JP2011107117A - Substrate circuit inspection device and inspection method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate circuit inspection device and an inspection method that reduce the total inspection cost, by utilizing charged electronic ink to measure a conducting condition of an electrode and defining use of a pin probe on one surface of a substrate. <P>SOLUTION: The substrate circuit inspection device includes a pin probe 110 that makes contact with one side of an electrode 160 formed on one surface of a substrate 180; a voltage source 120 applying a voltage to the pin probe 110; a film 130 placed on another side of the electrode 160, formed on another surface of the substrate 180; a dielectric fluid 140 sealed within the film 130; and the electronic ink 150; dispersed in the inside of the dielectric fluid 140 and charged to flow by the energization of the electrode 160. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a circuit inspection apparatus and an inspection method for a substrate.

  In recent years, with the development of the electronic industry, the demand for higher functionality of electronic components has increased rapidly. As a result, circuit board inspection methods performed at the time of board manufacture are also required to have high accuracy, high speed, and low cost. However, a contact-type pin probe method, which is a circuit inspection method for a substrate that is currently generally used, cannot satisfy the above-described requirements.

  FIG. 1 is a cross-sectional view of a substrate circuit inspection apparatus employing a contact pin probe according to the prior art.

  Referring to FIG. 1, a circuit inspection apparatus for a substrate 15 that employs a contact type pin probe includes two pin probes 11, 12, a voltage source 13, and an ammeter 14.

  The first pin probe 11 contacts one side of the electrode 16 formed on one surface of the substrate 15 to transmit the current supplied from the voltage source 13 to the electrode 16, and the second pin probe 12 It contacts the other side of the electrode 16 formed on the surface, receives current from the electrode 16 and transmits it to the ammeter 14.

  That is, when the electrode 16 is conductive, the voltage source 13, the first pin probe 11, the electrode 16, the second pin probe 12, and the ammeter 14 are serially connected in this order to form a closed circuit, and a current flows in the closed circuit. . Therefore, if the current is measured using the ammeter 14, the resistance value can be obtained by Ohm's law (R = V / I). Theoretically, when the electrode 16 is conductive, a resistance value of 0Ω should be measured, but since the resistance of the pin probes 11 and 12 and the conductor itself constituting the closed circuit exists, the resistance value is measured to 0Ω. If not, a relatively low resistance value is measured.

  On the other hand, when the electrode 16 is not conducting, the above-described current does not flow, and the resistance value becomes infinite (V / 0 = ∞).

  Therefore, a circuit inspection apparatus for a substrate that employs a pin probe can measure the resistance value and determine the continuity of the electrodes.

  However, since the circuit inspection apparatus for the substrate according to the prior art has to manufacture the pin probe precisely in order to cope with the fine patterning of the substrate, the manufacturing cost of the pin probe is increasing more and more. There was a problem that the total inspection cost also increased.

  In addition, when there is a defect in which the electrode pad is slightly lifted and the electrode is not energized, there is a problem in that it is erroneously measured that the electrode is energized by the pressure of the pin probe during the inspection.

  Further, since the pin probes must be brought into contact with both sides of the electrode, there is a problem that it takes a long measurement time, and there is a problem that the electrode is damaged due to heat generation due to a current flow during the inspection.

  Therefore, the present invention has been made to solve the above-mentioned problems, and the object of the present invention is to adopt a case where the electrode pad is slightly lifted by adopting an electrophoresis method for circuit inspection of a substrate. An object of the present invention is to provide a circuit inspection apparatus and an inspection method for a substrate that can prevent erroneous measurement and can reduce the inspection cost caused by the consumption of the pin probe because the pin probe is used only on one surface of the substrate. .

  According to one aspect of the present invention, a pin probe that contacts one side of an electrode formed on one side of a substrate; a voltage source that applies a voltage to the pin probe; the other side of the electrode formed on the other side of the substrate And a dielectric fluid sealed inside the film; and an electronic ink dispersed in the dielectric fluid and charged to flow by energization of the electrodes. A circuit inspection apparatus is provided.

  The film preferably includes a number of microcapsules encapsulating the dielectric fluid and the electronic ink.

  The film preferably includes a partition wall formed vertically to separate the electronic ink at a predetermined interval.

