JP2011029565A - Substrate holding device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate holding device preventing generation of local stress acting on a glass substrate in lifting up or lifting down the glass substrate, and resultantly preventing damage of a thin film formed on a surface of the glass substrate and a crack of the glass substrate itself. <P>SOLUTION: In this substrate holding device, a substrate being a processing object is transported to the upper side of a substrate holding surface by a substrate transport arm, and thereafter mounted on the substrate holding surface, and the substrate is sucked and held. The substrate holding device includes: a plurality of substrate holding parts for forming a flat substrate holding surface; a comb-teeth-like substrate holding surface vertical-movement part vertically moving under the substrate holding surface; a substrate sucking/holding means to suck and hold the substrate to the flat substrate holding surface; and a substrate lifting means to lift the substrate from the substrate holding surface. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a substrate holding device that holds a glass substrate to be processed when a glass substrate used in a liquid crystal display device or the like is processed.

  A color filter used in a liquid crystal display device will be described as an example of a glass substrate to be processed. FIG. 1 is a cross-sectional view showing an example of a color filter used in a color liquid crystal display device. The color filter 1 includes a black matrix (hereinafter referred to as BM) 3, a red R colored pixel (hereinafter referred to as R pixel) 4-1, a green G colored pixel (hereinafter referred to as G pixel) 4-2, blue on a glass substrate 2. B colored pixels (hereinafter referred to as B pixels) 4-3, a transparent electrode 5, a photo spacer (hereinafter referred to as PS) 6, and a vertical alignment (hereinafter referred to as VA) 7 were sequentially formed. Is.

  As a method for manufacturing a color filter having the above structure, a photolithography method, a printing method, and an ink jet method are known. FIG. 2 is a flow chart showing steps of a commonly used photolithography method. In the color filter, first, a step of forming BM on the glass substrate (C-1), a step of cleaning the glass substrate (C-2), and a step of applying and pre-drying a colored photoresist (C-3) ), A pre-baking step (C-4) for drying and curing the colored photoresist, a step (C-5) for exposing, a step (C-6) for developing, and a step (C-) for curing the colored photoresist. 7) is performed. For example, when pixels are formed in the order of R pixel, G pixel, and B pixel, from the step (C-2) of cleaning the color filter glass substrate to the step of curing the colored photoresist (C- In 7), the color resist is changed in the order of red R, green G, and blue B, and the process is repeated three times to form R, G, and B pixels. Further, the step of polishing (C-8), the step of forming a transparent electrode (C-9), and the step of forming PS and VA (C-10) are performed in this order. Further, although not shown, inspection and correction are appropriately inserted between the processes.

  Each process in the color filter manufacturing process is performed by placing and holding a glass substrate to be processed on the substrate holding apparatus shown in FIG. In order to place the glass substrate 10 on the substrate holding device 11, the elevation pins 12 of the substrate holding device 11 are projected (FIG. 3A), and the glass substrate 10 is placed on the transfer arm 13 and the arrow 14. (FIG. 3B) Then, after placing the glass substrate 10 on the lifting pins 12, the transfer arm 13 is retracted outside the substrate holding device 11 in the direction indicated by the arrow 14, and then The elevating pins 12 are immersed in the substrate holding device 11, and the glass substrate 10 is placed on the substrate holding device 11 and held by vacuum suction (a vacuum suction portion is not shown) (FIG. 3C).

JP 2002-246450 A

  When the glass substrate 10 is placed on the lift pins 12 and lifted up and down, the contact area between the glass substrate and the lift pins is small, so that the local stress received by the glass substrate is large and formed on the surface of the glass substrate. This causes damage to thin films such as RGB pixels and breakage of the glass substrate itself.

  Therefore, in the present invention, when the glass substrate is lifted up and down, local stress acting on the glass substrate is not generated, and as a result, damage to the thin film formed on the glass substrate surface and cracking of the glass substrate itself are prevented. It is an object of the present invention to provide a substrate holding device that makes it possible.

