JP2011167986A - Method of manufacturing laminated board - Google Patents

Method of manufacturing laminated board Download PDF

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Publication number
JP2011167986A
JP2011167986A JP2010035245A JP2010035245A JP2011167986A JP 2011167986 A JP2011167986 A JP 2011167986A JP 2010035245 A JP2010035245 A JP 2010035245A JP 2010035245 A JP2010035245 A JP 2010035245A JP 2011167986 A JP2011167986 A JP 2011167986A
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resin
board
adhesive
laminated
wood
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JP2010035245A
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Japanese (ja)
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Takeshi Kumazawa
豪 熊澤
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Asahi Wood Processing Co Ltd
朝日木材加工株式会社
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Priority to JP2010035245A priority Critical patent/JP2011167986A/en
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a laminated board which is capable of reducing a time required for the curing of an adhesive. <P>SOLUTION: In a lamination step, wood boards 10 and resin boards 20 are alternately laminated so that the resin adhesive applied on each side surface of the resin board 20 applied in an application step is interposed between the side surfaces opposed the wood board 10 and the resin board 20 to each other. In a compression step carried out after that, the respective side surfaces of the laminated wood boards 10 and the resin boards 20 are pressed in the lamination direction and irradiated with electromagnetic wave from the vertical direction intersecting the planes 13, 23 of the wood board 10 and resin board 20 as the wood board 10 and the resin board 20 are compressed to stick the side surfaces of the wood board 10 and the resin board 20 opposing to each other. Because the resin adhesive is induction-heated to be energized from the inside, high thermal efficiency is attained to be economical compared to the heating from the outside and the temperature is controlled speedily by the free control of the electromagnetic wave power. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a laminated board, and more particularly to a method for manufacturing a laminated board that can shorten the time required for curing an adhesive.

  Conventionally, a laminated board in which a resin material and wood are bonded together via a resin adhesive is known. For example, Patent Document 1 discloses a laminated board in which an acrylic resin material (resin material) and a wooden board (wood) are bonded together via a resorcinol-based adhesive (resin adhesive).

  In such a conventional laminated board, a resorcinol-based adhesive is applied to the adhesive surface between the acrylic resin material and the wooden board, and the acrylic resin material and the wooden board are superposed on the adhesive surface, and an equal pressure is applied to the superposed product. The acrylic resin material and the wooden board are bonded by performing the pressing process.

  Resinol-based adhesives can be used at room temperature, but when used at room temperature, the curing time is long, so the pressing process requires about 24 hours. In the pressing process, an acrylic resin material and a wooden board are used. Curing of the adhesive can be promoted by heating from the outside. Thereby, since the time required for hardening of an adhesive material can be shortened, the time required for a pressing process can be shortened.

Utility Model Registration No. 3051584 (FIG. 1)

  However, in the above-described conventional method for bonding an acrylic resin material and a wooden board, the acrylic resin material and the wooden board are heated from the outside, and therefore the temperature of the acrylic resin material and the wooden board gradually increases from the surface side. Therefore, it takes time until the heat applied from the outside reaches the inside (the deepest part) and the temperature of the entire object becomes higher than a predetermined temperature at which drying of the adhesive can be promoted. Therefore, there is a problem that the time required for the pressing process cannot be shortened.

  On the other hand, if the heating temperature for heating the acrylic resin material and the wooden board is increased, the time required for the pressing process can be shortened accordingly, but the acrylic resin material is weak against heat and may be deformed by heat of 100 ° C. or more. Therefore, the heating temperature cannot be increased (100 ° C. or higher). Therefore, there is a problem that the time required for the pressing process cannot be shortened depending on the method of increasing the heating temperature.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a method for manufacturing a laminated board that can shorten the time required for curing the adhesive.

