JP2011216042A - Panel, touch panel, and method of manufacturing the panel - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a panel, a touch panel, and a method of manufacturing the panel by bonding substrates having light shielding areas with an UV-curable adhesive.SOLUTION: The touch panel 2 has a translucent ultraviolet ray emitting layer 96 formed on a cover glass-side light shielding area 99, for bonding a sensor substrate 20 with a sensor substrate-side light shielding area 29 and a cover glass 90 with the cover glass-side light shielding area 99. The sensor substrate 20 and the cover glass 90 are superposed across an uncured ultraviolet curing adhesive 94. The cover glass 90 is then laterally irradiated with ultraviolet ray. As a result, the ultraviolet ray emitting layer 96 functions as a light guide layer to allow the ultraviolet ray to reach the adhesive 94 located between the light shielding area 29 and the light shielding area 99.

Description

  The present invention relates to a panel, a touch panel, and a panel manufacturing method in which substrates having light-shielding regions are bonded together with an adhesive.

  Liquid crystal devices and touch panels have a panel structure in which substrates are bonded together with an adhesive. For example, in a capacitive touch panel, a position detection electrode is formed on one surface of a sensor substrate, and a translucent cover is bonded to one surface of the glass substrate with an adhesive (Patent Document). 1).

  Here, in the sensor substrate, as shown in FIG. 9, the sensor substrate side light-shielding region 29 is configured by the wiring 27 having the metal layer 4 c in the peripheral region outside the input region. The light shielding layer 91 formed in the overlapping area constitutes the cover glass side light shielding area 99. When the sensor substrate 20 and the cover glass 90 having such a configuration are bonded with the adhesive 94X, if an ultraviolet curable adhesive is used as the adhesive 94X, the sensor substrate side light shielding region 29 and the cover glass side light shielding region 99 overlap. In the region, the adhesive 94X cannot be cured. That is, as indicated by an arrow L11, even when ultraviolet rays are irradiated from the cover glass 90 side, the ultraviolet rays are blocked by the light shielding layer 91 (cover glass side light shielding region 99). Further, as indicated by an arrow L12, even if ultraviolet rays are irradiated from the sensor substrate 20 side, the ultraviolet rays are blocked by the wiring 27 (sensor substrate side light shielding region 29). Further, as indicated by an arrow L13, even if ultraviolet rays are irradiated from the side, the ultraviolet rays do not reach the inside of the adhesive 94X, and only the surface of the adhesive 94X is cured. Therefore, a thermosetting adhesive is generally used to bond substrates having light-shielding regions together. Such a situation is not limited to the touch panel, but is present in all panels in which substrates having light shielding regions are bonded together.

JP 2009-259203 A

  However, in the case of a thermosetting adhesive, there is a problem that it takes a long time to cure, and heat resistance becomes a problem. For example, when at least one of a pair of substrates is a plastic substrate, or when a flexible wiring substrate is connected even if both of the pair of substrates are glass substrates, the heat resistance of the plastic substrate or the flexible wiring substrate, etc. Becomes a problem.

  In view of the above problems, an object of the present invention is to provide a panel, a touch panel, and a method for manufacturing a panel, which can be bonded to each other with an ultraviolet curable adhesive even between substrates having a light shielding region. is there.

  In order to solve the above problems, a panel according to the present invention includes a first substrate having a first substrate-side light shielding region, a second substrate having a second substrate-side light shielding region, and the first substrate-side light shielding region. And an ultraviolet curable adhesive layer for bonding the first substrate and the second substrate in a region overlapping both the second substrate side light shielding region, the second substrate side light shielding region and the ultraviolet curable adhesive layer, And an ultraviolet ray emitting layer that emits ultraviolet rays when electromagnetic waves are incident thereon.

  In the present invention, when the substrates having the light shielding region are bonded to each other with an adhesive, an ultraviolet light emitting layer is provided between the second substrate side light shielding region and the ultraviolet curable adhesive layer. When an electromagnetic wave is incident, it emits ultraviolet rays. For this reason, even if it does not irradiate an ultraviolet curable adhesive layer directly between the 1st board | substrate side light-shielding area | region and the 2nd board | substrate side light-shielding area, an ultraviolet curable adhesion | attachment is carried out by the ultraviolet-ray radiate | emitted from the ultraviolet-ray output layer. The agent can be cured. Therefore, even if a thermosetting adhesive is not used, the substrates having a light shielding region can be bonded together with an adhesive.

  In the present invention, as the ultraviolet ray emitting layer, a light guiding layer that emits ultraviolet rays as the electromagnetic wave while propagating inside can be used.

  In this case, according to the present invention, the first substrate provided with the first substrate side light shielding region and the second substrate provided with the second substrate side light shielding region are combined with the first substrate side light shielding region and the second substrate side light shielding. A method for manufacturing a panel to be bonded by an adhesive provided in an area overlapping with both areas, an ultraviolet emitting layer forming step of forming a translucent ultraviolet emitting layer on the second substrate-side light-shielding area, and uncured A step of superimposing the first substrate and the second substrate with the ultraviolet curable adhesive as an adhesive, and irradiating ultraviolet rays from the side of the second substrate to the ultraviolet emitting layer. And an electromagnetic wave irradiation step for making the light incident.

