JP2011211748A - Rfid tag - Google Patents

Rfid tag Download PDF

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Publication number
JP2011211748A
JP2011211748A JP2011130375A JP2011130375A JP2011211748A JP 2011211748 A JP2011211748 A JP 2011211748A JP 2011130375 A JP2011130375 A JP 2011130375A JP 2011130375 A JP2011130375 A JP 2011130375A JP 2011211748 A JP2011211748 A JP 2011211748A
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antenna pattern
dielectric substrate
rfid tag
ic chip
antenna
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JP2011130375A
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JP5460646B2 (en
Inventor
Takashi Iwakura
Kimihiro Kaneko
Tomohiro Mizuno
Yasuhiro Nishioka
Hirokatsu Okegawa
崇 岩倉
弘勝 桶川
友宏 水野
泰弘 西岡
公廣 金子
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Mitsubishi Electric Corp
三菱電機株式会社
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Priority to JP2011130375A priority patent/JP5460646B2/en
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Abstract

PROBLEM TO BE SOLVED To operate a UHF band, a microwave band, etc., which can operate with an RFID tag alone (including a molding material) regardless of the material of an installation surface such as metal or non-metal, and reduces the possibility of failure due to environmental change of the installation location. It is an object of the present invention to provide a novel RFID tag that can be used in a high frequency band and a manufacturing method thereof.
A dielectric substrate, an IC chip provided on one main surface of the dielectric substrate, and a first antenna electrically connected to one end of the IC chip and disposed on the one main surface. And a second antenna that is electrically connected to the other end of the IC chip, and is arranged from the one main surface through one side surface of the dielectric substrate to the other main surface of the dielectric substrate. It has a pattern and a molding material covering the dielectric substrate, and has a short line that short-circuits the first antenna pattern and the second antenna pattern.
[Selection] FIG.

Description

  The present invention relates to an RFID (Radio Frequency Identification) tag and a manufacturing method thereof. The RFID tag receives a command signal transmitted from a reader / writer and updates tag information stored in a memory according to the information of the command signal. The tag information is additionally recorded or the tag information is transmitted as a read signal to the RFID reader / writer, and is used for entrance / exit management of the living body / article, distribution management, and the like.

  The RFID system performs wireless communication between an RFID tag including an IC chip and an RFID reader / writer. RFID tags include a so-called active type tag that is mounted with a battery and driven by the electric power, and a so-called passive type tag that receives electric power from a reader / writer and drives it as a power source. The active tag has a battery compared to the passive type, so it has advantages in terms of communication distance and communication stability, but has a complicated structure and disadvantages such as an increase in size and cost. There is also. And with recent improvements in semiconductor technology, IC chips have become smaller and higher performance for passive tags, and the use of passive tags in a wide range of fields has been expanded by extending communication distance and improving communication stability. The situation is realized.

  In the passive induction tag, in the electromagnetic induction method applied to the RFID tag of the long wave band and the short wave band, a voltage is applied to the RFID tag by the electromagnetic induction action between the transmission antenna coil of the reader / writer and the antenna coil of the RFID tag. The IC chip is activated by this voltage to enable communication. Therefore, the RFID tag operates only within the induction electromagnetic field by the RFID reader / writer, and the communication distance becomes about several tens of centimeters. In addition, in radio frequency RFID tags such as UHF band and microwave band, the radio wave communication method is applied, and power is supplied to the IC chip of the RFID tag by radio waves, so the communication distance is about 1 to 8 m. And has improved significantly. Accordingly, RFID tags in high frequency bands such as UHF band and microwave band are collectively read and moved by a plurality of RFID tags that are difficult to realize in long wave band and short wave band RFID systems with short communication distances. RFID tags can be read, and the range of use is very wide.

  2. Description of the Related Art Conventionally, an RFID system includes a bidirectional wireless transmission / reception / radio tag transmission / reception common antenna that functions as a wireless tag receiving antenna that receives a signal transmitted from a wireless tag (RFID tag), that is, a wireless communication device such as a wireless LAN and an RFID. Some use an RFID reader / writer antenna that can be used for both communication with a tag (see, for example, Patent Document 1). On the other hand, for antennas used in wireless LAN, etc., a main radiation electrode is formed on the upper surface of a dielectric substrate (dielectric substrate), a sub radiation electrode is formed on the lower surface, and a sub radiation is formed on the side surface from the joint (feeding point). There is a surface-mounted antenna provided with a connecting electrode inclined from the center of the lower end to the upper right corner so as to connect the electrode and the main radiation electrode (see, for example, Patent Document 2). On the other hand, the RFID tag (wireless tag) has a structure similar to the surface-mounted antenna described in Patent Document 2, and has a top surface antenna portion (main radiation electrode) formed on a dielectric (dielectric substrate), A bottom antenna portion (sub-radiation electrode), a side antenna portion (connection electrode), and a tag IC (IC chip) are provided, and at least a top antenna portion, a bottom antenna portion, and a side antenna portion form one tag antenna. The tag IC is mounted on any one of the plurality of antenna portions forming the tag antenna, and the length including the upper surface antenna portion, tag IC, side antenna portion 4 and lower surface antenna portion is set to the communication frequency. The electrical length (λg) is set to approximately λg / 2 (λg is an equivalent wavelength including the dielectric constant effect of the dielectric). Accordingly, there is a wireless tag whose length is approximately λg / 4. (For example, refer to Patent Document 3). The tag IC is basically mounted at the feeding point of the antenna unit. FIG. 7 of Patent Document 3 shows a side antenna having a belt-like pattern that is inclined obliquely downward from the conductor end of the upper surface antenna portion toward the conductor end of the lower surface antenna portion.

  The other RFID tags are both formed on one flat surface (one surface) of a base material (film base material), and the first conductor pattern and the first relative pattern that are in a predetermined relative positional relationship by bending the base material. Two conductor patterns, an IC circuit portion electrically connected to both of the first conductor pattern and the second conductor pattern, and an insertion material (dielectric substrate) inserted between the bent base materials (See, for example, Patent Document 4), a dielectric substrate, a ground conductor provided on one main surface of the dielectric substrate, and provided on the other main surface of the dielectric substrate, A patch conductor portion having a slot; an electrical connection portion extending inward from an opposing portion of the slot; and an IC chip disposed inside the slot and connected to the electrical connection portion; (For example, see Patent Document 5) A flat dielectric member (dielectric substrate), a first gap between the first surface and the second surface of the dielectric member, and a second gap from the first surface of the dielectric member; There are ones including first and second loop antenna patterns that communicate with each of the surfaces, and an IC chip that is electrically connected to the first and second loop antenna patterns on one surface (for example, (See Patent Document 6).

  In addition, the RFID tag manufacturing method includes injection molding, and an RFID tag that covers the periphery of the tag inlet with a molding material is formed of an outer layer resin (molding material) that covers the built-in component (tag inlet), and the internal component is primarily molded The first molded part, which is a primary molded part in a state where a part of the built-in part is temporarily sealed, is injected into the inner surface of the mold for use in primary molding. Resin injection is performed with the concave and convex portions corresponding to the grooves and protrusions provided for the purpose of positioning and positioning the built-in parts on the inner surface of the mold, with the primary molded parts inserted and placed in the mold for secondary molding. A second molded part obtained by molding an unmolded part of the primary molded part (see, for example, Patent Document 7), a resin film base material, an antenna disposed, and Equipped with IC chip Using an IC tag member having a function as a non-contact type IC tag that is electrically connected to these as an inlet, in-mold molding is performed with a molding die, and a molding resin (mold material) is used as an exterior substrate. A non-contact type IC tag manufacturing method as described above, wherein a protective layer that protects the inlet against resin injection into the mold is attached to the surface of the inlet and then in-mold molded A substrate in which a mold resin is formed through a protective layer (see, for example, Patent Document 8), a substrate on which electronic components are mounted and an electronic circuit is formed (tag inlet), and a substrate A first cover formed by injection molding and disposed on the other surface side of the substrate and having a step portion on the outer peripheral edge of the storage portion. And touching One first are those consisting of the cover and a second cover secured together (e.g., see Patent Document 9).

  Further, there is an RFID tag configured by bending a flexible substrate (see, for example, Patent Document 10). A specific configuration of such an RFID tag (wireless tag) is that the antenna has a flexible substrate and a spacer, and the flexible substrate is bent with the formation surface of the radiation electrode or the like inside to form a microstrip antenna. ing. An IC (integrated circuit) chip is opposed to a spacer, and a concave portion larger than the IC chip is formed in the spacer at the opposed position. Therefore, in the assembled state, the IC chip is accommodated in the concave portion of the spacer, and the outer surface of the flexible substrate has no protruding portion and is a flat surface.

JP 2002-353852 A (FIG. 1) Japanese Patent Laid-Open No. 2003-332818 (FIGS. 1 to 6) JP 2005-191705 A (particularly FIGS. 1 to 10 and FIGS. 16 to 19) Japanese Patent Laying-Open No. 2007-221528 (FIG. 10) Japanese Patent Laid-Open No. 2007-243296 (FIG. 1) JP 2007-272264 A (FIGS. 1 to 5 and FIGS. 13 to 15) JP 2003-36431 A (FIG. 1) Japanese Patent Laying-Open No. 2005-332116 (FIGS. 1 and 2) Japanese Unexamined Patent Publication No. 2007-133617 (FIG. 1) JP 2008-42379 A (FIG. 5)

  However, in the RFID tags described in Patent Documents 3 to 5, the IC chip (tag IC, IC circuit portion) is exposed on the surface of the RFID tag, and there is a possibility that the IC chip breaks down due to external impact. There is a problem that there is. In addition, since the RFID tag described in Patent Documents 3 to 5 has an antenna pattern formed on a dielectric substrate, the RFID tag has a difference in linear expansion coefficient between the dielectric substrate and the conductor constituting the antenna pattern. There is also a problem that the antenna pattern may be peeled off from the dielectric substrate or the antenna pattern may be broken when the place where the tag is installed is a place where the temperature change is severe. In addition, paragraph number “0054” of Patent Document 4 states that “a protective layer is formed on the surface of the IC circuit portion, the first conductor pattern, and the second conductor pattern, and further the type and stored contents of the wireless tag on the surface. However, the description of the linear expansion coefficient between the first conductor pattern and the second conductor pattern (antenna pattern) and the intercalation material (dielectric substrate) and the details of the protective layer are described. There is no description of a typical configuration.

  Next, unlike the RFID tags described in Patent Documents 3 to 5, the RFID tag described in Patent Document 6 has an IC chip disposed in a recess formed in a dielectric substrate, so that the IC chip is protected. However, as with the RFID tags described in Patent Documents 3 to 5, the place where the RFID tag is installed is a place where the temperature change is severe due to the difference in the linear expansion coefficient between the dielectric substrate and the conductor constituting the antenna pattern. In this case, there is a problem that the antenna pattern may be peeled off from the dielectric substrate or the antenna pattern may be broken, as shown in FIG. The first and second loop antenna patterns, which are formed with a predetermined gap on the front and back surfaces of the dielectric substrate and communicate with the front and back surfaces of the dielectric substrate, respectively, and one surface ( Surface) is electrically connected to the IC chip, so that when the dielectric substrate expands or contracts due to heat, the connection portion between the IC chip and the first loop antenna pattern and the C chip and the second loop antenna There is a problem that a load is applied to both of the connection portions with the pattern, and the connection between the IC chip and the first and second loop antenna patterns may be disconnected. Furthermore, the RFID tag described in Patent Document 6 is premised on being attached to metal, and when being attached to other than metal, in order to operate as an RFID tag, the lower part of the RFID tag (the back surface of the dielectric substrate) In addition, it is necessary to laminate an insulating sheet and a metal sheet, and there is a problem that the structure of the RFID tag becomes complicated.

  In addition, in the RFID tag manufacturing method, particularly in the technique of covering the periphery of the tag inlet with a resin such as a molding material by injection molding, the one described in Patent Document 7 is based on the pressure and heat of the resin injected into the mold die. Primary molding die having a tag inlet antenna pattern and IC chip positioning grooves and protrusions to prevent the antenna pattern from being deformed or disconnected or from being disconnected from the IC pattern. In addition, there is a problem that it is necessary to use two molds for molding, including a mold for secondary molding that seals the tag inlet temporarily sealed by the mold for primary molding. Further, the one described in Patent Document 7 needs to change the internal shape of the primary molding die each time the antenna pattern or the arrangement of the IC chip is changed regardless of the outer dimensions of the RFID tag to be finally completed. There is also a problem that there is. On the other hand, the ones described in Patent Documents 8 and 9 are prepared in advance by producing portions corresponding to the lower portion of the RFID tag to be finally completed (the base portion and the lower cover) instead of performing the primary molding by the primary molding die. Then, after placing the tag inlet on the mold die and placing the tag inlet thereon, the resin is injected into the mold die, so that only one mold die is required. On the other hand, the ones described in Patent Documents 8 and 9 do not temporarily seal the tag inlet, so that the antenna pattern may be deformed or disconnected due to the pressure or heat of the resin injected into the mold. In order to avoid disconnection between the IC chip and the IC chip, there is a problem that it is necessary to provide a layer (protective layer, heat-resistant sheet) on the tag inlet in order to prevent the resin from directly touching the tag inlet. .