Means for Solving the Problems and Effects of the Invention

  In order to achieve this object, according to the method for manufacturing a laminated board according to claim 1, a resorcinol-based resin adhesive is applied to at least one of wood and a resin material in an application step, In the laminating step, the wood and the resin material are laminated by superimposing the wood and the resin material on the adhesive surface so that the adhesive surface to which the resin adhesive is applied is interposed between the wood and the resin material. Thereafter, the wood and the resin material laminated in the laminating step are pressed in the laminating direction in the pressing process, and the resin adhesive is made dielectric by applying electromagnetic waves to the wood and resin material pressed in the laminating direction. Heating generates heat from the inside, and the generated resin adhesive is cured, whereby the laminated wood and resin material are bonded and integrated. On the other hand, since the resin material hardly absorbs electromagnetic waves, the temperature of the resin material does not easily rise even when the resin material is irradiated with electromagnetic waves.

  Therefore, since the resin adhesive interposed between the wood and the resin material is dielectrically heated by the electromagnetic wave to generate heat from the inside and harden, the deformation of the resin material can be prevented and the wood and the resin material can be heated from the outside. Compared to the case where the resin adhesive is cured, the time required for curing the resin adhesive can be shortened.

  The method for producing a laminated board according to claim 2 is the method for producing a laminated board according to claim 1, wherein the electromagnetic wave is irradiated from the direction intersecting the laminating direction in the pressing step. The resin material is irradiated with electromagnetic waves. Therefore, there is an effect that the pressurizing operation for pressurizing the wood and the resin material and the irradiation operation for irradiating the pressed wood and the resin material with electromagnetic waves can be performed smoothly without interfering with each other.

  The method for manufacturing a laminated board according to claim 3 is the method for manufacturing a laminated board according to claim 2, wherein the wood and the resin material have a prismatic shape having a bottom surface and a side surface having sides longer than each side of the bottom surface. In the laminating step, the wood and the resin material are laminated by their side surfaces being brought into contact with each other. The wood and the resin material laminated in the laminating step are pressed on the side surfaces in the pressing step and are irradiated with electromagnetic waves from a direction that is perpendicular to the side surface and parallel to the side surface.

  Here, the wood and the resin material laminated in the laminating step are the areas of the cross sections cut by a plane perpendicular to the side surfaces and parallel to the side sides (hereinafter referred to as “parallel surfaces”). It can be formed larger. Therefore, the wood and resin material laminated in the laminating process have a larger area to be pressed in the pressing process than in the case where the side area is formed larger than the cross-sectional area cut by the parallel plane. The length of the wood and the resin material can be reduced in a direction that can be made smaller and at the same time tolerance to the plane. Therefore, there is an effect that the time for irradiating electromagnetic waves can be shortened while reducing the load for pressing the side surfaces of the wood and the resin material in the pressing step.

  The method for producing a laminated board according to claim 4 is the method for producing a laminated board according to any one of claims 1 to 3, wherein the resin material is made of methacrylic resin. The part has higher light transmittance than glass and is excellent in transparency. Therefore, the light projected from the light source toward the laminated plate cannot pass through the wood portion but can pass through the methacrylic resin portion. Therefore, by using the laminated plate for furniture such as a table or a fitting such as a floor, there is an effect that the decorativeness of the furniture and the fitting can be improved by the light passing through the methacrylic resin portion.

It is a perspective view of the laminated board in 1st Embodiment of this invention. It is a perspective view of the wooden board and the resin board which show the state before bonding. It is a front view of a laminated board. It is a flowchart which shows the manufacturing method of a laminated board. (A) is a perspective view of the test piece X, (b) is a perspective view of the test piece Y. (A) is a table | surface which shows the test result about adhesive force, (b) is a table | surface which shows the test result about peeling of an adhesive surface. The laminated board in 2nd Embodiment of this invention is shown, (a) is a perspective view of a laminated board, (b) is a front view of a laminated board.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of the invention will be described with reference to the accompanying drawings. FIG. 1 is a perspective view of the laminated board 1 in the first embodiment of the present invention, and shows a state where a wooden board 10 and a resin board 20 are bonded. FIG. 2 is a perspective view of the wooden board 10 and the resin board 20 showing a state before being bonded. FIG. 3 is a front view of the laminate 1.

