JP2010251335A - High-speed electrical connector - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain an electrically-connecting high-speed and high-density connector for differential application. <P>SOLUTION: The connector includes an interposer 180-C1 having a plurality of openings arrayed, and a housing supporting a first thin and long contact member and a second thin and long contact member by each of a plurality of cells 122-C positioned inside the openings. The interposer is formed of a conductive material, and the housing is formed of a dielectric material. The connector includes a plurality of circuit boards extended nearly vertically on the interposer, and a plurality of spacers between the circuit boards, and the housing includes slots each receiving an edge of each circuit board. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  This application claims the benefit of US Provisional Application No. 60 / 487,580, filed July 17,2003. This application is also a continuation-in-part of US patent application Ser. No. 10 / 234,859 (pending situation) filed on Sep. 5, 2002, which is filed on Jan. 7, 2002. No. 10 / 036,796 (pending situation), which is a continuation-in-part of the US provisional application 60 / 260,893 filed on January 12, 2001 and filed on October 12, 2001. Claims the benefit of U.S. Patent Application No. 60 / 328,396. Each of the applications identified above is hereby incorporated by reference.

  The present invention relates generally to electrical interconnect systems, and more particularly to high speed, high density interconnect systems for differential and single-ended transmission applications.

  The backplane system is composed of a composite printed circuit board called the backplane or motherboard and several smaller printed circuit boards called daughter cards or daughter boards that plug into the backbone. Each daughter card may include a chip called a driver / receiver. The driver / receiver transmits / receives signals to / from drivers / receivers on other daughter cards. For example, a signal path is formed between the driver / receiver on the first daughter card and the driver / receiver on the second daughter card. The signal path includes an electrical connector that connects the first daughter card to the backplane, a backplane, a second electrical connector that connects the second daughter card to the backplane, and a driver / receiver that receives the carrier signal. And a second daughter card.

  Various drivers / receivers used today are capable of transmitting signals at data rates of 5-10 Gb / sec and higher. An electrical connector for connecting each daughter card to the backplane is a limiting factor (data transfer rate) in the signal path. Furthermore, the receiver may receive a signal that is only about 5% of the original signal strength sent by the driver. This reduction in signal strength increases the importance of minimizing crosstalk between signal paths to avoid introducing signal degradation or errors in the digital data stream. In high speed, high density electrical connectors, it is even more important to eliminate or reduce crosstalk. Therefore, there is a particular need in the art for high-speed electrical connectors that can handle high-speed signals that reduce crosstalk between signal paths.

  The present invention provides a high speed electrical interconnect system designed to overcome the shortcomings of conventional interconnect systems. In a preferred embodiment, the present invention provides an electrical connector that can effectively handle high speed signals.

  Although compliant pins are widely used in a variety of other high speed interconnects, the embodiments described herein are a significant improvement over current systems. For example, due to the size and wiring of compliant functions, current systems typically have performance issues such as impedance discontinuities and crosstalk. In contrast, the preferred embodiments described herein can improve the adjustment of compliant pin termination performance to a printed circuit board. In particular, as described above, in the preferred embodiment, the connector uses a broadside coupled transmission line having a spatial relationship that can promote a particularly high degree of crosstalk isolation.

  According to some embodiments, an interconnect system is a first circuit board, comprising: (a) a first differential interconnect path; and (b) a first socket on a surface of the first circuit board. And (c) a first circuit board that also includes a second socket on the surface of the first circuit board, wherein the first differential interconnection path is electrically connected to the first socket. A first circuit board comprising a first signal path and a second signal path electrically connected to the second socket; a second circuit board comprising a second differential interconnection path; A connector that electrically connects a first differential interconnect path to the second differential interconnect path, and is an interposer having a first surface and a second surface opposite to the first surface. The first surface faces the surface of the first circuit board, and the interposer An interposer including an array of openings extending from the first surface to the second surface of the interposer, a first conductor having an end adjacent to the second surface of the interposer, and the first A second conductor that is substantially parallel to and substantially equal to one conductor, and also has an end adjacent to the second surface of the interposer, the first conductor, and the second conductor; A plurality of cells located in the array of openings, each including a housing supporting a first elongate contact member and a second elongate contact member; A first contact member of the first elongated contact member having a conductor contact portion, a substrate contact portion, and an intermediate portion between the conductor contact portion and the substrate contact portion, wherein the conductor contact portion is Said Physically contacting the end of one conductor, the substrate contacting portion physically contacting the first socket and engaging compliantly, and at least a portion of the intermediate portion is the first of the housings. A first contact member of the first elongate contact member that engages with one housing; a conductor contact portion; a substrate contact portion; and an intermediate portion between the conductor contact portion and the substrate contact portion. The first contact member of the second elongated contact members, wherein the conductor contact portion is in physical contact with the first end portion of the second conductor, and the substrate contact portion is in contact with the second socket. A first contact member of the second elongate contact member in physical contact and compliant engagement and at least a portion of the intermediate portion engages the first housing of the housing; With And an interconnect system comprising a connector.

  In some preferred embodiments, the housing is made of a dielectric material and the interposer is made of a conductive material or coated with a conductive material. In some embodiments, the dielectric material disposed between the first conductor and the second conductor includes a third circuit board having a first surface and a second surface. In some embodiments, the first conductor is disposed on the first surface of the third circuit board and the second conductor is disposed on the second surface of the third circuit board. In some embodiments, the third circuit board is sandwiched between a first spacer and a second spacer. In some embodiments, the first spacer has a groove on its first surface, the groove being aligned with and reflecting the first conductor. In some embodiments, the first spacer has at least one finger for attaching the spacer to the interposer, and the interposer has at least one recess for receiving the at least one finger. . In some embodiments, the second spacer has a groove on its first surface, the groove aligns with and reflects the second conductor. In some embodiments, the first of the housings includes a slot adapted to receive the third circuit board. In some embodiments, the first of the housings further includes a channel adapted to receive the conductor contacts of the first and second elongate contact members. In some embodiments, the conductor contact is flexibly housed within the channel, and the channel extends beyond the distal end of each of the first and second elongate contact members. In some embodiments, the substrate contact includes pins having a diameter less than about 0.04 inches, or in some embodiments less than about 0.03 inches, or in some embodiments, less than about 0.02 inches. . In some embodiments, the housing has a width of less than about 0.3 inches, or in some embodiments less than about 0.2 inches, or in some embodiments, less than about 0.15 inches. In some embodiments, the connector supports differential applications higher than about 5 GBPS, or in some embodiments, higher than about 10 GBPS.

