JP2011071279A - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法 Download PDFInfo
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- JP2011071279A JP2011071279A JP2009220508A JP2009220508A JP2011071279A JP 2011071279 A JP2011071279 A JP 2011071279A JP 2009220508 A JP2009220508 A JP 2009220508A JP 2009220508 A JP2009220508 A JP 2009220508A JP 2011071279 A JP2011071279 A JP 2011071279A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 24
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 21
- 239000011162 core material Substances 0.000 claims abstract description 61
- 230000001681 protective effect Effects 0.000 claims abstract description 40
- 239000000463 material Substances 0.000 claims abstract description 31
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 13
- 239000001301 oxygen Substances 0.000 claims abstract description 13
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 13
- 238000012545 processing Methods 0.000 claims abstract description 8
- 238000005530 etching Methods 0.000 claims abstract description 7
- 238000000034 method Methods 0.000 claims description 21
- 238000012546 transfer Methods 0.000 abstract description 5
- 239000007789 gas Substances 0.000 description 10
- 239000011368 organic material Substances 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 5
- 238000005229 chemical vapour deposition Methods 0.000 description 5
- 238000001020 plasma etching Methods 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- 238000001459 lithography Methods 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 230000009466 transformation Effects 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 238000004380 ashing Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 150000001282 organosilanes Chemical class 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- PQDJYEQOELDLCP-UHFFFAOYSA-N trimethylsilane Chemical compound C[SiH](C)C PQDJYEQOELDLCP-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
- H01L21/0334—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
- H01L21/0337—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
- H01L21/0334—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
- H01L21/0338—Process specially adapted to improve the resolution of the mask
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- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Inorganic Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Computer Hardware Design (AREA)
- Drying Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Semiconductor Memories (AREA)
- Non-Volatile Memory (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Electrodes Of Semiconductors (AREA)
Abstract
【解決手段】本発明の一態様に係る半導体装置の製造方法は、被加工体1上にCを含む材料からなる芯材2を選択的に形成する工程と、芯材2の上面および側面を覆うように、酸素を含まない材料からなる保護膜3を形成する工程と、保護膜3を介して芯材2と被加工体1を覆うように酸化膜4を形成する工程と、芯材2の側方に少なくとも酸化膜4からなる側壁5を加工形成する工程と、少なくとも芯材2を除去した後、側壁5をマスクとして用いて被加工体1をエッチングし、側壁5のパターンを転写する工程と、を含む。
【選択図】図1A
Description
図1A(a)〜(d)、図1B(e)、(f)は、本発明の第1の実施の形態に係る半導体装置の製造工程を示す断面図である。
この第1の実施の形態によれば、酸化膜4を形成する前に芯材2の表面を保護膜3で覆うことにより、Cを含む材料からなる芯材2への酸素成分によるダメージを抑えることができる。このため、芯材2の幅の減少や、変形を抑えて、精度の高いパターンを有する側壁5を形成し、その結果、精度の高い微細なパターンを被加工体1に転写することができる。
第2の実施の形態は、側壁の構成において、第1の実施の形態と異なる。なお、第1の実施の形態と同様の点については、説明を省略または簡略化する。
この第2の実施の形態によれば、第1の実施の形態と異なるプロセスで側壁を形成し、第1の実施の形態と同様の効果を得ることができる。
本発明は、上記各実施の形態に限定されず、発明の主旨を逸脱しない範囲内において種々変形実施が可能である。
Claims (5)
- 被加工体上にCを含む材料からなる芯材を選択的に形成する工程と、
前記芯材の上面および側面を覆うように、酸素を含まない材料からなる保護膜を形成する工程と、
前記保護膜を介して前記芯材と前記被加工体を覆うように酸化膜を形成する工程と、
前記芯材の側方に少なくとも前記酸化膜からなる側壁を加工形成する工程と、
少なくとも前記芯材を除去した後、前記側壁をマスクとして用いて前記被加工体をエッチングし、前記側壁のパターンを転写する工程と、