  In such a configuration, after forming a translucent ultraviolet emitting layer on the second substrate side light-shielding region, the first substrate and the second substrate are overlapped with an uncured ultraviolet curable adhesive interposed therebetween, and then the first substrate Two ultraviolet rays are irradiated from the side of the substrate. As a result, the translucent ultraviolet light emitting layer functions as a light guide layer, and the ultraviolet light can reach the ultraviolet curable adhesive. Therefore, even if a thermosetting adhesive is not used, substrates having a light shielding region can be bonded to each other with an ultraviolet curable adhesive.

  In the present invention, the ultraviolet light emitting layer may be a light emitting layer having fluorescence or phosphorescence that is excited by the electromagnetic wave and emits ultraviolet light. In the present invention, “fluorescence” means light emission by excitation of electrons, and includes “phosphorescence”.

  In this case, according to the present invention, the first substrate provided with the first substrate side light shielding region and the second substrate provided with the second substrate side light shielding region are combined with the first substrate side light shielding region and the second substrate side light shielding. A method for manufacturing a panel to be bonded by an adhesive provided in an area overlapping with both areas, wherein the second substrate side light-shielding area has fluorescence or phosphorescence that can be excited by electromagnetic waves and emit ultraviolet rays. An ultraviolet ray emission layer forming step for forming an ultraviolet ray emission layer, an electromagnetic wave irradiation step for irradiating the ultraviolet ray emission layer with an electromagnetic wave, an uncured ultraviolet curable adhesive as the adhesive, and the first substrate and the second substrate And an overlapping step of overlapping the substrate.

  In such a configuration, after forming an ultraviolet emitting layer having fluorescence or phosphorescence on the second substrate-side light-shielding region, an electromagnetic wave is irradiated to the ultraviolet emitting layer, and then an uncured ultraviolet curable adhesive is sandwiched between them. The first substrate and the second substrate are overlaid. As a result, the ultraviolet curable adhesive can be cured by the ultraviolet light emitted from the ultraviolet light emitting layer. Therefore, even if a thermosetting adhesive is not used, substrates having a light shielding region can be bonded to each other with an ultraviolet curable adhesive.

  The panel according to the present invention can be configured as a touch panel, for example. In this case, the first substrate is a touch panel substrate in which the first substrate-side light-shielding region is formed by light-shielding peripheral wiring formed in a peripheral region outside the input region, and the second substrate is A configuration of a cover glass in which the second substrate-side light-shielding region is formed by a light-shielding layer formed in a region overlapping with the peripheral region can be employed.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an explanatory diagram schematically illustrating an overall configuration of an electro-optical device with an input function including a touch panel (panel) according to Embodiment 1 of the present invention. 1 is an explanatory diagram schematically showing a cross-sectional configuration of an electro-optical device with an input function according to a first embodiment of the present invention. It is explanatory drawing which shows schematic structure, such as a sensor board | substrate used for the touchscreen which concerns on Embodiment 1 of this invention. It is process sectional drawing which shows the manufacturing method of the touchscreen which concerns on Embodiment 1 of this invention. It is explanatory drawing of the ultraviolet-ray output layer used for the touchscreen which concerns on Embodiment 1 of this invention. It is process sectional drawing which shows the manufacturing method of the touchscreen which concerns on Embodiment 2 of this invention. It is explanatory drawing of the ultraviolet-ray output layer used for the touchscreen which concerns on Embodiment 2 of this invention. It is explanatory drawing of the electronic device provided with the electro-optical apparatus with an input function to which this invention is applied. It is explanatory drawing which shows the structure of the conventional panel.

  Embodiments of the present invention will be described with reference to the drawings. In the drawings to be referred to in the following description, the scales are different for each layer and each member so that each layer and each member have a size that can be recognized on the drawing. Moreover, in the following description, the touch panel which bonded the cover glass to the sensor board | substrate is illustrated as a panel which bonded together the board | substrate provided with the light shielding area | region. The sensor substrate is described as a first substrate and the cover glass is described as a second substrate.

[Embodiment 1]
(Overall configuration of electro-optical device with input function)
FIG. 1 is an explanatory diagram schematically showing the overall configuration of an electro-optical device with an input function including a touch panel (panel) according to Embodiment 1 of the present invention. FIGS. FIG. 2 is a perspective view of a state in which a cover glass (translucent substrate) is removed from an electro-optical device with an input function, and a plan view of the electro-optical device with an input function. FIG. 2 is an explanatory diagram schematically showing a cross-sectional configuration of the electro-optical device with an input function according to the first embodiment of the present invention.