  According to some other embodiments, an interposer assembly for high speed and high density differential applications comprising: a) a first surface and a second surface opposite the first surface. B) the interposer includes an array of openings extending from the first surface of the interposer to the second surface of the interposer, and c) is located within the array of openings. A plurality of cells, each including a housing supporting a first elongate contact member and a second elongate contact member; d) the interposer is made of a conductive material or is conductive E) the housing is made of a dielectric material, and f) an intermediate between the conductor contact portion, the substrate contact portion, the conductor contact portion, and the substrate contact portion. A first contact member of the first elongate contact member, wherein the conductor contact portion is not attached to the first conductor and is in pressure contact, and the substrate contact portion is about 0. A first contact member of the first elongate contact member including a compliant pin having a diameter less than .04 inches and at least a portion of the intermediate portion engages a first housing of the housing. And g) a first contact member of the second elongate contact member having a conductor contact portion, a substrate contact portion, and an intermediate portion between the conductor contact portion and the substrate contact portion, The conductor contact portion is not attached to the second conductor and is adapted to make a pressure contact, and the substrate contact portion has a diameter less than about 0.04 inches. And an interposer assembly comprising a first contact member of the second elongate contact member, wherein at least a portion of the intermediate portion engages a first housing of the housing. The

  According to some other embodiments, a connector for high speed and high density differential applications that electrically connects a signal path on a first circuit board with a signal path on a second circuit board. A) an interposer having a first surface and a second surface opposite to the first surface; b) the interposer from the first surface of the interposer to the second of the interposer. An array of openings extending to a surface, and c) a plurality of cells located within the array of openings, each including a housing supporting a first elongate contact member and a second elongate contact member. D) the interposer is made of or coated with a conductive material, e) the housing is made of a dielectric material, and f) the interposer A plurality of circuit boards extending generally perpendicular to the g; a) a plurality of spacers between the circuit boards; and h) the housing each including a slot adapted to receive a respective edge of the circuit board. A connector is provided.

  In some embodiments, the first and second elongate contact members include leaf springs that press each conductor on the circuit board. In some embodiments, the circuit board includes a plurality of signal conductors, and the number of signal conductors disposed on one first surface of the circuit board is disposed on the first surface of the second circuit board. Is not the same as the number of signal conductors. In some embodiments, the number of signal conductors disposed on the second surface of the first circuit board is one less than the number of signal conductors disposed on the first surface of the second circuit board. Or one more. In some embodiments, each housing includes at least one tab adapted to engage with at least one corresponding slot of the interposer. In some embodiments, the conductors between adjacent circuit boards are staggered to increase the distance between the conductors between the adjacent printed circuit boards.

  According to some other embodiments, a method of manufacturing a connector comprising: a) an interposer, an array of openings extending from a first surface of the interposer to a second surface of the interposer Providing an interposer made of or coated with a conductive material, and b) a housing each supporting a first elongate contact member and a second elongate contact member Providing a plurality of cells, each comprising a housing made of a dielectric material and having a slot each adapted to receive an edge of each circuit board; and c) a plurality of printed circuits. A first and second elongated contact so that an edge of the printed circuit board is received in each of the slots of the housing. As member is conductive and engagement of each of both surfaces of the printed circuit board, the method including: a moving in a direction toward the interposer be substantially perpendicular to the interposer it is carried out.

  In some embodiments, the first and second elongate contact members deploy leaf spring portions on the first and second elongate contact members that are displaced by the printed circuit board when inserted into the slot. Thereby engaging the respective conductors on both sides of the printed circuit board. In some embodiments, the method includes aligning a plurality of spacers between the printed circuit boards by inserting protrusions extending from the spacers into engaging recesses of the interposer. Is further included. In some embodiments, the method further includes inserting the housing into the interposer until an outwardly extending tab is received in each slot of the interposer.

  The accompanying drawings, which are incorporated in and form a part of this specification, serve to illustrate various embodiments of the invention and, when used in conjunction with this description, explain the principles of the invention and allow those skilled in the art to understand the invention. It further helps to make it possible to manufacture and use. In the drawings, like reference numbers indicate identical or functionally similar elements. Also, for ease of reference, the leftmost digit of a reference number often identifies the drawing in which that reference number first appears.

  In general, FIGS. 1-36 are illustrations of exemplary preferred embodiments, particularly in connection with compression mount connectors or interconnections, and FIGS. 37-46 are specifically illustrative of compliant mount connectors or interconnections. FIG. 6 is a diagram of another preferred embodiment relating to a connection.

It is an expanded view of the connector by the example of embodiment of this invention. 1 is a diagram of a printed circuit board according to an embodiment of the present invention. FIG. 3 is a front view of the printed circuit board shown in FIG. 2. FIG. 6 is a perspective view of a spacer according to an example embodiment of the present invention. It is a top view of the 1st surface of the spacer shown in FIG. It is a top view of the 2nd surface of the spacer shown in FIG. It is a front view of the spacer shown in FIG. It is a top view of the 1st surface of the 2nd spacer. It is a top view of the 2nd surface of the 2nd spacer. It is a perspective view of the apparatus which consists of a circuit board pinched | interposed into two spacers. It is a front view of the apparatus shown in FIG. It is a figure which shows arrangement | positioning of the multi-circuit board | substrate and multi-spacer by the example of embodiment of this invention. 1 is a plan view of a first surface of a circuit board according to an embodiment of the present invention. It is a figure which shows how the alignment of the conductor on an A type circuit board differs from the alignment of the conductor on a B type circuit board. It is a figure which shows the contact member by one Embodiment of this invention. FIG. 3 shows a cell according to one embodiment of the invention. FIG. 3 shows a cell according to one embodiment of the invention. FIG. 6 shows that a cell can be adapted to fit into an opening in an interposer. FIG. 6 shows that a cell can be adapted to fit into an opening in an interposer. It is a figure which shows the finger of the spacer inserted in the notch corresponding to an interposer. FIG. 6 illustrates the placement of interposer 180 relative to substrate 120 and relative to substrates 2190 and 2180, according to one embodiment. 1 is a cross-sectional view of an embodiment of a connector 100. FIG. FIG. 3 shows an embodiment of a backbone 150. FIG. 6 shows an embodiment of an end cap 199. 2 is an exploded view of a backbone 150 and an end cap 199. FIG. It is the figure which assembled the backbone 150 and the end cap 199. FIG. FIG. 4 is a diagram of spacers connected to the backbone 150. It is a figure which shows embodiment of the attachment clip 190b. It is an exploded view of the clip 190b and the end cap 199. It is a figure of the clip 190b to which the end cap 199 was attached. FIG. 6 is a diagram illustrating an embodiment of a shield 160. 4 is an exploded view of a shield 160 and an interposer 180. FIG. FIG. 4 is a diagram of a shield 160 connected to an interposer 180. It is the figure of the assembled connector which abbreviate | omitted the interposer 180 and the clip 190a. FIG. 36 shows different views of the connector 100 according to one embodiment assembled without cells in FIG. 35 and with two cells in FIG. FIG. 36 shows different views of the connector 100 according to one embodiment assembled without cells in FIG. 35 and with two cells in FIG. FIG. 6 is a front perspective view of exemplary components of a connector according to some exemplary other embodiments of the present invention, including interposers loaded with inserts, spacers, and the like. FIG. 38 is a side perspective view from the rear right side in the direction of arrow 38 shown in FIG. 37 showing exemplary components of the connector, particularly the interposer and spacer loaded with the insert. FIG. 38 is a side perspective view, seen from the rear right side, in the direction of arrow 39 shown in FIG. 37 showing exemplary components of the connector, in particular a printed circuit board. FIG. 38 is a partial enlarged view of FIG. 37, showing an enlarged view of a plurality of cells or inserts loaded in the interposer. FIG. 38 is a further enlarged view of a part of FIG. 37, showing an enlarged view of one of the cells or inserts loaded into the interposer. FIG. 2 is a schematic diagram illustrating these spatial relationships when the electrical components of the connector correspond to the footprint of the motherboard or daughter card, for example showing a connector equipped with a plurality of substantially parallel printed circuit boards and spacers. FIG. FIG. 39 is a schematic rear sectional view of a portion of the loaded interposer shown in FIG. 37 taken in the direction as indicated by line AA shown in FIG. FIG. 3 is a plan view of a cell or insert for loading into an interposer according to some preferred embodiments of the present invention. FIG. 45 is a front view of the cell or insert shown in FIG. 44. FIG. 45 is a front perspective view of the cell or insert shown in FIG. 44.