  Preferably, the voltage source applies a positive voltage to the pin probe, and the electronic ink is charged with a negative charge.

  Preferably, the voltage source applies a negative voltage to the pin probe, and the electronic ink is charged with a positive charge.

  The electronic ink is preferably white ink and black ink.

  The white ink is preferably charged with a positive charge, and the black ink is preferably charged with a negative charge.

  Preferably, the white ink is charged with a negative charge, and the black ink is charged with a positive charge.

  The film can be polyethylene terephthalate (PET), polycarbonate (PC), polymethyl methacrylate (PMMA), polyethylene naphthalate (PEN), polyethersulfone (PES), cyclic olefin polymer (COC), glass (Glass) or reinforced It is preferably formed of glass.

  The dielectric fluid may be transparent.

  The specific gravity of the electronic ink and the dielectric fluid may be the same.

  It is preferable that the circuit inspection apparatus for the substrate further includes a camera for photographing the flow state of the electronic ink.

  It is preferable that the circuit inspection apparatus for the substrate further includes an image comparison unit that determines an energization state of the electrode by comparing an image photographed by the camera with a reference image when the electrode is energized.

  The substrate may be a printed circuit board or a semiconductor wafer.

  According to another aspect of the present invention, (A) preparing a pin probe and a film sealed with a dielectric fluid in which electronic ink is dispersed; (B) forming the pin probe on one surface of the substrate; Contacting one side of the formed electrode and positioning the film on the other side of the electrode formed on the other side of the substrate; and (C) a voltage source is charged by applying a voltage to the pin probe A circuit inspection method for a substrate is provided, including the step of determining the energization state of the electrode by measuring the flow state of the electronic ink.

  In the step (C), it is preferable that the electronic ink flows when the electrode is energized.

  In the step (C), it is preferable to measure the flow state of the electronic ink by photographing with a camera.

  In the step (C), it is preferable to determine an energization state of the electrode by comparing an image photographed by the camera and a control image when the electrode is energized.

  In step (A), the specific gravity of the electronic ink and the dielectric fluid are the same. In step (C), the voltage source applies a voltage to the pin probe until the flow of the electronic ink stops. It is preferable.

  The features and advantages of the present invention will become more apparent from the following detailed description based on the accompanying drawings.

  Prior to the detailed description of the invention, the terms and words used in the specification and claims should not be construed in a normal and lexicographic sense, and the inventor will best explain his or her invention. In order to explain, the terminology must be interpreted into meanings and concepts that meet the technical idea of the present invention according to the principle that the concept of terms can be appropriately defined.

  According to the present invention, it is possible to limit the use of the pin probe to one side of the substrate by measuring the energization state of the electrode using charged electronic ink, thereby reducing the total inspection cost. There is an effect that can be done.

  In addition, according to the present invention, when a failure occurs in which the electrode pad is slightly lifted and the electrode is not energized, since the energized state is measured using an electrophoresis method without applying pressure, there is an advantage that no erroneous measurement occurs. .

  Furthermore, according to the present invention, since the pin probe only needs to be brought into contact with one surface of the substrate, the measurement time is shortened and no current flows through the electrode, so that the electrode can be prevented from being damaged due to heat generation. is there.

It is sectional drawing of the circuit inspection apparatus of the board | substrate which employ | adopted the contact-type pin probe by a prior art. It is sectional drawing (1) of the circuit inspection apparatus of the board | substrate by the suitable 1st Example of this invention. It is sectional drawing (2) of the circuit inspection apparatus of the board | substrate by 1st Example suitable for this invention. It is sectional drawing (1) of the circuit inspection apparatus of the board | substrate by 2nd Example suitable for this invention. It is sectional drawing (2) of the circuit inspection apparatus of the board | substrate by 2nd Example suitable for this invention. It is sectional drawing (1) of the circuit inspection apparatus of the board | substrate by 3rd Example suitable for this invention. It is sectional drawing (2) of the circuit inspection apparatus of the board | substrate by 3rd Example suitable for this invention. It is sectional drawing (1) of the circuit inspection apparatus of the board | substrate by preferable 4th Example of this invention. It is sectional drawing (2) of the circuit inspection apparatus of the board | substrate by 4th Example suitable for this invention. It is sectional drawing (1) which shows the circuit inspection method of the board | substrate by a suitable Example of this invention in order. It is sectional drawing (2) which shows the circuit inspection method of the board | substrate by a suitable Example of this invention in order. It is sectional drawing (3) which shows the circuit inspection method of the board | substrate by a suitable Example of this invention in order. It is sectional drawing (4) which shows the circuit inspection method of the board | substrate by a suitable Example of this invention in order. It is sectional drawing (5) which shows the circuit inspection method of the board | substrate by a suitable Example of this invention in order.

