JP2011188459A - High frequency coupler - Google Patents

High frequency coupler Download PDF

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JP2011188459A
JP2011188459A JP2010054764A JP2010054764A JP2011188459A JP 2011188459 A JP2011188459 A JP 2011188459A JP 2010054764 A JP2010054764 A JP 2010054764A JP 2010054764 A JP2010054764 A JP 2010054764A JP 2011188459 A JP2011188459 A JP 2011188459A
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antenna element
circle
path
circuit board
frequency coupler
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JP5634084B2 (en
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Hideyuki Usui
英之 臼井
Daisuke Dobashi
大亮 土橋
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Tyco Electronics Japan GK
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Tyco Electronics Japan GK
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Priority to JP2010054764A priority Critical patent/JP5634084B2/en
Priority to TW100202220U priority patent/TWM408891U/en
Priority to CN201180013435.4A priority patent/CN102782938B/en
Priority to KR1020127022413A priority patent/KR20130006601A/en
Priority to PCT/JP2011/054735 priority patent/WO2011111578A1/en
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    • H04B5/26
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/36Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00Antenna arrays or systems
    • H01Q21/06Arrays of individually energised antenna units similarly polarised and spaced apart

Abstract

<P>PROBLEM TO BE SOLVED: To provide a high frequency coupler that is immune to a traverse shift, while achieving small-sizing and thinning, in the high frequency coupler being used for communicating a high frequency signal. <P>SOLUTION: A high frequency coupler includes: a circuit board; and an antenna element which is formed on either a front surface or an inner surface of the circuit board and having shape which turns around along the circle while alternately repeating a first route extending from the inside of the circle to the outside thereof and a second route extending from the outside of the circle to the inside thereof when a circle is drawn on the surface. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

本発明は、高周波信号の通信に用いられる高周波結合器に関する。   The present invention relates to a high-frequency coupler used for high-frequency signal communication.

近年、広帯域無線技術をベースとした近接無線転送技術が提案され、今後の普及が期待されている。この近接無線転送技術は、誘導電界を用いたアンテナを介して非接触で通信を行う技術である。この近接無線転送技術は、大容量データを高速かつ短時間で転送することができる技術であって、例えば音楽データや動画データなどといった大容量データの転送に好適である。また、この近接無線転送技術は、通信距離が数cm以内と想定されており、通信時におけるデータ漏洩の可能性が低いといった利点も有する。   In recent years, proximity wireless transfer technology based on broadband wireless technology has been proposed and is expected to become popular in the future. This proximity wireless transfer technology is a technology for performing contactless communication via an antenna using an induction electric field. This proximity wireless transfer technology is a technology capable of transferring a large amount of data at a high speed in a short time, and is suitable for transferring a large amount of data such as music data or moving image data. In addition, this proximity wireless transfer technology is assumed to have a communication distance of several centimeters or less, and has an advantage that the possibility of data leakage during communication is low.

このような近接無線転送技術を実現する手段として、例えば、結合用の電極を線状導体で構成しコイル状に折りたたんだ構造の高周波結合器が提案されている(特許文献1)。   As means for realizing such a proximity wireless transfer technology, for example, a high-frequency coupler having a structure in which a coupling electrode is formed of a linear conductor and folded in a coil shape has been proposed (Patent Document 1).

また、高周波結合器を基板上に形成した構造も提案されている(特許文献2)。   A structure in which a high-frequency coupler is formed on a substrate has also been proposed (Patent Document 2).

特開2009−100111号公報JP 2009-100111 A 特開2008−271606号公報JP 2008-271606 A

この高周波結合器は、例えば携帯電話機等の小型機器に搭載されることが想定されており、小型化、薄型化の要請が強い。   This high-frequency coupler is assumed to be mounted on a small device such as a mobile phone, and there is a strong demand for downsizing and thinning.