  Here, when the antenna patterns described in Patent Documents 7 to 9 are examined, from the technical term of antenna coil (coil antenna) in Patent Documents 7 to 9, the RFID tag manufacturing method described in Patent Documents 7 to 9 is used. Is based on the premise that it is applied to RFID tags used in the electromagnetic induction system of the long wave band and the short wave band. RFID tags and antenna patterns of high frequency bands such as UHF band and microwave band are used. When compared, the antenna coil (coil antenna) of the RFID tag described in Patent Documents 7 to 9 has a fine or complicated pattern, and the above-described high frequency is affected by the pressure and heat of the resin injected into the mold. It is conceivable that it is larger than the band RFID tag. In other words, the problems described in Patent Documents 7 to 9 may not necessarily be a problem for the above-described high frequency band RFID tags. In addition, in paragraph number “0014” of Patent Document 8, “as an IC tag member serving as an inlet, an antenna coil is disposed on a base material made of a resin film shown in FIG. An IC chip mounted and electrically connected is used. As an IC tag member applicable in the method of manufacturing a non-contact type IC tag of the present invention, the IC tag member shown in FIG. Although there is a description that “it is not limited”, it is unclear whether the IC tag member is other than the electromagnetic induction type.

  Since the RFID tag described in Patent Document 10 is a microstrip antenna, the surface of the ground conductor can be attached to a metal, but there are the following problems in structure and manufacturing. First, the structural problem is that “the portion where the flexible substrate is bent (hereinafter referred to as a corner portion) is difficult to adhere. Therefore, there is a possibility that peeling will proceed from the corner portion when it is bent.” “Dielectric By using a flexible substrate material for the body (base material), the springback after bending the conductor and flexible substrate becomes larger, leading to peeling.When bent, the IC chip and the hole may interfere. " There is a problem such as “the flexible substrate itself may be wrinkled or peeled off because the curvature changes depending on the location when it is bent.” Next, the manufacturing issues are: “Dielectrics are flexible substrates that are difficult to position during bonding.” “Adhesion work is difficult.” “It is considered difficult to stabilize the adhesion work. There is a problem such as “

  The present invention has been made to solve the above-described problems, and can operate regardless of the material of the installation surface, such as metal or non-metal, using an RFID tag alone (including a molding material), and the environment of the installation location. It is an object of the present invention to provide a novel RFID tag that can be used in a high frequency band such as a UHF band and a microwave band with reduced possibility of failure due to a change.

  An RFID tag according to a first aspect of the present invention is a dielectric substrate, an IC chip provided on one principal surface of the dielectric substrate, and electrically connected to one end of the IC chip, on the one principal surface. The first antenna pattern is electrically connected to the other end of the IC chip and extends from the one main surface through one side surface of the dielectric substrate to the other main surface of the dielectric substrate. A second antenna pattern arranged and a molding material covering the dielectric substrate, and having a short line that short-circuits the first antenna pattern and the second antenna pattern. is there.

  The RFID tag according to a second aspect of the present invention is the RFID tag according to the first aspect, wherein the one side surface is a side surface of the dielectric substrate closest to the IC chip or a side surface sharing one side with the side surface. Is.

  According to a third aspect of the present invention, there is provided an RFID tag including a dielectric base, an IC chip provided on one side of the dielectric base, and electrically connected to one end of the IC chip. A first antenna pattern disposed over one main surface of the substrate and a first antenna pattern electrically connected to the other end of the IC chip and disposed from the one side surface to the other main surface of the dielectric substrate; And a short line that short-circuits the first antenna pattern and the second antenna pattern. The antenna pattern includes two antenna patterns and a molding material that covers the dielectric substrate.

  An RFID tag according to a fourth aspect of the present invention is the RFID tag, wherein the dielectric base is rounded on the opposite sides of the one side surface on which the first antenna pattern or the second antenna pattern is disposed. It is a thing in any one of Claims 1-3.

  An RFID tag according to a fifth aspect of the present invention is the RFID tag according to any one of the first to fourth aspects, wherein the short line is integrated with the first antenna pattern and the second antenna pattern.

  The RFID tag according to a sixth aspect of the present invention is the RFID tag according to any one of the first to fifth aspects, wherein the short line is disposed on at least one of the one main surface, the one side surface, and the other main surface. belongs to.

  As described above, according to the first aspect of the invention, operation is possible regardless of the material of the installation surface such as metal or nonmetal, and the first antenna pattern and the second antenna pattern are short-circuited. Therefore, it is possible to obtain an RFID tag having a simple structure that does not require a through hole (excluding an IC chip hole) in the dielectric substrate.

  According to the second aspect of the invention, in addition to the effect of the first aspect of the invention, the IC is located at a substantially middle point of the total length (electric length) of the antenna pattern composed of the first antenna pattern and the second antenna pattern. Since the chip can be easily arranged, it is easy to adjust the antenna pattern as an antenna element, and an RFID tag that can operate regardless of the material of the installation surface such as metal or nonmetal can be obtained.

  According to the invention of claim 3, since the IC chip is arranged on one side surface of the dielectric substrate, even if a load is applied to the front and back surfaces of the dielectric substrate, the influence on the IC chip is small. Furthermore, the IC chip is arranged near the midpoint of the total length (electrical length) of the antenna pattern composed of the first antenna pattern and the second antenna pattern, compared to the case where the IC chip is provided on one main surface of the dielectric substrate. The antenna pattern can be easily adjusted as an antenna element, can be operated regardless of the material of the installation surface such as metal or non-metal, and the first antenna pattern and the second antenna pattern are short-circuited. Therefore, it is possible to obtain an RFID tag having a simple structure in which it is not necessary to provide a through hole (excluding an IC chip hole) in the dielectric substrate.

  According to the invention of claim 4, in addition to the effects of the inventions of claims 1 to 3, each of the opposing sides of one side surface of the dielectric substrate on which the first antenna pattern or the second antenna pattern is arranged is provided. Because it is rounded, the dielectric substrate expands and contracts due to changes in the installation environment such as temperature changes, and the load on the opposite side of one side of the dielectric substrate is distributed. The load applied to the first antenna pattern or the second antenna pattern can be reduced, and an RFID tag that can operate regardless of the material of the installation surface such as metal or nonmetal can be obtained.

  According to the invention according to claim 5, in addition to the effects of the invention according to claims 1 to 4, the first antenna pattern, the second antenna pattern, and the short line which are conductive patterns are integrated, so that the reliability is further improved. An RFID tag that can operate regardless of the material of the installation surface such as high metal or non-metal can be obtained.

  According to the invention of claim 6, in addition to the effects of the inventions of claims 1 to 5, the conductive pattern is arranged only on the minimum necessary surface of the dielectric substrate, and the change of the installation environment such as temperature change Thus, even when the dielectric substrate expands or contracts, an RFID tag that can operate regardless of the material of the installation surface such as metal or nonmetal that has little influence on the conductive pattern can be obtained.

It is a block diagram of the RFID tag which concerns on Embodiment 1 of this invention. It is a block diagram before the molding of the RFID tag which concerns on Embodiment 1 of this invention. It is a block diagram of the RFID tag which concerns on Embodiment 1 of this invention. It is a block diagram of the RFID tag which concerns on Embodiment 1 of this invention. It is a block diagram of the RFID tag which concerns on Embodiment 2 of this invention. It is a block diagram before the molding of the RFID tag which concerns on Embodiment 2 of this invention. It is a block diagram of the RFID tag which concerns on Embodiment 2 of this invention. It is explanatory drawing of the basic form of the RFID tag which concerns on this invention. It is a schematic diagram which shows the modification (part) of the antenna pattern of the RFID tag which concerns on Embodiment 1 and 2 of this invention. It is a schematic diagram which shows the modification (part) of the antenna pattern of the RFID tag which concerns on Embodiment 1 and 2 of this invention. It is a block diagram of the RFID tag which concerns on the modification of Embodiment 1 and 2 of this invention. It is a block diagram of the RFID tag which concerns on the modification of Embodiment 1 and 2 of this invention. It is a block diagram of the RFID tag which concerns on the modification of Embodiment 1 and 2 of this invention. It is an antenna pattern formation process and IC chip connection process figure of the manufacturing method of the RFID tag which concerns on Embodiment 3 and 4 of this invention. It is the antenna pattern enlarged view formed by the antenna pattern formation process of the manufacturing method of the RFID tag which concerns on Embodiment 3 and 4 of this invention. It is an antenna pattern external view manufactured by the antenna pattern formation process of the manufacturing method of the RFID tag which concerns on Embodiment 3 and 4 of this invention. It is an antenna pattern fixing process figure of the manufacturing method of the RFID tag which concerns on Embodiment 3 of this invention. It is an antenna pattern fixing process figure of the manufacturing method of the RFID tag which concerns on Embodiment 3 of this invention. It is an antenna pattern fixing process figure of the manufacturing method of the RFID tag which concerns on Embodiment 4 of this invention. It is an antenna pattern fixing process figure of the manufacturing method of the RFID tag which concerns on Embodiment 4 of this invention. It is an antenna pattern fixing process figure of the manufacturing method of the RFID tag which concerns on Embodiment 4 of this invention. It is an antenna pattern fixing process figure of the manufacturing method of the RFID tag which concerns on Embodiment 4 of this invention. It is an antenna pattern fixing process figure of the manufacturing method of the RFID tag which concerns on Embodiment 4 of this invention. It is an antenna pattern fixing process figure of the manufacturing method of the RFID tag which concerns on Embodiment 4 of this invention. It is sectional drawing of the metal mold | die (lower metal mold | die) used for the manufacturing method of the RFID tag which concerns on Embodiment 5 of this invention. It is sectional drawing of the metal mold | die for a mold used for the manufacturing method of the RFID tag which concerns on Embodiment 5 of this invention. It is sectional drawing which inject | poured resin into the metal mold | die for a mold used for the manufacturing method of the RFID tag which concerns on Embodiment 5 of this invention. It is a mold process figure (final process) of the manufacturing method of the RFID tag which concerns on Embodiment 5 of this invention. It is sectional drawing of the metal mold | die (lower metal mold | die) used for the manufacturing method of the RFID tag which concerns on Embodiment 5 of this invention. It is sectional drawing of the metal mold | die (lower metal mold | die) used for the manufacturing method of the RFID tag which concerns on Embodiment 5 of this invention. It is sectional drawing of the metal mold | die for a mold used for the manufacturing method of the RFID tag which concerns on Embodiment 5 of this invention. It is sectional drawing which inject | poured resin into the metal mold | die for a mold used for the manufacturing method of the RFID tag which concerns on Embodiment 5 of this invention. It is a mold process figure (final process) of the manufacturing method of the RFID tag which concerns on Embodiment 5 of this invention. It is sectional drawing of the metal mold | die (lower metal mold | die) used for the manufacturing method of the RFID tag which concerns on Embodiment 5 of this invention. It is sectional drawing of the metal mold | die for a mold used for the manufacturing method of the RFID tag which concerns on Embodiment 5 of this invention. It is sectional drawing which inject | poured resin into the metal mold | die for a mold used for the manufacturing method of the RFID tag which concerns on Embodiment 5 of this invention. It is sectional drawing of the RFID tag manufactured by the manufacturing method of the RFID tag which concerns on Embodiment 5 of this invention.