  While the invention may be implemented in many different forms, many illustrative embodiments are now considered to be illustrative of the principles of the invention and the present disclosure The examples are described with the understanding that the invention is not intended to be limited to the preferred embodiments described and / or illustrated herein.

  In the following, it is described in two parts. Part 1 is typically related to compression mount connectors or interconnections as described in connection with FIGS. 1-36, etc., and part 2 is generally compliant as described in connection with FIGS. 37-46, etc. Related to mount connector or interconnect.

(Part 1: Embodiment related to compression mount connector, for example)
FIG. 1 is an exploded view of a connector 100 according to an example of a preferred embodiment of the present invention. Some components are omitted for ease of understanding. As shown in FIG. 1, the connector 100 may include at least one printed circuit board 120 having a conductor printed thereon. In the illustrated embodiment, connector 100 further includes spacer pair 110a and 110b, interposer pair 180a and 180b, end cap pair 199 (199a and 199b), backbone 150, shield 160 and end plate pair 190 (ie 190a and 190b). Can be included. Although only one circuit board and two spacers are shown in FIG. 1, those skilled in the art will appreciate that in a typical configuration, connector 100 includes a number of circuit boards and spacers, with each circuit board being It will be understood that it is placed between two spacers.

  FIG. 2 is a diagram of the printed circuit board 120. In the illustrated embodiment, the circuit board 120 is generally rectangular in shape. As shown, the circuit board 120 may have one or more conductors disposed on its surface 220. In the illustrated embodiment, the substrate 120 provides four conductors 201, 202, 203 and 204 on the surface 220. Each conductor 201-204 has a first end, a second end, and an intermediate portion between the first end and the second end. The first end of each conductor is located on or adjacent to the first edge 210 of the surface 220, and the second end of each conductor is on or to the second edge 211 of the surface 220. Located at an adjacent point. In many embodiments, the second edge 211 of the surface 220 is perpendicular to the first edge 210, as shown in the embodiment illustrated in FIG.

  Although not shown in FIG. 2, a corresponding conductor exists on the opposite surface of the circuit board 120. Specifically, a conductor which is a mirror image of this conductor exists on the opposite surface to each of the conductors 201 to 204. This feature is illustrated in FIG. 3, which is a front view of the substrate 120. As shown in FIG. 3, the conductors 301 to 304 are disposed on the surface 320 of the substrate 120 facing away from the surface 220. As further illustrated, conductors 301-304 correspond to conductors 201-204, respectively.

  When the interconnection system 100 of the present invention is used for differential signal transmission, one of the conductors 201-204 and the corresponding conductor on the opposite surface are used together to transmit the differential signal. Two wire balanced pairs required for transmission can be formed. Since the lengths of the two conductors are the same, there should be no skew between the two conductors (skew is the difference in time required for a signal to propagate through the two conductors). .

  In configurations where the connector 100 includes multiple circuit boards 120, the circuit boards are preferably arranged in series and in parallel. Preferably, in such a configuration, each circuit board 120 of connector 100 is disposed between two spacers 110.

  FIG. 4 is a side perspective view of a spacer 110a according to one embodiment of the present invention. As shown, the spacer 110a may include one or more grooves on the surface 420 that does not face the substrate 120. In the illustrated embodiment, the surface 420 of the spacer 110a is provided with three grooves 401, 402 and 403. Each groove 401-403 extends from a point on or near the first edge 410 of the surface 420 to a point on or near the second edge 411 of the surface 420. In many embodiments, the second edge 411 of the surface 420 is perpendicular to the first edge 410, as shown in the embodiment illustrated in FIG.

  As further shown, the surface 420 of the spacer 110a may be provided with one or more indentations at the edges of the surface 420. In the illustrated embodiment, there are two sets of four depressions at the edge of surface 420. The first indentation set includes indentations 421a-d, and the second indentation set includes indentations 431a-d. Each indentation 421a-d is located immediately adjacent to the end of at least one groove and extends from a point on the edge 410 of the surface 420 to a second point spaced inward from the edge 410 by a short distance. Similarly, each indentation 431a-d is located immediately next to the end of at least one groove and is a second point spaced inward from the point on edge 411 of surface 420 by a short distance from edge 411. Extend to. Thus, in the illustrated embodiment, there is at least one indentation between the ends of all the grooves. Each recess 421, 431 is designed to receive the end of a spring element (see FIG. 16, element 1520).

  Although not shown in FIG. 4, a groove and a recess may be formed on the surface 491 on the opposite side of the spacer 110a. In a preferred embodiment, the number of grooves in the first surface of spacer 110 is one less (or one more) than the number of grooves in the second surface of spacer 110, but this is not a requirement. Similarly, in this preferred embodiment, the number of depressions on the first surface of spacer 110 is two less (or two more) than the number of depressions on the second surface of spacer 110. This feature is illustrated in FIGS. 5 is a plan view of the surface 420, FIG. 6 is a plan view of the opposite surface (ie, the surface 491), and FIG. 7 is a front view of the spacer 110a.

  As shown in FIG. 5, the grooves 401 to 403, the recesses 421a to d and the recesses 431a to 431d are arranged on the surface 420 of the spacer 110a. Similarly, as shown in FIG. 6, the grooves 601 to 604, the recesses 621 a to c and the recesses 631 a to c are arranged on the surface 491 of the spacer 110 a facing in the direction opposite to the surface 420.

  The grooves 601 to 604 extend from a point on the first edge 610 of the surface 491 to a point on the second edge 611 of the surface 491, similar to the grooves 401 to 403. Similarly, the recesses 621 and 631 are similar to the recesses 421 and 431. Like each recess 421, each recess 621 extends from a point on the edge 610 of the surface 491 to a second point spaced inward from the edge 610 by a short distance. Similarly, each recess 631 extends from a point on the edge 611 of the surface 491 to a second point spaced inward from the edge 611 by a short distance. Each indentation 621, 631 is designed to receive the end of a spring element (see FIG. 16, element 1520).

  These figures show that in some embodiments, the number of grooves on one side of the spacer 110 is one less (or one more) than the number of grooves on the opposite side of the spacer. . It also shows that the number of indentations on one side may be two less (or more than two) than the number of indentations on the opposite side.

  In the embodiment shown in FIGS. 4-6, each indentation on one surface is positioned so that it is approximately immediately opposite the end of the groove on the opposite surface. For example, the indentation 421a is almost immediately opposite the end of the groove 604, and the indentation 621a is almost immediately opposite the end of the groove 403. This feature can be more easily understood by examining FIG. 7, which is a front view of the spacer.

  Returning to FIGS. 4-6, FIG. 4 shows that the spacer 110a may further include three fingers 435, 437 and 440. FIG. In addition, the spacer 110a includes a slot 444, a first boss pair 450 disposed on the surface 420 and projecting outward from the surface, and a second boss pair 650 disposed on the surface 491 and projecting outward from the surface. It can also be included. The boss 650 is fitted into the opening 244 of the circuit board 120. This feature allows the substrate 120 to be properly aligned with the adjacent spacers 110a and 110b.

