JP2011108865A - Optical module and droplet curing device - Google Patents

Optical module and droplet curing device Download PDF

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Publication number
JP2011108865A
JP2011108865A JP2009262666A JP2009262666A JP2011108865A JP 2011108865 A JP2011108865 A JP 2011108865A JP 2009262666 A JP2009262666 A JP 2009262666A JP 2009262666 A JP2009262666 A JP 2009262666A JP 2011108865 A JP2011108865 A JP 2011108865A
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light
material
provided
light transmissive
transmissive material
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JP2009262666A
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JP5473553B2 (en
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Yasuhiko Shigeta
泰彦 重田
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Kyocera Corp
京セラ株式会社
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161Disposition
    • H01L2224/16151Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Abstract

PROBLEM TO BE SOLVED: To provide an optical module and a droplet effect device having a small luminance distribution.
A light-emitting element array 10 which is an example of an optical module of the present invention is disposed on a support base 20 having a recess 20a, a light-emitting element 30 provided in the recess 20a, and the light-emitting element 30. The first light-transmitting material 41 that transmits light emitted from the light-emitting element 30 and the second light-transmitting material 42 that covers the first light-transmitting material 41 and the light-emitting element 30 are provided.
[Selection] Figure 2

Description

  The present invention relates to an optical module and a droplet curing device.

  Currently, there are image apparatuses such as image printing apparatuses such as facsimiles and image display apparatuses such as liquid crystal displays and electric light displays. These images are formed by arranging small pixels of different shades and colors in a matrix. However, when the optical elements to be pixels are arranged in a wide area, the light intensity is different between the central portion where light is irradiated around and the peripheral portion where light is not irradiated from the periphery.

  Therefore, there is a technique for making the luminance distribution uniform by adjusting the energization time of the current flowing through the plurality of optical elements. A technique for adjusting the luminance distribution based on the energization time as described above is described in Patent Document 1, for example.

Japanese Patent Laid-Open No. 03-69991

  However, if the luminance distribution of a plurality of optical elements is to be controlled only by the energization time, the circuit configuration becomes complicated.

  The present invention has been conceived under the above circumstances, and an object thereof is to provide an optical module and a droplet effect device having a small luminance distribution.

  The optical module of the present invention irradiates a support substrate having a recess, an optical element provided in the recess, light emitted from the optical element, or the optical element disposed on the optical element. A first translucent material that transmits light; and a second translucent material that covers the first translucent material and the optical element.

  The droplet effect device of the present invention includes the optical module of the present invention.

  According to the present invention, it is possible to provide an optical module and a droplet effect device having a small luminance distribution.

It is a top view which shows schematic structure of the light irradiation head which is an example of embodiment of the optical module of this invention. It is sectional drawing along the II-II line | wire shown in FIG. It is a top view of the support base | substrate and light emitting element which comprise the light irradiation head shown in FIG. It is a top view which shows schematic structure of the light irradiation head which is another example of embodiment of the optical module of this invention. It is sectional drawing along the VV line shown in FIG. FIG. 5 is a cross-sectional perspective view taken along line VI-VI, showing a support base and a light emitting element that constitute the light irradiation head shown in FIG. 4. 1 is a schematic top view illustrating an ink jet printer that is an example of a droplet curing apparatus of the present invention. It is a schematic sectional drawing of the ink jet printer shown in FIG.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The following embodiments are illustrative, and the present invention is not limited to these embodiments.

<First form of optical module>
The light irradiation head 10 shown in FIGS. 1 to 3 includes a support base 20, a light emitting element 30, and a light collector 40.

  The support base 20 has a function of supporting the light emitting element 30 and the light collector 40. Examples of the material for forming the support base 20 include ceramics and resin materials. Examples of the ceramic include an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, and a glass ceramic. Examples of the resin material include an epoxy resin and a liquid crystal polymer (LCP).

The support base 20 is provided with a plurality of recesses 20a on the first main surface 20b. The plurality of recesses 20a are arranged in a lattice shape when the first main surface 20b is viewed in plan from the normal direction. In the present embodiment, the plurality of recesses 20a are arranged in an orthogonal lattice shape. In the present embodiment, the two directions of the orthogonal lattice are the first direction and the second direction. In the present embodiment, the first direction is the X direction, and the second direction is the Y direction. The recess 20a has a diameter W 20a in the plane direction of the first major surface 20b is, is configured to be narrower toward the bottom surface 20a 1, the inner surface 20a 2 is inclined. The planar direction of this embodiment is composed of a first direction and a second direction. Further, the recess 20a is provided so that a cross section along the plane direction is circular in plan view. The shape of the concave portion 20a in a plan view is not limited to a circular shape, and may be various shapes such as an elliptical shape, a polygonal shape, and a shape with rounded corners.