Embodiment 1 FIG.
Embodiment 1 of the present invention will be described below with reference to FIGS. 1 is a configuration diagram of an RFID tag according to Embodiment 1, FIG. 1 (a) is a perspective view of the RFID tag, FIG. 1 (b) is a cross-sectional view of FIG. 1 (a) divided in an arrow direction, and FIG. FIG. 2 (a) is a perspective view of the RFID tag, FIG. 2 (b) is a sectional view of FIG. 2 (a) divided in the direction of the arrow, and FIG. FIG. 3A is a cross-sectional view of the RFID tag (corresponding to a cross section taken along a dotted line AB in FIG. 3C. FIG. 3C is an RFID tag before molding. 3 (b) is a cross-sectional view of the RFID tag before the molding process (corresponding to the cross section taken along the dotted line AB in FIG. 3 (c)), and FIG. 3 (c) is a main part of the RFID tag before the molding process. 4 is a configuration diagram of the RFID tag according to Embodiment 1, and FIGS. 4A and 4B are diagrams of the RFID tag. A back view, as the cut side of the cross section is similar to FIG. 3 (a) (b). 1 to 4, reference numeral 1 denotes a dielectric substrate serving as a core of an RFID tag such as a dielectric or a dielectric substrate, which has a three-dimensional shape including one main surface, another main surface, and side surfaces. The boundary may be rounded (a dielectric substrate 10 and a corner portion 11 described later are examples thereof). In the first to fifth embodiments, which are examples of the present invention, an IC chip 3 and an antenna pattern described later are mounted on the dielectric substrate 1 and the dielectric substrate 10 described later are referred to as an RFID tag core. . Moreover, although the core (dielectric base | substrate) demonstrated Embodiment 1-5 using the thing of square pillar shape, a shape is not restricted to these. 2 is a hole provided on one main surface (front surface) of the dielectric substrate 1, 3 is an IC chip, 4 is electrically connected to one end of the IC chip 3, and is disposed on one main surface of the dielectric substrate 1. The first antenna pattern 5 is electrically connected to the other end of the IC chip 3 and arranged over the other main surface (back surface) of the dielectric substrate 1 via the side surface of the dielectric substrate 1. It is a 2nd antenna pattern.

  6 is an adhesive layer formed of an adhesive sheet or an adhesive for fixing the first antenna pattern 4 and the second antenna pattern 5 to the dielectric substrate 1 (note that drawings relating to Embodiments 1 to 5 except for a part) In FIG. 2, the first antenna pattern 4 and the second antenna pattern 5 are present between the dielectric bases 1 and 10, but are omitted from the drawing. The same applies to the drawings. Mold material covering all side surfaces of the substrate 1, that is, the four side surfaces, 8 is a hole (through hole) penetrating the dielectric substrate 1 from the front surface to the back surface, 9 is a filling mold material filled in the hole 8, 10 is at least a first antenna pattern The dielectric substrate (with corners) is rounded on the opposite sides of one side where the antenna 4 or the second antenna pattern 5 is arranged, and 11 is rounded on the opposite sides of one side of the dielectric substrate 10. It is a corner part. In the drawings, the same reference numerals denote the same or corresponding parts, and detailed descriptions thereof are omitted.

  An antenna pattern composed of the first antenna pattern 4 and the second antenna pattern 5 (hereinafter, unless otherwise specified, “antenna pattern” means “first antenna pattern” and “second antenna pattern”). It may be formed on a film substrate to be described later. Although the film base material is not shown in FIGS. 1 to 4, the film base material may be fixed together when the antenna pattern is fixed to the dielectric substrate 1. In that case, you may fix the antenna pattern by making the contact bonding layer 6 contact only to a film base material. Further, the filling mold material 9 does not need to be the same material as the mold material 7, but preferably has a high affinity with the mold material 7 and the dielectric bases 1 and 10. Of course, the molding material 7 should also have high affinity with the dielectric substrates 1 and 10. In addition, one side surface of the dielectric substrate 1 refers to either the side surface of the dielectric substrate 1 that is closest to the IC chip 3 or the side surface sharing one side with the side surface among the four side surfaces. . The same applies to the dielectric substrate 10. Hereinafter, the expression side refers to one side provided with an antenna pattern unless otherwise noted.

  The RFID tag shown in FIG. 1 has a hole 2 in which an IC chip 3 in which one end is electrically connected to the first antenna pattern 4 and the other end is electrically connected to the second antenna pattern 5 is inserted. In this structure, the periphery of the dielectric substrate 1 is molded with a molding material. Specifically, the first antenna pattern 4 is fixed to the surface of the dielectric substrate 1 via the adhesive layer 6, and the second antenna pattern 5 has the adhesive layer 6 on the surface, side surface, and back surface of the dielectric substrate 1. Is fixed through. The adhesive layer 6 does not have to be provided on all the surfaces where the dielectric substrate 1 and the first antenna pattern 4 and the second antenna pattern 5 are in contact with each other. The first adhesive layer 6 is used until the dielectric substrate is molded with a molding material. The antenna pattern 4 and the second antenna pattern 5 may have an area (amount) that can be fixed to the dielectric substrate 1. Of course, when the 1st antenna pattern 4 and the 2nd antenna pattern 5 are formed in the film base material, it is necessary to provide the contact bonding layer 6 in all the surfaces where the dielectric substrate 1 and a film base material contact. It goes without saying that there is nothing. Since the antenna pattern is fixed by the molding material 7, the area of the adhesive layer can be reduced by the area of the antenna pattern, and the material of the adhesive layer 6 can be reduced. The adhesive layer 6 may be provided on the dielectric substrate 1 side or on the antenna pattern (film substrate) side.

  1 and 2, the hole portion 2 of the RFID tag according to the first embodiment has such a dimension that the IC chip 3 can be inserted, and no protrusion due to the IC chip is generated on the dielectric substrate 1. As a result, a discontinuous surface is hardly generated between the dielectric substrate 1 and the molding material 7, and the antenna pattern does not change even if the dielectric substrate expands or contracts due to a change in installation environment such as a temperature change. The IC chip 3 is protected from the load. The hole 2 shown in FIGS. 1 and 2 is substantially the same size as the outer shape of the IC chip 3, but even if the dimension of the hole 2 is larger than the dimension of the IC chip 3, the IC chip 3 is the first antenna. The IC chip 3 is disposed at a predetermined position by being connected to the pattern 4 and the second antenna pattern 5, and the first antenna pattern 4 and the second antenna pattern 5 are fixed to the dielectric substrate 1. Is done. In this case, since there is a load applied to the dielectric substrate 1 due to expansion of the air remaining in the hole 2 due to factors such as high temperature, the filling mold material 9 is placed in the hole 2 in order to reduce the load. The air inside the hole 2 may be expelled by filling it by filling it and filling the IC chip 3 in it. The resin that is the filling mold material 9 to be filled in the hole 2 may be other than the mold material 7. However, when the same resin as the mold material 7 is used, it is opposite to the surface in contact with the adhesive layer 6 with the mold material. When covering the front and back surfaces of the dielectric substrate 1, including the surfaces of the first antenna pattern 4 and the second antenna pattern 5 on the side, and all the side surfaces of the dielectric substrate 1, that is, the side surfaces of the four surfaces. However, if the timing of injecting the resin into the hole 2 is after the insertion of the IC chip 3, the IC chip 3, the first antenna pattern 4, and the second antenna pattern 5 are used. It is necessary to leave the hole 2 so that the resin can be injected into a portion that is not covered. If the timing of injecting the resin into the hole 2 is before the insertion of the IC chip 3, the “hole” after the resin is injected is the hole 2 of the RFID tag according to the first embodiment. It can be said.

  The RFID tag shown in FIG. 2 shows a structure before the periphery of the RFID tag shown in FIG. 1 is molded with the molding material 7. In this structure, the first antenna pattern 4 and the second antenna pattern 5 are If it is bare and the adhesive layer is not firmly fixed, it may be peeled off from the dielectric substrate 1 or the first antenna pattern 4 and the second antenna pattern 5 may be electrically connected to the IC chip 3. Connection may not be maintained. Even if the adhesive layer is firmly fixed, the dielectric substrate 1 expands and contracts due to a change in installation environment such as a temperature change, and the first antenna pattern 4 or the second antenna pattern 5 breaks. There is a fear. However, by arranging the molding material 7 around the RFID tag shown in FIG. 2, the first antenna pattern 4 and the second antenna pattern 5 are firmly fixed between the molding material 7 and the dielectric substrate 1. Therefore, the first antenna pattern 4 or the second antenna pattern 5 is protected and is less susceptible to changes in the installation environment such as temperature changes. Furthermore, it is possible to use an adhesive sheet / adhesive that has not been conventionally used as the adhesive layer 6.

  The RFID tag shown in FIG. 3 differs from the RFID tag shown in FIGS. 1 and 2 in the shape and depth of the hole. The RFID tag hole 2 shown in FIG. 1 and FIG. 2 has an opening only on the surface of the dielectric substrate 1, but the RFID tag hole 8 shown in FIG. A through hole penetrating the (one main surface) and the back surface (the other main surface) has openings on both the front surface and the back surface of the dielectric substrate 1. Therefore, the constraint condition regarding the thickness of the IC chip 3 is relaxed, and the degree of freedom of the dimension of the selectable IC chip is increased. The hole 8 is dimensioned so that the IC chip 3 can be inserted in the same manner as described with respect to the hole 2, so that no protrusion due to the IC chip occurs on the dielectric substrate 1. Therefore, a discontinuous surface is hardly generated between the dielectric substrate 1 and the molding material 7, and the antenna pattern is formed between the dielectric substrate and the molding material even if the dielectric substrate expands or contracts due to a change in the installation environment such as a temperature change. The IC chip 3 is protected from the load.

  As shown in FIG. 3C, when the dimension of the hole 8 is larger than the dimension of the IC chip 3, the first antenna pattern 4 and the second antenna pattern 5 are connected to the IC chip 3, and the first Since the first antenna pattern 4 and the second antenna pattern 5 are held by the dielectric substrate 1, the IC chip 3 is arranged at a predetermined position. In this case, in order to reduce the load applied to the dielectric substrate 1 due to the expansion of the air remaining inside the hole 8 due to factors such as high temperature, the filling mold material 9 is injected and filled into the hole 8. The air inside the hole 8 may be expelled by embedding the IC chip 3 therein. FIG. 3A shows an RFID tag in this case. The hole portion 8 of the RFID tag shown in FIG. 3A is filled with a filling mold material 9. On the other hand, FIG. 3B is a diagram showing a state before the filling material 9 is filled in the hole 8. In addition, the resin that is the filling mold material 9 to be filled in the hole portion 8 may be other than the mold material 7 as in the case of the hole portion 2, but when using the same resin as the mold material 7, The front and back surfaces of the dielectric substrate 1, including the surfaces of the first antenna pattern 4 and the second antenna pattern 5 opposite to the surface in contact with the adhesive layer 6, and all the side surfaces of the dielectric substrate 1, that is, the four surfaces The air inside the hole 8 may be expelled when covering the side surface of the hole 8. However, as shown in FIGS. 3B and 3C, if the timing of injecting the resin into the hole 8 is after the insertion of the IC chip 3, the IC chip 3, the first antenna pattern 4, and the second antenna. Due to the pattern 5, it is necessary to leave a portion where the hole 8 is not covered, such as around the IC chip 3 of FIG. Even if there is no portion where the hole 8 opening on the surface of the dielectric substrate 1 is not covered to such an extent that the resin can be injected, the resin substrate 1 is empty enough to allow the resin to be injected into the hole 8 opening on the back surface side. If there is, it is possible to inject the resin from the opening of the hole 8 on the back side of the dielectric substrate 1. The term “vacant” as used herein refers not only to the case where the second antenna pattern 5 partially covers the hole 8 opening on the back surface side of the dielectric substrate 1, but also to the back surface side of the dielectric substrate 1. This includes the case where the opening of the hole 8 is not covered at all. If the timing of injecting the resin into the hole 8 is before the IC chip 3 is inserted, the “hole” after the resin is injected is the hole 8 (hole) of the RFID tag according to the first embodiment. Part 2).

  Although not shown, when the opening of the hole 8 shown in FIG. 3 is the same size as the outer shape other than the thickness of the IC chip 3, the timing of injecting the resin into the hole 8 is the insertion of the IC chip 3. After that, the portion where the hole 8 is not covered by the IC chip 3, the first antenna pattern 4, and the second antenna pattern 5 is not on the surface of the dielectric substrate 1, so as described above, It is necessary to inject resin into the hole 8 from the opening on the back side of the dielectric substrate 1. Also in this case, it is a precondition that the opening on the back surface side of the dielectric substrate 1 is not completely closed by the second antenna pattern 5. The hole 2 and the hole 8 may be provided after manufacturing the dielectric bases 1 and 10, or may be provided at the time of injection molding if the dielectric base 1 is an injection-molded substrate.

  The RFID tag shown in FIG. 4 differs from the RFID tag shown in FIGS. The dielectric substrate 10 of the RFID tag shown in FIGS. 4 (a) and 4 (b) has a corner portion 11 that is rounded on the opposite side of one side where the first antenna pattern 4 or the second antenna pattern 5 is disposed. have. In particular, in FIG. 4A, a corner portion is provided on each side of the dielectric substrate 10, a surface facing the one surface, a side formed by the surface of the dielectric substrate 1, and a side formed by the back surface. This is a sufficient condition to be satisfied by the dielectric substrate 10 and is not a necessary condition. That is, not only the dielectric substrate 10 shown in FIG. 4A but also the dielectric substrate 10 shown in FIG. The dielectric substrate 10 having such a shape includes a dielectric substrate on which the side and the side surface of the dielectric substrate 1 on which the second antenna pattern 5 is disposed, and the second antenna pattern 5 are disposed. Since the corner portion 11 is provided on the side formed by the back surface and the side surface of the first antenna pattern 5, the second antenna pattern 5 (the film base corresponding to the second antenna pattern when a film substrate is used) The load due to the stress concentration on the portion in contact with the corner portion 11 of the material is also reduced. Accordingly, the dielectric substrate expands / contracts due to a change in the installation environment such as a temperature change, and the load applied to the opposing corner portion 11 on one side surface of the dielectric substrate is dispersed, so that the second antenna pattern 5 (and the film base) is distributed. It is possible to reduce the load on the material. In addition, since the second antenna pattern 5 is disposed at the corner portion 11 and the second antenna pattern 5 itself is not folded so as to be angular, no unnecessary load is applied to the second antenna pattern 5 itself. Of course, the dielectric substrate 10 may be provided with a hole 8 (through hole) instead of the hole 2.