  Objects, specific advantages and novel features of the present invention will be more clearly understood from the following detailed description and preferred embodiments with reference to the accompanying drawings. In this specification, the same reference numerals are given to the components in the drawings as much as possible even if the same components are illustrated in other drawings. The terms “one side”, “other side”, “one side”, “other side” are used to distinguish one component from another component, and the component is limited to the above term. It is not something. In the description of the present invention, specific descriptions of related known techniques that can unnecessarily obscure the subject matter of the present invention are omitted.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

  2A and 2B are cross-sectional views of a circuit inspection apparatus for a substrate according to a first preferred embodiment of the present invention.

  2A and 2B, the circuit inspection apparatus for the substrate 180 according to the present embodiment applies a voltage to the pin probe 110 and the pin probe 110 that are in contact with one side of the electrode 160 formed on one surface of the substrate 180. The voltage source 120, the film 130 formed on the other side of the electrode 160 formed on the other surface of the substrate 180, the dielectric fluid 140 sealed in the film 130, and the dielectric fluid 140 are dispersed inside the electrode 160. The electronic ink 150 is charged so as to flow when energized. In addition, the circuit inspection apparatus for the substrate 180 according to the present embodiment compares the image captured by the camera 190 that captures the flow state of the electronic ink 150 and the control image when the electrode 160 is energized with the image of the electrode 190. An image comparison unit 200 that determines the energized state can be further included.

  Here, the electrodes 160 and 170 are objects to be inspected by the circuit inspection apparatus for the substrate 180 according to the present invention. The electrodes 160 and 170 are vias, circuit layers, It is a concept that includes all pads. Further, although the substrate 180 is shown as a single layer in the drawing, it is needless to say that a multilayer substrate is also included in the scope of the present invention, and is a concept including a printed circuit board (PCB) or a semiconductor wafer.

  The pin probe 110 is in contact with one side of the electrodes 160 and 170 formed on one surface of the substrate 180 and serves to transmit a voltage applied from the voltage source 120 to the electrodes 160 and 170. An electric field is generated at the electrode 160 that receives the voltage, and the conduction state of the electrodes 160 and 170 can be measured by this electric field. A detailed description thereof will be described later.

  Further, the pin probe 110 is manufactured in an ultra-small pin type structure so as to correspond to a fine circuit. In general, the cross-section of the pin probe 110 is circular, but is not limited to this, and the pin probe 110 may be formed in a polygon such as a triangle or a quadrangle. The pin probe 110 is made of a conductor so as to transmit a voltage to the electrodes 160 and 170, and in order to minimize the electric resistance of the pin probe 110 itself, a metal having a low electric resistance and a high surface strength, for example The surface of the pin probe 110 is plated with a noble metal such as gold or rhodium.

  The voltage source 120 serves to apply a voltage to the pin probe 110. Here, the voltage source 120 is generally preferably a DC voltage source 120 of 70V to 100V, but is not limited thereto, and the thickness of the substrate 180, the weight of the electronic ink 150, and the like are taken into consideration. Thus, the voltage source 120 that applies an appropriate voltage can be selected.

  The film 130 is a means for sealing a dielectric fluid 140, which will be described later, and is located on the other side of the substrate 180, which is the opposite side of the substrate 180 where the pin probe 110 is located. Film 130 can be polyethylene terephthalate (PET), polycarbonate (PC), polymethyl methacrylate (PMMA), polyethylene naphthalate (PEN), polyethersulfone (PES), cyclic olefin polymer (COC), glass (Glass) or reinforced It can be formed of glass or the like. In addition, the dielectric fluid 140 and the electronic ink 150 which are the core components of the present invention are hardly affected by the distortion of the film 130. Therefore, the film 130 can be manufactured flexibly if necessary.

