JP2010267685A - Semiconductor device - Google Patents

Semiconductor device Download PDF

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JP2010267685A
JP2010267685A JP2009116030A JP2009116030A JP2010267685A JP 2010267685 A JP2010267685 A JP 2010267685A JP 2009116030 A JP2009116030 A JP 2009116030A JP 2009116030 A JP2009116030 A JP 2009116030A JP 2010267685 A JP2010267685 A JP 2010267685A
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wire
metal
electrode
wiring
fine
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JP4907693B2 (en
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Nobuhiko Fujita
Masao Kikuchi
正雄 菊池
暢彦 藤田
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Mitsubishi Electric Corp
三菱電機株式会社
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    • H—ELECTRICITY
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
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    • H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H01L2224/0601—Structure
    • H01L2224/0603—Bonding areas having different sizes, e.g. different heights or widths
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    • H01L2224/45001—Core members of the connector
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    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
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    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a semiconductor device having high mechanical reliability while achieving reduced size in a power module by arranging fine metal wires having different diameters in the fine metal wires connecting an electrode of a semiconductor element with a wiring member. <P>SOLUTION: The semiconductor device includes: a switching element 1; first electrode 4 and second electrode 5 formed in the switching element 1; fine metal wires connecting each electrode and a wiring member; an outer packaging case 7 containing the switching element 1, the wiring member, and the fine metal wires; and an encapsulating resin 11 encapsulated in the outer packaging case 7. A first fine metal wire 6 has a wire diameter larger than that of a second fine metal wire 9 and also a wire length longer than that of the second fine metal wire 9, and the second fine metal wire 9 is wired substantially in parallel near the first fine metal wire 6. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

この発明は、線径が異なる複数の金属細線を用いてスイッチング素子と配線部材を繋いでなる半導体装置に関わるものである。   The present invention relates to a semiconductor device in which a switching element and a wiring member are connected using a plurality of fine metal wires having different wire diameters.
従来からパワーモジュールなどにおいて、パワー回路ブロックと制御ブロックとを内部配線用の端子ブロックを用いずに、直接ワイヤボンディングする技術が知られている（特許文献１）。
一方、この発明が対象とする半導体装置は、基板に搭載されたスイッチング素子と配線部材とを有し、配線部材は、装置外部と電流の受け渡しをするために、外部端子と接続されるとともに、スイッチング素子とも接続される。スイッチング素子と配線部材の接続には、主として比較的電気抵抗が小さいアルミニウムを主成分とする材質からなる金属細線が用いられることが多い。また、スイッチング素子には、半導体装置が制御する電流を引き出すための第一の電極が素子表面に形成されるとともに、電流を流したり遮断したりするために電圧もしくは電流を印加する第二の電極が第一の電極と同じ素子表面に形成されている。 2. Description of the Related Art Conventionally, in a power module or the like, a technique for directly wire bonding a power circuit block and a control block without using a terminal block for internal wiring is known (Patent Document 1).
On the other hand, a semiconductor device to which the present invention is directed has a switching element and a wiring member mounted on a substrate, and the wiring member is connected to an external terminal in order to exchange current with the outside of the device. A switching element is also connected. For the connection between the switching element and the wiring member, a thin metal wire mainly made of a material mainly composed of aluminum having a relatively small electric resistance is often used. The switching element is formed with a first electrode for drawing out a current controlled by the semiconductor device on the element surface, and a second electrode for applying a voltage or a current to flow or cut off the current. Is formed on the same element surface as the first electrode.
第一の金属細線は、第一の電極から第一の配線部材に向かってループ形成されて接続され、また、第二の金属細線は、第二の電極から制御基板につながる第二の配線部材に向かってループ形成されて接続されている。さらに、第一、第二の配線部材はあらかじめ外装ケースに保持されるとともに、外装ケース内には、保護のために樹脂が封入されて、金属細線の周辺を覆っている。   The first thin metal wire is loop-connected from the first electrode toward the first wiring member, and the second thin metal wire is connected to the control board from the second electrode. A loop is formed and connected. Further, the first and second wiring members are held in the outer case in advance, and resin is enclosed in the outer case for protection to cover the periphery of the fine metal wires.
