid recovery device 102. Therefore, the immersion liquid is supplied from the immersion liquid supply apparatus 101 to the immersion area between the final lens 32 of the projection optical system 31 and the wafer 51 via the immersion liquid supply ports 111 and 112, and the immersion liquid is supplied. The liquid is recovered by the immersion liquid recovery apparatus 103 via the liquid recovery ports 113 and 114.

  FIG. 3 schematically shows that the liquid level of the immersion liquid changes between the final lens 32 and the nozzle 41 when the wafer stage 53 moves. When the wafer stage 53 moves in the direction of the arrow 201 with acceleration, the liquid level between the final lens 32 and the nozzle 41 has a lower liquid level on the left side as indicated by the arrow 211, and the right side. The liquid level becomes higher as indicated by an arrow 212. In this way, the liquid level of the immersion liquid changes by driving the stage.

  FIG. 4 is a flowchart of the cleaning maintenance execution procedure. When cleaning the final lens 32 and the nozzle 41, the supply and recovery of the immersion liquid are stopped after the exposure is completed (Step A). Next, the wafer stage and the cleaning stage are moved (step B). FIG. 5 shows a schematic configuration of an exposure apparatus during cleaning maintenance. The arrows in FIG. 5 indicate the flow of electrical signals. The stage control unit 301 moves the wafer stage 51 that was below the final lens 32 of the projection optical system 31 to another place during exposure, and moves the cleaning stage 61 below the final lens 32 (step B).

  Thereafter, a cleaning liquid is supplied between the projection optical system 31 and the cleaning stage 61 (step C). As the cleaning liquid, for example, hydrogen water or ozone water can be considered. As shown in FIG. 5, the cleaning liquid supply device 103 communicates with at least one of the immersion liquid supply ports 111 and 112 and the immersion liquid recovery ports 113 and 114 of the nozzle 41 via the switching valve 121 at the time of cleaning. It is like that. Further, the switching valve 121 can be switched by the valve control unit 302. Therefore, at the time of cleaning, by switching the switching valve 121, the cleaning liquid is supplied from the cleaning liquid supply device 103 via the nozzle 41, and the cleaning liquid region 151 is formed on the cleaning stage 61 in contact with the final lens 32 and the nozzle 41. . FIG. 6 is a schematic cross-sectional view around the cleaning liquid region 151 in the cleaning in Step C. The cleaning liquid is supplied from at least one of the immersion liquid supply ports 111 and 112 and the immersion liquid recovery ports 113 and 114 of the nozzle 41 to form the cleaning liquid region 151. The cleaning liquid region 151 is formed so that a component that has been in contact with the immersion liquid at the time of exposure is in contact with the cleaning liquid. The cleaning stage 61 has a recovery port 62 and communicates with the liquid recovery apparatus 104 via a pipe. Therefore, the cleaning liquid in the cleaning liquid region 151 is recovered from the recovery port 62 to the liquid recovery apparatus 104.

  After executing Step C, the nozzle position is changed (Step D), and the rinsing liquid is supplied between the projection optical system 31 and the cleaning stage 61 (Step E). In this embodiment, the same type of liquid as the immersion liquid is used as the rinsing liquid, and the cleaning liquid is washed away with the immersion liquid. FIG. 7 is a schematic cross-sectional view of the periphery of the final lens 32 and the nozzle 41 in Step E after the nozzle position is changed. The nozzle 41 moves in the direction of the arrow 221 (direction approaching the cleaning stage 61) from the position at the time of cleaning in Step C by moving the nozzle supporting member 42 by the nozzle supporting member control unit 303. The rinsing liquid is supplied from at least one of the immersion liquid supply ports 111 and 112 and the immersion liquid recovery ports 113 and 114 of the nozzle 41, and the rinsing liquid region 152 is formed on the cleaning stage 61. By changing the height of the nozzle 41 from that at the time of cleaning (step C), the liquid level of the rinsing liquid is made higher than the liquid level of the cleaning liquid in step C. The dotted line in FIG. 7 represents the liquid level in Step C. As a result, the rinsing liquid comes into contact with all portions of the final lens 32 and the nozzle 41 that have been in contact with the cleaning liquid in Step C, and the cleaning liquid remaining on the member surface can be washed away with the rinsing liquid.