Further, the support base 20 has a first terminal electrode 21, a second terminal electrode 22, and an internal electrode 23. The first terminal electrode 21, the second terminal electrode 22, and the internal electrode 23 have a function as a conductive path when power is supplied to the light emitting element 30. The first terminal electrode 21 and second terminal electrode 22 is provided on the bottom surface 20a 1 of each recess 20a. The internal electrode 23 is connected to the first terminal electrode 21 or the second terminal electrode 22 and is provided inside the support base 20.

The light emitting element 30 is provided in the recess 20 a of the support base 20. The light emitting element 30 is arranged to output light to the opening side from the bottom surface 20a 1 of recess 20a. The light emitting element 30 includes an element substrate 31, a light emitting layer 32, a first element electrode 33, and a second element electrode 34.

  The element substrate 31 functions as a support substrate for the light emitting element 30. Examples of the material for forming the support base 20 include silicon, sapphire, and gallium-based materials. A light emitting layer 32 is provided on the first main surface of the element substrate 31.

  The light emitting layer 32 is configured to emit light when power is supplied. More specifically, the light emitting layer 32 includes, for example, a first semiconductor layer of one conductivity type of n-type and p-type, a first contact layer, and the first contact layer from the first main surface of the element substrate 31. The semiconductor layer of the second conductivity type opposite to the first semiconductor layer and the second contact layer are stacked in the order described here. Examples of the light emitting layer 32 include various layers made of a compound semiconductor such as GaN. In the present embodiment, a light emitting layer 32 that emits ultraviolet light (UV light) having a wavelength peak spectrum of 380 [nm] or less is employed.

The first element electrodes 33 and the second element electrode 34 is provided on the main surface of the light-emitting layer 32 on the side opposite to the bottom surface 20a 1 of recess 20a. The first element electrode 33 and the second element electrode 34 are connected to the first terminal electrode 21 and the second terminal electrode 22 of the support base 20 through a solder layer. The light emitting element 30 of the present embodiment is arranged in a flip chip state on the first main surface of the first substrate 20. The light emitting element 30 is configured to emit light having a light amount corresponding to the magnitude of current when electric power is supplied to the element electrodes 33 and 34.

  In the present embodiment, one light emitting element 30 is provided in one recess 20a, but a plurality of light emitting elements 30 may be provided in one recess 20a.

Further, in the present embodiment, the light emitting element 30 so as to flip-chip connection, among the two main surfaces of the element substrate 31, on the side facing the bottom surface 20a 2 of the recess 20a, the first element electrode 33 and the Although the two element electrodes 34 are provided, the first element electrode 33 and the second element electrode 34 may be provided on the opening side of the recess 20a and connected by a bonding wire.

  The light collector 40 is provided in the recess 20a of the support base 20, and is provided so that a part thereof protrudes. The light condensing material 40 has a function of condensing light emitted from the light emitting element 30. As the light condensing material 40, a material that favorably transmits light emitted from the light emitting layer 32 is selected. As this condensing material 40, a silicone resin is mentioned, for example. The light condensing material 40 includes a first light transmissive material 41 and a second light transmissive material 42. In addition, this condensing material 40 is abbreviate | omitted in FIG.

A part of the first translucent material 41 is provided in the recess 20a, and a part of the first translucent material 41 protrudes from the recess 20a. The first translucent material 41 is located closer to the opening side of the recess than the light emitting element 30 and is provided apart from the light emitting element 30. The first light transmitting material 41, the surface is in contact with the inner surface 20a 2 of the recess 20a. The first translucent material 41 has a spherical shape, and the radius from the center of the cut surface is about ± 10%. Therefore, this 1st translucent material 41 can be arrange | positioned in the recessed part 20a, without considering direction.

  The second light transmissive material 42 covers the first light transmissive material 41. The second light transmissive material 42 is provided so as to protrude from the concave portion 20 a and serves as the outer surface of the light collector 40. The light condensing material 40 of the present embodiment condenses light emitted from the light emitting element 30 by the curvature of the second light transmissive material 42. In the present embodiment, a material having a refractive index substantially equal to that of the first light transmissive material 41 is employed as the second light transmissive material 42. Thus, by making the refractive indexes of the first light transmissive material 41 and the second light transmissive material 42 substantially equal, the first light transmissive material 41 and the second light transmissive material 42 The reflection of light at the interface can be reduced.