  In FIG. 1, an electro-optical device 100 with an input function according to the present embodiment is generally an image generating device 5 composed of a liquid crystal device or the like, and an input that is arranged so as to overlap the surface on the display light emitting side in the image generating device 5. Device 1. The input device 1 includes a capacitive touch panel 2, and the image generation device 5 includes a liquid crystal panel as an electro-optical panel 5a (display panel). In this embodiment, both the touch panel 2 and the electro-optical panel 5a have a rectangular planar shape, and the center area when the touch panel 2 and the electro-optical panel 5a are viewed in plan is the input area 2a. Further, an area that overlaps the input area 2a in plan view in the electro-optical panel 5a is an image forming area 5c. In the electro-optical panel 5a, the flexible wiring board 73 is connected to the side where the end 20e is located among the four ends 20e to 20h of the touch panel 2. In the touch panel 2, the flexible wiring board 35 on which the driving IC 350 is mounted is connected to the side where the end 20 e is located.

  1 and 2, an image generation device 5 is a transmissive or transflective active matrix liquid crystal display device, and is opposite to the side on which the touch panel 2 is disposed with respect to the electro-optical panel 5a. A backlight device (not shown) is disposed on the side opposite to the display light emission side. The backlight device includes, for example, a translucent light guide plate that is disposed on the side opposite to the side on which the touch panel 2 is disposed with respect to the electro-optical panel 5a, and a white color toward the side end of the light guide plate. A light source such as a light emitting diode that emits light, etc., and the light emitted from the light source is incident on the side edge of the light guide plate and then emitted toward the electro-optical panel 5a while propagating through the light guide plate. Is done. A sheet-like optical member such as a light scattering sheet or a prism sheet may be disposed between the light guide plate and the electro-optical panel 5a.

  In the image generating apparatus 5, a first polarizing plate 81 is placed on the electroluminescent panel 5a on the display light emission side, and a second polarizing plate 82 is placed on the opposite side. The electro-optical panel 5a includes a light-transmitting element substrate 50 disposed on the side opposite to the display light emission side, and a light-transmitting counter element disposed opposite to the element substrate 50 on the display light emission side. And a substrate 60. The counter substrate 60 and the element substrate 50 are bonded to each other with a rectangular frame-shaped sealing material 71, and the liquid crystal layer 55 is held in a region surrounded by the sealing material 71 between the counter substrate 60 and the element substrate 50. ing. In the element substrate 50, a plurality of pixel electrodes 58 are formed on a surface facing the counter substrate 60 by a translucent conductive film such as an ITO (Indium Tin Oxide) film or an IZO (Indium Zinc Oxide) film. A common electrode 68 is formed of a light-transmitting conductive film such as an ITO film on the surface facing the element substrate 50. Further, a color filter is formed on the counter substrate 60. When the electro-optical panel 5a is an IPS (In Plane Switching) method or an FFS (Fringe Field Switching) method, the common electrode 68 is provided on the element substrate 50 side. Further, the element substrate 50 may be arranged on the display light emitting side with respect to the counter substrate 60. In the element substrate 50, a driving IC 75 is COG-mounted in an overhang region 59 projecting from the edge of the counter substrate 60, and a flexible wiring board 73 is connected to the overhang region 59. Note that a drive circuit may be formed on the element substrate 50 simultaneously with the switching elements on the element substrate 50.

(Detailed Configuration of Capacitance Type Input Device 1)
In the input device 1 shown in FIG. 2, the touch panel 2 includes a sensor substrate 20 made of a glass substrate. In this embodiment, the sensor substrate 20 is a glass substrate. Hereinafter, in the sensor substrate 20, the side on which electrodes and the like described below are formed will be described as a first surface 20a, and the opposite side will be described as a second surface 20b.

  As will be described in detail later, the first light-transmitting conductive film 4a, the interlayer insulating film 214, and the second light-transmitting conductive material are formed on the first surface 20a of the sensor substrate 20 from the lower layer side to the upper layer side as viewed from the sensor substrate 20. The film 4b and the translucent overcoat layer 22 are formed, and the input position is detected by the first translucent conductive film 4a out of the first translucent conductive film 4a and the second translucent conductive film 4b. A working electrode 21 is formed. A cover glass 90 made of chemically strengthened glass or the like is attached to the sensor substrate 20 on the input operation side with an adhesive 94 or the like. On the cover glass 90, a black light-shielding layer 91 is printed in a region overlapping the outer region (peripheral region 2b) of the input region 2a on the sensor substrate 20, and the region surrounded by the light-shielding layer 91 is the input region 2a. It is. In this embodiment, the sensor substrate 20 has the first surface 20a on which electrodes and the like are formed facing the input operation side, but the second surface 20b opposite to the first surface 20a faces the input operation side. In some cases, the sensor substrate 20 may be disposed.

  Between the touch panel 2 and the electro-optical panel 5a, a shielding conductive film 31 in which a light-transmitting conductive film such as an ITO film is formed on a light-transmitting film is disposed. The conductive film 31 is bonded to the sensor substrate 20 with the adhesive layer 32, and the conductive film 31 prevents the potential change on the electro-optical panel 5a side from affecting the input position detection electrode 21 as noise. It has a function to do. If a sufficient distance can be secured between the electro-optical panel 5a and the input position detection electrode 21, the conductive film 99 may be omitted.

