JP2012079565A - Led lighting device - Google Patents

Led lighting device Download PDF

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JP2012079565A
JP2012079565A JP2010224461A JP2010224461A JP2012079565A JP 2012079565 A JP2012079565 A JP 2012079565A JP 2010224461 A JP2010224461 A JP 2010224461A JP 2010224461 A JP2010224461 A JP 2010224461A JP 2012079565 A JP2012079565 A JP 2012079565A
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base
support
light source
led light
led
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Hiroki Yokoyama
浩樹 横山
Morihisa Yoshino
森久 吉野
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Stanley Electric Co Ltd
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Stanley Electric Co Ltd
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02BCLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B20/00Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
    • Y02B20/72Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps in street lighting

Abstract

PROBLEM TO BE SOLVED: To provide an LED lighting device capable of improving heat radiation by raising thermal conductivity and thermal diffusion.SOLUTION: In the LED lighting device 1, an LED light source case 3 for supporting an LED light source 2 is mounted on a device base 6 via a support tool 4; and the LED light source 2, the LED light source case 3 and the support tool 4, together with the device base 6, are covered with a device cover 7. A support tool base 5 is arranged between the support tool 4 and the device base 6, the support tool 4 is fixed to the surface of the support tool base 5 in a surface contact state, and the device base 6 is fixed to the rear surface of the support tool base 5 in a surface contact state.

Description

本発明は、LED(発光ダイオード)を光源として使用するLED照明装置に関するものである。   The present invention relates to an LED lighting device that uses an LED (light emitting diode) as a light source.

LEDは高輝度で省電力、高寿命等の特長を有することから、近年、街路灯、道路灯等の他、一般照明用としてもLEDを光源とするLED照明装置が使用されるようになってきつつある(例えば、特許文献1参照)。   Since LEDs have features such as high brightness, power saving, and long service life, in recent years, LED lighting devices using LEDs as light sources have been used for general lighting as well as street lights and road lights. (See, for example, Patent Document 1).

ここで、従来のLED照明装置の一例を図7の側断面図に示すが、図示のLED照明装置101は、器具ベース106上に立設された口金ソケット112にLED光源102がその口金110をねじ込むことによって装着されており、LED光源102は球殻状の透明な器具カバー107によって覆われている。   Here, an example of a conventional LED lighting device is shown in a side cross-sectional view of FIG. 7. In the illustrated LED lighting device 101, the LED light source 102 places the base 110 on the base socket 112 erected on the instrument base 106. The LED light source 102 is covered with a transparent device cover 107 having a spherical shell shape.

上記LED光源102は、器具カバー107内に光源であるLED109が実装されたLED基板108とこれを支持するLED光源筐体103が収容されており、LED光源筐体103には複数の放熱フィン103aが設けられている。   The LED light source 102 includes an LED cover 108 on which an LED 109 as a light source is mounted in an instrument cover 107, and an LED light source housing 103 that supports the LED substrate 108. The LED light source housing 103 includes a plurality of radiating fins 103a. Is provided.

斯かるLED照明装置101においては、LED109の発光によって発生する熱は、図7に矢印にてその伝達経路を示すように、LED109からLED光源筐体103の放熱フィン103aへと熱伝導によって伝わり、放熱フィン103aから自然対流と輻射によって器具カバー107内の内部空気へと伝わる。そして、器具カバー107内の内部空気へと伝わった熱は、器具カバー107を介して自然対流と輻射によって器具カバー107外の外部空気へと伝わる。   In such an LED lighting device 101, the heat generated by the light emission of the LED 109 is transferred by heat conduction from the LED 109 to the heat radiation fin 103a of the LED light source housing 103, as indicated by the arrow in FIG. The heat radiating fin 103a is transmitted to the internal air in the instrument cover 107 by natural convection and radiation. The heat transmitted to the internal air in the instrument cover 107 is transmitted to the external air outside the instrument cover 107 by natural convection and radiation through the instrument cover 107.

ところが、上記のような経路を経て熱が伝達されるLED照明装置101においては、放熱フィン103aから密閉された内部空気に放熱がなされるために放熱効率が著しく悪く、LED109の冷却が十分行われないために該LED109の寿命や劣化を早めるという問題があった。   However, in the LED lighting device 101 in which heat is transmitted through the above-described path, the heat dissipation efficiency is remarkably deteriorated because the heat is dissipated from the radiating fins 103a to the sealed internal air, and the LED 109 is sufficiently cooled. Therefore, there is a problem that the life and deterioration of the LED 109 are accelerated.