  In FIG. 1, an intermediate portion in the stacking direction of the laminated plate 1 is not shown, and a portion indicated by Z is enlarged. In order to illustrate the resin adhesive 30 in the enlarged portion, a large amount of the resin adhesive 30 is illustrated. In FIG. 2, only some of the laminated wooden boards 10 and resin boards 20 are shown. In FIG. 3, the pressurization direction and the irradiation direction are indicated by different arrows. In FIG. 1 to FIG. 3, in order to facilitate understanding of the drawings, a plurality of identical configurations are denoted by reference numerals only for some of the plurality of configurations, and the drawings are simplified. Yes. The same applies to FIGS. 5 and 7.

  As shown in FIG. 1, the laminated board 1 is integrated by adhering alternately laminated wooden boards 10 and resin boards 20 with a resin adhesive 30 applied to an adhesive surface (a pair of side faces 12 described later). The wooden plate 10 and the resin plate 20 are configured in a vertical stripe pattern. The surface of the laminate 1 is buffed (abrasives are applied to a soft buff made of a flexible material such as cloth, leather, rubber, etc., and the surface is polished by pressing the buff against the work piece. ) Is given. Thereby, since the transparency of the resin board 20 can be improved, the decorativeness by the light which permeate | transmits the laminated board 1 can be improved.

  The laminated plate 1 is formed in a large plate shape having a thickness of 40 mm, a width of 920 mm, and a total length of 2440 mm. In this way, by increasing the size of the laminate 1, it can be used not only for furniture such as chairs and tables, but also for furniture such as stairs, doors, walls and floors. Can improve the performance.

  As shown in FIG. 2, the wood board 10 includes a pair of side surfaces 12 having a bottom surface 11 and side sides 14 longer than the sides of the bottom surface 11 and facing each other, and a pair of side surfaces 14 facing the side surface 12 in common. It is formed in a quadrangular prism shape having a flat surface 13. The wood board 10 is made of wood such as oak wood, and its moisture content is 6% to 15% when the temperature is 35 ° C. or lower.

  As shown in FIG. 2, the resin plate 20 has a bottom surface 21 and a pair of side surfaces 22 facing each other and having side sides 24 longer than the sides of the bottom surface 21, and the side sides 24 are common to the side surfaces 22 and face each other. It is formed in a quadrangular prism shape having a pair of flat surfaces 23 and is made of a resin material such as methacrylic resin. Although the side surface 22 of the resin plate 20 is formed in substantially the same shape as the side surface 12 of the wood plate 10, the flat surface 23 of the resin plate 20 has a length in the longitudinal direction (vertical direction in FIG. 1) of the wood plate 10. And the length of the laminated board 1 in the thickness direction (left and right direction in FIG. 1) is formed to be about one quarter of the plane 13 of the wooden board 10.

  The resin adhesive 30 is a resorcinol adhesive, and is applied to each of a pair of side surfaces of the resin plate 20. The resorcinol-based adhesive is composed mainly of resorcinol resin or phenol-resorcinol resin, and is a curing agent in an aqueous solution obtained by condensation reaction of resorcinol and formaldehyde as main components using acid or alkali as a catalyst and dissolving in water or alcohol. As a paraformaldehyde powder. The standard composition of the main agent and the curing agent is set to a ratio of 15% of the curing agent when the main agent is 100% in mass ratio.

Then, with reference to FIGS. 2-4, the manufacturing method of the laminated sheet 1 is demonstrated. FIG. 4 is a flowchart showing a method for manufacturing the laminated plate 1. When manufacturing the laminated board 1, as shown in FIG. 4, the pressing process S3 is performed after the application | coating process S1 and the lamination process S2. Specifically, first, the resin adhesive 30 is evenly applied to the bonding surfaces of the wooden board 10 and the resin board 20, that is, the entire side surfaces 22 of the resin board 20 (application step S1). The application amount of the resin adhesive 30 applied to each side surface 22 is 200 g / m 2 . After application of the resin adhesive 30, the stacking step S <b> 2 is performed after an accumulation time of 10 minutes until the opposing side surfaces 12 and 22 of the wooden board 10 and the resin board 20 are overlapped with each other. The moisture and solvent of the applied resin adhesive 30 can be volatilized by this accumulation time.