  As a means for solving the above problems, the invention according to claim 1 is characterized in that the substrate to be processed is transported above the substrate holding surface by the substrate transport arm and then placed on the substrate holding surface to attract the substrate. A substrate holding device for holding a plurality of substrate holding portions for forming a flat substrate holding surface, a comb-like substrate holding surface elevating portion that moves up and down under the substrate holding surface, and a flat substrate holding surface A substrate holding apparatus comprising: a substrate suction holding unit that holds a substrate by suction; and a substrate floating unit that floats the substrate from a substrate holding surface.

  According to a second aspect of the present invention, there is provided the substrate holding apparatus according to the first aspect, wherein the opposite sides of the substrate holding part and the substrate holding surface elevating part are non-linear.

  According to a third aspect of the present invention, there is provided a substrate suction hole and a substrate suction holding means in both the substrate holding part and the substrate holding surface lifting part, or in either the substrate holding part or the substrate holding surface lifting part, 3. The substrate holding apparatus according to claim 1, wherein the substrate is sucked and held by sucking air from the substrate suction hole in a state where the holding surface raising / lowering portion is raised and the substrate holding surface is flattened.

  According to a fourth aspect of the present invention, there is provided a substrate floating hole and a substrate floating means in both the substrate holding part and the substrate holding surface elevating part, or the substrate holding part or the substrate holding surface elevating part, and immediately before raising the substrate. 4. The substrate holding apparatus according to claim 1, wherein air is blown out from the substrate floating hole to float the substrate.

  In the invention according to claim 5, the driving of all the substrate suctions of the plurality of substrate holding units and the comb-shaped substrate holding surface lifting unit is started at the same time or started at different times, 5. The driving of all the substrate floating of the substrate holding part and the comb-like substrate holding surface elevating part is started at the same time or at different times. It is a board | substrate holding apparatus of description.

  According to a sixth aspect of the present invention, in the end portion of the substrate holding portion and the substrate holding surface raising / lowering portion on the substrate holding surface, corner portions are chamfered. It is a board | substrate holding apparatus of description.

  According to a seventh aspect of the present invention, there is provided the substrate holding device according to any one of the first to sixth aspects, wherein the substrate suction hole and the substrate floating hole have a salamomi structure or a pocket-shaped static pressure bearing structure. It is.

The substrate holding apparatus of the present invention can create a space for inserting the substrate transfer arm above the substrate holding surface by lowering a part of the flat substrate holding surface, that is, the substrate holding unit lifting / lowering unit. As a result, the substrate can be loaded and unloaded.

  The substrate is attached to and detached from the substrate holding surface by providing a suction hole for sucking and floating the substrate, and providing the floating hole in both the substrate holding unit and the substrate holding surface lifting unit, or in the substrate holding unit and the substrate holding surface lifting unit. I can do it.

There is a concern that a defect caused by a seam generated on the flat substrate holding surface formed by the substrate holding portion and the substrate holding surface raising / lowering portion may occur. For example, when the substrate is heated and cooled on the substrate holding surface, the heat transfer at the joint portion becomes non-uniform, and the temperature of the substrate may be uneven. For this reason, the side by which the substrate holding part and the substrate holding surface elevating part are opposed to each other is formed in a non-linear shape, thereby preventing defects due to the shape of the joint portion of the substrate holding part and the substrate holding surface elevating part. .

  The substrate holding surface lifting / lowering portion makes the contact area between the substrate lifting / lowering portion and the substrate much larger than when using conventional lifting / lowering pins, thereby preventing damage to the substrate or the thin film formed on the substrate surface. I can do it.

  The driving of the substrate suction of the plurality of substrate holding units and the comb-shaped substrate holding surface lifting unit is started at different times, and the driving of the substrate floating of the plurality of substrate holding units and the comb-shaped substrate holding surface lifting unit is By starting at a different time, especially for large glass substrates, it is possible to reduce the local stress applied to the glass substrate, prevent the glass substrate from being damaged, and attach / detach time Can be expected to shorten.