特開平８−２０４１１５号公報（第３頁、図２）JP-A-8-204115 (page 3, FIG. 2)
半導体装置においては、スイッチング素子の能動面積が大きいほど、制御できる電流が大きく性能が向上する。一方、第二の電極は印加される電力が小さいため、第二の電極を極力小さく作り、第一の電極を大きくする。また、第一の金属細線は大きな電流を流す必要がある一方で、第二の金属細線は接合する第二の電極が小さいこと、大きな電流を流す必要がないことから、第一の金属細線よりも線径が小さくなる。   In a semiconductor device, the greater the active area of a switching element, the greater the current that can be controlled and the better the performance. On the other hand, since the electric power applied to the second electrode is small, the second electrode is made as small as possible and the first electrode is enlarged. In addition, the first thin metal wire needs to pass a large current, while the second fine metal wire has a smaller second electrode to be joined, and it is not necessary to flow a large current. The wire diameter becomes smaller.
金属細線は線径が小さいほど、剛性が小さくなり、機械的信頼性が低下して、半導体装置に要求される性能によっては、線径を大きくせざるを得ず、半導体装置の小形化を妨げるだけでなく、第一の電極の面積が目減りして素子の性能を十分引き出せない問題があった。特に、この種半導体装置では、保護のために樹脂封入する構造となっており、封入樹脂と金属細線との線膨張差に起因する熱応力が金属細線に発生したり、封入樹脂の振動によって金属細線が揺られて歪みが蓄積し、金属細線の機械的特性が制限されるおそれがあった。   The smaller the wire diameter, the lower the rigidity of the fine metal wire and the lower the mechanical reliability. Depending on the performance required of the semiconductor device, it is necessary to increase the wire diameter, which hinders the miniaturization of the semiconductor device. In addition, there is a problem in that the area of the first electrode is reduced and the performance of the device cannot be sufficiently obtained. In particular, this type of semiconductor device has a structure in which a resin is encapsulated for protection, and thermal stress caused by a difference in linear expansion between the encapsulated resin and the fine metal wire is generated in the fine metal wire, or the metal is caused by vibration of the encapsulated resin. There was a possibility that the fine wire was shaken to accumulate distortion, and the mechanical properties of the fine metal wire were limited.
この発明は、かかる課題を解決するためになされるものであり、スイッチング素子、スイッチング素子に形成された第一の電極と第二の電極、第一の電極と電気的に繋がる第一の配線部材、第一の電極と第一の配線部材を繋ぐ少なくとも1本の第一の金属細線、第二の電極と電気的に繋がる第二の配線部材、第二の電極と第二の配線部材を繋ぐ少なくとも１本の第二の金属細線、スイッチング素子、第一の配線部材、第二の配線部材、第一の金属細線、および第二の金属細線を収納する外装ケース、外装ケースに封入する封入樹脂とを備えた半導体装置であって、第一の金属細線は、第二の金属細線よりも線径が大きく、かつ長く又はその配線高さを高くし、第一の金属細線の近傍に略並行に第二の金属細線を配線したものである。   This invention is made in order to solve this subject, and is the 1st wiring member electrically connected with a switching element, the 1st electrode and 2nd electrode which were formed in the switching element, and the 1st electrode , Connecting at least one first metal thin wire connecting the first electrode and the first wiring member, connecting the second electrode electrically connecting to the second electrode, and connecting the second electrode and the second wiring member At least one second thin metal wire, switching element, first wiring member, second wiring member, first metal thin wire, outer case for housing the second metal thin wire, and encapsulating resin sealed in the outer case The first metal fine wire is larger in diameter than the second metal thin wire and is longer or has a higher wiring height, and is substantially parallel to the vicinity of the first metal fine wire. The second thin metal wire is wired.
