JP2011058317A - Method for forming attachment backing, and attachment backing forming tool used for the same - Google Patents

Method for forming attachment backing, and attachment backing forming tool used for the same Download PDF

Info

Publication number
JP2011058317A
JP2011058317A JP2009211235A JP2009211235A JP2011058317A JP 2011058317 A JP2011058317 A JP 2011058317A JP 2009211235 A JP2009211235 A JP 2009211235A JP 2009211235 A JP2009211235 A JP 2009211235A JP 2011058317 A JP2011058317 A JP 2011058317A
Authority
JP
Japan
Prior art keywords
forming
resin layer
hole
resin
curable resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009211235A
Other languages
Japanese (ja)
Inventor
Masamitsu Harutake
政実 治武
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP2009211235A priority Critical patent/JP2011058317A/en
Publication of JP2011058317A publication Critical patent/JP2011058317A/en
Pending legal-status Critical Current

Links

Landscapes

  • Finishing Walls (AREA)
  • Steps, Ramps, And Handrails (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for forming attachment backing, and an attachment backing forming tool conveniently usable for the method having sufficient strength even for a weak wall, low in cost with high working efficiency without impairing appearance, and versatile to cope with various brackets. <P>SOLUTION: The method for forming attachment backing includes a hole forming process for forming a through hole in a predetermined part of a surface plate; a first resin layer forming process for forming a first resin layer by pressure-bonding curable resin to the inner peripheral surface of the through hole in the surface plate; a second resin layer forming process for forming a second resin layer by putting curable resin into a hollow space through the through hole and pressure-bonding the curable resin to the back face of the surface plate; a third resin layer forming process for forming a third resin layer on the surface of the second resin layer by putting curable resin into the hollow space through the through hole; and a wall forming process for forming an attachment wall by filling curable resin in the first to third resin layers. The attachment backing forming tool includes a handle part, an insertion part and a working tool part, and the working tool part includes an insertion protrusion and a spatula part. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

本発明は、例えば、マンションのような集合住宅や、図書館、体育館、美術館のような民間もしくは公営施設の建造物及び一般住宅において、その浴室、トイレ、居室、廊下、階段等の壁面に取り付けられる手摺のような取付部材の取付下地を形成する形成方法及びこの形成方法に用いる形成工具に関するものであり、特に、比較的に強度の低い薄板状壁に一方の壁面からのみの作業で手摺等の取付部材を取り付ける際の取付下地を形成する形成方法及びこの形成方法に用いる形成工具に関するものである。   The present invention is attached to the walls of bathrooms, toilets, living rooms, hallways, stairs, etc. in, for example, apartment houses such as condominiums, private or public facilities such as libraries, gymnasiums, and museums and general houses. The present invention relates to a forming method for forming a mounting base of a mounting member such as a handrail and a forming tool used in this forming method, and in particular, a handrail or the like by a work only from one wall surface to a relatively low-strength thin wall. The present invention relates to a forming method for forming a mounting base when mounting a mounting member, and a forming tool used in this forming method.

従来、一般に壁面は、間仕切り壁と表面板の間に桟材を介在させている。例えばコンクリート面と表面板との間に桟材やモルタルを介在させて中空部を形成している。このような中空壁構造においては、中空部の表面板に手摺やその他の金具を取付けようとすると、表面板は一般に薄く直接ネジなどで固定することがでず、それ故に手摺りなどを取り付けることができなかった。   Conventionally, generally, a wall surface has a crosspiece interposed between a partition wall and a surface plate. For example, a hollow portion is formed by interposing a crosspiece or mortar between the concrete surface and the surface plate. In such a hollow wall structure, when attaching a handrail or other metal fittings to the surface plate of the hollow part, the surface plate is generally thin and cannot be directly fixed with screws, and therefore a handrail or the like must be attached. I could not.

この中空壁構造で手摺りを取り付けるために桟材等の下地を利用しようとすると、下地の位置と金具の取付け位置にずれが生じたり、金具取付け位置が規制されるなど問題点があった。また、事後に金具の取付け位置に併せて下地を設けるには、表面板を外して、金具取付け位置に合わせて桟材などの下地を入れて、外した表面板を戻さなければならず、施工が煩雑になる問題点があった。   If an attempt is made to use a base such as a crosspiece to attach a handrail with this hollow wall structure, there is a problem in that the position of the base and the mounting position of the metal fitting are deviated or the metal mounting position is restricted. In addition, in order to provide the base at the mounting position of the bracket after the fact, the surface plate must be removed, the base such as a crosspiece must be inserted at the mounting position of the bracket, and the removed surface plate must be returned. There was a problem that became complicated.

そこで、このような問題点を解決するために、柔軟樹脂を利用した取付下地の形成方法が提案されている(例えば、特許文献1及び特許文献11参照)。また、ネジ付きアンカーを用いて固定する方法(例えば、特許文献2参照)、強度向上を図るために帯板手摺りを用いた方法(例えば、特許文献3参照)、複数の取付金具の使用とピンを斜めに打つことで固定する方法(例えば、特許文献4参照)、下地のある位置まで届くアンカーを打ちそれと特殊な手すりをネジ止めして固定する方法(例えば、特許文献5参照)、空間のあるネジ状の成型物を打ち込みそこに樹脂を注入することで固定する方法(例えば、特許文献6参照)、貫通穴を開けて袋を入れ樹脂を注入して固定する方法(例えば、特許文献7参照)、貫通穴を開け下地板を挿入して固定する方法(例えば、特許文献8参照)、打ち込まれた固定具が裏面にて四方に広がることで固定する方法(例えば、特許文献9参照)、大きな補強版を使用し釘を斜めに打つことで固定する方法(例えば、特許文献10参照)などが提案されている。   In order to solve such problems, a method for forming an attachment base using a flexible resin has been proposed (see, for example, Patent Document 1 and Patent Document 11). In addition, a method of fixing using a threaded anchor (for example, see Patent Document 2), a method using a band plate handrail to improve strength (for example, see Patent Document 3), use of a plurality of mounting brackets, A method of fixing the pin by hitting it diagonally (for example, see Patent Document 4), a method of fixing an anchor that reaches the position of the ground and screwing it with a special handrail (for example, see Patent Document 5), space A method of fixing by inserting a screw-like molded product with a resin and injecting resin there (for example, see Patent Document 6), a method of opening a through hole and inserting a bag and injecting resin and fixing (for example, Patent Document) 7), a method of opening a through hole and inserting and fixing a base plate (see, for example, Patent Document 8), a method of fixing by driving a fixed tool spread in all directions on the back surface (see, for example, Patent Document 9) ),big Method of fixing by hitting using a reinforcing plate nail obliquely (e.g., see Patent Document 10) it has been proposed.