Embodiment 2. FIG.
A second embodiment of the present invention will be described with reference to FIGS. 5 is a configuration diagram of the RFID tag according to Embodiment 1, FIG. 5A is a perspective view of the RFID tag, FIG. 5B is a cross-sectional view of FIG. 5A divided in the direction of the arrow, and FIG. FIG. 6A is a perspective view of the RFID tag, FIG. 6B is a cross-sectional view of FIG. 6A divided in the direction of the arrow, and FIG. (a) and (b) are cross-sectional views of the RFID tag, and the method of cutting the cross section is the same as in FIGS. 3 (a) and 3 (b). 5, 6, and 7, 12 is a hole provided in one side surface of the dielectric substrate 1, 13 is electrically connected to one end of the IC chip 3, and passes through the side surface of the dielectric substrate 1 to The first antenna pattern 14 arranged over one main surface (front surface) of the substrate 1 is electrically connected to the other end of the IC chip 3, passes through the side surface of the dielectric substrate 1, and passes through the dielectric substrate 1. The second antenna pattern 15 is arranged over the other main surface (back surface), and 15 is formed of an adhesive sheet or an adhesive that fixes the first antenna pattern 13 and the second antenna pattern 14 to the dielectric substrates 1 and 10. The adhesive layer (which is present between the first antenna pattern 13 and the second antenna pattern 14 and the dielectric substrate 1 in FIGS. 5, 6, and 7 is omitted in the drawings). .) In the drawings, the same reference numerals denote the same or corresponding parts, and detailed descriptions thereof are omitted.

  The difference between the second embodiment and the first embodiment is that the positions (surfaces) of the holes into which the IC chips 3 formed on the dielectric substrates 1 and 10 are inserted are different and the arrangement of the antenna patterns is different. It is. Since the rest is common, the second embodiment will be described with a focus on differences from the first embodiment. Of course, the antenna pattern composed of the first antenna pattern 13 and the second antenna pattern 14 (hereinafter, unless otherwise specified, the “antenna pattern” means the first antenna pattern 13 and the second antenna pattern 13). May be formed on a film substrate to be described later.

  In the RFID tag shown in FIGS. 5 and 6, the first antenna pattern 13 is fixed to the front surface and side surface of the dielectric substrate 1 via the adhesive layer 6, and the second antenna pattern 14 is connected to the back surface of the dielectric substrate 1. It is fixed to the side surface via an adhesive layer 6. The hole 12 is dimensioned so that the IC chip 3 can be inserted in the same manner as the hole 2, and no protrusion due to the IC chip is generated on the dielectric substrate 1. As a result, a discontinuous surface is hardly generated between the dielectric substrate 1 and the molding material 7, and the antenna pattern does not change even if the dielectric substrate expands or contracts due to a change in installation environment such as a temperature change. The IC chip 3 is protected from the load.

  The RFID tag shown in FIG. 6 shows a structure before the periphery of the RFID tag shown in FIG. 5 is molded with the molding material 7. In this structure, the first antenna pattern 13 and the second antenna pattern 14 are If the adhesive layer is not firmly fixed, it is peeled from the dielectric substrate 1 or the first antenna pattern 13 and the second antenna pattern 14 are electrically connected to the IC chip 3. Connection may not be maintained. Even if the adhesive layer is firmly fixed, the dielectric substrate 1 expands and contracts due to a change in the installation environment such as a temperature change, and the first antenna pattern 13 or the second antenna pattern 14 is broken. There is a fear. However, the first antenna pattern 13 and the second antenna pattern 14 are firmly fixed between the molding material 7 and the dielectric substrate 1 by arranging the molding material 7 around the RFID tag shown in FIG. Therefore, the first antenna pattern 13 or the second antenna pattern 14 is protected and is hardly affected by changes in the installation environment such as temperature changes. Furthermore, as the adhesive layer 6, an adhesive sheet / adhesive that has not been conventionally used can be used.

  The RFID tag shown in FIGS. 7A and 7B is different from the RFID tag shown in FIGS. 5 and 6 in the shape of the dielectric substrate. This is the same as the relationship between the RFID tag shown in FIGS. 4A and 4B and the RFID tag shown in FIGS. The dielectric substrate on which the side formed by the surface and side surface of the dielectric substrate 1 on which the first antenna pattern 13 is disposed, the side formed by the back surface and the side surface of the dielectric substrate 1, and the second antenna pattern 14 is disposed. Since the corner portion 11 is provided on the side formed by the back surface and the side surface of 1 and the side formed by the back surface and the side surface of the dielectric substrate 1, the first antenna pattern 13 and the second antenna pattern 14 (film substrate) Is used, the load due to the stress concentration on the portion in contact with the corner portion 11 of the film substrate corresponding to the antenna pattern is also reduced. Therefore, the dielectric substrate expands / contracts due to a change in the installation environment such as a temperature change, and the load applied to the opposing corner portion 11 on one side of the dielectric substrate is dispersed, and the first antenna pattern 13 and the second antenna pattern 13 are distributed. It is possible to reduce the load applied to the antenna pattern 14 (and the film base material). In addition, since the first antenna pattern 13 and the second antenna pattern 14 are disposed in the corner portion 11 and the first antenna pattern 13 and the second antenna pattern 14 themselves are not folded so as to be angular, the first antenna pattern 13 and the second antenna pattern 14 are not folded. An unnecessary load is not given to the antenna pattern 13 and the second antenna pattern 14 itself.

  As described above, the RFID tag according to the second embodiment has an intermediate length of the antenna pattern (electric length) as compared with the case where the IC chip 3 is inserted into the holes 2 and 8 provided on one main surface of the dielectric substrate 1. It becomes easy to place the IC chip 3 in the vicinity of the point, and adjustment of the antenna pattern as an antenna element is easy. Further, since the IC chip 3 is disposed on one side surface of the dielectric substrate 1, even if a load is applied to the front and back surfaces of the dielectric substrate 1, only the antenna pattern is formed on the dielectric substrate 1. The influence on the IC chip 3 is small.

  Next, the operation of the RFID tag according to Embodiments 1 and 2 will be described. Since the operation of the entire RFID system and the RFID reader / writer is the same as that of the prior art, the description thereof will be omitted, and only the operation of the RFID tag will be described with reference to FIG. FIG. 8 is an explanatory diagram of the basic form of the RFID tag according to the present invention. FIG. 8A shows the prototype of this tag antenna, which is called a sleeve monopole antenna according to the antenna engineering handbook (edited by the Institute of Electronics, Information and Communication Engineers, 1980/10 (pages 120 to 121)). . The input impedance characteristics and radiation characteristics of this antenna hardly depend on the internal structure of the feeding coaxial line. The shape of the conductor extending upward from the feeding point, the shape of the outer conductor of the coaxial line, the position of the ground plate, It is almost determined by the shape. When considering application to an RFID tag, the tag IC chip has all the functions necessary for communication with the reader / writer, so the coaxial line connecting the external circuit and the antenna as shown in FIG. It becomes unnecessary, and it is only necessary to connect the IC chip to the feeding point as shown in FIG. The input impedance characteristics and radiation characteristics shown in FIG. 8A are almost equivalent to those shown in FIG. The conductor below the ground plate in FIG. 8B is irrelevant to the antenna characteristics, and the shape of the cylindrical conductor above the ground plate is a design matter to be selected as appropriate. If the shape of the cylindrical conductor is the same as the shape of the conductor extending upward from the feeding point, for example, FIG. From the standpoint of practicality, the shape of FIG. 8C is inconvenient, and when it is bent and lowered in height so that it can be easily used, FIG. 8D is obtained. In general, even if the conductor dimensions and shape are changed while maintaining the basic structure of FIG. 8D, it is not easy to improve the impedance matching between the antenna and the IC chip. Therefore, a structure in which a short line (short-circuit conductor) shown in FIG. 8E is added so that the impedance matching state between the antenna and the IC chip can be satisfactorily adjusted is provided in the RFID tag according to the first and second embodiments. Basic structure.

  As described above, the RFID tag according to the first and second embodiments has the side surface of the dielectric substrate 1 that is the closest to the IC chip 3 among the four side surfaces of the dielectric substrate 1 or one side with this side surface. Since the second antenna pattern 5 is fixed to the dielectric substrate 1 from the one side surface to the back surface of the dielectric substrate 1, the first antenna pattern and the first antenna pattern are connected to each other. It is easy to place the IC chip at a substantially midpoint of the total length (electric length) of the antenna pattern composed of the two antenna patterns. 9 to 13, 15, and 16 described later, a short line that short-circuits the first antenna pattern and the second antenna pattern is illustrated in the vicinity of the IC chip 3. The shape / position / thickness of the short line is not limited to those shown in FIGS. 9 to 13, 15 and 16, and therefore the short line is not shown in other drawings. . However, the short lines are arranged on the three main surfaces (front surface), one side surface, and the other main surface (back surface) of the dielectric substrates 1 and 10 on which the first antenna pattern and the second antenna pattern are arranged. This is because the conductive substrates (first antenna pattern, second antenna pattern, and short line) are present on the four or more surfaces of the dielectric substrates 1 and 10 so that the expansion and expansion of the dielectric substrates 1 and 10 can be performed. There is little influence on the conductive pattern due to the shrinkage, and the possibility of realizing the RFID tag design in the direction of eliminating the adhesive layer 6 between the short line and the dielectric bases 1 and 10 is increased. Of course, the adhesive layer 6 may be positively disposed between the short line and the dielectric substrates 1 and 10. Further, it goes without saying that the configuration of the short lines is made much simpler by forming the short lines by the conductive pattern than by forming the through holes for short lines separately from the dielectric bases 1 and 10. Further, the short line may be considered as a part of the first antenna pattern or a part of the second antenna pattern, or may be considered as a part of the antenna pattern. If the first antenna pattern, the second antenna pattern, and the short line are formed as an integral conductive pattern, the first antenna pattern, the second antenna pattern, and the short line can be easily placed on the dielectric substrates 1 and 10, and the possibility of breakage can be reduced. It is more practical to form the conductive pattern integrally. The short line is also placed on the dielectric substrates 1 and 10 and covered with the molding material 7.

  When an RFID tag using a dipole antenna is installed on a metal surface, an electric field cannot exist in parallel with the metal surface, so radio waves from the RFID reader / writer cannot be received and installed on the metal surface for operation. However, the RFID tags according to Embodiments 1 and 2 can operate as RFID tags even when installed on a metal surface because the second antenna patterns 5 and 14 operate as ground plates. Therefore, the transmission wave from the RFID reader / writer can be received. The mold material 7 is not provided for separating the antenna pattern from the metal in order to operate as a dipole antenna, like an RFID tag using a dipole antenna, but is provided as a protection for the antenna pattern and the IC chip 3. ing. Note that when the RFID tag is attached to the installation surface with an adhesive such as a double-sided tape, there is an effect of protecting the antenna pattern. Therefore, the RFID tag can be peeled from the installation surface and pasted again and again. A part of the antenna pattern described in the drawings of the RFID tags according to all the embodiments including the first and second embodiments includes a first antenna pattern disposed on the surface of the dielectric bases 1 and 10. 4 and 13 and the second antenna patterns 5 and 14 arranged on the back surface are symmetrical, but this is to make it easier to compare and explain the drawings. It goes without saying that the shape of the antenna pattern changes if the shape, relative dielectric constant, and IC chip 3 of the dielectric substrates 1 and 10 are different. Note that a meander pattern (meander circuit) or a stepped impedance (capacitance) is provided between the electrical connection between the IC chip 3 and the antenna pattern in order to match the IC chip 3 with the antenna pattern or for further miniaturization. ) Etc. may be put.