  The 2nd translucent material 42 of this embodiment is formed with the resin material formed by hardening | curing the precursor which has fluidity | liquidity. In order to form the second light transmissive material 42, first, the first light transmissive material 41 is disposed in the recess 20a. Next, a precursor to be the second light transmissive material 42 is placed in the recess 20 a and provided on the first light transmissive material 41. Next, the precursor in the said recessed part 20a and the precursor on the 1st translucent material 41 are hardened | cured and formed. When the second light transmissive material 42 is formed in this way, the curvature of the surface of the second light transmissive material 42 can be controlled by the volume of the precursor.

Since the second translucent material 42 is formed by curing a precursor having fluidity, the curvature of the surface of the second translucent material 42 is that of the first translucent material 41. as the thickness T 42 of the second light transmitting material 42 provided on the upper thicker decreases. In other words, the second light transmitting material 42, by increasing the volume of the precursor, it is possible to increase the thickness T 42 of the second light transmitting material 42, to reduce the curvature.

The thickness T 42 of the second light transmitting material 42 of the present embodiment, among the recesses 20a provided in rows along the first direction, in the central portion than the thickness at the ends of this sequence Thickness is provided thickly. Thus, by the thickness T 42 of the second light transmitting material 42 provided relatively thick in the center, the light emitting element 30 of the central portion of the light from both sides of the same row is to be irradiated emitted Can be reduced, and the uniformity of the light can be increased.

The thickness T 42 of the second light transmitting material 42, of the recess 20a provided in a lattice shape, and is provided thicker thickness at the central portion than the thickness at the peripheral portion. Thus, by the thickness T 42 of the second light transmitting material 42 provided relatively thick in the center, condensing the light emitting element 30 of the central portion so that the light from the surroundings is irradiated emits The uniformity of light can be improved.

  Furthermore, the wettability between the precursor that becomes the second light-transmitting material 42 and the first light-transmitting material 41 is changed to the wettability between the precursor that becomes the second light-transmitting material 42 and the support base 20. It is preferable to make it larger. In this case, the precursor to be the second light transmissive material 42 can be collected in the recess 20a of the support base 20 in which the first light transmissive material 41 is disposed. In this case, the second light transmissive material 42 can be made close to a spherical shape by the surface tension acting on the precursor.

  The first light transmissive material 41 of the present embodiment is made of the same material as the second light transmissive material 42. Further, a material close to the refractive index of the element substrate 31 is selected as the refractive index of the light condensing material 40 as compared with about 1.0 which is the refractive index of air. The light collector 40 of this embodiment is formed of a silicone resin having a refractive index of about 1.4, and is formed of sapphire having a refractive index of 1.7 compared to air having a refractive index of about 1.0. The value is close to that of the element substrate 31.

<Second form of optical module>
The light irradiation head 10A shown in FIGS. 4 to 6 includes a support base 20A, a light emitting element 30, and a light condensing material 40A. Among these, the structure of the light emitting element 30 is the same as the structure with which the light irradiation head 10 is provided.

  The support base 20A is different in configuration from the support base 20 in that a recess 20Aa extending in the X direction is provided. The other configuration of the support base 20A is the same as the configuration of the support base 20 described above.

The recess 20Aa extends in the X direction. A plurality of light emitting elements 30 are provided in the recess 20Aa along the X direction. The recesses 20Aa has a width W 20Aa along the Y direction is configured to be narrower toward the bottom surface 20Aa 1, the inner surface 20Aa 2 is inclined.

  The light collecting member 40A includes a first light transmissive material 41A and a second light transmissive material 42A.

A part of the first translucent material 41A is provided in the recess 20Aa, and a part protrudes from the recess 20Aa. The first translucent material 41 </ b> A is located closer to the opening of the recess than the light emitting element 30, and is provided apart from the light emitting element 30. The first light transmitting material 41A, the surface is in contact with the inner surface 20Aa 2 recesses 20Aa. The first translucent material 41A has a columnar shape extending in the X direction, and has a radius of about ± 10% from the center of the cut surface along the Y direction. Therefore, the first translucent material 41A can be disposed in the recess 20Aa without considering the orientation.

