JP2011232709A - Curable resin composition - Google Patents

Abstract

An object of the present invention is to provide a resist ink composition that hardly causes color separation and a printed wiring board having a cured product thereof.
(A) A carboxyl group-containing resin having one or more carboxyl groups in one molecule, (B) a photopolymerization initiator, (C) a fluorine-containing block copolymer and / or a polyether having a fluorinated alkyl group. A curable resin composition comprising a polymer, (D) a diluent, (E) a colorant, and (F) an epoxy resin.
[Selection figure] None

Description

  The present invention relates to a resin composition such as photocuring property and thermosetting property, and a printed wiring board having a cured product (solder resist layer, resin insulating layer) obtained by curing the composition.

  Due to recent rapid advances in semiconductor components, electronic devices are becoming smaller, lighter, higher performance, and multifunctional, and the printed wiring board is becoming increasingly dense following these trends. As the solder resist used for such a printed wiring board, a liquid development type solder resist is used which forms an image by pattern exposure with ultraviolet rays and develops it, and is finally cured (mainly cured) by heat and light irradiation. In consideration of environmental problems, an alkali development type liquid solder resist ink (for example, Patent Document 1) using an alkaline aqueous solution as a developing solution has become mainstream.

  Such a liquid solder resist ink is applied to the entire surface of a printed wiring board by a screen printing method, a curtain coating method, a spray coating method, a roll coating method, etc., and a temporary solvent that volatilizes an organic solvent to enable contact exposure. Drying is performed, and then exposure and development are performed to form a pattern, followed by heat curing to obtain a cured coating film excellent in heat resistance, electrical insulation and the like.

  For example, in the curtain coating method, a liquid solder resist ink is flow-applied from an ink head onto a printed wiring board conveyed by a conveyor. Ink heads are circulated and replenished with resist ink transferred from an ink tank via an ink receiver by a pump, and are reused. Thus, the printed wiring board which apply | coated to the whole surface of the printed wiring board and formed the cured film of the coating film of soldering resist ink is obtained.

  In the case of coating with such a curtain coater, it is necessary to dilute the liquid solder resist ink to a low viscosity. For example, when diluted to 50 dPa · s or less, a colorant such as phthalocyanine blue is separated and easily floats on the surface. Among these, it is known that so-called “color separation” is likely to occur.

  Patent Document 1 proposes that a resin composition contains a specific thixotropic agent and hydrophilic silica in order to suppress color separation.

  Patent Document 2 proposes to stabilize the dispersion in the composition by subjecting copper phthalocyanine blue to a hydrophilic surface treatment in order to suppress color separation.

  In Patent Document 3, in order to suppress color separation, a colorant dispersion is made by pulverizing a colorant together with a resin component and a solvent component, which are basic components of a resist ink, by mechanical means, and the resist ink is used by using this. In making the colorant dispersion, it is possible to produce a low-viscosity colorant dispersion by changing the proportion of each component used in the composition of the colorant dispersion. If the mechanical means for (or pulverization) is changed from the conventional three rolls to a pulverizer for fine powder such as a mill dispersion method using media such as balls and beads, the pigment particles of the colorant can be further pulverized. The average particle size is less than 1 μm, and the standard deviation of the particle size distribution is 0.1 to 0.2 μm.

JP 2003-96368 A JP 2002-194527 A JP 2007-133070 A

  An object of the present invention is to provide a resist ink composition that hardly causes color separation and a printed wiring board having a cured product thereof.

  In order to solve the above problems, the curable resin composition according to the present invention includes (A) a carboxyl group-containing resin, (B) a photopolymerization initiator, (C) a fluorine-containing block copolymer and / or a fluorinated alkyl group. A polyether polymer having (D) a diluent, (E) a colorant, and (F) an epoxy resin.

  The present invention has an effect of suppressing color separation by blending a fluorinated block copolymer and / or a polyether polymer having a fluorinated alkyl group with a curable resin composition.

  In particular, by controlling the color separation by setting the blending amount of these fluorine-containing block copolymers and / or polyether polymers having fluorinated alkyl groups within a specific range, defoaming and marking adhesion are also good. It will be something.

  Hereinafter, embodiments of the present invention will be described in detail.