Although FIG. 7 illustrates the case where the liquid level rises by lowering the height of the nozzle 41, depending on the shape of the final lens 32 and the nozzle 41 and the distance between them, the height of the nozzle 41 is increased. The liquid level may rise. In this case, the height of the nozzle 41 at the time of rinsing is increased as compared with the time of cleaning. Further, the change of the nozzle position is not limited to the height direction, and may be changed in the horizontal direction.
For example, if the nozzle is configured so that the position of the liquid supply / recovery nozzle can be changed vertically and horizontally (height direction and horizontal direction), the liquid level at the time of rinsing becomes higher in a predetermined direction than at the time of cleaning. The nozzle may be moved.

  Further, the rinsing liquid supply flow rate supplied to the rinsing liquid region 152 is made larger than the cleaning liquid supply flow rate supplied to the cleaning liquid region 151 at the time of cleaning, so that the rinsing liquid region is higher than the liquid surface of the cleaning liquid region 151 at the time of cleaning. The liquid level of 152 may be increased. Further, the rinsing liquid recovery flow rate recovered from the rinsing liquid region 152 may be smaller than the cleaning liquid recovery flow rate recovered from the cleaning liquid region 151 in Step C. As described above, the rinse liquid supply flow rate and the rinse liquid recovery flow rate are changed from the cleaning liquid supply flow rate and the cleaning liquid recovery flow rate at the time of cleaning, thereby rinsing liquid region 152 at the time of rinsing rather than the liquid surface of the cleaning liquid region 151 at the time of cleaning. The liquid level may be increased.

  After rinsing in step E, the cleaning stage 61 is moved from below the final lens 32 to another location, and the wafer stage 51 is moved below the final lens 32 (step F). Thereafter, the immersion liquid is supplied from the immersion liquid supply apparatus 101 via the immersion liquid supply ports 111 and 112, so that an immersion area between the final lens 32 and the wafer 51 is formed (step G). After the exposure start conditions are satisfied, exposure is started (step H).

  As described above, in the exposure apparatus according to the first embodiment, in rinsing away the cleaning liquid using the rinsing liquid, the position of the nozzle member is changed between the time of cleaning and the time of rinsing, so The washing liquid can be washed away with the liquid level raised. Accordingly, the cleaning liquid can be prevented from remaining, and the constituent members of the exposure apparatus can be cleaned and exposure can be started without deteriorating the exposure performance of the exposure apparatus.

  Although cleaning and rinsing are performed on the cleaning stage 61, cleaning and rinsing may be performed on the wafer stage. For example, a cleaning substrate may be held by a wafer chuck, a cleaning liquid region may be formed on the cleaning substrate, and rinsing may be performed.

  The second embodiment is different from the cleaning maintenance execution procedure flowchart in the first embodiment shown in FIG. In the second embodiment, the height of the cleaning stage is changed between the cleaning (step C) and the rinsing (step E) (step D2).

  FIG. 8 shows an outline of the periphery of the final lens 32 and the nozzle 41 in Step E in which the cleaning liquid is washed away using the rinsing liquid. The rinsing liquid is supplied from at least one of the immersion liquid supply ports 111 and 112 and the immersion liquid recovery ports 113 and 114 of the nozzle 41, and the rinsing liquid region 152 comes into contact with the final lens 32 and the nozzle 41 on the cleaning stage 61. Formed. In step D2 before step E, the stage controller 301 moves the cleaning stage 61 in the direction of the arrow 231 from the position at the time of cleaning. The height of the cleaning stage 61 is made higher than that at the time of cleaning, and the distance between the cleaning stage 61 and the projection optical system 31 is narrowed, so that the liquid level in the rinsing liquid region 152 is higher than the liquid level in the cleaning liquid region 151 in Step C. To increase. The dotted line in FIG. 8 represents the liquid level in Step C. As a result, the rinsing liquid comes into contact with all portions of the final lens 32 and the nozzle 41 that have been in contact with the cleaning liquid in Step C, and the cleaning liquid remaining on the member surface can be washed away with the rinsing liquid. Further, the rinsing liquid supply flow rate and the recovery liquid amount are changed from the cleaning liquid supply flow rate and the recovery flow rate for the cleaning liquid region 151 in Step C, so that the rinsing liquid region 152 is higher than the liquid surface of the cleaning liquid region 151 in Step C. The effect of increasing the liquid level may be further enhanced. Further, the position of the nozzle may be changed as in the first embodiment.

