JP2011164887A - Touch panel sensor manufacturing method and touch panel sensor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a touch panel sensor manufacturing method for forming the protective layer of the extraction conductor of metallic materials without providing any exclusive process for forming the protective layer and a touch panel sensor to which the method is applied. <P>SOLUTION: The touch panel sensor manufacturing method includes: an etching step of etching and patterning a coating conductive layer and a transparent conductive layer in a laminate in which a transparent base material film, a transparent conductive layer and a coating conductive layer are laminated in this order; a second photosensitive layer formation step of forming the second photosensitive layer of a photosensitive etching resist on the patterned side face; a second exposure step of carrying out exposure via a second photo-mask to the second photosensitive layer; and a development step of developing the second photosensitive layer and patterning the second photosensitive layer such that at least the site of an extraction conductor in the second photosensitive layer is made to remain, and the site of an active area is removed. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention belongs to the technical field of touch panel sensors. In particular, a touch panel sensor manufacturing method for improving a process of forming a covering conductive layer formed on a transparent conductive layer in a touch panel sensor, particularly a protective layer for protecting a patterned extraction conductor portion from corrosion, leakage, etc. The present invention relates to a touch panel sensor to which the method is applied.

  A touch panel display is known as an apparatus in which an input device (touch panel) and a display device (display) are integrated. The touch input surface (also referred to as a touch sensor region or active area) of the touch panel is formed close to (or in close contact with) the outer surface of the display screen so as to be parallel to the surface. The user performs input by touching (or approaching) a specific place on the touch panel with a fingertip or a pen (stylus). At that time, in order for the user to make a desired input, the display generates a display screen that shows the relationship between the place of contact and the input content. That is, the user needs to visually recognize the display screen of the display through the touch input surface of the touch panel. At least the part of the touch panel formed on the display screen of the display is made of a transparent material so that the visual recognition is possible. Such touch panel displays are widely used as devices for inputting and displaying in electronic devices such as mobile phones, ticket machines, ATM devices, game machines, and computers.

A touch panel device (referred to as a touch panel device when the touch panel means its entire configuration) is not only a touch panel sensor including a contact input surface where input is performed by the above contact (or proximity), but also a contact on the touch panel sensor. It includes a circuit portion (also referred to as a sensor circuit or a sensor amplifier) including a conversion circuit that converts signals, an arithmetic circuit that calculates contact positions from the electrical signals, a control circuit that controls the operation of these circuits, and the like.
The touch panel device can be classified into various types based on the principle of detecting contact (or proximity) to the contact input surface of the touch panel sensor (hereinafter, “contact (or proximity)” is simply referred to as “contact”). Recently, capacitively coupled touch panel devices have become mainstream for reasons such as being optically bright, having design properties, being easy in structure, and being excellent in function. In a capacitively coupled touch panel device, when a fingertip or a pen (stylus) contacts a touch sensor, the capacitance at the contact portion changes, and the contact position is calculated from the change (for example, Patent Document 1).

The capacitively coupled touch panel device is generally a one-point detection touch panel device capable of detecting a normal contact position when the number of contacts at a specific position on the contact input surface of the touch panel sensor is one. As a structure of the touch panel sensor in this one-point detection touch panel device, for example, in a plurality of capacitive couplings arranged in an XY arrangement, an extraction conductor to a terminal on one surface of capacitive coupling is connected in the Y direction for each arrangement in the Y direction. In the X direction, the conductor is connected to the terminal on the other surface of the capacitive coupling for each arrangement in the X direction and connected to the terminal in the Y direction.
On the other hand, in a capacitively coupled touch panel device, a touch panel device configured to detect a plurality of contacts that occur simultaneously at different positions on the contact input surface of the touch panel sensor and generate a signal representing each position of the contacts. That is, there is a proposal of a touch panel device for multi-touch detection (multi-point detection). For example, “multipoint touch screen” of Patent Document 2 is an invention of such a device. The multi-point detection touch panel device is attracting attention because it can input various types of instructions in response to simultaneous multi-point input. In the structure of the touch panel sensor in the apparatus disclosed in Patent Document 2, in a plurality of capacitive couplings arranged in an XY manner, each of the extraction conductors to terminals on one surface of each capacitive coupling is in the X direction. Each of the conductors to be taken out to the terminal on the other side of the capacitive coupling is taken out to the side part in the Y direction. Therefore, in order to obtain the same position resolution, the multipoint detection type has more terminals than the single point detection type, and the configuration of the touch panel device (touch panel sensor, sensor circuit, data processing) is complicated. To do. For this reason, single point detection is suitable for small to large touch panel devices, and multipoint detection is often suitable for small touch panel devices.

  Such a capacitively coupled touch panel sensor generally includes a first base film on which a first sensor electrode is formed and a second base film on which a second sensor electrode is formed. (For example, patent document 3). In the manufactured touch panel sensor, the first sensor electrode and the second sensor electrode are connected to an external sensor via an extraction wiring (extraction conductor) formed in a region outside the active area (contact input surface) of the base film. Connected to the circuit. When the touch panel device is used together with a display device, the first sensor electrode and the second sensor electrode are formed from a transparent conductive material having a low conductivity (electric conductivity). On the other hand, the extraction conductor disposed outside the active area does not need to be transparent, and is generally formed by printing a metal material having high conductivity on the base film by screen printing. The

JP 2009-175784 A Special table 2007-533044 gazette JP-A-4-264613 JP 2007-308710 A

By the way, as described above, a metal material is generally used for the portion of the extraction conductor in the touch panel sensor of the touch panel device. For example, metal materials such as aluminum, molybdenum, silver, chromium, and copper are used. These metal materials are easily corroded, and as the corrosion progresses from the surface to the inside of the metal material, the conductivity decreases and eventually the necessary conductivity is lost. Then, the touch panel device stops its function and becomes unusable. That is, there is a problem that the durability of the touch panel device is remarkably impaired due to corrosion of the extracted conductor portion.
Further, the exposed conductor portion of the metal material having conductivity is exposed to a risk of electric leakage. In particular, in an environment where water (rain, tap water) or water-containing liquid (beverage, sweat) falls, an environment where humidity is high and water droplets are easily formed, etc., the electrical insulation is lowered and electric leakage is likely to occur. The portion of the extraction conductor is a wiring pattern in which a large number of linear extraction conductors are parallel and approach in a general touch panel sensor. Accordingly, a current is likely to flow between adjacent extraction conductors due to a slight decrease in insulation, and a leakage occurs, resulting in a malfunction or inoperability. That is, there is a problem that the reliability of the touch panel device is remarkably impaired due to the exposed conductor portion being exposed.

In order to solve this problem, a protective layer is formed on the surface of the extraction conductor portion. Of course, the material of the protective layer is a material having electrical insulation, and conventionally, the protective layer is obtained by applying the insulating paint to the conductor portion and its peripheral portion (base material, etc.). Is formed (Patent Document 4).
However, in the related art, since the process for forming the protective layer is simply added to the other processes, there is a problem that the entire process increases. In general, when a process is newly added, it is necessary to consider the influence of the addition of the process on other processes, the influence on the quality of products, and the like. In other words, it is necessary to take appropriate measures such as optimizing manufacturing conditions and carefully selecting materials to be used. In addition, operations such as maintenance and quality control are generated for the process, increasing the manufacturing load. In particular, when introducing different processes and materials different from conventional processes, there is a problem that many problems in manufacturing and quality must be solved. On the contrary, the fact that the same quality process and the same quality material as before can be used has the effect of solving many problems in manufacturing and quality, and greatly increasing the degree of freedom in process design and product design.

  The present invention has been made in order to solve the above-described problems, and the formation of a protective layer that protects the portion of the conductive material from which the conductive metal material is taken out has a special process for its formation. It is an object of the present invention to provide a touch panel sensor manufacturing method and a touch panel sensor to which the method can be applied by applying a process of the same quality as before without providing the touch panel sensor.

The manufacturing method of the touch panel sensor which concerns on Claim 1 of this invention is a transparent base film, the transparent conductive layer provided on the surface of the one side of the said base film, and the surface of the said transparent conductive layer A first photosensitive layer forming step of forming a photosensitive layer of a photosensitive etching resist on the surface of the laminate having the coated conductive layer provided on the side of the coated conductive layer; and a first photomask for the photosensitive layer. A first exposure step in which the photosensitive layer is developed, and a first development step in which the photosensitive layer is developed to pattern the photosensitive layer, and the coated conductive layer and the transparent conductive layer are etched using the patterned photosensitive layer as an etching mask. A first etching step of patterning the coated conductive layer and the transparent conductive layer, a photosensitive layer removing step of removing the photosensitive layer, and the coated conductive layer and the transparent conductive layer of the laminate. A second photosensitive layer forming step of forming a photosensitive layer of a photosensitive etching resist on the surface of the turned side; a second exposure step of exposing the photosensitive layer through a second photomask; and Developing and patterning the photosensitive layer so that at least the portion of the extracted conductor and its periphery are left and the active area is removed, and the patterned photosensitive layer is used as a second etching mask to form the second etching mask. And a second etching step in which the covering conductive layer in the active area is removed by etching.
The touch panel sensor manufacturing method according to claim 2 of the present invention is the touch panel sensor manufacturing method according to claim 1, wherein the second exposure step and the second development step include a portion of the extraction conductor, In this step, the photosensitive layer is left in all of the portion of the transparent conductive layer around the portion and the portion of the base film around the portion.
A touch panel sensor manufacturing method according to a third aspect of the present invention is the touch panel sensor manufacturing method according to the first or second aspect, wherein a third photomask is formed on the photosensitive layer as a subsequent step of the second etching step. And a third developing step of patterning so that the photosensitive layer is subjected to a third development to remove a terminal portion in the photosensitive layer.
Moreover, the manufacturing method of the touchscreen sensor which concerns on Claim 4 of this invention is a transparent base film, the transparent conductive layer provided on the surface of the one side of the said base film, and the surface of the said transparent conductive layer A first photosensitive layer forming step of forming a photosensitive layer of a photosensitive etching resist on a surface of the laminate having the coated conductive layer provided on the coated conductive layer side; and a first photo for the photosensitive layer. A first exposure step of exposing through a mask; a first development step of developing the photosensitive layer to pattern the photosensitive layer; and the covering conductive layer and the transparent conductive layer using the patterned photosensitive layer as an etching mask. A first etching step of patterning the coated conductive layer and the transparent conductive layer by etching, a photosensitive layer removing step of removing the photosensitive layer, and the coated conductive layer and the transparent conductive layer of the laminate. A second photosensitive layer forming step of forming a photosensitive layer of a photosensitive etching resist on the surface on which the layer is patterned; a second exposure step of exposing the photosensitive layer through a second photomask; A second developing step of developing the layer and patterning so that at least a portion of the extracted conductor and its periphery are left in the photosensitive layer and a portion of the terminal is left and a portion of the active area is removed; and A second etching step in which the photosensitive conductive layer is used as a second etching mask to remove the covering conductive layer in the active area, and the photosensitive layer is third developed to leave a portion of the extracted conductor in the photosensitive layer. And a third developing step of patterning so as to remove the portion.
Moreover, the manufacturing method of the touch-panel sensor which concerns on Claim 5 of this invention is a transparent base film, the transparent conductive layer provided on the surface of the one side of the said base film, and the surface of the said transparent conductive layer A first photosensitive layer forming step of forming a photosensitive layer of a photosensitive etching resist on a surface of the laminate having the coated conductive layer provided on the coated conductive layer side; and a first photo for the photosensitive layer. A first exposure step of exposing through a mask; a first development step of developing the photosensitive layer to pattern the photosensitive layer; and the covering conductive layer and the transparent conductive layer using the patterned photosensitive layer as an etching mask. A first etching step of patterning the coated conductive layer and the transparent conductive layer by etching, a photosensitive layer removing step of removing the photosensitive layer, and the coated conductive layer and the transparent conductive layer of the laminate. A second photosensitive layer forming step of forming a photosensitive layer of a photosensitive etching resist on the surface on which the layer is patterned; a second exposure step of exposing the photosensitive layer through a second photomask; A second development step of developing the layer and patterning so that at least the portion of the extracted conductor in the photosensitive layer and its periphery are left and the active area portion and the terminal portion are removed; and the patterned photosensitive layer And a second etching step in which the coated conductive layer in the active area is removed by etching as a second etching mask.
In addition, a touch panel sensor according to claim 6 of the present invention is provided on a transparent base film, a transparent conductive layer provided on a surface on one side of the base film, and a surface of the transparent conductive layer. The transparent conductive layer is patterned so as to leave a terminal portion, a lead conductor portion, and an active area portion, and the coated conductive layer is a terminal portion. And the portion of the extraction conductor is left and the portion of the active area is removed, and at least the portion of the terminal is not covered with the photosensitive layer. It is intended to be coated with a photosensitive layer.