を含む半導体装置の製造方法。 - 前記側壁のパターンを転写する工程は、前記芯材を除去した後、前記保護膜と前記酸化膜からなる側壁をマスクとして用いて前記被加工体をエッチングする、
請求項1に記載の半導体装置の製造方法。 - 前記側壁のパターンを転写する工程は、前記芯材と前記保護膜を除去した後、前記酸化膜からなる側壁をマスクとして用いて前記被加工体をエッチングする、
請求項1に記載の半導体装置の製造方法。 - 前記芯材は、レジスト材からなる、
請求項1〜3のうちのいずれか1つに記載の半導体装置の製造方法。 - 前記保護膜は、SiCN、SiN、SiC、BN、SiH、SiFの少なくともいずれか1つを含む材料からなる、
請求項1〜4のうちのいずれか1つに記載の半導体装置の製造方法。
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JP2009220508A JP5075897B2 (ja) | 2009-09-25 | 2009-09-25 | 半導体装置の製造方法 |
US12/791,434 US20110076850A1 (en) | 2009-09-25 | 2010-06-01 | Method of fabricating semiconductor device |
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JP2009220508A JP5075897B2 (ja) | 2009-09-25 | 2009-09-25 | 半導体装置の製造方法 |
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JP2011071279A true JP2011071279A (ja) | 2011-04-07 |
JP5075897B2 JP5075897B2 (ja) | 2012-11-21 |
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JP (1) | JP5075897B2 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015111668A (ja) * | 2013-11-07 | 2015-06-18 | ノベラス・システムズ・インコーポレーテッドNovellus Systems Incorporated | 先進のパターニングのためのソフトランディング・ナノラミネート |
JPWO2015060069A1 (ja) * | 2013-10-22 | 2017-03-09 | 株式会社日立国際電気 | 微細パターンの形成方法、半導体装置の製造方法、及び基板処理装置並びに記録媒体 |
CN111524795A (zh) * | 2019-02-03 | 2020-08-11 | 中芯国际集成电路制造(上海)有限公司 | 自对准双重图形化方法及其形成的半导体结构 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8735296B2 (en) * | 2012-07-18 | 2014-05-27 | International Business Machines Corporation | Method of simultaneously forming multiple structures having different critical dimensions using sidewall transfer |
JP2021048329A (ja) | 2019-09-19 | 2021-03-25 | キオクシア株式会社 | パターン形成方法及びテンプレートの製造方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2009124134A (ja) * | 2007-10-26 | 2009-06-04 | Applied Materials Inc | フォトレジストテンプレートマスクを用いて頻度を倍にする方法 |
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DE102007030056B3 (de) * | 2007-06-29 | 2009-01-22 | Advanced Micro Devices, Inc., Sunnyvale | Verfahren zum Blockieren einer Voramorphisierung einer Gateelektrode eines Transistors |
JP2009130035A (ja) * | 2007-11-21 | 2009-06-11 | Toshiba Corp | 半導体装置の製造方法 |
JP2009152243A (ja) * | 2007-12-18 | 2009-07-09 | Toshiba Corp | 半導体装置の製造方法 |
KR100961203B1 (ko) * | 2008-04-29 | 2010-06-09 | 주식회사 하이닉스반도체 | 스페이서 패터닝 기술을 이용한 미세 패턴 형성 방법 |
JP2010003826A (ja) * | 2008-06-19 | 2010-01-07 | Toshiba Corp | 半導体装置の製造方法 |
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2009
- 2009-09-25 JP JP2009220508A patent/JP5075897B2/ja not_active Expired - Fee Related
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- 2010-06-01 US US12/791,434 patent/US20110076850A1/en not_active Abandoned
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2009124134A (ja) * | 2007-10-26 | 2009-06-04 | Applied Materials Inc | フォトレジストテンプレートマスクを用いて頻度を倍にする方法 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2015060069A1 (ja) * | 2013-10-22 | 2017-03-09 | 株式会社日立国際電気 | 微細パターンの形成方法、半導体装置の製造方法、及び基板処理装置並びに記録媒体 |
JP2015111668A (ja) * | 2013-11-07 | 2015-06-18 | ノベラス・システムズ・インコーポレーテッドNovellus Systems Incorporated | 先進のパターニングのためのソフトランディング・ナノラミネート |
US10192742B2 (en) | 2013-11-07 | 2019-01-29 | Novellus Systems, Inc. | Soft landing nanolaminates for advanced patterning |
CN111524795A (zh) * | 2019-02-03 | 2020-08-11 | 中芯国际集成电路制造(上海)有限公司 | 自对准双重图形化方法及其形成的半导体结构 |
CN111524795B (zh) * | 2019-02-03 | 2024-02-27 | 中芯国际集成电路制造(上海)有限公司 | 自对准双重图形化方法及其形成的半导体结构 |
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JP5075897B2 (ja) | 2012-11-21 |
US20110076850A1 (en) | 2011-03-31 |
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