  The curable resin composition according to the present invention comprises (A) a carboxyl group-containing resin, (B) a photopolymerization initiator, (C) a fluorine-containing block copolymer and / or a polyether polymer having a fluorinated alkyl group, (D) Contains diluent, (E) colorant, and (F) epoxy resin.

(A) Carboxyl group-containing resin As the carboxyl group-containing resin (A) used in the present invention, a resin having an arbitrary carboxyl group can be used. Among the resins having a carboxyl group, the carboxyl group-containing photosensitive resin (A ′) itself having an ethylenically unsaturated double bond and the carboxyl group-containing resin (A) having no ethylenically unsaturated double bond Either can be used suitably. In particular, the resins listed below (any of oligomers and polymers) can be preferably used.

(1) a carboxyl group-containing resin obtained by copolymerization of an unsaturated carboxylic acid and a compound having an unsaturated double bond,
(2) Carboxyl group-containing photosensitivity obtained by adding an ethylenically unsaturated group as a pendant (for example, adding glycidyl methacrylate) to a copolymer of an unsaturated carboxylic acid and a compound having an unsaturated double bond. resin,
(3) An unsaturated monocarboxylic acid is reacted with a copolymer of a compound having an epoxy group and an unsaturated double bond in one molecule and a compound having an unsaturated double bond. A carboxyl group-containing photosensitive resin obtained by reacting a saturated or unsaturated polybasic acid anhydride,
(4) A compound having a hydroxyl group and an unsaturated double bond in one molecule is reacted with a copolymer of an acid anhydride having an unsaturated double bond and another compound having an unsaturated double bond. The resulting carboxyl group-containing photosensitive resin,
(5) a carboxyl group-containing photosensitive resin obtained by reacting a polyfunctional epoxy compound with an unsaturated monocarboxylic acid and reacting the generated hydroxyl group with a saturated or unsaturated polybasic acid anhydride,
(6) A hydroxyl group obtained by reacting a hydroxyl group-containing polymer with a saturated or unsaturated polybasic acid anhydride and then reacting the resulting carboxylic acid with a compound having an epoxy group and an unsaturated double bond in one molecule; Carboxyl group-containing photosensitive resin,
(7) a polyfunctional epoxy compound, an unsaturated monocarboxylic acid, at least one alcoholic hydroxyl group in one molecule, and a compound having one reactive group other than an alcoholic hydroxyl group that reacts with an epoxy group Unsaturated with carboxyl group-containing photosensitive resin obtained by reacting reaction product with saturated or unsaturated polybasic acid anhydride, and (8) polyfunctional oxetane compound having at least two oxetane rings in one molecule Examples thereof include a carboxyl group-containing photosensitive resin obtained by reacting a monocarboxylic acid and reacting a saturated or unsaturated polybasic acid anhydride with a primary hydroxyl group in the resulting modified oxetane resin.

  Among these, a carboxyl group-containing photosensitive resin having two or more photosensitive unsaturated double bonds in one molecule, particularly the carboxyl group-containing photosensitive resin (5) is preferable.

  Since the carboxyl group-containing resin (A) as described above has a large number of free carboxyl groups in the side chain of the backbone polymer, development with an aqueous alkali solution becomes possible.

Moreover, the acid value of the said carboxyl group-containing resin (A) is the range of 40-200 mgKOH / g, More preferably, it is the range of 45-120 mgKOH / g. When the acid value of the carboxyl group-containing resin is less than 40 mgKOH / g, alkali development becomes difficult. On the other hand, when the acid value exceeds 200 mgKOH / g, dissolution of the exposed area by the developer proceeds and the line becomes thinner than necessary. Depending on the case, the exposed portion and the unexposed portion are not distinguished from each other by dissolution and peeling with a developer, which makes it difficult to draw a normal resist pattern.

  The compounding quantity of such carboxyl group-containing resin (A) is 20-60 mass% in all the compositions, Preferably it is 30-50 mass%. When the amount is less than the above range, the coating strength is lowered, which is not preferable. On the other hand, when the amount is larger than the above range, the viscosity becomes high or the printability is lowered, which is not preferable.

