JP2011183589A - Sealing apparatus - Google Patents
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- JP2011183589A JP2011183589A JP2010048902A JP2010048902A JP2011183589A JP 2011183589 A JP2011183589 A JP 2011183589A JP 2010048902 A JP2010048902 A JP 2010048902A JP 2010048902 A JP2010048902 A JP 2010048902A JP 2011183589 A JP2011183589 A JP 2011183589A
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- sealing
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- condition setting
- seal
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/18—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/18—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools
- B29C65/24—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools characterised by the means for heating the tool
- B29C65/30—Electrical means
- B29C65/305—Electrical means involving the use of cartridge heaters
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/05—Particular design of joint configurations
- B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
- B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
- B29C66/112—Single lapped joints
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/05—Particular design of joint configurations
- B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
- B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
- B29C66/114—Single butt joints
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
- B29C66/51—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
- B29C66/53—Joining single elements to tubular articles, hollow articles or bars
- B29C66/534—Joining single elements to open ends of tubular or hollow articles or to the ends of bars
- B29C66/5346—Joining single elements to open ends of tubular or hollow articles or to the ends of bars said single elements being substantially flat
- B29C66/53461—Joining single elements to open ends of tubular or hollow articles or to the ends of bars said single elements being substantially flat joining substantially flat covers and/or substantially flat bottoms to open ends of container bodies
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/80—General aspects of machine operations or constructions and parts thereof
- B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
- B29C66/832—Reciprocating joining or pressing tools
- B29C66/8322—Joining or pressing tools reciprocating along one axis
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/90—Measuring or controlling the joining process
- B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
- B29C66/912—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by measuring the temperature, the heat or the thermal flux
- B29C66/9121—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by measuring the temperature, the heat or the thermal flux by measuring the temperature
- B29C66/91211—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by measuring the temperature, the heat or the thermal flux by measuring the temperature with special temperature measurement means or methods
- B29C66/91216—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by measuring the temperature, the heat or the thermal flux by measuring the temperature with special temperature measurement means or methods enabling contactless temperature measurements, e.g. using a pyrometer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/90—Measuring or controlling the joining process
- B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
- B29C66/912—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by measuring the temperature, the heat or the thermal flux
- B29C66/9121—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by measuring the temperature, the heat or the thermal flux by measuring the temperature
- B29C66/91221—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by measuring the temperature, the heat or the thermal flux by measuring the temperature of the parts to be joined
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/90—Measuring or controlling the joining process
- B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
- B29C66/914—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux
- B29C66/9141—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the temperature
- B29C66/91411—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the temperature of the parts to be joined, e.g. the joining process taking the temperature of the parts to be joined into account
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/90—Measuring or controlling the joining process
- B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
- B29C66/914—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux
- B29C66/9141—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the temperature
- B29C66/91441—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the temperature the temperature being non-constant over time
- B29C66/91443—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the temperature the temperature being non-constant over time following a temperature-time profile
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/90—Measuring or controlling the joining process
- B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
- B29C66/919—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges
- B29C66/9192—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams
- B29C66/91951—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams in explicit relation to time, e.g. temperature-time diagrams
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/90—Measuring or controlling the joining process
- B29C66/96—Measuring or controlling the joining process characterised by the method for implementing the controlling of the joining process
- B29C66/961—Measuring or controlling the joining process characterised by the method for implementing the controlling of the joining process involving a feedback loop mechanism, e.g. comparison with a desired value
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/90—Measuring or controlling the joining process
- B29C66/96—Measuring or controlling the joining process characterised by the method for implementing the controlling of the joining process
- B29C66/967—Measuring or controlling the joining process characterised by the method for implementing the controlling of the joining process involving special data inputs or special data outputs, e.g. for monitoring purposes
- B29C66/9674—Measuring or controlling the joining process characterised by the method for implementing the controlling of the joining process involving special data inputs or special data outputs, e.g. for monitoring purposes involving special data outputs, e.g. special data display means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/82—Testing the joint
- B29C65/8207—Testing the joint by mechanical methods
- B29C65/8215—Tensile tests
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/82—Testing the joint
- B29C65/8207—Testing the joint by mechanical methods
- B29C65/8223—Peel tests
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/82—Testing the joint
- B29C65/8253—Testing the joint by the use of waves or particle radiation, e.g. visual examination, scanning electron microscopy, or X-rays
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/756—Microarticles, nanoarticles
Abstract
Description
本発明は,遺伝子解析などのバイオ関連の研究や生産に用いられるマイクロチップのチップ本体と蓋を溶着するシール装置に関する。なお、一般的にはマイクロチップとは集積回路を作り付けた半導体小片のことであるが、ここでは、化学物質やDNA、たんぱく質などの反応、分離、精製、検出などを行う複雑な化学システムを1つの基板上に集積したものを指すものとする。 The present invention relates to a sealing device for welding a chip body and a lid of a microchip used for bio-related research and production such as gene analysis. In general, a microchip is a small semiconductor chip in which an integrated circuit is built. Here, a complex chemical system that performs reactions, separation, purification, detection, etc. of chemical substances, DNA, proteins, etc. It shall be the one integrated on one substrate.