特許第3716397号公報Japanese Patent No. 3716397 特開平10−331819公報Japanese Patent Laid-Open No. 10-331819 特開2004−162320公報JP 2004-162320 A 実用新案登録第3132092公報Utility Model Registration No. 3132092 特開2001−59322公報JP 2001-59322 A 特開平7−127611公報JP-A-7-127611 特開2002−21283公報JP 2002-21283 A 特開平11−71878公報JP-A-11-71878 実開平5−8016公報Japanese Utility Model Publication 5-8016 実用新案登録第3122395公報Utility Model Registration No. 3123395 特開2000−96742公報JP 2000-96742 A

しかしながら、上述した先行文献の技術では、次の通りの問題が存在する。即ち、特許文献2、特許文献4、特許文献6及び特許文献9の技術では、抵抗面積が少なく手すりなどの用途目的には十分な強度が確保できない。また、特許文献3及び特許文献5の技術では、部品点数が多く大幅なコストアップとなる。特許文献1、特許文献7及び特許文献8の技術ではブラケットのネジ穴の間に貫通穴を開けることでネジ周囲の壁自体の強度を低下させてしまうことになる。また、特許文献10の技術では、表面に取り付け板が必要になり、下地の有無により外観が異なり全体の外観を損なうこととなる。外観を良くするためにすべて施工するのはコストもかかり無駄である。更に、特許文献1及び特許文献11の技術では、柔軟樹脂を利用する為に注入樹脂本来の硬度及び強度が発揮できない。本発明はこれらの課題を解決するものである。   However, the prior art described above has the following problems. That is, with the techniques of Patent Document 2, Patent Document 4, Patent Document 6, and Patent Document 9, the resistance area is small and sufficient strength for application purposes such as handrails cannot be secured. Further, with the techniques of Patent Document 3 and Patent Document 5, the number of parts is large and the cost is significantly increased. In the techniques of Patent Document 1, Patent Document 7 and Patent Document 8, the strength of the wall itself around the screw is reduced by opening a through hole between the screw holes of the bracket. Moreover, in the technique of patent document 10, a mounting plate is required on the surface, and the appearance changes depending on the presence or absence of a base, and the overall appearance is impaired. It is costly and wasteful to install everything to improve the appearance. Furthermore, in the techniques of Patent Document 1 and Patent Document 11, since the soft resin is used, the original hardness and strength of the injected resin cannot be exhibited. The present invention solves these problems.

本発明の目的は、脆い壁でも十分な強度を出すことができ、加えて低コストで作業性良く外観を損なわず、様々なデザイン形状のブラケットが販売されておりそれらに対応できる汎用性のある取付下地の形成方法を提供することである
また、本発明の他の目的は、上記取付下地の形成方法に好都合に用いることができる取付下地形成工具を提供することである。
The object of the present invention is to provide sufficient strength even with a fragile wall, and in addition, it is versatile enough to handle brackets of various design shapes that are sold at low cost without damaging the appearance and good workability. Another object of the present invention is to provide a mounting base forming tool that can be advantageously used in the above mounting base forming method.

本発明の請求項1に記載の取付下地の形成方法は、表面板の裏面側に中空空間が存在する中空壁構造に設置部材を取り付けるための取付下地を形成する形成方法であって、前記表面板の所定部位に貫通孔を形成する孔形成工程と、前記表面板の前記貫通孔の内周面に硬化型樹脂を圧着して第1樹脂層を形成する第1樹脂層形成工程と、前記第1樹脂層を形成した後に、前記貫通孔を通して前記中空空間に硬化型樹脂を入れて前記表面板の裏面に圧着して第2樹脂層を形成する第2樹脂層形成工程と、前記貫通孔を通して前記中空空間に硬化型樹脂を入れて前記第2樹脂層の表面に第3樹脂層を形成する第3樹脂層形成工程と、前記第1〜第3樹脂層に硬化型樹脂を充填して取付壁部を形成する壁部形成工程と、を含むことを特徴とする。   The method for forming an attachment base according to claim 1 of the present invention is a method for forming an attachment base for attaching an installation member to a hollow wall structure in which a hollow space exists on the back surface side of the front plate. A hole forming step of forming a through hole in a predetermined portion of the face plate, a first resin layer forming step of forming a first resin layer by pressure-bonding a curable resin to the inner peripheral surface of the through hole of the surface plate, A second resin layer forming step of forming a second resin layer by forming a second resin layer by forming a first resin layer and then pressing the curable resin into the hollow space through the through-holes and then press-bonding to the back surface of the surface plate; A third resin layer forming step of forming a third resin layer on the surface of the second resin layer by inserting a curable resin into the hollow space, and filling the curable resin into the first to third resin layers A wall portion forming step for forming the mounting wall portion.

また、本発明の請求項2に記載の取付下地の形成方法では、前記第3樹脂層形成工程においては、硬化型樹脂を前記第2樹脂層の表面に塗布して所定厚さの前記第3樹脂層を形成するための取付下地形成工具が用いられ、前記取付下地形成工具は、取手部と、前記取手部の先端部に設けられ、前記貫通孔に挿入される挿入部と、前記挿入部から延びる作業工具部とを備え、前記作業工具部は、前記挿入部の先端部から延びる挿入突出部と、前記挿入突出部の先端部に設けられ、この先端部から垂直に延びるヘラ部とを有することを特徴とする。   In the method for forming a mounting base according to claim 2 of the present invention, in the third resin layer forming step, a curable resin is applied to the surface of the second resin layer to form the third resin having a predetermined thickness. A mounting base forming tool for forming a resin layer is used, and the mounting base forming tool is provided at a handle portion, a distal end portion of the handle portion, and inserted into the through hole, and the insertion portion. A working tool portion extending from the insertion projection portion extending from the distal end portion of the insertion portion, and a spatula portion provided at the distal end portion of the insertion projection portion and extending vertically from the distal end portion. It is characterized by having.

また、本発明の請求項3に記載の取付下地の形成方法では、前記取付下地形成工具は、前記第2樹脂形成工程においても用いられ、前記取手部を手前側に引いて前記ヘラ部を前記表面板の裏面に圧接させた状態にて前記ヘラ部を回動させて硬化型樹脂を前記表面板の裏面に圧着させることを特徴とする。   Further, in the method for forming the mounting base according to claim 3 of the present invention, the mounting base forming tool is also used in the second resin forming step, and the spatula portion is pulled by pulling the handle portion toward the front side. The spatula portion is rotated in a state where it is pressed against the back surface of the front plate, and the curable resin is pressure-bonded to the back surface of the front plate.

更に、本発明の請求項4に記載の取付下地形成工具は、取手部と、前記取手部の先端部に設けられ、中空壁構造の表面板に形成された貫通孔に挿入される挿入部と、前記挿入部から延びる作業工具部とを備え、前記作業工具部は、前記挿入部の先端部から延びる挿入突出部と、前記挿入突出部の先端部に設けられ、この先端部から垂直に延びるヘラ部とを有することを特徴とする。   Furthermore, the mounting base forming tool according to claim 4 of the present invention includes a handle portion, and an insertion portion that is provided at a distal end portion of the handle portion and is inserted into a through hole formed in the surface plate of the hollow wall structure. A work tool portion extending from the insertion portion, the work tool portion being provided at an insertion protrusion extending from a distal end portion of the insertion portion and a distal end portion of the insertion protrusion, and extending vertically from the distal end portion. It has a spatula part.

本発明の請求項1に記載の取付下地の形成方法によれば、表面板に形成した貫通孔の内周面とこの表面板の裏面に硬化型樹脂を圧着する(第1樹脂層形成工程、第2樹脂層形成工程)ので、流動性の少ない濡れ性の悪い樹脂を貫通孔通して表面板内部へ押し込んだ時に落下させずに第3樹脂層を形成することができる。それによって、中空部材のネジ類の取付部に小さな貫通孔を開けるだけで大きな部品挿入口を必要とせず、表面板の強度を落とすことなく大きな強度保持面積により表面板の強度低下を抑えて下地とすることが出来るものである。   According to the method for forming a mounting base according to claim 1 of the present invention, a curable resin is pressure-bonded to the inner peripheral surface of the through hole formed in the surface plate and the back surface of the surface plate (first resin layer forming step, The second resin layer forming step) allows the third resin layer to be formed without being dropped when a resin having low fluidity and poor wettability is pushed through the through-hole into the surface plate. As a result, a large through hole is not required just by opening a small through hole in the mounting portion of the screw of the hollow member, and the strength reduction of the surface plate is suppressed by a large strength holding area without reducing the strength of the surface plate. It can be said that.