(B) Photopolymerization initiator As the photopolymerization initiator (B) used in the present invention, for example, benzoin and benzoin alkyl ethers such as benzoin, benzoin methyl ether, benzoin ethyl ether, and benzoin isopropyl ether; acetophenone, 2, Acetophenones such as 2-dimethoxy-2-phenylacetophenone, 2,2-diethoxy-2-phenylacetophenone, 2,2-diethoxy-2-phenylacetophenone, 1,1-dichloroacetophenone; 2-methyl-1- [4 Aminoacetophenones such as-(methylthio) phenyl] -2-morpholinopropan-1-one and 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone-1; 2-methylanthraquinone; 2-ethylanthraquinone Anthraquinones such as 2-tertiarybutylanthraquinone and 1-chloroanthraquinone; thioxanthones such as 2,4-dimethylthioxanthone, 2,4-diethylthioxanthone, 2-chlorothioxanthone and 2,4-diisopropylthioxanthone; acetophenone dimethyl ketal Ketones such as benzyldimethyl ketal; benzophenones such as benzophenone; or xanthones; (2,6-dimethoxybenzoyl) -2,4,4-pentylphosphine oxide, bis (2,4,6-trimethylbenzoyl)- Phosphine oxides such as phenylphosphine oxide, 2,4,6-trimethylbenzoyldiphenylphosphine oxide, ethyl-2,4,6-trimethylbenzoylphenyl phosphinate ; Various peroxides and the like can be used alone or in combination of two or more of these conventionally known photopolymerization initiator.

  The compounding quantity of these photoinitiators (B) is 0.2-10 mass% in the whole composition, Preferably it is 0.5-5 mass%. When the blending amount is less than 0.2% by mass of the total amount of the composition, the photocurability is lowered, and pattern formation after exposure / development becomes difficult. On the other hand, if it exceeds 10% by mass, the photo-radical polymerization initiator itself absorbs light, resulting in a decrease in thick film curability and high cost.

  Along with the photopolymerization initiator (B) as described above, N, N-dimethylaminobenzoic acid ethyl ester, N, N-dimethylaminobenzoic acid isoamyl ester, pentyl-4-dimethylaminobenzoate, triethylamine, triethanolamine, etc. Photosensitizers such as tertiary amines can be used alone or in combination of two or more.

  Furthermore, titanocene photopolymerization initiators such as Irgacure 784 manufactured by Ciba Specialty Chemicals, which initiate radical polymerization in the visible region, and leuco dyes can be used in combination as curing aids.

(C) Fluorine-containing block copolymer and / or polyether polymer having fluorinated alkyl group As the fluorinated block copolymer used in the present invention, a block copolymer comprising a fluorinated alkyl group-containing polymer segment and an acrylic polymer segment is used. Product names manufactured by NOF Corporation: Modiper F series, for example, Modiper F200, Modiper F220, Modiper F2020, Modiper F3035, and Modiper F600 are commercially available.

  The blending amount of such a fluorinated block copolymer is 0.001% by mass or more, preferably less than 0.005 to 0.15% by mass, more preferably 0.007 to 0.1% by mass in the total composition. is there. When the blending amount is less than 0.001% by mass, the color separation suppressing effect is not exhibited. In addition, if the said compounding quantity is 0.15 mass% or more, defoaming property and marking adhesiveness will worsen.

  As the polyether polymer having a fluorinated alkyl group used in the present invention, a polyether polymer having a pendant type short fluorinated alkyl is, for example, PolyFox series (PF-636, manufactured by Omninova Solsons, Inc.). PF-6320, PF-651, PF-652, PF-656, PF-6520, PF-151N, PF-3320, etc.) are commercially available.

  The blending amount of such a polyether polymer having a fluorinated alkyl group is 0.1% by mass or more, preferably 0.1 to 3.5% by mass, more preferably 0.2 to 2.% by mass in the entire composition. 5% by mass. When the blending amount is less than 0.1% by mass, the color separation suppressing effect is not exhibited. In addition, when the said compounding quantity exceeds 3.5 mass%, defoaming property and marking adhesiveness will worsen.

(D) Diluent The diluent (D) used in the present invention is used to improve the workability by adjusting the viscosity of the composition, to increase the crosslinking density, to improve the adhesion, etc. A reactive diluent such as a photopolymerizable monomer or a known and commonly used organic solvent can be used.

