JP2011013883A - Ic card separator and ic card case - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent interference between non-contact IC cards, while realizing film thinning and reduction of magnetic permeability of a magnetic layer.SOLUTION: An IC card separator 10 is arranged between non-contact IC cards 24 and 28 stored in storage parts 22 and 26 of a card case 20, and magnetic layers 16A and 16B are arranged on the both sides of a conductive metallic layer 12, with dielectric layers 14A and 14B interposed whose relative dielectric constant is two or more, and whose thickness is 10 μm or more and 100 μm or less. The shield effects of the dielectric layers 14A and 14B are added to the shield effects of a metallic layer 12 and the shielding effects of the magnetic layers 16A and 16B, by arranging the dielectric layers 14A and 14B whose cost are lower than those of the magnetic layers 16A and 16B. Thus, it is possible to obtain reading/writing of only IC cards 24 and 28, by preventing interferences between the IC cards 24 and 28, while realizing film thinning and magnetic permeability and cost reduction in the magnetic layers 16A and 16B.

Description

  The present invention relates to an IC card separator and an IC card case that prevent interference when non-contact type IC cards are stacked.

  With the spread of non-contact type IC cards such as FeliCa (registered trademark), the number of people who own a plurality of IC cards has increased. As a result, if you have multiple IC cards in the card case, you may not know which card will be read until you hold it over the reader / writer, or money may be withdrawn from a card that is not the target card. . In order to prevent such a situation, it is necessary to take out the card case and hold it over the reader / writer each time the card is used.

  In addition, with the spread of IC cards, IC card protectors made by pouching a metal film such as punching metal for the purpose of preventing skimming are on the market and are popular. It is known that by sandwiching this metal film between two IC cards, the IC card above the metal film becomes invisible due to the shielding effect. However, the IC card under the metal film (on the reader / writer side) is also invisible due to the reflection by the metal, so it cannot be said that it is an effective means for preventing interference between a plurality of IC cards.

  In order to solve such a problem, in the non-contact type IC card holder described in Patent Document 1 below, by sandwiching a conductive metal film between magnetic layers, the shielding effect of the metal layer can be reduced by the metal layer. In addition, the desired IC card can be read and written, and at the same time, the effect of not affecting other IC cards is realized.

Japanese Patent No. 3630006

  However, in order to prevent erroneous reading with good reproducibility in the structure described in Patent Document 1, it is necessary to increase the effect coefficient. The effect coefficient depends on the square root of the magnetic permeability of the magnetic layer and the magnetic layer. Therefore, it is necessary to provide a thick magnetic material having a high magnetic permeability, and there is a disadvantage in that the magnetic layer cannot be thinned and the magnetic permeability cannot be reduced.

  The present invention focuses on the above points, and its purpose is an IC capable of satisfactorily preventing interference between non-contact type IC cards while realizing a thin magnetic layer and a low magnetic permeability. The object is to provide a card separator and an IC card case using the card separator.

  In order to achieve the above object, the present invention is an IC card separator which is disposed between two non-contact type IC cards and prevents interference between these IC cards, comprising a conductive metal layer, A pair of dielectric layers provided on both main surfaces of the metal layer, and a pair of magnetic layers provided on the main surface of the pair of dielectric layers on the IC card side, and a relative dielectric constant of the dielectric layer Is 2 or more, and the thickness is 10 μm or more and 100 μm or less.

  Another invention is an IC card separator which is disposed between two non-contact type IC cards and prevents interference between these IC cards, comprising a conductive metal layer and both main surfaces of the metal layer A pair of magnetic layers, a pair of dielectric layers provided on the main surface of the pair of magnetic layers on the IC card side, and the dielectric layer has a relative dielectric constant of 2 or more, The thickness is 10 μm or more and 100 μm or less.

  Still another invention is an IC card separator which is arranged between two non-contact type IC cards and prevents interference between these IC cards, comprising a conductive metal layer and both main layers of the metal layer. A pair of dielectric layers provided on the surface, a pair of magnetic layers provided on the main surface of the pair of dielectric layers on the IC card side, and a pair provided on the main surface of the pair of magnetic layers on the IC card side The dielectric layer has a relative dielectric constant of 2 or more and a thickness of 10 μm to 100 μm.

  One of the main forms is characterized in that a dielectric constant of the dielectric layer is preferably 2.5 or more. According to another aspect, the magnetic layer is characterized in that magnetic powder is dispersed in a dielectric.