  Extraction of conductive metal material A touch panel sensor manufacturing method that enables formation of a protective layer for protecting a portion of a conductor by applying a process of the same quality as before without providing a special process for the formation. And a touch panel sensor to which the method is applied. In this way, by forming the protective layer with the same quality process and the same material as before, many problems in manufacturing and quality are solved, and the freedom of process design and product design is greatly increased. Has a noticeable effect.

FIG. 1 is a flowchart showing the manufacturing process of the touch panel sensor of the present invention. FIG. 2 is a cross-sectional view showing the structure of the laminate before and after the photosensitive layer forming step. FIG. 3 is an explanatory view showing an example of the first exposure step. FIG. 4 is a diagram illustrating an example of the pattern of the first transparent conductor 20. FIG. 5 is a diagram illustrating an example of a pattern of the second transparent conductor 30. FIG. 6 is a diagram showing a pattern in which the pattern of the first transparent conductor 20 and the pattern of the second transparent conductor 30 are overlapped. FIG. 7 is a cross-sectional view (first exposure step) of the laminate having the photosensitive layer formed sandwiched by the photomasks at positions Aa and Ba indicated by alternate long and short dash lines in FIG. FIG. 8 is a cross-sectional view (first exposure step) of the laminate having the photosensitive layer formed sandwiched between the photomasks at the positions of Ca and Da indicated by alternate long and short dash lines in FIG. FIG. 9 is a cross-sectional view (first exposure step) of the laminate having the photosensitive layer formed sandwiched by the photomasks at positions Ab and Bb indicated by the one-dot chain line in FIG. FIG. 10 is a cross-sectional view (first exposure step) of the laminate having the photosensitive layer formed sandwiched between the photomasks at the positions Cb and Db indicated by the one-dot chain line in FIG. FIG. 11 is a diagram showing a layer structure of the first developed laminated body patterned in the first developing process as a cross-sectional view (first developing process) at positions Ab, Bb, Cb, and Db indicated by alternate long and short dash lines in FIG. It is. FIG. 12 shows the layer structure of the first etched laminate patterned in the first etching step as a cross-sectional view (first etching step) at positions Ab, Bb, Cb, and Db indicated by alternate long and short dash lines in FIG. FIG. FIG. 13 is a cross-sectional view of the layer structure of the second photosensitive layer-removed laminate from which the photosensitive layer has been removed in the photosensitive layer removing step at positions Ab, Bb, Cb, and Db indicated by alternate long and short dashed lines in FIG. It is a figure shown as a process. FIG. 14 is a cross-sectional view of the layer structure of the second photosensitive layer formed laminate in which the second photosensitive layer is formed in the second photosensitive layer forming step, at positions Ab, Bb, Cb, and Db indicated by alternate long and short dashed lines in FIG. It is a figure shown as (2nd photosensitive layer formation process). FIG. 15 is a diagram showing an example of a pattern (first extraction conductor 43 and first terminal conductor 44) of the first covering conductive layer. FIG. 16 is a diagram illustrating an example of a pattern of the second covering conductive layer (second extraction conductor 53 and second terminal conductor 54). FIG. 17 is a diagram showing a pattern in which the pattern of the first covered conductive layer and the pattern of the second covered conductive layer are superimposed. FIG. 18 is a cross-sectional view (second exposure step) of the first etched stacked body on which the second photomask 91 is placed at the positions Ab, Bb, Cb, and Db indicated by the alternate long and short dash line in FIG. FIG. 19 shows a layer structure of the second developed laminated body patterned in the second developing step as a cross-sectional view (second developing step) at positions Ab, Bb, Cb, and Db indicated by alternate long and short dash lines in FIG. FIG. FIG. 20 is a diagram showing the layer structure of the second etched laminate patterned in the second etching step as a cross-sectional view (second etching) at positions Ab, Bb, Cb, and Db indicated by a one-dot chain line in FIG. It is. FIG. 21 is a flowchart showing another example of the manufacturing process of the touch panel sensor. FIG. 22 is a cross-sectional view (second exposure step) of the photosensitive layer-formed laminate on which the second photomask 92 is placed at the positions Ab, Bb, Cb, and Db indicated by the alternate long and short dash line in FIG. FIG. 23 is a cross-sectional view (second development step) of the second developed laminated body at the positions of Ab, Bb, Cb, and Db indicated by alternate long and short dash lines in FIG. FIG. 24 is a cross-sectional view (second etching) of the second etched layered body at the positions of Ab, Bb, Cb, and Db indicated by alternate long and short dash lines in FIG. FIG. 25 is a cross-sectional view (third development step) of the third developed laminated body at the positions of Ab, Bb, Cb, and Db indicated by alternate long and short dash lines in FIG. FIG. 26 is a diagram showing an example of a touch panel display to which the touch panel sensor of the present invention is applied. 2 is a diagram illustrating an example of a configuration of a base film 10. FIG. FIG. 21 is a flowchart showing another example (third example) of the manufacturing process of the touch panel sensor. FIG. 29 is a cross-sectional view (second exposure step) of the photosensitive layer-formed laminated body on which the second photomask 92 is placed at the positions of Ab, Bb, Cb, and Db indicated by alternate long and short dash lines in FIG. FIG. 30 is a cross-sectional view (second development step) of the second developed laminated body at the positions of Ab, Bb, Cb, and Db indicated by alternate long and short dash lines in FIG. FIG. 31 is a cross-sectional view (second etching) of the second etched layered product at positions Ab, Bb, Cb, and Db indicated by the alternate long and short dash line in FIG.

Next, embodiments of the present invention will be described with reference to the drawings. In the drawings attached to the present specification, for convenience of illustration, easy understanding, etc., the dimensional ratios, vertical / horizontal dimensional ratios, scales, etc. of the respective parts have been changed or exaggerated, and are usually different from the actual ones. Does not match. In addition, the terms “conductor”, “conductive layer”, and “electrode” used in this specification have the same meaning and are not distinguished from each other. Further, “film” used in the present specification includes the meanings of “sheet”, “web”, and “plate” and is not distinguished from each other.
An example of a touch panel display to which the touch panel sensor of the present invention is applied is shown in FIG. The touch panel display is an input / output device in which a touch panel device and a display device (for example, a liquid crystal display device) are integrated. In the present invention, when the touch panel means the whole configuration, it is called a touch panel device, and when the touch panel means the main part of the input unit, it is called a touch panel sensor (details will be described later). FIG. 26A is a configuration diagram of a touch panel display, and FIG. 26B is a cross-sectional view of the touch panel display.
In the example shown in FIG. 26A, the touch panel display 110 includes a touch panel device 120 and a display device 130. The touch panel device 120 includes an input unit 121 and a circuit unit 122, and the display device 130 includes a display unit 131 and a display control unit 132.

The liquid crystal display device 130 displays on the display unit 131 so that the user can know the relationship between the contact position on the contact input surface of the input unit 121 of the touch panel device and the input content. In order to input a specific input content, the user makes a judgment by looking at the display, and touches the fingertip or the stylus pen to a specific position on the contact input surface. The input unit 121 and the circuit unit 122 are connected by a plurality of wirings. The input unit 121 generates an electrical signal corresponding to the difference in contact position on the contact input surface. The electric signal is transmitted to the circuit unit 122 through the plurality of wirings. The circuit unit 122 calculates a contact position from the transmitted electrical signal, and transmits an electrical signal indicating the calculated contact position to the display control unit 132. The display control unit 132 performs display control corresponding to the contact position indicated by the transmitted electrical signal.
The touch panel display is used as an input / output unit of an electronic device. The main body portion of the electronic device may be included in the display control unit 132 (FIG. 26A is an example thereof). Further, the main body of the electronic device and the display control unit 132 are separate and are not shown in FIG. 26A, but the display control unit 132 has an electrical connection wiring with the main body of the electronic device. It may be a thing. In any case, the electrical signal indicating the contact position calculated by the circuit unit 122 is transmitted to the main body of the electronic device, and the main body performs data processing corresponding to the contact position indicated by the transmitted electrical signal and displays the data. An electrical signal for operating the display of the display unit 131 is output to the control unit 132.

The input unit 121 of the touch panel device 120 includes a protective cover 123, an adhesive layer 124, and a touch panel sensor 125 as further detailed configurations, as shown in a cross-sectional view in FIG. The protective cover 123 is a protective film (or sheet or plate) provided on the user side (surface) of the touch panel sensor 125 in order to protect the touch panel sensor 125 from impact force, outside air (humidity), and the like. The protective cover 123 is made of a dielectric material that transmits visible light. The protective cover 123 is bonded to the touch panel sensor 125 via the adhesive layer 124. The protective cover 123 is a contact input surface (touch surface, input surface) in the input unit 121 of the touch panel device 120. In addition, the protective cover 123 forms the most observer side of the input / output device 110 and is also a cover that protects the touch panel device 120 and the display device 130 from the outside in the input / output device 110.
On the other hand, on the display surface side (back surface) of the touch panel sensor 125, that is, on the opposite side of the protective cover 123, the adhesive layer 126 is formed on the display surface of the display unit 131 in the liquid crystal display device 130 as shown in FIG. Is glued through.
Note that as the above-described adhesive layers 124 and 126, layers made of various known adhesive materials can be used. In this specification, “adhesion (layer)” is used as a concept including adhesion (layer).

As shown in FIG. 26B, the touch panel sensor 125 is a first transparent conductive film provided in a predetermined pattern on the base film 10 and a surface 10a on one side (user side) of the base film 10. The body 20 and the second transparent conductor 30 provided in a predetermined pattern on the surface 10b on the other side (display device side) of the base film 10 are included.
An example of the pattern of the first transparent conductor 20 is shown in FIG. An example of the pattern of the second transparent conductor 30 is shown in FIG. Moreover, the pattern which overlap | superposed the pattern of the 1st transparent conductor 20 and the pattern of the 2nd transparent conductor 30 is shown in FIG. FIG. 26B is a cross-sectional view, but FIGS. 4 to 6 are plan views.
As shown in FIGS. 4-6, in the touch panel sensor 125, the plane can be divided into characteristic areas. That is, it can be divided into an active area A corresponding to an area where the touch position can be detected, and an inactive area B adjacent to the active area A.

The active area A occupies an area facing the display area of the display device 130. Therefore, the touch panel sensor 125 uses a material that transmits visible light at least in the active area A. An example of the layer structure of the active area A is shown in FIG. 25D (only the structure of one surface of the base film 10 is shown in this figure). As shown in FIG. 25D, the layer configuration of the active area A in the touch panel sensor 125 is configured such that the transparent conductive layer (second transparent conductive layer 30) is present on the base film.
As shown in FIGS. 4 to 6, the active area A includes a first bulging electrode 21 and a second bulging portion that can form capacitive coupling with an external conductor (finger or stylus pen). A bulging electrode 31 is provided. In the example shown in FIGS. 4 to 6, the first bulging electrode 21 and the second bulging electrode 31 have a rectangular (substantially quadrilateral) pattern inclined by 45 degrees. The matrix is arranged. Each of the plurality of bulging portions arranged in a matrix is arranged so as not to overlap each other when viewed from a direction perpendicular to the surface of the base film 10, that is, as shown in FIG.
Each of the plurality of first bulging electrodes 21 arranged in a matrix is connected to the first bulging electrode 21 in the adjacent row direction (Y direction). A connecting portion that performs the connection is the first connecting electrode 22. Similarly, each of the plurality of second bulging electrodes 31 arranged in a matrix is connected to the adjacent second bulging electrodes 31 in the column direction (X direction). The connecting portion that performs the connection is the second connecting electrode 32. A plurality of connecting portions are arranged in a row like the bulging portions, but each of the connecting portions intersects each other when viewed from a direction perpendicular to the surface of the base film 10, that is, as shown in FIG. It is an array.
Thus, in the active area A, the pattern of the first transparent conductor 20 has a plurality of bulging portions (first bulging electrodes 21) and connecting portions (first connecting electrodes 22) extending in the row direction (Y direction). Each of the plurality of continuous patterns is a continuous pattern connected to each of a first transparent extraction conductor 23 and a first transparent terminal conductor 24 described later in the inactive area B. Similarly, the pattern of the second transparent conductor 30 is formed by a plurality of continuous patterns in which the bulging portion (second bulging electrode 31) and the connecting portion (second connecting electrode 32) extend in the column direction (X direction), Each of the plurality of continuous patterns is a continuous pattern connected to each of a second transparent extraction conductor 33 and a second transparent terminal conductor 34 described later in the inactive area B.

