JP2011155537A - Electric wiring substrate and optical print head - Google Patents

Electric wiring substrate and optical print head Download PDF

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Publication number
JP2011155537A
JP2011155537A JP2010016216A JP2010016216A JP2011155537A JP 2011155537 A JP2011155537 A JP 2011155537A JP 2010016216 A JP2010016216 A JP 2010016216A JP 2010016216 A JP2010016216 A JP 2010016216A JP 2011155537 A JP2011155537 A JP 2011155537A
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JP
Japan
Prior art keywords
substrate
upper surface
wiring board
provided
plurality
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010016216A
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Japanese (ja)
Inventor
Hironori Yoshii
浩紀 喜井
Original Assignee
Kyocera Corp
京セラ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Kyocera Corp, 京セラ株式会社 filed Critical Kyocera Corp
Priority to JP2010016216A priority Critical patent/JP2011155537A/en
Publication of JP2011155537A publication Critical patent/JP2011155537A/en
Application status is Pending legal-status Critical

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Abstract

<P>PROBLEM TO BE SOLVED: To provide an electric wiring substrate having strong adhesion between a bonding wire and a bonding pad. <P>SOLUTION: The electric wiring substrate includes a first substrate, an adhesive layer provided on the upper surface of the first substrate, and a second substrate having the lower surface adhered with the adhesive layer and the upper surface provided with an electrode pad where a plurality of irregularities are provided on the upper surface of the first substrate or the lower surface of the second substrate, and the electrode pad is located above the projecting part of the irregularities. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an electric wiring board and an optical print head used as exposure means for an electrophotographic printer or the like.

  An optical print head used as an exposure means for an electrophotographic printer has, for example, a structure in which a plurality of light emitting element arrays are mounted on an upper surface of a printed wiring board on which a predetermined pattern of wiring conductor is attached. Yes. A predetermined electric power is applied to each light emitting element of these light emitting element arrays based on an external print signal, and the light emitting elements are selectively made to emit light individually. The emitted light is irradiated onto an external photosensitive drum through a lens to form a predetermined latent image on the surface of the photosensitive drum, which is developed and transferred to a sheet or the like.

  For example, as shown in Patent Document 1, an optical print head is manufactured by bonding a light emitting element array and a printed wiring board with an adhesive.

JP 2007-268875 A

  In order to electrically connect with other members, a bonding pad is formed in the light emitting element array, and a bonding wire is bonded to the bonding pad.

  However, when bonding, the force applied to the wire is absorbed by the adhesive, so that the bonding force escapes and the bonding force between the bonding wire and the bonding pad becomes weak.

  The present invention has been made in view of such a new problem, and an object of the present invention is to provide an electric wiring board and an optical print head having a strong adhesive force between a bonding wire and a bonding pad.

  An electrical wiring board according to an embodiment of the present invention includes a first substrate, an adhesive layer provided on the upper surface of the first substrate, the adhesive layer and the lower surface bonded, and an electrode pad on the upper surface. A plurality of irregularities are provided on the upper surface of the first substrate or the lower surface of the second substrate, and the electrode pads are located above the convex portions of the irregularities. .

  Preferably, the top surfaces of the plurality of convex portions are provided on the same plane as the upper surface of the first substrate or the lower surface of the second substrate, and the plurality of concave portions are grooves.

  When viewed from above, the outer shape of the convex portion is preferably larger than the outer shape of the electrode pad.

  It is preferable that a plurality of the electrode pads are arranged in a line on the upper surface of the second substrate.

  An optical print head according to an embodiment of the present invention includes the electrical wiring substrate and a plurality of light emitting elements provided on the upper surface of the second substrate.

  According to this embodiment, a plurality of irregularities are provided on the upper surface of the first substrate or the lower surface of the second substrate, and the electrode pad is positioned above the convex portions of the concave and convex portions so that the adhesive enters the concave portions. The adhesive force between the first substrate and the second substrate is improved, and a sufficient adhesive force can be obtained even if the distance between the first substrate and the second substrate immediately below the electrode pad is reduced. Become. As a result, the force during bonding wire bonding is difficult to escape and the force can be transmitted efficiently.

It is a typical top view of the optical print head of one embodiment of the present invention. It is sectional drawing which cut | disconnected the optical print head in FIG. 1 by X-X '. It is sectional drawing of the optical print head of other embodiment. It is sectional drawing of the optical print head of other embodiment. (A) And (b) is sectional drawing which showed the preparation methods of the optical print head which is one Embodiment of this invention for every process. FIG. 3 is an enlarged sectional view of the optical print head of FIG. 2 in an enlarged manner.