この発明によれば、半導体装置内部にあって、スイッチング素子と配線部材の間に配線される第一の金属細線と第二の金属細線のうち、剛性が大きい第一の金属細線で被覆樹脂が拘束されるために、剛性が小さい第二の金属細線は樹脂物性に影響することなく、機械的信頼性が向上する。   According to the present invention, the coating resin is coated with the first metal thin wire having high rigidity among the first metal thin wire and the second metal thin wire that are provided between the switching element and the wiring member inside the semiconductor device. Since the second metal fine wire having low rigidity is restrained, the mechanical reliability is improved without affecting the physical properties of the resin.
この発明における半導体装置の実施の形態１を説明するための概略図を示し、（ａ）は平面図、（ｂ）は横断面を模式的に示す。BRIEF DESCRIPTION OF THE DRAWINGS The schematic for demonstrating Embodiment 1 of the semiconductor device in this invention is shown, (a) is a top view, (b) shows a cross section typically. この発明の実施の形態２を説明するための概略平面図を示す。The schematic plan view for demonstrating Embodiment 2 of this invention is shown. この発明の実施の形態２を説明するための模式図を示す。The schematic diagram for demonstrating Embodiment 2 of this invention is shown.
実施の形態１．
図１は、この発明の実施の形態１を説明するために一部を取り出した部分模式図であり、図１（ａ）は平面、図１（ｂ）は横断面を示す。
スイッチング素子１は、基板２に形成された金属配線パターン３の上に例えばはんだや導電ペーストによって接合される。スイッチング素子１には、その表面に半導体装置の主たる電流を制御するための第一の電極４と、スイッチング素子のゲートあるいはベースの電圧もしくは電流を制御するための第二の電極５が形成されている。第一の電極４には本実施の形態では４本の第一の金属細線６が接合されている。第一の金属細線６のもう一方の端部は、外装ケース７に保持された第一の配線部材である第一のターミナル部８あるいは基板２上の配線パターン部１２に接合されている。このように、第一の金属細線によって第一の配線部材とスイッチング素子、あるいはスイッチング素子同士を電気的に接続することになる。 Embodiment 1 FIG.
1A and 1B are partial schematic views partially taken out for explaining Embodiment 1 of the present invention. FIG. 1A is a plan view and FIG. 1B is a cross-sectional view.
The switching element 1 is bonded onto the metal wiring pattern 3 formed on the substrate 2 by, for example, solder or conductive paste. A first electrode 4 for controlling the main current of the semiconductor device and a second electrode 5 for controlling the voltage or current of the gate or base of the switching element are formed on the surface of the switching element 1. Yes. In the present embodiment, four first metal wires 6 are joined to the first electrode 4. The other end of the first fine metal wire 6 is joined to the first terminal portion 8 which is the first wiring member held by the outer case 7 or the wiring pattern portion 12 on the substrate 2. In this way, the first wiring member and the switching element or the switching elements are electrically connected by the first thin metal wire.
一方、スイッチング素子１上の第二の電極５には、第一の金属細線６よりも線径が小さい第二の金属細線９が接合され、もう一方の端部はスイッチング素子１を制御する制御基板に接続するための第二のターミナル部１０あるいは基板２上の配線パターン部１３に接合されている。第二の金属細線９は第一の金属細線６に比べて線径を小さくすることで、第二の電極５の面積も小さくてすみ、大きな電流を制御するために設けた第一の電極４を大きな面積とすることができる。
また、第一の金属細線６は大きな電流を制御するために、電気抵抗の小さいアルミニウムを材質とし、線径は直径１００〜６００μｍ程度で、好ましくは、３００〜５００μｍであれば、接合する際のエネルギーでスイッチング素子に損傷を与えることなく、接合することができる。一方、第二の金属細線９は、同等の機械的特性を有するアルミニウムあるいは金を材質とし、線径は直径１５〜１５０μｍ程度で、好ましくは、２０〜８０μｍであれば、第二の電極面積に対して十分に位置的な尤度をもって接合することができる。 On the other hand, a second metal wire 9 having a diameter smaller than that of the first metal wire 6 is joined to the second electrode 5 on the switching device 1, and the other end is controlled to control the switching device 1. It is joined to the second terminal portion 10 for connection to the substrate or the wiring pattern portion 13 on the substrate 2. The second thin metal wire 9 has a smaller wire diameter than the first fine metal wire 6 so that the area of the second electrode 5 can be reduced, and the first electrode 4 provided for controlling a large current. Can be a large area.