しかしながら、特許文献1に開示されている線状導体をコイル状に折りたたんだ構造の高周波結合器の場合、コイル状に折り畳んだとはいえ、コイルの寸法分の高さが必要となり、携帯電話機のような小型機器への搭載に十分なレベルにまで小型化、薄型化するのは難しい。   However, in the case of the high-frequency coupler having a structure in which the linear conductor disclosed in Patent Document 1 is folded in a coil shape, the height of the coil is required although it is folded in a coil shape. It is difficult to reduce the size and thickness to a level sufficient for mounting on such a small device.

また、高周波結合器に要求されるもう1つの点は、送信側の高周波結合器と受信側の高周波結合器との横ずれの許容度を上げることである。送信側と受信側の2つの高周波結合器を互いに正しく正対させたときは十分な結合強度が得られそれらの間での通信が可能であったとしても、それら2つの高周波結合器を相対的に横にずらしたときに結合強度が急激に弱まってしまうと使いにくいものとなってしまう。   Another requirement of the high frequency coupler is to increase the tolerance of lateral deviation between the high frequency coupler on the transmission side and the high frequency coupler on the reception side. When the two high-frequency couplers on the transmission side and the reception side are correctly aligned with each other, even if sufficient coupling strength is obtained and communication between them is possible, the two high-frequency couplers are relatively If the bond strength is suddenly weakened when it is shifted to the side, it becomes difficult to use.

このため、2つの高周波結合器を相対的に横にずらしたときに、十分な結合強度が得られる横距離が問題となる。   For this reason, when the two high-frequency couplers are shifted relative to each other, the lateral distance at which sufficient coupling strength is obtained becomes a problem.

特許文献2に開示された高周波結合器は、基板上に形成されており、特許文献1に開示された高周波結合器と比べ小型化の点では優れているが、後述する比較例に示すように横ずれに対する許容度が低くなると考えられる。   The high frequency coupler disclosed in Patent Document 2 is formed on a substrate and is superior in terms of miniaturization as compared with the high frequency coupler disclosed in Patent Document 1, but as shown in a comparative example described later. It is considered that the tolerance for lateral displacement is lowered.

本発明は、小型化、薄型化を図りながら、さらに横ずれに強い高周波結合器を提供することを目的とする。   It is an object of the present invention to provide a high-frequency coupler that is more resistant to lateral displacement while being reduced in size and thickness.

上記目的を達成する本発明の高周波結合器は、回路基板と、その回路基板の表面又は内面のうちのいずれかの面に形成された、その面の上に円を描いたときのその円の内側から外側に延びる第1経路と、その円の外側から内側に延びる第2経路とを交互に繰り返しながらその円に沿って周回する形状のアンテナ素子とを備えたことを特徴とする。   The high-frequency coupler of the present invention that achieves the above object is formed on a surface of a circuit board and either the surface or the inner surface of the circuit board, and when the circle is drawn on the surface, An antenna element having a shape that circulates along the circle while alternately repeating a first path extending from the inside to the outside and a second path extending from the outside to the inside of the circle is provided.

ここで、本発明の高周波結合器において、上記アンテナ素子を構成する第1経路および第2経路は、いずれも直線的に延びる経路であって、互いに隣接する第1経路と第2経路が互いの間に角を成して互いに接して交互に繰り返しているものであってもよい。   Here, in the high frequency coupler of the present invention, the first path and the second path that constitute the antenna element are both linearly extending paths, and the first path and the second path that are adjacent to each other are mutually connected. They may be alternately repeated in contact with each other with an angle between them.

さらに、本発明の高周波結合器は、上記回路基板の表面又は内面の上に形成された、上記アンテナ素子を周回する第2のアンテナ素子を有することも好ましい形態である。   Furthermore, the high-frequency coupler according to the present invention preferably includes a second antenna element that circulates around the antenna element and is formed on the surface or the inner surface of the circuit board.

また、本発明の高周波結合器は、上記回路基板の表面に、前記アンテナ素子を周回するループ状アンテナ素子を有するものであってもよい。   The high-frequency coupler of the present invention may have a loop antenna element that circulates around the antenna element on the surface of the circuit board.