  As shown in FIG. 2, in the lamination step S <b> 2, the resin adhesive 30 applied to each side surface 22 of the resin plate 20 is interposed between the opposite side surfaces 12 and 22 of the wooden plate 10 and the resin plate 20. In addition, the opposing side surfaces 12 and 22 are overlapped, and the wooden board 10 and the resin board 20 are alternately laminated. Thereafter, the pressing step S3 is performed on the laminated wooden board 10 and the resin board 20.

  As shown in FIG. 3, in the pressing step S <b> 3, the side surfaces 12 and 22 of the laminated wooden plate 10 and the resin plate 20 are bonded together in order to bond the side surfaces 12 and 22 of the wooden plate 10 and the resin plate 20 facing each other. While being pressed in the laminating direction (left and right direction in FIG. 3), the resin adhesive 30 (see FIG. 2) is heated by irradiating electromagnetic waves with the wooden board 10 and the resin board 20 being pressed. In the pressing step S3, the electromagnetic wave is irradiated from a direction intersecting with the stacking direction, specifically, from the vertical direction (the vertical direction in FIG. 3) of the stacked plate 1 orthogonal to the planes 13 and 23 of the wooden board 10 and the resin board 20. Is done.

  The pressure by which the laminated wooden board 10 and the resin board 20 are pressurized is set between 0.68 and 1.47 MPa. That is, when the air-drying specific gravity, which is a value representing the weight of the wooden board 10 and the weight of water having the same volume as the drying weight of the wooden board 10 as a volume ratio, is 0.6 or more, It is set to 0.98 to 1.47 MPa, and when the air-dry specific gravity is 0.6 or less, that is, between 0.68 to 0.98 MPa for soft materials.

  The electromagnetic wave irradiated from the vertical direction of the laminated plate 1 is a high frequency set in a frequency range of 3 MHz to 300 MHz, and the temperature of the resin adhesive 30 is 7 to 10 kW using an unshown high frequency dielectric heating output device. Irradiation is at 70 to 80 degrees. For example, when heat is generated from the inside so that the temperature of the resin adhesive 30 is 80 degrees by irradiating a high frequency with an output of 8 KW, it was used for the laminate 1 having a thickness of 40 mm, a width of 920 mm, and a total length of 2440 mm The time required for curing the resin adhesive 30 (the time required for the pressing step) is 40 minutes, and the curing period for completely curing the resin adhesive 30 is only 2 days.

  On the other hand, since the resin adhesive 30 is a resorcinol-based adhesive, it can be cured at room temperature by adding a curing agent. However, when cured at room temperature, the resin adhesive 30 is obtained when the laminate 1 has the above-described size. The time required for curing (time required for the pressing process) is about 24 hours, and the curing period also requires 7 days. In addition, when the resin adhesive 30 is heated from the outside through the wooden board 10 and the resin board 20, the curing time can be shortened compared with the case where the resin adhesive 30 is cured at room temperature, but a high temperature of 100 ° C or higher. Because it cannot be heated, it takes several hours.

  On the other hand, when the resin adhesive 30 interposed between the wooden board 10 and the resin board 20 is heated by the electromagnetic wave to generate heat from the inside, the resin adhesive 30 itself generates heat. In comparison with this, it has high thermal efficiency and is economical, and speedy temperature control can be achieved by freely controlling electromagnetic power. In addition, since combustion is not performed in order to raise the temperature of the resin adhesive 30, generation of toxic gas and the surrounding environment do not become high temperature, and the working environment can be kept good. In addition, since the temperature of the resin plate 20 is less likely to rise than when the resin adhesive 30 is heated from the outside of the laminated plate 1, it is possible to prevent the resin plate 20 from being deformed by heat.

  Moreover, since electromagnetic waves are irradiated from the direction which cross | intersects a lamination direction (pressurization direction), a pressurization direction and an irradiation direction can be made into a different direction. Therefore, the pressurizing operation for pressurizing the wooden board 10 and the resin board 20 and the irradiation operation for irradiating the pressed wooden board 10 and the resin board 20 with electromagnetic waves can be performed smoothly without interfering with each other.