また、貫通孔の周りにのみネジ類を保持できる硬質樹脂を形成するので、下地がネジ類の位置に対応して正確に構築され、最小限の硬質樹脂により無駄も生じない効率的な取付下地を構築できる効果がある。   In addition, since a hard resin that can hold screws only around the through hole is formed, the base is constructed accurately according to the position of the screws, and an efficient mounting base that does not waste with the minimum hard resin There is an effect that can be built.

更に、貫通孔は取付けるべき設置部品により覆われるので、表面板の表面の美観も損なわない効果がある。万一取り外した時も、部品を挿入するための挿入口などの貫通穴を開けないので補修が最小限である。   Furthermore, since the through hole is covered with the installation parts to be attached, there is an effect that the aesthetic appearance of the surface plate is not impaired. In the unlikely event that it is removed, the through hole such as the insertion port for inserting the part cannot be opened, so that the repair is minimal.

また、本発明の請求項2に記載の取付下地の形成方法によれば、取手部とこの取手部の先端部に設けられた挿入部と、この挿入部に設けられた作業工具部とを備えているので、挿入部を貫通孔に挿入して取手部を表面板の表面に押し当てて塗布作業を行うことにより、硬化型樹脂を第2樹脂層の表面に所定厚さに塗布し第3樹脂層を容易に形成することができる。   Further, according to the method for forming the mounting base of the second aspect of the present invention, it is provided with a handle portion, an insertion portion provided at a tip portion of the handle portion, and a work tool portion provided in the insertion portion. Therefore, the curable resin is applied to the surface of the second resin layer to a predetermined thickness by inserting the insertion portion into the through hole and pressing the handle portion against the surface of the surface plate to perform the coating operation. The resin layer can be easily formed.

また、本発明の請求項3に記載の取付下地の形成方法によれば、この取付下地形成工具を引きながら回転することで、挿入された作業工具部のヘラ部が貫通孔に入れられた硬化型樹脂を表面板の裏面に容易に圧着させることができる。   Further, according to the method for forming the mounting base according to claim 3 of the present invention, the spatula portion of the inserted work tool portion is placed in the through hole by rotating while pulling the mounting base forming tool. The mold resin can be easily crimped to the back surface of the front plate.

また、本発明の請求項4に記載の取付下地形成工具によれば、取手部の先端部に挿入部が設けられ、この挿入部の先端部に作業工具部が設けられているので、取手部が表面板に当接することによって、一定以上の表面板の貫通孔への進入を止めることができ、これによって、表面板と作業工具部のヘラ部との距離を一定に保ち必要な強度を発揮できる厚さの第3樹脂層を形成することができる。これは作業の安定性及び確実性を実現するものである。また、作業工具部のヘラ部を利用することにより、硬化型樹脂を表面板の裏面に圧着して第2樹脂層を容易に形成することができ、これによって硬化型樹脂の落下を防止して所定厚さの第3樹脂層を形成することができる。   According to the mounting base forming tool of claim 4 of the present invention, the insertion portion is provided at the distal end portion of the handle portion, and the work tool portion is provided at the distal end portion of the insertion portion. By contacting the surface plate, it is possible to stop the surface plate from entering the through-hole of a certain level or more, thereby maintaining the distance between the surface plate and the spatula portion of the work tool unit to provide the required strength. A third resin layer having a possible thickness can be formed. This realizes the stability and certainty of the work. In addition, by using the spatula portion of the work tool portion, the second resin layer can be easily formed by pressure-bonding the curable resin to the back surface of the front plate, thereby preventing the curable resin from dropping. A third resin layer having a predetermined thickness can be formed.

本発明に従う取付下地の形成方法を適用して手摺りを取り付けた状態を示す断面図。Sectional drawing which shows the state which applied the formation method of the attachment base | substrate according to this invention, and attached the handrail. 表面板に貫通孔を形成した状態を示す簡略断面図。The simplified sectional view showing the state where the through hole was formed in the surface plate. 貫通孔の内周面に塗付け棒を用いて硬化型樹脂を圧着させて第1樹脂層を形成した状態を示す簡略断面図。FIG. 3 is a simplified cross-sectional view showing a state in which a first resin layer is formed by press-bonding a curable resin to the inner peripheral surface of a through hole using a coating rod. 第2樹脂層を形成するための硬化型樹脂を貫通孔に注入した状態を示す簡略断面図。The simplified sectional view showing the state where curable resin for forming the 2nd resin layer was poured into the penetration hole. 貫通孔を通して取付下地形成工具の作業工具部を挿入した状態を示す簡略断面図。The simplified sectional view which shows the state which inserted the work tool part of the attachment base | substrate formation tool through the through-hole. 本発明に従う取付下地形成工具の一実施形態を示す正面図。The front view which shows one Embodiment of the attachment base | substrate formation tool according to this invention. 図6の取付下地形成工具を貫通孔を通して挿入していく状態を示す簡略断面図。FIG. 7 is a simplified cross-sectional view showing a state where the attachment base forming tool of FIG. 6 is inserted through a through hole. 貫通孔の裏面に硬化型樹脂を圧着させて第2樹脂層を形成した状態を示す簡略断面図。The simplified sectional view showing the state where the 2nd resin layer was formed by pressure-bonding curable resin to the back of a penetration hole. 第3樹脂層を形成するための硬化型樹脂を貫通孔を通して注入した状態を示す簡略断面図。The simplified sectional view showing the state where curable resin for forming the 3rd resin layer was poured through the penetration hole. 貫通孔を通して取付下地形成工具を挿入した状態を示す簡略断面図。The simplified sectional view showing the state where the attachment foundation formation tool was inserted through the through hole. 表面板の裏面の第2樹脂層の表面に第3樹脂層を形成した状態を示す簡略断面図。The simplified sectional view showing the state where the 3rd resin layer was formed in the surface of the 2nd resin layer of the back of a surface board. 取付壁部を形成するための硬化型樹脂を貫通孔を通して注入した状態を示す簡略断面図。The simplified sectional view which shows the state which inject | poured curable resin for forming an attachment wall part through a through-hole. 手すりブラケットを取り付けるためのネジの下穴を設けた状態を示す簡略断面図。The simplified sectional view which shows the state which provided the pilot hole of the screw for attaching a handrail bracket.

以下、添付図面を参照して、本発明に従う取付下地の形成方法の一実施形態及びこれに用いる取付下地形成工具の一実施形態について説明する。   Hereinafter, with reference to an accompanying drawing, one embodiment of the formation method of the attachment foundation according to the present invention and one embodiment of the attachment foundation formation tool used for this are described.

まず、図1を参照して、この取付下地の形成方法を用いて、設置部材としての手摺りを取り付けた状態を説明する。図1において、この実施形態では、間仕切り壁(図示せず)の表面側に表面板1が配設され、この間仕切り壁と表面板1との間に中空空間101が設けられ、この中空空間101に常温硬化型樹脂を注入して取付壁部17が形成され、この取付壁部17を利用して手摺り21を取り付けるためのブラケット19が取り付けられる。   First, with reference to FIG. 1, the state which attached the handrail as an installation member using this formation method of an attachment base is demonstrated. In FIG. 1, in this embodiment, a surface plate 1 is disposed on the surface side of a partition wall (not shown), and a hollow space 101 is provided between the partition wall and the surface plate 1. A mounting wall portion 17 is formed by injecting a room-temperature curable resin into the bracket, and a bracket 19 for mounting the handrail 21 is attached using the mounting wall portion 17.