本発明によれば、同形のアンテナ素子を有する送信用高周波結合器と受信用高周波結合器とを互いに重ね合わせて横にずらしていったときであっても、送信用と受信用とで互いに平行に近接した線分のペアが形成され、したがって横ずれがあっても強い結合強度が保たれる。   According to the present invention, even when the transmission high-frequency coupler and the reception high-frequency coupler having the same shape of the antenna element are overlapped with each other and shifted laterally, the transmission and reception are parallel to each other. A pair of line segments close to each other is formed, so that strong coupling strength is maintained even if there is a lateral shift.

本発明の実施形態の高周波結合器の表面(A)および裏面(B)を示した図である。It is the figure which showed the surface (A) and back surface (B) of the high frequency coupler of embodiment of this invention. それぞれにアンテナ素子が形成された、送信用と受信用の2枚の回路基板が重なった状態(A)と横にずらした状態(B)を示した図である。It is the figure which showed the state (A) and the state shifted to the side (B) where two circuit boards for transmission and reception each formed with an antenna element overlap each other. 円形のアンテナ素子を横にずらした状態を示した図である。It is the figure which showed the state which shifted the circular antenna element sideways. 星形のアンテナ素子を横にずらした状態を示した図である。It is the figure which showed the state which shifted the star-shaped antenna element sideways. 横へのずらし量と結合強度との関係を示した図である。It is the figure which showed the relationship between the shift amount to a side, and coupling strength. 図1に示す実施形態の各種変形例を示した図である。It is the figure which showed the various modifications of embodiment shown in FIG. アンテナ素子の変形例を示した図である。It is the figure which showed the modification of the antenna element.

以下、本発明の実施形態を説明する。   Embodiments of the present invention will be described below.

図1は、本発明の一実施形態の高周波結合器の表面(A)および裏面(B)を示した図である。   FIG. 1 is a view showing a front surface (A) and a back surface (B) of a high-frequency coupler according to an embodiment of the present invention.

この高周波結合器10は、図1(A)に示すように、回路基板20と、その回路基板20の表面に形成された星形のアンテナ素子30と、その回路基板20の表面に、星形のアンテナ素子30を周回するように形成されたループ状アンテナ素子40とを有する。さらに、図1(B)に示すように、回路基板20の裏面には、その中央部分に広くグランド面33が形成されており、そのグランド面33が切除された開口内に星型アンテナ素子30用の給電部34が形成されている。回路基板20の表面に形成された星形のアンテナ素子30の一端は、スルーホール38を介して回路基板20の裏面に形成された給電部34に接続され、星型のアンテナ素子30の他端は、スルーホール39を介して、回路基板20の裏面のグランド面33に接続されている。   As shown in FIG. 1A, the high-frequency coupler 10 includes a circuit board 20, a star-shaped antenna element 30 formed on the surface of the circuit board 20, and a star shape on the surface of the circuit board 20. A loop antenna element 40 formed so as to circulate around the antenna element 30. Further, as shown in FIG. 1B, a ground surface 33 is widely formed at the center of the back surface of the circuit board 20, and the star antenna element 30 is formed in the opening from which the ground surface 33 is cut. A power feeding section 34 is formed. One end of the star-shaped antenna element 30 formed on the surface of the circuit board 20 is connected to the power feeding portion 34 formed on the back surface of the circuit board 20 through the through hole 38, and the other end of the star-shaped antenna element 30 is formed. Is connected to the ground surface 33 on the back surface of the circuit board 20 through the through hole 39.

また、この回路基板20の裏面には、ループ状アンテナ素子40用の2つの給電部41が形成されている。回路基板20の表面に形成されたループ状アンテナ素子40の両端は、スルーホール49を介して、回路基板20の裏面の2つの給電部41にそれぞれ接続されている。   In addition, two power feeding portions 41 for the loop antenna element 40 are formed on the back surface of the circuit board 20. Both ends of the loop antenna element 40 formed on the surface of the circuit board 20 are connected to the two power feeding portions 41 on the back surface of the circuit board 20 through the through holes 49, respectively.