  As described above, in the exposure apparatus according to the second embodiment, in rinsing away the cleaning liquid using the rinsing liquid, the distance between the cleaning stage 61 and the projection optical system 31 is rinsed to be smaller than the liquid level of the cleaning liquid at the time of cleaning. The washing liquid can be washed away with the liquid level raised. Accordingly, the cleaning liquid can be prevented from remaining, and the constituent members of the exposure apparatus can be cleaned and exposure can be started without deteriorating the exposure performance of the exposure apparatus.

  The third embodiment is different in step D from the above-described embodiment. In Example 3, the gas blowing pressure is changed between cleaning (step C) and rinsing (step E) (step D3).

  FIG. 9A shows a schematic cross-sectional view around the immersion area in the present embodiment. The immersion liquid is supplied to the immersion area between the final lens 32 of the projection optical system 31 and the wafer 51 via the immersion liquid supply ports 111 and 112, and is recovered from the immersion liquid recovery ports 113 and 114. The The difference from FIG. 2 described in the first embodiment is that gas is blown around the immersion liquid 100 in order to strengthen the liquid retention in the immersion area. In FIG. 9A, gas is supplied from the gas supply device 141 through the gas supply port 131 and is recovered by the gas recovery device 142 through the gas recovery port 132 under the control of the gas pressure control unit 304. is doing.

  FIG. 9B is a schematic cross-sectional view around the final lens 32 and the nozzle 41 in the cleaning in Step C. The cleaning liquid is supplied from at least one of the immersion liquid supply ports 111 and 112 and the immersion liquid recovery ports 113 and 114 of the nozzle 41 to form the cleaning liquid region 151. The cleaning liquid region 151 is formed so that peripheral members that have been in contact with the immersion liquid at the time of immersion exposure are in contact with the cleaning liquid. A gas is supplied from the gas supply port 131 around the cleaning liquid region 151. Accordingly, the cleaning liquid is recovered from the recovery port 62 of the cleaning stage 61 to the liquid recovery apparatus 104 without spreading outside the cleaning liquid region 151 on the cleaning stage 61.

  FIG. 9C shows an outline of the periphery of the final lens 32 and the nozzle 41 in the rinsing in the step E in which the rinsing liquid is used to wash away the cleaning liquid. The rinsing liquid is supplied from at least one of the immersion liquid supply ports 111 and 112 and the immersion liquid recovery ports 113 and 114 of the nozzle 41, and the rinsing liquid region 152 comes into contact with the final lens 32 and the nozzle 41 on the cleaning stage 61. Formed. In step D3 prior to step E, the pressure of the gas blown to the gas supply port 131 is made higher than that during cleaning by the gas pressure control unit 304, so that the rinsing liquid is higher than the liquid level in the cleaning liquid region 151 in step C. The liquid level in the region 152 is increased. As a result, the rinsing liquid comes into contact with all portions of the final lens 32 and the nozzle 41 that have been in contact with the cleaning liquid in Step C, and the cleaning liquid remaining on the member surface can be washed away with the rinsing liquid.

  Further, by changing the supply flow rate and the recovery flow rate of the rinsing liquid from the supply flow rate and the recovery flow rate of the cleaning liquid to the cleaning liquid region 151 in Step C, the rinsing liquid region 152 is larger than the liquid level of the cleaning liquid region 151 in Step C. The effect of increasing the liquid level may be further enhanced. Further, as in the first and second embodiments, the position of the nozzle may be changed, or the position of the stage may be changed.

  Although the description of the blowing of the gas to be blown around the immersion liquid has been made by blowing the gas from the nozzle 41 around the immersion liquid, the blowing of the gas may be performed from a member other than the nozzle. For example, the gas supply port 133 and the gas recovery port 134 are attached to the cleaning stage 61, and the gas spray pressure is set higher during the rinsing in Step D than in the cleaning in Step C. Also in this case, the effect of increasing the liquid level of the rinsing liquid region 152 than the liquid level of the cleaning liquid region 151 in Step C can be obtained.

  As described above, in this embodiment, when the cleaning liquid is washed away using the rinsing liquid, the pressure of the gas sprayed around the immersion liquid is set higher during the rinsing than in the cleaning, so that the level of the cleaning liquid during the cleaning is higher. The washing liquid can be washed away with the liquid level of the rinsing liquid raised. Accordingly, the cleaning liquid can be prevented from remaining, and the constituent members of the exposure apparatus can be cleaned and exposure can be started without deteriorating the exposure performance of the exposure apparatus.