近年、化学反応やDNA反応、たんぱく質反応などをチップ上にて行う半導体微細加工技術や精密合成技術,微小流体制御技術を応用したマイクロ,ナノバイオデバイスであるμ−TotalAnalysis System(μ−TAS)技術やLab−On−Chip技術が実現してきており、今まで大型の実験装置や大量の試薬が必要であった反応実験が、マイクロチップを用いて少量の試薬で行えるようになってきている。 In recent years, μ-Total Analysis System (μ-TAS) technology, which is a micro- and nano-biodevice applying semiconductor microfabrication technology, precision synthesis technology, and microfluidic control technology that perform chemical reaction, DNA reaction, protein reaction, etc. on the chip, Lab-On-Chip technology has been realized, and reaction experiments, which have so far required a large experimental apparatus and a large amount of reagents, can be performed with a small amount of reagents using a microchip.
このようなマイクロチップなどの反応容器を用いた反応実験における処理は、通常、容器上に規則的に配列された窪み形状をしたウェル状反応部(以下、ウェル)の中に、検出対象となる検体を含んだ試薬液が分注された状態で行われる。このウェル内への試薬液分注工程においては、通常ピペット先端に装着されたピペットチップ内に試験管内から試薬液が吸引され、任意のウェル状反応部に反応試薬が分注されるといった処理が繰り返された後、加熱加圧による熱溶着により、蓋材が接合され、各ウェル、ならびに各ウェル間を繋ぐ流路が形成される。 Processing in a reaction experiment using such a reaction vessel such as a microchip is usually a detection target in a well-shaped reaction portion (hereinafter, well) having a hollow shape regularly arranged on the vessel. This is performed in a state where a reagent solution containing a specimen is dispensed. In this reagent solution dispensing step, the reagent solution is normally sucked from the test tube into the pipette tip attached to the pipette tip, and the reaction reagent is dispensed into any well-like reaction part. After the repetition, the lid member is joined by thermal welding by heating and pressurization, and each well and a flow path connecting the wells are formed.
前述したマイクロチップなどの反応容器を用いた反応実験においては、規定されたウェルの容積や各ウェル間の流路容積が一定に保たれる事と、試薬送液時にモレが無い事が必要とされる。 In the above-described reaction experiment using a reaction vessel such as a microchip, it is necessary that the defined well volume and the channel volume between the wells are kept constant and that there is no leakage during reagent feeding. Is done.
シール装置を用いた熱溶着工程においては、シール温度が低いと試薬送液時、ウェルおよびウェル間流路からの試薬モレを起こしたり、シール後に蓋材が剥離してしまう溶着不良が発生し、シール温度が高いとウェルおよびウェル間流路の容積が小さくなる事、シール前に予め分注された反応試薬が熱により失活して、反応機能が低下する現象が起こる事などの不具合が生じる。 In the thermal welding process using the sealing device, if the sealing temperature is low, a reagent failure from the well and the flow path between the wells when the reagent is fed, or a welding failure that the lid material peels off after sealing occurs, If the sealing temperature is high, the volume of the well and the flow path between the wells will be reduced, and the reaction reagent dispensed before sealing will be deactivated by heat, resulting in a phenomenon that the reaction function deteriorates. .