中空空間101を有する中空壁構造102の表面側に配設される表面板1の所定部位に貫通孔2が設けられ、この貫通孔2の内周面に第1樹脂層10が設けられ、また表面板1の裏面における貫通孔2の周囲には第2樹脂層14が設けられ、更に第2樹脂層14の表面側に第3樹脂層16が設けられ、第1、第2及び第3樹脂層10,14,16の内側に取付壁部17が設けられ、これら第1〜第3樹脂層10,14,16及び取付壁部17は常温硬化型樹脂から形成される。   A through hole 2 is provided at a predetermined portion of the surface plate 1 disposed on the surface side of the hollow wall structure 102 having the hollow space 101, and a first resin layer 10 is provided on the inner peripheral surface of the through hole 2. A second resin layer 14 is provided around the through-hole 2 on the back surface of the front plate 1, and a third resin layer 16 is further provided on the surface side of the second resin layer 14, and the first, second, and third resins are provided. A mounting wall portion 17 is provided inside the layers 10, 14, and 16, and the first to third resin layers 10, 14, 16 and the mounting wall portion 17 are formed of a room temperature curable resin.

取付壁部17(実施形態では2つ示す)に対応して、ブラケット19の取付部103が位置付けられ、この取付部103に設けられた孔を通して取付壁部17にネジ20を螺着することによって、ブラケット19が取付壁部17、即ち表面板1に取り付けられる。表面板1には、上述したようして複数のブラケット19が間隔をおいて取り付けられ、手摺り21はこれらブラケット19に所要の通りに取り付けられる。   Corresponding to the mounting wall portion 17 (two shown in the embodiment), the mounting portion 103 of the bracket 19 is positioned, and screws 20 are screwed onto the mounting wall portion 17 through holes provided in the mounting portion 103. The bracket 19 is attached to the attachment wall portion 17, that is, the surface plate 1. As described above, the plurality of brackets 19 are attached to the surface plate 1 at intervals, and the handrail 21 is attached to these brackets 19 as required.

このような手摺りの取り付けは、図2〜図13に示すように、例えば次の通りの施工手順に従って行うことができる。まず、図2に示すように、室内の内壁を構成する表面板1に貫通孔2を形成する(孔形成工程)。この貫通孔2は、直径が例えば10mm程度となるように形成する。   Such a handrail can be attached according to the following construction procedure, for example, as shown in FIGS. First, as shown in FIG. 2, the through-hole 2 is formed in the surface board 1 which comprises the inner wall of a room (hole formation process). The through hole 2 is formed so that the diameter is, for example, about 10 mm.

貫通孔2を開ける時の直径は5mm以上とし、好ましくは8mmから15mmが望ましい。直径が5mm以下では、十分に拡幅できる取付下地形成工具(後述する)の挿入が難しく、表面板1の裏面3側に形成する樹脂の必要量を供給するために何回も押し込む作業が必要になり、その作業性が悪く、また荷重がかかった時に樹脂部が変形せずに形状を保持できなく、必要な面積も確保し難い。直径が20mm以上では、多くの場合に貫通孔2がブラケット19の取付部103からはみ出て外観を損なう可能性があり、また注入する樹脂量も必要以上に多くなり無駄である。   The diameter when opening the through-hole 2 is 5 mm or more, preferably 8 to 15 mm. When the diameter is 5 mm or less, it is difficult to insert a mounting base forming tool (to be described later) that can be sufficiently widened, and it is necessary to push in several times to supply the required amount of resin formed on the back surface 3 side of the front plate 1. Therefore, the workability is poor, and when a load is applied, the resin portion does not deform and the shape cannot be maintained, and it is difficult to secure a necessary area. If the diameter is 20 mm or more, in many cases, the through-hole 2 may protrude from the mounting portion 103 of the bracket 19 and impair the appearance, and the amount of resin to be injected is unnecessarily large and is useless.

次に、図3に示すように、常温硬化型樹脂を丸棒11の先に付け、この丸棒11の先端部を貫通孔2に挿入して回転及び前後に動かし、先端についた常温硬化型樹脂を貫通孔2の内周面22に擦り付けて圧着し、その内周面22の全域に第1樹脂層10を形成する(第1樹脂層形成工程)。ここで用いる丸棒11は、貫通孔2の直径未満で樹脂の入る隙間のできる直径であれば良く、取付下地形成工具(後述する)を利用することもできる。また、丸棒でなくても樹脂を擦り付ける(即ち、貫通孔2の内周面22に圧着する)ことができるものであれば形状に拘るものではない。   Next, as shown in FIG. 3, a room temperature curable resin is attached to the tip of the round bar 11, and the tip of the round bar 11 is inserted into the through hole 2 and rotated and moved back and forth. Resin is rubbed against the inner peripheral surface 22 of the through-hole 2 and pressed to form the first resin layer 10 over the entire inner peripheral surface 22 (first resin layer forming step). The round bar 11 used here only needs to have a diameter that is less than the diameter of the through-hole 2 and allows a resin to enter, and an attachment base forming tool (described later) can also be used. Further, the shape is not limited as long as the resin can be rubbed (that is, pressure-bonded to the inner peripheral surface 22 of the through hole 2) without being a round bar.

ここで使用される常温硬化型樹脂とは、エポキシ系樹脂、ウレタンアクリレート系樹脂、エポキシアクリレート系樹脂、ポリエステル系樹脂、ウレタン樹脂などが望ましく、常温反応型として使用することが望ましい。湿気硬化機能を付与した光硬化型や局部的な加熱硬化型も使用可能である。湿気硬化型にはスプレータイプもあり作業性の点からは望ましいが、常温でネジが打てる強度に達する時間は6時間以内でないと作業が翌日にまたがるので望ましくない。   The room temperature curable resin used here is preferably an epoxy resin, a urethane acrylate resin, an epoxy acrylate resin, a polyester resin, a urethane resin, or the like, and is preferably used as a room temperature reaction type. A photo-curing type having a moisture curing function or a local heat-curing type can also be used. The moisture-curing type has a spray type, which is desirable from the viewpoint of workability. However, it is not desirable because the time required to reach the strength at which the screw can be hit at room temperature is not within 6 hours, because the work spans the next day.

また、前記における常温硬化型樹脂の粘度(チキソ性含む)は、取付壁部17を形成するための貫通孔2に樹脂を押し込むので、押し込んでから押し広げる工程に入るまで垂れないような流動性のないものでなければならない。また、表面板1の裏面3側に樹脂層形成後も硬化するまでその形状が変化せず、形状が維持できるものでなければならない。   Further, the viscosity (including thixotropy) of the room temperature curable resin described above is such that the resin is pushed into the through-hole 2 for forming the mounting wall portion 17 so that it does not drip until it enters the step of spreading after pushing. It must be without. Moreover, the shape should not be changed until the resin layer is cured on the back surface 3 side of the front plate 1 until it is cured, and the shape must be maintained.

そして、硬化後の樹脂硬度及び接着強度は、荷重がかかった時に表面板1の裏面3側及び貫通孔2の内周面22の局部に荷重がかからない様にしなければならない。そのためには、形成された取付下地、即ち取付壁部17が負荷のかかった時に表面板1の破壊につながる変形を起こさない接着強度及び硬度が必要で、裏面3側の全体に荷重が分散される必要がある。ショアー硬度Dで50以上、好ましくは70以上が必要である。   The cured resin hardness and adhesive strength must be such that no load is applied to the back surface 3 side of the front plate 1 and the inner peripheral surface 22 of the through hole 2 when a load is applied. For this purpose, it is necessary to have an adhesive strength and hardness that do not cause deformation leading to the destruction of the surface plate 1 when the formed mounting base, that is, the mounting wall portion 17 is loaded, and the load is distributed to the entire back surface 3 side. It is necessary to The Shore hardness D must be 50 or more, preferably 70 or more.