  The finger 435 is located on the upper front side of the spacer 110a, and the finger 437 is located on the front side of the bottom surface of the spacer 110a. The finger 435 protrudes outward from the front surface of the spacer 110a in a direction perpendicular to the front surface of the spacer. Similarly, the finger 437 protrudes outward from the bottom surface of the spacer 110a in a direction perpendicular to the bottom surface of the spacer. Fingers 435 and 437 serve to attach spacer 110a to interposers 180b and 180a, respectively. Specifically, the interposer 180a includes a recess 1810 (see FIG. 18) that receives and holds the finger 437. Similarly, the interposer 180b includes a recess that receives and holds the finger 435. Fingers 435 and 437 include protrusions 436 and 438, respectively. The protrusions are sufficiently elastic to be able to fit into corresponding recesses in the corresponding interposer.

  The slot 444 is closer to the back surface of the spacer 110a but away from the back surface. The slot 444 extends downward from the top surface of the spacer 110 to form a finger 440. The fingers 440 and the slots 444 work together, and the spacer 110a is attached to the backbone 150.

  Returning to spacer 110b (see FIG. 1), in the illustrated embodiment, spacer 110b is similar but not identical to spacer 110a. Accordingly, in some embodiments, the connector 100 includes two types of spacers, Type A and Type B. In other embodiments, more or less than two types of spacers may be used. 8 and 9 further illustrate a spacer 110b (type B spacer) according to one embodiment. FIG. 8 is a plan view of the surface 820 of the spacer 110b. The surface 820 faces the circuit board 120. As shown in FIG. 8, the surface 820 is similar to the surface 491 of the spacer 110a, which also faces the substrate 120. Like surface 491, surface 820 has four grooves 801-804, a first set of three indentations 821a-c and a second set of three indentations 831a-c.

  The grooves 801-804 are similar to the grooves 601-604 in that each groove 801-804 extends from a point on the first edge 810 of the surface 820 to a point on the second edge 811 of the surface 820. Similarly, the recesses 821 and 831 are similar to the recesses 621 and 631. Like each recess 621, each recess 821 extends from a point on the edge 810 of the surface 820 to a second point spaced inward from the edge 810 by a short distance. Similarly, each indentation 831 extends from a point on edge 811 of surface 820 to a second point spaced inward from edge 811 by a short distance.

  FIG. 9 is a plan view of the surface 920 of the spacer 110b. The surface 920 faces the side away from the circuit board 120 in the direction opposite to the surface 820. As shown in FIG. 9, the surface 920 is similar to the surface 420 of the spacer 110a, which also faces away from the substrate 120. Like surface 420, surface 920 has three grooves 901-903, a first set of four recesses 921a-d and a second set of four recesses 931a-d.

  The grooves 901-903 are similar to the grooves 401-403 in that each groove 901-903 extends from a point on the first edge 910 of the surface 920 to a point on the second edge 911 of the surface 920. Similarly, the recesses 921 and 931 are similar to the recesses 421 and 431. Each indentation 921 extends from a point on edge 910 of surface 920 to a second point spaced inward from edge 910 by a short distance, and each indentation 931 extends from a point on edge 911 of surface 920 to edge 911. Extends to a second point spaced inward by a short distance.

  The spacer 110b also includes three fingers 835, 837 and 840, a slot 844, and an opening pair 850 that passes through the spacer 110b. Opening 850 is adapted to receive boss 650. This feature allows the spacer 110b to be properly aligned with the spacer 110a.

  Unlike the finger 435 located on the upper front side of the spacer 110a, the finger 835 is located on the lower front side of the spacer 110b. Similarly, unlike the finger 437 located at the front of the bottom surface of the spacer 110a, the finger 837 is located at the back of the bottom surface of the spacer 110b. The finger 835 protrudes outward in a direction perpendicular to the front surface of the spacer 110b from the front surface of the spacer 110b, and the finger 837 protrudes outward in a direction perpendicular to the bottom surface of the spacer 110b. Yes. Like fingers 435 and 437, fingers 835 and 837 act to attach spacer 110b to interposers 180b and 180a, respectively.

  As described above, the substrate 120 is positioned between the spacers 110a and 110b. This feature is shown in FIG. Although not shown in FIG. 10, the boss 650 of the spacer 110a protrudes through the opening 244 of the substrate 120 and the opening 850 of the spacer 110b. Use of the boss 650 facilitates correct alignment of the spacers 110a and 110b and the substrate 120. When the substrate 120 is properly aligned with the spacer, the conductors 201-204 and 301-304 are aligned with the grooves 601-604 and 801-804, respectively. This feature is shown in FIG.

  As shown in FIG. 11, the grooves 601 to 604 arranged on the surface of the spacer 110a facing the substrate 120 are positioned on the spacer so as to reflect the conductors 201 to 204 on the printed circuit board 120. . Similarly, the grooves 801 to 804 arranged on the surface of the spacer 110 b facing the substrate 120 are positioned on the spacer so as to reflect the conductors 301 to 304. In particular, the grooves 601 to 604 and 801 to 804 prevent the conductors 201 to 204 and 301 to 304 from touching the spacers 110a and 110b, respectively. In this way, the conductor disposed on the substrate 120 is insulated by the air trapped between the substrate 120 and the trench.

  The spacer 110 may be made of a conductive material, or may be made of a dielectric material and covered with a conductive layer, thereby electromagnetically shielding the conductor of the printed circuit board 120. Furthermore, the combined impedance of the conductors and their corresponding grooves can be adjusted by changing their dimensions. Furthermore, the breakdown voltage can be adjusted so that the groove includes a layer of a dielectric material such as Teflon (registered trademark), and the composite impedance between the conductor and the corresponding groove can be further adjusted.

  Next, FIG. 12 shows an example of the arrangement of the spacer 110 and the circuit board 120 when a multi-circuit board is used for the connector 100. As shown, the substrate 120 and the spacer 110 are continuously aligned in parallel, and each circuit board 120 is sandwiched between two spacers. In the illustrated example, there are two types of substrates (A) and (B) along with the two types of spacers (A) and (B) described above. The A type circuit boards are identical to each other, and the B type circuit boards are identical to each other. Similarly, A-type spacers are identical to one another, and B-type spacers are identical to one another.

  In the illustrated embodiment, the spacers 110 and the substrate 120 are arranged alternately. That is, there is a B type spacer between two given A type spacers, and vice versa. In addition, there is a B type substrate between two given A type substrates, and vice versa. Thus, an A type spacer is not adjacent to another A type spacer, and an A type substrate is not adjacent to another A type substrate. Therefore, in the configuration of this example, each substrate 120 is disposed between the A type spacer and the B type spacer.

  As can be seen from FIG. 12, each surface of each substrate 120b (B type substrate) has three conductors. FIG. 13 is a plan view of one surface 1320 of the B-type substrate (the other surface not shown is a mirror image of the surface 1320). As shown in FIG. 13, three conductors 1301, 1302, and 1303 are arranged on the surface 1320. By comparing FIG. 13 with FIG. 2 (plan view of the surface of the A type substrate), it can be seen that the A and B type substrates are almost identical. One difference is the number of conductors on each face and the arrangement of conductors on the face. In the illustrated embodiment, the B type substrate has one less conductor than the A type substrate.