Modified examples of the first and second embodiments.
A modification of the first and second embodiments of the present invention will be described with reference to FIGS. 9 and 10 are schematic views showing a modification (part) of the antenna pattern of the RFID tag according to the present invention. 9 and 10, 4a is a first antenna pattern in which matching with the IC chip 3 is realized by the meander circuit 4aa, and 4b is bent in an L shape at the end opposite to the end connected to the IC chip 3. The first antenna pattern 5a having the stepped impedance 4ba is a second antenna pattern 5b in which the portions disposed on the back surfaces of the dielectric substrates 1 and 10 are thicker than the portions disposed on the side surfaces and the surface. Is a second antenna pattern in which the portions disposed on the side surfaces of the dielectric substrates 1 and 10 are slanted, and 5c is a second antenna in which the portions disposed on the side surfaces of the dielectric substrates 1 and 10 are crank-shaped. Reference numeral 45 denotes a short line for short-circuiting the first antenna pattern 4 and the second antenna pattern 5 and the first antenna pattern and the second antenna pattern shown in FIG. Short line for short-circuiting and down, 34 is a short line for short-circuiting the first antenna pattern 13 and the second antenna pattern 14. In the drawings, the same reference numerals denote the same or corresponding parts, and detailed descriptions thereof are omitted.

  9 and 10, 4c is a first antenna pattern in which the connection side with the IC chip 3 is thin, and 13a is a first antenna pattern in which the connection side with the IC chip 3 is thin and extends to the side surface. , 13b is a first antenna pattern on the connection side with the IC chip 3, and the portion extending to the side surface is narrowed. 13c is a connection side with the IC chip 3, and the portion extending to the side surface is narrowed. 1 is an antenna pattern, 13d is a first antenna pattern in which matching with the IC chip 3 is realized by means of a meander circuit 13da, 5d is a portion disposed on the back surface of the dielectric substrate 1, 10, and is disposed on the side surface and the surface. The second antenna pattern 14a, which is thicker than the portion, is a second antenna pattern 14a which is thin on the connection side with the IC chip 3 and extends to the side surface. Is a second antenna pattern in which the portion extending to the side surface is narrowed on the side connected to the IC chip 3, and 14c is a second antenna pattern in which the portion extending to the side surface is narrowed on the side connected to the IC chip 3. It is an antenna pattern. In the drawings, the same reference numerals denote the same or corresponding parts, and detailed descriptions thereof are omitted.

  Further, in FIGS. 9 and 10, 46 is a short line for short-circuiting the first antenna pattern 4c and the second antenna pattern 5d, and 47 is a short-circuit for short-circuiting the first antenna pattern 13a and the second antenna pattern 14a. 48, a short line that short-circuits the first antenna pattern 13b and the second antenna pattern 14b, 49 a short line that short-circuits the first antenna pattern 13a and the second antenna pattern 14b, and 50 a first line. This is a short line that short-circuits the antenna pattern 13c or the first antenna pattern 13d and the second antenna pattern 14c. In the drawings, the same reference numerals denote the same or corresponding parts, and detailed descriptions thereof are omitted. As described above, each short line may be considered to be a part of each first antenna pattern or a part of each second antenna pattern, or may be considered to be a part of each antenna pattern. May be. 9 and 10, four dotted lines run vertically, but this does not indicate that each antenna pattern is divided, but the two dotted lines in the center of the drawing indicate the antenna pattern. The position (folding) that is bent when placed on the dielectric substrate 1 (dielectric substrate 10) is shown. The two dotted lines at both ends of the drawing indicate the end of the antenna pattern and the end of the antenna pattern. The position of the dielectric substrate 1 is shown.

9 and 10, d 1 is the lengths of the first antenna pattern and the second antenna pattern arranged on the surface of the dielectric substrate 1. However, when the IC chip 3 is arranged on one side, it is the length of the portion where the first antenna pattern is arranged on the surface of the dielectric substrate 1. d 2 is the length of the portion where the dielectric substrate 1 of the second antenna pattern is arranged on one side (thickness of the dielectric substrate 1). However, when the IC chip 3 is disposed on one side surface, it is disposed on one side surface of the dielectric substrate 1, not the length of the portion disposed on the one side surface of the dielectric substrate 1 of the second antenna pattern. This is the length of the first antenna pattern and the second antenna pattern of the portion. d 3 is the length of the portion where the second antenna pattern is disposed on the back surface of the dielectric substrate 1. As an example, FIG. 9 shows that the end of the antenna pattern does not extend to the end of the dielectric substrate 1, and FIG. 10 shows that the end of the antenna pattern extends to the end of the dielectric substrate 10. ing. In the drawings, the same reference numerals denote the same or corresponding parts, and detailed descriptions thereof are omitted. 9A, 9G, 10A, and 10B, the dielectric substrate 1 has an antenna pattern arranged on the actual dielectric substrate 1. FIG. FIG. 9 (a) to (g) and FIG. 10 (a) to (f) which part of each antenna pattern is which part of the dielectric substrate 1 is virtually developed. It is for demonstrating what is arrange | positioned.

In the first and second embodiments, the antenna pattern has been described as a simple rectangle, but the antenna pattern of the RFID tag according to the present invention is the same as the antenna pattern described in the first and second embodiments and the first and second embodiments. The present invention is not limited to the antenna pattern shown in the drawings. As described in the first and second embodiments, the first antenna patterns 4 and 13 arranged on the front surfaces of the dielectric substrates 1 and 10 and the second antenna patterns 5 and 14 arranged on the back surface are respectively symmetrical. However, this is to make it easier to compare and explain the drawings. Actually, if the shape and relative permittivity of the dielectric substrates 1 and 10 and the IC chip 3 are different, the antenna pattern The shape changes. Therefore, as shown in FIGS. 9 and 10, the shape of the antenna pattern may be appropriately selected depending on the thickness / dimension, relative dielectric constant, etc. of the dielectric substrate 1 and the frequency used. Note that the lengths d 1 , d 2 , and d 3 indicate which antenna pattern (first antenna pattern 4, 4a to c, 13, 13a to d and second antenna pattern 5, 5a to d, 14, 14a to 9 is selected, the antenna patterns in FIG. 9 have the same length on the drawing in FIG. Each antenna pattern of FIG. 10 has the same length on the drawing of FIG. This is because priority was given to the ease of comparing the shapes of the respective antenna patterns. Actually, even if the same dielectric substrate 1, 10 and IC chip 3 are used, if the antenna pattern is changed, The lengths d 1 and d 3 are changed. Even if the shape of the antenna pattern is the same, if the specifications of the dielectric bases 1 and 10 and the IC chip 3 are changed, the dimensions of the antenna pattern are changed, and the antenna pattern is matched to the antenna pattern with the IC chip 3. It may be necessary to change the shape of the pattern itself. The same applies to the case of the dielectric substrate 10 having the corner portions 11 shown in FIGS. 4 and 7, and the same applies to the case where the relative permittivity and thickness of the molding material 7 change. Furthermore, although not shown, the antenna pattern described in FIG. 9 and the antenna pattern described in FIG. 10 may be combined.

  Next, each antenna pattern described in FIGS. 9 and 10 will be briefly described. In the antenna pattern of FIG. 9A, the first antenna pattern 4 is arranged only on the surface of the dielectric substrate 1, and the second antenna pattern 5 is arranged over the surface, side surface, and back surface of the dielectric substrate 1. Has been. The antenna pattern shown in FIG. 9B is different from the antenna pattern shown in FIG. 9A in that the second antenna pattern 5 is wider than the second antenna pattern 5 in which the portion disposed on the back side of the dielectric substrate 1 is wider. An antenna pattern 5a is provided. Unlike the antenna pattern of FIG. 9A, the antenna pattern of FIG. 9C has a second antenna pattern 5b inclined obliquely disposed on the side surface of the dielectric substrate 1. Unlike the antenna pattern of FIG. 9A, the antenna pattern of FIG. 9D has a crank-shaped second antenna pattern 5c disposed on the side surface of the dielectric substrate 1. The antenna pattern of FIG. 9E is different from the antenna pattern of FIG. 9A, and has a meander circuit 4aa at a portion where the first antenna pattern 4a is connected to the IC chip 3. The antenna pattern in FIG. 9F is different from the antenna pattern in FIG. 9A, and the first antenna pattern 4a has an end opposite to the portion connected to the IC chip 3 bent in an L shape. It has a stepped impedance 4ba. The antenna patterns shown in FIGS. 9A to 9F are configured such that the IC chip 3 can be placed in the hole 2. In the antenna pattern of FIG. 9G, the first antenna pattern 13 is disposed over the surface and side surfaces of the dielectric substrate 1, and the second antenna pattern 14 is disposed over the back surface and side surfaces of the dielectric substrate 1. Has been. The antenna pattern shown in FIG. 9G is configured such that the IC chip 3 can be placed in the hole 12.

  The difference between the antenna pattern of FIG. 10 and the antenna pattern of FIG. 9 is that each antenna pattern of FIG. 10 has a narrower pattern in the vicinity of the portion connected to the IC chip 3 than the other portions. Is a point. Further, short lines 46 to 50 are formed along the narrowed portion. Each of the short lines 46 to 49 in FIGS. 10A to 10D is formed so as to sandwich the IC chip 3 therebetween. Therefore, since the width and length of the two short lines can be adjusted in the RFID tag design stage, the short line design parameters are increased, and the width of antenna impedance adjustment is widened. In the antenna pattern of FIG. 10A, the first antenna pattern 4c is arranged only on the surface of the dielectric substrate 1, and the second antenna pattern 5d is arranged over the front surface, side surface, and back surface of the dielectric substrate 1. Has been. Further, the narrowed portion of the second antenna pattern 5d is disposed only on the surface and side surfaces of the dielectric substrate 1. The antenna pattern shown in FIG. 10A is configured such that the IC chip 3 can be placed in the hole 2.

  In the antenna pattern of FIG. 10B, the first antenna pattern 13 a is disposed over the surface and side surfaces of the dielectric substrate 1, and the second antenna pattern 14 a is disposed over the back surface and side surfaces of the dielectric substrate 1. The narrowed portions of the first antenna pattern 13a and the second antenna pattern 14a extend to the front and back surfaces of the dielectric substrate 1. In the antenna pattern of FIG. 10C, the first antenna pattern 13 b is disposed over the surface and side surfaces of the dielectric substrate 1, and the second antenna pattern 14 b is disposed over the back surface and side surfaces of the dielectric substrate 1. The thinned portions of the first antenna pattern 13b and the second antenna pattern 14b are disposed only on the side surface of the dielectric substrate 1. In the antenna pattern of FIG. 10D, the first antenna pattern 13 a is disposed over the surface and side surfaces of the dielectric substrate 1, and the second antenna pattern 14 b is disposed on the back surface and side surfaces of the dielectric substrate 1. ing. Further, the thinned portion of the second antenna pattern 14 b is disposed only on the side surface of the dielectric substrate 1.

  In the antenna pattern of FIG. 10E, the first antenna pattern 13 c is disposed over the surface and side surfaces of the dielectric substrate 1, and the second antenna pattern 14 c is disposed over the back surface and side surfaces of the dielectric substrate 1. The narrowed portions of the first antenna pattern 13 c and the second antenna pattern 14 c are disposed only on the side surface of the dielectric substrate 1. The difference from FIG. 10C is that in FIG. 10E, one short line 50 is used to short-circuit the first antenna pattern 13c and the second antenna pattern 14c. Unlike the antenna pattern of FIG. 10E, the antenna pattern of FIG. 10F has a meander circuit 13da at a portion where the first antenna pattern 13d is connected to the IC chip 3. The antenna patterns shown in FIGS. 10B to 10F are configured such that the IC chip 3 can be placed in the hole 12. Thus, although each antenna pattern was demonstrated easily by FIG.9 and 10, since the impedance of the antenna fluctuates by the shape (thickness, position) of the short lines 43.45-50 of each antenna pattern, Needless to say, it is necessary to make adjustments in consideration of the mutual relationship among the three conductive patterns constituting the antenna of the first antenna pattern, the second antenna pattern, and the short line.

  Of the antenna patterns described above, the configuration of the RFID tag on which the three antenna patterns shown in FIGS. 10 (a), 10 (e), and 10 (f) are mounted is taken as an example. 1 and 2 will be described with reference to FIGS. 11 to 13. FIG. 11 is a configuration diagram of an RFID tag according to a modification of the first and second embodiments, FIG. 11A is a perspective view of the RFID tag, and FIG. 11B is a cross-section obtained by dividing FIG. FIG. 12, FIG. 12 is a configuration diagram of an RFID tag according to a modification of the first and second embodiments, FIG. 12 (a) is a perspective view of the RFID tag, and FIG. 12 (b) is a sectional view of FIG. FIG. 13 is a configuration diagram of an RFID tag according to a modification of the first and second embodiments, FIG. 13 (a) is a perspective view of the RFID tag, and FIG. 13 (b) is an arrow direction of FIG. 13 (a). It is sectional drawing divided | segmented into. In the drawings, the same reference numerals denote the same or corresponding parts, and detailed descriptions thereof are omitted.