  The dielectric fluid 140 is a dispersion medium sealed inside the film 130, and serves to flow the electronic ink 150 that is a dispersoid dispersed inside the dielectric fluid 140. The dielectric fluid 140 may use a dyed colloid suspension such as PDMS oil, but may use a transparent fluid so that the flow of the electronic ink 150 can be measured more accurately. it can.

  The electronic ink 150 is fine particles dispersed in a fine form in the dielectric fluid 140. The electronic ink 150 is charged with a positive charge or a negative charge and flows when the electrodes 160 and 170 are energized, so that the energized state of the electrodes 160 and 170 is changed. It makes it possible to make a judgment (visual or camera) 190 visually. The flow of the electronic ink 150 will be described in more detail. Since the voltage is transmitted from the pin probe 110 on one side of the electrodes 160 and 170 and the other side of the electrodes 160 and 170 is open, current flows. In other words, an electric field is generated on the other side of the energized electrode 160. The electronic ink 150 flows due to the electric field generated on the other side of the energized electrode 160.

  For example, as shown in FIG. 2A, when the voltage source 120 applies a negative voltage to the pin probe 110, the electronic ink 150 charged with a positive charge flows to the other side of the electrode 160 that is energized by electrical attraction. However, it does not flow to the other side of the electrode 170 that is not energized.

  In addition, as shown in FIG. 2B, when the voltage source 120 applies a positive voltage to the pin probe 110, the electronic ink 150 charged with a negative charge flows to the other side of the electrode 160 that is energized by electrical attraction. However, it does not flow to the other side of the electrode 170 that is not energized.

  Therefore, it can be determined that the electrode 160 on the side where the electronic ink 150 flows is energized, and the electrode 170 on the side where the electronic ink 150 does not flow is determined not to be energized. That is, the energization state of the electrode 160 can be determined by electrophoresis.

  As described above, since the circuit inspection apparatus for a substrate according to the present invention performs inspection by non-contact electrophoresis without contacting the pin probe 110 to the other side of the electrodes 160 and 170, the usage amount of the pin probe 110. Can reduce the overall inspection cost and shorten the inspection time. Further, when the electrode pad is slightly lifted, it is possible to prevent erroneous measurement that occurs in the contact type, and since no current flows through the inspection electrodes 160 and 170, there is an advantage that damage to the electrodes 160 and 170 can be prevented. is there.

  On the other hand, when the voltage source 120 applies a positive voltage to the pin probe 110 and the electronic ink 150 is charged with a positive charge, or the voltage source 120 applies a negative voltage to the pin probe 110 and the electronic ink 150 has a negative charge. Although it can be assumed that it is charged, in this case, the electronic ink 150 is far from the other side of the electrode 160 that is energized by an electric repulsive force, so that the energized electrode 160 cannot be clearly determined. Exists. Therefore, as described above, it is preferable to charge the electronic ink 150 with the opposite polarity of the voltage applied to the pin probe 110 by the voltage source 120.

  In determining the energization state of the electrode 160 based on the flow of the electronic ink 150, power can be saved by using bistability. Bistability means the property that the electronic ink 150 does not move even if the electric field is removed after the electronic ink 150 flows by the electric field and collects on the other end side of the electrode 160. Since the bistability is well realized when the specific gravity of the dispersoid and the specific gravity of the dispersion medium are the same, the specific gravity of the electronic ink 150 and the dielectric fluid 140 is preferably the same. However, here, the same specific gravity does not mean mathematically perfect identity, but is a concept including an error in the manufacturing process of the electronic ink 150 and the dielectric fluid 140.

  On the other hand, it is preferable to use titanium dioxide, carbon, or the like as the electronic ink 150. The size of the electronic ink 150 is not particularly limited. For ease of use, one of 1 to 2 μm is preferable.

  On the other hand, the flow of the electronic ink 150 can be measured with the naked eye, but it is preferable to include a camera 190 that captures the flow state of the electronic ink 150 for more accurate measurement. In addition, it is preferable to include an image comparison unit 200 that can accurately determine the energization state of the electrode 160 by comparing an image photographed by the camera 190 with a reference image when the previously input electrode is energized.

  3A and 3B are cross-sectional views of a circuit inspection apparatus for a substrate according to a second preferred embodiment of the present invention.