On the other hand, the non-active area B is formed in a frame shape so as to surround the rectangular active area A from the four sides. This inactive area B is formed in a region facing the non-display region of the display device 130.
The inactive area B can be further divided into an extraction area C and a terminal area D. As shown in FIGS. 4 to 6, the first transparent conductor 23, which is a part of the extraction area C of the first transparent conductor 20, is in the extraction area C, and the first transparent conductor 20 is in the terminal area D. There is a first transparent terminal conductor 24 which is a part of the terminal area D. The extraction area C has a second transparent extraction conductor 33 which is a portion of the extraction area C of the second transparent conductor 30, and the terminal area D is a portion of the terminal area D of the second transparent conductor 30. There are two transparent terminal conductors 34.
As shown in FIGS. 4 to 6, the first transparent extraction conductor 23 is connected to the first bulging electrode 21 at one end, and is connected to the first transparent terminal conductor 24 at the other end. Further, as shown in FIG. 26A, the first transparent terminal conductor 24 is a circuit configured to detect a contact position of the external conductor (finger or stylus pen) to the contact input surface of the input unit 121. The portion 122 is electrically connected by wiring. Similarly, as shown in FIG. 4 to FIG. 6, the second transparent extraction conductor 33 is connected to the second bulging electrode 31 at one end and to the second transparent terminal conductor 34 at the other end. ing. Further, as shown in FIG. 26A, the second transparent terminal conductor 34 is a circuit configured to detect a contact position of the external conductor (finger or stylus pen) with respect to the contact input surface of the input unit 121. The portion 122 is electrically connected by wiring.

A covering conductive layer and a photosensitive layer (electrode protective layer) are formed on the first transparent extraction conductor 23 and the second transparent extraction conductor 33 in the extraction area C of the inactive area B.
An example of the layer structure in the extraction area C is shown in FIG. 25B (in this figure, only the structure of one surface of the base film 10 is shown). As shown in FIG. 25B, the layer configuration of the extraction area C in the touch panel sensor 125 includes the second transparent extraction conductor 33 on the base film 10 and the second transparent extraction conductor 33. The second extraction conductor 53 which is a covering conductive layer is present, and the photosensitive layers (electrode protective layers) 75 and 78 are present on the second extraction conductor 53.
In addition, a covering conductive layer is formed on the first transparent terminal conductor 24 and the second transparent terminal conductor 34 in the terminal area D of the inactive area B. An example of the layer structure in the terminal area D is shown in FIG. 25A (in this figure, only the structure of one surface of the base film 10 is shown). As shown in FIG. 25A, the layer configuration of the terminal area D in the touch panel sensor 125 includes the second transparent terminal conductor 34 on the base film 10 and the second transparent terminal conductor 34. Is a configuration in which a second terminal conductor 54 which is a coated conductive layer is present.

An example of the pattern of the first covering conductive layer (the first extraction conductor 43 and the first terminal conductor 44) is shown in FIG. An example of the pattern of the second covering conductive layer (second extraction conductor 53 and second terminal conductor 54) is shown in FIG. FIG. 17 shows a pattern obtained by superimposing the pattern of the first covered conductive layer and the pattern of the second covered conductive layer. 15-17, the pattern part of a 1st coating conductive layer and the pattern part of a 2nd coating conductive layer are shown as a continuous line, and the part of the 1st transparent conductor 20 and the 2nd transparent conductor 30 is shown with a broken line. 15 to 17 are plan views.
The pattern of the first transparent conductor 20 is such that the bulging portion (first bulging electrode 21) and the linking portion (first linking electrode 22) are in the row direction (Y direction) as shown by the broken lines in FIGS. Each of the plurality of first extraction conductors 43 couples each of the plurality of continuous patterns to each of the first terminal conductors 44. The first extraction conductor 43 is provided on the first transparent extraction conductor 23 described above, and the first terminal conductor 44 is provided on the first transparent terminal conductor 24 described above. The first take-out conductor 43 and the first transparent take-out conductor 23 and the first terminal conductor 44 and the first transparent terminal conductor 24 are stacked in two layers, thereby improving the conductivity at that portion. (Electric resistance can be reduced). Similarly, as shown by broken lines in FIGS. 16 and 17, the pattern of the second transparent conductor 30 is such that the bulging portion (second bulging electrode 31) and the connecting portion (second linking electrode 32) are arranged in the column direction ( Each of the plurality of second extraction conductors 53 connects each of the plurality of continuous patterns and each of the second terminal conductors 54. The second extraction conductor 53 is provided on the second transparent extraction conductor 33 described above, and the second terminal conductor 54 is provided on the second transparent terminal conductor 34 described above. The second lead conductor 53 and the second transparent conductor conductor 33 and the second terminal conductor 54 and the second transparent terminal conductor 34 are stacked in two layers to improve the conductivity at that portion. (Electrical resistance can be reduced).
In contrast to this covering conductive layer, the photosensitive layer (electrode protective layer) is provided only on the extraction conductor (first extraction conductor 43, second extraction conductor 53), and the terminal conductor (first terminal conductor). 44, the second terminal conductor 54) is not provided. The photosensitive layer (electrode protective layer) protects the extracted conductor from corrosion, leakage, and the like.

Next, the material of each part constituting the touch panel sensor 125 will be described in particular.
The base film 10 is a dielectric material that transmits visible light, for example, a film body 11 made of a resin film such as a PET film (polyethylene terephthalate film), and index matching formed on one or both surfaces of the film body 11. And a film 12. An example of the structure of the base film 10 is shown in FIGS. 27 (A) and 27 (B). As shown in FIG. 27A, the index matching film 12 includes a plurality of high refractive index films 12a and low refractive index films 12b arranged alternately. By providing the index matching film 12, even if the refractive index of the film body 11 of the base film 10 and the transparent conductors 20 and 30 are greatly different, the transparent conductors 20 and 30 on the base film 10 are It is possible to prevent the reflectance from changing greatly between the provided region and the non-provided region.
As shown in FIG. 27B, the base film 32 includes a film body 11 made of a resin film and a low refractive index film 13 formed on one or both surfaces of the film body 11. is doing. According to the low refractive index film 13, the transparent conductors 20, 30 on the base film 10 are different even if the film body 11 of the base film 10 and the transparent conductors 20, 30 are largely different in refractive index. It is possible to prevent the spectral characteristics of the transmittance from greatly changing between the provided region and the non-provided region, and to realize uniform transmittance in each wavelength region.

The first transparent conductor 20 and the second transparent conductor 30 are formed of a material that is transparent to visible light and has conductivity (for example, ITO (indium tin oxide)). ITO is preferable because it has good conductivity among transparent conductive materials, but other transparent conductive materials can also be used. For example, zinc oxide (AZO: aluminum-added zinc oxide, GZO: gallium-added zinc oxide), tin oxide (Sn02), titanium oxide (TiO2), magnesium hydroxide (Mg (OH) 2), organic conductivity Polymers (polythiophene-based conductive polymers) are known.
Since the first extraction conductor 43, the second extraction conductor 53, the first terminal conductor 44, and the second terminal conductor 54 (that is, the covering conductive layer) are disposed in the non-active area B, the light transmitting property It is not necessary to form it from the material which has this, and the material which has conductivity much higher than transparent conductive materials, such as ITO, can be used. For example, a metal material such as aluminum, molybdenum, silver, chromium, copper, or the like having a much higher conductivity than a transparent conductor such as ITO can be suitably used. These metal materials have light shielding properties. The light shielding property functions as a light shielding body that prevents exposure to an inappropriate part when performing exposure for patterning or the like in the manufacturing process of the touch panel sensor 125 (details will be described later).

The photosensitive layer (electrode protective layer) can be formed of a material having a property of protecting the portion of the extraction conductor from corrosion, leakage, and the like. In the present invention, a photosensitive material can be suitably used as the material. For example, for example, a novolac positive resist or an acrylic negative resist (resist using an acrylic resin and a multi-sensitive acrylic monomer (oligomer)) can be preferably used. Specific product names for the novolak positive resists are "SC500", a product of Rohm & Haas Electronic Materials, "FR1000", a product of AZ Electronic Materials, Inc. "AZ 8112", the company product "AZ RFP-230K2", etc. can be used conveniently. In addition, specific product names of acrylic negative resists include “IT-MP1905-15 Rev. 12 (IT-MP1909)”, a product of Inktec, and “NN901”, a product of JSR. It can be preferably used.
Thus, in the present invention, both a positive resist and a negative resist can be used as the resist. If a manufacturing method using one type of resist is understood, it is extremely easy for a person skilled in the art to understand a manufacturing method using the other type of resist. Therefore, in the following, only the manufacturing method when using a positive resist will be described.

Next, a method for manufacturing the touch panel sensor 125 having the above configuration will be described. A manufacturing process (first example) of the touch panel sensor of the present invention is shown in FIG. 1 as a flowchart.
First, in step S1 (first photosensitive layer formation), the transparent base film 10, the transparent conductive layer 20 provided on the surface on one side of the base film, and the surface of the transparent conductive layer 20 A first photosensitive layer 60 of a photosensitive etching resist is formed on the surface of the laminate having the coated conductive layer 40 provided on the side of the coated conductive layer 40. When the laminate has a layer structure on both sides of the base film 10, that is, in addition to the above, the transparent conductive layer 30 provided on the other side of the base film, and the transparent conductive layer 30 In the case of a laminated body having a coated conductive layer 50 provided on the surface, a first photosensitive layer 70 of a photosensitive etching resist is formed on the surface of the laminated body on the coated conductive layer 50 side.
The first photosensitive layers 60 and 70 are formed by applying a coating solution of a photosensitive material to the laminate by a coating method such as spin coating or die coating, and then drying by hot air drying or the like. It can be carried out by scattering and drying volatile components (solvent, moisture, etc.) of the applied coating liquid.

FIG. 2 is a sectional view showing the structure of the laminate before and after the first photosensitive layer forming step. As shown in FIG. 2 (A), the layer structure of the laminate having a layer structure only on one side is the base film 10, the transparent electrode 20 on the surface on one side thereof, and the coated conductive layer 40 on the surface. It has a layer structure in which layers are stacked in order. As shown in FIG. 2B, the first photosensitive layer-formed laminated body in which the first photosensitive layer 60 is formed on the surface of the laminated body on the side of the coated conductive layer 40 using the laminated body as a raw material. The material film 10 has a layer structure in which the transparent electrode 20 is formed on the surface on one side thereof, the coated conductive layer 40 is formed thereon, and the first photosensitive layer 60 is laminated thereon in that order.
As shown in FIG. 2 (C), the layer structure of the laminate having the layer structure on both sides is the base film 10, the transparent electrode 20 on the surface on one side, the coated conductive layer 40 on the surface, A transparent electrode 30 is formed on the other surface of the base film 10, and a coated conductive layer 50 is stacked thereon in that order. Using this laminate as a raw material, the first photosensitive layer 60 is formed on the surface of the laminate on the side of the coated conductive layer 40, and the first photosensitive layer 70 is formed on the surface of the laminate on the side of the coated conductive layer 50. The formed first photosensitive layer-formed laminate, as shown in FIG. 2 (D), is a base film 10, a transparent electrode 20 on the surface on one side thereof, a coated conductive layer 40 thereon, and a top thereof. A layer in which the first photosensitive layer 60, the transparent electrode 30 on the surface of the other side of the base film 10, the coated conductive layer 50 thereon, and the first photosensitive layer 70 thereon are laminated in that order. It has a configuration.