又、図7に示すLED照明装置101は、LED光源筐体103に大型の放熱フィン103aが設けられているために重くて大きなものとなっていた。このため、LED照明装置101を下向きに取り付けて使用する場合、振動等によってLED光源102の口金110と口金ソケット112間に緩みが発生し、電気的な接触不良が発生して照明が不灯になったり、最悪の場合にはLED光源102が外れて落下してしまうという問題もあった。   Further, the LED illumination device 101 shown in FIG. 7 is heavy and large because the LED light source housing 103 is provided with the large heat radiation fins 103a. For this reason, when the LED lighting device 101 is used with the LED lighting device 101 facing downward, loosening occurs between the base 110 and the base socket 112 of the LED light source 102 due to vibration or the like, resulting in poor electrical contact, and the lighting is turned off. In the worst case, the LED light source 102 may come off and fall.

そこで、図8に示すようなLED照明装置201が提案されている。   Therefore, an LED lighting device 201 as shown in FIG. 8 has been proposed.

即ち、図8は従来のLED照明装置201の側断面図であり、図示のLED照明装置201は、LED光源202を支持するLED光源筐体203を放熱向上部品である支持具204を介して器具ベース206に取り付けるとともに、LED光源202とLED光源筐体203及び支持具204を器具ベース206と共に球殻状の透明な器具カバー207によって覆って構成されている。ここで、LED光源筐体203と支持具204及び器具ベース206は、アルミニウム等の熱伝導性の高い材料で構成されている。   That is, FIG. 8 is a side sectional view of a conventional LED lighting device 201. The illustrated LED lighting device 201 includes an LED light source housing 203 that supports the LED light source 202 via a support 204 that is a heat radiation improving component. In addition to being attached to the base 206, the LED light source 202, the LED light source casing 203, and the support 204 are covered with a spherical shell-shaped transparent instrument cover 207 together with the instrument base 206. Here, the LED light source casing 203, the support 204, and the instrument base 206 are made of a material having high thermal conductivity such as aluminum.

斯かるLED照明装置201においては、LED光源202が発生する熱は、図8に矢印にてその伝達経路を示すように、LED光源202からLED光源筐体203と支持具204を経て器具ベース206へと熱伝導によって伝わり、器具ベース206の外表面から自然対流と輻射によって外部空気へと伝達される。このような熱伝達経路には熱伝達率の低い内部空気への放熱が含まれないため、図7に示したLED照明装置101よりも高い放熱効果が得られる。   In such an LED lighting device 201, the heat generated by the LED light source 202 is transmitted from the LED light source 202 through the LED light source casing 203 and the support 204, as indicated by an arrow in FIG. To the outside air by natural convection and radiation from the outer surface of the instrument base 206. Since such a heat transfer path does not include heat dissipation to the internal air having a low heat transfer coefficient, a higher heat dissipation effect than that of the LED lighting device 101 shown in FIG. 7 can be obtained.

特開2006−156187号公報JP 2006-156187 A

ところで、図8に示したLED照明装置201は、LED光源202において発生する熱は、LED光源202→LED光源筐体203→支持具204→器具ベース206→外部空気という放熱経路を経て伝達されるが、この放熱経路においては熱は熱伝導ロス無く伝わらなければならない。   By the way, in the LED lighting device 201 shown in FIG. 8, the heat generated in the LED light source 202 is transmitted through a heat radiation path of the LED light source 202 → the LED light source housing 203 → the support 204 → the instrument base 206 → external air. However, in this heat radiation path, heat must be transmitted without heat conduction loss.

ところが、実際の製品では器具ベース206として既存品を利用しているため、この器具ベース206の支持具204を取り付ける面は複雑な形状を有しており、支持具204を器具ベース206に取り付けた状態では両者の接触面積(伝熱面積)が小さくなる。このため、支持具204から器具ベース206への熱伝導が効率良くなされず、又、熱流量が接触点に集中するとともに、器具ベース206の厚さが数mm程度と薄いため、接触点からの熱の拡散が不十分となり、器具ベース206から外部空気への放熱に際して放熱有効面積が小さくなって放熱効率が悪化してしまうという問題がある。   However, since an actual product uses an existing product as the instrument base 206, the surface to which the support 204 of the instrument base 206 is attached has a complicated shape, and the support 204 is attached to the instrument base 206. In the state, the contact area (heat transfer area) between the two becomes small. For this reason, the heat transfer from the support 204 to the instrument base 206 is not efficiently performed, and the heat flow is concentrated at the contact point, and the thickness of the instrument base 206 is as thin as several millimeters. There is a problem that heat diffusion becomes insufficient, and the heat radiation effective area is reduced when heat is radiated from the instrument base 206 to the outside air, and the heat radiation efficiency is deteriorated.

本発明は上記問題に鑑みてなされたものであり、その目的とする処は、熱伝導性と熱拡散性を高めて放熱性の向上を図ることができるLED照明装置を提供することにある。   This invention is made | formed in view of the said problem, The process made into the objective is providing the LED illuminating device which can aim at the improvement of heat dissipation by improving thermal conductivity and thermal diffusivity.