  When this embodiment is compared with the first embodiment described above, the greatest difference is that the film 130 further includes a microcapsule 133 in which the dielectric fluid 140 and the electronic ink 150 are sealed. Since the components outside the microcapsule 133 are the same, a duplicate description thereof will be omitted, and the microcapsule 133 that is different will be described in detail.

  Since the electronic ink 150 of the first embodiment can freely flow in the entire space inside the film 130, the electronic ink 150 can be clustered or aggregated. In this case, even if an electric attractive force acts on the electronic ink 150, the electronic ink 150 does not flow, or the density of the electronic ink 150 is different for each part. Therefore, it is difficult to accurately measure the flow of the electronic ink 150. .

  In this embodiment, a microcapsule 133 is used to solve such a problem. The microcapsule 133 limits the space in which the electronic ink 150 can flow, thereby preventing the electronic ink 150 from being clustered or aggregated in a specific portion. In addition, if the microcapsule 133 is manufactured finely, there is an advantage that the measurement decomposition ability is increased and it is possible to cope with the fine patterning of the substrate 180.

  Also in this embodiment, as in the first embodiment described above, the voltage source 120 applies a negative voltage to the pin probe 110 to charge the electronic ink 150 with a positive charge, thereby changing the conductive state of the electrodes 160 and 170. The voltage source 120 can measure the conduction state of the electrodes 160 and 170 by applying a positive voltage to the pin probe 110 and charging the electronic ink 150 with a negative charge (see FIG. 3A). (See FIG. 3B).

  4A and 4B are cross-sectional views of a circuit inspection apparatus for a substrate according to a third preferred embodiment of the present invention.

  When this embodiment is compared with the above-described embodiment, the biggest difference is that the partition walls 135 are vertically formed in the film 130 so as to separate the electronic ink 150 at a predetermined interval. Since the components other than the partition wall 135 are the same, a duplicate description thereof will be omitted, and the partition wall 135 that is different will be described in detail.

  The partition wall 135 of the present embodiment plays a role similar to the microcapsule 133 of the second embodiment. That is, the partition wall 135 provided in the film 130 limits the space in which the electronic ink 150 can flow, thereby preventing the electronic ink 150 from being clustered or aggregated in a specific portion. In addition, if the partition walls 135 are formed at fine intervals, there is an advantage that the measurement resolution capability is increased and the substrate 180 can be made finer. Furthermore, since the partition wall 135 serves to support the film 130, there is an advantage that the thickness of the film 130 can be prevented from becoming uneven.

  Also in the present embodiment, as in the first embodiment described above, the voltage source 120 applies a negative voltage to the pin probe 110 to charge the electronic ink 150 with a positive charge, thereby changing the conductive state of the electrodes 160 and 170. The voltage source 120 can measure the conduction state of the electrodes 160 and 170 by applying a positive voltage to the pin probe 110 and charging the electronic ink 150 with a negative charge (see FIG. 4A). (See FIG. 4B).

  5A and 5B are sectional views of a circuit inspection apparatus for a substrate according to a fourth preferred embodiment of the present invention.

  When this embodiment is compared with the above-described embodiment, the greatest difference is that the electronic ink 150 is composed of white ink 153 and black ink 155. The white ink 153 and the black ink 155 are charged with different polar charges, and are separated from each other when an electric field is applied. Therefore, the flow of the electronic ink 150 can be measured more clearly.

  For example, as shown in FIG. 5A, when the white ink 153 is charged with a positive charge and the black ink 155 is charged with a negative charge, and then the voltage source 120 applies a negative voltage to the pin probe 110, the white ink 153 is electrically charged. Since the black ink 155 moves away from the other side of the electrode 160 energized by the electric repulsion, the white ink 153 and the black ink 155 are separated from each other. The On the other hand, since no electric field is generated on the other side of the electrode 170 that is not energized, the white ink 153 and the black ink 155 are not separated.

  Further, as shown in FIG. 5B, if the white ink 153 is charged with a negative charge and the black ink 155 is charged with a positive charge and then the voltage source 120 applies a negative voltage to the pin probe 110, the black ink 155 is The white ink 153 moves away from the other side of the electrode 160 energized by the electric repulsion, but the white ink 153 and the black ink 155 are separated from each other. Is done. On the other hand, since no electric field is generated on the other side of the electrode 170 that is not energized, the white ink 153 and the black ink 155 are not separated.