(Schematic configuration of electrodes of input device 1)
FIG. 3 is an explanatory diagram showing a schematic configuration of the sensor substrate 20 and the like used in the touch panel 2 according to Embodiment 1 of the present invention, and FIGS. 3A and 3B are plan configurations of the sensor substrate 20 and the like. It is explanatory drawing which shows, and explanatory drawing which shows a cross-sectional structure. In FIG. 3A, the corner of the input area 2a is indicated by an English letter “L” mark. FIG. 3B schematically shows a cross section taken along the line CC ′ of the sensor substrate 20.

  As shown in FIG. 3A, in the capacitance-type input device 1 of the present embodiment, the input extending on the first surface 20a of the sensor substrate 20 in the X direction (first direction) in the input region 2a. A plurality of first electrodes 211 for position detection and a plurality of second electrodes 212 for input position detection extending in the Y direction (second direction) intersecting the X direction in the input region 2a are formed, These first electrode 211 and second electrode 212 form an input position detection electrode 21.

  Further, on the first surface 20 a of the sensor substrate 20, the peripheral region 2 b corresponding to the outside of the input region 2 a has a wiring 27 extending from one end portion of the first electrode 211 and one side of the second electrode 212. A wiring 27 extending from the end is formed. In addition, the wiring 27 extends to the mounting area 240 provided with the end 20 e, and the mounting terminals 24 including the end of the wiring 27 are arranged in the mounting area 240. The flexible wiring board 35 is connected to the mounting area 240. Here, the black light shielding layer 91 of the cover glass 90 shown in FIG. 1B and FIG. 2 overlaps the wiring 27 so that the wiring 27 cannot be seen from the input operation surface side. .

  As shown in FIG. 3B, in the capacitance-type input device 1 according to the present embodiment, the first surface 20a of the sensor substrate 20 is provided on the first surface 20a side from the lower layer side to the upper layer side as viewed from the sensor substrate 20. The first translucent conductive film 4a, the interlayer insulating film 214, the second translucent conductive film 4b, and the overcoat layer 22 are sequentially formed. Further, on the first surface 20 a side of the sensor substrate 20, a portion of the first light-transmitting conductive film 4 a that forms the wiring 27 (lower wiring layer 271) has the first light-transmitting conductive film 4 a. An upper wiring layer 272 made of the metal layer 4c is formed on the upper surface. In the wiring 27, the metal layer 4c may be formed on the lower layer side of the first light-transmissive conductive film 4a.

  Therefore, in the sensor substrate 20, the region through which the wiring 27 passes is a sensor substrate side light shielding region 29 by the metal layer 4c. In the cover glass 90, the region overlapping the sensor substrate side light shielding region 29 is the light shielding layer. The cover glass side light shielding area 99 is formed by 91.

  In this embodiment, the first light-transmitting conductive film 4a is made of a polycrystalline ITO film, and a light-transmitting insulating film such as a photosensitive resin film or a silicon oxide film is formed on the upper layer side of the first light-transmitting conductive film 4a. An interlayer insulating film 214 made of is formed. In the present embodiment, the second translucent conductive film 4b is also made of a polycrystalline ITO film, like the first translucent conductive film 4a. The first surface 20a of the sensor substrate 20 may be provided with a light-transmitting base protective layer made of a silicon oxide film or the like on the entire surface. In this case, the first light-transmitting layer is formed on the base protective layer. The conductive conductive film 4a and the second translucent conductive film 4b are sequentially stacked.

  In the capacitance-type input device 1 of the present embodiment, the first light-transmissive conductive film 4a is first formed as a plurality of rhombus regions in the input region 2a. The pad portions 211a and 212a (large area portion) of the first electrode 211 and the second electrode 212) are configured. These pad portions 211a and 212a are alternately arranged in the X direction and the Y direction. In the plurality of pad portions 211a, adjacent pad portions 211a in the X direction (first direction) are connected via a connecting portion 211c, and the pad portion 211a and the connecting portion 211c extend in the X direction. Is configured. On the other hand, the plurality of pad portions 212a constitute the second electrode 212 extending in the Y direction (second direction), but overlap between the pad portions 212a adjacent in the Y direction, that is, the connecting portion 211c. The portion is a discontinuous portion 218a.

  The interlayer insulating film 214 is formed in a wide region from the input region 2a to the peripheral region 2b. A contact hole 214a is formed in the interlayer insulating film 214, and the contact hole 214a is formed at a position overlapping the end portion facing the gap portion 218a in the pad portion 212a. On the upper layer side of the interlayer insulating film 214, the second light-transmissive conductive film 4b is formed as a relay electrode 215 in a region overlapping with the contact hole 214a. Furthermore, an overcoat layer 22 made of a photosensitive resin or the like is formed on substantially the entire surface of the sensor substrate 20 on the upper layer side of the second light-transmissive conductive film 4b.