  Furthermore, the wooden board 10 and the resin board 20 laminated in the lamination step S2 are cut by a plane (a plane parallel to the upper surface or the lower surface of the laminated board 1) orthogonal to the side surfaces 12 and 22 and parallel to the side edges 14 and 24. The area of the formed cross section can be formed larger than the areas of the side surfaces 12 and 22 of the wooden board 10 and the resin board 20. Therefore, since the laminated board 1 can form the area of the side surface pressurized more than the area of the upper surface irradiated with electromagnetic waves, compared with the case where the wooden board 10 and the resin board 20 are formed in a flat plate shape and laminated in the vertical direction. (Refer to the second embodiment of FIG. 7), the area to be pressed in the pressing step can be formed small and the length (plate thickness) of the laminate 1 in the electromagnetic wave irradiation direction (vertical direction in FIG. 3) is shortened ( (Thin) can be formed. Therefore, it is possible to shorten the time for irradiating electromagnetic waves while reducing the load for pressing the side surfaces 12 and 22 of the wooden board 10 and the resin board 20 in the pressing step S3.

  Moreover, since the resin board 20 of the manufactured laminated board 1 is comprised with the methacryl resin, it has a light transmittance higher than glass. Therefore, since the laminated board 1 is excellent in transparency, the light projected from the light source toward the laminated board 1 cannot pass through the wooden board 10 but can pass through the resin board 20. Therefore, the decorativeness of furniture and joinery can be improved by using the laminated plate 1 for furniture such as a table and fixtures such as a floor and the light that has passed through the resin plate 20.

  Here, the test piece X shown in FIG. 5A is manufactured by the manufacturing method described above, and the test piece Y shown in FIG. 5B is cut from the test piece X, and the test piece X and the test piece Y are cut. As a result of conducting a test on the adhesive strength and peeling of the adhesive surface using, the numerical values shown in FIG. 6 were obtained. With reference to FIG.5 and FIG.6, the result of the test regarding adhesive force and peeling of an adhesive surface is demonstrated. 5A is a perspective view of the test piece X, and FIG. 5B is a perspective view of the test piece Y. FIG. Further, the part indicated by M in FIG. Further, FIG. 6A is a table showing test results for adhesive strength, and FIG. 6B is a table showing test results for peeling of the adhesive surface.

As shown in FIG. 5 (a), the test piece X includes five wooden boards 110 and four resin boards 120 made of methacrylic resin, and a pair of side faces 122 ( The resin adhesive 30 applied to a total of 8 surfaces) is cured by high frequency to be integrated. The wooden board 110 is formed with a thickness of 25 mm, a width of 20 mm, and a total length of 490 mm, and the resin board 120 is formed with a thickness of 25 mm, a width of 5 mm, and a total length of 490 mm. Therefore, the entire test piece X is formed to have a thickness of 25 mm, a width of 120 mm, and a total length of 490 mm, and the total adhesion area is 25 mm × 490 mm × 8 = 98 m 2 . As shown in FIG. 5B, the test piece Y is formed by cutting the test piece X, and the adhesion area between the wooden board 110a and the resin board 120a is 25 mm × 13 mm = 3.23 cm 2. Set to

  In the test concerning the adhesive strength and the peeling of the adhesive surface, the adhesive strength of 10 test pieces Y placed under different conditions (normal temperature, high temperature and low temperature) was measured, and the adhesive surface peeling at high temperature and low temperature was measured. The state was observed. Moreover, in the test regarding peeling of the adhesive surface, the state of peeling of the adhesive surface of the test piece X placed under moisture and dry resistance was observed. Regarding the adhesive force, a tensile shear test is performed using a 2t universal testing machine (not shown) at a tensile speed of 10 mm / min, and the tensile force when the adhesive surface of the test piece Y peels is measured. did.