  Examples of the photopolymerizable monomer include alkyl (meth) acrylates such as 2-ethylhexyl (meth) acrylate and cyclohexyl (meth) acrylate; hydroxy such as 2-hydroxyethyl (meth) acrylate and 2-hydroxypropyl (meth) acrylate. Alkyl (meth) acrylates; mono- or di (meth) acrylates of alkylene oxide derivatives such as ethylene glycol, propylene glycol, diethylene glycol, dipropylene glycol; hexanediol, trimethylolpropane, pentaerythritol, ditrimethylolpropane, dipentaerythritol , Polyhydric alcohols such as trishydroxyethyl isocyanurate, or polyvalent (meth) acrylates of these ethylene oxide or propylene oxide adducts Rate: Phenoxyethyl (meth) acrylate, bisphenol A polyethoxydi (meth) acrylate and other phenolic ethylene oxide or propylene oxide (meth) acrylates; glycerin diglycidyl ether, trimethylolpropane triglycidyl ether, triglycidyl (Meth) acrylates of glycidyl ether such as isocyanurate; and melamine (meth) acrylate.

  These can be used singly or in combination of two or more, (meth) acrylates containing a hydrophilic group in terms of liquid stability of the composition, and polyfunctional (meth) acrylates in terms of photocurability. Is preferred. The range of use of these photopolymerizable monomers is 20% by mass or less, preferably 10% by mass or less in the entire composition. If it is more than this, it is not preferable because the dryness to the touch becomes worse.

  In addition, in this specification, (meth) acrylate is a term which generically refers to acrylate, methacrylate and mixtures thereof, and the same applies to other similar expressions.

  Examples of the organic solvent include ketones such as methyl ethyl ketone and cyclohexanone; aromatic hydrocarbons such as toluene, xylene, and tetramethylbenzene; cellosolve, methyl cellosolve, butyl cellosolve, carbitol, methyl carbitol, butyl carbitol, propylene glycol monomethyl Glycol ethers such as ether, dipropylene glycol monomethyl ether, dipropylene glycol diethyl ether, tripropylene glycol monomethyl ether; ethyl acetate, butyl acetate, butyl lactate, cellosolve acetate, butyl cellosolve acetate, carbitol acetate, butyl carbitol acetate, propylene Glycol monomethyl ether acetate, dipropylene glycol monomethyl ether acetate Esters such as propylene carbonate; octane, aliphatic hydrocarbons decane; petroleum ether, petroleum naphtha, and petroleum solvents such as solvent naphtha, organic solvents conventionally known can be used. These organic solvents can be used alone or in combination of two or more.

    The amount of the organic solvent used varies depending on the coating method and the boiling point of the organic solvent to be used, and is not particularly limited, but is generally 80% by mass, preferably 60% by mass in the total composition. Or less, more preferably 50% by mass or less. When a high-boiling organic solvent is contained in a large amount, the dryness to the touch is lowered, and sagging or the like occurs after the coating until it is temporarily dried.

(E) Colorant As the colorant (E) used in the present invention, a known inorganic pigment, organic pigment, or organic dye can be included. Since organic dyes cause a decrease in sensitivity, it is preferable to use inorganic pigments or organic pigments. Specific examples include phthalocyanine blue, phthalocyanine green, iodin green, disazo yellow, crystal violet, titanium oxide, carbon black, and naphthalene black. Furthermore, it is preferable to use a non-halogen organic pigment in view of environmental problems.

  The amount of these pigments is generally 5% by mass or less in the composition, excluding titanium oxide. When it is more than the above range, the photocurability is lowered, which is not preferable. In addition, when using a titanium oxide, generally it is used at 15 mass% or less in a composition.