  FIG. 14 shows how the arrangement of the conductors 1301 to 1303 on the B type substrate is different from the arrangement of the conductors 201 to 204 on the A type substrate. FIG. 14 shows representative substrates 120a and 120b side by side such that the leading edge 1401 of substrate 120a is spaced apart and parallel to the corresponding leading edge 1402 of substrate 120b. From FIG. 14, it can be clearly seen that the end of the conductor on the B type substrate located at the edge 1402 is not aligned with the end of the conductor on the A type substrate located at the edge 1401. For example, in the illustrated example, the end of a given conductor on the B type substrate is spaced apart from the ends of two adjacent conductors on the A type substrate. That is, if the shortest line is drawn from the end of each conductor on the B substrate to the adjacent surface of the A substrate, this line ends at the point between the ends of the two conductors on the A substrate. For example, the shortest line from the end of the conductor 1301 to the adjacent surface of the substrate 120a ends at the point between the ends of the conductors 204 and 203. The advantage of shifting the conductor is that it can reduce crosstalk in the connector.

  Returning to FIG. 12, it can be clearly seen that each conductor on each substrate 120 is aligned with a groove on the spacer immediately adjacent to that conductor. That is, each groove on each spacer 110 is designed to reflect a corresponding conductor on adjacent substrate 120. Since each conductor is aligned with the corresponding groove, there is a space between the conductor and the spacer.

  When connector 100 is fully assembled, each conductor on substrate 120 makes physical and electrical contact with two contact members (see exemplary contact member 1530a in FIG. 15). The end of each contact member fits into the space between the adjacent spacer and conductor. Specifically, the first end of each conductor is in physical and electrical contact with the contact portion of the first contact member, and the second end of each conductor is physically and electrically in contact with the contact portion of the second contact member. Touch. The contact portions of the first and second contact members are each placed in the space between the corresponding end portion of the conductor and the spacer. Each contact member acts to electrically connect the conductor that the contact member contacts to a trace on the circuit board to which the connector 100 is attached.

  FIG. 15 illustrates a contact member 1530a according to one embodiment of the present invention for electrical connection of conductor 201 on substrate 120 to a trace on a circuit board (not shown in FIG. 15) to which connector 100 is attached. . Since a part of the contact member 1530a is located in the housing 1522, only a part of the contact member can be seen in FIG.

  As shown in FIG. 15, contact member 1530a contacts the end of conductor 201 (spacers and interposers are not shown to better illustrate this feature). In some embodiments, both ends of the conductor 201 are wider than the middle so that the surface area for receiving the contact portion of the contact member is greater.

  FIG. 15 partially shows another contact member 1530b. The bottom of the contact member 1530b is also covered with the housing 1522. The contact member 1530b contacts the end of the conductor 301 that cannot be seen in FIG. The housing 1522 is preferably made of an electrically insulating material such as plastic. The electrical contacts 1530 of each housing 1522 can be disposed within the housing during manufacture or can be subsequently fitted into the housing.

  Contact member 1530 may be manufactured by commonly available techniques utilizing any material having appropriate electrical and mechanical properties. You may manufacture with laminate materials, such as gold-plated scale bronze. Although illustrated as a unitary structure, those skilled in the art will appreciate that it may comprise multiple components.

  As further shown in FIG. 15, the housing 1522 may be configured to hold two extension springs 1520a and 1520b. Spring 1520 extends in the same direction as contact members 1530 and 1531. The distal end of the spring 1520 is designed to be inserted into the corresponding spacer recess. For example, the distal end of spring 1520a is designed to be received in recess 621c. The combination of housing 1522, contact member 1530, and spring 1520 is referred to as cell 1570.

  16 and 17 further illustrate a cell 1570 according to one embodiment. FIG. 17 is an exploded view of the cell 1570. As shown, the housing 1522 is generally rectangular in shape and includes an opening 1710 for receiving the spring 1520 and an opening 1720 for receiving the contact material 1530. The opening 1720 extends from the top surface of the housing to the bottom surface so that the proximal end 1641 of the contact member 1730 can protrude beyond the bottom surface of the housing 1522 as shown in FIG.

  Opening 1710 extends from the top surface of housing 1522 to the bottom surface, but does not reach the bottom surface. Thus, when the spring 1520 is inserted into the opening 1710, the proximal end does not protrude beyond the bottom surface of the housing 1522. Although an open opening 1710 is illustrated, it will be appreciated that a closed opening may be used.

  As shown in FIG. 17, each contact member 1530 according to the illustrated embodiment has a proximal end 1641 and a distal end 1749. Between the ends 1641 and 1749 there is a base 1743, a transition 1744 and a contact 1745. Base 1743 is between proximal end 1641 and transition 1744, transition is between base 1743 and contact 1745, and contact 1745 is between transition 1744 and distal end 1749. . In the illustrated embodiment, the base 1743 is disposed within the opening 1720 such that substantially the entire base is within the housing 1522, the transition 1744 is tilted inward with respect to the base, and the distal end 1749 is the transition. It acts as an introduction part by being inclined outward.

  In a preferred embodiment, the contact portion of the contact member is not secured to the end of the conductor that makes physical and electrical contact. For example, the contacts are not soldered or otherwise secured to the conductors of the substrate 120, as is typically done in the prior art. Instead, in the preferred embodiment, contact member 1630 is electrically connected to the corresponding conductor by a wiping action similar to that used in card edge connectors. That is, the contact portion of the contact member simply presses the end portion of the corresponding conductor. For example, returning to FIG. 15, the contact portion of the contact member 1530 a simply presses or presses the end of the conductor 201. Because it is not fixed to the conductor, the contact can move along the length of the conductor while pressed against the conductor to create a wiping action. This wiping action ensures a good electrical connection between the contact member and the corresponding conductor of the printed circuit board 120.

  Next, FIGS. 18 and 19 show that each cell 1570 is designed to fit into the opening 1811 of the interposer 180. In the illustrated embodiment, each interposer 180 is arranged in a first aligned set to form a first vertical and horizontal arrangement (see FIG. 19) and a second aligned set. And a second set of openings 1811b for creating a second vertical and horizontal arrangement. In the illustrated embodiment, each column of the second set is disposed between two columns of the first set. For example, a row 1931 that is a row of openings 1811b is disposed between rows 1930 and 1932 that are each a row of openings 1811a.

  As shown in the figure, the second vertical and horizontal arrangements are arranged so that the second set of openings are aligned with each other but not with the first set of openings, and vice versa. 1 is shifted from the vertical and horizontal arrangement.

  The interposer 180 may be electromagnetically shielded from the conductors of the printed circuit board 120 by being made of a conductive material or a non-conductive material coated with a conductive material.

  Also, as shown in FIGS. 18 and 19, the interposer 180 includes notches 1810 along the top and bottom surfaces. Each notch 1810 is designed to receive the end of a finger of spacer 110. Preferably, the fingers snap into the corresponding notches to secure the spacer 110 to the interposer 180. This feature is shown in FIG.

  When the connector 100 is fully constructed, the first and second sets of openings each receive a cell 1570. The housing 1522 of each cell 1570 has a tab 1633 adapted to fit into a slot 1888 provided in a corresponding opening of the interposer 180. Slot 1888 does not extend the entire length of the opening. Accordingly, tab 1633 prevents cell 1570 from falling out of the opening. It will be appreciated that the particular shapes of the cells and corresponding openings are for illustration only. The present invention is not limited to these shapes.

  In addition, when the connector is completely constructed, the interposer is configured such that the contact portion 1745 of each contact member 1530 contacts the corresponding conductor. FIG. 21 illustrates this concept.