Next, in step S2 (first exposure), the first photosensitive layers 60 and 70 are exposed through the first photomask. An example of the first exposure process is shown in FIG. 3 as an explanatory diagram. In this first exposure step, as shown in FIG. 3, exposure is performed from both sides with the first photosensitive layer-formed laminate sandwiched between the first photomask 80 and the first photomask 90. Generally, light (electromagnetic radiation) such as ultraviolet rays is used as a light source for exposure, but an electron beam is used depending on the material of the first photosensitive layers 60 and 70.
Light from the outside of the entire surface of the first photomask 80 passes through the first photomask 80 and becomes a predetermined pattern of light, reaches the first photosensitive layer 60 and exposes the first photosensitive layer 60. . Part of the light further passes through the first photosensitive layer 60 and reaches the coated conductive layer 40. The covering conductive layer 40 is a layer made of a good electrical conductor such as a metal material and shields light. Therefore, it does not reach the opposite side of the base film 10.
Similarly, the light from the outside of the entire surface of the first photomask 90 passes through the first photomask 90 and reaches the first photosensitive layer 70 as light having a predetermined pattern and reaches the first photosensitive layer 70. Are exposed in a predetermined pattern. Part of the light further passes through the first photosensitive layer 70 and reaches the coated conductive layer 50. The covering conductive layer 50 is a layer made of a good electrical conductor such as a metal material and shields light. Therefore, it does not reach the opposite side of the base film 10.
Thus, since the covering conductive layer 40 and the covering conductive layer 50 have a function of shielding light, different patterns on one surface and the other surface of the base film 10 are mutually influenced in the first exposure step. It can be applied completely independently without being done. This point also has the same effect in the first exposure process of the second and third examples described later. Therefore, by simultaneously exposing both surfaces of the base film, the process can be simplified with respect to the case of separately exposing.

The pattern of the first photomask 80 is basically the same as the pattern of the first transparent conductor 20, that is, the example of the pattern of the first transparent conductor 20 shown in FIG. As a pattern other than the pattern of the first transparent conductor 20, the pattern of the first photomask 80 includes, for example, a registration mark for alignment in a later process, a product name that identifies the product, and a product that identifies the manufacture. Numbers and other patterns can be included. In addition, the pattern such as the line width of the pattern is finely adjusted so that a desired first transparent conductor pattern can be finally obtained through steps such as exposure and etching.
Similarly, the pattern of the first photomask 90 is basically the same as the pattern of the second transparent conductor 30, that is, the example of the pattern of the second transparent conductor 30 shown in FIG. As a pattern other than the pattern of the second transparent conductor 30, the pattern of the first photomask 90 includes, for example, a registration mark for alignment, a product name that identifies a product, a product number that identifies manufacture, and other patterns. Can be included. Further, the pattern such as the line width of the pattern is finely adjusted so that a desired pattern of the second transparent conductor 30 can be finally obtained through steps such as exposure and etching.
The first photomask 80 and the first photomask 90 are relatively aligned so that the corresponding positions on the respective planes are appropriate, and in this state, the first photosensitive layer is formed as shown in FIG. Hold the laminate. The first photomask 80 and the first photomask 90 are aligned relative to each other so that the pattern of the first transparent conductor and the pattern of the second transparent conductor 30 are arranged as shown in FIG. Is done.

4 is a cross-sectional view (first exposure) of the first photosensitive layer-formed laminate at positions Aa, Ba, Ca, Da indicated by a one-dot chain line in FIG. 4 and positions Ab, Bb, Cb, Db indicated by a one-dot chain line in FIG. Steps) are shown in FIGS. These cross-sectional views change as the manufacturing process proceeds. By comparing the changing cross-sectional views, the manufacturing process is easily understood.
7 to 10, in both the first photomask 80 and the first photomask 90, the black portion is a portion that shields the exposure light, and the white portion transmits the exposure light. It has become a part.
FIG. 7A is a cross-sectional view of the position of Aa indicated by a dashed line in FIG. This portion is a portion where the first transparent terminal conductor 24 and the first terminal conductor 44 are formed.
FIG. 7B is a cross-sectional view of the position of Ba indicated by a one-dot chain line in FIG. This portion is where the first transparent extraction conductor 23, the first extraction conductor 43, and the second photosensitive layer (electrode protective layer) 78 are formed.
FIG. 8A is a cross-sectional view of the active area A in the vicinity of the position of Ca indicated by the alternate long and short dash line in FIG. This portion is a portion where the first transparent extraction conductor 23 is extended to the active area A and connected to the bulging portion (first bulging electrode 21) of the active area A.
FIG. 8B is a cross-sectional view of the position of Da indicated by the alternate long and short dash line in FIG. This portion is a portion where the bulge portion (first bulge electrode 21) of the active area A is formed.
FIG. 9A is a cross-sectional view of the position of Ab shown by the alternate long and short dash line in FIG. This portion is a portion where the second transparent terminal conductor 34 and the second terminal conductor 54 are formed.
FIG. 9B is a cross-sectional view of the position Bb shown by the alternate long and short dash line in FIG. This portion is a portion where the second transparent extraction conductor 33, the second extraction conductor 53, and the second photosensitive layer (electrode protective layer) 78 are formed.
FIG. 10A is a cross-sectional view of the position of Cb indicated by the alternate long and short dash line in FIG. 5, that is, the boundary position of the extraction area C and the active area A. This portion is a portion where the second transparent extraction conductor 33 is extended to the active area A and connected to the bulging portion (second bulging electrode 31) of the active area A.
FIG. 10B is a cross-sectional view of the position of Db indicated by the alternate long and short dash line in FIG. This portion is a portion where the bulge portion (second bulge electrode 31) of the active area A is formed.

Next, in step S3 (first development), the first photosensitive layers 60 and 70 of the first exposed laminate are developed and the first photosensitive layers 60 and 70 are patterned. That is, a developer suitable for developing the first photosensitive layers 60 and 70 is prepared, and the first photosensitive layers 60 and 70 are developed using the developer. Thereby, the 1st photosensitive layer of the site | part exposed to light in the 1st exposure process is removed. That is, the first photosensitive layers 60 and 70 have basically the same pattern as the first photomasks 80 and 90.
The layer structure of the first developed laminate patterned in the first development step is shown in FIG. 11 as a cross-sectional view (first development step) at positions Ab, Bb, Cb, and Db indicated by the alternate long and short dash line in FIG. In the figures so far, both surfaces of the base film 10 have been described, but the change in the layer configuration on both sides in the progress of the process is the same, and the other layer configuration can be predicted from one to the other. Therefore, only the side shown in FIG. 5 will be mainly described from here. In FIG. 11, it is shown upside down with respect to the diagram of the layer structure so far.
FIG. 11A is a cross-sectional view of the position of Ab shown by the alternate long and short dash line in FIG. This portion is a portion where the second transparent terminal conductor 34 and the second terminal conductor 54 are formed. After the first development step, the first photosensitive layer is a portion of the first photosensitive layer 70 corresponding to the portion shown in black in FIG. 9A, that is, the portion where the exposure light is shielded, that is, the patterned first layer. Only one photosensitive layer 74 is left.
FIG. 11B is a cross-sectional view of the position of Bb indicated by the alternate long and short dash line in FIG. This portion is where the first transparent extraction conductor 33, the second extraction conductor 53, and the second photosensitive layer (electrode protective layer) 78 are formed. After the first development step, the first photosensitive layer is the first photosensitive layer 70 corresponding to the portion shown in black in FIG. 9B, that is, the portion where the exposure light is shielded, that is, the patterned first photosensitive layer. Only the portion of layer 73 is left.
FIG. 11C is a cross-sectional view of the position of Cb indicated by the alternate long and short dash line in FIG. 5, that is, the boundary position of the extraction area C and the active area A. This portion is a portion where the second transparent extraction conductor 33 is extended to the active area A and connected to the bulging portion (second bulging electrode 31) of the active area A. After the first development step, the first photosensitive layer is a portion of the first photosensitive layer 70 corresponding to the portion shown in black in FIG. 10A, that is, the portion where the exposure light is shielded, that is, the patterned first layer. Only one photosensitive layer 73 is left.
FIG. 11D is a cross-sectional view of the position of Db indicated by a one-dot chain line in FIG. This portion is a portion where the bulge portion (second bulge electrode 31) of the active area A is formed. After the first development step, the first photosensitive layer is a portion of the first photosensitive layer 70 corresponding to the portion shown in black in FIG. 10A, that is, the portion where the exposure light is shielded, that is, the patterned first layer. Only one photosensitive layer 71 is left.

Next, in step S4 (first etching), the coated conductive layer 50 and the transparent conductive layer 30 are etched using the first photosensitive layer 70 of the first developed laminate patterned in the first development step as a first etching mask. Then, the covering conductive layer 50 and the transparent conductive layer 30 are patterned.
This first etching process is composed of two etching processes, a first etching process and a second etching process. The coated conductive layer 50 is patterned in the first etching step, and the transparent conductive layer 30 is patterned in the second etching step.
In the first etching step, for example, when the coated conductive layer 50 is made of aluminum or molybdenum, phosphoric acid acetic acid (water) containing phosphoric acid, nitric acid, acetic acid, and water in a ratio of 5: 5: 5: 1. ) Can be used as an etchant. Further, when the coated conductive layer 50 is made of silver, phosphoric acid acetic acid (water) obtained by blending phosphoric acid, nitric acid, acetic acid, and water in a ratio of 4: 1: 4: 4 can be used as an etching solution. . Furthermore, when the covering conductive layer 50 is made of chromium, an etching solution in which cerium ammonium nitrate, perchloric acid, and water are mixed at a ratio of 17: 4: 70 can be used.
In the second etching step, for example, when the transparent conductive layer 30 is made of ITO, ferric chloride can be used as an etching solution.
In this way, by using a plurality of types of etching solutions, the coated conductive layer and the transparent conductive layer made of different materials can be etched.

The layer structure of the first etched laminate patterned in the first etching step is shown in FIG. 12 as a cross-sectional view (first etching step) at positions Ab, Bb, Cb, and Db indicated by alternate long and short dash lines in FIG.
FIG. 12A is a cross-sectional view (first etching step) of the position of Ab shown by the alternate long and short dash line in FIG. 5, that is, the terminal area D. FIG. After the first etching step, as the covering conductive layer and the transparent conductive layer, the portion of the first photosensitive layer 70 in FIG. 11A, that is, the portion of the first photosensitive layer 74 patterned by the first exposure and the first development. Only the portions of the covering conductive layer 50 (first terminal conductor 54) and the transparent conductive layer 30 (second transparent terminal conductor 34) corresponding to the above are left.
FIG. 12B is a cross-sectional view of the position Bb shown by the alternate long and short dash line in FIG. After the first etching step, the coated conductive layer 50 and the transparent conductive layer include a coated conductive layer 50 (corresponding to the portion of the first photosensitive layer 70 in FIG. 11B, that is, the patterned first photosensitive layer 73). Only the second extraction conductor 53) and the portion of the transparent conductive layer 30 (second transparent extraction conductor 33) are left.
12C is a cross-sectional view of the position of Cb indicated by the alternate long and short dash line in FIG. After the first etching step, the coated conductive layer 50 and the transparent conductive layer include a coated conductive layer 50 (corresponding to the portion of the first photosensitive layer 70 in FIG. 11C, that is, the patterned first photosensitive layer 73). Only the second extraction conductor 53) and the portion of the transparent conductive layer 30 (second transparent extraction conductor 33) are left.
FIG. 12D is a cross-sectional view of the position Db shown by the alternate long and short dash line in FIG. After the first etching step, as the covering conductive layer and the transparent conductive layer, the covering conductive layer 50 (corresponding to the portion of the first photosensitive layer 70 in FIG. 11D, that is, the patterned first photosensitive layer 71). Only the portions of the second bulging conductor 51) and the transparent conductive layer 30 (second bulging electrode 31) are left.