  The fourth embodiment is different in step D from the previous embodiment. In the fourth embodiment, a liquid leakage preventing member is added or changed between cleaning (step C) and rinsing (step E) (step D4).

  FIG. 10 shows an outline of the periphery of the final lens 32 and the nozzle 41 in step E in which the cleaning liquid is washed away with the rinsing liquid in the fourth embodiment. The rinsing liquid is supplied from at least one of the immersion liquid supply ports 111 and 112 and the immersion liquid recovery ports 113 and 114 of the nozzle 41, and the rinsing liquid region 152 comes into contact with the final lens 32 and the nozzle 41 on the cleaning stage 61. Formed. In step D4, which is a stage prior to step E, the liquid leakage prevention member 66 is added to the cleaning stage 61 as compared to the cleaning step. The liquid leakage prevention member 66 is arranged in an annular shape, and the rinsing liquid in the rinsing liquid region 152 is less likely to leak to the periphery. Thereby, the liquid level of the rinse liquid area | region 152 can be made higher than the liquid level of the washing | cleaning liquid area | region 151 in step C, and the liquid leakage to the stage outer side can be prevented. The dotted line in FIG. 10 represents the liquid level height during cleaning. Therefore, the rinsing liquid comes into contact with all portions of the final lens 32 and the nozzle 41 that have been in contact with the cleaning liquid in Step C, and the cleaning liquid remaining on the member surface can be washed away with the rinsing liquid. The above description has been given by adding the liquid leakage prevention member 66 in step D4. The liquid leakage preventing member may be attached in the cleaning step C, and the position may be changed by changing the height in step D4 or moving it in the horizontal direction.

  Further, the supply flow rate and the recovery liquid amount of the rinse liquid are changed from the supply flow rate and the recovery flow rate of the cleaning liquid with respect to the cleaning liquid region 151 in Step C, so The effect of increasing the liquid level may be further enhanced.

  As described above, in this embodiment, in rinsing away the cleaning liquid using the rinsing liquid, a state in which the liquid level of the rinsing liquid is made higher than the liquid level of the cleaning liquid at the time of cleaning using a member that prevents liquid leakage of the rinsing liquid. The washing liquid can be washed away with. Accordingly, the cleaning liquid can be prevented from remaining, and the constituent members of the exposure apparatus can be cleaned and exposure can be started without deteriorating the exposure performance of the exposure apparatus.

  In the fifth embodiment, in step 3 in the cleaning maintenance execution procedure flowchart of FIG. 11, the nozzle position is changed, and cleaning is performed with the cleaning liquid level higher than the maximum liquid level of the immersion liquid during exposure. . In Steps 4 and 5, as in the examples described above and later, when the cleaning liquid is washed away using the rinsing liquid, the cleaning liquid is washed away in a state where the liquid level of the rinsing liquid is higher than the liquid level of the cleaning liquid at the time of cleaning.

  FIG. 12 shows an outline of the periphery of the cleaning liquid region 151 in the cleaning in Step 4. The cleaning liquid is supplied from at least one of the immersion liquid supply ports 111 and 112 and the immersion liquid recovery ports 113 and 114 of the nozzle 41 to form the cleaning liquid region 151. The cleaning liquid region 151 is formed so that the peripheral member that has been in contact with the immersion liquid at the time of exposure is in contact with the cleaning liquid. The cleaning stage 61 has a recovery port 62 and communicates with the liquid recovery apparatus 104 via a pipe. Therefore, the cleaning liquid in the cleaning liquid region 151 is recovered from the recovery port 62 to the liquid recovery apparatus 104. In step 3 before step 4, the nozzle 41 is moved in the direction of the arrow 221 (direction approaching the cleaning stage 61) from the position at the time of exposure. By changing the height of the nozzle 41 from that at the time of exposure, the liquid level of the cleaning liquid region 151 is made higher than the level of the immersion liquid region at the time of exposure. In addition, since the liquid level height changes by moving the stage during exposure, it is necessary to make it higher than the maximum liquid level height during exposure during cleaning. As a result, the cleaning liquid comes into contact with all parts of the final lens 32 and the nozzle 41 that have been in contact with the immersion liquid at the time of exposure, and the immersion liquid and dirt remaining on the surface of the member can be cleaned with the cleaning liquid.

  As a method for making the liquid level of the cleaning liquid region 151 higher than the liquid level of the immersion liquid region at the time of exposure, the position of the nozzle member was changed between the time of exposure and the time of cleaning. Other methods such as those described in the above examples of changing the height may be used.