FIG. 21 shows the placement of the interposer 180 relative to the substrate 120 and relative to the substrates 2190 and 2180. The substrate 120 and the interposer 180 are arranged so that the front surface 2102 of the substrate 120 is aligned with the vertical center line of the opening of the interposer 180b, and the bottom surface 2104 of the substrate 120 is aligned with the vertical center line of the opening of the interposer 180a. The spacers 110 are not shown in the figure to show that they are arranged to fit. FIG. 21 also shows two cells 1570, each located in the opening of the interposer 180. As shown in FIG. 21, the contact member 1530 of each cell 1570 is in physical contact with the corresponding conductor.

  Although not shown in FIG. 21, during use of the connector 100, the proximal end 1641 of each contact member 1530a, b contacts a conductive element on a circuit board connected to the connector 100. FIG. For example, the end 1641 of the contact member 1530b contacts a conductive element on the circuit board 2190, and the end 1641 of the contact member 1530a contacts a conductive element on the circuit board 2180. Accordingly, FIG. 21 shows that there is at least one electrical signal path from the board 2190 through the connector 100 to the board 2180. The electrical signal path includes a conductor 214, a contact member 1530b, and a contact member 1530a. As will be appreciated by those skilled in the art, connector 100 provides a number of electrical signal paths from boards 2190 and 2180, each signal path including two contact members 1530 and a conductor on board 120.

  According to the embodiment shown in FIG. 21, each interposer is arranged in parallel with one circuit board connected to the connector 100. Specifically, the interposer 180a is parallel to the circuit board 2180, and the interposer 180b is parallel to the circuit board 2190. Accordingly, one surface of the interposer 180a faces the substrate 2180, and one surface of the interposer 180b faces the substrate 2190.

  Next, FIG. 22 is a cross-sectional view of the connector 100, and as described above, during use of the connector 100, each proximal end 1641 of each contact member 1530 contacts the conductive element 2194 on the circuit board 2190. Show. In the preferred embodiment, each conductive element 2194 is a signal pad and not a via. Thus, in the preferred embodiment, the connector 100 is a compression mount connector because each proximal end 1641 simply presses the circuit board and is not inserted into a via in the circuit board. However, in other embodiments, each element 2194 may be a via or other conductive element.

  In a preferred embodiment, the substrate 2190 includes a differential signal path having a first signal path 2196a (eg, a first trace) and a second signal path 2196b (eg, a second trace). As shown, the first pad 2194a is connected to the first signal path 2196a and the second conductive element 2194b is connected to the second signal path 2196b. Second circuit board 2180 may also have a conductive element pair, such as element 2194, electrically connected to a signal path pair, such as path 2196.

  As shown in FIG. 22, the cell 1570 is inserted into the opening of the interposer 180. As further shown, the distal end of each contact member 1530 of cell 1570 extends beyond the top surface 2250 of the interposer, and the proximal end 1641 of each contact member 1530 extends beyond the bottom surface 2251 of the interposer. This bottom surface faces the substrate 2190 and is substantially parallel to it. Each proximal end 1641 presses a conductive element 2194 on the substrate 2190. Similarly, each contact portion 1745 of the contact member 1530 presses the conductor on the substrate 120. Accordingly, contact member 1530 electrically connects the conductor on substrate 120 with conductive element 2194 on substrate 2190. As shown in FIG. 22, the end of the conductor of the substrate 120 is near the top surface 2250 of the interposer.

  When the end 1641 of the contact member 1530 presses against the corresponding element 2194, the normal force generated by the element is applied to the contact member. Since the contact member 1530 is firmly held in the housing 1522, the normal force causes the housing 1522 to move in the normal force direction (ie, away from the circuit board 2190). However, when the housing 1522 moves away from the substrate 2190, the spring 1520 contracts and exerts a force in the opposite direction to the normal force generated by the substrate 2190, so that the spring 1520 causes the housing 1522 to move away from the substrate 2190. The size of moving away is limited. This occurs because the distal end of the spring abuts the surface of the spacer 110 and the spacer is firmly attached to the interposer 180 and the interposer itself does not move relative to the substrate 2190. Thus, the spring 1520 contracts and applies a force in the opposite direction to the normal force to the housing.

  Returning to FIG. 1, each spacer 110 may be configured to be attached to an elongated backbone 150. Connector 100 may also include two end caps 199 (199a and 199b) each designed to be attached to each end of backbone 150. The backbone 150 and end cap 199 (199a and 199b) are described below.

  FIG. 23 illustrates an embodiment of the backbone 150. The backbone 150 according to the illustrated embodiment includes a boss 2300 adapted to engage end caps 199 (199a and 199b) and slots each adapted to receive fingers 440 of the spacer 110 as shown in FIG. 2320. Backbone 150 may further include teeth 2330 adapted to engage spacer 110.

  FIG. 24 shows an embodiment of the end cap 199. End cap 199 according to the illustrated embodiment includes an opening 2402 adapted to engage a boss disposed on an adjacent spacer and a boss 2300 disposed on backbone 150. End cap 199 further includes screws 2420 and pins 2410 adapted to mechanically couple connector 100 to a circuit board that may have multiple layers, for example, more than 30 layers, and end plate 190b (FIGS. 1 and 25). Tongs 2430 adapted to engage the reference).

  Although the end cap 199 is shown as being symmetrical, i.e., can be used at either end of the connector 100, separate left and right end caps may be used. The screw 2420 and the pin 2410 of the end cap 199 may be formed integrally with the end cap 199, or may be attached to the end cap 199 after manufacturing. It has been found that it is often necessary to utilize a metal screw 2420 rather than a plastic in terms of the mechanical stress involved. It will be appreciated that the invention is not limited to the use of screws 2420 and pins 2410, and other fastening means may be used.

  As described above, end cap 199 (199a and 199b) and spacer 110 may be manufactured from an insulating material such as plastic and coated with a conductive material to provide electromagnetic shielding or entirely metal. You may manufacture with electroconductive materials, such as.

  FIG. 25 is an exploded view of the backbone 150 and the end cap 199, and FIG. 26 is an assembled view of the backbone 150 and the end cap 199.

  As shown in FIGS. 25 and 26, the boss 2300 of the backbone 150 is inserted into the corresponding opening 2402 of the end cap 199 (199a and 199b) to form a rigid structure. The use of the boss 2300 and the opening 2402 is for illustrative purposes, and the present invention is not limited thereto. That is, the backbone 150 can be mechanically connected to the end cap 199 (199a and 199b) using other fastening means.

  Further, as shown in FIG. 27, the spacer 110 is mechanically connected to the backbone 150 using a combination of fingers 440 and slots engaged therewith. The illustrated combinations are for illustrative purposes and the present invention is not limited thereto. In a similar manner, the fingers 435, 437, 835, and 837 of the spacer 110 are engaged with corresponding slots in the interposer 180, as described above. The illustrated combinations of fingers and slots are for illustrative purposes, and the present invention is not limited thereto.

  Returning to FIG. 1, FIG. 1 shows that the connector 100 also includes two mounting clips 190a and 190b and a shield 160. FIG. Mounting clip 190 and shield 160 are combined with the components of connector 100 described above to form a composite arrangement. The mounting clip 190 and the shield 160 may be conductive so as to electromagnetically shield the signal carrying element of the connector 100. The mounting clip 190 and the shield 160 will be described in detail below.