  The IC card case of the present invention has a plurality of non-contact type IC card storage portions, and the IC card separator according to any one of the above is arranged between overlapping IC cards. The above and other objects, features and advantages of the present invention will become apparent from the following detailed description and the accompanying drawings.

  The present invention provides an IC card separator in which a magnetic layer is provided on both main surfaces of a metal layer, between the metal layer and the magnetic layer, or the main surface of the magnetic layer (between the magnetic layer and the IC card), or By providing a dielectric layer having a relative dielectric constant of 2 or more and a thickness of 10 μm or more and 100 μm or less on both of them, a shielding effect by the magnetic layer and the dielectric layer can be obtained. The effect that interference between non-contact type IC cards can be prevented is realized.

It is a figure which shows Example 1 of this invention, (A) is a figure which shows an example of use, (B) is sectional drawing which shows a basic structure, (C) is a figure which shows another example of use. It is a figure which shows the specific example of the said Example 1, (A) is sectional drawing before adhesion | attachment, (B) is sectional drawing after adhesion | attachment. It is a graph which shows the measurement result of the effective sensitivity area | region of the said Example 1 and a comparative example. It is a graph which shows the measurement result of the effective sensitivity area | region of the said Example 1. FIG. It is a graph which shows the measurement result of the effective sensitivity area | region of a comparative example. It is a figure which shows the other Example of this invention, (A) is sectional drawing which shows Example 2, (B) is sectional drawing which shows Example 3. FIG.

  Hereinafter, the best mode for carrying out the present invention will be described in detail based on examples.

  First, Embodiment 1 of the present invention will be described with reference to FIGS. FIG. 1A is a diagram showing a usage example of this embodiment, FIG. 1B is a cross-sectional view showing the basic structure of this embodiment, and FIG. 1C is a diagram showing another usage example. 2A and 2B are diagrams showing a specific example of the present embodiment, in which FIG. 2A is a cross-sectional view before bonding, and FIG. 2B is a cross-sectional view after bonding. 3-5 is a graph which shows the measurement result of the effective sensitivity area | region of a present Example and a comparative example. Note that FIG. 1C will be described later. As shown in FIG. 1A, the IC card separator 10 of this embodiment is used between the non-contact type IC cards 24 and 28 stored in the storage portions 22 and 26 of the card case 20, In the example shown in the figure, it is stored in the storage unit 26 so as to overlap the one IC card 28. Of course, it may be placed on the other IC card 24 so as to be accommodated in the accommodating portion 22, and further, another accommodating portion (not shown) is provided between the accommodating portions 22 and 26, and the IC card separator 10 is mounted. You may make it accommodate.

  <Basic Structure> First, the basic structure of this embodiment will be described with reference to FIG. The IC card separator 10 is provided with dielectric layers 14A and 14B on both main surfaces of the conductive metal layer 12, and further, magnetic surfaces on the main surfaces of the dielectric layers 14A and 14B on the IC card 24 and 28 side are magnetic. The layers 16A and 16B are provided. In FIG. 1B, the storage portions 22 and 26 of the card case 20 are omitted. The dielectric layers 14A and 14B have a relative dielectric constant of 2 or more, preferably 2.5 or more, and a thickness of 10 μm or more and 100 μm or less.

  By providing the dielectric layers 14A and 14B, which are lower in cost than the magnetic layers 16A and 16B, the shielding effect of the metal layer 12 and the shielding effect by the magnetic layers 16A and 16B (proportional to the product of the square root of the relative permeability and the thickness) ) As well as the shielding effect (proportional to the product of the square root of the relative dielectric constant and the thickness) by the dielectric layers 14A and 14B. Therefore, the magnetic layers 16A and 16B can be made thin and have low magnetic permeability to reduce costs, while the IC card separator 10 is sandwiched between the IC cards 24 and 28 to prevent interference, and each IC Only the cards 24 and 28 are read and written.