  In the capacitance-type input device 1 configured as described above, the first electrode 211 and the second electrode 212 are formed of the same conductive film (first translucent conductive film 4a) and intersect each other. Therefore, an intersection 218 where the first electrode 211 and the second electrode 212 intersect exists on the sensor substrate 20. Here, of the first electrode 211 and the second electrode 212, the first electrode 211 extends in the X direction by the connecting portion 211c made of the second light-transmissive conductive film 4b even at the intersection 218. On the other hand, the second electrode 212 has a discontinuous portion 218 a at the intersection 218. However, at the intersection 218, a relay electrode 215 is formed in the upper layer of the interlayer insulating film 214, and the relay electrode 215 is adjacent to the pad adjacent to the interrupted portion 218a through the contact hole 214a of the interlayer insulating film 214. 212a is electrically connected. For this reason, the second electrode 212 extends in the Y direction while being electrically connected in the Y direction. Note that the relay electrode 215 overlaps the connecting portion 211c with the interlayer insulating film 214 interposed therebetween, so there is no possibility of short circuit.

(Lamination structure)
In the touch panel 2 of this embodiment, the sensor substrate 20 has a sensor substrate side light shielding region 29 due to the light shielding wiring 27, and the cover glass 90 has a cover glass side light shielding region 99 due to the light shielding layer 91. Nevertheless, the entire first surface 20 a side of the sensor substrate 20 is bonded to the cover glass 90 with the ultraviolet curable adhesive 94.

  In adopting such a bonding structure, in this embodiment, in the cover glass 90, the upper layer of the light shielding layer 91 (the side on which the sensor substrate 20 and the ultraviolet curable adhesive 94 are located) overlaps the entire light shielding layer 91. An ultraviolet ray emitting layer 96 that emits ultraviolet rays when electromagnetic waves are incident is formed. Therefore, in this embodiment, as described below with reference to FIGS. 4 and 5, the ultraviolet light emitting layer 96 is used to overlap the sensor substrate side light shielding region 29 and the cover glass side light shielding region 99. The ultraviolet curable adhesive 94 positioned is also properly cured.

  In this embodiment, a light-transmitting layer is formed as the ultraviolet emitting layer 96, and the ultraviolet emitting layer 96 detects ultraviolet rays emitted from the side of the cover glass 90 as described below. It functions as a light guide layer that leads to the ultraviolet curable adhesive 94 positioned between the substrate side light shielding region 29 and the cover glass side light shielding region 99.

(Method for manufacturing touch panel 2)
FIG. 4 is a process cross-sectional view illustrating the manufacturing method of the touch panel 2 according to Embodiment 1 of the present invention. FIG. 5 is an explanatory diagram of the ultraviolet light emitting layer 96 used in the touch panel 2 according to Embodiment 1 of the present invention. Note that the feature of this embodiment is that the ultraviolet curable adhesive is cured even in a region that overlaps the light shielding region. Therefore, in FIG. 4, the sensor substrate 20 passes through the end 20 h on the side where the wiring 27 extends. A cross section is shown.

  When manufacturing the touch panel 2 of this embodiment, as shown in FIG. 4A, the cover glass 90 is positioned on the outer peripheral side of the input region 2 a of the sensor substrate 20 on the surface side to be bonded to the sensor substrate 20. A black light shielding layer 91 (cover glass side light shielding area 99) is formed in the area to be printed by printing or the like.

  Next, in the ultraviolet emission layer forming step shown in FIG. 4B, an ultraviolet emission layer 96 made of a translucent resin layer or the like is formed on the light shielding layer 91 in the cover glass 90. The ultraviolet emitting layer 96 is formed by using printing or photolithography technology.

  Next, in the overlapping process shown in FIGS. 4C and 4D, the sensor substrate 20 and the cover glass 90 are overlapped with the uncured ultraviolet curable adhesive 94 interposed therebetween. More specifically, as shown in FIG. 4C, after uncured UV curable adhesive 94 is applied to a predetermined region of the cover glass 90, the sensor substrate 20 is then turned on as shown in FIG. And the cover glass 90 are overlapped. As a result, the uncured ultraviolet curable adhesive 94 spreads between the sensor substrate 20 and the cover glass 90, and the uncured ultraviolet curable adhesive 94 spreads over substantially the entire surface of the sensor substrate 20. Therefore, an uncured ultraviolet curable adhesive 94 is also provided between the sensor substrate side light shielding region 29 where the wiring 27 extends in the sensor substrate 20 and the cover glass side light shielding region 99 where the light shielding layer 91 exists in the cover glass 90. Exists. In this embodiment, after the flexible wiring board 35 is connected to the sensor board 20, an overlaying process is performed.

  Next, in the electromagnetic wave irradiation step shown in FIG. 4E, first, ultraviolet rays (electromagnetic waves) are irradiated from the side of the cover glass 90 as indicated by an arrow L3. In this embodiment, ultraviolet rays are irradiated simultaneously or sequentially from all directions of the four sides of the cover glass 90.