  The second light transmissive material 42A covers the first light transmissive material 41A. The second translucent material 42A is provided so as to protrude from the recess 20Aa and serves as the outer surface of the light condensing material 40A. The light condensing material 40A of the present embodiment condenses light emitted from the light emitting element 30A by the curvature of the second light transmissive material 42A.

  The second translucent material 42A of the present embodiment is formed of a resin material formed by curing a fluid precursor. In order to form the second light transmissive material 42A, first, the first light transmissive material 41A is disposed in the recess 20Aa. Next, a precursor to be the second light transmissive material 42A is placed in the recess 20Aa, and a precursor is provided on the first light transmissive material 41A. Next, the precursor in the said recessed part 20Aa and the precursor on 41 A of 1st translucent materials are hardened | cured and formed. When the second light transmissive material 42A is formed in this manner, the curvature of the surface of the second light transmissive material 42A can be controlled by the volume of the precursor.

Since the second translucent material 42A is formed by curing a fluid precursor, the curvature of the surface of the second translucent material 42A is the same as that of the first translucent material 41A. The thickness T42A of the second translucent material 42A provided above becomes smaller as the thickness T42A increases. In other words, the second light-transmitting material 42A is, by increasing the volume of the precursor, it is possible to increase the thickness T 42A in the second light transmitting material 42A, to reduce the curvature.

<Droplet effect device>
Hereinafter, an embodiment of a droplet curing apparatus, which is an example of an apparatus using the light irradiation head 10, will be described with reference to the drawings.

  7 and 8 are diagrams illustrating the ink jet printer 1 that is an example of the droplet curing device of the present invention that includes the light irradiation head 10.

  The ink jet printer 1 ejects ink droplets from the ink jet head 11 onto the surface of the recording medium 50 such as paper, which is conveyed in one direction (X direction in the figure), and is attached to the surface of the recording medium 50. The ink droplets attached to the recording medium 50 are cured by irradiating the droplets with light having a predetermined wavelength distribution. The ink jet printer 1 includes a platen 12 on which the recording medium 50 is placed, a conveying unit 13 having a feed roller 131 and a pressing roller 132, and a movement for moving the ink jet head 11 relative to the platen 12. It has a mechanism 14 and a light irradiation head 10.

  The inkjet head 11 ejects photocurable ink droplets onto the surface of the recording medium 50 that is placed on the platen 12 and conveyed in accordance with an image signal input from outside. The inkjet head 11 is a known inkjet head such as a so-called thermal type or bubble type. The inkjet head 11 is reciprocated along the Y direction in the drawing along a guide rail 141 provided in the moving mechanism 14.

  The recording medium 50 is conveyed by the conveying means 13 along, for example, the X direction in the drawing. As the recording medium 50 moves, the inkjet head 11 is also moved along the Y direction in the drawing. As the recording medium 50 and the inkjet head 11 move, an image signal is sent to the inkjet head 11 from a control unit (not shown). In the inkjet head 11, photocurable ink droplets are ejected toward the recording medium according to the image signal, and an image pattern (ink droplet pattern) corresponding to the image signal is formed on the surface of the recording medium 50.

  The light irradiation head 10 is disposed downstream of the recording medium 50 with respect to the inkjet head 11. In other words, the ink jet printer 1 is configured such that light from the light irradiation head 10 is irradiated onto ink droplets ejected from the ink jet head 11 and attached to the surface of the recording medium 50.

  The form of the ink jet printer is not limited to the above embodiment. For example, a so-called offset printing type printer that rotates a shaft-supported roller and conveys the recording medium 50 along the roller surface may exhibit the same effect.

  As mentioned above, although the example of specific embodiment of this invention was shown, this invention is not limited to this, A various change is possible within the range which does not deviate from the summary of invention.

  In the present embodiment, the light emitting element array 10 is described as an example of the pixel device, but the present invention is not limited to this. For example, a light receiving module employing a light receiving element instead of the light emitting element 50 may be used.

  In the present embodiment, the light emitting elements 50 are arranged in a square matrix, but the configuration is not limited thereto. For example, the light emitting elements 50 may be arranged in a matrix, but may have other angles in which the row direction and the column direction are not orthogonal.

  The ink jet printer 1 of the present embodiment employs the light irradiation head 10, but the light irradiation head 10 </ b> A may be employed. In this case, the uniformity of the light irradiated to the recording medium 50 can be improved by intersecting the direction in which the recess 20Aa of the light irradiation head 10A extends and the direction in which the recording medium 50 is conveyed.