これらの不具合を解消するため、比較的低温でプラスチック同士を接合する方法(特許文献1)や、接着と熱溶着を併合した接合方法(特許文献2)が考案されている。 In order to eliminate these problems, a method of joining plastics at a relatively low temperature (Patent Document 1) and a joining method that combines adhesion and thermal welding (Patent Document 2) have been devised.
上記シール方法の工夫により、シール不良発生率を減らす事は可能であるが、反応容器と蓋材を接合するシール工程において、蓋材と反応容器からなるシール部材のシール装置への装着ミスやシール装置設定管理ミス、シール部材自体の形状不良などにより、反応容器と蓋材の接合不良が生じてしまう場合が想定され、この僅かな不良の発生が個々の反応実験に支障をきたしてしまい、正確な反応実験結果が得られなくなってしまう。したがっ
て、シール工程におけるシール状態の検査が強く望まれている。
It is possible to reduce the failure rate of seals by devising the above sealing method. It is assumed that there is a case where a bonding failure between the reaction vessel and the cover material occurs due to a mistake in device setting management, a defective shape of the seal member itself, etc. The result of the reaction experiment cannot be obtained. Therefore, the inspection of the sealing state in the sealing process is strongly desired.
正しくシールされたかどうかを確認する手段として、例えば各部材が透過性の材料である場合、溶着跡にムラが無いかを確認する人間の目視によるシール面検査、つまり官能検査が行われている。しかし、人間の官能に依存する官能検査においては、検査員による判定結果のばらつきを回避することはできない。特に、マイクロチップに形成されるウェルの容積は非常に小さいことが多いため、目視でウェルおよび各ウェル間の流路周辺の熱溶着の状態を判別するのは非常に困難であり、作業性が低いという問題がある。 As a means for confirming whether or not the seal is correctly performed, for example, when each member is made of a permeable material, a seal surface inspection by human eyes, that is, a sensory test is performed to confirm whether or not there is unevenness in the welding mark. However, in the sensory test that depends on human sensory, variations in determination results by the inspector cannot be avoided. In particular, since the volume of the well formed on the microchip is often very small, it is very difficult to visually determine the state of thermal welding around the well and the flow path between each well, and workability is low. There is a problem that it is low.
また、接合した蓋材を剥がした時に要した力を測定する張力試験や、ウェル流路内に一定圧力を欠け、モレが無いかを測定する圧力試験などが行われているが、破壊試験となることから、抜取りによる検査となり、信頼性を要求されるマイクロチップでは、検査結果の信頼性が保たれない事となる。これを補うため、抜取り検査回数を増やすことが考えられるが検査数分の製造コストが増す事となり、また、抜取り検査で不良判定が行われた場合には検査対象直前の反応容器を不良品扱いとなるため、不良品の発生が多くなる等の問題がある。 In addition, a tension test that measures the force required when the bonded lid material is peeled off and a pressure test that measures whether there is a lack of constant pressure in the well flow path and the presence of leakage are performed. Therefore, the inspection is performed by sampling, and the reliability of the inspection result cannot be maintained in a microchip that requires reliability. To compensate for this, it may be possible to increase the number of sampling inspections, but this will increase the manufacturing cost for the number of inspections, and if a defective determination is made in the sampling inspection, the reaction container immediately before the inspection target is treated as a defective product. Therefore, there are problems such as the occurrence of defective products.
従来のシール装置やシール方法には、マイクロチップ内に分注(反応試薬を基板上の決められた窪みの部分に注入すること)された反応試薬が失活する事無く、かつシール強度を保ち、ウェル容積、ウェル間流路容積を保つシール手段が提供されるが、何れもシール品質を保証する手段は存在せず、シール作業後に目視検査、抜取り検査を行うのが実情であった。 In the conventional sealing device and sealing method, the reaction reagent dispensed into the microchip (injecting the reaction reagent into a predetermined recess on the substrate) is not deactivated and the sealing strength is maintained. Although there is provided a sealing means for maintaining the well volume and the flow path volume between the wells, there is no means for assuring the quality of the seal, and the actual situation is that visual inspection and sampling inspection are performed after the sealing operation.