Next, in step S5 (photosensitive layer removal), the first photosensitive layer that has been patterned and remains on the coated conductive layer is removed. For example, by using an alkaline solution such as 2% potassium hydroxide, the remaining first photosensitive layer 70 is removed, and the patterned coated conductive layer 50 is exposed. The exposed covering conductive layer 50 is basically the same as an example of the pattern of the second transparent conductor 30 shown in FIG.
FIG. 5 is a cross-sectional view (photosensitive layer removal process) at positions Ab, Bb, Cb, and Db indicated by a one-dot chain line in FIG. 5 showing the layer configuration of the photosensitive layer-removed laminate from which the first photosensitive layer has been removed in the photosensitive layer removal process. As shown in FIG.
FIG. 13A is a cross-sectional view (photosensitive layer removing step) of the position of Ab shown by the alternate long and short dash line in FIG. 5, that is, the terminal area D. FIG. After the photosensitive layer removing step, the part of the first photosensitive layer 70 in FIG. 12A, that is, the part of the first photosensitive layer 74 patterned by the first exposure and the first development is removed, and the coating corresponding to the part is removed. The portions of the conductive layer 50 (first terminal conductor 54) and the transparent conductive layer 30 (second transparent terminal conductor 34) are left.
FIG. 13B is a cross-sectional view of the position Bb shown by the alternate long and short dash line in FIG. After the photosensitive layer removing step, the portion of the first photosensitive layer 70 in FIG. 12B, that is, the portion of the patterned first photosensitive layer 73 is removed, and the coated conductive layer 50 (second extraction conductive layer) corresponding to the portion is removed. Body 53) and a portion of the transparent conductive layer 30 (second transparent extraction conductor 33) are left.
FIG. 13C is a cross-sectional view of the position of Cb indicated by the one-dot chain line in FIG. 5, that is, the boundary position of the extraction area C and the active area A. After the photosensitive layer removing step, the portion of the first photosensitive layer 70 in FIG. 12C, that is, the portion of the patterned first photosensitive layer 73 is removed, and the corresponding covering conductive layer 50 (second extraction conductor) is removed. 53), the portion of the transparent conductive layer 30 (second transparent extraction conductor 33) is left.
FIG. 13D is a cross-sectional view of the position of Db indicated by a one-dot chain line in FIG. After the first etching step, the part of the first photosensitive layer 70 in FIG. 12D, that is, the part of the patterned first photosensitive layer 71 is removed, and the covered conductive layer 50 (second bulge) corresponding to the part is removed. The portions of the conductor 51) and the transparent conductive layer 30 (second bulging electrode 31) are left.

Next, in step S6 (second photosensitive layer formation), a second photosensitive layer of a photosensitive etching resist is formed on the surface on the side where the coated conductive layer and the transparent conductive layer of the laminate having the photosensitive layer removed are patterned. The second photosensitive layers 65 and 75 are formed by applying a coating solution of a photosensitive material to the laminate by a coating method such as spin coating or die coating, and then drying by hot air drying or the like. It can be carried out by scattering and drying the volatile components (solvent) of the applied coating liquid.
FIG. 5 is a cross-sectional view (second view) of the layer structure of the second photosensitive layer-formed laminated body in which the second photosensitive layer is formed in the second photosensitive layer forming step, at positions Ab, Bb, Cb, and Db indicated by a dashed line FIG. 14 shows the photosensitive layer forming step.
FIG. 14A is a cross-sectional view (second photosensitive layer forming step) of the position of Ab shown by the alternate long and short dash line in FIG. 5, that is, the terminal area D. FIG. After the second photosensitive layer forming step, the upper surface and the side surface on which the covering conductive layer 50 (first terminal conductor 54) and the transparent conductive layer 30 (second transparent terminal conductor 34) in FIG. The second photosensitive layer 75 is formed on the surface where the base film 10 is exposed, that is, the entire surface.
FIG. 14B is a cross-sectional view of the position Bb indicated by the alternate long and short dash line in FIG. After the second photosensitive layer forming step, the upper surface on which the covering conductive layer 50 (second extraction conductor 53) and the transparent conductive layer 30 portion (second transparent extraction conductor 33) in FIG. The second photosensitive layer 75 is formed on the side surface and the surface where the base film 10 is exposed, that is, the entire surface.
14C is a cross-sectional view of the position of Cb indicated by the alternate long and short dash line in FIG. 5, that is, the boundary position of the extraction area C and the active area A. FIG. After the formation of the second photosensitive layer, the upper surface on which the covering conductive layer 50 (second extraction conductor 53) and the transparent conductive layer 30 portion (second transparent extraction conductor 33) in FIG. The second photosensitive layer 75 is formed on the side surface and the surface where the base film 10 is exposed, that is, the entire surface.
FIG. 14D is a cross-sectional view of the position Db indicated by the alternate long and short dash line in FIG. After the formation of the second photosensitive layer, the upper surface on which the portions of the covering conductive layer 50 (second bulging conductor 51) and the transparent conductive layer 30 (second bulging electrode 31) in FIG. The second photosensitive layer 75 is formed on the side surface and the surface where the base film 10 is exposed, that is, the entire surface.

Next, in step S7 (second exposure), the second photosensitive layer 75 of the laminate having the second photosensitive layer formed is exposed through a second photomask. The pattern of the second photomask is a pattern that transmits the exposure light to the second photosensitive layer 75 in the active area A and shields the exposure light from the second photosensitive layer 75 in the inactive area B. .
In the first etched laminate, the surface is covered with the second photosensitive layer 75, but a transparent conductor is formed below the second photosensitive layer 75, that is, between the second photosensitive layer 75 and the base film 10. There is a pattern. The surface of one side of the base film 10 has a pattern of the first transparent conductor 20 shown in FIG. 4, and the surface of the other side has a pattern of the second transparent conductor 30 shown in FIG. A pattern in which the pattern of the first transparent conductor 20 and the pattern of the second transparent conductor 30 are superimposed is shown in FIG.
FIGS. 15-17 are drawn corresponding to these FIGS. 4-6 (description figure of the 2nd etched laminated body mentioned later). The second photomask to be applied to the surface on one side of the base film 10 at least shields the exposure light in the second exposure step at and around the pattern indicated by the solid line in FIG. 15, and at least the pattern indicated by the broken line. The exposure light in the second exposure step is transmitted through the portion. The second photomask applied to the surface on the other side of the base film 10 at least shields the exposure light in the second exposure step at and around the pattern indicated by the solid line in FIG. 16, and at least the pattern indicated by the broken line. The exposure light in the second exposure step is transmitted through the portion. FIG. 17 shows a superimposed pattern. Here, “the portion of the pattern indicated by the solid line and its surroundings” means “the portion in which the pattern indicated by the solid line is thickened (expanded)”. The reason for this is to protect the portion of the extraction conductor 53 from corrosion, deterioration of insulation, etc. by completely covering the “part of the pattern indicated by the solid line” with the two photosensitive layers 75, that is, the electrode protective layer. .
In particular, in the non-active area B, when there is no portion excluding the second photosensitive layer (for example, register mark, product name, product number, etc.), the first photomask and the second photomask that perform such exposure are used. The photo has a simple pattern that transmits the exposure light to the second photosensitive layer 75 on the entire surface of the active area A and shields the exposure light to the second photosensitive layer 75 on the entire surface of the non-active area B. A mask can be applied.
When performing the second exposure step with such a photomask, as shown in FIGS. 18A, 18B, 18C, and 18D, a portion that becomes a light shielding portion in the second photomask 91. In FIG. 7, the coated conductive layer 50 exists, and as shown in FIGS. 7 to 10, the exposure light from the back surface of the base film (photosensitive layer 60 side) is shielded, and the photosensitive layer 70 is exposed to the exposure light from the back surface. Not sensitive. Therefore, in the second exposure step, different patterns on one surface and the other surface of the base film 10 can be applied completely independently without being influenced by each other. This point has the same effect in the second exposure process of the second example and the third example described later, and the same is true when half exposure described later is performed. Therefore, by exposing both surfaces of the base film at the same time, the process can be simplified with respect to the case of separately exposing.

FIG. 18 shows a cross-sectional view (second exposure step) of the first etched laminated body on which the second photomask 91 is placed at the positions of Ab, Bb, Cb, and Db indicated by alternate long and short dash lines in FIG.
In FIG. 18, the second photomask 91 is a portion indicated by black, that is, a portion where the inactive area B blocks exposure light, and a portion indicated by white, ie, a portion where the active area A transmits exposure light. It has become.
FIG. 18A is a cross-sectional view of the position of Ab shown by the alternate long and short dash line in FIG. This portion is a portion where the second transparent terminal conductor 34 and the second terminal conductor 54 are formed.
18B is a cross-sectional view of the position Bb shown by the alternate long and short dash line in FIG. This portion is a portion where the second transparent extraction conductor 33, the second extraction conductor 53, and the photosensitive layer (electrode protective layer) 78 are formed.
18C is a cross-sectional view of the position of Cb indicated by the alternate long and short dash line in FIG. 5, that is, the boundary position of the extraction area C and the active area A. This portion is a portion where the second transparent extraction conductor 33 is extended to the active area A and connected to the bulging portion (second bulging electrode 31) of the active area A.
FIG. 18D is a cross-sectional view of the position of Db indicated by the alternate long and short dash line in FIG. This portion is a portion where the bulge portion (second bulge electrode 31) of the active area A is formed.

Next, in step S8 (second development), the photosensitive layer 75 is developed and patterned. That is, a developer suitable for development of the photosensitive layer 75 is prepared, and the photosensitive layer 75 is developed using this developer. Thereby, the photosensitive layer of the site | part exposed to light in a 2nd exposure process is removed. The photosensitive layer 75 that has undergone the second development process is shown in FIGS. 15 to 17 (corresponding to FIG. 5 is FIG. 16), the portion excluding the active area A indicated by the broken line, that is, the portion of the inactive area B itself. It basically has the same pattern.
The layer structure of the second developed laminated body patterned in the second development step is shown in FIG. 19 as a cross-sectional view (second development step) at positions Ab, Bb, Cb, and Db indicated by a one-dot chain line in FIG.
FIG. 19A is a cross-sectional view of the position of Ab shown by the alternate long and short dash line in FIG. As the second photosensitive layer 75, only the portion of the second photosensitive layer 79 corresponding to the black portion in FIG. 18A, that is, the portion where the exposure light is shielded is left.
FIG. 19B is a cross-sectional view of the position Bb shown by the alternate long and short dash line in FIG. After the second development step, as the second photosensitive layer 75, only the second photosensitive layer 78 corresponding to the black portion in FIG. 18B, that is, the portion where the exposure light is shielded is left. .
FIG. 19C is a cross-sectional view of the position of Cb indicated by the alternate long and short dash line in FIG. 5, that is, the boundary position of the extraction area C and the active area A. After the second development step, only the portion of the second photosensitive layer 78 corresponding to the portion shown in black in FIG. 18C, that is, the portion where the exposure light is shielded is left as the second photosensitive layer 75. ing.
FIG. 19D is a cross-sectional view of the position of Db indicated by a one-dot chain line in FIG. After the second development step, a clear difference is recognized as compared with FIG. 18 (D), and the photosensitive layer 75 is completely removed.

Next, in step S9 (second etching), the part of the touch sensor, that is, the covering conductive layer in the active area A is etched away using the patterned second photosensitive layer 75 as a second etching mask. In this second etching step, for example, when the coated conductive layer 50 is made of aluminum or molybdenum, phosphoric acid acetic acid (5: 5: 5: 1) containing phosphoric acid, nitric acid, acetic acid, and water is blended. Water) can be used as an etchant. Further, when the coated conductive layer 50 is made of silver, phosphoric acid acetic acid (water) obtained by blending phosphoric acid, nitric acid, acetic acid, and water in a ratio of 4: 1: 4: 4 can be used as an etching solution. . Furthermore, when the covering conductive layer 50 is made of chromium, an etching solution in which cerium ammonium nitrate, perchloric acid, and water are mixed at a ratio of 17: 4: 70 can be used.
In this second etching step, the covering conductive layer is removed from the pattern of the active area A, and the active area A transmits visible light. Further, the coating conductive layer is left in the pattern of the non-active area B, and good conductivity is still given.
An example of the pattern of the first coated conductive layer (the first extraction conductor 43 and the first terminal conductor 44) is shown in FIG. 15, and the pattern of the second coated conductive layer (the second extraction conductor 53 and the second terminal conductor 54). ) Is shown in FIG. 16, and a pattern in which the pattern of the first covered conductive layer and the pattern of the second covered conductive layer are superimposed is shown in FIG.