  The substrate suction hole and the substrate floating hole have a salamomi structure or a pocket-shaped static pressure bearing structure, so that air thrust can be efficiently transmitted to the substrate when the substrate floats.

  By using the comb-shaped substrate holding surface lifting part having a larger contact area with the glass substrate than that of the conventionally used lifting pins, it can be expected to prevent the glass substrate and the thin film formed on the glass substrate surface from being broken.

  Also, compared to the conventional lifting and lowering of the glass substrate using the lifting pins, the use of the substrate holding surface lifting and lowering portion reduces the local stress on the glass substrate, and the substrate holding surface lifting and lowering portion is connected to the lifting and lowering pins. Therefore, it is possible to shorten the time required for loading and unloading the glass substrate.

The figure which showed an example of the color filter used for a color liquid crystal display device in a cross section. The flowchart of the process of the photolithographic method generally used. The figure for demonstrating the method of mounting a glass substrate in a substrate holding device. (A) is a figure which shows the state which made the raising / lowering pin of the board | substrate holding | maintenance apparatus protrude. (B) is a figure which shows the state which inserted the conveyance arm, with the glass substrate mounted on the conveyance arm. (C) is a figure which shows the state which mounted the glass substrate in the board | substrate holding | maintenance apparatus, and was vacuum-sucked and hold | maintained. The figure which shows the cross section of the board | substrate holding apparatus which concerns on this invention. (A) is a figure which shows the state by which the conveyance arm carrying a glass substrate was inserted above the substrate holding apparatus in the state where the substrate holding surface raising / lowering part was sunk below the substrate holding surface. FIG. 6B is a diagram illustrating a state where the glass substrate is transferred from the transfer arm to the substrate holding surface. (C) is a figure which shows the state which the board | substrate holding surface raising / lowering part raised and the board | substrate holding surface became flat. The figure which shows the state which mounted the glass substrate in the board | substrate holding | maintenance apparatus which concerns on this invention, and the substrate conveyance arm detach | leaved from the glass substrate. The figure which shows the state which the board | substrate holding surface raising / lowering part of the board | substrate holding apparatus which concerns on this invention rose, and the substrate holding surface became flat. The figure which shows schematic structure of the board | substrate holding | maintenance apparatus which concerns on this invention. The figure which looked at the substrate holding device concerning the present invention from the upper surface, and is a figure showing a plurality of substrate holding parts and a comb-like substrate holding surface raising and lowering part. The figure which showed the substrate holding part of the substrate holding device which concerns on this invention, and a part of substrate holding surface raising / lowering part by the cross section. (A) is a figure for demonstrating providing the shape with a taper shape or roundness in the corner | angular part of a board | substrate holding part and a board | substrate holding surface raising / lowering part. (B) is the figure which showed the shape of the board | substrate adsorption | suction hole and the board | substrate floating hole in detail.

  FIG. 4 is a view showing a cross section of the substrate holding apparatus according to the present invention. The substrate holding device 50 includes a plurality of substrate holding units 20 and a comb-like substrate holding surface elevating unit 21 that form a flat substrate holding surface 33, and a vacuum suction device (not shown) that is a substrate suction holding unit that holds the substrate by suction. And a compressed air device (not shown) which is a substrate floating means for floating the substrate from the substrate holding surface. The substrate suction hole and the substrate floating hole 20-1 of the substrate holding unit and the substrate suction hole and the substrate floating hole 21-1 of the substrate holding surface elevating unit are piped to a vacuum suction device and a pneumatic device. A substrate guide 24 and alignment pins 25 are provided for placing the substrate at a set position.