  <Specific Example> Next, a specific example of this embodiment will be described with reference to FIG. As shown in FIG. 2 (A), the IC card separator 30 is formed by laminating a laminate of a double-sided tape 36, a magnetic film 38, and a protective film 40 on one main surface of PET 34 on which Al32 is vapor-deposited. A laminate of the protective film 42, the magnetic film 44, and the double-sided tape 46 is bonded to the (Al32 side). The thickness of the Al 32 is 0.02 μm, and the thickness of the PET 34 is 25 μm. The double-sided tape 36 has a PET base material with a total thickness of 10 μm, and the double-sided tape 46 has a base material (PET) thickness of 25 μm and a total thickness of 80 μm. The magnetic films 38 and 44 are made by dispersing Sendust magnetic powder in a dielectric (in this example, chlorinated polyethylene, frequency 13.56 MHz, dielectric constant 3.0). The magnetic constant is 115 and the dielectric constant is 2.5. The protective films 40 and 42 are protective films using single-sided tape.

  In the IC card separator 30 in which these are superimposed as shown in FIG. 2 (B), Al 32 corresponds to the metal layer 12 in FIG. 1 (B), and the PET 34 and the base PET of the double-sided tape 36 are combined. Corresponds to the dielectric layer 14A, the base PET and adhesive layer of the double-sided tape 46 correspond to the dielectric layer 14B, and the magnetic films 38 and 44 correspond to the magnetic layers 16A and 16B, respectively. . In this example, in addition to the basic structure shown in FIG. 1B, protective films 40 and 42 are provided on the outermost layer.

  In the basic structure shown in FIG. 1B, an effect obtained by adding the shielding effect by the dielectric layers 14A and 14B to the shielding effect by the magnetic layers 16A and 16B can be obtained. In the example shown in FIG. The magnetic films 38 and 44 have a structure in which Sendust magnetic powder is dispersed in a dielectric. Therefore, the shielding effects of the magnetic films 38 and 44 are the shielding effect by the magnetic powder (proportional to the product of the square root and the relative permeability) and the shielding effect (proportional to the product of the square root and the relative dielectric constant). And the shielding effect by the dielectric layer (PET 34, PET of the base material of the double-sided tape 36, PET of the base material of the double-sided tape 46 and the adhesive layer) is added to this, and the IC card separator 30 as a whole is shielded. Since it becomes an effect, a very big effect can be acquired.

<Experimental Example 1> Next, Experimental Example 1 will be described. In the experiment, an IC card separator of this example was sandwiched between two pieces of Suica (registered trademark) in which 1490 yen and 1500 yen were deposited using a Felica reader / writer RC-S320 (manufactured by Sony Corporation). As a case and a comparative example, a test was conducted for a case where nothing was sandwiched, a case where a metal film was sandwiched, and a case where a magnetic film was sandwiched. In addition, about the case where nothing is pinched | interposed and the case where an IC card separator is pinched | interposed, also when the upper and lower sides of two IC cards were replaced, the test was done. The test conditions and results are shown in Table 1 below. In Table 1, a card of 1490 yen is represented as “card A”, and a card of 1500 yen is represented as “card B”.

  From the results in Table 1, when nothing is sandwiched and when a magnetic film is sandwiched, a card that should not be read is read out, and when a metal film is sandwiched, nothing can be read out. It was confirmed that the IC card on the reader / writer side was read by sandwiching the IC card separator of this example.

  Experimental Example 2 Next, Experimental Example 2 will be described with reference to FIGS. Here, for the IC card separator of this example and the comparative example, the effective sensitivity region was measured using an in-house manufactured Felica sensitivity measurement jig. FIG. 3 shows a case where the IC card separator of this example (indicated as “SFX7-200W” in the figure) is sandwiched between two Felica cards and a case where a commercially available card separator is sandwiched as a comparative example ( In the case of “SKIM SEPARATOR” and no separator (“No separator”), only the magnetic layer and the dielectric layer (magnetic layer 0.1 mm / dielectric layer 0.08 mm) are included (“SFX4”). The measurement result for the case of sandwiching between “−100” and the measurement result for one Felica card (indicated as “One card only” in the figure) is shown. FIG. 3A shows the measurement results of the sensitivity region of the XZ plane of the five types of measurement samples, and FIG. 3B shows the measurement results of the sensitivity region of the YZ plane. In these drawings, the horizontal axis represents the position (mm) on the X axis or the Y axis, and the vertical axis represents the position on the Z axis. Each line on the drawing represents an area (limit position) that can be read without misreading.