Moreover, in order to control a large electric current, the first metal thin wire 6 is made of aluminum having a small electric resistance, and the wire diameter is about 100 to 600 μm, preferably 300 to 500 μm. The bonding can be performed without damaging the switching element with energy. On the other hand, the second thin metal wire 9 is made of aluminum or gold having the same mechanical characteristics, and has a wire diameter of about 15 to 150 μm, preferably 20 to 80 μm. On the other hand, it can join with sufficient positional likelihood.
また、半導体装置には、スイッチング素子１や金属細線６、９を含む配線を保護するために封入樹脂１１が封入されている。本実施の形態の金属細線においては、第二の金属細線９は、第一の金属細線６の極近傍に配線されており、各々が略平行なように配線されている。また、第一の金属細線６は、第二の金属細線９よりも長く形成されている。
第二の金属細線９は線径が小さいために、第一の金属細線と比べると剛性があまり大きくなく、半導体装置がさらされる温度サイクルや振動が加わると、封入樹脂との機械的物性の差異によって封入樹脂と金属細線が相対的に変位し、発生するストレスに対する耐量が第一の金属細線６に比べて小さい。 In addition, an encapsulating resin 11 is encapsulated in the semiconductor device in order to protect the wiring including the switching element 1 and the fine metal wires 6 and 9. In the metal thin wire of the present embodiment, the second metal thin wire 9 is wired in the vicinity of the first metal thin wire 6 and is wired so as to be substantially parallel to each other. Further, the first fine metal wire 6 is formed longer than the second fine metal wire 9.
Since the second metal thin wire 9 has a small wire diameter, the rigidity is not so large as compared with the first metal thin wire, and when the temperature cycle and vibration to which the semiconductor device is exposed are added, the difference in mechanical properties from the encapsulating resin. As a result, the encapsulating resin and the fine metal wire are relatively displaced, and the resistance to the generated stress is smaller than that of the first fine metal wire 6.
しかしながら、本実施の形態のように剛性が小さい第二の金属細線９の極近くに第一の金属細線６を平行に配線することにより、封入樹脂１１は剛性が高い第一の金属細線６によって拘束されるため、第一の金属細線６の変位に近くなる。一方、第一の金属細線６と第二の金属細線９はほぼ同等の機械的物性を有していることから、第二の金属細線９の周囲の封入樹脂と第二の金属細線９の相対変位は小さくなり、ストレスの発生を低減して機械的信頼性が向上する。
また、剛性が高い第一の金属細線６が例えば振動時に封入樹脂１１に対して発生する慣性力を受け止めて樹脂の動きを拘束するため、剛性が小さい第二の金属細線９が樹脂に揺られることがなく、耐振性の向上が顕著である。 However, by arranging the first metal wires 6 in parallel near the second metal wires 9 having low rigidity as in the present embodiment, the encapsulating resin 11 is formed by the first metal wires 6 having high rigidity. Since it is restrained, it becomes close to the displacement of the first fine metal wire 6. On the other hand, since the first fine metal wire 6 and the second fine metal wire 9 have substantially the same mechanical properties, the relative relationship between the encapsulated resin around the second fine metal wire 9 and the second fine metal wire 9 is relatively small. The displacement is reduced, and the mechanical reliability is improved by reducing the occurrence of stress.
In addition, since the first thin metal wire 6 having high rigidity receives, for example, inertia force generated with respect to the encapsulating resin 11 during vibration and restrains the movement of the resin, the second thin metal wire 9 having low rigidity is shaken by the resin. There is no significant improvement in vibration resistance.
