JP2011243956A - 高効率発光ダイオード及びその製造方法 - Google Patents
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- 238000000034 method Methods 0.000 title abstract description 39
- 238000004519 manufacturing process Methods 0.000 title abstract description 25
- 239000004065 semiconductor Substances 0.000 claims abstract description 238
- 150000001875 compounds Chemical class 0.000 claims abstract description 73
- 229910052751 metal Inorganic materials 0.000 claims description 276
- 239000002184 metal Substances 0.000 claims description 276
- 239000000758 substrate Substances 0.000 claims description 177
- 230000004888 barrier function Effects 0.000 claims description 52
- 230000002093 peripheral effect Effects 0.000 claims description 35
- 239000010949 copper Substances 0.000 claims description 12
- 229910052721 tungsten Inorganic materials 0.000 claims description 8
- 229910052759 nickel Inorganic materials 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 229910052750 molybdenum Inorganic materials 0.000 claims description 6
- 239000011733 molybdenum Substances 0.000 claims description 6
- 229910052697 platinum Inorganic materials 0.000 claims description 6
- 229910052719 titanium Inorganic materials 0.000 claims description 6
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 6
- 239000010937 tungsten Substances 0.000 claims description 6
- 229910052804 chromium Inorganic materials 0.000 claims description 4
- 238000009826 distribution Methods 0.000 abstract description 3
- 238000009413 insulation Methods 0.000 abstract 2
- 239000010410 layer Substances 0.000 description 510
- 239000000463 material Substances 0.000 description 64
- 239000011241 protective layer Substances 0.000 description 28
- 230000003287 optical effect Effects 0.000 description 19
- 230000008569 process Effects 0.000 description 17
- 229910052594 sapphire Inorganic materials 0.000 description 9
- 239000010980 sapphire Substances 0.000 description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- 229910004298 SiO 2 Inorganic materials 0.000 description 7
- 238000010586 diagram Methods 0.000 description 7
- 238000005530 etching Methods 0.000 description 7
- 150000004767 nitrides Chemical class 0.000 description 6
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 5
- 238000000605 extraction Methods 0.000 description 5
- 238000002310 reflectometry Methods 0.000 description 5
- 229910015363 Au—Sn Inorganic materials 0.000 description 4
- 229910002601 GaN Inorganic materials 0.000 description 4
- 229910052581 Si3N4 Inorganic materials 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 229910010413 TiO 2 Inorganic materials 0.000 description 4
- 238000005452 bending Methods 0.000 description 4
- 230000005496 eutectics Effects 0.000 description 4
- 238000005304 joining Methods 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 4
- 229910052814 silicon oxide Inorganic materials 0.000 description 4
- 239000002356 single layer Substances 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000001451 molecular beam epitaxy Methods 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000000313 electron-beam-induced deposition Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000002207 thermal evaporation Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
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- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/38—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
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- H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
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- H01L33/26—Materials of the light emitting region
- H01L33/30—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table
- H01L33/32—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table containing nitrogen
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- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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Abstract