  The SFX7-200W has a magnetic layer 0.2 mm / dielectric layer 0.08 mm / metal layer (Al) 0.001 mm / dielectric layer 0.01 mm / sendust dispersed in a dielectric polymer. The magnetic layer is dispersed in a layered structure of 0.2 mm, and the total thickness is 0.491 mm. The commercially available card separator has a laminated structure of ferrite magnetic sheet 0.3 mm / metal film 0.1 mm / ferrite magnetic sheet 0.3 mm, and the total thickness is 0.7 mm.

  As shown in FIGS. 3 (A) and 3 (B), SFX7-200W of this example and a commercially available product are available on both the XZ plane and the YZ plane as in the case of a single Felica card serving as a reference. The result of reading OK was obtained with the card separator, and the result of misreading was obtained when there was no separator and when the magnetic layer was 0.1 mm / dielectric layer 0.08 mm (SFX4-100). Read OK indicates that the information on the card closer to the reader can be read, and misreading indicates that the card far from the reader can be read. From this result, it was confirmed that the IC card separator of this example can obtain good sensitivity even if the thickness is thinner than that of a commercially available product.

  4 (A) and 4 (B) show the thickness dependence of the magnetic layer of the present example. Regarding the SFX7-200W and the other measurement samples SFX7-100W and SFX7-85W of the present example, The measurement results of the sensitivity regions on the XZ plane and the YZ plane are shown. The SFX7-100W has a laminated structure of the SFX7-200W (magnetic layer 0.2 mm in which sendust is dispersed in a dielectric polymer / dielectric layer 0.08 mm / metal layer (Al) 0.001 mm / dielectric layer 0.01 mm). In the magnetic layer (0.2 mm) in which Sendust is dispersed in a dielectric polymer), the magnetic layer is 0.1 mm, and SFX7-85W has a magnetic layer of 0.085 mm. As shown in FIGS. 4A and 4B, the result of reading OK is obtained for all three types of measurement samples, and good sensitivity is obtained within the above-described thickness range of the magnetic layer. It was confirmed.

  On the other hand, FIGS. 5 (A) and 5 (B) show the XZ plane when the SFX4-100 (magnetic layer 0.1 mm / dielectric layer 0.08 mm) is sandwiched and when two sheets are sandwiched. And the measurement result of the sensitivity area | region of a YZ surface is shown. As shown in FIGS. 5A and 5B, when one sheet of SFX4-100 is sandwiched, all are misread. In addition, even when two sheets are sandwiched, even if the read OK area can be read, there is an area (SFX4-100 × 2 (misread)) that is misread outside, so in reality, the target card is The result was that you could read or misread a different card. As described above, when a sheet having only a magnetic layer of 0.1 mm / dielectric layer of 0.08 mm is used, unlike the IC card separator of this embodiment, good reading cannot be performed, and magnetic / dielectric / metal / It has been confirmed that it is necessary to make a dielectric / magnetic structure.

  Thus, according to Example 1, in the IC card separator in which the magnetic layers are provided on both main surfaces of the metal layer, the relative dielectric constant is 2 or more and the thickness is between the metal layer and the magnetic layer. A dielectric layer of 10 μm or more and 100 μm or less was provided. For this reason, by adding the shielding effect of the dielectric layer to the shielding effect of the metal layer and the shielding effect of the magnetic layer, the magnetic layer can be made thinner and the magnetic permeability can be reduced, and the cost can be reduced and contactless. There is an effect that interference between the type IC cards can be satisfactorily prevented.

  Next, Embodiment 2 of the present invention will be described with reference to FIG. In addition, the same code | symbol shall be used for the component which is the same as that of Example 1 mentioned above, or respond | corresponds (it is the same also about a following example). In Example 1 described above, in the IC card separator 10 in which the magnetic layers are provided on both main surfaces of the metal layer, the dielectric layers 14A and 14B are provided between the metal layer 12 and the magnetic layers 16A and 16B. . On the other hand, in the IC card separator 50 of the present embodiment, the dielectric layers 14A and 14B are provided on the main surface of the magnetic layers 16A and 16B on the IC card side as shown in the cross section of FIG. It has a structure. That is, the dielectric layers 14A and 14B are arranged between the magnetic layers 16A and 16B and the IC cards 24 and 28. The relative permittivity and thickness of the dielectric layers 14A and 14B are the same as those in the first embodiment. The basic operation and effects of the present embodiment are the same as those of the first embodiment described above. Of course, as in the specific example of Example 1, a protective film (not shown) may be provided on the outermost layer.