FIG. 20 is a cross-sectional view after the second etching process in step S9, that is, a cross-sectional view (second etching) of the second etched layered body at positions Ab, Bb, Cb, and Db indicated by alternate long and short dash lines in FIG. Show.
FIG. 20A is a cross-sectional view of the position of Ab shown by the alternate long and short dash line in FIG. The layer structure at this portion is basically the same as that in FIG. 19A, which is a cross-sectional view of the second development step. The photosensitive layer 75 (photosensitive layer (electrode protective layer) 79) covers that portion.
Thereby, terminal portions (second transparent terminal conductor 34, second terminal conductor 54, photosensitive layer (electrode protective layer) 79) in the touch panel sensor are formed in this portion. This terminal portion is covered with an electrode protective layer, and as such, it cannot be used as a terminal electrode to connect an electric signal. Therefore, for this terminal portion, it is necessary to remove the electrode protective layer of the terminal portion in a separate process so that it can be used as a terminal electrode. For example, a method of performing spot exposure only on the terminal portion and developing, mechanically removing, etc. can be applied. The method for exposing the terminal portion to remove the electrode protective layer is specifically as follows. After the step S9 (second etching), at least the second transparent terminal conductor 34 and the second terminal in the region including the terminal portion, specifically, in the terminal area D of the inactive area B shown in FIG. The photosensitive layer 74 on the second terminal conductor is removed by performing exposure using a photomask that has a light transmitting portion in an area covering the conductor 54 and shields the other areas from light. I can do it. Similarly, the photosensitive layer 60 on the first terminal conductor 44 can be removed. If such a process is added, the electrode protective layer in the terminal portion is removed, and a touch panel sensor having a configuration in which the first terminal conductor 44 and the second terminal conductor 54 are exposed is obtained. Similarly, when spot exposure is performed, after step S9 (second etching), the photosensitive layer 79 on the terminal conductor may be subjected to spot exposure and then developed.
FIG. 20B is a cross-sectional view of the position Bb indicated by the one-dot chain line in FIG. The layer structure at this portion is basically the same as that in FIG. 19B, which is a cross-sectional view of the second development step. The photosensitive layer 75 (photosensitive layer (electrode protective layer) 78) covers that portion.
Thereby, the extraction conductor portions (second transparent extraction conductor 33, second extraction conductor 53, photosensitive layer (electrode protective layer) 78) in the touch panel sensor are formed in this portion. This extraction conductor is covered with an electrode protective layer. Therefore, it is possible to avoid the problem that the durability of the touch panel device is significantly impaired due to the corrosion of the portion of the extracted conductor.
20C is a cross-sectional view of the position of Cb indicated by the alternate long and short dash line in FIG. 5, that is, the boundary position of the extraction area C and the active area A. FIG. This portion is a portion where the second transparent extraction conductor 33 is extended to the active area A and connected to the bulging portion (second bulging electrode 31) of the active area A. The layer configuration at this portion is basically the same as that in FIG. 19C, which is a cross-sectional view of the second development process, in the inactive area B. The photosensitive layer 75 (photosensitive layer (electrode protective layer) 78) covers that portion. On the other hand, in the active area A, the second extraction conductor 53 is removed and only the second transparent extraction conductor 33 is left.
Thereby, the second transparent extraction conductor 33, the second extraction conductor 53, and the photosensitive layer (electrode protective layer) 78 are formed in this portion.
FIG. 20D is a cross-sectional view of the position of Db indicated by a one-dot chain line in FIG. A clear difference is recognized in the layer structure at this portion as compared with FIG. 19C which is a sectional view of the second developing step. That is, the patterned covered conductive layer 50 (covered conductive layer 51 on the second bulging electrode 31) is removed, and only the second bulging electrode 31 is left.
Thereby, the bulging part (second bulging electrode 31) of the active area A is formed in this part.

  The touch panel sensor 125 having the above-described configuration can be obtained as described above. The touch panel sensor 125 is bonded to the display device 131 via the adhesive layer 126, and the protective cover 123 is bonded to the touch panel sensor 125 via the adhesive layer 124, thereby being shown in FIGS. The input / output device 110 is obtained.

The manufacturing process of the touch panel sensor shown in FIG. 1 has been described above. Next, another example (second example) of the manufacturing process of the touch panel sensor will be described. Another example of the manufacturing process of the touch panel sensor is shown as a flowchart in FIG. In the manufacturing process of the touch panel sensor shown in FIG. 1, the terminal portion is covered with an electrode protective layer, and as it is, it cannot be used as a terminal electrode to connect an electric signal. In the manufacturing process of the touch panel sensor shown, the terminal portion is not covered with the electrode protective layer, and can be used as a terminal electrode as it is to connect an electric signal.
First, in step S101 (first photosensitive layer formation), the transparent base film 10, the transparent conductive layer 20 provided on the surface on one side of the base film, and the surface of the transparent conductive layer 20 A photosensitive layer 60 of a photosensitive etching resist is formed on the surface of the laminate having the coated conductive layer 40 provided on the side of the coated conductive layer 40. Since this step is the same as step S1 (photosensitive layer formation) described above, detailed description thereof is omitted.
Next, in step S102 (first exposure), the photosensitive layers 60 and 70 are exposed through the first photomask. Since this step is the same as step S2 (first exposure) described above, detailed description thereof is omitted.
Next, in step S103 (first development), the photosensitive layers 60 and 70 of the first exposed laminate are developed, and the photosensitive layers 60 and 70 are patterned. Since this step is the same as step S3 (first development) described above, detailed description thereof is omitted.
Next, in step S104 (first etching), the coated conductive layer 50 and the transparent conductive layer 30 are etched and coated using the photosensitive layer 70 of the first developed laminate patterned in the first development process as a first etching mask. The conductive layer 50 and the transparent conductive layer 30 are patterned. Since this process is the same as step S4 (first etching) described above, detailed description thereof is omitted.
Next, in S105 (photosensitive layer removal), the first photosensitive layer that has been patterned and remains on the coated conductive layer is removed. Since this step is the same as step S5 (photosensitive layer removal) described above, detailed description thereof is omitted.
Next, in S106 (second photosensitive layer formation), a second photosensitive layer of a photosensitive etching resist is formed on the surface on which the coated conductive layer and the transparent conductive layer of the laminate having the photosensitive layer removed are patterned. Since this step is the same as step S6 (second photosensitive layer formation) described above, detailed description thereof is omitted.

Next, in step S107 (second exposure), the second photosensitive layer 75 of the second photosensitive layer-formed laminate is exposed through a second photomask. The pattern of the second photomask transmits the exposure light to the second photosensitive layer 75 in the active area A, shields the exposure light from the second photosensitive layer 75 in the extraction area C of the inactive area B, The second exposure layer 75 in the terminal area D of the non-active area B has a pattern (half-exposure pattern) that transmits and partially blocks exposure light. As a photomask having such a semi-transmissive pattern, a mask obtained by adding a pattern made of a semi-transmissive thin film (chromium oxide or chromium nitride thin film) to a normal chrome mask can be used. What was formed so that it might become -70% can be used.
In the laminate having the second photosensitive layer formed, the surface is covered with the second photosensitive layer 75, but the transparent conductive material is below the second photosensitive layer 75, that is, between the second photosensitive layer 75 and the base film 10. There is a laminate pattern in which the body and the coated conductor are laminated. The surface of one side of the base film 10 has a pattern of the first transparent conductor 20 shown in FIG. 4, and the surface of the other side has a pattern of the second transparent conductor 30 shown in FIG. A pattern in which the pattern of the first transparent conductor 20 and the pattern of the second transparent conductor 30 are superimposed is shown in FIG.
FIGS. 15-17 are drawn corresponding to these FIGS. 4-6 (description figure of the 2nd etched laminated body mentioned later). The second photomask applied to the surface on one side of the base film 10 is at least the portion of the pattern indicated by the solid line in FIG. The portion of the pattern shown by the solid line in FIG. 15 is shielded at least, and the light of the exposure in the second exposure process is partially transmitted and shielded in the portion of the terminal conductor 44, and at least the portion shown by the broken line. The exposure light in the second exposure step is transmitted through the first bulging electrode 21 and the first connection electrode 22 in the active area A. The second photomask applied to the surface on the other side of the base film 10 is at least the portion of the pattern indicated by the solid line in FIG. The portion of the pattern shown in FIG. 16 that is shielded at least by light and is partially transmitted and shielded by the light in the second exposure step at the portion of the terminal conductor 54 at least, and at least the portion of the pattern shown by the broken line. The exposure light in the second exposure process is transmitted through the second bulging electrode 31 and the second connection electrode 32 in the active area A. FIG. 17 shows a superimposed pattern. Here, “the portion of the pattern indicated by the solid line and its surroundings” means “the portion in which the pattern indicated by the solid line is thickened (expanded)”. The reason for doing so is to completely cover the “53 portion of the extracted conductor” by completely covering the “portion of the pattern indicated by the solid line” with the second photosensitive layer 75, that is, the electrode protective layer.
In particular, in the non-active area B, when there is no portion excluding the second photosensitive layer (for example, register mark, product name, product number, etc.), the first photomask and the second photomask that perform such exposure are used. Transmits the exposure light to the second photosensitive layer 75 on the entire surface of the active area A, and shields the exposure light on the second photosensitive layer 75 on the entire surface of the extraction area C of the non-active area B. A photomask having a simple pattern in which the exposure light is partially transmitted and shielded to the second photosensitive layer 75 over the entire surface of the terminal area D of the inactive area B can be applied.

FIG. 22 shows a cross-sectional view (second exposure step) of the second photosensitive layer-formed laminate on which the second photomask 92 is placed at the positions Ab, Bb, Cb, and Db indicated by the one-dot chain line in FIG.
In FIG. 22, the second photomask 92 is a portion indicated by white, that is, a portion where the active area A transmits the exposure light, and a portion indicated by diagonal lines, ie, the portion of the terminal area D of the inactive area B is exposed. The portion shown in black, that is, the portion of the extraction area C of the inactive area B is a portion that shields the exposure light.
FIG. 22A is a cross-sectional view of the position Ab shown by the alternate long and short dash line in FIG. This portion is a portion where the second transparent terminal conductor 34 and the second terminal conductor 54 are formed.
FIG. 22B is a cross-sectional view of the position Bb indicated by the alternate long and short dash line in FIG. This portion is the portion where the second transparent extraction conductor 33, the second extraction conductor 53, and the photosensitive layer (electrode protective layer) 73 are formed.
FIG. 22C is a cross-sectional view of the position of Cb indicated by the alternate long and short dash line in FIG. 5, that is, the boundary position of the extraction area C and the active area A. This portion is a portion where the second transparent extraction conductor 33 is extended to the active area A and connected to the bulging portion (second bulging electrode 31) of the active area A.
FIG. 22D is a cross-sectional view of the position Db indicated by the alternate long and short dash line in FIG. This portion is a portion where the bulge portion (second bulge electrode 31) of the active area A is formed.

Next, in step S108 (second development), the second photosensitive layer 75 is developed, and the portion of the extracted conductor is left in the patterned photosensitive layer, the half of the terminal is left, and the portion of the touch sensor is removed. Further patterning is performed. That is, a developer suitable for development of the photosensitive layer 75 is prepared, and the photosensitive layer 75 is developed using this developer. As a result, the photosensitive layer at the site exposed to light in the second exposure step is removed, and the photosensitive layer at the site exposed to light half-exposure (half-exposed) in the second exposure step is removed. The photosensitive layer 75 that has undergone the second development process is shown in FIGS. 15 to 17 (corresponding to FIG. 5 is FIG. 16), the portion excluding the active area A indicated by the broken line, that is, the portion of the inactive area B itself. It basically has the same pattern.
FIG. 23 shows a layer configuration of the second developed laminated body patterned in the second development step as a cross-sectional view (second development step) at positions Ab, Bb, Cb, and Db indicated by alternate long and short dash lines in FIG.
FIG. 23A is a cross-sectional view of the position of Ab shown by the alternate long and short dash line in FIG. As compared with FIG. 12A, which is a cross-sectional view of the first etching process, the photosensitive layers 75 and 79 are thinner in the layer structure at this portion. The photosensitive layer 74 in this portion (portion area D portion) is controlled by a second photomask 92 that partially transmits and shields the exposure light, and is half-exposed, so that the photosensitive layer 70 is half in the second developing step. This is because it has been removed. The photosensitive layer 70, which is half left and has a small thickness, has a function as an etching resist.
FIG. 23B is a cross-sectional view of the position Bb shown by the alternate long and short dash line in FIG. After the second development step, as the second photosensitive layer 75, only the second photosensitive layer 78 corresponding to the black portion in FIG. 18B, that is, the portion where the exposure light is shielded is left. .
FIG. 23C is a cross-sectional view of the position of Cb indicated by the alternate long and short dash line in FIG. 5, that is, the boundary position of the extraction area C and the active area A. After the second development step, only the portion of the second photosensitive layer 78 corresponding to the portion shown in black in FIG. 18C, that is, the portion where the exposure light is shielded is left as the second photosensitive layer 75. ing.
FIG. 23D is a cross-sectional view of the position of Db indicated by the alternate long and short dash line in FIG. After the second development step, a clear difference is recognized as compared with FIG. 18 (D), and the photosensitive layer 75 is completely removed.