  As described above, in the immersion exposure apparatus according to the fifth embodiment, cleaning can be performed in a state where the level of the cleaning liquid is higher than the level of the immersion liquid during exposure. As a result, the cleaning liquid can come into contact with the remaining immersion liquid and dirt above the nozzle 41, and cleaning without any remaining cleaning can be performed.

  In the above-described embodiment, rinsing is performed using the same liquid as the immersion liquid (Step E), and then the cleaning stage and the wafer stage are moved (Step F) to supply the immersion liquid (Step S). G). In this embodiment, the rinsing liquid is different from the immersion liquid.

  If the rinsing liquid is a different type of liquid from the immersion liquid, and the rinsing liquid remains in the apparatus, the rinsing liquid needs to be washed away with the immersion liquid if it adversely affects the apparatus. The step of rinsing the rinsing liquid with the immersion liquid (step E ′) is performed during step G after step E shown in FIG.

  In step E ′ in which the rinsing liquid is washed away with the immersion liquid, the liquid level of the immersion liquid is made higher than the liquid level of the rinsing liquid in step E to wash away the rinsing liquid. This prevents the rinse liquid from remaining and adversely affecting the apparatus. As a method for increasing the liquid level, the method performed in the above-described embodiment can be employed.

  In this embodiment, the rinsing liquid uses a different type of liquid from the immersion liquid, and after rinsing the cleaning liquid with the rinsing liquid, the immersion liquid is used rather than the liquid level of the rinsing liquid when rinsing with the immersion liquid. Rinse the rinse with the liquid level raised. Accordingly, it is possible to prevent the rinsing liquid from remaining, and it is possible to start exposure by cleaning the constituent members of the exposure apparatus without deteriorating the exposure performance of the exposure apparatus.

  In this embodiment, step D shown in FIG. 4 is not performed. FIG. 13A shows an outline of the periphery of the cleaning liquid region 151 in the cleaning in Step C. A cleaning liquid is supplied from the immersion liquid supply port 112 to form a cleaning liquid region 151. FIG. 13B schematically shows the vicinity of the rinsing liquid region 152 in the rinsing in Step E. The rinsing liquid is supplied from the immersion liquid recovery port 114 at a position higher than the immersion liquid supply port 112 that has supplied the cleaning liquid in step C, and the cleaning liquid is washed away. By supplying the rinse liquid from a place higher than the supply of the cleaning liquid, the cleaning liquid remaining on the surface of the member by the cleaning in Step C can be washed away by the rinse liquid. The cleaning liquid recovery port 62 may be located at a position lower than the rinse liquid supply port. Thereby, it is possible to prevent the cleaning liquid from remaining, and it is possible to start exposure by cleaning the constituent members of the exposure apparatus without deteriorating the exposure performance of the exposure apparatus.

  The rinsing liquid may be supplied from the immersion liquid recovery port 114 at the same time as the cleaning liquid is supplied from the immersion liquid supply port 112. In this case, by supplying the rinsing liquid from the immersion liquid recovery port 114 positioned higher than the immersion liquid supply port 112, the liquid level of the rinsing liquid becomes higher than the liquid level of the cleaning liquid, and the cleaning liquid Since it is washed away from above by the rinse liquid, it does not remain.

  In the eighth embodiment, the supply port 115 dedicated to the rinsing liquid is provided at a position higher than the cleaning liquid supply port. FIG. 14 schematically shows the periphery of the final lens 32 and the nozzle 41 in the exposure apparatus of the present embodiment. The rinsing liquid supply port 115 is positioned higher than the immersion liquid supply ports 111 and 112 for supplying the cleaning liquid and the immersion liquid recovery ports 113 and 114. The cleaning maintenance execution procedure is the same as that of the seventh embodiment. In the cleaning in Step C, the cleaning liquid is supplied from at least one of the immersion liquid supply ports 111 and 112 and the immersion liquid recovery ports 113 and 114 of the nozzle 41 to form the cleaning liquid region 151. The cleaning liquid region 151 is formed so that peripheral members that have been in contact with the immersion liquid at the time of immersion exposure are in contact with the cleaning liquid. In the rinsing in Step E, the rinsing liquid is supplied from the rinsing supply port 115 at a position higher than the cleaning supply, so that the cleaning liquid remaining on the member surface in the cleaning in Step C can be washed away by the rinsing liquid. Thereby, it is possible to prevent the cleaning liquid from remaining, and it is possible to perform cleaning that does not adversely affect the apparatus.