上記目的を達成するため、請求項1記載の発明は、LED光源を支持するLED光源筐体を支持具を介して器具ベースに取り付けるとともに、前記LED光源と前記LED光源筐体及び前記支持具を前記器具ベースと共に器具カバーによって覆って構成されるLED照明装置において、前記支持具と前記器具ベースの間に支持具ベースを介装し、該支持具ベースの表面に前記支持具を面接触させて固定し、同支持具ベースの裏面に前記器具ベースを面接触させて固定したことを特徴とする。   In order to achieve the above object, the invention according to claim 1 is characterized in that an LED light source casing that supports an LED light source is attached to an instrument base through a support, and the LED light source, the LED light source casing, and the support are mounted. In the LED lighting apparatus configured to be covered with an instrument cover together with the instrument base, a support base is interposed between the support and the instrument base, and the support is in surface contact with the surface of the support base. The instrument base is fixed in contact with the back surface of the support base.

請求項2記載の発明は、請求項1記載の発明において、前記支持具と前記器具ベース及び前記支持具ベースを熱伝導性の高い材料で構成したことを特徴とする。   The invention according to claim 2 is characterized in that, in the invention according to claim 1, the support, the instrument base, and the support base are made of a material having high thermal conductivity.

請求項3記載の発明は、請求項1又は2記載の発明において、前記支持具ベースの裏面に複数の放熱フィンを形成したことを特徴とする。   According to a third aspect of the present invention, in the first or second aspect of the present invention, a plurality of heat radiation fins are formed on the back surface of the support base.

請求項4記載の発明は、請求項1〜3の何れかに記載の発明において、前記支持具と前記支持具ベースを前記器具ベースにネジ固定したことを特徴とする。   According to a fourth aspect of the present invention, in the invention according to any one of the first to third aspects, the support and the support base are screwed to the instrument base.

請求項5記載の発明は、請求項1〜3の何れかに記載の発明において、前記支持具と前記支持具ベースとを一体に構成したことを特徴とする。   The invention according to claim 5 is the invention according to any one of claims 1 to 3, wherein the support and the support base are configured integrally.

請求項1記載の発明によれば、支持具と器具ベースの間に支持具ベースを介装し、該支持具ベースと支持具及び器具ベースを面接触させて固定したため、支持具ベースと支持具及び器具ベースとの接触面積(伝熱面積)が大きくなり、LED光源からの熱は支持具から支持具ベースを経て器具ベースへと効率良く伝導及び拡散し、最終的に器具ベースの外表面から自然対流と輻射によって外部空気へと伝わる。このため、熱伝導性と熱拡散性が高められて放熱性の向上が図られ、LED光源の温度上昇が抑えられる。   According to the first aspect of the present invention, the support tool base is interposed between the support tool and the instrument base, and the support tool base, the support tool, and the tool base are fixed in surface contact. In addition, the contact area (heat transfer area) with the tool base is increased, and heat from the LED light source is efficiently conducted and diffused from the support tool to the tool base through the support tool base, and finally from the outer surface of the tool base. It is transmitted to the outside air by natural convection and radiation. For this reason, thermal conductivity and thermal diffusivity are improved, heat dissipation is improved, and temperature rise of the LED light source is suppressed.

請求項2記載の発明によれば、支持具と器具ベース及び支持具ベースを熱伝導性の高い材料で構成したため、LED光源からの熱が支持具と支持具ベースを経て器具ベースへと効率良く伝導し、最終的に器具ベースの外表面から外部空気に自然対流と輻射によって伝わるため、当該LED照明装置の放熱性が一層効果的に高められてLED光源が効率良く冷却される。   According to the invention described in claim 2, since the support tool, the instrument base, and the support tool base are made of a material having high thermal conductivity, heat from the LED light source efficiently passes through the support tool and the support tool base to the instrument base. Conducted and finally transmitted from the outer surface of the instrument base to the external air by natural convection and radiation, so that the heat dissipation of the LED lighting device is further effectively improved and the LED light source is efficiently cooled.

請求項3記載の発明によれば、支持具ベースの裏面に複数の放熱フィンを形成したため、放熱フィンから内部空気への放熱によってLED光源の冷却が促進されるともに、放熱フィンが器具ベースに面接触することによって伝熱面積が拡大されるため、当該LED照明装置の熱伝導性と拡散性が更に高められて放熱性の更なる向上が図られる。   According to the invention described in claim 3, since the plurality of radiating fins are formed on the back surface of the support base, cooling of the LED light source is promoted by radiating heat from the radiating fins to the internal air, and the radiating fins face the fixture base. Since the heat transfer area is expanded by the contact, the thermal conductivity and diffusibility of the LED lighting device are further enhanced, and the heat dissipation is further improved.