次に、図4に示すように、取付壁部17のための貫通孔2に常温硬化型樹脂12をヘラ(図示せず)などを用いて押し付け圧入し、この圧入した常温硬化型樹脂12でもって第2樹脂層14を形成する(第2樹脂層形成工程)。圧入された常温硬化型樹脂12は、貫通孔2の内周面22に圧着された第1樹脂層10と一体となって貫通孔2を塞ぎ、余分の樹脂は表面板1の裏面3側にはみ出すような状態となる。   Next, as shown in FIG. 4, the room temperature curable resin 12 is pressed and pressed into the through hole 2 for the mounting wall portion 17 using a spatula (not shown). Thus, the second resin layer 14 is formed (second resin layer forming step). The cold-cured resin 12 that has been press-fitted together with the first resin layer 10 that is pressure-bonded to the inner peripheral surface 22 of the through-hole 2 closes the through-hole 2, and excess resin is placed on the back surface 3 side of the surface plate 1. It will be in a state that protrudes.

そして、図5に示すように、注入された常温硬化型樹脂12を通して取付下地形成工具104を挿入させる。この時、垂れないように選ばれた高粘度樹脂は濡れ性が悪く、図3の第1樹脂層形成工程無しでは挿入時に取付下地形成工具104が圧入した樹脂12を押し落としてしまう。しかし、擦り付けて圧着された第1樹脂層10と馴染むことにより落下することなく保持される。そして、取付下地形成工具104を引きながら回転させることにより、取付下地形成工具104の傾斜のあるヘラ部4で圧入された樹脂12を貫通孔2の裏面3に擦り付けて圧着させる。   Then, as shown in FIG. 5, the attachment base forming tool 104 is inserted through the injected room temperature curable resin 12. At this time, the high-viscosity resin selected so as not to drip is poor in wettability, and without the first resin layer forming step of FIG. However, the first resin layer 10 that has been rubbed and pressure-bonded is fitted to the first resin layer 10 without being dropped. Then, by rotating the mounting base forming tool 104 while pulling, the resin 12 press-fitted by the inclined spatula portion 4 of the mounting base forming tool 104 is rubbed against the back surface 3 of the through-hole 2 and pressed.

ここで図6及び図7を参照して、取付下地形成工具104について説明する。図6に示すように、この取付下地形成工具104は、全体として略L字状構造であるが、貫通孔2に挿入した後に開帳する構造のもでもよい。この取付下地形成孔具104は、構造が単純な図6で示すL字形状のものが好ましい。この取付下地形成工具104は、作業時に把持する取手部9と、取手部9の先端部に設けられた挿入部7と、この挿入部7の先端部に設けられた作業工具部5とを備えている。取手部9は挿入部7よりも外形が大きく、この取手部9と挿入部7との間に段部が設けられ、この段部によって当接面6が規定され、かかる当接面6が表面板1の表面に当接するようになる。   Here, the attachment base forming tool 104 will be described with reference to FIGS. As shown in FIG. 6, the attachment base forming tool 104 has a substantially L-shaped structure as a whole, but may have a structure in which the book is opened after being inserted into the through hole 2. The mounting base forming hole 104 is preferably L-shaped as shown in FIG. The attachment base forming tool 104 includes a handle portion 9 to be gripped during work, an insertion portion 7 provided at the distal end portion of the handle portion 9, and a work tool portion 5 provided at the distal end portion of the insertion portion 7. ing. The handle portion 9 has an outer shape larger than that of the insertion portion 7, and a step portion is provided between the handle portion 9 and the insertion portion 7, and the contact surface 6 is defined by the step portion, and the contact surface 6 is displayed. It comes into contact with the surface of the face plate 1.

挿入部7の外径は、表面板1に形成された貫通孔2の内径に対応し、この挿入部7が貫通孔2に挿入される。作業工具部5は、略L字状であり、挿入部7の先端部から直線状に伸びる挿入突出部8と、この挿入突出部8から垂直に横方向に伸びるヘラ部4とを有し、このヘラ部4の内側に傾斜のあるヘラ作用部105が設けられている。   The outer diameter of the insertion portion 7 corresponds to the inner diameter of the through hole 2 formed in the surface plate 1, and the insertion portion 7 is inserted into the through hole 2. The work tool portion 5 is substantially L-shaped, and has an insertion protrusion 8 that extends linearly from the distal end of the insertion portion 7, and a spatula portion 4 that extends vertically from the insertion protrusion 8 in a lateral direction. An inclined spatula action part 105 is provided inside the spatula part 4.

ヘラ部4は常温硬化型樹脂12を押し広げるため傾斜を持ち、その長手方向の長さは必要な強度に合わせて調整し回転半径を変えることで荷重分散面積を調整することが出来る。その長さは、回転直径が15mm以上のもの、望ましくは30mm以上のものであるのが好ましい。その長さが15mm以下である場合、表面板1として石膏ボードや薄い合板のときには部材強度が低く、手すりなどの用途に使用することが難しい。多くの特許が出されているが、それは部材に対し取付ネジ部周辺だけの引っ掛かりを作り抵抗を多くして強度を上げるものであり、脆い石膏ボードや薄い合板では一定以上の強度向上を望めるものではない。局部的に負荷のかかる方法では十分な強度を出すことが出来ない。   The spatula 4 has an inclination to spread the room temperature curable resin 12, and the length in the longitudinal direction is adjusted according to the required strength, and the load distribution area can be adjusted by changing the rotation radius. The length is preferably that having a rotational diameter of 15 mm or more, desirably 30 mm or more. When the length is 15 mm or less, when the surface plate 1 is a gypsum board or a thin plywood, the member strength is low, and it is difficult to use it for applications such as handrails. Although many patents have been issued, it is intended to increase the strength by increasing the resistance by creating a catch only around the mounting screw part of the member, and it can be expected to improve the strength beyond a certain level in brittle gypsum board and thin plywood is not. A locally loaded method cannot provide sufficient strength.

この作業工具部5は、貫通孔2への挿入部7をガイドとすることにより均一に回転することが出来る。ヘラ部4のヘラ作用部105と表面板1の裏面3との距離(即ち、第3樹脂層16の厚さ)を調整する為に、脱着可能な厚さ調整部材(図子せず)を使用することもでき、このような厚さ調整部材を用いることによって、第3樹脂層16の厚さを調整することができ、また表面板1としての石膏ボードや合板など厚みの異なる部材にも対応することができる。   The work tool portion 5 can be rotated uniformly by using the insertion portion 7 to the through hole 2 as a guide. In order to adjust the distance between the spatula action part 105 of the spatula part 4 and the back surface 3 of the front plate 1 (that is, the thickness of the third resin layer 16), a removable thickness adjusting member (not shown) is attached. By using such a thickness adjusting member, the thickness of the third resin layer 16 can be adjusted, and also for a member having a different thickness such as a plaster board or plywood as the surface plate 1 Can respond.

この取付下地形成工具104は、図7に示すように、L字状構造の取付下地形成工具104の作業工具部5を90度回転しながら挿入することでヘラ部4を表面板1の裏面3側に挿入することができる。   As shown in FIG. 7, the attachment base forming tool 104 is configured such that the spatula portion 4 is inserted into the back surface 3 of the front plate 1 by inserting the work tool portion 5 of the L-shaped structure attachment base formation tool 104 while rotating 90 degrees. Can be inserted to the side.