  FIG. 28 shows an embodiment of a mounting clip 190b. The mounting clip 190b according to the illustrated embodiment includes (a) a pin 2860 adapted to engage a hole in a circuit board (eg, board 2190 or 2180) and (b) a tong of an end cap 199 (199a and 199b). Slot 2870 adapted to receive 2430. Pin 2860 acts to connect clip 190b to the circuit board by engaging the hole in the circuit board described above. Pin 2860 is electrically conductive and can be electrically and physically connected to the ground plane of the circuit board to which it is connected.

  FIG. 29 is an exploded view of the clip 190b and the end cap 199, and FIG. 30 is a view in which the end cap 199 is attached to the clip 190b. As shown in FIG. 30, the tongue 2430 of the end cap 199 is adapted to engage the corresponding slot 2870 of the clip 190b. As with the other fastening means shown, the invention is not limited to the use of tongues and corresponding slots.

  Next, FIG. 31 shows an embodiment of a shield 160. The shield 160 according to the illustrated embodiment includes a hook 3100 adapted to fit into a slot in the interposer 180. FIG. 32 is an exploded view of the shield 160 and the interposer 180. FIG. 33 is a diagram in which the shield 160 is connected to the interposer 180. FIG. 33 shows a state in which the hook 3100 of the shield 160 snaps into the slot of the interposer 180 and the both are mechanically connected.

  FIG. 34 is a view of the assembled connector with the interposer 180 and the clip 190a omitted. FIGS. 35 and 36 are different views of the fully assembled connector 100 according to one embodiment. FIG. 35 shows end caps 199a and 199b, shield 160, interposer 180a and clip 190b.

  FIG. 36 shows end caps 199a and 199b, interposers 180a and 180b, and clips 190a and 190b. Clip 190a may be attached to the entire assembly by any conventional fastening means, and may include pins or other fastening means for attaching assembled connector 100 to the daughter board, for example.

  Another interposer 180b and clip 190a may be the same as or different from (or not at all) the interposer 180a and clip 190b, depending on the application of the interconnect system assembly.

  Although the two interposers 180 are shown as being perpendicular to each other, the invention is not so limited. That is, depending on the application, the surfaces of the two interposers 180 may be at a 45 degree angle or other angles, for example. Accordingly, connector 100 need not be a “right angle” connector.

  As can be seen from FIGS. 34-36, the entire interconnect system assembly couples together to form a rigid structure that can completely shield the conductors on the printed circuit board 120.

(Part 2: Embodiment related to compliant pin connector, for example)
Figures 37-46 illustrate some other preferred embodiments of the present invention. In particular, the embodiment shown in FIGS. 37-46 is generally similar to the embodiment described above, and the commercial applications are also similar. However, the embodiment shown in FIGS. 37-46 preferably includes a two-piece connector with compliant pin connections.

  The components shown in FIGS. 37-46 can be used in a modified connector 100 that is substantially similar to the connector of any of the embodiments described above with reference to FIGS. 1-36. As in the embodiment described above, the modified connector 100 preferably has two interposers 180-C having an array of openings, cells 122-C inserted into the openings of the interposer, and a conductor on its surface. (E.g., printed or otherwise formed) having at least one printed circuit board 120-C and a plurality of spacers 110-C (e.g., spacers 110a-C and 110b-C as shown). Further, in some exemplary embodiments, the modified connector also includes a support structure, enclosure structure and / or other structure for maintaining components described with reference to FIGS. . For example, in some exemplary and non-limiting embodiments, the following: an end cap pair (see, eg, the above, not shown in FIGS. 37-46), a backbone (eg, the above) 37 (not shown in FIGS. 37-46), shield (see eg above, not shown in FIGS. 37-46) and end plate pair (see eg above, FIGS. 37-46). (Not shown in the figure)), preferably all. Those skilled in the art will appreciate that, in a typical configuration, as in the above-described embodiments, the modified connector 110 includes multiple circuit boards and spacers.

  However, the most preferred embodiment of the compression mounting scheme described above includes a one-piece connector, while the most preferred embodiment of the press-fit mounting scheme includes a two-piece connector. In this regard, in conventional two-piece connectors, one connector portion is typically bonded to the motherboard (eg, usually by some form of press-fit attachment method) as a permanent or semi-permanent attachment, and the connector second This connector part is also attached to the daughter card using some kind of press-fitting mechanism. When the daughter card slides into the card cage, the motherboard side portion (“header”) engages with the daughter card side portion (“socket”).

  In the preferred two-piece embodiment described below, the components are preferably attached as follows, unlike a one-piece connector where the complete connector is secured to, for example, a daughter card. First, both interposers are assembled in advance with the cell 122-C. The first interposer 180-C is then permanently or otherwise screwed, fitted and / or in some other way into the connector body (eg, including the circuit board 120-C and spacer 110-C), for example. Attach by semi-permanent adhesion. The assembly is then press-fitted into the daughter card (eg, in the same manner as a conventional two-piece connector socket). On the other hand, the second interposer is directly attached to the motherboard (for example, in the same manner as a conventional two-piece connector header). When the daughter card is slid into the card cage, the two connector portions are connected and the two connector portions are connected to each other (Note: as will be described in detail later, when the two connector portions are connected to each other, the cell 122 -Slots in C preferably help guide printed circuit board 120-C into place). Preferably, in order to permanently or semi-permanently attach the daughter card side interposer to the connector body, a latch mechanism is provided to connect the first interposer to the connector body. However, in the preferred embodiment, the daughter card can be removed from the motherboard as needed, and no latching mechanism is provided between the second interposer and the connector body.

  FIG. 39 is a side perspective view showing the printed circuit board 120-C in particular. In the illustrated embodiment, the circuit board 120-C is generally rectangular in shape. As shown, the circuit board 120-C may comprise one or more electrical conductors on its surface 220-C. In the illustrated embodiment, the substrate 120-C includes three conductors 201-C, 202-C, 203-C, and 204-C on the surface 220-C. Each conductor 201-C to 204-C has a first end, a second end, and an intermediate portion between the first end and the second end. As in the previous conductor, the first end of each conductor is located at a point on or adjacent to the first edge of the surface 220-C, and the second end of each conductor is the surface 220-C. Located on or adjacent to the second edge of C. As in the previous embodiment, the configuration may vary as desired depending on the situation, but in many embodiments, as shown, the second edge of surface 220-C is substantially perpendicular to the first edge. It is.

  As in the preferred embodiment described above, although not shown in FIG. 39, there is a corresponding conductor on the opposite side of the circuit board 120-C. Specifically, for each of the conductors 201-C to 204-C, there is a corresponding conductor that is a mirror image of this conductor on the opposite surface. This feature is illustrated in FIG. FIG. 42 is a cutaway front cross-sectional view of a plurality of circuit boards 120-C having conductor pairs on both sides.

  As described above, when the modified interconnect system 100 is used for differential signal transmission, one of the conductors and the corresponding conductor on the opposite side are used together to transmit the differential signal. The required two wire balanced pairs can be formed. Again, in the preferred embodiment, the lengths of the two conductors are the same, so there should be no skew between the two conductors (a signal propagates through the two conductors). Is the difference in time required for

  In configurations where the modified connector 100 includes a number of circuit boards 120-C, the circuit boards are preferably arranged in series and substantially parallel. Preferably, in such a configuration, each circuit board 120-C of connector 100 is located between two spacers 110-C (see, eg, spacers 110a-C and 110b-C, each of which is generically referred to herein). Also shown as reference number 110-C).