請求項4記載の発明によれば、支持具と支持具ベースを器具ベースにネジ固定したため、これらの固定が振動等によって緩むことがなく、支持具に取り付けられたLED光源筐体及びこれに支持されたLED光源が外れて落下するという不具合の発生が防がれる。   According to the fourth aspect of the present invention, since the support and the support base are screw-fixed to the instrument base, the fixing is not loosened by vibration or the like, and the LED light source housing attached to the support and the support Occurrence of the problem that the LED light source is removed and dropped is prevented.

請求項5記載の発明によれば、支持具と支持具ベースとを一体化したため、支持具と支持具ベース間の接触熱抵抗が無くなり、熱伝導性が更に高められる。   According to the fifth aspect of the present invention, since the support tool and the support tool base are integrated, the contact thermal resistance between the support tool and the support tool base is eliminated, and the thermal conductivity is further improved.

本発明の実施の形態1に係るLED照明装置の側断面図である。It is a sectional side view of the LED lighting apparatus which concerns on Embodiment 1 of this invention. 本発明の実施の形態1に係るLED照明装置要部の分解斜視図である。It is a disassembled perspective view of the LED illuminating device principal part which concerns on Embodiment 1 of this invention. 本発明の実施の形態1に係るLED照明装置要部の分解斜視図である。It is a disassembled perspective view of the LED illuminating device principal part which concerns on Embodiment 1 of this invention. (a),(b)は本発明の実施の形態1に係るLED照明装置の支持具ベースの支持具と器具ベースへの接触部を示す斜視図である。(A), (b) is a perspective view which shows the contact part to the support tool of the support tool base of the LED illuminating device which concerns on Embodiment 1 of this invention, and an instrument base. 本発明の実施の形態1に係るLED照明装置の支持具ベースの斜視図である。It is a perspective view of the support base of the LED lighting apparatus which concerns on Embodiment 1 of this invention. 本発明の実施の形態2に係るLED照明装置の側断面図である。It is a sectional side view of the LED lighting apparatus which concerns on Embodiment 2 of this invention. 従来のLED照明装置の側断面図である。It is side sectional drawing of the conventional LED lighting apparatus. 従来のLED照明装置の側断面図である。It is side sectional drawing of the conventional LED lighting apparatus.

以下に本発明の実施の形態を添付図面に基づいて説明する。   Embodiments of the present invention will be described below with reference to the accompanying drawings.

<実施の形態1>
図1は本発明の実施の形態1に係るLED照明装置の側断面図、図2及び図3は同LED照明装置要部の分解斜視図、図4(a),(b)は同LED照明装置の支持具ベースの支持具と器具ベースへの接触部を示す斜視図である。
<Embodiment 1>
1 is a side sectional view of an LED lighting apparatus according to Embodiment 1 of the present invention, FIGS. 2 and 3 are exploded perspective views of the main part of the LED lighting apparatus, and FIGS. 4A and 4B are LED lightings. It is a perspective view which shows the support part of the support tool base of an apparatus, and the contact part to an instrument base.

本実施の形態に係るLED照明装置1は、LED光源2を支持するLED光源筐体3を放熱向上部品である支持具4及び支持具ベース5を介して器具ベース6に取り付けるとともに、LED光源2、LED光源筐体3、支持具4及び支持具ベース5を器具ベース6と共に球殻状の透明な器具カバー7によって覆って構成されている。   The LED lighting device 1 according to the present embodiment attaches the LED light source housing 3 that supports the LED light source 2 to the fixture base 6 via the support tool 4 and the support tool base 5 that are heat dissipation improving components, and the LED light source 2. The LED light source housing 3, the support 4, and the support base 5 are covered with a spherical shell-like transparent instrument cover 7 together with the instrument base 6.

上記LED光源2は、図2及び図3に示すように、LED光源筐体3に設けられた四角柱状の支持部3Aの四面に取り付けられた計4枚のLED基板8のそれぞれに複数(図示例では12個)のLED9を実装することによって構成されている。そして、LED光源筐体3の下面中央部には給電用の口金10が取り付けられている。尚、LED光源筐体3は、アルミニウム等の熱伝導性の高い材料で構成されている。   As shown in FIGS. 2 and 3, a plurality of LED light sources 2 are provided on each of four LED substrates 8 attached to the four surfaces of a quadrangular columnar support 3A provided in the LED light source housing 3 (see FIG. 2). It is configured by mounting 12 LEDs 9 in the illustrated example. A power supply base 10 is attached to the center of the lower surface of the LED light source housing 3. The LED light source housing 3 is made of a material having high thermal conductivity such as aluminum.