星形のアンテナ素子30は、回路基板20の表面に円37を描いたときの、その円37の内側から外側に延びる第1経路31と、その円37の外側から内側に延びる第2経路32とを交互に繰り返しながらその円37に沿って周回する形状を有する。このアンテナ素子30は、図1に示すように、幅が約10mm程度の大きさのアンテナ素子であり、4〜5GH帯の波長で高速通信を行なうことができる。 The star-shaped antenna element 30 includes a first path 31 extending from the inside to the outside of the circle 37 and a second path 32 extending from the outside to the inside of the circle 37 when the circle 37 is drawn on the surface of the circuit board 20. And alternately and repeatedly around the circle 37. The antenna element 30, as shown in FIG. 1, a size of the antenna elements having a width of about of about 10 mm, it is possible to perform high-speed communications at a wavelength of 4~5GH Z bands.

また、この図1に示すアンテナ素子30の場合、第1経路31と第2経路32は、いずれも直線的に延びる経路であって、互いに隣接する第1経路31と第2経路32が互いの間に角を成し互いに接して交互に繰り返している。   In the antenna element 30 shown in FIG. 1, the first path 31 and the second path 32 are both linearly extending paths, and the first path 31 and the second path 32 adjacent to each other are mutually connected. It repeats alternately with an angle in between and touching each other.

また、ループ状アンテナ素子40は、前述の通り回路基板20の表面に、星形のアンテナ素子30を周回するように形成されている。このループ状アンテナ素子の両端は、一対のスルーホール49を介して、回路基板20の裏面に形成された2つの給電部41に接続されている。   The loop-shaped antenna element 40 is formed on the surface of the circuit board 20 so as to go around the star-shaped antenna element 30 as described above. Both ends of the loop antenna element are connected to two power feeding portions 41 formed on the back surface of the circuit board 20 through a pair of through holes 49.

このループ状アンテナ素子40は、いわゆるRFIDの無線アンテナとして用いるものである。   The loop antenna element 40 is used as a so-called RFID radio antenna.

図2は、それぞれにアンテナ素子が形成された、送信用と受信用の2枚の回路基板が重なった状態(A)と横にずらした状態(B)を示した図である。   FIG. 2 is a diagram showing a state (A) in which two circuit boards for transmission and reception, each having an antenna element formed thereon, are overlapped (A) and a state (B) in which they are shifted laterally.

ここでは、図1に示す星形のアンテナ素子30を送信用と受信用として2つ用意し、図2(A)から図2(B)のように、相対的に横にずらした場合について考察する。ここでは、送信用と受信用の2つのアンテナ素子どうしの間隔は1mmである。   Here, consideration is given to a case where two star-shaped antenna elements 30 shown in FIG. 1 are prepared for transmission and reception, and are relatively shifted laterally as shown in FIG. 2 (A) to FIG. 2 (B). To do. Here, the interval between the two antenna elements for transmission and reception is 1 mm.

図3は、円形のアンテナ素子を横にずらした状態を示した図である。この円形のアンテナ素子は、本発明の実施形態と対比される比較例のアンテナ素子である。   FIG. 3 is a diagram showing a state in which a circular antenna element is shifted laterally. This circular antenna element is a comparative antenna element compared with the embodiment of the present invention.

送信用のアンテナ素子と受信用のアンテナ素子との結合強度は、大まかには、互いに近接して互いに平行に延びる線分のペアの長さとその近接の程度によって決定される。   The coupling strength between the transmitting antenna element and the receiving antenna element is roughly determined by the length of a pair of line segments that are close to each other and extend parallel to each other and the degree of proximity.