  Therefore, this embodiment uses the white ink 153 and the black ink 155 that are clearly distinguished from each other to check whether or not the white ink 153 and the black ink 155 are separated, thereby determining whether the electrode 160 is energized. Can be accurately determined.

  5A and 5B show the case where the microcapsule 133 is employed (see the second embodiment), but the present invention is not limited to this, and the case where only the basic film 130 described above is provided (the first embodiment). The electronic ink 150 can be composed of the white ink 153 and the black ink 155 in any case where the film 130 having the inner wall is provided (see the third embodiment).

  6 to 10 are sectional views sequentially showing a circuit inspection method for a substrate according to a preferred embodiment of the present invention.

  As shown in FIGS. 6 to 10, the circuit inspection method for a substrate according to the present embodiment prepares (A) a pin probe 110 and a film 130 sealed with a dielectric fluid 140 in which electronic ink 150 is dispersed. (B) bringing the pin probe 110 into contact with one side of the electrode 160 formed on one surface of the substrate 180 and positioning the film 130 on the other side of the electrode 160 formed on the other surface of the substrate 180; (C) The step of determining the energization state of the electrode 160 by measuring the flow state of the electronic ink 150 charged by the voltage source 120 applying a voltage to the pin probe 110 is included.

  The circuit inspection method for a substrate according to the present embodiment uses the above-described circuit inspection device for a substrate, and the configuration of the circuit inspection device for a substrate has already been described. The time series characteristics of the inspection method will be mainly described.

  First, as shown in FIG. 6, a pin probe 110 and a film 130 sealed with a dielectric fluid 140 in which electronic ink 150 is dispersed are prepared. At this time, the specific gravity of the electronic ink 150 and the dielectric fluid 140 is preferably the same. This is because the bi-stability is used in determining the energization state of the electrode 160 from the flow of the electronic ink 150 at a later-described stage.

  Next, as shown in FIG. 7, the pin probe 110 is brought into contact with one side of the electrodes 160 and 170 formed on the one surface of the substrate 180, and the film 130 is placed on the other surface of the substrate 180 in addition to the electrodes 160 and 170. It is a stage to be located on the side. At this time, the pin probe 110 is in contact with the electrodes 160 and 170 so as to be electrically connected, and the film 130 is preferably located within the range of the electric field generated by the energized electrode 160.

  Next, as shown in FIGS. 8 to 10, the voltage source 120 applies a voltage to the pin probe 110 to measure the flow state of the charged electronic ink 150, thereby determining the energization state of the electrodes 160 and 170. It is the stage to do. More preferably, in this step, the energization state of the electrodes 160 and 170 is determined by the image comparison unit 200 by applying a voltage to the pin probe 110, removing the voltage from the pin probe 110, and measuring using the camera 190. At the stage to do.

  First, referring to FIG. 8, the voltage source 120 applies a voltage to the pin probe 110. When a voltage is applied, the electronic ink 150 flows to the other side of the energized electrode 160 due to electrical attraction, and the electronic ink 150 does not flow to the other side of the non-energized electrode 170.

  Next, referring to FIG. 9, the voltage applied to the pin probe 110 is removed. When the flow of the electronic ink 150 stops, the voltage applied to the pin probe 110 is removed. Even when the voltage is removed, the electronic ink 150 does not flow on the other side of the energized electrode 160 due to the bi-stability. Therefore, the voltage source 120 only needs to selectively apply a voltage to the pin probe 110 only while the electronic ink 150 flows, so that there is an advantage that power consumption can be reduced.

  Next, referring to FIG. 10, the current comparison state of the electrode 160 is determined by the image comparison unit 200 based on the measurement using the camera 190. Although the flow of the electronic ink 150 can be determined with the naked eye, the flow of the electronic ink 150 is measured by photographing with the camera 190 for more accurate measurement. Thereafter, the image captured by the camera 190 is transmitted to the image comparison unit 200. Here, the image comparison unit 200 stores in advance a control image when the electrode is energized (when the electrode is normal). The image comparison means 200 determines the energization state of the electrode 160 by comparing the image captured by the camera 190 with the reference image.