前記支持具4は、アルミニウム等の熱伝導性の高い金属によって下方に向かって拡径するテーパ筒状に成形されており、その下端周縁に形成されたフランジ4Aには4つの円孔11が同一円周上に等角度ピッチ(90°ピッチ)で形成されている。   The support 4 is formed in a tapered cylindrical shape whose diameter is expanded downward by a metal having high thermal conductivity such as aluminum, and the four circular holes 11 are the same in the flange 4A formed at the peripheral edge of the lower end. It is formed on the circumference at an equiangular pitch (90 ° pitch).

ところで、本実施の形態では、前記器具ベース6としては既存のもの(本発明に係るLED照明装置1のために特別設計された専用品ではないもの)が利用され、これは熱伝導性の高いアルミダイキャスト等によって略丸皿状に一体成形されており、その下面中央からは円筒状の通線用ボス6Aが垂直下方に向かって一体に突設されている。   By the way, in this embodiment, as the appliance base 6, an existing one (not a special product specially designed for the LED lighting device 1 according to the present invention) is used, which has a high thermal conductivity. It is integrally formed in a substantially circular dish shape by aluminum die casting or the like, and a cylindrical passage boss 6A is integrally projected downward from the center of the lower surface.

又、器具ベース6の上面中央には、口金ソケット12が門型の支持ステー13によって取り付けられており、器具ベース6の上面の外周4箇所には平坦な取付座6aが等角度ピッチ(90°ピッチ)で形成されており、各取付座6aにはネジ孔14がそれぞれ形成されている。更に、器具ベース6の上面の前記取付座6aが設けられた箇所の内径側部分には計4つの取付座6bがそれぞれ一体に形成されており、各取付座6bの平坦な取付面の中央にはネジ孔15がそれぞれ形成されている。   In addition, a base socket 12 is attached to the center of the upper surface of the instrument base 6 by a gate-shaped support stay 13, and flat mounting seats 6 a are arranged at equiangular pitches (90 °) at four locations on the outer periphery of the upper surface of the instrument base 6. The screw holes 14 are respectively formed in the mounting seats 6a. Further, a total of four mounting seats 6b are integrally formed on the inner diameter side portion of the upper surface of the instrument base 6 where the mounting seat 6a is provided, and are formed at the center of the flat mounting surface of each mounting seat 6b. Screw holes 15 are respectively formed.

前記支持具ベース5は、熱伝導性の高いアルミダイキャスト等によって略円環状に成形されており、その外周の4箇所には器具ベース6に形成された前記取付座6bが嵌合するための切欠き5aが形成されている。又、支持具ベース5の中央に形成された円孔5bの内周部の相対向する2箇所には凹状の取付座5cが形成されており、各取付座5cには円孔16がそれぞれ形成されている。   The support base 5 is formed in a substantially annular shape by an aluminum die cast or the like having a high thermal conductivity, and the mounting seat 6b formed on the instrument base 6 is fitted into four places on the outer periphery thereof. A notch 5a is formed. In addition, concave mounting seats 5c are formed at two opposing positions on the inner periphery of the circular hole 5b formed in the center of the support base 5, and circular holes 16 are formed in each mounting seat 5c. Has been.

更に、支持具ベース5の外周部の同一円周上には計8つの円孔17が等角度ピッチ(45°ピッチ)で形成されており、図3に示すように、該支持具ベース5の下面(裏面)には複数(図示例では12)の三角リブ状の放熱フィン18が放射状に一体に形成されている。   Further, a total of eight circular holes 17 are formed at an equiangular pitch (45 ° pitch) on the same circumference of the outer peripheral portion of the support base 5, and as shown in FIG. A plurality (12 in the illustrated example) of triangular rib-shaped heat radiation fins 18 are radially and integrally formed on the lower surface (back surface).

而して、本実施の形態に係るLED照明装置1の組み立てに際しては、支持具ベース5が器具ベース6上に載置され、その外周に形成された4つの切欠き5aが器具ベース6に形成された4つの取付座6bに嵌め込まれて該支持具ベース5の位置決めがなされる。このように支持具ベース5が器具ベース6上に載置されて位置決めされると、該支持具ベース5に形成された円孔17と取付座5cに形成された円孔16が器具ベース6の取付座6a,6bに形成されたネジ孔14,15にそれぞれ合致する。又、このとき、支持具ベース5の下面(裏面)外周の図4(b)において斜線を付したリング状部分と複数の放熱フィン18の各下面(図4(b)において斜線を付した面)及び2つの取付座5cの下面((図4(b)において斜線を付した面)は器具ベース6の上面に面接触する。そして、支持具ベース5に形成された2つの取付座5cに形成された円孔16に上方から挿通する不図示のネジを器具ベース6の取付座6bに形成されたネジ孔15にねじ込むことによって支持具ベース5が器具ベース6に固定される。   Thus, when the LED lighting device 1 according to the present embodiment is assembled, the support base 5 is placed on the instrument base 6, and four notches 5 a formed on the outer periphery thereof are formed in the instrument base 6. The support base 5 is positioned by being fitted into the four mounting seats 6b. When the support base 5 is thus placed and positioned on the instrument base 6, the circular hole 17 formed in the support base 5 and the circular hole 16 formed in the mounting seat 5 c are formed on the instrument base 6. The screw holes 14 and 15 formed in the mounting seats 6a and 6b respectively match. Further, at this time, the ring-shaped portion hatched in FIG. 4B on the outer periphery of the lower surface (back surface) of the support base 5 and the lower surfaces of the plurality of radiating fins 18 (surfaces hatched in FIG. 4B). ) And the lower surfaces of the two mounting seats 5c (the surfaces hatched in FIG. 4B) are in surface contact with the upper surface of the instrument base 6. The two mounting seats 5c formed on the support base 5 The support base 5 is fixed to the instrument base 6 by screwing a screw (not shown) inserted through the formed circular hole 16 from above into a screw hole 15 formed in the mounting seat 6 b of the instrument base 6.