本発明は係る問題点に鑑みてなされたもので、マイクロチップなどの反応容器と蓋材が適正なシール温度で熱溶着されたかどうかをシール直後に判定し、シール異常時には直ちにシール動作を停止するシール装置を提供することを課題とする。 The present invention has been made in view of such problems, and determines immediately after sealing whether or not a reaction vessel such as a microchip and a lid material are thermally welded at an appropriate sealing temperature, and immediately stops the sealing operation when the sealing is abnormal. It is an object to provide a sealing device.
上記の課題を解決するための手段として、請求項1に記載の発明は、基板上に窪み形状のウェル状反応部とウェル間ならびに送廃液口を繋ぐ流路を有し、ウェル状反応部に所定量の反応試薬が分注された反応容器と、前記ウェルおよび流路を形成するための蓋材を熱溶着するシール装置であって、
前記反応容器/蓋材の表面温度を計測する温度計測手段と、
シールの良否を検査するための検査条件設定手段と、
前記温度計測手段により計測された温度計測データを取り込む計測データ取り込み手段と、
前記計測データ取り込み手段によって取り込まれた計測値と検査条件設定手段により設定された良否判定閾値を比較する判定処理手段と、を備えたシール検査機能を有し、かつ、
前記検査条件設定手段により設定された検査条件を記録する記録する情報記録手段と、
前記判定処理手段によってシール不良と判定された場合にシール動作の停止指令を出力する制御手段と、を備えたことを特徴とするシール装置である。
As a means for solving the above-mentioned problems, the invention according to
Temperature measuring means for measuring the surface temperature of the reaction vessel / cover material;
Inspection condition setting means for inspecting the quality of the seal;
Measurement data acquisition means for acquiring temperature measurement data measured by the temperature measurement means;
A determination processing means that compares the measurement value acquired by the measurement data acquisition means and the pass / fail determination threshold set by the inspection condition setting means, and has a seal inspection function, and
Information recording means for recording the inspection conditions set by the inspection condition setting means;
And a control unit that outputs a sealing operation stop command when the determination processing unit determines that the seal is defective.
上記の課題を解決するための手段として、請求項2に記載の発明は、前記温度計測手段は、同一の計測領域において時間経過に従って複数回計測することを特徴とする請求項1記載のシール装置である。
As a means for solving the above-mentioned problem, the invention according to
上記の課題を解決するための手段として、請求項3に記載の発明は、検査条件設定手段は、温度計測を行う領域の設定や、シール後の温度計測データを取り込むタイミングを決める経過時間設定や、良否判定の温度閾値設定や、異常信号出力条件設定を行うことを特
徴とする請求項1または2に記載のシール装置である。
As means for solving the above-mentioned problems, the invention according to
本発明のシール装置によれば、マイクロチップなどの反応容器と蓋材が適正なシール温度で熱溶着されたかどうかをシール後の時間経過に従って計測し、計測結果とあらかじめ設定された閾値を比較することによって、その良否を判定し、シール不良と判定した場合にはシール動作を停止することによって、不良の発生を抑制することが可能となる。 According to the sealing device of the present invention, whether a reaction vessel such as a microchip and a lid member are thermally welded at an appropriate sealing temperature is measured over time after sealing, and the measurement result is compared with a preset threshold value. Thus, it is possible to suppress the occurrence of a defect by determining the quality and stopping the sealing operation when it is determined that the seal is defective.
以下に、本発明に係るシール装置を実施するための形態について説明する。 Below, the form for implementing the sealing device which concerns on this invention is demonstrated.