  Hereinafter, modes for carrying out the present invention will be described.

  An electrical wiring board according to an embodiment of the present invention includes a first substrate 1, a second substrate 2, and an adhesive layer. Wires 6 are bonded to the connection pads 5 provided on the second substrate 2.

  An electric wiring board according to an embodiment of the present invention is shown in a top view in FIG. 1 and a sectional view in FIG. 1 and 2, an optical print head is shown as an example of the electrical wiring board. In addition, a printed wiring board is shown as the first substrate 1, and a semiconductor substrate forming a light emitting element array provided with a plurality of light emitting elements 3 is shown as an example of the second substrate 2.

  As shown in FIG. 1, a plurality of irregularities (concave part 4 and convex part 7) are provided on the upper surface of the first substrate 1. The second substrate 2 is provided with connection pads 5 on the upper surface thereof.

  In this electrical wiring board, the position of the connection pad 5 is provided above the convex portion 7. And between each connection pad 5, it is provided above the recessed part 4. FIG.

  3 and 4 are sectional views of an electric wiring board according to another embodiment of the present invention. In FIG. 3, a plurality of irregularities (concave part 4 and convex part 7) are provided on the surface of the second substrate 2. The position of the connection pad 5 is provided above the convex portion 7. In FIG. 4, a plurality of irregularities (concave part 4 and convex part 7) are provided on the surfaces of the first substrate 1 and the second substrate 2, and the position of the connection pad 5 is provided above the convex part 7. In the case of FIG. 4, the unevenness on the first substrate 1 and the unevenness on the second substrate 2 are the same. “Upper” means the upper side with respect to the electric wiring board, that is, the second board side.

  FIG. 5 shows a method for manufacturing an electrical wiring board (FIGS. 1 and 2) according to an embodiment of the present invention.

First, the adhesive 9 is provided on the upper surface of the first substrate 1 (FIG. 5A). The adhesive 9 is provided on the concave portion 4 and the convex portion 7 provided on the main surface of the first substrate 1. In addition, the recessed part 4 is provided as a groove | channel (it describes with a dotted line in FIG. 1). Further, the convex portion 7 is provided so that the top surface 7 a thereof is flush with the upper surface of the first substrate 1. Furthermore, the outer shape of the top surface 7a of the convex portion 7 is
It is larger than the outer shape of the bottom surface 5a of the electrode pad. Note that the outer shape of the top surface 7 of the convex portion 7 is a portion surrounded by a ridge line formed by the top surface 7a and the side surface of the convex portion 7, and the outer shape of the bottom surface 5a of the electrode pad is the side surface of the bottom surface 5a of the electrode pad. This is the area surrounded by the ridgeline.

  By satisfying each of these configurations, the effects of the present invention can be sufficiently achieved.

  Examples of the method for providing the adhesive 9 include a printing technique and a coating method using a dispenser.

  Next, a 2nd board | substrate is adhere | attached with respect to the 1st board | substrate 1 which provided the adhesive agent 9 on the upper surface (FIG.3 (b)). When bonding the first substrate 1 and the second substrate 2, the connection pad 5 is positioned above the convex portion 7. As a specific bonding method, the second substrate 2 is bonded to the first substrate 1 by thermosetting the resin in the adhesive 9 in a state where the second substrate 2 is pressed to the first substrate 1 side. Attach to the top.

  And after attaching the 1st board | substrate 1 and the 2nd board | substrate 2, the wire 6 is bonded on the electrode pad 5, and the optical print head shown in FIG. 1 and 2 is produced.

  The bonding of the wire onto the electrode pad 5 is performed by pressing the wire 6 against the electrode pad 5 using a capillary, for example.

  Usually, when the adhesive layer 8 is provided on the first substrate 1 without providing the recess 4, it is necessary to increase the thickness of the adhesive layer 8 in order to perform sufficient adhesion.

  However, in the present invention, the adhesive layer 8 is filled in the concave portion 4, so that the adhesive force between the first substrate 1 and the second substrate 2 by the adhesive layer 8 is improved, and the region immediately below the electrode pad 5 is improved. Even if the distance between the first substrate 1 and the second substrate 2 is reduced to 1 to 5 μm, a sufficient adhesive force can be obtained. As a result, when the wire 6 is bonded to the electrode pad 5, the force applied to the electrode pad 5 at the time of bonding is difficult to escape and the force is transmitted efficiently, and the bonding force between the bonding wire 6 and the electrode pad 5 is improved. .