  As described above, the present invention has been described in detail on the basis of specific embodiments. This is for specifically explaining the present invention, and the circuit inspection apparatus for a substrate and the circuit inspection method for a substrate according to the present invention include However, the present invention is not limited thereto, and various modifications and improvements may be made by those having ordinary knowledge in the field within the technical idea of the present invention. All simple variations and modifications of the present invention shall fall within the scope of the present invention, and the specific scope of protection of the present invention will be clearly determined by the claims.

  The present invention can be applied to a contact pin probe type substrate circuit inspection method that is currently generally used.

110 Pin probe 120 Voltage source 130 Film 133 Microcapsule 135 Bulkhead 140 Dielectric fluid 150 Electronic ink 153 White ink 155 Black ink 160 Electrode 170 Non-energized electrode 180 Substrate 190 Camera 200 Image comparison means

Claims (19)

A pin probe in contact with one side of an electrode formed on one side of the substrate;
A voltage source for applying a voltage to the pin probe;
A film located on the other side of the electrode formed on the other side of the substrate;
A dielectric fluid sealed within the film; and electronic ink dispersed within the dielectric fluid and charged to flow by energization of the electrodes;
A circuit inspection apparatus for a substrate, comprising:   2. The circuit inspection apparatus for a substrate according to claim 1, wherein the film includes a plurality of microcapsules encapsulating the dielectric fluid and the electronic ink.   The circuit inspection apparatus for a substrate according to claim 1, wherein the film includes a partition wall formed vertically to separate the electronic ink at a predetermined interval.   The circuit inspection apparatus for a substrate according to claim 1, wherein the voltage source applies a positive voltage to the pin probe, and the electronic ink is charged with a negative charge.   The circuit inspection apparatus for a substrate according to claim 1, wherein the voltage source applies a negative voltage to the pin probe, and the electronic ink is charged with a positive charge.   The circuit inspection apparatus for a substrate according to claim 1, wherein the electronic ink is a white ink and a black ink.   The circuit inspection apparatus for a substrate according to claim 6, wherein the white ink is charged with a positive charge and the black ink is charged with a negative charge.   The circuit inspection apparatus for a substrate according to claim 6, wherein the white ink is charged with a negative charge and the black ink is charged with a positive charge.   The film may be polyethylene terephthalate (PET), polycarbonate (PC), polymethyl methacrylate (PMMA), polyethylene naphthalate (PEN), polyethersulfone (PES), cyclic olefin polymer (COC), glass (Glass) or reinforced 2. The circuit inspection apparatus for a substrate according to claim 1, wherein the circuit inspection apparatus is made of glass.   The circuit inspection apparatus for a substrate according to claim 1, wherein the dielectric fluid is transparent.   2. The circuit inspection apparatus for a substrate according to claim 1, wherein the specific gravity of the electronic ink and the dielectric fluid are the same.   The circuit inspection apparatus for a substrate according to claim 1, further comprising a camera for photographing a flow state of the electronic ink.   The circuit of claim 12, further comprising an image comparison unit that determines an energization state of the electrode by comparing an image photographed by the camera with a reference image when the electrode is energized. Inspection device.   The circuit inspection apparatus for a substrate according to claim 1, wherein the substrate is a printed circuit board or a semiconductor wafer. (A) preparing a pin probe and a film sealed with a dielectric fluid in which electronic ink is dispersed;
(B) contacting the pin probe with one side of an electrode formed on one side of the substrate, and positioning the film on the other side of the electrode formed on the other side of the substrate; and (C) a voltage source is Determining an energization state of the electrode by measuring a flow state of the electronic ink charged by applying a voltage to a pin probe;
A circuit inspection method for a substrate, comprising:   16. The circuit inspection method for a substrate according to claim 15, wherein, in the step (C), the electronic ink flows by energization of the electrode.   16. The circuit inspection method for a substrate according to claim 15, wherein in the step (C), the flow state of the electronic ink is measured by photographing with a camera.   18. The substrate according to claim 17, wherein the step (C) determines an energization state of the electrode by comparing an image taken by the camera with a control image when the electrode is energized. Circuit inspection method. In the step (A), the electronic ink and the dielectric fluid have the same specific gravity,
16. The circuit inspection method for a substrate according to claim 15, wherein, in the step (C), the voltage source applies a voltage to the pin probe until the flow of the electronic ink stops.