なお、図１（ｂ）の左側部に示すように、第一電極４と第一ターミナル部８とを接合する第一の金属細線６のように、第一の金属細線の高さが、第二の金属細線の高さよりも高くすることによって、第二の金属細線の頂部に作用する封入樹脂量が小さくなる。このため、線径が小さい第二の金属細線の接合部に特に大きなモーメントを作用させる頂部の樹脂量を減らせ、かつ、剛性が高い第一の金属細線が樹脂の動きを制限するため、接合部に作用するモーメントを大幅に低減させることができ、機械的信頼性が向上する。   As shown on the left side of FIG. 1 (b), the height of the first fine metal wire is the same as the first fine metal wire 6 that joins the first electrode 4 and the first terminal portion 8. By making it higher than the height of the second fine metal wire, the amount of encapsulating resin acting on the top of the second fine metal wire is reduced. For this reason, the amount of resin at the top that causes a particularly large moment to act on the joint portion of the second thin metal wire with a small wire diameter can be reduced, and the first thin metal wire with high rigidity limits the movement of the resin. Moment can be significantly reduced, and mechanical reliability is improved.
実施の形態２．
図２は、この発明の実施の形態２を説明するための半導体装置の概略図で、平面図を模式的に示す図である。本実施の形態では、第二の金属細線９ａ、９ｂは第一の金属細線６ａ、６ｂに囲まれるように配線されている。同様に、第二の金属細線９ｃ、９ｄは第一の金属細線６ｃ、６ｄに囲まれるように配線されている。また、図示しないが本実施形態においても、半導体装置内部に樹脂が封入されている。
剛性が大きい第一の金属細線６ａ、６ｂ、６ｃ、６ｄによって囲まれる領域の封入樹脂は、両側の金属細線に拘束されるために温度変化や振動時の変位が小さくなり、第一の金属細線６ａ、６ｂ、６ｃ、６ｄと同等材質である第二の金属細線９ａ、９ｂ、９ｃ、９ｄとの相対変位が小さくなり、ストレスを低減することができる。
さらに、第一の金属細線６ａ、６ｂ、６ｃ、６ｄによって囲まれる領域は小さい容積であるために、第二の金属細線９ａ、９ｂ、９ｃ、９ｄへの機械的影響が小さくなり、とりわけ振動時の樹脂の動きが小さくなるので、耐振性の向上が顕著となる。 Embodiment 2. FIG.
FIG. 2 is a schematic diagram of a semiconductor device for explaining the second embodiment of the present invention, and schematically shows a plan view. In the present embodiment, the second fine metal wires 9a and 9b are wired so as to be surrounded by the first fine metal wires 6a and 6b. Similarly, the second fine metal wires 9c and 9d are wired so as to be surrounded by the first fine metal wires 6c and 6d. Although not shown, also in this embodiment, resin is sealed inside the semiconductor device.
The encapsulating resin in the region surrounded by the first thin metal wires 6a, 6b, 6c, and 6d having high rigidity is restrained by the thin metal wires on both sides, so that the temperature change and the displacement at the time of vibration are reduced. The relative displacement with the second thin metal wires 9a, 9b, 9c, 9d, which are the same material as 6a, 6b, 6c, 6d, is reduced, and stress can be reduced.
Furthermore, since the area surrounded by the first thin metal wires 6a, 6b, 6c and 6d has a small volume, the mechanical influence on the second thin metal wires 9a, 9b, 9c and 9d is reduced, especially during vibration. Since the movement of the resin becomes smaller, the improvement in vibration resistance becomes remarkable.
また、基板２上に第二の金属細線９ａ、９ｂと接続する配線パターン部１３が形成されており、配線パターン部１３からさらに図示しない配線ターミナル部に接続される。配線パターン部１３は本実施形態では第一の金属細線６ｂをくぐるように下方に配線されており、立体的にコンパクトに集約されて配線をすることができる。
なお、第一の金属細線６ａは第二の金属細線９ａよりも長く、第二の金属細線９ａ、９ｂと第二の電極５ならびに配線パターン部１２の接合部は、第一の金属細線６ａの両端部から金属細線６ｂとの垂線で囲まれた領域（図３中斜線部）内に位置している。第二の金属細線９ｃ、９ｄの場合も同様である。このような位置関係によって、特に信頼性を左右する接合部１４、１５近傍の樹脂が剛性の高い第一の金属細線６ａ、６ｂ又は６ｃ、６ｄの拘束を受けるので、接合部の信頼性が向上し、半導体装置としての信頼性が向上する。 A wiring pattern portion 13 connected to the second metal thin wires 9a and 9b is formed on the substrate 2, and the wiring pattern portion 13 is further connected to a wiring terminal portion (not shown). In the present embodiment, the wiring pattern portion 13 is wired downward so as to pass through the first thin metal wire 6b, and can be wired in a three-dimensionally compact manner.