(F) Epoxy resin The epoxy resin (F) of the present invention contains various known and commonly used epoxy resins such as bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, brominated bisphenol A type epoxy resin, water. Bisphenol A type epoxy resin, biphenol type epoxy resin, bixylenol type epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin, brominated phenol novolac type epoxy resin, bisphenol A novolak type epoxy resin, trihydroxyphenylmethane Type epoxy resin, tetraphenylolethane type epoxy resin, phenol novolac type epoxy resin containing naphthalene skeleton, phenol novolak type epoxy resin containing dicyclopentadiene skeleton Glycidyl ether compounds such as fat; Glycidyl ester compounds such as terephthalic acid diglycidyl ester, hexahydrophthalic acid diglycidyl ester and dimer acid diglycidyl ester; Alicyclic epoxy resins such as EHPE-3150 manufactured by Daicel Chemical Industries; Heterocyclic epoxy resins such as isocyanurates; N, N, N ′, N′-tetraglycidylmetaxylenediamine, N, N, N ′, N′-tetraglycidylbisaminomethylcyclohexane, N, N-diglycidylaniline Known conventional epoxy compounds such as glycidylamines and copolymers of glycidyl (meth) acrylate and compounds having an ethylenically unsaturated double bond can be used, but from the viewpoint of dryness to touch and heat resistance , Phenol novolac type epoxy resin, Crezo Particularly preferred are ernovolak type epoxy resins, biphenol type or bixylenol type epoxy resins or mixtures thereof and triglycidyl isocyanurate. These epoxy resins (F) can be used alone or in combination of two or more.

  These epoxy resins (F) are thermally cured with the carboxyl group-containing resin (A) to improve heat resistance, adhesion, and the like. The compounding amount of these epoxy resins (F) is 0.5 to 3.0 equivalents of epoxy groups, preferably 1.0 to 2.0, with respect to 1 equivalent of carboxyl groups of the carboxyl group-containing resin (A). Is equivalent. When the blending amount of the epoxy resin (F) is less than 0.5 equivalents of epoxy groups, unreacted carboxyl groups remain, the hygroscopicity of the cured film becomes high, and the PCT resistance is liable to be reduced. And electroless plating resistance tend to be low. Moreover, when the compounding quantity of an epoxy resin (F) exceeds 3.0 equivalent of epoxy groups, the developability of a coating film and the electroless-plating resistance of a cured film will worsen, and PCT tolerance will also be inferior. .

(Curing catalyst, other components)
Furthermore, the photocurable thermosetting resin composition of the present invention can contain imidazole salts, boron trifluoride complexes, organometallic salts, and the like as latent curing catalysts. Further, for the purpose of preventing the oxidation of copper, i.e., copper, a compound such as adenine, vinyltriazine, dicyandiamide, orthotolylbiguanide, melamine, or a salt thereof can be added. The compounding ratio of these compounds is generally 5% by mass or less in the composition, and by adding these, the chemical resistance of the cured coating film and the adhesion to the copper foil are improved.

  Furthermore, the photocurable thermosetting resin composition of the present invention is a known and commonly used material such as hydroquinone, hydroquinone monomethyl ether, t-butylcatechol, pyrogallol, phenothiazine, etc. Known and conventional additives such as thermal polymerization inhibitors, silicone-based, fluorine-based, polymer-based antifoaming agents and / or leveling agents, imidazole-based, thiazole-based, triazole-based silane coupling agents, etc. Can be blended.

(Use)
The photocurable thermosetting resin composition of the present invention having the above composition is diluted as necessary to adjust the viscosity to be suitable for the coating method, and this is applied to, for example, a printed wiring board on which a circuit is formed. It is applied by screen printing method, curtain coating method, spray coating method, dip coating method, roll coating method, etc., for example, by evaporating and drying the organic solvent contained in the composition at a temperature of 60 to 100 ° C. A free coating film can be formed.

  In particular, the composition of the present invention is effective for construction methods using a low-viscosity composition such as curtain coating, spray coating, and dip coating.

  Then, the resist pattern can be formed by selectively exposing with an active energy ray through a photomask having a predetermined pattern, and developing the unexposed portion with an alkaline aqueous solution. Irradiation with active energy rays after curing or final finish curing (main curing) only by heat curing, adhesion, hardness, solder heat resistance, chemical resistance, solvent resistance, electrical insulation, electric corrosion resistance, A cured film (solder resist film) excellent in resolution, plating resistance, PCT resistance, and moisture absorption resistance is formed. In particular, by taking a step of heat curing after irradiation with active energy rays or irradiation of active energy rays after heat curing, unreacted photosensitive groups reacted and were excellent in electric resistance, plating resistance, and moisture absorption resistance. A cured coating can be obtained.

  As the alkaline aqueous solution used for the development, alkaline aqueous solutions such as potassium hydroxide, sodium hydroxide, sodium carbonate, potassium carbonate, sodium phosphate, sodium silicate, ammonia, amines and the like can be used. As the irradiation light source for photocuring, a low-pressure mercury lamp, a medium-pressure mercury lamp, a high-pressure mercury lamp, an ultrahigh-pressure mercury lamp, a xenon lamp, a metal halide lamp, or the like is appropriate. In addition, laser beams and the like can also be used as active energy rays.