1. Inkjet printer (droplet effect device)
10, 10A ... Light irradiation head (optical module)
DESCRIPTION OF SYMBOLS 11 ... Inkjet head 12 ... Platen 13 ... Conveyance means 131 ... Feed roller 132 ... Pressing roller 14 ... Moving mechanism 141 ... Guide rail 15 ... Control part 20, 20A・ ・ ・ Support base 20a, 20Aa ... Recess 20a 1 , 20Aa 1 ... Bottom of recess 20a 2 , 20Aa 2 ... Inner side surface of recess 20b, 20Ab ... Main surface 21 ... First Terminal electrode 22 ... 2nd terminal electrode 23 ... Internal electrode 30 ... Light emitting element (optical element)
DESCRIPTION OF SYMBOLS 31 ... Element substrate 32 ... Light emitting layer 33 ... 1st element electrode 34 ... 2nd element electrode 40, 40A ... Sealing material 41, 41A ... 1st light transmission sex material 42, 42A ... second light transmitting material 50 ... recording medium T 42, T 42A ... thickness W 20a of the second light-transmitting material, W 20Aa ... recess width

Claims (7)

  1. A support substrate having a recess;
    An optical element provided in the recess;
    A first translucent material that is disposed on the optical element and transmits light emitted by the optical element or light applied to the optical element;
    An optical module comprising: the first light transmissive material; and a second light transmissive material covering the optical element.
  2.   The light emitting element according to claim 1, wherein the first light transmissive material has a refractive index substantially equal to that of the second light transmissive material.
  3. A plurality of the optical elements;
    The support base is provided with a plurality of recesses,
    Each of the plurality of recesses is provided with the light emitting element, the first light transmissive material, and the second light transmissive material,
    3. The light-emitting element according to claim 1, wherein the plurality of second light-transmitting materials have different thicknesses from portions provided on the first light-transmitting material.
  4. The plurality of recesses are provided in a row,
    The second light transmissive material has a thickness greater than a thickness of a portion provided on the first light transmissive material at an end portion of the concave portion array. The optical module according to claim 3, wherein a thickness of a portion provided on one translucent material is thick.
  5. The plurality of recesses are arranged in a lattice pattern,
    The second translucent material is provided in such a manner that the portion provided on the first translucent material is thicker at the center of the array of recesses than at the periphery of the array of recesses. The optical module according to claim 3.
  6.   The optical module according to claim 1, wherein the second light transmissive material is a resin material formed by curing a precursor having fluidity.
  7. An optical module according to any one of claims 1 to 6,
    A droplet curing apparatus comprising: a discharge unit that discharges a droplet of a photocurable material that is cured by receiving light emitted from the optical module to a recording medium, and attaches the droplet to the surface of the recording medium.
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012256754A (en) * 2011-06-09 2012-12-27 Kyocera Corp Lighting device, lighting module and printing apparatus

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0369991A (en) * 1989-08-10 1991-03-26 Wakamatsu Sogo Gijutsu Joho Kenkyusho:Kk Display device provided with light emitting diode
JP2004179644A (en) * 2002-11-12 2004-06-24 Nichia Chem Ind Ltd Phosphor lamination and light source using the same
JP2006032387A (en) * 2004-07-12 2006-02-02 Asahi Rubber:Kk Led lamp
JP2007201301A (en) * 2006-01-30 2007-08-09 Sumitomo Metal Electronics Devices Inc Light emitting device using white led
JP2007273562A (en) * 2006-03-30 2007-10-18 Toshiba Corp Semiconductor light-emitting device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0369991A (en) * 1989-08-10 1991-03-26 Wakamatsu Sogo Gijutsu Joho Kenkyusho:Kk Display device provided with light emitting diode
JP2004179644A (en) * 2002-11-12 2004-06-24 Nichia Chem Ind Ltd Phosphor lamination and light source using the same
JP2006032387A (en) * 2004-07-12 2006-02-02 Asahi Rubber:Kk Led lamp
JP2007201301A (en) * 2006-01-30 2007-08-09 Sumitomo Metal Electronics Devices Inc Light emitting device using white led
JP2007273562A (en) * 2006-03-30 2007-10-18 Toshiba Corp Semiconductor light-emitting device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012256754A (en) * 2011-06-09 2012-12-27 Kyocera Corp Lighting device, lighting module and printing apparatus

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