  When the glass substrate 60 is put into the substrate holding device 50, the substrate holding surface raising / lowering unit 21 is lowered below the substrate holding surface 33 by the raising / lowering driving unit (not shown) as shown in FIG. In the state, the transfer arm 41 provided in the transfer device 40 on which the glass substrate 60 is mounted is inserted in the direction indicated by the arrow 42. Next, as shown in FIG. 4B, the glass substrate 60 is transferred from the transfer arm 41 to the substrate holding surface 33. In this state, air may be blown out from the substrate floating hole 20-1 on the surface of the substrate holding unit 20 by a compressed air device to assist the placement of the glass substrate 60.

  4B and 5 show a state where the glass substrate 60 is placed on the substrate holding surface 33 and the substrate transfer arm 41 is detached from the glass substrate 60. FIG. From this state, the substrate transfer arm 41 is retracted from the substrate holding device 50 in the direction indicated by the arrow 42.

  4C and 6 show a state in which the substrate holding surface raising / lowering portion 21 is raised in the direction indicated by the arrow 26, and the substrate holding surface is flattened. At this time, air is blown out from the compressed air device to float the glass substrate 60, and the glass substrate 60 is moved by the substrate guide 24. The substrate guide 24 prevents the floating substrate from sliding. After alignment, the glass substrate 60 is sucked and held by the substrate suction holes 20-1 and 21-1.

  When adsorbing the glass substrate 60, both the substrate adsorption hole 20-1 of the substrate holding unit 20 and the substrate adsorption hole 21-1 of the substrate holding surface elevating unit 21, or the substrate adsorption hole 20-1 of the substrate holding unit 20 or The substrate is adsorbed by any of the substrate adsorbing holes 21-1 of the substrate holding surface elevating unit 21. Both or either of them may be appropriately selected on the condition that no displacement occurs while the glass substrate 60 is processed.

  When the glass substrate 60 is dispensed from the substrate holding device 50, the reverse operation is performed. That is, in order to release the glass substrate 60 adsorbed and held by the substrate holding unit 20 and the substrate holding surface elevating unit 21, the vacuum is released by blowing compressed air from the substrate floating holes 20-1 and 21-1. After the glass substrate 60 is levitated and the substrate holding surface elevating part 21 is lowered, the substrate transfer arm 41 is inserted, and the glass substrate 60 is discharged. The substrate holding surface elevating unit 21 sinks to a position where the substrate transport arm 40 does not interfere with the substrate holding surface elevating unit 21 and the glass substrate 60 in the state of being submerged.

  When the glass substrate 60 is levitated, both the substrate levitating hole 20-1 of the substrate holding unit 20 and the substrate levitating hole 21-1 of the substrate holding surface elevating unit 21, or the substrate levitating hole 20-1 of the substrate holding unit 20 or The substrate is levitated by one of the substrate levitation holes 21-1 of the substrate holding surface elevating unit 21. Both or either may be selected as appropriate on the condition that the glass substrate 60 is levitated.

When the substrate is heated and cooled on the substrate holding surface, there is a possibility that the temperature unevenness of the substrate due to the seam generated on the flat substrate holding surface formed by the substrate holding unit and the substrate holding surface raising / lowering unit may occur. For this reason, as shown in FIG. 5, the above-mentioned problem can be solved by using a non-linear shape in which the end portion is engaged.

  As shown in FIG. 6, it is desirable to provide the substrate holding unit 20 with a substrate guide 24 and alignment pins 25 for correcting the position of the substrate so that the glass substrate 60 does not float and slide when starting to float.

  FIG. 7 is a diagram showing a schematic configuration of the substrate holding apparatus of the present invention. There is an elevating drive unit 32 that moves the substrate holding surface elevating unit 21 up and down, a substrate adsorption holding unit that adsorbs and holds a glass substrate, and a substrate floating unit that levitates the substrate. The raising / lowering drive unit 32 moves the cam follower 32e up and down by rotating the trapezoidal cam 32d with a ball screw 32c through a coupling 32b connected to the motor 32a, and raises and lowers the substrate holding surface lifting unit 21. The structure of the raising / lowering drive part 32 is an example of the general structure using the motor 32a and the trapezoidal cam 32d. The vacuum suction device 30 and the compressed air device 31 are connected to suction holes and floating holes 20-1 and 21-1 provided in the substrate holding unit 20 and the substrate holding surface lifting / lowering unit 21.