  With reference to FIG.5 and FIG.6 (a), the test result about adhesive force is demonstrated. The above-described tensile shear test was performed on 10 test pieces Y under normal temperature (normal) conditions. The average adhesion force of the ten test pieces Y was 15.89 MPa, the minimum adhesion force was 18.83 MPa, and the maximum adhesion force was 17.46 MPa. Test specimen Y under high temperature conditions, specifically, 10 specimens Y immersed in warm water at 80 ° C. for 5 hours and then dried at room temperature for about 24 hours; Similarly, a tensile shear test was performed. The average adhesion strength of the ten test pieces Y was 16.18 MPa, the minimum adhesion strength was 10.2 MPa, and the maximum adhesion strength was 19.02 MPa. A test piece Y under low temperature conditions, specifically, 10 pieces of test piece Y put in a constant temperature and humidity chamber set at −10 ° C. for 24 hours and then dried at room temperature for about 24 hours, Tensile shear tests were performed as in the normal and high temperature cases. The average adhesive force of 10 test pieces Y was 16.97 MPa, the minimum adhesive force was 12.16 MPa, and the maximum adhesive force was 21.08 MPa.

  Next, with reference to FIG.6 (b), the test result about peeling of an adhesive surface is demonstrated. No peeling of the adhesive surface was observed in any of the ten test pieces Y under the above-described high temperature condition and the ten test pieces Y under the low temperature condition described above. Also. Under the conditions of moisture resistance and dry resistance, specifically, one piece of test piece X which was put in a bath at a temperature of 40 ° C. and a humidity of 90% for 72 hours and then put in a bath at a temperature of 60 ° C. and a humidity of 30% for 72 hours. The state of peeling of the adhesive surface was observed. No peeling of the adhesive surface was found for test piece X.

  From the test results described above, the adhesive strength of the test piece X manufactured by the above-described manufacturing method is good and stable on the bonded surface at 100% under any conditions of normal temperature, high temperature and low temperature. is doing. Moreover, peeling was not recognized by the test pieces X and Y manufactured by the manufacturing method mentioned above also in any case of high temperature, low temperature, and moisture-proof and dry-proof conditions.

  In addition, the test regarding the adhesive force mentioned above and peeling of an adhesive surface was done also about the test pieces X and Y formed by hardening the resin adhesive 30 at normal temperature. As a result, the same adhesive force as that of the test piece Y formed by curing the resin adhesive 30 at high frequency was observed for any test piece X, and no peeling was observed for any of the test pieces X and Y. . Therefore, the laminated board 1 manufactured by the manufacturing method mentioned above has the same quality as the case where it hardens | cures at normal temperature, Since the time required for hardening can be shortened, productivity is improved.

  With reference to FIG. 7, the manufacturing method of the laminated board 200 in 2nd Embodiment of this invention is demonstrated. FIG. 7 shows a laminated board 200 according to the second embodiment of the present invention, where (a) is a perspective view of the laminated board 200, and (b) is a front view of the laminated board 200. In FIG. 7, illustration of an intermediate portion in a direction orthogonal to the lamination direction of the laminated plate 200 is omitted, and a portion indicated by N is enlarged.

  The laminated board 1 in the first embodiment is a laminated board in the second embodiment, whereas the wooden board 10 and the resin board 20 are formed in a prismatic shape, and the wooden board 10 and the resin board 20 are configured in a vertical stripe pattern. 200 includes a wooden board 210 and a resin board 220 formed in a flat plate shape, and the wooden board 210 and the resin board 220 are configured in a horizontal stripe pattern. In the laminated plate 200, the resin adhesive 30 is applied to each flat surface 223 of the resin plate 220. Since the laminated plate 200 is formed of the wooden plate 210 and the resin plate 220 formed in a flat plate shape, the laminated plate 200 is formed as compared with the laminated plate 1 when the laminated plates 1 and 200 are set to the same volume. The number of wooden boards 210 and resin boards 220 can be reduced. Therefore, since the number of times of applying the resin adhesive 30 to the flat surface 223 of the resin plate 220 in the coating step S1 and the number of times of laminating work in the laminating step S2 can be reduced, workability can be improved.

  As described above, the present invention has been described based on the embodiments, but the present invention is not limited to the above embodiments, and various improvements and modifications can be made without departing from the spirit of the present invention. It can be easily guessed.