図3(A)のように、送信用と受信用の2つのアンテナ素子50A,50Bが少しだけずれたときは、この図3(A)の上下部分に送信用のアンテナ素子50Aと受信用アンテナ素子50Bとの間で互いに近接した平行な線分ペアが存在するが、図3(B)のように大きくずれると、互いに平行な部分は互いに離れてしまい、弱い結合強度しか得られない。   When the two antenna elements 50A and 50B for transmission and reception are slightly shifted as shown in FIG. 3A, the antenna element 50A for transmission and the antenna for reception are placed in the upper and lower parts of FIG. 3A. There are parallel line segment pairs that are close to each other with the element 50B. However, if they are largely shifted as shown in FIG. 3B, the parallel parts are separated from each other, and only weak coupling strength is obtained.

図4は、星形のアンテナ素子を横にずらした状態を示した図である。   FIG. 4 is a diagram showing a state in which the star-shaped antenna element is shifted laterally.

図4(A)のように、送信用と受信用の2つのアンテナ素子60A,60Bが少しだけずれたときは、送信用のアンテナ素子60Aと受信用アンテナ素子60Bとの間では、ほぼ全周に亘り、互いに近接した互いに平行な線分が存在する。また、図4(B)のように大きくずれても、図4(B)に点線で囲った部分のように、互いに近接しかつ互いに平行な線分ペアが存在する。したがって、図4(B)のように横に大きくずれても強い結合強度が得られる。   As shown in FIG. 4A, when the two antenna elements 60A and 60B for transmission and reception are slightly shifted, the entire circumference between the antenna element 60A for transmission and the antenna element 60B for reception is almost the entire circumference. There are parallel line segments that are close to each other. 4B, line segment pairs that are close to each other and parallel to each other exist as shown by a dotted line in FIG. 4B. Therefore, a strong coupling strength can be obtained even if it is greatly displaced laterally as shown in FIG.

図5は、図1に示す星形のアンテナ素子(実施例)と、それと同じ波長領域での送受信が可能な円形のアンテナ素子(比較例)における、横へのずらし量と結合強度との関係を示した図である。   FIG. 5 shows the relationship between the lateral shift amount and the coupling strength in the star-shaped antenna element (example) shown in FIG. 1 and the circular antenna element (comparative example) capable of transmitting and receiving in the same wavelength region. FIG.

「実施例」は、図1に示す形状の星形であって、10mm程度の幅寸法を有し、4〜5GH帯の電波を送受信するように長さが決められたアンテナ素子である。また、「比較例」は、円形平板状のアンテナ素子であって、「実施例」と同じく、4〜5GHの周波数帯の電波を送受信するように長さが決められている。 "Example" is a star shape as shown in FIG. 1, has a width of about 10 mm, an antenna element whose length is determined so as to transmit and receive radio waves 4~5GH Z bands. Furthermore, "comparative example" is a circular plate-shaped antenna elements, as in the "Examples", is the length to transmit and receive radio waves in the frequency band of 4~5GH Z are determined.

さらに、「実施例」と「比較例」のいずれの場合も、送信用アンテナ素子と受信用アンテナ素子との間の対面方向の間隔は1mmである(図2参照)。   Further, in both the “Example” and “Comparative Example”, the distance in the facing direction between the transmitting antenna element and the receiving antenna element is 1 mm (see FIG. 2).

図5の横軸は相対的なずらし距離[mm]、縦軸は結合強度[dB]を示している。結合強度[dB]は、送信用のアンテナ素子に投入した電力に対する受信用のアンテナ素子に伝達された電力をデシベル(dB)で表わしたものである。   In FIG. 5, the horizontal axis indicates the relative shift distance [mm], and the vertical axis indicates the coupling strength [dB]. The coupling strength [dB] is expressed in decibels (dB) of the power transmitted to the receiving antenna element with respect to the power input to the transmitting antenna element.

ここでは、4〜5GHの周波数帯域をさらに複数の周波数帯域に分割したときの各周波数帯域ごとの結合強度のうちの、各ずらし距離におけるピークの周波数帯域における結合強度をプロットしている。 Here plots the binding strength, in the frequency band of the peaks in the shifting distance of the coupling strength of each frequency band when were further divided into a plurality of frequency bands the frequency band of 4~5GH Z.