  In the embodiment of the present invention, the suction hole and the floating hole 20-1 of the substrate holding portion piped to the vacuum suction device 30 and the pressure pneumatic device 31 are the same hole, and the suction hole and the floating hole 21 of the substrate holding surface lifting and lowering portion. -1 is the same hole, and the solenoid valve 34 is used for switching between suction and levitation. However, the suction hole and the levitation hole may be provided separately and piped.

  FIG. 8 is a schematic view seen from the upper surface of the substrate holding device of the present invention, for explaining the start time for vacuum suction of the substrates of the plurality of substrate holding parts and the comb-like lifting part and the start time for releasing the vacuum of the substrate. FIG. When vacuum adsorbing a glass substrate to a plurality of substrate holding parts and comb-shaped lifting parts, the start time for vacuum suction of the plurality of substrate holding parts and the comb-shaped lifting parts is the same time, The start time for releasing the vacuum from the substrate may be the same, but in the case of a large substrate, when the substrate is levitated, air is sucked from the glass substrate and the substrate holding surface by sucking from the center of the glass substrate. When the vacuum is released, the stress applied to the glass substrate can be reduced by releasing the vacuum from the peripheral portion of the glass substrate, and the glass substrate can be prevented from being broken.

  In FIG. 8, for example, when the substrate holding part is 20a to 20d and the substrate holding surface lifting part is 21a to 21i, when vacuum sucking the glass substrate, the order of vacuum suction is, for example, the start time 1 (20b, 21e, 20c) → start time 2 (21d, 21b, 21f, 21h) → start time 3 (21a, 21c, 21g, 21i) → start time 4 (20a, 20d), while releasing the glass substrate from vacuum In contrast to the above vacuum suction, start time 11 (20a, 20d) → start time 12 (21a, 21c, 21g, 21i) → start time 13 (21d, 21b, 21f, 21h) → start time 14 (20b) , 21e, 20c).

  As described above, when the vacuum adsorption start time (start time 1 to 4) and the vacuum release start time (start time 11 to 14) are shifted, a plurality of solenoid valves (four in the above case) are provided. Each suction hole, levitation hole, a vacuum device and a pneumatic device are connected to perform vacuum suction and vacuum release.

  FIG. 9A is a cross-sectional view of a part of the substrate holding unit 20 and the substrate holding surface elevating unit 21. Since the corners 20-2 and 21-2 of the substrate holding unit 20 and the substrate holding surface elevating unit 21 are in direct contact with the glass substrate, the glass substrate is not damaged as a tapered shape or a rounded shape. .

FIG. 9B is a diagram showing in detail the shapes of the substrate suction hole and the substrate floating hole 20-1 of the substrate holding unit 20 and the substrate suction hole and the substrate floating hole 21-1 of the substrate holding surface elevating unit 21. The substrate suction holes and the substrate floating holes 20-1 and 21-1 have a salamomi structure or a pocket-shaped static pressure bearing structure. As a result, the adsorption of the substrate can be performed uniformly, and the thrust of the air can be efficiently transmitted to the substrate when the substrate floats.

  The substrate holding surface 20 and the substrate holding surface lifting / lowering unit 21 have appropriate characteristics (for example, thermal conductivity, electrical conductivity, thermal expansion coefficient, surface roughness, etc.) according to the processing contents such as heating and cooling of the substrate holding device. ) Is appropriately selected. Further, it is desirable to appropriately select a material and surface treatment for preventing static electricity generated on the substrate holding surface and the glass substrate.

  As described above, according to the present invention, since the substrate is lifted up and down by the substrate holding surface lifting part, the local stress on the glass substrate can be reduced, and as a result, formed on the surface of the glass substrate. Damage to the thin film and cracking of the glass substrate itself can be prevented. In addition, since the substrate holding surface elevating part is much larger in contact with the glass substrate than the conventional elevating pins, it is possible to move up and down at high speed, which is required for loading and unloading the substrate to and from the substrate holding device. Reduction of processing time can be expected.