  As a result, as shown in FIG. 5, the light-transmitting ultraviolet light emitting layer 96 functions as a light guide layer, and the uncured ultraviolet light curing located between the sensor substrate side light shielding region 29 and the cover glass side light shielding region 99. The adhesive adhesive 94 is also irradiated with ultraviolet rays. That is, the ultraviolet light incident from the end of the translucent ultraviolet light emitting layer 96 is reflected in both directions of the ultraviolet light emitting layer 96 in the in-plane direction of the cover glass 90 as indicated by an arrow L1a in FIG. Propagating. Meanwhile, the ultraviolet rays are emitted from the surface of the ultraviolet ray emitting layer 96 that contacts the ultraviolet curable adhesive 94. Accordingly, the entire ultraviolet curable adhesive 94 positioned between the sensor substrate side light shielding region 29 and the cover glass side light shielding region 99 is irradiated with ultraviolet rays, so that the sensor substrate side light shielding region 29 and the cover glass side light shielding region 99 are In the meantime, the ultraviolet curable adhesive 94 is cured.

  Further, since the ultraviolet rays reach the entire ultraviolet curable adhesive 94 located between the region where the flexible wiring substrate 35 is connected in the sensor substrate 20 and the cover glass side light shielding region 99, the flexible wiring substrate 35 is connected. The ultraviolet curable adhesive 94 located between the area where the light is shielded and the cover glass side light shielding area 99 is also cured.

  Next, as indicated by an arrow L1 in FIG. 4 (e), ultraviolet rays are irradiated from the side of the cover glass 90 to cure the ultraviolet curable adhesive 94 that exists in a position overlapping the region surrounded by the light shielding layer 91. Let Further, as shown by an arrow L2 in FIG. 4 (e), the ultraviolet curable adhesive 94 that irradiates ultraviolet rays from the sensor substrate 20 side and overlaps the region surrounded by the input region 2a, and the peripheral region 2b. The ultraviolet curable adhesive 94 that overlaps the region where the wiring 27 is not formed may be cured.

(Main effects of this form)
As described above, in this embodiment, the sensor substrate 20 (first substrate) including the sensor substrate side light shielding region 29 (first substrate side light shielding region) and the cover glass side light shielding region 99 (second substrate side light shielding region). When the cover glass 90 (second substrate) provided with the above is bonded with an adhesive, a translucent ultraviolet emitting layer 96 is formed on the cover glass-side light-shielding region 99. And the sensor board | substrate 20 and the cover glass 90 are piled up on both sides of the unhardened ultraviolet curable adhesive 94, and an ultraviolet-ray is irradiated from the side of the cover glass 90 after that. As a result, the translucent ultraviolet light emitting layer 96 functions as a light guide layer, and allows the ultraviolet light to reach the ultraviolet curable adhesive 94 positioned between the sensor substrate side light shielding region 29 and the cover glass side light shielding region 99. Can do. Therefore, without using a thermosetting adhesive, the ultraviolet ray curable adhesive 94 can be used to form the sensor substrate 20 having the sensor substrate-side light shielding region 29 and the cover glass 90 having the cover glass-side light shielding region 99. Can be pasted together.

[Embodiment 2]
FIG. 6 is a process cross-sectional view illustrating the manufacturing method of the touch panel 2 according to Embodiment 2 of the present invention. FIG. 7 is an explanatory diagram of the ultraviolet light emitting layer 96 used in the touch panel 2 according to Embodiment 2 of the present invention. Note that, as in the first embodiment, the feature of this embodiment is that the ultraviolet curable adhesive is cured even in a region overlapping with the light shielding region. Therefore, in FIG. 6, the wiring 27 extends in the sensor substrate 20. A section through the side end 20h is shown. In addition, since the basic configuration of the present embodiment is the same as that of the first embodiment, common portions are denoted by the same reference numerals and description thereof is omitted. For the structure of this embodiment, refer to FIG. 3 and the like used in the description of Embodiment 1.

  As shown in FIG. 6, also in the touch panel 2 of the present embodiment, as in the first embodiment, the sensor substrate 20 has a sensor substrate-side light shielding region 29 due to the light shielding wiring 27, and the cover glass 90 has a cover glass 90. The entire first surface 20 a side of the sensor substrate 20 is bonded to the cover glass 90 with the ultraviolet curable adhesive 94 in spite of the presence of the cover glass side light shielding region 99 due to the light shielding layer 91.

  In adopting such a bonding structure, in this embodiment, in the cover glass 90, the upper layer of the light shielding layer 91 (the side on which the sensor substrate 20 and the ultraviolet curable adhesive 94 are located) overlaps the entire light shielding layer 91. An ultraviolet ray emitting layer 96 that emits ultraviolet rays when excited by electromagnetic waves is formed.