上記状態から支持具4を支持具ベース5と器具ベース6の上に被せ、その下端周縁のフランジ4Aに形成された4つの円孔11を支持具ベース5に形成された円孔17と器具ベース6の取付座6aに形成されたネジ孔14に合わせ、円孔11,17に上方から挿通する不図示のネジを器具ベース6の4つの取付座6aにそれぞれ形成されたネジ孔14にねじ込むことによって支持具4が器具ベース6に固定される。このとき、支持具ベース5の上面(表面)の外周の図4(a)において斜線を付したリング状部分が支持具4のフランジ4Aの下面に面接触する。   From the above state, the support 4 is put on the support base 5 and the instrument base 6, and the four circular holes 11 formed in the flange 4 </ b> A at the peripheral edge of the lower end thereof are formed with the circular holes 17 formed in the support base 5 and the instrument base. In accordance with the screw holes 14 formed in the six mounting seats 6a, screws (not shown) inserted through the circular holes 11 and 17 from above are screwed into the screw holes 14 formed in the four mounting seats 6a of the instrument base 6, respectively. Thus, the support 4 is fixed to the instrument base 6. At this time, the ring-shaped portion indicated by hatching in FIG. 4A on the outer periphery of the upper surface (front surface) of the support tool base 5 comes into surface contact with the lower surface of the flange 4 </ b> A of the support tool 4.

以上のようにして支持具ベース5と支持具4が器具ベース6にネジ固定によって取り付けられると、LED光源2を支持するLED光源筐体3を支持具4の内部に上方から差し込み、その下端に設けられた口金10を器具ベース6上に支持された口金ソケット12にねじ込むことによってLED光源筐体3がLED光源2と共に器具ベース6に取り付けられる。そして、最後にLED光源2を支持したLED光源筐体3と支持具4及び支持具ベース5を器具ベース6と共に器具カバー7によって覆うことによってLED照明装置1が組み付けられる。   When the support tool base 5 and the support tool 4 are attached to the tool base 6 with screws as described above, the LED light source housing 3 that supports the LED light source 2 is inserted into the support tool 4 from above, and at the lower end thereof. The LED light source housing 3 is attached to the device base 6 together with the LED light source 2 by screwing the provided base 10 into a base socket 12 supported on the device base 6. Finally, the LED lighting device 1 is assembled by covering the LED light source housing 3 supporting the LED light source 2, the support 4, and the support base 5 together with the instrument base 6 with the instrument cover 7.

而して、本実施の形態に係るLED照明装置1において、不図示の商用電源からLED光源2の各LED9に電流が供給されると、各LED9が起動されて発光し、その光は透明な器具カバー7を透過して周囲に向けて出射する。このとき、各LED9の発光によってLED光源2は発熱するが、その熱は、図1に矢印にて示すように、LED光源筐体3から支持具4と支持具ベース5を経て器具ベース6へと伝導し、器具ベース6の外表面から自然対流と輻射によって外部空気へと伝達される。   Thus, in the LED lighting device 1 according to the present embodiment, when current is supplied to each LED 9 of the LED light source 2 from a commercial power source (not shown), each LED 9 is activated to emit light, and the light is transparent. The light passes through the instrument cover 7 and is emitted toward the periphery. At this time, the LED light source 2 generates heat by the light emission of each LED 9, but the heat is transferred from the LED light source housing 3 to the instrument base 6 through the support 4 and the support base 5 as indicated by arrows in FIG. And is transmitted from the outer surface of the instrument base 6 to the external air by natural convection and radiation.