In addition, the 1st metal fine wire 6a is longer than the 2nd metal fine wire 9a, and the junction part of 2nd metal fine wire 9a, 9b, the 2nd electrode 5, and the wiring pattern part 12 is the 1st metal fine wire 6a. It is located in a region (shaded portion in FIG. 3) surrounded by a perpendicular line from both ends to the fine metal wire 6b. The same applies to the second thin metal wires 9c and 9d. By such a positional relationship, the resin in the vicinity of the joint portions 14 and 15 that particularly affect the reliability is restrained by the first metal thin wires 6a and 6b or 6c and 6d having high rigidity, so the reliability of the joint portion is improved. In addition, the reliability as a semiconductor device is improved.
また、図１で説明したと同様に第二の金属細線の高さが、第一の金属細線の高さよりも小さくすることによって、線径が小さい第二の金属細線の接合部に特に大きなモーメントを作用させる第二の金属細線の頂部に作用する封入樹脂量が小さくなる。また、これと相まって剛性が高い第一の金属細線が樹脂の動きを制限するため、接合部に作用するモーメントを低減させることができ、機械的信頼性が向上する。
なお、本発明の実施形態のごとく、第一の金属細線が複数本形成されている場合には、第二の金属細線に最も近く配置された第一の金属細線６ａ１，６ｂ１，６ｃ１，６ｄ１が、その他の金属細線と異なり、第二の金属細線の高さより高くするようにすれば、他の第一の金属細線を所望の高さとしつつ、上記と同様の効果を奏することができる。 Further, in the same manner as described with reference to FIG. 1, by making the height of the second fine metal wire smaller than the height of the first fine metal wire, a particularly large moment is applied to the joint portion of the second fine metal wire having a small wire diameter. The amount of the encapsulating resin acting on the top of the second thin metal wire that acts is reduced. Further, coupled with this, the first metal fine wire having high rigidity restricts the movement of the resin, so that the moment acting on the joint can be reduced, and the mechanical reliability is improved.
When a plurality of the first fine metal wires are formed as in the embodiment of the present invention, the first fine metal wires 6a1, 6b1, 6c1, 6d1 arranged closest to the second fine metal wire are Unlike the other fine metal wires, if the height is made higher than the height of the second fine metal wires, the same effect as described above can be achieved while making the other first fine metal wires have a desired height.
１ スイッチング素子、２ 基板、３ 金属配線パターン、４ 第一の電極、５ 第二の電極、６、６ａ、６ｂ、６ｃ、６ｄ 第一の金属細線、７ 外装ケース、８ 第一ターミナル部、９、９ａ、９ｂ、９ｃ、９ｄ 第二の金属細線、１０ 第二ターミナル部、１１ 封入樹脂、１２ 配線パターン部、１３ 配線パターン部、１４ 接合部、１５ 接合部。   DESCRIPTION OF SYMBOLS 1 Switching element, 2 Substrate, 3 Metal wiring pattern, 4 1st electrode, 5 2nd electrode, 6, 6a, 6b, 6c, 6d 1st metal fine wire, 7 Outer case, 8 1st terminal part, 9 , 9a, 9b, 9c, 9d Second metal thin wire, 10 Second terminal portion, 11 Encapsulating resin, 12 Wiring pattern portion, 13 Wiring pattern portion, 14 Joining portion, 15 Joining portion.