  Moreover, the electrical wiring board of one embodiment of the present invention can solve not only the above effects but also the following problems.

For example, when a light-emitting layer of a light-emitting element is formed by stacking a semiconductor layer such as Al X Ga 1-X As on a substrate such as a GaAs crystal used as the second substrate 2, the main peak light from the light-emitting layer Sub-peak light is generated in a wavelength band different from the first wavelength, and this sub-peak light is transmitted through the second substrate 2 and reflected by the first substrate 1. In particular, this behavior occurs between the electrode pads 5.

  However, since the electrical wiring board obtained by one embodiment of the present invention is provided with the recesses 4 below the electrode pads 5 and the adhesive layer 8 in the recesses 4, the adhesive layer 8 is sub-peak light. Can be absorbed and light emission to the outside due to the sub-peak light can be suppressed.

  The adhesive layer 8 not only bonds the first substrate 1 and the second substrate 2 but also emits from the second substrate 2 excited by receiving light from the outside (for example, light from the light emitting element 3). It plays the role of absorbing the light that is emitted. Specific examples of the adhesive layer 8 include liquid resins such as epoxy resins.

Further, when bonding the wire 6 to the electrode pad 5, as shown in FIG. 6, most of the force is transmitted to the top surface of the convex portion 7 as shown by the solid arrow, but as shown by the dotted arrow. There is also a force applied to the recess 4. As shown in FIG. 4, the bonded force flows into the adhesive layer 8 in the recess 4. Since the inflowing force acts in the lateral direction so as to push the inner wall of the recess 4, the adhesive layer 8 is difficult to come off from the recess 4. Furthermore, since the adhesive area between the adhesive layer 8 and the first substrate 1 is also large, the adhesive strength between the first substrate 1 and the second substrate 2 is improved by these factors.

  In addition, when the second substrate 2 is a semiconductor substrate, the first substrate 1 is a printed wiring board, and a plurality of light emitting element arrays are provided on the printed wiring board, it is usually not used for bonding, and an excessive bonding Conventionally, there has been a problem that the agent is ejected from the joint between the light emitting element arrays due to a capillary phenomenon or the like. It is hard to generate and the above-mentioned problem is hard to occur.

  Each configuration is shown below.

(First substrate 1)
As the first substrate 1, a printed wiring board is provided as described above. The printed wiring board may be made of any material, but is preferably made of an electrically insulating material such as glass epoxy resin. The upper surface of the first substrate 1 supports a second substrate 2 provided with a plurality of wiring conductors and a plurality of light emitting elements.

  The recess 4 in the first substrate 1 has a groove shape. For example, when the size of the printed wiring board which is the first substrate 1 is 5 to 20 mm in length, 300 to 500 mm in width, and 0.5 to 2.0 mm in height, the depth of the groove-like recess 4 is 10 to 50 μm. The width is 10 to 50 μm and the length is 200 to 1000 μm. The concave portion 4 is specifically provided by simultaneously producing the via hole and pattern of the substrate in the same process. Moreover, although the cross-sectional shape of the recessed part 4 is a rectangular shape, an elliptical shape etc. are mentioned to others.

(Second substrate)
Examples of the second substrate 2 include a compound semiconductor substrate 2 such as GaAs, InP, and GaN. These are direct transition type compound semiconductors that absorb light of a specific wavelength and are excited to emit light on the long wavelength side.

For example, when GaAs is used as the second substrate 2 and AlGaAs (for example, Al 0.15 Ga 0.85 As) is used as the light emitting element 3, the light emitting element 3 emits light having an absorption maximum of about 770 nm. However, GaAs on the second substrate 2 is excited by absorbing this light emission, and emits light of about 860 nm as a sub-peak.

(Light emitting element 3)
The light emitting element 3 includes a p-type semiconductor layer and an n-type semiconductor layer, and these semiconductor layers are formed of, for example, a GaAs compound.

In addition to the p-type semiconductor layer and the n-type semiconductor layer, a nitride semiconductor can also be used. Here, the nitride semiconductor means, for example, a semiconductor composed of a nitride of a group IIIB (group 13) element in the periodic table. The group IIIB nitride semiconductor can be represented by the chemical formula Al x Ga y In (1-xy) N (0 ≦ x ≦ 1, 0 ≦ y ≦ 1, x + y ≦ 1). Examples of the group IIIB nitride semiconductor include gallium nitride (GaN), aluminum nitride (AlN), indium nitride (InN), and the like.