ところで、本実施の形態では、器具ベース6として既存のものを利用しているが、該器具ベース6と支持具4の間に支持具ベース5を介装し、該スカートベース5とスカート4及び器具ベース6を面接触させて固定したため、支持具ベース5と支持具4及び器具ベース6との接触面積(伝熱面積)が大きくなり、LED光源2からの熱は支持具4から支持具ベース5を経て器具ベース6へと効率良く伝導及び拡散し、最終的に器具ベース6の外表面から自然対流と輻射によって外部空気へと伝わる。このため、当該LED照明装置1の熱伝導性と熱拡散性が高められて放熱性の向上が図られ、LED光源2の温度上昇が抑えられる。   By the way, in the present embodiment, an existing instrument base 6 is used, but a support base 5 is interposed between the instrument base 6 and the support 4, and the skirt base 5 and the skirt 4 and Since the fixture base 6 is fixed in surface contact, the contact area (heat transfer area) between the support fixture base 5, the support fixture 4 and the fixture base 6 is increased, and the heat from the LED light source 2 is transferred from the support fixture 4 to the support fixture base. 5 is efficiently conducted and diffused to the instrument base 6 through 5 and finally transmitted from the outer surface of the instrument base 6 to the external air by natural convection and radiation. For this reason, the thermal conductivity and thermal diffusibility of the LED lighting device 1 are enhanced, the heat dissipation is improved, and the temperature rise of the LED light source 2 is suppressed.

そして、本実施の形態では、支持具4と器具ベース6及び支持具ベース5を熱伝導性の高い材料で構成したため、LED光源3からの熱が支持具4と支持具ベース5を経て器具ベース6へと効率良く伝導し、最終的に器具ベース6の外表面から外部空気に自然対流と輻射によって伝わるため、当該LED照明装置1の放熱性が一層効果的に高められてLED光源2が効率良く冷却される。   In this embodiment, since the support 4, the instrument base 6, and the support base 5 are made of a material having high thermal conductivity, heat from the LED light source 3 passes through the support 4 and the support base 5, and the instrument base. 6 is efficiently conducted to the outside air from the outer surface of the instrument base 6 to the outside air by natural convection and radiation, so that the heat dissipation of the LED lighting device 1 is further effectively improved and the LED light source 2 is more efficient. Cools well.

又、本実施の形態では、支持具ベース5の下面(裏面)に複数の放熱フィン18を形成したため、該放熱フィン18から内部空気への放熱によってLED光源2の冷却が促進されるともに、放熱フィン18が器具ベース6に面接触することによって両者間の伝熱面積が拡大されるために熱伝導性と拡散性が更に高められて放熱性の更なる向上が図られる。   Moreover, in this Embodiment, since the several heat sink 18 was formed in the lower surface (back surface) of the support base 5, cooling of the LED light source 2 is accelerated | stimulated by the heat radiation from this heat sink 18 to internal air, and also heat radiation. When the fin 18 is in surface contact with the instrument base 6, the heat transfer area between the two is expanded, so that the thermal conductivity and the diffusibility are further improved, and the heat dissipation is further improved.

更に、本実施の形態では、支持具4と支持具ベース5を器具ベース6にネジ固定したため、これらの固定が振動等によって緩むことがなく、電気的な接触不良が発生して照明が不灯になるという不具合が発生することがなく、又、当該LED照明装置1を下向き(図1において上下を逆にした状態)に取り付けて使用する場合であっても、LED光源2が外れて落下してしまうという不具合が発生することもない。尚、LED照明装置1の取付方向は任意である。   Furthermore, in this embodiment, since the support 4 and the support base 5 are fixed to the instrument base 6 with screws, the fixing does not loosen due to vibration or the like, an electrical contact failure occurs, and the illumination is turned off. In addition, even when the LED lighting device 1 is mounted downward (in a state where the top and bottom are reversed in FIG. 1), the LED light source 2 comes off and falls. There is no problem that it will end up. In addition, the attachment direction of the LED lighting apparatus 1 is arbitrary.

ところで、本実施の形態では、支持具ベース5の底面(裏面)に複数の放熱フィン18を形成したが、放熱フィン18を形成しないで図5に示すように支持具ベース5を中実に構成すれば、該支持具ベース5の底面(裏面)のほぼ全面を器具ベース6に面接触させることができるため、支持具ベース5から器具ベース6への伝導熱量が増えて放熱性が更に高められる。   By the way, in this Embodiment, although the several heat radiating fin 18 was formed in the bottom face (back surface) of the support tool base 5, as shown in FIG. For example, since almost the entire bottom surface (back surface) of the support base 5 can be brought into surface contact with the instrument base 6, the amount of heat transferred from the support base 5 to the instrument base 6 is increased, and the heat dissipation is further enhanced.

<実施の形態2>
次に、本発明の実施の形態2を図6に基づいて以下に説明する。
<Embodiment 2>
Next, a second embodiment of the present invention will be described below with reference to FIG.