  Also in this embodiment, the cleaning liquid supply and the rinsing liquid supply may be performed simultaneously.

  The preferred embodiments of the present invention have been described above, but the present invention is not limited to these embodiments, and various modifications and changes can be made within the scope of the gist. For example, as a method for increasing the liquid level, the methods described in the above embodiments may be appropriately combined.

  Next, a method for manufacturing a device (semiconductor IC element, liquid crystal display element, etc.) using the above-described exposure apparatus will be described. The device uses the above-described exposure apparatus to expose a substrate (wafer, glass substrate, etc.) coated with a photosensitive agent, to develop the substrate (photosensitive agent), and other well-known steps. It is manufactured by going through. Other known processes include etching, resist stripping, dicing, bonding, packaging, and the like. According to this device manufacturing method, it is possible to manufacture a higher quality device than before.

31 Projection Optical System 41 Nozzle 51 Wafer 61 Cleaning Stage 66 Liquid Leakage Prevention Member

Claims (10)

In an exposure apparatus that exposes a substrate through an immersion liquid, a cleaning method for cleaning a constituent member that constitutes the exposure apparatus and contacts the immersion liquid,
A cleaning step of cleaning the component using a cleaning liquid;
And a rinsing step of rinsing the cleaning liquid in a state where the liquid level of the rinsing liquid is higher than the liquid level of the cleaning liquid at the time of the cleaning step.   By changing the position of the nozzle member having the supply port and the recovery port for the immersion liquid between the cleaning step and the rinsing step, the liquid level of the cleaning liquid at the time of the rinsing step is higher than that at the time of the cleaning step. The cleaning method according to claim 1, wherein a liquid level of the rinse liquid is increased.   The position of the cleaning stage for cleaning the components by holding the cleaning liquid from below is made higher at the time of the rinsing step than at the time of the cleaning step, so that the level of the cleaning liquid at the time of the cleaning step is higher than that at the time of the cleaning step. The cleaning method according to claim 1, wherein a level of the rinse liquid during the rinsing step is increased.   The liquid of the rinsing liquid at the time of the rinsing step is higher than the liquid level of the cleaning liquid at the time of the rinsing step by increasing the spraying pressure of the gas sprayed around the immersion liquid at the time of the rinsing step than at the time of the cleaning step. 4. The cleaning method according to claim 1, wherein the surface is raised.   Using the member for preventing leakage of at least one of the cleaning liquid and the rinsing liquid provided in a cleaning stage for holding the cleaning liquid from below and cleaning the component member, the cleaning liquid at the time of the cleaning step The cleaning method according to any one of claims 1 to 4, wherein a liquid level of the rinse liquid at the time of the rinsing step is made higher than a liquid level of the liquid.   6. The cleaning step according to claim 1, wherein the cleaning step is performed in a state where the level of the cleaning liquid at the time of the cleaning step is higher than the level of the immersion liquid at the time of exposing the substrate. The cleaning method according to claim 1.   The rinse liquid is a different type of liquid from the immersion liquid, and after washing the cleaning liquid, the immersion liquid is used to remove the immersion liquid from the surface of the rinse liquid during the rinsing step. The cleaning method according to claim 1, further comprising a step of rinsing the rinse liquid in a state where the liquid level is raised. In an exposure apparatus that exposes a substrate through an immersion liquid,
Components constituting the exposure apparatus and in contact with the immersion liquid;
A control unit that controls cleaning of the constituent members;
The control unit controls the cleaning liquid to be higher than the cleaning liquid level when the member is cleaned with the cleaning liquid and the cleaning liquid is rinsed off with the rinsing liquid. A featured exposure apparatus. In an exposure apparatus that exposes a substrate through an immersion liquid,
A supply port for supplying a cleaning liquid for cleaning the constituent members that constitute the exposure apparatus and come into contact with the immersion liquid;
A recovery port for recovering the cleaning liquid;
A rinsing liquid supply port for washing away the cleaning liquid;
An exposure apparatus, wherein the rinse liquid supply port is located higher than the cleaning liquid supply port and the recovery port.   10. A device manufacturing method comprising: exposing a substrate with a circuit pattern using the exposure apparatus according to claim 8; and developing the exposed substrate.

Images