そして、図8に示すように、取付下地形成工具104を手前側(図5において右側)に引いて作業工具部5を回転させることによって、ヘラ部4によって常温硬化型樹脂12を表面板1の裏面3に擦り付けて圧着してこの裏面3に第2樹脂層14が形成される。この時、圧着する常温硬化型樹脂の量は少量で良く、ヘラ部4の回転径内の表面板1の裏面3に擦り込まれる程度でよい。   Then, as shown in FIG. 8, by pulling the attachment base forming tool 104 toward the front side (right side in FIG. 5) and rotating the work tool part 5, the spatula part 4 attaches the room temperature curable resin 12 to the surface plate 1. The second resin layer 14 is formed on the back surface 3 by being rubbed and pressure-bonded to the back surface 3. At this time, the amount of the room-temperature curable resin to be pressure-bonded may be small and may be rubbed against the back surface 3 of the surface plate 1 within the rotation diameter of the spatula portion 4.

次に、図9に示すように、取付下地形成工具104を表面板1の貫通孔2から引き抜き、図4の第2樹脂層形成工程と同様にして常温硬化型樹脂15を注入し、次のようにして第3樹脂層16を形成する(第3樹脂層形成工程)。   Next, as shown in FIG. 9, the mounting base forming tool 104 is pulled out from the through hole 2 of the surface plate 1, and the room temperature curable resin 15 is injected in the same manner as in the second resin layer forming step of FIG. Thus, the third resin layer 16 is formed (third resin layer forming step).

図10に示すように、取付下地形成工具104を上述したようにして貫通孔2を通して挿入し、かく挿入することによって、圧入された常温硬化型樹脂15を更に押し込み、取付下地形成工具104を押しながら回転させることにより取付下地形成工具104の傾斜のあるヘラ部4で圧入された常温硬化型樹脂15を表面板1の裏面3の圧着された第2樹脂層14に馴染ませながら押し広げ、第2樹脂層14の表面に第3樹脂層16を形成する。この時、濡れ性の少ない高粘度樹脂でも擦り付けて圧着された第2樹脂層14により落下することなく保持される。必要な樹脂厚を確保するために、図9及び図10の工程を複数回繰り返す。この時の回数は、表面板1の厚さや材質強度、貫通孔2の口径などにより変えることができる。   As shown in FIG. 10, the mounting base forming tool 104 is inserted through the through-hole 2 as described above, and by inserting it, the press-fitted room temperature curable resin 15 is further pressed, and the mounting base forming tool 104 is pressed. The room temperature curable resin 15 press-fitted by the inclined spatula portion 4 of the mounting base forming tool 104 is rotated and spread while adhering to the second resin layer 14 to which the back surface 3 of the front plate 1 is pressed. The third resin layer 16 is formed on the surface of the second resin layer 14. At this time, even a highly viscous resin with low wettability is held without falling by the second resin layer 14 rubbed and pressure-bonded. In order to secure the necessary resin thickness, the steps of FIGS. 9 and 10 are repeated a plurality of times. The number of times at this time can be changed according to the thickness and material strength of the surface plate 1, the diameter of the through hole 2, and the like.

このようにして、図11に示すように、取付下地形成工具104の回転によって注入した常温硬化型樹脂15が押し広げられて第3樹脂層16が形成される。これは取付下地形成工具104のヘラ部4の表面板1の裏面3側の当り面から表面板1の当たり面部、即ち取手部9の当接面6までの距離によって、第3樹脂樹層16が所定の厚さに形成され、このようにして第1〜第3樹脂層10,14,16が一体となる。   In this way, as shown in FIG. 11, the room temperature curable resin 15 injected by the rotation of the mounting base forming tool 104 is spread and the third resin layer 16 is formed. This depends on the distance from the contact surface on the back surface 3 side of the front plate 1 of the spatula portion 4 of the mounting base forming tool 104 to the contact surface portion of the front surface plate 1, that is, the contact surface 6 of the handle portion 9. Is formed to a predetermined thickness, and the first to third resin layers 10, 14, and 16 are united in this manner.

次に、図12に示すように、取付下地形成工具104を引き抜き、引き抜かれた時にできた空間に図4に示すときと同様にして常温硬化型樹脂を充填して取付壁部17を形成する(壁部形成工程)。このようにして、第1〜第3樹脂層10,14,16と取付壁部17とが一体的となり、表面板1の貫通孔2に取付下地、即ち取付壁部17が形成され、所定の時間常温で放置し十分な強度が発現するまで養生する。   Next, as shown in FIG. 12, the attachment base forming tool 104 is pulled out, and the space formed when it is pulled out is filled with room temperature curable resin in the same manner as shown in FIG. (Wall part formation process). In this way, the first to third resin layers 10, 14, 16 and the mounting wall portion 17 are integrated, and the mounting base, that is, the mounting wall portion 17 is formed in the through hole 2 of the surface plate 1. Leave it at room temperature for a while until it is sufficiently strong.

次に、図13に示すように、形成された取付壁部17(即ち、取付下地)が養生され十分な強度が発現した後に、この取付壁部17に下穴18を形成する。このように下穴18を空けることで、ネジ20を打ち込んだ時に発生する可能性のある形成された取付下地の割れを防止することができる。この下穴18の径は使用するネジ20により調整される。尚、下穴18は必ずしも必要なものではなく、取付ネジ(図子せず)などを用いてブラケット19を取り付ける場合などにおいては、省略することもできる。   Next, as shown in FIG. 13, after the formed mounting wall portion 17 (that is, the mounting base) is cured and has sufficient strength, a pilot hole 18 is formed in the mounting wall portion 17. By making the pilot hole 18 in this way, it is possible to prevent cracking of the formed mounting base that may occur when the screw 20 is driven. The diameter of the pilot hole 18 is adjusted by the screw 20 to be used. The pilot hole 18 is not always necessary, and may be omitted when the bracket 19 is attached using an attachment screw (not shown).

この取付下地(即ち、取付壁部17)は中空壁構造102に対し使用される。それは、2枚の表面板間に桟材を介して構成した中空壁構造、あるいはコンクリート面にモルタルや桟材を介して表面板を貼った中空壁構造、あるいは同様の中空壁構造の天井、床、又はドア等の建具などにも適用することができる。   This mounting base (that is, the mounting wall portion 17) is used for the hollow wall structure 102. It is a hollow wall structure that is configured with a crosspiece between two surface plates, or a hollow wall structure in which a surface plate is pasted on a concrete surface with a mortar or crosspiece, or a similar hollow wall structure ceiling, floor. It can also be applied to joinery such as doors.

また、上述したようにして形成した取付下地(取付壁部17)に取り付ける設置部材とは、ネジ類により表面板1に固定される部材であればその種類を問わない。例えば、中空壁構造102が壁であれば、手摺、各種金具、各種造作材等の設置部材であり、天井であれば照明器具等の設置部材であり、また床であれば、強度付加下地材等の設置部材などである。   Moreover, the installation member attached to the attachment base (attachment wall part 17) formed as mentioned above will not ask | require the kind if it is a member fixed to the surface board 1 with screws. For example, if the hollow wall structure 102 is a wall, it is an installation member for handrails, various metal fittings, various construction materials, etc., if it is a ceiling, it is an installation member for lighting equipment, etc., and if it is a floor, a strength-added base material And the like.