図6は本発明の実施の形態2に係るLED照明装置の側断面図であり、本図においては図1に示したものと同一要素には同一符号を付しており、以下、それらについての再度の説明は省略する。   FIG. 6 is a side sectional view of the LED lighting apparatus according to Embodiment 2 of the present invention. In this figure, the same elements as those shown in FIG. The description will not be repeated.

本実施の形態に係るLED照明装置1’は、支持具4と支持具ベース5を一体に構成したことを特徴としており、他の構成は前記実施の形態1のそれと同じである。   The LED lighting device 1 ′ according to the present embodiment is characterized in that the support 4 and the support base 5 are integrally formed, and other configurations are the same as those of the first embodiment.

而して、本実施の形態では、支持具4と支持具ベース5とを一体化したため、これらの支持具4と支持具ベース5間の接触熱抵抗が無くなり、熱伝導性が更に高められるという効果が得られる他、前記実施の形態1と同様の効果が得られる。   Thus, in the present embodiment, since the support tool 4 and the support tool base 5 are integrated, the contact thermal resistance between the support tool 4 and the support tool base 5 is eliminated, and the thermal conductivity is further improved. In addition to the effects, the same effects as in the first embodiment can be obtained.

本発明は、一般照明灯具や街路灯、道路灯等の主に屋外照明灯具に対して好適に適用可能である。   The present invention can be suitably applied mainly to outdoor illumination lamps such as general illumination lamps, street lamps, and road lights.

1,1’ LED照明装置
2 LED光源
3 LED光源筐体
3A LED光源筐体の支持部
4 支持具
4A 支持具のフランジ
5 支持具ベース
5a 支持具ベースの切欠き
5b 支持具ベースの円孔
5c 支持具ベースの取付座
6 器具ベース
6A 器具ベースの通線用ボス
6a,6b 器具ベースの取付座
7 器具カバー
8 LED基板
9 LED
10 口金
11 支持具の円孔
12 口金ソケット
13 支持ステー
14,15 器具ベースのネジ孔
16,17 支持具ベースの円孔
18 放熱フィン
DESCRIPTION OF SYMBOLS 1,1 'LED illuminating device 2 LED light source 3 LED light source housing 3A LED light source housing support part 4 Support tool 4A Support tool flange 5 Support tool base 5a Support tool base notch 5b Support tool base circular hole 5c Support base mounting seat 6 Device base 6A Device base wiring boss 6a, 6b Device base mounting seat 7 Device cover 8 LED substrate 9 LED
DESCRIPTION OF SYMBOLS 10 Base 11 Circular hole of support tool 12 Base socket 13 Support stay 14, 15 Screw hole 16 of instrument base 16, 17 Circular hole of support base 18 Radiation fin

Claims (5)

LED光源を支持するLED光源筐体を支持具を介して器具ベースに取り付けるとともに、前記LED光源と前記LED光源筐体及び前記支持具を前記器具ベースと共に器具カバーによって覆って構成されるLED照明装置において、
前記支持具と前記器具ベースの間に支持具ベースを介装し、該支持具ベースの表面に前記支持具を面接触させて固定し、同支持具ベースの裏面に前記器具ベースを面接触させて固定したことを特徴とするLED照明装置。
An LED illumination device configured to attach an LED light source casing that supports an LED light source to an instrument base via a support, and to cover the LED light source, the LED light source casing, and the support together with the instrument base with an instrument cover In
A support base is interposed between the support and the instrument base, the support is fixed in surface contact with the surface of the support base, and the instrument base is in surface contact with the back surface of the support base. LED lighting device characterized by being fixed.
前記支持具と前記器具ベース及び前記支持具ベースを熱伝導性の高い材料で構成したことを特徴とする請求項1記載のLED照明装置。   The LED lighting device according to claim 1, wherein the support, the instrument base, and the support base are made of a material having high thermal conductivity. 前記支持具ベースの裏面に複数の放熱フィンを形成したことを特徴とする請求項1又は2記載のLED照明装置。   The LED lighting device according to claim 1, wherein a plurality of heat radiation fins are formed on a back surface of the support base. 前記支持具と前記支持具ベースを前記器具ベースにネジ固定したことを特徴とする請求項1〜3の何れかに記載のLED照明装置。   The LED lighting device according to any one of claims 1 to 3, wherein the support and the support base are screwed to the instrument base. 前記支持具と前記支持具ベースとを一体に構成したことを特徴とする請求項1〜3の何れかに記載のLED照明装置。
The LED lighting device according to claim 1, wherein the support and the support base are integrally configured.
JP2010224461A 2010-10-04 2010-10-04 Led lighting device Pending JP2012079565A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016143653A (en) * 2015-02-05 2016-08-08 株式会社東芝 Illumination device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016143653A (en) * 2015-02-05 2016-08-08 株式会社東芝 Illumination device
US10222050B2 (en) 2015-02-05 2019-03-05 Kabushiki Kaisha Toshiba Lighting device

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