  The RFID tag described in FIG. 11 is obtained by arranging the antenna pattern of FIG. 10A on a dielectric substrate 1 in which a hole 2 is formed. The RFID tag shown in FIG. 12 is obtained by arranging the antenna pattern of FIG. 10E on the dielectric substrate 1 in which the hole 12 is formed. The RFID tag described in FIG. 13 is obtained by arranging the antenna pattern of FIG. 10F on the dielectric substrate 1 in which the hole 12 is formed. As described above, the RFID tags shown in FIGS. 11 to 13 have not only few protrusions by the IC chip 3 as in the RFID tags according to the first and second embodiments, but also all the conductive patterns are dielectric. Since the dielectric substrate is disposed only on one main surface, one side surface, and other main surface of the body substrate 1, the dielectric substrate expands or contracts to the entire surface of the conductive pattern or the bent portion of the conductive pattern. Therefore, the possibility of breakage of the conductive pattern can be reduced.

  In the following third to fifth embodiments, the RFID tag manufacturing method according to the first and second embodiments (including modifications) will be described. In the drawings according to the third to fifth embodiments, only the dielectric substrate 1 is used. Although described, the RFID tag manufacturing method is applicable to the dielectric substrate 10 (FIG. 4) in which the opposite sides of one side where the antenna pattern is arranged are rounded. In places where the character is not pointed to, the expression “dielectric substrate 1, 10” is used. Further, regarding the hole portion into which the IC chip 3 is inserted / placed, there is only the description of the hole portion 2 and the hole portion 12, but the dielectric substrates 1 and 10 having the hole portion 8 (through hole) may be used. Good. Furthermore, the antenna pattern has been described using a combination of the first antenna pattern 4 and the second antenna pattern 5 and a combination of the first antenna pattern 13 and the second antenna pattern 14 as representatives. Of course, the antenna pattern (including the short line) described in the first and second embodiments (including the modification) can also be used. 15 and 16, which will be described later, a part other than the combination of the first antenna pattern 4 and the second antenna pattern 5 and the combination of the first antenna pattern 13 and the second antenna pattern 14 will be described as another example. Also shown are antenna patterns (antenna patterns shown in FIGS. 10A, 10E, and 10F).

Embodiment 3 FIG.
A third embodiment of the present invention will be described with reference to FIGS. The third embodiment relates to a manufacturing method up to the molding process of the RFID tag according to the first and second embodiments. FIG. 14 is a diagram showing an antenna pattern forming process and an IC chip connecting process in the RFID tag manufacturing method according to the third embodiment, and FIG. 14A shows a state in which the antenna pattern is masked on the copper foil formed on the film substrate. Fig. 14 (b) is a diagram showing a film substrate from which copper foil other than the antenna pattern has been removed by etching or the like (antenna pattern forming step), and Fig. 14 (c) is a case where the IC chip 3 is mounted on the antenna pattern. FIG. 15 is a diagram showing the state (IC chip connection process), FIG. 15 is an enlarged view of the antenna pattern formed by the antenna pattern formation process of the RFID tag manufacturing method according to Embodiment 3, and FIG. FIG. 15B is an enlarged view of the antenna pattern before the IC chip connecting step shown in FIG. 15A, and FIG. 15B is an IC chip connection of the antenna pattern shown in FIG. FIG. 15C is an enlarged view before the IC chip connecting process of the antenna pattern shown in FIG. 10F, and FIG. 15D is an IC chip connecting of the antenna pattern shown in FIG. FIG. 16 is an external view of the antenna pattern (tag inlet) manufactured by the antenna pattern forming process and the IC chip connecting process of the RFID tag manufacturing method according to Embodiment 3, 16A is an external view of a tag inlet with a film base, FIG. 16B is an external view of a tag inlet without a film base, and FIG. 16C is an external view of a tag inlet with a film base. 16D is an external view of a tag inlet without a film substrate, FIG. 17 is an antenna pattern fixing process diagram of the RFID tag manufacturing method according to Embodiment 3, and FIG. FIG. 17 shows a state in which the dielectric substrate 1 and the antenna pattern (IC chip 3) are aligned (the adhesive layer 6 is formed on a part of the dielectric substrate 1), and FIG. 17B shows the dielectric substrate. 1 is a diagram showing a state in which the antenna pattern (IC chip 3) is aligned (the adhesive layer 6 is formed on the entire portion corresponding to the antenna pattern of the dielectric substrate 1), and FIG. 18 is a diagram showing the dielectric substrate 1 after the fixing step, FIG. 18 is an antenna pattern fixing step diagram of the RFID tag manufacturing method according to the third embodiment, and FIG. 18A is the dielectric substrate 1 and the antenna pattern (IC chip 3). FIG. 18B is a diagram showing a state in which alignment is performed (the adhesive layer 15 is formed on a part of the dielectric substrate 1), and FIG. 18B is the position of the dielectric substrate 1 and the antenna pattern (IC chip 3). Aligning state (Adhesive layer 15 is formed on the entire portion corresponding to the antenna pattern of dielectric substrate 1), FIG. 18 (c) is a diagram showing dielectric substrate 1 after the antenna pattern fixing step, and FIGS. 16 is a film base material, 51 is electrically continuous from the end on the IC chip 3 side in the first antenna pattern for connecting the IC chip 3 and the antenna pattern, and is connected to an IC chip 3 connection terminal (not shown). The electrical connection portion 52 contacts the IC chip 3 and the antenna pattern. The second antenna pattern 52 connects the IC chip 3 and the antenna pattern, and extends electrically continuously from the end portion on the IC chip 3 side. (Not shown), which is an electrical connection part to be contacted, 53 is a dummy pad for placing a connection terminal which is not in contact with the electrical connection parts 51, 52 when there are four electrical connection parts of the IC chip 3; (Square portion indicated by dotted) is an IC chip 3 mounted (placed) the position of the antenna pattern. In the drawings, the same reference numerals denote the same or corresponding parts, and detailed descriptions thereof are omitted.

  First, a method for manufacturing a tag inlet will be described. As shown to Fig.14 (a), it is desired for the film base material 16 (The roll-shaped copper foil and the copper foil and the film base material 16 were united by adhesion | attachment etc.) by which the layer of copper foil was formed in the single side | surface. In order to obtain a plurality of antenna patterns, the shape is masked. Next, a desired antenna pattern is obtained by etching or laser trimming the film substrate 16 subjected to masking as shown in FIG. As described above, by integrally forming the first antenna pattern, the second antenna pattern, and the short line, which will be described later, which are conductive patterns, it is possible to further reduce the possibility of breakage of the conductive pattern at each step. it can. FIG. 14 schematically shows only the outer shapes of the first antenna pattern and the second antenna pattern, but it is practical to form a short line during the antenna pattern formation process. The reason is that a short line is formed as a pattern in the conductive pattern, and the first antenna pattern and the second antenna pattern are formed in the antenna pattern forming step, so that the first and second antenna patterns are short-circuited. It is possible to omit a process of providing a hole (excluding an IC chip hole 8 (through hole)) and a process of connecting an antenna pattern and a short line. For simplification of the drawing, the short line is omitted in FIG. 14, but three types of antenna patterns will be described using FIG. 15 as an example of details of the antenna pattern including the short line.

  The antenna patterns described in FIGS. 15A to 15C are enlarged views of the periphery of the IC chip mounting position 3a, and the electrical connection portions 51 and 52 are designed in a shape that can be matched with the IC chip 3. Yes. The dummy pads 53 may not be necessary or may need to be changed depending on the number of connection terminals of the IC chip 3 used for the RFID tag. Further, when the first antenna pattern, the second antenna pattern, and the short line are formed at the same time, the boundary between the conductive patterns (continuous as the conductive pattern) is not known, so FIG. FIG. 15D shows the conductive patterns clearly shown. The conductor pattern (antenna pattern / short line) shown in FIGS. 15 (a) and 15 (d) is formed in such a manner that the electrical connection portion is cut through the conductor pattern without dividing the outer shape. Therefore, the possibility of breaking the conductive pattern at each step is further reduced. From FIG. 15D, what can be said with respect to the antenna pattern of the RFID tag according to the present invention is that the portion connecting the first antenna pattern and the second antenna pattern is a short line, The portion connected to the IC chip in the antenna pattern (second antenna pattern) can be said to be an electrical connection portion. Further, the other pattern may be a dummy pad or a mark marking when mounting an IC chip.

  After the antenna pattern forming step, an IC chip is mounted on the antenna pattern as shown in FIG. The IC chip 3 is mounted on a multi-sided state or a roll-shaped antenna pattern. For chip mounting, a method such as thermocompression bonding using a conductive paste or soldering is used. As shown in FIG. 16A, the tag inlet thus obtained is punched into individual tag inlets using a die after chip mounting. At this time, the film substrate 16 may be removed from the antenna pattern (FIG. 16B). In addition, the manufacturing method of a tag inlet is not restricted to the above thing, You may apply many faces which impose many antenna patterns on one surface of the film base material 16. FIG. In addition, a method of manufacturing a copper foil by cutting it into an antenna pattern with a mold, or printing using a conductive paste or the like is also conceivable. 16 (c) and 16 (d) correspond to FIGS. 16 (a) and 16 (b), respectively, and the antenna patterns shown in FIGS. 16 (a) and 16 (b) (FIG. 9 (a)). )) Is changed to the antenna pattern shown in FIG. As described above, the conductor pattern (antenna pattern / short line) shown in FIGS. 16C and 16D is not easily broken even if the pattern is added at each step.

  Subsequently, the hole forming step and the adhesive layer forming step will be described. Dielectric substrates 1 and 10 having holes on one principal surface (front surface) or one side surface of the substrate (core) are manufactured by injection molding or by processing such as punching from a flat substrate. That is, the hole forming step may be performed simultaneously with the formation of the dielectric bases 1 and 10 or may be performed after the formation of the dielectric bases 1 and 10. In the adhesive layer forming step, the adhesive layers 6 and 15 formed of an adhesive sheet (double-sided tape) or an adhesive are placed on the dielectric substrates 1 and 10. The adhesive layers 6 and 15 may be provided on the antenna pattern (film substrate 16) side. Further, when the adhesive layers 6 and 15 are provided on the dielectric substrates 1 and 10 are referred to as an adhesive layer forming step, when the adhesive layers 6 and 15 are provided on the antenna pattern (film substrate 16) side, the antennas are provided. It can be said that the adhesive layer forming step is performed simultaneously with the below-described antenna pattern fixing step in which the pattern (film substrate 16) is fixed to the dielectric substrates 1 and 10.

  The antenna pattern fixing process is a process of fixing the tag inlets through the antenna pattern forming process, the IC chip connecting process, the hole forming process, and the adhesive layer forming process to the dielectric substrates 1 and 10. In this antenna pattern fixing step, the first antenna pattern is fixed to one main surface and the second antenna pattern is fixed to the other main surface. The form varies depending on the position. First, when the holes are on the surfaces of the dielectric bases 1 and 10 as in the RFID tag according to the first embodiment, as shown in FIGS. 17 (a) and 17 (b), the tag inlet (antenna pattern, IC chip) is used. 3) is aligned with one main surface of the dielectric substrate 1, and then the IC chip 3 is inserted into the hole 2 of the dielectric substrate 1 so that the first antenna pattern 4 is the main substrate of the dielectric substrate 1. On the surface, the second antenna pattern 5 is fixed to one side surface and the other main surface of the dielectric substrate 1 (FIG. 17C). Next, when the hole is on the side surface of the dielectric bases 1 and 10 as in the RFID tag according to the second embodiment, as shown in FIGS. 18A and 18B, the tag inlet (antenna pattern, IC After the alignment between the chip 3) and one side surface of the dielectric substrate 1, the IC chip 3 is inserted into the hole 12 of the dielectric substrate 1, and the first antenna pattern 13 is connected to one side surface of the dielectric substrate 1. Then, the second antenna pattern 14 is fixed to one side surface and the other main surface of the dielectric substrate 1 on one main surface (FIG. 18C). Since the IC chip 3 is inserted into the holes 2 and 12, antenna pattern alignment is easy. Further, when the alignment accuracy between the tag inlet (antenna pattern, IC chip 3) and the dielectric substrate 1 is high, the IC chip 3 is not inserted into the hole 2 (hole 8) first, but the first The antenna pattern 4 (first antenna pattern 13) or the second antenna pattern 5 (second antenna pattern 14) is fixed to the dielectric bases 1 and 10, and as a result, the IC chip 3 is formed in the hole 2 ( It may be inserted into the hole 8). In addition, when short lines (not shown) are arranged on the surfaces other than the main surface, one side surface, and the back surface of the dielectric bases 1 and 10, the number of steps of the antenna pattern fixing process is increased or the adhesive layer 6 is formed. In some cases, it is also necessary to provide that surface (the surface on which all or part of the short line is arranged). In addition, since the molding process is performed later, the adhesive layers 6 and 15 have not been conventionally used for bonding the antenna pattern (or the film substrate 16) and the dielectric bases 1 and 10 or cannot be used conventionally. Even an adhesive layer can be used.