上述した実施形態については、硬化型樹脂として常温硬化型樹脂を用いて説明したが、これに限定される事無く加熱硬化型樹脂及び光硬化型樹脂、電子線硬化型樹脂なども用いる事ができる。
また、簡易的なヘラ(図示せず)などを用いて押し付け圧入での方法を用いて説明したが、取付下地形成工具104のヘラ部4 挿入部7 挿入突出部8 取手部9のそれぞれの内部に連続した樹脂注入孔を設け硬化型樹脂を注入する事もできる。
The above-described embodiment has been described using a room temperature curable resin as the curable resin, but the present invention is not limited to this, and a heat curable resin, a photo curable resin, an electron beam curable resin, and the like can also be used. .
Moreover, although it demonstrated using the method of press-fitting using a simple spatula (not shown) etc., the spatula part 4 of the attachment base | substrate formation tool 104 Insertion part 7 Insertion protrusion part 8 Each inside of the handle part 9 A continuous resin injection hole may be provided to inject a curable resin.

本発明に従う取付下地の形成方法の効果を確認するために、次の通りにして施工確認を行った。   In order to confirm the effect of the method for forming the mounting base according to the present invention, the construction was confirmed as follows.

まず、厚さ12.5mmの石膏ボーにドリルで直径10mmの貫通孔2を開けた。そして、6.5cc/穴当たりの混合された2液常温硬化型エポキシ系樹脂をつくり、丸棒の先端部に付け、て貫通孔の内周面に擦り付けて第1樹脂層を形成した。丸棒の直径が5mmであり、その先端部に0.1cc付け、貫通孔の内周面に回転及び前後に動かしながら擦り付け、貫通孔の内周面の全体が樹脂の色になっていることを確認した。   First, a through hole 2 having a diameter of 10 mm was drilled in a gypsum bow having a thickness of 12.5 mm. Then, a mixed two-component room temperature curable epoxy resin per 6.5 cc / hole was made, applied to the tip of the round bar, and rubbed against the inner peripheral surface of the through hole to form a first resin layer. The diameter of the round bar is 5mm, 0.1cc is attached to the tip, and the inner peripheral surface of the through hole is rubbed while rotating and moving back and forth, and the entire inner peripheral surface of the through hole is colored resin It was confirmed.

次に、混合された2液常温硬化型エポキシ系樹脂を1.5ccヘラに取り、貫通孔に押し付け圧入し、この貫通孔を塞ぐように充填した。そして、取付下地形成工具の作業工具部を貫通孔を通して挿入し、引きながら回転させることで充填した樹脂を表面板の裏面に擦り付けた。1回の作業では十分広がらないのでもう一度0.8ccの樹脂をヘラに取り、貫通孔に押し付け注入し、1回目の作業と同様にして取付下地形成工具を使い、表面板の裏面側に擦り付け、このようにして第2樹脂層を形成した。この作業により、第2樹脂層樹脂14が薄く形成された。   Next, the mixed two-component room temperature curable epoxy resin was taken on a 1.5 cc spatula, pressed into the through hole, and press-fitted to fill the through hole. Then, the work tool portion of the mounting base forming tool was inserted through the through hole, and the resin filled by rotating while pulling was rubbed against the back surface of the front plate. Since it does not spread enough in one operation, take 0.8 cc of resin on the spatula, press it into the through hole, inject it, and rub against the back side of the surface plate using the mounting base forming tool in the same way as the first operation. In this way, a second resin layer was formed. By this operation, the second resin layer resin 14 was thinly formed.

その後、混合された2液常温硬化型エポキシ系樹脂を0.8ccヘラに取り、貫通孔に押し付けて注入し、上述したと同様にして取付下地形成工具を挿入し、この工程では、押しながら回転させる(取付下地形成工具の当接面を表面板の表面に押し当てた状態で回転させる)ことにより、一定の樹脂厚の第3樹脂層を表面板の裏面(第2樹脂層の表面)に形成することができた。一回の作業では十分な樹脂量ではないので、再度混合された2液常温硬化型エポキシ系樹脂を再度0.8ccヘラに取り、貫通孔に押し付け圧入し、取付下地形成工具を挿入し押しながら回転させた。このようにして十分な下地強度を有する下地厚さの第3樹脂層を形成することができた。   Then, the mixed two-component room temperature curing type epoxy resin is taken in a 0.8 cc spatula, pressed into the through hole and injected, and the mounting base forming tool is inserted in the same manner as described above. The third resin layer having a constant resin thickness is applied to the back surface of the front plate (the surface of the second resin layer). Could be formed. Since the amount of resin is not enough in one operation, take the two-component room temperature curing type epoxy resin mixed again into a 0.8cc spatula, press it into the through hole, press fit, and insert and press the mounting base forming tool. Rotated. In this way, it was possible to form the third resin layer having the base thickness having sufficient base strength.

中央に取付下地形成工具の引き抜いた跡穴が出来ているので、それを埋める分とネジ部の接触面積を十分確保するために、更に、1.5ccの混合された2液常温硬化型エポキシ系樹脂をヘラで部品取付部の貫通孔に押し付けて充填した。これまでの作業は文章にすると多くの工程があるように思うが単純な同じ作業の繰り返しなので7分/穴程度の作業時間で形成することができ、比較的簡単な作業であった。   Since there is a trace hole in the center where the mounting base forming tool is pulled out, in order to ensure sufficient contact area between the screw part and the part to be filled, 1.5 cc mixed two-component room temperature curing epoxy system Resin was filled with a spatula by pressing against the through hole of the component mounting portion. The work so far seems to have many processes when written in sentences, but since it is a simple repetition of the same work, it can be formed in a work time of about 7 minutes / hole and was a relatively simple work.

硬化するまで約1時間放置し、十分な硬さになった取付下地(取付壁部)に2.8mmのドリルで下穴を開け、手すりブラケットを直径3,2mmのネジ20で取り付けた。硬化時間は25℃1時間で完了し、最終強度に達する24時間の養生後手すりの強度として必要な鉛直及び水平荷重120kgfに耐える強度を得た。   It was allowed to stand for about 1 hour until it hardened, a pilot hole was drilled with a 2.8 mm drill in the mounting base (mounting wall portion) that had become sufficiently hard, and a handrail bracket was attached with screws 20 having a diameter of 3 or 2 mm. The curing time was completed at 25 ° C. for 1 hour, and the strength to withstand vertical and horizontal loads of 120 kgf required as the strength of handrails for 24 hours after curing to reach the final strength was obtained.

テスト方法は、株式会社ベストHI営業部製の壁用ブラケットを使用し、上記方法にて900mmスパンで2か所固定した後24時間放置して手すりを設置し、中央部にて鉛直及び水平荷重テストを実施した。手すりの必要強度は財団法人ベターリビングの優良住宅部品性能試験方法書の規格試験方法を参考とした。   The test method uses a wall bracket made by Best HI Sales Co., Ltd., fixed at two locations with 900 mm span by the above method, left to stand for 24 hours, and vertical and horizontal loads at the center. A test was conducted. The required strength of the handrail was referred to the standard test method in the excellent housing part performance test method document of Better Living Foundation.