  Next, Embodiment 3 of the present invention will be described with reference to FIG. In this embodiment, in the IC card separator 60 in which the magnetic layers 16A and 16B are provided on both main surfaces of the metal layer 12, dielectric layers 14A and 14B are provided between the metal layer 12 and the magnetic layers 16A and 16B, respectively. Further, the dielectric layers 14C and 14D are provided on the main surfaces of the magnetic layers 16A and 16B on the side of the IC cards 24 and 28, respectively. That is, it can be said that the dielectric layers 14C and 14D are provided on the outermost layer of the IC card separator 10 shown in the first embodiment. The relative dielectric constants and thicknesses of the dielectric layers 14A to 14D are as described in the first embodiment, and the functions and effects are the same as those in the first embodiment.

In addition, this invention is not limited to the Example mentioned above, A various change can be added in the range which does not deviate from the summary of this invention. For example, the following are also included.
(1) The shapes and dimensions shown in the above embodiments are merely examples, and may be changed as appropriate. Similarly, the thicknesses of the dielectric layers 14 </ b> A to 14 </ b> D may be appropriately changed as necessary within the above-described range.
(2) The materials shown in the above embodiments are also examples, and various known materials may be used as long as the same effects can be obtained.

(3) The card case 20 shown in the usage example of the first embodiment is also an example, and as long as the IC card separator of the present invention is sandwiched between the IC cards, the design may be changed as appropriate. For example, as in a card case 70 shown in FIG. 1 (C), the housing portions 72 and 74 of the case main body may be partitioned by the IC card separator 10.
(4) The magnetic films 38 and 44 shown in the specific example of the first embodiment are also examples, and may be appropriately changed so as to achieve the same effect.
(5) In the above embodiment, Suica (registered trademark) is taken as an example of a non-contact type IC card. However, the present invention is not limited to this, and the present invention is not limited to other various non-contact types. It can be applied to prevent interference of all types of IC cards.

  According to the present invention, the relative dielectric constant is 2 or more between the metal layer and the magnetic layer, or the main surface of the magnetic layer (between the magnetic layer and the IC card), or both. By providing a dielectric layer of 10 μm or more and 100 μm or less, it is possible to prevent interference between non-contact type IC cards while realizing thinning and low magnetic permeability of the magnetic layer. Applicable to separators and cases when multiple sheets are owned.

10: IC card separator 12: metal layers 14A to 14D: dielectric layers 16A, 16B: magnetic layer 20: card case 22, 26: storage section 24, 28: IC card 30: IC card separator 32: Al
34: PET
36, 46: Double-sided tape 38, 44: Magnetic film 40, 42: Protective film 50, 60: IC card separator 70: Card case 72, 74: Storage section

Claims (6)

An IC card separator disposed between two non-contact type IC cards to prevent interference between these IC cards,
Conductive metal layer,
A pair of dielectric layers provided on both principal surfaces of the metal layer;
A pair of magnetic layers provided on the main surface of the pair of dielectric layers on the IC card side;
With
An IC card separator, wherein the dielectric layer has a relative dielectric constant of 2 or more and a thickness of 10 μm to 100 μm. An IC card separator disposed between two non-contact type IC cards to prevent interference between these IC cards,
Conductive metal layer,
A pair of magnetic layers provided on both principal surfaces of the metal layer;
A pair of dielectric layers provided on the main surface of the pair of magnetic layers on the IC card side;
With
An IC card separator, wherein the dielectric layer has a relative dielectric constant of 2 or more and a thickness of 10 μm to 100 μm. An IC card separator disposed between two non-contact type IC cards to prevent interference between these IC cards,
Conductive metal layer,
A pair of dielectric layers provided on both principal surfaces of the metal layer;
A pair of magnetic layers provided on the main surface of the pair of dielectric layers on the IC card side;
A pair of other dielectric layers provided on the main surface of the pair of magnetic layers on the IC card side;
With
An IC card separator, wherein the dielectric layer has a relative dielectric constant of 2 or more and a thickness of 10 μm to 100 μm.   The IC card separator according to any one of claims 1 to 3, wherein a relative dielectric constant of the dielectric layer is preferably 2.5 or more.   The IC card separator according to any one of claims 1 to 4, wherein the magnetic layer is one in which magnetic powder is dispersed in a dielectric.   An IC card case comprising: a plurality of non-contact type IC card storage portions; and the IC card separator according to any one of claims 1 to 5 disposed between overlapping IC cards.

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