  In this embodiment, a layer having fluorescence or phosphorescence is formed as the ultraviolet emitting layer 96, and the ultraviolet emitting layer 96 is formed by electromagnetic waves irradiated before the superposition process, as will be described below. Excited and emits ultraviolet rays toward the ultraviolet curable adhesive 94 positioned between the sensor substrate side light shielding region 29 and the cover glass side light shielding region 99 after the superposition process. Therefore, in this embodiment, as described below with reference to FIGS. 6 and 7, the ultraviolet light emitting layer 96 is used to overlap the sensor substrate side light shielding region 29 and the cover glass side light shielding region 99. The ultraviolet curable adhesive 94 positioned is also properly cured.

  When manufacturing the touch panel 2 of this embodiment, as shown in FIG. 6A, the cover glass 90 is positioned on the outer peripheral side of the input region 2 a of the sensor substrate 20 on the surface side to be bonded to the sensor substrate 20. A black light shielding layer 91 (cover glass side light shielding area 99) is formed in the area to be printed by printing or the like.

  Next, in the ultraviolet emission layer forming step shown in FIG. 6B, an ultraviolet emission layer 96 having fluorescence or phosphorescence is formed on the cover glass 90 on the light shielding layer 91. The ultraviolet emitting layer 96 is formed by using printing or photolithography technology. As the fluorescent material used for the ultraviolet emitting layer 96, various organic materials and various inorganic materials used in plasma displays and cathode ray tubes can be used. In addition, as the phosphorescent material used for the ultraviolet emitting layer 96, various organic materials, phosphorescent inorganic materials such as strontium aluminate, and the like can be used.

  Next, in the irradiation step shown in FIG. 6C, the ultraviolet ray emitting layer 96 is irradiated with electromagnetic waves as indicated by an arrow L4. At that time, as an electromagnetic wave, an electromagnetic wave having a wavelength shorter than that of ultraviolet rays is irradiated.

  Next, in the overlapping process shown in FIG. 6D, the sensor substrate 20 and the cover glass 90 are overlapped with the uncured ultraviolet curable adhesive 94 interposed therebetween. At that time, the uncured ultraviolet curable adhesive 94 may be applied to either the sensor substrate 20 or the cover glass 90 with respect to the uncured ultraviolet curable adhesive 94.

  When the sensor substrate 20 and the cover glass 90 are overlapped in this way, as indicated by an arrow L4a in FIG. 7, ultraviolet rays are emitted from the ultraviolet ray emission layer 96, and the sensor substrate side light shielding region 29 and the cover glass side light shielding are performed. The uncured UV curable adhesive 94 positioned between the region 99 is also irradiated with UV light. As a result, the ultraviolet curable adhesive 94 is cured between the sensor substrate side light shielding region 29 and the cover glass side light shielding region 99. Therefore, after the irradiation step, the superposition step is performed before the emission of ultraviolet rays from the ultraviolet ray emission layer 96 is completed.

  After that, as indicated by an arrow L1 in FIG. 6E, ultraviolet rays are irradiated from the cover glass 90 side, and the ultraviolet curable adhesive 94 existing at a position overlapping with the region surrounded by the light shielding layer 91 is removed. Harden. Further, as shown by an arrow L2 in FIG. 6 (e), the ultraviolet curable adhesive 94 that irradiates ultraviolet rays from the sensor substrate 20 side and overlaps the region surrounded by the input region 2a, and the peripheral region 2b. The ultraviolet curable adhesive 94 that overlaps the region where the wiring 27 is not formed may be cured.

  As described above, also in this embodiment, as in the second embodiment, the sensor substrate 20 (first substrate) including the sensor substrate-side light-shielding region 29 (first substrate-side light-shielding region) and the cover glass-side light shielding region 99 are provided. When the cover glass 90 (second substrate) provided with (second substrate side light shielding region) is bonded with an adhesive, an ultraviolet light emitting layer 96 is formed on the cover glass side light shielding region 99. In this embodiment, a layer having fluorescence and phosphorescence is formed as the ultraviolet light emitting layer 96. Therefore, if the sensor substrate 20 and the cover glass 90 are overlapped with the uncured ultraviolet curable adhesive 94 after the electromagnetic wave is irradiated to the ultraviolet light emitting layer 96, the ultraviolet light emitted from the ultraviolet light emitting layer 96 is ultraviolet cured. The adhesive 94 can be cured. Therefore, without using a thermosetting adhesive, the ultraviolet ray curable adhesive 94 can be used to form the sensor substrate 20 having the sensor substrate-side light shielding region 29 and the cover glass 90 having the cover glass-side light shielding region 99. Can be pasted together.

[Other embodiments]
In the above embodiment, the sensor substrate 20 is the first substrate, the cover glass 90 is the second substrate, and the ultraviolet emission layer 96 is provided on the cover glass 90 side, but the sensor substrate 20 is the second substrate and the cover glass. 90 may be the first substrate, and the ultraviolet light emitting layer 96 may be provided on the sensor substrate 20 side.

  In the above embodiment, the present invention is applied when the sensor substrate 20 and the cover glass 90 are bonded to each other in the capacitive touch panel 2. However, the capacitive touch panel, liquid crystal device, or organic electroluminescence is applied. In an electro-optical device such as a device, the present invention may be applied to form a panel in which substrates having light shielding regions are bonded together with an adhesive.