1 表面板
2 貫通孔
3 裏面
4 ヘラ部
5 作業工具部
6 当接面
7 挿入部
8 挿入突出部
9 取手部
10 第1樹脂層
11 丸棒
12 常温硬化型樹脂
14 第2樹脂層
15 常温硬化型樹脂
16 第3樹脂層
17 取付壁部
18 下穴
19 ブラケット
20 ネジ
21 手摺り
22 内壁
101中空空間
102中空壁構造
103取付部
104取付下地形成工具
105ヘラ作用部
DESCRIPTION OF SYMBOLS 1 Surface plate 2 Through-hole 3 Back surface 4 Spatula part 5 Work tool part 6 Contact surface 7 Insertion part 8 Insertion protrusion part 9 Handle part 10 1st resin layer 11 Round bar 12 Room temperature curable resin 14 2nd resin layer 15 Room temperature cure Mold resin 16 Third resin layer 17 Mounting wall portion 18 Pilot hole 19 Bracket 20 Screw 21 Handrail 22 Inner wall 101 Hollow space 102 Hollow wall structure 103 Mounting portion 104 Mounting base forming tool 105 Spatula action portion

Claims (4)

表面板の裏面側に中空空間が存在する中空壁構造に設置部材を取り付けるための取付下地を形成する形成方法であって、前記表面板の所定部位に貫通孔を形成する孔形成工程と、前記表面板の前記貫通孔の内周面に硬化型樹脂を圧着して第1樹脂層を形成する第1樹脂層形成工程と、前記第1樹脂層を形成した後に、前記貫通孔を通して前記中空空間に硬化型樹脂を入れて前記表面板の裏面に圧着して第2樹脂層を形成する第2樹脂層形成工程と、前記貫通孔を通して前記中空空間に硬化型樹脂を入れて前記第2樹脂層の表面に第3樹脂層を形成する第3樹脂層形成工程と、前記第1〜第3樹脂層に硬化型樹脂を充填して取付壁部を形成する壁部形成工程を含むことを特徴とする取付下地の形成方法。   A forming method for forming an attachment base for attaching an installation member to a hollow wall structure in which a hollow space exists on the back surface side of the surface plate, the hole forming step forming a through hole in a predetermined portion of the surface plate; A first resin layer forming step in which a first resin layer is formed by pressure-bonding a curable resin to an inner peripheral surface of the through hole of the surface plate; and after forming the first resin layer, the hollow space is formed through the through hole. And a second resin layer forming step of forming a second resin layer by pressure bonding to the back surface of the front plate, and the second resin layer by inserting the curable resin into the hollow space through the through hole. Including a third resin layer forming step of forming a third resin layer on the surface of the substrate and a wall forming step of forming a mounting wall portion by filling the first to third resin layers with a curable resin. A method for forming a mounting base. 前記第3樹脂層形成工程においては、硬化型樹脂を前記第2樹脂層の表面に塗布して所定厚さの前記第3樹脂層を形成するための取付下地形成工具が用いられ、前記取付下地形成工具は、取手部と、前記取手部の先端部に設けられ、前記貫通孔に挿入される挿入部と、前記挿入部から延びる作業工具部とを備え、前記作業工具部は、前記挿入部の先端部から延びる挿入突出部と、前記挿入突出部の先端部に設けられ、この先端部から垂直に延びるヘラ部を有することを特徴とする請求項1に記載の取付下地の形成方法。   In the third resin layer forming step, a mounting base forming tool for applying a curable resin to the surface of the second resin layer to form the third resin layer having a predetermined thickness is used. The forming tool includes a handle portion, an insertion portion provided at a distal end portion of the handle portion and inserted into the through hole, and a work tool portion extending from the insertion portion, and the work tool portion includes the insertion portion. 2. The method of forming an attachment base according to claim 1, further comprising: an insertion protrusion extending from a distal end portion of the first protrusion portion; and a spatula portion provided at a distal end portion of the insertion protrusion portion and extending perpendicularly from the distal end portion. 前記取付下地形成工具は、前記第2樹脂形成工程においても用いられ、前記取手部を手前側に引いて前記ヘラ部を前記表面板の裏面に圧接させた状態にて前記ヘラ部を回動させて硬化型樹脂を前記表面板の裏面に圧着させることを特徴とする請求項2に記載の取付下地の形成方法。   The mounting base forming tool is also used in the second resin forming step, and rotates the spatula part in a state where the handle part is pulled toward the front side and the spatula part is pressed against the back surface of the front plate. The method for forming an attachment base according to claim 2, wherein the curable resin is pressure-bonded to the back surface of the front plate. 取手部と、前記取手部の先端部に設けられ、中空壁構造の表面板に形成された貫通孔に挿入される挿入部と、前記挿入部から延びる作業工具部とを備え、前記作業工具部は、前記挿入部の先端部から延びる挿入突出部と、前記挿入突出部の先端部に設けられ、この先端部から垂直に延びるヘラ部とを有することを特徴とする取付下地形成工具。
The work tool portion includes a handle portion, an insertion portion that is provided at a distal end portion of the handle portion and is inserted into a through hole formed in a surface plate having a hollow wall structure, and a work tool portion extending from the insertion portion. The mounting base forming tool characterized by having an insertion protrusion extending from the distal end portion of the insertion portion and a spatula portion provided at the distal end portion of the insertion protrusion and extending perpendicularly from the distal end portion.
JP2009211235A 2009-09-14 2009-09-14 Method for forming attachment backing, and attachment backing forming tool used for the same Pending JP2011058317A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009211235A JP2011058317A (en) 2009-09-14 2009-09-14 Method for forming attachment backing, and attachment backing forming tool used for the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009211235A JP2011058317A (en) 2009-09-14 2009-09-14 Method for forming attachment backing, and attachment backing forming tool used for the same

Publications (1)

Publication Number Publication Date
JP2011058317A true JP2011058317A (en) 2011-03-24

Family

ID=43946247

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009211235A Pending JP2011058317A (en) 2009-09-14 2009-09-14 Method for forming attachment backing, and attachment backing forming tool used for the same

Country Status (1)

Country Link
JP (1) JP2011058317A (en)

Similar Documents

Publication Publication Date Title
JP5896978B2 (en) Pinning method
JP5892936B2 (en) Building material board or building material board set, fixing system for building material board and method for fixing building material board
JP5334427B2 (en) Fixing structure to wall material and anchor bolt
JP6486122B2 (en) Wall body repair method
TW533260B (en) Fixing and adjusting tool of plate material
JP2011058317A (en) Method for forming attachment backing, and attachment backing forming tool used for the same
JP2006016952A (en) Anchor, method for temporarily fixing it, and temporary fixing structure using the same
JP6985717B2 (en) Pinning method
KR200407350Y1 (en) Building exterior materials and their construction
JP2008308926A (en) Tile, anchor tile, unit tile, method for manually laying tile, prefabricated form method for tile, and prefabricated pc-plate method for tile
JP3859471B2 (en) Method of attaching long element to lightweight cellular concrete member and lightweight cellular concrete member to which a long element is attached using the attachment method
JP3716397B2 (en) Method of forming mounting base on hollow member and mounting base of hollow member
JP2005023550A (en) Outer wall repairing anchor pin
JP2001081928A (en) Handrail mounting structure and its mounting method
WO2016084189A1 (en) Interior panel mounting structure and mounting method
CN216839992U (en) Wall body sound insulation structure applied to building engineering
JP2005054571A (en) Method for attaching long element to lightweight cellular concrete member, method for attaching the furring strip through the intermediary of long element, and method for attaching panel using the furring strip
JP2006193911A (en) Tile wall
JP2002303032A (en) Method and structure for mounting building member of building member mounting surface
JP2004275797A (en) Adhesive injector and method for injecting adhesive
JP3916467B2 (en) How to repair tile walls
JP2002339559A (en) Structure and construction method for mounting interior finish substrate board
JP2009216218A (en) Mounting member of bracket
JPH10159348A (en) Crack repairing method for cement board
JP2006077435A (en) Panel mounting method and panel mounting structure