図5に破線で示す比較例の場合は、約10mm以上のずらし距離で結合強度が大きく低下しているのに対し、実施例の場合、比較例のような結合強度の急激な低下は見られない。すなわち、実施例の場合、送信用のアンテナ素子に対し、受信用のアンテナ素子をかなりずれた位置に配置してもそれらの間での通信が可能であり、実用性に優れたものとなる。   In the case of the comparative example shown by the broken line in FIG. 5, the bond strength is greatly reduced at a shift distance of about 10 mm or more, whereas in the case of the example, a sharp decrease in the bond strength as in the comparative example is seen. Absent. That is, in the case of the embodiment, even if the receiving antenna element is arranged at a position considerably deviated from the transmitting antenna element, communication is possible between them, and the practicality is excellent.

図6は、図1に示す実施形態の各種変形例を示した図である。   FIG. 6 is a diagram showing various modifications of the embodiment shown in FIG.

図6(A)に示す高周波結合器10Aは、星形のアンテナ素子30Aと、グランド面33Aと、給電部34Aを、いずれも回路基板20Aの同一表面に形成した例である。   A high-frequency coupler 10A shown in FIG. 6A is an example in which a star-shaped antenna element 30A, a ground plane 33A, and a power feeding portion 34A are all formed on the same surface of the circuit board 20A.

このように、本発明の高周波結合器は、回路基板の一面のみに全要素を形成することも可能である。   Thus, the high frequency coupler of the present invention can also form all elements on only one surface of the circuit board.

また、図6(B)に示す高周波結合器10Bは、図6(A)と同様、星形のアンテナ素子30B、グランド面33B、および給電部34Bの全要素を回路基板20Bの同一面に形成した例であるが、グランド面33Bには開口331Bが形成され、アンテナ素子30Bはその開口331B内に配置されている。   Further, in the high frequency coupler 10B shown in FIG. 6B, all elements of the star-shaped antenna element 30B, the ground surface 33B, and the power feeding portion 34B are formed on the same surface of the circuit board 20B as in FIG. 6A. In this example, an opening 331B is formed in the ground surface 33B, and the antenna element 30B is disposed in the opening 331B.

さらに、図6(C)示す高周波結合器10Cは、図6(A),(B)と同様、星形のアンテナ素子30C、グランド面33C、および給電部34Cを回路基板20Cの同一面に形成し、さらに、図6(B)と同様、グランド面33Cがアンテナ素子30Cを取り巻くように広がっている。ただし、図6(B)では、アンテナ素子30Bを取り巻く開口331Bが一部が直線の円弧形状であり、図6(C)では、アンテナ素子30Cを取り巻く開口331Cが矩形である点が異なっている。   Further, in the high frequency coupler 10C shown in FIG. 6C, as in FIGS. 6A and 6B, the star-shaped antenna element 30C, the ground surface 33C, and the feeding portion 34C are formed on the same surface of the circuit board 20C. Further, similarly to FIG. 6B, the ground surface 33C spreads so as to surround the antenna element 30C. However, in FIG. 6B, the opening 331B surrounding the antenna element 30B has a partially circular arc shape, and in FIG. 6C, the opening 331C surrounding the antenna element 30C is rectangular. .

図1および図6(A)〜(C)に示すように、アンテナ素子とグランド面の配置には様々な形態があり得る。   As shown in FIG. 1 and FIGS. 6A to 6C, the antenna element and the ground plane can be arranged in various forms.

図7は、アンテナ素子の変形例を示す図である。   FIG. 7 is a diagram illustrating a modification of the antenna element.

図1に示すアンテナ素子30の場合、第1経路31と第2経路32は、円37の外側においても内側においてもそれらの間に角を成して直接に接して交互に繰り返しながら円37に沿って周回している。   In the case of the antenna element 30 shown in FIG. 1, the first path 31 and the second path 32 are formed in the circle 37 while being alternately in contact with each other at an angle between the inside and the outside of the circle 37. It is circling along.