図1(a)は本発明によるシール装置に投入する前の、反応容器の一例を示す平面図で、図1(b)は同平面図の断面101より見た断面図である。反応容器11には、窪み形状のウェル12と、送排液口13とウェル12の間、およびウェル12と別のウェル12の間を繋ぐ溝状の流路14が設けられている。各ウェル12には少量の反応試薬15がスポット状に乗っており、送排液口より注入された試薬と反応し、変色や発光で反応結果を示す。なお、流路14は各ウェル12間で反応試薬15同士のコンタミを嫌う場合ため、袋小路状に経路を変更しても良い。
FIG. 1A is a plan view showing an example of a reaction container before being put into the sealing device according to the present invention, and FIG. 1B is a cross-sectional view as seen from a cross-section 101 of the same plan view. The reaction container 11 is provided with a recess-shaped well 12, a groove-
図2は本発明によるシール装置の反応容器11と蓋材16を熱溶着するヒーターに係る部分の構成図である。シール台17の所定の位置に反応容器11を置き、その上に蓋材16を載せ、その上方より、ヒーター18を有する加熱部材19を一定の圧力で蓋材16に押し付けるように加熱加圧し、加熱部材19の熱により、蓋材16と反応容器11を熱溶着する。さらに熱溶着に必要な熱量から計算したシール時間を経た後、加熱部材19は、蓋材16から離れて上方へ移動する。
FIG. 2 is a configuration diagram of a portion related to a heater for thermally welding the reaction vessel 11 and the lid member 16 of the sealing device according to the present invention. The reaction vessel 11 is placed at a predetermined position of the seal stand 17, the lid member 16 is placed thereon, and from above, the
図3(a)は上記に示したシールを終え、蓋板16がシールされた後の反応容器側面図である。また。図3(b)は同斜視図である。蓋材がシールされる事により、溝状の流路14は筒状となり、また、ウェル12は反応試薬15を覆う蓋が形成され、反応容器が完成する。なお、反応容器11および蓋材16の材質は熱溶着に適したプラスチック類以外に、接合面に熱溶着に適した樹脂層を設けたガラスや金属類でも良い。
FIG. 3A is a side view of the reaction vessel after the sealing shown above is completed and the lid plate 16 is sealed. Also. FIG. 3B is a perspective view of the same. By sealing the lid material, the groove-shaped
ところで、加熱部材19を用いた加熱加圧方式で熱溶着した反応容器11は、加熱部材19が接していた蓋材16の表面温度は面方向に温度の差がある。一方、反応容器11の厚み方向にも、加熱部材19が接する蓋材16から反応容器11の接合面を通じて前記反
応容器11底面へ熱伝導が行われるため、温度の差は存在する。さらに厚さが厚く、熱伝導率の低い材質を用いた反応容器11を使用する場合、蓋材16の表面温度は徐々に温度が下がり、反応容器11底面の表面温度はある一定時間を経過するまで、温度上昇した後、下降するといった、熱溶着後の経過時間による同一計測箇所での温度変化が顕著となる傾向がある。即ち、反応容器の熱溶着後の溶着部分の温度を複数の経過時間において計測し、また経過時間に設定した閾値温度と前記複数の経過時間において計測した温度を比較することによって、熱溶着によるシール品質を判定する事ができる。
By the way, in the reaction vessel 11 thermally welded by the heating and pressurizing method using the
図4は本発明におけるシール後の反応容器の表面温度を計測する一例を示す模式図である。温度計測手段である蓋材16側表面の温度を計測するA計測器20と反応容器11の底面の温度を計測するB計測器21はシール装置の適宜な任意の位置に備えられ、各表面の温度を計測する。図4は、本発明を実施するための形態を説明する便宜上、2つの計測器を使用したが、反応容器11が厚い場合には、反応容器側面の表面温度を計測する一つ以上の計測器を更に加えても良い。また、反応容器11の熱伝導率が良く、熱が伝わり易い場合や、低温で熱溶着しやすい反応容器の場合では、A計測器20のみであっても良い。、計測器はスポットではなく2次元にわたる温度を計測するために、例えば、サーモビュアーを用いることが望ましいが、同じ非接触のスポット温度計もしくは接触式の温度計を複数台使用しても良い。
FIG. 4 is a schematic view showing an example of measuring the surface temperature of the reaction container after sealing in the present invention. A measuring
図5は、本発明のシール装置に備えられたシール検査機能に係る部分の概略構成を示す模式図である。計測値取り込み手段23はA計測器20と繋がり、温度計測データを判定処理手段24へ伝送する。また、前記判定処理手段24は検査条件設定手段22および、情報記録手段25と繋がり、更に、制御信号処理手段26を経由してシール装置制御部27とも繋がっている。22〜26の各手段は図に示すようにパーソナルコンピュータ28に取り込んだ形態に限らず、その一部または全てがA計測器20やシール装置制御部内にあっても良い。本発明による実施の形態を説明する便宜上、蓋材16表面の温度を計測するA計測器を例示したが、計測器が複数台ある場合においても各計測器は前記取り込み手段23に接続される。
FIG. 5 is a schematic diagram showing a schematic configuration of a portion related to a seal inspection function provided in the sealing device of the present invention. The measurement value capturing means 23 is connected to the