【解決手段】 本発明の発光ダイオードは、支持基板と、支持基板上に位置し、p型化合物半導体層、活性層、及びn型化合物半導体層を有する半導体積層構造体と、支持基板と半導体積層構造体との間に配置され、半導体積層構造体にオーミックコンタクトする反射金属層と、半導体積層構造体上に配置される第1の電極パッドと、第1の電極パッドから延長し、n型化合物半導体層に接触する接触領域を有する電極延長部と、支持基板と半導体積層構造体との間に配置され、電極延長部の接触領域下のp型化合物半導体層の表面領域を覆う下部絶縁層と、第1の電極パッドと半導体積層構造体との間に介在された上部絶縁層と、備える。
【選択図】 図8
Description
27 活性層
29 p型化合物半導体層
30 半導体積層構造体
31 反射金属層
33 下部絶縁層
35 バリアメタル層
41 支持基板
43 ボンディングメタル
47 上部絶縁層
51a 電極延長部
Claims (19)
- 支持基板と、
前記支持基板上に配置され、p型化合物半導体層、活性層、及びn型化合物半導体層を有する半導体積層構造体と、
前記支持基板と前記半導体積層構造体との間に配置され、前記半導体積層構造体にオーミックコンタクトする反射金属層と、
前記半導体積層構造体上に配置される第1の電極パッドと、
前記第1の電極パッドから延長され、前記n型化合物半導体層に接触する接触領域を有する電極延長部と、
前記支持基板と前記半導体積層構造体との間に配置され、前記電極延長部の前記接触領域下の前記p型化合物半導体層の表面領域を覆う下部絶縁層と、
前記第1の電極パッドと前記半導体積層構造体との間に介在された上部絶縁層と、
を備えることを特徴とする発光ダイオード。 - バリアメタル層をさらに有し、
前記反射金属層は、前記半導体積層構造体を露出させる溝領域を有し、
前記下部絶縁層は、前記反射金属層と前記支持基板との間に配置され、前記溝領域に充填されると共に、前記反射金属層を覆い、前記反射金属層を露出させる開口部を有し、
前記バリアメタル層は、前記支持基板と前記下部絶縁層との間に配置され、前記下部絶縁層の開口部により露出した前記反射金属層を覆うことを特徴とする請求項1に記載の発光ダイオード。 - 前記第1の電極パッド及び前記電極延長部は、前記溝領域の上部に配置されることを特徴とする請求項2に記載の発光ダイオード。
- 前記反射金属層は、複数のプレートからなり、前記下部絶縁層は、前記複数のプレートの側面及び周縁部を覆い、前記下部絶縁層の開口部によって前記複数のプレートがそれぞれ露出されることを特徴とする請求項2に記載の発光ダイオード。
- 前記下部絶縁層は、前記半導体積層構造体を露出させる少なくとも一つの溝を有し、
前記反射金属層は、前記下部絶縁層と前記支持基板との間に配置され、前記少なくとも一つの溝に充填されて前記半導体積層構造体にオーミックコンタクトすることを特徴とする請求項1に記載の発光ダイオード。 - 前記下部絶縁層の溝の側壁は、傾斜していることを特徴とする請求項5に記載の発光ダイオード。
- 前記支持基板と前記反射金属層との間に配置され、前記反射金属層の周縁部を覆い、前記反射金属層を取り囲むバリアメタル層をさらに有することを特徴とする請求項6に記載の発光ダイオード。
- 前記反射金属層の周縁部は、前記下部絶縁層と前記支持基板との間に配置されると共に、前記半導体積層構造体の周縁部と前記支持基板の周縁部との間に配置されることを特徴とする請求項5に記載の発光ダイオード。
- 前記下部絶縁層は、複数の溝を有し、
前記第1の電極パッド及び前記電極延長部は、前記下部絶縁層領域の上部に配置されることを特徴とする請求項5に記載の発光ダイオード。 - 前記支持基板は、
タングステン(W)またはモリブデン(Mo)の少なくとも一つを含む第1の金属層と、
前記第1の金属層よりも熱膨張係数が高く、前記第1の金属層の上下面にそれぞれ配置された第2の金属層とを有することを特徴とする請求項1に記載の発光ダイオード。 - 前記第2の金属層は、銅(Cu)を含むことを特徴とする請求項10に記載の発光ダイオード。
- 前記第1の金属層及び前記第2の金属層の間にそれぞれ接合層が配置されたことを特徴とする請求項10に記載の発光ダイオード。
- 前記接合層は、Ni、Ti、Cr、Ptの少なくとも一つを含む請求項12に記載の発光ダイオード。
- 前記支持基板と前記半導体積層構造体との間に介在するボンディングメタルと、
前記ボンディングメタルと対称に、前記第2の金属層の下面に形成された下部ボンディングメタルとをさらに有することを特徴とする請求項10に記載の発光ダイオード。 - 前記半導体積層構造体は、粗い表面を有し、
前記上部絶縁層は、前記粗い表面を覆い、前記粗い表面に沿って凹凸面を形成することを特徴とする請求項1に記載の発光ダイオード。 - 前記半導体積層構造体は、滑らかな表面を有し、前記第1の電極パッド及び前記電極延長部は、前記滑らかな表面上に配置されることを特徴とする請求項15に記載の発光ダイオード。
- 前記電極延長部は、前記半導体積層構造体の滑らかな表面に接触されることを特徴とする請求項16に記載の発光ダイオード。
- 前記粗い表面は、前記電極延長部よりも下方に配置されることを特徴とする請求項15に記載の発光ダイオード。
- 複数の第1の電極パッドと、
前記複数の第1の電極パッドからそれぞれ延びる複数の電極延長部とを有することを特徴とする請求項1に記載の発光ダイオード。
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Application Number | Priority Date | Filing Date | Title |
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KR10-2010-0046532 | 2010-05-18 | ||
KR1020100046532A KR101115537B1 (ko) | 2010-05-18 | 2010-05-18 | 고효율 반도체 발광소자 |
KR1020100092991A KR101138978B1 (ko) | 2010-09-27 | 2010-09-27 | 고효율 발광 다이오드 및 그것을 제조하는 방법 |
KR10-2010-0092991 | 2010-09-27 | ||
KR10-2010-0094298 | 2010-09-29 | ||
KR1020100094298A KR101158077B1 (ko) | 2010-09-29 | 2010-09-29 | 고효율 발광 다이오드 및 그것을 제조하는 방법 |
KR10-2010-0101227 | 2010-10-18 | ||
KR1020100101227A KR101154511B1 (ko) | 2010-10-18 | 2010-10-18 | 고효율 발광 다이오드 및 그것을 제조하는 방법 |
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US (2) | US9029888B2 (ja) |
EP (1) | EP2388836B1 (ja) |
JP (1) | JP5725927B2 (ja) |
CN (3) | CN104851952B (ja) |
TW (2) | TWI546983B (ja) |
WO (1) | WO2011145850A2 (ja) |
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JP7536500B2 (ja) | 2019-05-16 | 2024-08-20 | 晶元光電股▲ふん▼有限公司 | 半導体素子 |
JP2020202350A (ja) * | 2019-06-13 | 2020-12-17 | ローム株式会社 | 半導体発光装置 |
JP7360822B2 (ja) | 2019-06-13 | 2023-10-13 | ローム株式会社 | 半導体発光装置 |
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US20120119243A1 (en) | 2012-05-17 |
TW201543717A (zh) | 2015-11-16 |
CN104851952A (zh) | 2015-08-19 |
CN102255022B (zh) | 2016-06-01 |
US10249797B2 (en) | 2019-04-02 |
WO2011145850A2 (en) | 2011-11-24 |
CN105895770A (zh) | 2016-08-24 |
EP2388836A2 (en) | 2011-11-23 |
TW201145591A (en) | 2011-12-16 |
US20150243847A1 (en) | 2015-08-27 |
TWI493757B (zh) | 2015-07-21 |
CN105895770B (zh) | 2018-06-01 |
EP2388836B1 (en) | 2020-02-12 |
EP2388836A3 (en) | 2013-10-09 |
WO2011145850A3 (en) | 2012-02-23 |
CN104851952B (zh) | 2017-09-15 |
CN102255022A (zh) | 2011-11-23 |
JP5725927B2 (ja) | 2015-05-27 |
TWI546983B (zh) | 2016-08-21 |
US9029888B2 (en) | 2015-05-12 |
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