Claims (5)

  1. スイッチング素子、前記スイッチング素子に形成された第一の電極と第二の電極、前記第一の電極と電気的に繋がる第一の配線部材、前記第一の電極と前記第一の配線部材を繋ぐ少なくとも１本の第一の金属細線、前記第二の電極と電気的に繋がる第二の配線部材、前記第二の電極と前記第二の配線部材を繋ぐ少なくとも１本の第二の金属細線、前記スイッチング素子、前記第一の配線部材、前記第二の配線部材、前記第一の金属細線および前記第二の金属細線を収納する外装ケース、前記外装ケースに封入する封入樹脂とを有する半導体装置であって、前記第一の金属細線は、前記第二の金属細線よりも線径が大きく、前記第一の金属細線の近傍に略並行に前記第二の金属細線を配線するとともに、前記第一の金属細線は、前記第二の金属細線よりも長く配線したことを特徴とする半導体装置。   A switching element, a first electrode and a second electrode formed on the switching element, a first wiring member electrically connected to the first electrode, and a connection between the first electrode and the first wiring member At least one first metal wire, a second wiring member electrically connected to the second electrode, at least one second metal wire connecting the second electrode and the second wiring member, A semiconductor device comprising: the switching element; the first wiring member; the second wiring member; the first metal thin wire; and an outer case that houses the second metal thin wire; and an encapsulating resin that is sealed in the outer case. The first fine metal wire has a larger diameter than the second fine metal wire, and the second fine metal wire is wired substantially parallel to the vicinity of the first fine metal wire. One thin metal wire is the second metal The semiconductor device is characterized in that longer lines than the line.
  2. スイッチング素子、前記スイッチング素子に形成された第一の電極と第二の電極、前記第一の電極と電気的に繋がる第一の配線部材、前記第一の電極と前記第一の配線部材を繋ぐ少なくとも１本の第一の金属細線、前記第二の電極と電気的に繋がる第二の配線部材、前記第二の電極と前記第二の配線部材を繋ぐ少なくとも１本の第二の金属細線、前記スイッチング素子、前記第一の配線部材、前記第二の配線部材、前記第一の金属細線および前記第二の金属細線を収納する外装ケース、前記外装ケースに封入する封入樹脂とを有する半導体装置であって、前記第一の金属細線は、前記第二の金属細線よりも線径が大きく、前記第一の金属細線の近傍に略並行に前記第二の金属細線を配線するとともに、前記第一の金属細線の高さは、前記第二の金属細線の高さより高くなるよう配線したことを特徴とする半導体装置。   A switching element, a first electrode and a second electrode formed on the switching element, a first wiring member electrically connected to the first electrode, and a connection between the first electrode and the first wiring member At least one first metal wire, a second wiring member electrically connected to the second electrode, at least one second metal wire connecting the second electrode and the second wiring member, A semiconductor device comprising: the switching element; the first wiring member; the second wiring member; the first metal thin wire; and an outer case that houses the second metal thin wire; and an encapsulating resin that is sealed in the outer case. The first fine metal wire has a larger diameter than the second fine metal wire, and the second fine metal wire is wired substantially parallel to the vicinity of the first fine metal wire. The height of one thin metal wire is the second The semiconductor device is characterized in that wiring to be higher than the height of the metal thin wires.
  3. 前記第二の金属細線は、前記第一の金属細線の間に挟まれるように配置されることを特徴とする請求項１又は２記載の半導体装置。   3. The semiconductor device according to claim 1, wherein the second thin metal wire is disposed so as to be sandwiched between the first thin metal wires. 4.
  4. 前記第一の金属細線は複数本平行して設けられ、そのうち、少なくとも前記第二の金属細線に最も近い金属細線を前記第二の金属細線の高さよりも高くしたことを特徴とする請求項２記載の半導体装置。   3. The plurality of first metal fine wires are provided in parallel, and at least a metal fine wire closest to the second metal fine wire is made higher than a height of the second metal fine wire. The semiconductor device described.
  5. 前記第二の金属細線と接続される配線パターン部は、前記第一の金属細線の下をくぐって形成されていることを特徴とする請求項３記載の半導体装置。   4. The semiconductor device according to claim 3, wherein the wiring pattern portion connected to the second thin metal wire is formed under the first thin metal wire.
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US9530707B2 (en) 2013-10-03 2016-12-27 Fuji Electric Co., Ltd. Semiconductor module

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