  In addition, there is a new concern that the heat transfer of the seam portion generated on the flat substrate holding surface formed by the substrate holding portion and the substrate holding surface raising / lowering portion may become uneven, and the temperature unevenness of the substrate may occur. By making the sides where the holding unit and the substrate holding surface elevating unit face each other in a non-linear shape, the substrate holding unit and the substrate holding surface elevating unit are engaged with each other. As a result, the substrate holding unit and the substrate holding surface are obtained. Defects due to the shape of the joint portion of the elevating part can be prevented.

DESCRIPTION OF SYMBOLS 1 ... Color filter 2 ... Glass substrate 3 ... BM
4-1 ... R pixel 4-2 ... G pixel 4-3 ... B pixel 5 ... transparent electrode 6 ... PS
7 ... VA
DESCRIPTION OF SYMBOLS 10 ... Glass substrate 11 ... Substrate holding device 12 ... Elevating pin 13 ... Transfer arm 14 ... Arrow 20 indicating direction of insertion / retraction of transfer arm ... Substrate holding unit 20-1 ... Substrate adsorption hole, substrate floating hole 21 ... Substrate holding surface elevating part 21-1 ... Substrate adsorption hole, substrate floating hole 24 ... Substrate floating hole 24 ... Substrate guide 25. ..Alignment pin 26... Arrow 30 indicating the ascending direction of the substrate holding surface elevating part... Vacuum suction device 31... Compressed air introduction device 32. Ring 32c ... Ball screw 32d ... Trapezoid cam 32e ... Cam follower 33 ... Substrate holding surface 34 ... Solenoid valve 40 ... Substrate transfer device 41 ... Substrate transfer arm 42 ... -Indicates the direction of transfer arm insertion and retraction Indicia 50 ... substrate holding device 60 ... a glass substrate

Claims (7)

  A substrate holding device for transferring a substrate to be processed onto a substrate holding surface after the substrate transfer arm is transferred above the substrate holding surface and holding the substrate by suction, and a plurality of substrates for forming a flat substrate holding surface. Substrate holding portion, comb-like substrate holding surface elevating portion that moves up and down under the substrate holding surface, substrate suction holding means for sucking and holding the substrate on a flat substrate holding surface, and a substrate that floats the substrate from the substrate holding surface And a levitation means.   2. The substrate holding apparatus according to claim 1, wherein the sides facing the substrate holding part and the substrate holding surface elevating part have a non-linear shape.   Both the substrate holding part and the substrate holding surface elevating part, or either the substrate holding part or the substrate holding surface elevating part have a substrate suction hole and a substrate suction holding means, and the substrate holding surface elevating part is raised and the substrate holding surface is 3. The substrate holding apparatus according to claim 1, wherein air is sucked from the substrate suction hole in a flat state to suck and hold the substrate.   Both the substrate holding part and the substrate holding surface raising / lowering part, or the substrate holding part or the substrate holding surface raising / lowering part have a substrate floating hole and a substrate floating means, and air is blown out from the substrate floating hole immediately before the substrate is lifted. The substrate holding device according to claim 1, wherein the substrate holding device is floated.   The driving of all the substrate suctions of the plurality of substrate holding units and the comb-like lifting / lowering unit is started simultaneously or at different times, and the plurality of substrate holding units and the comb-like substrate holding surface lifting / lowering unit are started. 5. The substrate holding apparatus according to claim 1, wherein the driving of all the substrate levitation is started simultaneously or at different times.   6. The substrate holding device according to claim 1, wherein corners of the end portions of the substrate holding portion and the substrate holding surface lifting portion on the substrate holding surface are chamfered.   7. The substrate holding apparatus according to claim 1, wherein the substrate suction hole and the substrate floating hole have a salamomi structure or a pocket-shaped static pressure bearing structure.

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