The light emitting element 3 has a thickness of about 3 to 5 μm, the p-type semiconductor layer has a thickness of about 1 to 3 μm, and the n-type semiconductor layer has a thickness of about 1 to 3 μm.

  In addition, although LED is used as a specific example as the light emitting element 3, it goes without saying that a light emitting thyristor can be used as the light emitting element 3, for example.

  Further, the light emitting element 3 can correspond to any resolution of 600 dpi or 1200 dpi.

The light emitting element 3 can be manufactured by, for example, a well-known semiconductor manufacturing technique. Specifically, for example, when manufacturing a GaAs-based light-emitting element 3, first, the second substrate 2, which is a compound semiconductor substrate made of AlGaAs, is heated to a high temperature in a furnace, and AsH 3 , Ga, and Al are appropriately added. An n-type semiconductor AlGaAs single crystal is grown on the surface of the second substrate 2 in contact with the contained gas. Subsequently, a SiN windowed film is deposited on the surface of the n-type semiconductor AlGaAs single crystal and Zn gas is exposed to the window to diffuse Zn into a part of the n-type semiconductor AlGaAs single crystal. A pn junction is formed by forming a type semiconductor.

  The obtained print head which is one embodiment of the present invention is used in an image forming apparatus. The image forming apparatus includes not only an optical print head but also an electrophotographic photosensitive member, a developer supply unit, a transfer unit, and a fixing unit.

  The developer supply means supplies the developer to the electrophotographic photosensitive member. The electrophotographic photosensitive member is included in a cylindrical photosensitive member and is formed as the surface of the outer surface of the photosensitive drum. The electrophotographic photosensitive member is irradiated with light emitted from the light emitting element. The transfer unit transfers the image to the recording sheet. The image transferred to the recording sheet is formed on the electrophotographic photosensitive member with a developer. The fixing unit fixes the developer transferred to the recording sheet.

  Each embodiment mentioned above is illustrated in order to embody the technology concerning the present invention, does not limit the technical scope of the present invention, and the technical contents concerning the present invention are claimed. Various modifications can be made within the technical scope described in the above.

  Not only the combination of the parts specifically described in each embodiment, but also the embodiments can be partially combined as long as the combination does not hinder.

DESCRIPTION OF SYMBOLS 1 1st board | substrate 2 2nd board | substrate 3 Light emitting element 4 Concave part 5 Electrode pad 6 Bonding wire 7 Convex part 8 Adhesive layer 9 Adhesive

Claims (5)

  1. A first substrate;
    An adhesive layer provided on the upper surface of the first substrate;
    A second substrate having the adhesive layer and the lower surface bonded to each other and having an electrode pad on the upper surface;
    An electrical wiring board comprising:
    A plurality of irregularities are provided on the upper surface of the first substrate or the lower surface of the second substrate,
    An electrical wiring board in which the electrode pad is located above the uneven convex part.
  2. The top surfaces of the plurality of convex portions are provided on the same plane as the upper surface of the first substrate or the lower surface of the second substrate,
    The electrical wiring board according to claim 1, wherein each of the plurality of recesses is a groove.
  3. When seen through from above
    The electrical wiring board according to claim 2, wherein an outer shape of the top surface of the convex portion is larger than an outer shape of an upper surface of the electrode pad.
  4.   The electrical wiring board according to claim 1, wherein a plurality of the electrode pads are arranged in a line on the upper surface of the second substrate.
  5. An electrical wiring board according to any one of claims 1 to 4,
    A plurality of light emitting elements provided on the upper surface of the second substrate;
    An optical print head comprising:
JP2010016216A 2010-01-28 2010-01-28 Electric wiring substrate and optical print head Pending JP2011155537A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010016216A JP2011155537A (en) 2010-01-28 2010-01-28 Electric wiring substrate and optical print head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010016216A JP2011155537A (en) 2010-01-28 2010-01-28 Electric wiring substrate and optical print head

Publications (1)

Publication Number Publication Date
JP2011155537A true JP2011155537A (en) 2011-08-11

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010016216A Pending JP2011155537A (en) 2010-01-28 2010-01-28 Electric wiring substrate and optical print head

Country Status (1)

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JP (1) JP2011155537A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015518259A (en) * 2012-05-31 2015-06-25 京東方科技集團股▲ふん▼有限公司 Surface light source device and sidelight type backlight module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015518259A (en) * 2012-05-31 2015-06-25 京東方科技集團股▲ふん▼有限公司 Surface light source device and sidelight type backlight module

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