Next, in step S109 (second etching), the part of the touch sensor, that is, the covering conductive layer in the active area A is removed by etching using the patterned second photosensitive layer 75 as a second etching mask. In this second etching step, for example, when the coated conductive layer 50 is made of aluminum or molybdenum, phosphoric acid acetic acid (5: 5: 5: 1) containing phosphoric acid, nitric acid, acetic acid, and water is blended. Water) can be used as an etchant. Further, when the coated conductive layer 50 is made of silver, phosphoric acid acetic acid (water) obtained by blending phosphoric acid, nitric acid, acetic acid, and water in a ratio of 4: 1: 4: 4 can be used as an etching solution. . Furthermore, when the covering conductive layer 50 is made of chromium, an etching solution in which cerium ammonium nitrate, perchloric acid, and water are mixed at a ratio of 17: 4: 70 can be used.
In this second etching step, the covering conductive layer is removed from the pattern of the active area A, and the active area A transmits visible light. Further, the coating conductive layer is left in the pattern of the non-active area B, and good conductivity is still given.

FIG. 24 is a cross-sectional view after the second etching process of step S109, that is, a cross-sectional view (second etching) of the second etched laminated body at the positions of Ab, Bb, Cb, and Db indicated by alternate long and short dash lines in FIG. Shown in
FIG. 24A is a cross-sectional view of the position of Ab shown by the alternate long and short dash line in FIG. The layer structure at this portion is basically the same as FIG. 19A, which is a sectional view of the second developing step, except that the photosensitive layers 75 and 79 are thin. The photosensitive layer 75 (photosensitive layer (electrode protective layer) 79) covers that portion.
FIG. 24B is a cross-sectional view of the position Bb indicated by the alternate long and short dash line in FIG. The layer structure at this portion is basically the same as that in FIG. 19B, which is a cross-sectional view of the second development step. The photosensitive layer 75 (photosensitive layer (electrode protective layer) 78) covers that portion.
24C is a cross-sectional view of the position of Cb indicated by the alternate long and short dash line in FIG. 5, that is, the boundary position between the extraction area C and the active area A. FIG. This portion is a portion where the second transparent extraction conductor 33 is extended to the active area A and connected to the bulging portion (second bulging electrode 31) of the active area A. The layer configuration at this portion is basically the same as that in FIG. 19C, which is a cross-sectional view of the second development process, in the inactive area B. The photosensitive layer 75 (photosensitive layer (electrode protective layer) 78) covers that portion. On the other hand, in the active area A, the second extraction conductor 53 is removed and only the second transparent extraction conductor 33 is left.
FIG. 24D is a cross-sectional view of the position of Db indicated by the alternate long and short dash line in FIG. A clear difference is recognized in the layer structure at this portion as compared with FIG. 19C which is a sectional view of the second developing step. That is, the patterned covered conductive layer 50 (covered conductive layer 51 on the second bulging electrode 31) is removed, and only the second bulging electrode 31 is left.

Next, in step S110 (third development), the second photosensitive layer 75 patterned in the second development is further subjected to a third development, and a portion of the extraction conductor in the second photosensitive layer 75 patterned in the second development. The patterning is performed so as to leave the terminal portion and remove the portion of the terminal. That is, a developer suitable for the development of the second photosensitive layer 75 is prepared, and the second photosensitive layer 75 is developed using this developer. Thus, in the second exposure step, the second photomask 92 that partially transmits and shields the exposure light is controlled, and the half-exposed photosensitive layer is completely removed.
The layer structure of the third developed laminate patterned in the third development step is shown in FIG. 25 as a cross-sectional view (third development step) at the positions of Ab, Bb, Cb, and Db indicated by alternate long and short dash lines in FIG.
FIG. 25A is a cross-sectional view of the position Ab shown by the alternate long and short dash line in FIG. Compared with FIG. 24A, which is a cross-sectional view of the second etching process, the layer structure at this portion is such that the second transparent terminal conductor 34 and the second terminal conductor 54 remain, and the second photosensitive layers 75 and 79 are removed. Has been. Since the photosensitive layer 79 in this portion (portion area D portion) is half-exposed by the second photomask 92 that partially transmits and shields the exposure light, the second developing step and the third developing step are performed twice. This is because the photosensitive layer 70 is completely removed in the development process.
Thereby, the terminal part (the 2nd transparent terminal conductor 34, the 2nd terminal conductor 54) in a touch panel sensor was formed in this part. This terminal portion is not covered with an electrode protective layer, and can be used as a terminal electrode as it is to connect an electric signal.
FIG. 25B is a cross-sectional view of the position Bb indicated by the alternate long and short dash line in FIG. The layer structure at this portion is basically the same as FIG. 24B, which is a cross-sectional view of the second etching step.
Thereby, the extraction conductor portions (second transparent extraction conductor 33, second extraction conductor 53, and photosensitive layer (electrode protective layer) 73) in the touch panel sensor are formed in this portion. This extraction conductor is covered with an electrode protective layer. Therefore, it is possible to avoid the problem that the durability of the touch panel device is significantly impaired due to the corrosion of the portion of the extracted conductor.
FIG. 25C is a cross-sectional view of the position of Cb indicated by the alternate long and short dash line in FIG. 5, that is, the boundary position of the extraction area C and the active area A. This portion is a portion where the second transparent extraction conductor 33 is extended to the active area A and connected to the bulging portion (second bulging electrode 31) of the active area A. The layer structure at this portion is basically the same as FIG. 24C, which is a cross-sectional view of the second etching step.
Thereby, the second transparent extraction conductor 33, the second extraction conductor 53, and the photosensitive layer (electrode protective layer) 78 are formed in this portion.
FIG. 25D is a cross-sectional view of the position Db indicated by the alternate long and short dash line in FIG. The layer structure in this part is basically the same as FIG. 24D, which is a cross-sectional view of the second etching process.
Thereby, the bulging part (second bulging electrode 31) of the active area A is formed in this part.
The photosensitive layer (electrode protective layer) 78 may be post-baked and thermally cured as necessary.

  The touch panel sensor 125 having the above-described configuration can be obtained as described above. The touch panel sensor 125 is bonded to the display device 131 via the adhesive layer 126, and the protective cover 123 is bonded to the touch panel sensor 125 via the adhesive layer 124, thereby being shown in FIGS. The input / output device 110 is obtained.

Next, another example (third example) of the manufacturing process of the touch panel sensor will be described. Another example of the manufacturing process of the touch panel sensor is shown as a flowchart in FIG. In the manufacturing process of the touch panel sensor shown in FIG. 1, the terminal portion is covered with an electrode protective layer, and as it is, it cannot be used as a terminal electrode to connect an electrical signal. In the manufacturing process of the touch panel sensor shown, the terminal portion is not covered with the electrode protective layer, and can be used as a terminal electrode as it is to connect an electric signal. Further, in the manufacturing process shown in FIG. 28, the terminal portion is formed only of the transparent conductive layer and has a structure without the covering conductive layer. For this reason, the conductivity of the terminal portion is lowered, but the terminal portion is short as shown in FIG.
First, in step S201 (first photosensitive layer formation), the transparent base film 10, the transparent conductive layer 20 provided on the surface on one side of the base film, and the surface of the transparent conductive layer 20 A photosensitive layer 60 of a photosensitive etching resist is formed on the surface of the laminate having the coated conductive layer 40 provided on the side of the coated conductive layer 40. Since this step is the same as step S1 (photosensitive layer formation) described above, detailed description thereof is omitted.
Next, in step S202 (first exposure), the photosensitive layers 60 and 70 are exposed through the first photomask. Since this step is the same as step S2 (first exposure) described above, detailed description thereof is omitted.
Next, in step S203 (first development), the photosensitive layers 60 and 70 of the first exposed laminate are developed, and the photosensitive layers 60 and 70 are patterned. Since this step is the same as step S3 (first development) described above, detailed description thereof is omitted.
Next, in step S204 (first etching), the coated conductive layer 50 and the transparent conductive layer 30 are etched and coated using the photosensitive layer 70 of the first developed laminate patterned in the first development process as a first etching mask. The conductive layer 50 and the transparent conductive layer 30 are patterned. Since this process is the same as step S4 (first etching) described above, detailed description thereof is omitted.
Next, in S205 (photosensitive layer removal), the first photosensitive layer that has been patterned and remains on the coated conductive layer is removed. Since this step is the same as step S5 (photosensitive layer removal) described above, detailed description thereof is omitted.
Next, in S206 (second photosensitive layer formation), a second photosensitive layer of a photosensitive etching resist is formed on the surface on which the coated conductive layer and the transparent conductive layer of the laminate having the photosensitive layer removed are patterned. Since this step is the same as step S6 (second photosensitive layer formation) described above, detailed description thereof is omitted.

Next, in Step S207 (second exposure), the second photosensitive layer 75 of the second photosensitive layer-formed laminate is exposed through the second photomask 92. The pattern of the second photomask transmits exposure light to the second photosensitive layer 75 in the active area A and the second photosensitive layer 75 in the terminal area D in the inactive area B, and takes out the inactive area B. It is a pattern that shields exposure light from the second photosensitive layer 75 in area C.
In the laminate having the second photosensitive layer formed, the surface is covered with the second photosensitive layer 75, but the transparent conductive material is below the second photosensitive layer 75, that is, between the second photosensitive layer 75 and the base film 10. There is a laminate pattern in which the body and the coated conductor are laminated. The surface of one side of the base film 10 has a pattern of the first transparent conductor 20 shown in FIG. 4, and the surface of the other side has a pattern of the second transparent conductor 30 shown in FIG. A pattern in which the pattern of the first transparent conductor 20 and the pattern of the second transparent conductor 30 are superimposed is shown in FIG.
FIGS. 15-17 are drawn corresponding to these FIGS. 4-6 (description figure of the 2nd etched laminated body mentioned later). The second photomask applied to the surface on one side of the base film 10 is at least the portion of the pattern indicated by the solid line in FIG. The light is shielded, and at least the portion of the pattern indicated by the solid line in FIG. The exposure light in the second exposure step is transmitted through the output electrode 21 and the connecting electrode 22). The second photomask applied to the surface on the other side of the base film 10 is at least the portion of the pattern indicated by the solid line in FIG. The light is shielded, and at least the portion of the pattern indicated by the solid line in FIG. 16 and the portion of the terminal conductor 54 transmits the exposure light in the second exposure step, and at least the pattern indicated by the broken line (bulging electrode 31 and the connecting electrode 32) transmit the exposure light in the second exposure step. FIG. 17 shows a superimposed pattern. Here, “the portion of the pattern indicated by the solid line and its surroundings” means “the portion in which the pattern indicated by the solid line is thickened (expanded)”. The reason for doing so is to completely cover the “53 portion of the extracted conductor” by completely covering the “portion of the pattern indicated by the solid line” with the second photosensitive layer 75, that is, the electrode protective layer.
In particular, in the non-active area B, when there is no portion excluding the second photosensitive layer (for example, register mark, product name, product number, etc.), the first photomask and the second photomask that perform such exposure are used. Transmits the exposure light to the second photosensitive layer 75 on the entire surface of the active area A, and shields the exposure light on the second photosensitive layer 75 on the entire surface of the extraction area C of the non-active area B. A photomask having a simple pattern that transmits the exposure light to the second photosensitive layer 75 can be applied to the entire surface of the terminal area D of the inactive area B.

FIG. 29 shows a cross-sectional view (second exposure step) of the second photosensitive layer-formed laminate on which the second photomask 92 is placed at the positions Ab, Bb, Cb, and Db indicated by the alternate long and short dash line in FIG.
In FIG. 29, in the second photomask 92, the portion shown in white, that is, the portion of the terminal area D of the active area A and the inactive area B is a portion that transmits the exposure light, and the portion shown in black, ie, non-shown A portion of the extraction area C of the active area B is a portion that blocks exposure light.
FIG. 29A is a cross-sectional view of the position Ab shown by the alternate long and short dash line in FIG. This portion is a portion where the second transparent terminal conductor 34 is formed.
FIG. 29B is a cross-sectional view of the position Bb shown by the alternate long and short dash line in FIG. This portion is the portion where the second transparent extraction conductor 33, the second extraction conductor 53, and the photosensitive layer (electrode protective layer) 73 are formed.
FIG. 29C is a cross-sectional view of the position of Cb indicated by the alternate long and short dash line in FIG. This portion is a portion where the second transparent extraction conductor 33 is extended to the active area A and connected to the bulging portion (second bulging electrode 31) of the active area A.
FIG. 29D is a cross-sectional view of the position Db indicated by the alternate long and short dash line in FIG. This portion is a portion where the bulge portion (second bulge electrode 31) of the active area A is formed.