図6は、本発明に係るシール装置に備えられたシール検査機能の動作フローを示すフローチャート図である。検査機能は、検査条件設定ステップ(図中Sで示す。以下、Sと略記する)22、計測値取込み処理(S23)、判定処理(S24)、情報記録(S25)、および制御信号処理(S26)、という一連のステップによって行われる。以下、各ステップの内容を図6、及び図7の温度計測データの経過時間による推移を示す図を用いて、シールステップ順に説明する。図7の横軸に示すT0はシール開始時刻、T1はシール終了時刻で、T2、T3、T4はそれぞれシール後の経過時間を示す。また、M1、M2、M3、M4はそれぞれ上記時刻における計測温度を示す。 FIG. 6 is a flowchart showing an operation flow of the seal inspection function provided in the seal device according to the present invention. The inspection function includes an inspection condition setting step (indicated by S in the figure, hereinafter abbreviated as S) 22, a measurement value capturing process (S23), a determination process (S24), an information recording (S25), and a control signal process (S26). ), And a series of steps. Hereinafter, the contents of each step will be described in the order of the sealing steps with reference to FIG. 6 and FIG. T0 shown on the horizontal axis of FIG. 7 is the seal start time, T1 is the seal end time, and T2, T3, and T4 indicate the elapsed time after the seal, respectively. M1, M2, M3, and M4 indicate the measured temperatures at the above times, respectively.
S22(検査条件設定)について説明する。先ず、検査条件設定手段22にて、温度計測を行う領域の設定や、シール後の温度計測データを取り込むタイミングを決める経過時間設定や、良否判定の温度閾値設定を行う。例えばシール後の温度計測データを取り込むタイミングを決める経過時間設定を図7におけるT1、T2、T3、T4とし、そのときの良否判定の閾値をT1では120℃〜130℃、T2では100℃〜110℃、T3では80℃〜90℃、T4では60℃〜80℃として設定する。 S22 (inspection condition setting) will be described. First, the inspection condition setting means 22 performs setting of an area for temperature measurement, setting of elapsed time for determining the timing for taking in temperature measurement data after sealing, and setting of a temperature threshold value for pass / fail determination. For example, T1, T2, T3, and T4 in FIG. 7 are set as the elapsed time that determines the timing for taking in the temperature measurement data after sealing, and the threshold values for the pass / fail judgment at that time are 120 ° C. to 130 ° C. for T1 and 100 ° C. to 110 ° C. for T2. The temperature is set as 80 ° C. to 90 ° C. for T3 and 60 ° C. to 80 ° C. for T4.
S23(計測値の取り込み)について説明する。計測値取り込み手段23は、A計測器20により計測された表面温度値を検査条件設定手段22によって設定された温度計測を行う領域の温度を温度計測データを取り込むタイミングを決める設定された経過時間(図7における経過時間T1、T2、T3、T4)に従って取り込み、データを判定処理(S24)に使用出来る形にデジタル変換し、次に判定処理(S24)される。上記温度計測
は経過時間に従って計測するため、その計測領域は空気の流れによる影響を受けにくく、周辺温度が一定となるような雰囲気であることが望ましい。
S23 (measurement value acquisition) will be described. The measured
S24(判定処理)について説明する。判定処理手段24は、計測値取り込み処理S23より転送された温度計測値を、前記検査条件設定S22で設定された閾値温度と比較し、シール不良を判定する。例えばウェル12直上に位置し、ウェル直径より1mm大きい径の円周上の任意の位置のT1における表面温度の閾値を120℃〜130℃と設定し、温度計測値がこの範囲内に入らなければ異常と判断する。
S24 (determination process) will be described. The
一般的に反応容器1つに対して温度計測を行う領域を複数個設けることが望ましく、各領域毎に良否の判定を行い、その結果より、例えば、10個の温度計測を行う領域に対して9個以上の領域が良と判定された場合には、その反応容器のシールは良と判定しても良い。 In general, it is desirable to provide a plurality of regions for temperature measurement for one reaction container. For each region, it is determined whether or not the temperature is good. If nine or more regions are determined to be good, the seal of the reaction vessel may be determined to be good.