これに対し、図7に示すアンテナ素子30Dの場合、第1経路31Dと第2経路32Dは、円37Dの内側では角を成して直接に接しているが、円37Dの外側では、第1経路31Dと第2経路32Dは、直接には接しておらず、円37Dと平行に延びる線分35Dを介して接続されている。或いは、第1経路31Dと第2経路32Dは、線分35Dの代りに曲線を介して接続されてもよい。線分又は曲線を介して接続されるのは、円37Dの外側である代りに円37Dの内側でもよく、或いは円37Dの外側及び内側の双方でもよい。   On the other hand, in the case of the antenna element 30D shown in FIG. 7, the first path 31D and the second path 32D are in direct contact with each other while forming an angle inside the circle 37D, but the first path 31D and the second path 32D are outside the circle 37D. The path 31D and the second path 32D are not in direct contact with each other, but are connected via a line segment 35D extending in parallel with the circle 37D. Alternatively, the first path 31D and the second path 32D may be connected via a curve instead of the line segment 35D. Instead of being outside the circle 37D, it may be connected via a line segment or a curve inside the circle 37D, or both outside and inside the circle 37D.

本発明では、このように第1経路と第2経路が必ずしも直接に接続されている必要はない。   In the present invention, the first route and the second route are not necessarily directly connected as described above.

また、本実施形態では、星形のアンテナ素子は回路基板の表面に形成されていたが、回路基板の内面に形成されてもよい。   In the present embodiment, the star-shaped antenna element is formed on the surface of the circuit board, but may be formed on the inner surface of the circuit board.

10,10A,10B,10C 高周波結合器
20,20A,20B,20C 回路基板
30,30A,30B,30C,30D,50A,50B,60A,60B アンテナ素子
31,31D 第1経路
32,32D 第2経路
33,33A,33B,33C グランド面
34,34A,34B,34C,41 給電部
35D 線分
37,37D 円
38,39,49 スルーホール
40 ループ状アンテナ素子
331B,331C 開口
10, 10A, 10B, 10C High frequency coupler 20, 20A, 20B, 20C Circuit board 30, 30A, 30B, 30C, 30D, 50A, 50B, 60A, 60B Antenna elements 31, 31D First path 32, 32D Second path 33, 33A, 33B, 33C Ground plane 34, 34A, 34B, 34C, 41 Feeding portion 35D Line segment 37, 37D Circle 38, 39, 49 Through hole 40 Loop antenna element 331B, 331C Opening

Claims (3)

回路基板と、
前記回路基板の表面又は内面のうちのいずれかの面に形成された、該面上に円を描いたときの該円の内側から外側に延びる第1経路と、該円の外側から内側に延びる第2経路とを交互に繰り返しながら該円に沿って周回する形状のアンテナ素子とを備えたことを特徴とする高周波結合器。
A circuit board;
A first path formed on either the surface or the inner surface of the circuit board and extending from the inside to the outside of the circle when a circle is drawn on the surface, and extending from the outside to the inside of the circle An antenna element having a shape that circulates along the circle while alternately repeating the second path.
前記第1経路および前記第2経路が、いずれも直線的に延びる経路であって、互いに隣接する第1経路と第2経路が互いの間に角を成し互いに接して交互に繰り返していることを特徴とする請求項1記載の高周波結合器。   The first path and the second path are both linearly extending paths, and the first path and the second path adjacent to each other form an angle between each other and contact each other and repeat alternately. The high frequency coupler according to claim 1. 前記回路基板の表面に、前記アンテナ素子を周回するループ状アンテナ素子を有することを特徴とする請求項1又は2記載の高周波結合器。   3. The high frequency coupler according to claim 1, further comprising a loop antenna element that circulates around the antenna element on a surface of the circuit board.
JP2010054764A 2010-03-11 2010-03-11 High frequency coupler Expired - Fee Related JP5634084B2 (en)

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CN201180013435.4A CN102782938B (en) 2010-03-11 2011-03-02 High-frequency coupler
KR1020127022413A KR20130006601A (en) 2010-03-11 2011-03-02 High frequency coupler
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