  Hereinafter, although this invention is demonstrated concretely, showing Examples 1-11, it cannot be overemphasized that this invention is not limited to the following example. In the following description, “part” means “part by mass” unless otherwise specified.

Synthesis Example 215 parts of cresol novolac type epoxy resin N-680 (DIC, epoxy equivalent = 215) was placed in a four-necked flask equipped with a stirrer and a reflux condenser, and 196 parts of propylene glycol monomethyl ether acetate was added. Dissolved by heating. Next, 0.46 parts of methylhydroquinone as a polymerization inhibitor and 1.38 parts of triphenylphosphine as a reaction catalyst were added. This mixture was heated to 95-105 ° C., 72.0 parts (1.0 equivalent) of acrylic acid was gradually added dropwise and reacted for about 32 hours to obtain a reaction product having an acid value of 0.9 mgKOH / g. . This reaction product (hydroxyl group: 1 equivalent) was cooled to 80 to 90 ° C., 76.0 parts (0.5 equivalent) of tetrahydrophthalic anhydride was added, allowed to react for about 8 hours, cooled and taken out. The carboxyl group-containing resin (A) thus obtained had a nonvolatile content of 65% and a solid acid value of 77 mgKOH / g. Hereinafter, this varnish is referred to as A-1 varnish.

  The compounding components shown in Table 1 using the carboxyl group-containing resin varnish (A-1 varnish) obtained in the above synthesis example were kneaded with a three-roll mill to obtain each main component of the photocurable thermosetting resin composition. It was. Moreover, the compounding component shown in Table 1 was knead | mixed with the 3 roll mill, and the hardening | curing agent of the said photocurable thermosetting resin composition was obtained.

In addition, the obtained photocurable thermosetting resin composition was adjusted with propylene glycol monomethyl ether acetate so that a viscosity might be set to about 200 dPa * s.

Remarks Irgacure 907: Photopolymerization initiator fluorine-containing block copolymer manufactured by BASF: MODIPER F600 manufactured by NOF Corporation
Polyether polymer having an alkyl fluoride group: OMNOVA SOLUSONS INC. PF-6320
TEPIC: Nissan Chemical Co., Ltd., triglycidyl isocyanurate DPHA: Nippon Kayaku Co., Ltd., dipentaerythritol hexaacrylate The evaluation described in Table 1 is based on the following criteria.

[Color separation]
After 1 hour while circulating on the curtain coater, the presence or absence of color separation in the tank was visually confirmed.

○: No color separation.

Δ: Color separation occurs in a part of the tank.

X: Color separation occurs in most of the tank.

[Defoaming]
After 10 minutes while circulating in the curtain coater, the defoaming property in the tank and after coating the substrate (circuit thickness: 50 μm) was confirmed.

○: Good antifoaming properties both in the tank and after coating the substrate.

Δ: Some bubbling in the tank. However, it has good antifoaming properties after substrate coating.

X: Bubbles in the tank. Moreover, the defoaming property after application | coating of a board | substrate is also bad.

[Marking adhesion]
The marking ink was printed on the substrate on which the solder resist was formed and cured.

About the obtained marking, the presence or absence of peeling of a marking was confirmed after 10 reciprocations by hand using a 9H pencil.

○: Marking is not peeled off.

Δ: Marking is hardly peeled off.

X: Marking peeled off a lot.

  From Table 1, no color separation occurred in any of Examples 1 to 10 in which the fluorine-containing additive according to the present invention was blended. In particular, Examples 1-4 and Examples 6-9 were excellent in antifoaming properties and marking adhesion.

Claims (2)

(A) a carboxyl group-containing resin having one or more carboxyl groups in one molecule, (B) a photopolymerization initiator, (C) a fluorine-containing block copolymer and / or a polyether polymer having a fluorinated alkyl group, (D A curable resin composition comprising a diluent), (E) a colorant, and (F) an epoxy resin.   A printed wiring board comprising a solder resist layer and / or a resin insulation layer obtained by curing the curable resin composition according to claim 1.