Next, in step S208 (second development), the second photosensitive layer 75 is developed so that the portion of the extracted conductor in the patterned photosensitive layer remains, and the portion of the terminal and the portion of the touch sensor are removed. Further patterning is performed. That is, a developer suitable for development of the photosensitive layer 75 is prepared, and the photosensitive layer 75 is developed using this developer. Thereby, the photosensitive layer of the site | part exposed to light in a 2nd exposure process is removed. The photosensitive layer 75 having undergone the second development step is a portion excluding the terminal area D in the region of the non-active area B indicated by the solid line in FIGS. 15 to 17 (FIG. 16 corresponds to FIG. 5), that is, the non-photosensitive layer 75. The pattern of the extraction conductor in the extraction area B of the active area B has basically the same pattern.
FIG. 30 shows a layer structure of the second developed laminated body patterned in the second development process as a cross-sectional view (second development process) at positions Ab, Bb, Cb, and Db indicated by alternate long and short dashed lines in FIG.
FIG. 30A is a cross-sectional view of the position Ab shown by the alternate long and short dash line in FIG. The layer structure at this portion is such that the photosensitive layers 75 and 79 are removed as compared with FIG. 12A, which is a sectional view of the first etching step. This is because the photosensitive layer 74 in this portion (terminal area D portion) is controlled and exposed by the second photomask 92 that transmits the exposure light, and thus the photosensitive layer 70 is removed in the second development step.
FIG. 30B is a cross-sectional view of the position Bb indicated by the alternate long and short dash line in FIG. After the second development step, as the second photosensitive layer 75, only the second photosensitive layer 78 corresponding to the black portion in FIG. 29B, that is, the portion where the exposure light is shielded is left. .
FIG. 30C is a cross-sectional view of the position of Cb indicated by the alternate long and short dash line in FIG. 5, that is, the boundary position of the extraction area C and the active area A. After the second development step, as the second photosensitive layer 75, only the portion of the second photosensitive layer 78 corresponding to the black portion in FIG. 29C, that is, the portion where the exposure light is shielded is left. ing.
FIG. 30D is a cross-sectional view of the position of Db indicated by the alternate long and short dash line in FIG. 5, that is, the active area A. After the second development step, a clear difference is recognized as compared with FIG. 29 (D), and the photosensitive layer 75 is completely removed.

Next, in step S209 (second etching), the patterned second photosensitive layer 75 is used as a second etching mask to cover the conductive areas of the touch sensor portion, that is, the active area A and the terminal area D portion of the inactive area B. The layer is etched away. In this second etching step, for example, when the coated conductive layer 50 is made of aluminum or molybdenum, phosphoric acid acetic acid (5: 5: 5: 1) containing phosphoric acid, nitric acid, acetic acid, and water is blended. Water) can be used as an etchant. Further, when the coated conductive layer 50 is made of silver, phosphoric acid acetic acid (water) obtained by blending phosphoric acid, nitric acid, acetic acid, and water in a ratio of 4: 1: 4: 4 can be used as an etching solution. . Furthermore, when the covering conductive layer 50 is made of chromium, an etching solution in which cerium ammonium nitrate, perchloric acid, and water are mixed at a ratio of 17: 4: 70 can be used.
In this second etching step, the covering conductive layer is removed from the pattern of the terminal area D of the active area A and the non-active area B, so that the active area A transmits visible light. Moreover, the coating conductive layer is left in the pattern of the extraction area C in the non-active area B, and good conductivity is still given.

FIG. 31 is a cross-sectional view after the second etching step in step S209, that is, a cross-sectional view (second etching) of the second etched laminated relative body at the positions of Ab, Bb, Cb, and Db indicated by a one-dot chain line in FIG. Shown in
FIG. 31A is a cross-sectional view of the position of Ab shown by the alternate long and short dash line in FIG. The layer structure in this part is different from FIG. 30A which is a cross-sectional view of the second developing process, and only the transparent terminal conductor 34 is formed.
FIG. 31B is a cross-sectional view of the position Bb indicated by the alternate long and short dash line in FIG. The layer structure at this portion is basically the same as that in FIG. 30B, which is a cross-sectional view of the second development step. The photosensitive layer 75 (photosensitive layer (electrode protective layer) 78) covers that portion.
FIG. 31C is a cross-sectional view of the position of Cb indicated by the alternate long and short dash line in FIG. 5, that is, the boundary position of the extraction area C and the active area A. This portion is a portion where the second transparent extraction conductor 33 is extended to the active area A and connected to the bulging portion (second bulging electrode 31) of the active area A. The layer configuration at this portion is basically the same as that in FIG. 30C, which is a cross-sectional view of the second development process, in the inactive area B. The photosensitive layer 75 (photosensitive layer (electrode protective layer) 78) covers that portion. On the other hand, in the active area A, the second extraction conductor 53 is removed and only the second transparent extraction conductor 33 is left.
FIG. 31D is a cross-sectional view of the position of Db indicated by the alternate long and short dash line in FIG. 5, that is, the active area A. A clear difference is recognized in the layer structure at this portion as compared with FIG. 30C which is a sectional view of the second developing step. That is, the patterned covered conductive layer 50 (covered conductive layer 51 on the second bulging electrode 31) is removed, and only the second bulging electrode 31 is left.
The photosensitive layer (electrode protective layer) 78 may be post-baked and thermally cured as necessary.

  The touch panel sensor 125 having the above-described configuration can be obtained as described above. The touch panel sensor 125 is bonded to the display device 131 via the adhesive layer 126, and the protective cover 123 is bonded to the touch panel sensor 125 via the adhesive layer 124, thereby being shown in FIGS. The input / output device 110 is obtained.

  According to the touch panel sensor manufacturing method and the touch panel sensor of the present invention as described above, it is possible to improve the process of forming a protective layer that protects the portion of the extracted conductor from corrosion, leakage, and the like. Conventionally, a protective layer is formed by taking out an insulating paint and coating it on a conductor portion and its peripheral portion (base material, etc.). Since the protective layer is used, the same quality process and the same material are sufficient, so many problems in manufacturing and quality are solved, and the freedom of process design and product design is greatly increased. By providing this protective layer, the conductivity decreases as the corrosion progresses from the surface to the inside of the metal material used for the extraction conductor, and eventually the necessary conductivity is lost. It is possible to solve the problem that the function is stopped and becomes unusable. Also, the portion of the extraction conductor is a wiring pattern in which a large number of linear extraction conductors are parallel and approach in a general touch panel sensor. The problem of being inoperable can be solved.

DESCRIPTION OF SYMBOLS 10 Base film 20 1st transparent conductor, 1st transparent conductive layer 21 1st bulging electrode 22 1st connection electrode 23 1st transparent extraction conductor 24 1st transparent terminal conductor 30 2nd transparent conductor, 2nd Transparent conductive layer 31 2nd bulging electrode 32 2nd connection electrode 33 2nd transparent extraction conductor 34 2nd transparent terminal conductor 40 1st covering conductor, 1st covering conductive layer 43 1st extraction conductor 44 1st terminal Conductor 50 Second coated conductor, second coated conductive layer 53 Second extraction conductor 54 Second terminal conductor 60 Photosensitive layer 70-74 Photosensitive layer, first photosensitive layer 75-79 Photosensitive layer, second photosensitive layer 80 , 90 First photomask 91, 92 Second photomask 110 Touch panel display (input / output device)
120 Touch Panel Device 121 Input Unit 122 Circuit Unit 123 Protective Cover 124 Adhesive Layer 125 Touch Panel Sensor 126 Adhesive Layer 130 Liquid Crystal Display Device, Display Device 131 Display Unit 132 Display Control Unit

Claims (6)

The covering of the laminate having a transparent base film, a transparent conductive layer provided on one surface of the base film, and a coated conductive layer provided on the surface of the transparent conductive layer A first photosensitive layer forming step of forming a photosensitive layer of a photosensitive etching resist on the surface on the conductive layer side;
A first exposure step of exposing the photosensitive layer through a first photomask;
A first developing step of developing the photosensitive layer and patterning the photosensitive layer;
A first etching step of patterning the coated conductive layer and the transparent conductive layer by etching the coated conductive layer and the transparent conductive layer using the photosensitive layer patterned in the first development step as an etching mask;
A photosensitive layer removing step of removing the photosensitive layer;
A second photosensitive layer forming step of forming a photosensitive layer of a photosensitive etching resist on the surface of the laminate on which the covering conductive layer and the transparent conductive layer are patterned;
A second exposure step of exposing the photosensitive layer through a second photomask;
A second developing step of developing the photosensitive layer and patterning so that at least a portion of the extraction conductor and its periphery are left in the photosensitive layer and a portion of the active area is removed;
A second etching step in which the coated conductive layer in the active area is etched away using the photosensitive layer patterned in the second development step as a second etching mask; and
A method for manufacturing a touch panel sensor, comprising: 2. The touch panel sensor manufacturing method according to claim 1, wherein the second exposure step and the second development step include a portion of the extraction conductor, a portion of the transparent conductive layer in the vicinity thereof, and the base in the vicinity thereof. A method for manufacturing a touch panel sensor, comprising the step of leaving the photosensitive layer in all of the parts of the material film. In the manufacturing method of the touch panel sensor according to claim 1 or 2, as a post process of said 2nd etching process,
A third exposure step of exposing the photosensitive layer through a third photomask;
A third developing step of patterning the photosensitive layer by third development so that a portion of the terminal in the photosensitive layer is removed;
A method for manufacturing a touch panel sensor, comprising: The covering of the laminate having a transparent base film, a transparent conductive layer provided on one surface of the base film, and a coated conductive layer provided on the surface of the transparent conductive layer A first photosensitive layer forming step of forming a photosensitive layer of a photosensitive etching resist on the surface on the conductive layer side;
A first exposure step of exposing the photosensitive layer through a first photomask;
A first developing step of developing the photosensitive layer and patterning the photosensitive layer;
A first etching step of patterning the coated conductive layer and the transparent conductive layer by etching the coated conductive layer and the transparent conductive layer using the photosensitive layer patterned in the first development step as an etching mask;
A photosensitive layer removing step of removing the photosensitive layer;
A second photosensitive layer forming step of forming a photosensitive layer of a photosensitive etching resist on the surface of the laminate on which the covering conductive layer and the transparent conductive layer are patterned;
A second exposure step of exposing the photosensitive layer through a second photomask;
A second developing step of developing the photosensitive layer and patterning so that at least a portion of the extraction conductor and its periphery are left in the photosensitive layer and a portion of the terminal is left and a portion of the active area is removed;
A second etching step in which the coated conductive layer in the active area is etched away using the photosensitive layer patterned in the second development step as a second etching mask; and
A third development step of patterning the third development of the photosensitive layer so as to leave a portion of the extraction conductor in the photosensitive layer and remove a portion of the terminal;
A method for manufacturing a touch panel sensor, comprising: The covering of the laminate having a transparent base film, a transparent conductive layer provided on one surface of the base film, and a coated conductive layer provided on the surface of the transparent conductive layer A first photosensitive layer forming step of forming a photosensitive layer of a photosensitive etching resist on the surface on the conductive layer side;
A first exposure step of exposing the photosensitive layer through a first photomask;
A first developing step of developing the photosensitive layer and patterning the photosensitive layer;
A first etching step of patterning the coated conductive layer and the transparent conductive layer by etching the coated conductive layer and the transparent conductive layer using the photosensitive layer patterned in the first development step as an etching mask;
A photosensitive layer removing step of removing the photosensitive layer;
A second photosensitive layer forming step of forming a photosensitive layer of a photosensitive etching resist on the surface of the laminate on which the covering conductive layer and the transparent conductive layer are patterned;
A second exposure step of exposing the photosensitive layer through a second photomask;
A second developing step of developing the photosensitive layer and patterning so that at least a portion of the extraction conductor and its periphery are left in the photosensitive layer, and a portion of the active area and a portion of the terminal are removed;
A second etching step in which the coated conductive layer in the active area is etched away using the photosensitive layer patterned in the second development step as a second etching mask; and
A method for manufacturing a touch panel sensor, comprising: A touch panel sensor having a transparent base film, a transparent conductive layer provided on one surface of the base film, and a coated conductive layer provided on the surface of the transparent conductive layer,
The transparent conductive layer is patterned so that a terminal portion, a lead conductor portion, and an active area portion remain,
The coated conductive layer is patterned so that a portion of the terminal and a portion of the extraction conductor are left and a portion of the active area is removed,
At least the portion of the terminal is not covered with the photosensitive layer, and at least the portion of the extraction conductor and its periphery are covered with a photosensitive layer.
A touch panel sensor characterized by that.

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