Embodiment 4 FIG.
A fourth embodiment of the present invention will be described with reference to FIGS. The fourth embodiment relates to a manufacturing method up to the molding process of the RFID tag according to the first and second embodiments. The antenna pattern forming process, IC chip connecting process, hole forming process, and adhesive layer forming process are the same as those in the RFID tag manufacturing method according to the third embodiment (FIGS. 14 and 16), and are therefore omitted. To do. FIG. 19 is an antenna pattern fixing process diagram of the RFID tag manufacturing method according to the fourth embodiment (before the dielectric substrate is inserted), and FIG. 20 is an antenna pattern fixing process diagram of the RFID tag manufacturing method according to the fourth embodiment (dielectric). 20A is a state diagram in which the dielectric substrate 1 and the antenna pattern are aligned with the opening of the antenna pattern fixing die 17, and FIG. 20B is a diagram showing the dielectric substrate 1. FIG. 21 is a diagram of the RFID pattern manufacturing method (dielectric substrate insertion completion) of the RFID tag manufacturing method according to the fourth embodiment, and FIG. 22 is a fourth embodiment of the present invention. FIG. 23 is an antenna pattern fixing process diagram of the RFID tag manufacturing method according to the fourth embodiment. FIG. 23A is a state diagram in which the dielectric substrate 1 and the antenna pattern (IC chip 3) are aligned with the opening of the antenna pattern fixing mold 17, FIG. Fig. 24 is a state diagram during insertion of the dielectric substrate 1 into the antenna pattern fixing mold 17, and Fig. 24 is an antenna pattern fixing process diagram (dielectric substrate insertion completion) of the RFID tag manufacturing method according to the fourth embodiment. 19 to 24, reference numeral 17 denotes an antenna pattern fixing mold having an opening into which the dielectric substrates 1, 10 and the antenna pattern (IC chip 3) can be inserted from one side of the dielectric substrates 1, 10. Reference numeral 18 denotes an antenna pattern fixing mold having a dimension that allows the dielectric substrates 1 and 10 to be accommodated, leaving a gap that allows the dielectric substrates 1 and 10 mounted with the antenna pattern and the IC chip 3 to be taken out. In the space inside 7, an insertion space communicating with the opening of the antenna pattern stationary mold 17. In the drawings, the same reference numerals denote the same or corresponding parts, and detailed descriptions thereof are omitted.

  An antenna pattern fixing process of the RFID manufacturing method according to the fourth embodiment will be described. The tag inlet that has undergone the antenna pattern forming process, IC chip connecting process, hole forming process, and adhesive layer forming process is fixed to the dielectric substrates 1 and 10 using the antenna pattern fixing mold 17. . This antenna pattern fixing step is the same as in the third embodiment, in which the first antenna pattern is fixed to one main surface and the second antenna pattern is fixed to the other main surface. The form differs depending on the position of the hole formed in the. The length of the insertion direction 18 of the antenna pattern fixing mold 17 in the insertion direction of the dielectric bases 1 and 10 may be longer than the length of the dielectric bases 1 and 10 as shown in FIGS. If the antenna pattern can be fixed to the dielectric bases 1 and 10, the length of the insertion space 18 in the insertion direction of the dielectric bases 1 and 10 may be shorter than the length of the dielectric bases 1 and 10. Good. In this case, since the dielectric bases 1 and 10 partially protrude from the antenna pattern fixing mold 17, it can be said that the dielectric bases 1 and 10 can be easily pulled out from the antenna pattern fixing mold 17.

  First, when the hole is on the surface of the dielectric substrate 1 or 10 as in the RFID tag according to the first embodiment, as shown in FIGS. 19 and 20A, the tag inlet (antenna pattern, IC chip) 3) After aligning one side of the dielectric substrate 1 and the antenna pattern fixing mold 17, while pressing one side of the dielectric substrate 1 against the second antenna pattern, the antenna pattern fixing mold The dielectric substrate 1 is inserted into the insertion space 18 from the opening 17. In this process, the IC chip 3 is inserted into the hole 2 (FIG. 20b). Since the dielectric substrate 1 is inserted into the insertion space 18 of the fixing mold 17 until the antenna pattern is fixed, the tag inlet (antenna pattern, IC chip 3) is mounted on the dielectric substrate 1. If the accuracy of the position where one side surface of the dielectric substrate 1 is pressed against the second antenna pattern is ensured, the first antenna pattern 4 can be easily placed on the main surface of the dielectric substrate 1 and the second antenna pattern can be easily obtained. 5 can be fixed to one side surface of the dielectric substrate 1 and the other main surface. (FIG. 21). The insertion space 18 leaves a gap that allows the dielectric bases 1 and 10 on which the antenna pattern and the IC chip 3 are mounted to be taken out. 17 can be easily taken out.

  Next, when the hole is on one side of the dielectric substrates 1 and 10 as in the RFID tag according to the second embodiment, as shown in FIGS. 22 and 23A, the tag inlet (antenna pattern, After aligning the IC chip 3), one side of the dielectric substrate 1, and the antenna pattern fixing mold 17, the antenna pattern fixing mold is pressed against the one side of the dielectric substrate 1 against the IC chip 3. The dielectric substrate 1 is inserted into the insertion space 18 from the opening 17 (FIG. 23b). In other words, it can be said that the IC chip 3 is inserted into the hole 12 when one side surface of the dielectric substrate 1 is brought into contact with the second antenna pattern 14 (first antenna pattern 13). By inserting the IC chip 3 into the hole 12, the alignment of the antenna pattern and the IC3 chip to the dielectric substrate 1 is completed. Therefore, the dielectric substrate 1 is fixed to the fixing mold until the antenna pattern is fixed. Since the tag inlet (antenna pattern, IC chip 3) is mounted on the dielectric substrate 1 by being inserted into the insertion space 18, the one side surface of the dielectric substrate 1 is pressed against the IC chip 3 (antenna pattern). If the accuracy of the position is ensured, the first antenna pattern 13 is easily provided on one side and one main surface of the dielectric substrate 1, and the second antenna pattern 14 is provided on one side and the other main surface of the dielectric substrate 1. (Fig. 24). The insertion space 18 leaves a gap that allows the dielectric bases 1 and 10 on which the antenna pattern and the IC chip 3 are mounted to be taken out. 17 can be easily taken out.

  The antenna pattern fixing process of the RFID tag manufacturing method according to the fourth embodiment is not limited to the method using the antenna pattern fixing mold 17, and one side surface of the dielectric substrates 1 and 10 and the second side. The antenna patterns 5 and 14 (first antenna patterns 4 and 13) are brought into contact with each other, and one side formed by one side and one main surface of the dielectric bases 1 and 10 and one side formed by one side and the other main surface. Then, pressure is applied to one main surface and the other main surface to the other side surfaces of the dielectric bases 1 and 10 facing one side, and the first antenna patterns 4 and 13 are set to one main surface. Any configuration that can fix the second antenna patterns 5 and 14 to another main surface may be used. For example, it is conceivable to insert one side surface of the dielectric bases 1 and 10 between the antenna pattern and the rollers that use the dielectric bases 1 and 10 for laminating. Of course, the length between the rollers in the thickness direction of the dielectric substrates 1 and 10 is the same as the opening of the antenna pattern fixing mold 17. When a short line (not shown) is arranged on a surface other than the main surface, one side surface, and the back surface of the dielectric bases 1 and 10, the antenna pattern fixing step may be increased or the adhesive layer 6 may be disposed on the surface. In some cases, it is also necessary to provide it on the surface on which all or part of the short line is arranged. When the dielectric bases 1 and 10 are inserted into the antenna pattern fixing mold 17, the side of the dielectric bases 1 and 10 that are not on the main surface, one side surface, and the back side of the back surface of the antenna pattern is inserted. The possibility of breakage is further reduced. Hereinafter, the dielectric substrate 1 and 10 described in the third and fourth embodiments and the IC chip 3 and the antenna pattern mounted thereon are referred to as a core.

Embodiment 5 FIG.
Embodiment 5 of the present invention will be described with reference to FIGS. The fifth embodiment relates to a method of manufacturing an RFID tag according to the first and second embodiments, and relates to a molding process that has not been described in the third and fourth embodiments. FIG. 25 is a cross-sectional view of a mold (lower mold) used in the RFID tag manufacturing method according to the fifth embodiment, and FIG. 26 is a mold metal used in the RFID tag manufacturing method according to the fifth embodiment. 27 is a cross-sectional view of a mold, FIG. 27 is a cross-sectional view in which resin is injected into a mold for use in the RFID tag manufacturing method according to Embodiment 5, and FIG. 28 is a mold of the RFID tag manufacturing method according to Embodiment 5. Process drawing (final process), FIG. 28A is a cross-sectional view of the molded core taken out from the mold for molding, FIG. 28B is a cross-sectional view of the molded core with the support member removed, and FIG. FIG. 29C is a cross-sectional view of a molded core having an unfilled space of the molding material 7 formed after the support member is removed, and FIG. 29 is a mold for molding used in the RFID tag manufacturing method according to the fifth embodiment. (Lower mold 29A is a diagram of a modification of the core mounting method illustrated in FIG. 25, and FIG. 29B is a diagram in which the core itself is different from the core illustrated in FIG. In FIG. 29, 19 is a lower mold of a mold for molding the core with the molding material 7, 20 is an upper mold of the mold for molding the core with the molding material 7, and 21 is for molding. A support member for holding the core in a predetermined position in the mold, 22 is an injection port for injecting the molding material 7 provided in the upper mold into the mold, and 23 is generated by the support member 21 An unfilled space 24, which is a portion where the core molding material 7 does not exist, is a sealing resin for sealing the unfilled space 23. The injection port 22 may be provided on the lower mold 19 side, or the mating surface of the upper mold 20 and the lower mold 19 so as to be formed on the mating surface of the upper mold 20 and the lower mold 19. A groove having a shape to serve as an inlet may be carved. In the drawings, the same reference numerals denote the same or corresponding parts, and detailed descriptions thereof are omitted. Hereinafter, the molding process will be described.

  First, as shown in FIG. 25, the core is installed in the lower mold 19 of the mold for molding. At this time, the core of the RFID tag configured by molding the core is disposed at a predetermined position. In addition, a rod-like support member 21 is placed on the lower mold 19 and a core is placed thereon. Next, as shown in FIG. 26, the upper mold 20 is placed on the opening of the lower mold 19, and the lower mold 19 and the upper mold 20 are clamped. Here, the space formed in the mold for mold clamping is the outer shape of the RFID tag. In other words, if the support member 21 and the core can be placed in the space formed in the mold for molding, the specifications of the dielectric substrate 1, the IC chip 3, and the antenna pattern constituting the core are changed. Even so, there is no need to change the dimensions or internal shape of the mold. However, in the case of a core having a shape and dimensions such that the thickness of the molding material 7 for molding the core becomes too thin, the support member 21 and the core can be placed in the space formed in the mold for molding. This is not the case. Further, the change in the thickness of the molding material 7 is similar to the change in the specifications of the dielectric substrates 1 and 10 and the IC chip 3 described above, and the antenna performance as the RFID tag may change. In some cases, it is necessary to change the shape of the antenna pattern itself in order to change the dimensions and match the antenna pattern with the IC chip 3.

  After the mold clamping, as shown in FIG. 27, a thermoplastic resin as the molding material 7 is injected from the injection port 22, and the space in the molding die is filled with the molding material 7. After the molding material 7 is solidified, the mold is removed from the mold, the upper mold 20 and the lower mold 19 are separated, vulcanized, and the molded core (RFID tag) is taken out. It goes without saying that the shape and arrangement of the support member 21 need to be selected so that the support state of the core by the support member 21 does not collapse due to the momentum of the molding material 7 injected into the mold. Further, since the support member 21 does not constitute the outer shape of the molded RFID tag, the shape of the support member 21 can be selected regardless of the outer shape of the molded RFID tag. Of course, the shape of the support member 21 may be a shape other than a rod shape, or may not be two as shown in the figure.

  FIG. 28A shows a molded core (RFID tag) taken out from the mold for molding. The support member 21 is pulled out from the molded core as shown in FIG. 28 (b), and the unfilled space 23 of the molding material 7 generated by the drawing is closed with the sealing resin 24 as shown in FIG. 28 (c). Thus, the RFID tag is completed. The sealing resin 24 is ideally the same as the molding material 7 in which the core is molded, but is not necessarily the same. Here, the relationship between the sealing of the unfilled space 23 with the sealing resin 24 described above and the molding process will be described. FIG. 28 is a mold process diagram (final process), but there is an unfilled space 23. Since the molded core can be operated as an RFID tag regardless of whether it is present or not, the sealing of the unfilled space 23 may not be included in the molding process. Of course, a molding process including sealing of the unfilled space 23 may be performed. Although the core alone can operate as an RFID tag, it goes without saying that vulnerability to the environment cannot be denied.