[Example of mounting on electronic devices]
An electronic apparatus to which the electro-optical device 100 with an input function according to the above-described embodiment is applied will be described. FIG. 8 is an explanatory diagram of an electronic apparatus including the electro-optical device 100 with an input function according to the first embodiment of the invention. FIG. 8A shows the configuration of a mobile personal computer including the electro-optical device 100 with an input function. The personal computer 2000 includes an electro-optical device 100 with an input function as a display unit and a main body 2010. The main body 2010 is provided with a power switch 2001 and a keyboard 2002. FIG. 8B shows a configuration of a mobile phone including the electro-optical device 100 with an input function. A cellular phone 3000 includes a plurality of operation buttons 3001, scroll buttons 3002, and the electro-optical device 100 with an input function as a display unit. By operating the scroll button 3002, the screen displayed on the electro-optical device 100 with an input function is scrolled. FIG. 8C shows the configuration of a personal digital assistant (PDA) to which the electro-optical device 100 with an input function is applied. The information portable terminal 4000 includes a plurality of operation buttons 4001, a power switch 4002, and the electro-optical device 100 with an input function as a display unit. When the power switch 4002 is operated, various types of information such as an address book and a schedule book are displayed on the electro-optical device 100 with an input function.

  As an electronic apparatus to which the electro-optical device 100 with an input function is applied, in addition to those shown in FIG. 8, a digital still camera, a liquid crystal television, a viewfinder type, a monitor direct-view type video tape recorder, a car navigation device, a pager, Examples include electronic notebooks, calculators, word processors, workstations, video phones, POS terminals, bank terminals, and other electronic devices. The electro-optical device 100 with an input function described above can be applied as a display unit of these various electronic devices.

1..Capacitance type input device, 2..Touch panel, 2a..Input region, 2b..Peripheral region, 5..Image generation device, 5a..Electro-optical panel, 20..Sensor substrate (first Substrate), 21 .. Input position detection electrode, 27 .. Wiring, 29 .. Sensor substrate side light shielding region (first substrate side light shielding region), 35 .. Flexible wiring substrate, 90 .. Cover glass (second substrate) , 91..., Light shielding layer, 94... UV curable adhesive, 96... UV light emitting layer, 99.. Cover glass side light shielding region (second substrate side light shielding region), 100.

Claims (6)

A first substrate having a first substrate-side light-shielding region;
A second substrate having a second substrate-side light-shielding region;
An ultraviolet curable adhesive layer for bonding the first substrate and the second substrate in a region overlapping both the first substrate-side light-shielding region and the second substrate-side light-shielding region;
An ultraviolet ray emitting layer that is provided between the second substrate side light-shielding region and the ultraviolet ray curable adhesive layer and emits ultraviolet rays when electromagnetic waves are incident thereon;
A panel characterized by comprising:   The panel according to claim 1, wherein the ultraviolet ray emitting layer is a light guide layer that emits the ultraviolet rays as the electromagnetic waves while propagating the ultraviolet rays therein.   The panel according to claim 1, wherein the ultraviolet light emitting layer is a light emitting layer having fluorescence or phosphorescence that is excited by the electromagnetic wave and emits ultraviolet light. A touch panel comprising the panel according to any one of claims 1 to 3,
The first substrate is a touch panel substrate in which the first substrate-side light-shielding region is formed by a light-shielding peripheral wiring formed in a peripheral region outside the input region,
The touch panel, wherein the second substrate is a cover glass in which the second substrate-side light shielding region is formed by a light shielding layer formed in a region overlapping with the peripheral region. The first substrate having the first substrate side light shielding region and the second substrate having the second substrate side light shielding region are overlapped with both the first substrate side light shielding region and the second substrate side light shielding region. A method for manufacturing a panel to be bonded by an adhesive provided,
An ultraviolet ray emitting layer forming step of forming a translucent ultraviolet ray emitting layer on the second substrate side light shielding region;
A superposition step of superposing the first substrate and the second substrate with an uncured ultraviolet curable adhesive sandwiched as the adhesive;
An electromagnetic wave irradiation step of irradiating ultraviolet rays from the side of the second substrate and causing the ultraviolet ray to enter the ultraviolet ray emitting layer;
A method for producing a panel, comprising: The first substrate having the first substrate side light shielding region and the second substrate having the second substrate side light shielding region are overlapped with both the first substrate side light shielding region and the second substrate side light shielding region. A method for manufacturing a panel to be bonded by an adhesive provided,
An ultraviolet ray emitting layer forming step of forming an ultraviolet ray emitting layer having fluorescence or phosphorescence that can be excited by electromagnetic waves and emit ultraviolet rays on the second substrate side light shielding region;
An electromagnetic wave irradiation step of irradiating the ultraviolet ray emitting layer with an electromagnetic wave;
A superposition step of superposing the first substrate and the second substrate with an uncured ultraviolet curable adhesive sandwiched as the adhesive;
A method for producing a panel, comprising:

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