S25(情報記録)について説明する。情報記録手段25は、検査条件設定S22から判定処理24までの一連のステップで得られるデータのうち、検査条件設定S22で設定した種類のデータを、ハードディスク等の任意の記録媒体に記録する。記録したデータは後で再び用いられる。
S25 (information recording) will be described. The
S26(制御信号処理)について説明する。制御信号処理手段26は、シール装置制御部27に対して、判定処理S24で判定した結果より、検査条件設定S22で設定された異常信号条件設定(例えば、3個連続で反応容器がシール不良と判断された場合は制御信号を出力する)に従って、各異常に対応した制御信号を送信する。シール異常時には直ちに動作を停止する。 S26 (control signal processing) will be described. The control signal processing means 26 determines the abnormal signal condition setting set in the inspection condition setting S22 based on the determination result in the determination process S24 with respect to the sealing device control unit 27 (for example, three consecutive reaction containers indicate that the seal is defective). If it is determined, a control signal is output), and a control signal corresponding to each abnormality is transmitted. When the seal is abnormal, the operation stops immediately.
以上説明したように、本発明のシール装置およびシール方法によれば、マイクロチップなどの反応容器と蓋材が適正なシール温度で熱溶着されたかどうかをシール直後に判定し、シール異常時には直ちに動作を停止することが出来、シール不良の発生を削減することが可能となる As described above, according to the sealing device and the sealing method of the present invention, it is determined immediately after sealing whether a reaction vessel such as a microchip and a lid material are thermally welded at an appropriate sealing temperature, and immediately operates when a sealing abnormality occurs. Can be stopped and the occurrence of seal defects can be reduced.
本発明は、医薬品ならびにライフサイエンス事業における各種解析チップの研究、開発、製造に利用可能である。 The present invention can be used for research, development, and manufacture of various analysis chips in the pharmaceutical and life science businesses.
11…反応容器
12…ウェル
13…送排液口
14…流路
15…反応試薬
16…蓋材
18…ヒーター
19…加熱部材
20…A計測器
21…B計測器
22…検査条件設定手段
23…計測値取り込み手段
24…判定処理手段
25…情報記録手段
26…制御信号処理手段
27…シール装置制御部
28…パーソナルコンピュータ
101・・・断面
11 ... Reaction vessel
DESCRIPTION OF SYMBOLS 12 ... Well 13 ... Feed /
Claims (3)
前記反応容器/蓋材の表面温度を計測する温度計測手段と、
シールの良否を検査するための検査条件設定手段と、
前記温度計測手段により計測された温度計測データを取り込む計測データ取り込み手段と、
前記計測データ取り込み手段によって取り込まれた計測値と検査条件設定手段により設定された良否判定閾値を比較する判定処理手段と、を備えたシール検査機能を有し、かつ、
前記検査条件設定手段により設定された検査条件を記録する記録する情報記録手段と、
前記判定処理手段によってシール不良と判定された場合にシール動作の停止指令を出力する制御手段と、を備えたことを特徴とするシール装置。 A reaction vessel in which a predetermined amount of a reaction reagent is dispensed to the well-like reaction portion; and the well and the flow passage. A sealing device for thermally welding a lid material for forming,
Temperature measuring means for measuring the surface temperature of the reaction vessel / cover material;
Inspection condition setting means for inspecting the quality of the seal;
Measurement data acquisition means for acquiring temperature measurement data measured by the temperature measurement means;
A determination processing means that compares the measurement value acquired by the measurement data acquisition means and the pass / fail determination threshold set by the inspection condition setting means, and has a seal inspection function, and
Information recording means for recording the inspection conditions set by the inspection condition setting means;
And a control unit that outputs a seal operation stop command when the determination processing unit determines that the seal is defective.
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