  For example, in each of the above embodiments, the wooden boards 10 and 210 and the resin boards 20 and 220 are alternately laminated in the laminating process, but this is not necessarily limited to this, and only the central portion or the end in the laminating direction. The structure which arrange | positions the resin plates 20 and 220 may be sufficient. In this case, the contrast between the wooden boards 10 and 210 and the resin boards 20 and 220 can be emphasized, so that the merchantability can be improved.

  In each of the above-described embodiments, the thickness of the wooden plates 10 and 210 is configured to be thicker than the thickness of the resin plates 20 and 220. However, the present invention is not limited to this, and both may be configured to have the same thickness. On the contrary, the resin plates 20 and 220 may be made thicker than the wooden plates 10 and 210. In this case, since the amount of light transmitted through the resin plates 20 and 220 can be changed, the merchantability of the laminated plates 1 and 200 can be improved.

  Moreover, in each said embodiment, although the resin plates 20 and 220 were comprised with the methacryl resin, it is not necessarily restricted to this, You may comprise with other resin materials, such as nylon and an ABS resin. In this case, the resin plates 20 and 220 of the laminated plates 1 and 200 can be configured to be non-transmissive. Therefore, the range of use of the laminated plates 1,200 can be expanded, and the commercial properties can be improved.

  In addition, in the said 1st Embodiment, although the wooden board 10 and the resin board 20 were formed in square pillar shape, it is not necessarily restricted to this, If it has a pair of parallel side surfaces 12 and 22 which oppose It is enough. Therefore, it may be formed in a pentagonal column shape or a hexagonal column shape, and the pair of flat surfaces 13 and 23 may be formed in a curved surface shape. In this case, since the bending rate of the light transmitted through the resin plate 20 can be changed, the use range of the laminated plate 1 can be expanded, and the merchantability can be improved.

  Furthermore, in each of the above embodiments, the electromagnetic wave to be irradiated is set to a high frequency. However, the present invention is not necessarily limited to this, and the case where the size of the laminated plates 1,200 is small or the shape of the laminated plates 1,200 is complicated. In that case, a microwave of 300 MHz to 3 GHz may be used. In this case, even if the laminated plates 1,200 have a complicated shape by microwaves, they can be heated almost uniformly.

1,200 Laminated board 10,210 Wood board (wood)
11 Bottom surface 12 Side surface 14 Side 20 and 220 Resin plate (resin material)
21 Bottom 22 Side 24 Side 30 Resin adhesive S1 Application process S2 Lamination process S3 Clamping process

Claims (4)

  1. A method for producing a laminated board in which wood and a resin material are laminated, and the laminated wood and resin material are integrated by bonding with a resorcinol-based resin adhesive,
    An application step of applying the resin adhesive to the adhesive surface of at least one of the wood and the resin material;
    A laminating step of laminating the wood and the resin material by overlapping the wood and the resin material so that the resin adhesive applied to the adhesive surface is interposed between the wood and the resin material;
    A pressing step of pressing the stacked wood and resin material in the stacking direction and irradiating electromagnetic waves in a state where the wood and resin material are pressed to heat the resin adhesive. A manufacturing method of a laminated board.
  2.   2. The method for manufacturing a laminated board according to claim 1, wherein, in the pressing step, the electromagnetic wave is irradiated from a direction intersecting with the laminating direction.
  3. The wood and the resin material are formed in a prismatic shape including a bottom surface and a side surface having a side longer than each side of the bottom surface,
    In the laminating step, the wood and the resin material are laminated by abutting their side surfaces,
    In the pressing step, side surfaces of the laminated wood and resin material are pressurized, and the laminated wood and resin material are cut along a plane perpendicular to the side surface and parallel to the side edge. The area of the side is formed larger than the area of the side surface, and the wood and the resin material are irradiated with the electromagnetic wave from a direction that is perpendicular to the side surface and parallel to a plane parallel to the side. Method for producing a laminated board.
  4.   The said resin material is comprised with a methacryl resin, The manufacturing method of the laminated board in any one of Claim 1 to 3 characterized by the above-mentioned.
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CN105690497A (en) * 2016-03-10 2016-06-22 广西南宁侨盛木业有限责任公司 Method for producing E0-grade solid wood boards stable in structure by adopting E1-grade urea-formaldehyde resin adhesive
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