  When there is a possibility of damage or failure of the IC chip 3 due to heat of the molding material 7 which is a thermoplastic resin injected into the mold for molding or flow pressure due to injection, the distance from the IC chip 3 to the injection port 22 is increased. Alternatively, as described above, the influence of the molding material 7 on the IC chip 3 can be reduced by changing the position where the injection port 22 is provided. The same can be said for the antenna pattern. When the injection port 22 is fixed at a place as shown in FIGS. 26 and 27, as shown in FIG. 29 (a), the surface (one main surface) of the dielectric substrate 1 on which the IC chip 3 is mounted is placed on the lower metal. What is necessary is just to perform a molding process by placing the core so as to face the bottom surface of the mold 19. Furthermore, as shown in FIG. 29B, if the molding process is performed with a core in which the IC chip 3 is mounted on one side surface of the dielectric substrate 1, the influence of the molding material 7 on the IC chip 3 can be further reduced. .

  Due to the molding process as described above, a discontinuous surface is hardly generated between the dielectric bases 1 and 10 having no protrusions due to the IC chip 3 and the molding material 7, and the dielectric base expands due to a change in installation environment such as a temperature change. Even when the antenna pattern is reduced, the antenna pattern can be firmly fixed between the dielectric substrates 1 and 10 and the molding material 7. The core to which the antenna pattern having the film base material 16 is attached may be molded as it is, or the antenna base pattern may be left before the film base 16 is removed from the core before molding. In addition, since a mold for molding is used, an RFID tag having a desired outer shape and outer dimension can be obtained. Furthermore, by using the support member 21, a molding process can be performed with a single mold (molding mold) having an internal structure corresponding to the external shape and external dimensions of a desired RFID tag.

  Next, modified examples of the mold and the support member in the molding process of the RFID tag manufacturing method according to Embodiment 5 will be described with reference to FIGS. 30 is a cross-sectional view of a mold (lower mold) used in the RFID tag manufacturing method according to the fifth embodiment, and FIG. 31 is a mold metal used in the RFID tag manufacturing method according to the fifth embodiment. 32 is a cross-sectional view of the mold, FIG. 32 is a cross-sectional view in which resin is injected into a mold for use in the RFID tag manufacturing method according to Embodiment 5, and FIG. 33 is a mold of the RFID tag manufacturing method according to Embodiment 5. Process drawing (final process), FIG. 33 (a) is a sectional view of the molded core taken out from the mold for molding, and FIG. 33 (b) is formed after the supporting member (projection part of the lower mold) is removed. 34 is a cross-sectional view of a molded core having an unfilled space of the mold material 7, FIG. 34 is a cross-sectional view of a mold for molding (lower mold) used in the RFID tag manufacturing method according to Embodiment 5, and FIG. R according to the fifth embodiment 36 is a cross-sectional view of a mold for use in an ID tag manufacturing method, FIG. 36 is a cross-sectional view in which a resin is injected into a mold for use in an RFID tag manufacturing method according to Embodiment 5, and FIG. It is sectional drawing of the RFID tag manufactured by the manufacturing method of the RFID tag which concerns on form 5, In FIG.30-37, 25 is a downward metal mold | die (with a projection part), 26 is the dielectric substrate 1 which is a back surface of a core A protrusion formed on the bottom surface of the lower mold 25 facing the back surface (other main surface), 27 is an unfilled space in which the mold material 7 of the core formed by the protrusion 26 is not present, and 28 is a mold material 7 is a support member made of the same material as that in FIG. In the drawings, the same reference numerals denote the same or corresponding parts, and detailed descriptions thereof are omitted. The molding process described with reference to FIGS. 30 to 33 and the molding process described with reference to FIGS. 34 to 31 will be described with a focus on differences from the molding process described with reference to FIGS.

  The molding process described with reference to FIGS. 30 to 33 and the molding process described with reference to FIGS. 25 to 29 are basically the same except that the form of the support member is different. The difference will be described in detail. The latter is provided separately from the support member 21 and the lower mold 19 of the molding die. However, the former integrates the support member and the lower mold 25 of the molding die. The difference is that the protrusion 26 is formed on the bottom surface of the lower mold 25 facing the back surface (other main surface) of the dielectric substrate 1 which is the back surface of the core.

  30 to 33, first, as shown in FIG. 30, the core is installed in the lower mold 25 of the mold for molding, and at this time, the core is molded. In order to place the core of the RFID tag to be placed at a predetermined position, the core is placed on the protrusion 26 provided on the lower mold 25. Next, as shown in FIG. 31, the upper mold 20 is placed on the opening of the lower mold 25, and the lower mold 25 and the upper mold 20 are clamped. After the mold clamping, as shown in FIG. 32, a thermoplastic resin that is the molding material 7 is injected from the injection port 22, and the space in the molding die is filled with the molding material 7. After the molding material 7 is solidified, the mold is closed and the upper mold 20 and the lower mold 25 are separated and vulcanized to take out the molded core (RFID tag). Since the protrusion 26 does not constitute the outer shape of the molded RFID tag, the shape of the protrusion 26 can be selected regardless of the outer shape of the molded RFID tag. Of course, the shape of the protrusion 26 may be other than a rod shape, and may not be two as shown in the figure. Further, the protrusion 26 has a shape of the lower mold 25 including the protrusion 26 as long as the core can be placed even if the dielectric substrate 1, the IC chip 3, and the antenna pattern constituting the core are changed. There is no need to change.

  FIG. 28A shows a molded core (RFID tag) taken out from the mold for molding. Since the unfilled space 27 of the molding material 7 generated by taking out the molded core is closed with the sealing resin 28 as shown in FIG. 28B, the RFID tag is completed. As shown, it does not take time and effort to pull out the support member 21. Moreover, in the support member 21, it was necessary to select the shape and arrangement of the support member 21 so that the support state of the core by the support member 21 does not collapse due to the momentum of the molding material 7 injected into the mold for molding. Since the protrusion 26 is integrated with the lower mold 25 or inserted into the lower mold 25, the resistance against the momentum of the molding material 7 injected into the mold is increased. 26 can be selected to be thinner than the support member, and the unfilled space 27 can be made smaller than the unfilled space 25.

  The molding process described using FIGS. 34 to 37 and the molding process described using FIGS. 25 to 29 are basically the same except that the material of the support member is different. The difference will be described in detail. In the latter case, the support member 21 is made of a material different from that of the molding material 7, but the former is different in that the support member 28 is made of the same material as that of the molding material 7. .

  34 to 37, first, as shown in FIG. 34, the core is installed in the lower mold 19 of the mold for molding, and at this time, the core is molded. In order to place the RFID tag core in a predetermined position, a rod-like support member 28 is placed on the lower mold 19 and the core is placed thereon. Next, as shown in FIG. 35, the upper mold 20 is placed on the opening of the lower mold 19, and the lower mold 19 and the upper mold 20 are clamped. After the mold clamping, as shown in FIG. 36, a thermoplastic resin as the molding material 7 is injected from the injection port 22, and the space in the mold for molding is filled with the molding material 7. After the molding material 7 is solidified, the mold is removed from the mold, the upper mold 20 and the lower mold 19 are separated, vulcanized, and the molded core (RFID tag) is taken out. It goes without saying that the shape and arrangement of the support member 28 need to be selected so that the support state of the core by the support member 28 does not collapse due to the momentum of the molding material 7 injected into the mold for molding. Since the support member 28 is different from the support member 21 and uses the same material as the molding material 7, there is no need to pull out the support member 28 from the molded core. wide. Further, since the support member 28 does not constitute the outer shape of the molded RFID tag, the shape of the support member 28 can be selected regardless of the outer shape of the molded RFID tag. Of course, the shape of the support member 28 may be other than a rod shape, and may not be two as shown in the figure.

  FIG. 37 shows a molded core (RFID tag) taken out from the mold for molding. Since the RFID tag is completed by taking out the molded core, as shown in FIG. 28 (b), the trouble of pulling out the support member 21 and the unfilled space 27 as shown in FIG. 33 are sealed. It does not take time and effort. Moreover, in the support member 21, it was necessary to select the shape and arrangement of the support member 21 so that the support state of the core by the support member 21 does not collapse due to the momentum of the molding material 7 injected into the mold for molding. By increasing the size of the support member 21, the unfilled space 25 may increase, and the reliability of core sealing may be reduced. However, the support member 28 does not need to be pulled out after the core is molded. The support member 28 can be made larger than the support member 21.

  An outline of the RFID tag manufacturing method according to the third to fifth embodiments will be described. An IC chip is mounted on an antenna pattern to manufacture a tag inlet (an antenna pattern forming step and an IC chip connecting step), and the tag inlet is used as a dielectric substrate. The core is manufactured by being fixed to (a hole forming step, an adhesive layer forming step, an antenna pattern fixing step), and the core is injected into a molding material and molded to manufacture an RFID tag (molding step). The completed RFID tag becomes the RFID tag according to Embodiments 1 and 2 (including the modified example). In the molding process, one main surface and other main surfaces of the dielectric substrates 1 and 10 and all the side surfaces of the dielectric substrates 1 and 10 including the surface of the antenna pattern opposite to the surface in contact with the adhesive layer are formed. As described above, the unfilled spaces 23 and 27 generated when the mold for molding (the lower mold 25) having the support member 21 and the protrusion 26 are used in the molding process are sealed. This includes cases where it is not stopped.

DESCRIPTION OF SYMBOLS 1 ... Dielectric substrate, 2 ... Hole part, 3 ... IC chip, 3a ... IC chip mounting position,
4 ... 1st antenna pattern, 4a-c ... 1st antenna pattern,
43, 45-50 ... short line, 4aa ... meander circuit,
4ba ... stepped impedance, 5 ... second antenna pattern,
5a to d ... second antenna pattern, 51, 52 ... electrical connection, 53 ... dummy pad,
6 ... Adhesive layer, 7 ... Mold material, 8 ... Hole (through hole) 9 ... Filling mold material,
10: Dielectric substrate (with corner), 11 ... Corner, 12 ... Hole (one side),
13 ... 1st antenna pattern, 13a-d ... 1st antenna pattern,
13da ... meander circuit, 14 ... second antenna pattern,
14a to c ... second antenna pattern, 15 ... adhesive layer, 16 ... film substrate,
17 ... Antenna pattern fixing mold, 18 ... Insertion space, 19 ... Lower mold,
20 ... Upper mold, 21 ... Supporting member, 22 ... Injection port, 23 ... Unfilled space, 24 ... Sealing resin,
25 ... Lower mold (with protrusion), 26 ... Projection, 27 ... Unfilled space, 28 ... Support member.

Claims (6)

  1.   A dielectric substrate; an IC chip provided on one principal surface of the dielectric substrate; a first antenna pattern electrically connected to one end of the IC chip and disposed on the one principal surface; A second antenna pattern electrically connected to the other end of the IC chip, arranged from one main surface to one other side of the dielectric substrate, and to the other main surface of the dielectric substrate; An RFID tag comprising: a molding material that covers a dielectric substrate; and a short line that short-circuits the first antenna pattern and the second antenna pattern.
  2.   2. The RFID tag according to claim 1, wherein the one side surface is a side surface of the dielectric substrate closest to the IC chip or a side surface sharing one side with the side surface.
  3.   A dielectric base, an IC chip provided on one side of the dielectric base, and one end of the IC chip that is electrically connected, and disposed from the one side to one main surface of the dielectric base. A first antenna pattern, a second antenna pattern electrically connected to the other end of the IC chip and disposed from the one side surface to the other main surface of the dielectric substrate, and the dielectric substrate. An RFID tag comprising a molding material for covering and having a short line for short-circuiting the first antenna pattern and the second antenna pattern.
  4.   4. The dielectric base according to claim 1, wherein each of the opposing sides of the one side surface on which the first antenna pattern or the second antenna pattern is disposed is rounded. 5. RFID tag.
  5.   The RFID tag according to claim 1, wherein the short line is integral with the first antenna pattern and the second antenna pattern.
  6.   The RFID tag according to claim 1, wherein the short line is disposed on at least one of the one main surface, the one side surface, and the other main surface.
JP2011130375A 2008-02-27 2011-06-10 RFID tag Expired - Fee Related JP5460646B2 (en)

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TWI607601B (en) * 2015-02-10 2017-12-01 Phoenix Solution Co Ltd RF tag antenna and its manufacturing method and RF tag
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