  FIG. 38 is a side perspective view of components of connector 100 including spacers 110a-C according to one embodiment of the present invention. As shown, the spacers 110a-C preferably include one or more grooves on their face 420-C. In the illustrated embodiment, the surface 420-C of the spacer 110a-C includes three grooves 401-C, 402-C, and 403-C. Each groove 401-C to 403-C extends from a point on or near the first edge of the surface 420-C to a point on or near the second edge of the surface 420-C.

  As shown in FIG. 38, the first and second edges of the spacers 110a-C preferably accommodate a housing 1522-C (discussed below) of a cell 122-C (discussed below) at each of the ends of the groove. A plurality of dents 110r. Each indentation preferably extends from a point on the edge of the surface to a second point spaced inward from the edge by a short distance. Thus, in the illustrated embodiment, there are depressions at the ends of all the grooves. Each indentation is designed to receive one side of each cell 122-C as shown in FIG.

  Although not shown in FIG. 38, as best shown in FIG. 42, in some preferred embodiments, spacer 110a (eg, as described above with reference to the embodiment shown in FIGS. 1-36). Similar grooves and depressions are present on the opposite side (not shown) of -C. In some preferred embodiments, the number of grooves in the first surface of spacer 110a-C is one less (or one more) than the number of grooves in the second surface of spacer 110a-C. But this is not a requirement. In various embodiments, the choice of spacer and groove thereon may be similar to that of any of the embodiments described above with reference to FIGS. As described above with reference to FIGS. 1-36, by way of example, in some embodiments, the number of grooves on one side of spacers 110a-C is one more than the number of grooves on the opposite side of the spacer. One less (or one more).

  The embodiment shown in FIGS. 37-46, preferably, as in the finger implementations described in the above-described embodiments shown in FIGS. 4-6, for example, is preferred when the connector is fully assembled (eg, a two-piece connector). Spacer fingers 435-C and / or 437-C extending in corresponding receiving slots 1810-C (see FIG. 38) of interposers 180-C1 and 180-C2) when both connector portions are attached to each other as described above. (Note: each of the interposers is also collectively referred to as reference number 180-C). The fingers are best shown, for example, in FIGS. 37, 38 and 40. As shown, in a preferred embodiment, a plurality of spacers 110-C, or all of them, each of at least one, and preferably two, protrusions that engage a first interposer 180-C1. Including protruding fingers that engage the fingers and / or at least one, preferably two, of the second interposer 180-C2. The fingers engage within each receiving slot within each interposer. Among other things, such finger and slot engagement is when assembling the first interposer and the connector body (eg attached to the daughter card) and / or when connecting the two parts of the two-piece connector together. It can be advantageous (for example, when the daughter card is slid into the card cage), for example, to facilitate alignment of the printed circuit board.

  Although not shown in FIGS. 37-46, in some embodiments, each of the spacers 110a-C has an opening in each of the circuit boards 120-C disposed on and projecting outward therefrom. One or more bosses (not shown) can be included that fit into the part. As in the embodiments described above with reference to FIGS. 1-36, this feature allows the substrate 120-C to be properly aligned with adjacent spacers (eg, spacers 110a-C and 110b-C). Can be used to help you.

  In some exemplary embodiments, each spacer includes a finger 435-C located above the front of the spacer 110-C and a finger 437-C located towards the bottom of the front of the spacer 110-C. Including. As described above, similar fingers 435-C and / or 437-C can be used to assist in attaching spacer 110-C to interposer 180-C1 and / or 180-C2. Specifically, in some preferred embodiments, interposers 180-C1 and 180-C2 are both aligned vertically to receive corresponding fingers 435-C and 437-C from each spacer. A dent 1810-C. In some embodiments, the fingers can include protrusions that are sufficiently elastic to allow them to snap or press into corresponding recesses in the corresponding interposer.

  Although not shown, the embodiment shown in FIGS. 37-46 includes a similar slot 444 and corresponding structure attached to a similar backbone 150 (shown further below) in some exemplary cases. obtain.

  As shown in FIG. 42, in some embodiments, two different spacer types, 110a-C and 110b-C, are interleaved in connector 100. Thus, in some embodiments, the connector 100 includes two types of spacers, type A (ie, 110a-C) and type B (ie, 110b-C). In some embodiments, the two spacer types are similar but not identical to each other. In other embodiments, more or less than two types of spacers may be used. As described above with reference to the embodiment shown in FIGS. 1-36, the two spacer types A and B, for example, allow adjacent printed circuit boards to have conductors staggered as shown, for example, in FIG. Can be used to obtain. Thus, similarly, as described above, the printed circuit board 120-C can also include two types A and B to cooperate with the spacer to achieve this relationship.

  In this regard, in a preferred embodiment, a plurality of substantially parallel printed circuit boards 120-C are disposed between alternating spacer types A and B, such as spacers 110a-C and 110b-C. As mentioned above, this is best shown in FIG.

  Again, although not shown, the boss of one of the spacers, in some embodiments, passes through an opening in each substrate 120-C and another one of the spacers b. It protrudes through the opening (eg, similar to the embodiment described above). In particular, this facilitates correct alignment between the spacer and the substrate 120, so that the conductors of the substrate 120-C can each be aligned with the spacer grooves as shown in FIG.

  In addition, as in the above-described embodiment, this alignment allows the conductor disposed on the substrate 120-C to be insulated by air trapped between the substrate 120-C and the trench.

  As in the above-described embodiments, in various embodiments, the spacer 110-C is made of a conductive material or a dielectric material that is covered by a conductive layer to make the conductor of the printed circuit board 120-C electromagnetic. Should be shielded. Furthermore, the combined impedance of the conductors and their corresponding grooves can be adjusted by changing their dimensions. Furthermore, a dielectric material layer such as Teflon (registered trademark) can be included in the groove to adjust the breakdown voltage, and to further adjust the composite impedance between the conductor and the corresponding groove.

  FIG. 42 shows an exemplary arrangement of the spacer 110 -C and the circuit board 120 -C when using a multi-circuit board for the connector 100. As shown in the drawing, the substrate 120-C and the spacer 110-C are continuously aligned substantially in parallel, and each circuit board 120-C is sandwiched between two spacers. In the illustrated example, there are two types of circuit boards A and B and two types of spacers A and B (as described above). The A type circuit boards are identical to each other, and the B type circuit boards are identical to each other. Similarly, A-type spacers are identical to one another, and B-type spacers are identical to one another. This is roughly the same as the embodiment described above with reference to FIG.

  In the embodiment shown in FIG. 42, the spacers 110-C and the substrates 120-C are alternately arranged. That is, there is a B type spacer between two given A type spacers, and vice versa. In addition, there is a B type substrate between two given A type substrates, and vice versa. Thus, an A type spacer is not adjacent to another A type spacer, and an A type substrate is not adjacent to another A type substrate. Therefore, in the configuration of this example, each substrate 120-C is disposed between the A type spacer and the B type spacer.

  By way of example, in some embodiments, each side of each B-type substrate 120-C has three conductors (eg, as shown in FIG. 39). As described above with reference to FIG. 13, in some embodiments, the A and B type substrates 120-C are nearly identical. One difference is the number of conductors on each face and the arrangement of conductors on the face. In some illustrated embodiments, a B-type substrate has one less conductor than an A-type substrate.

  As mentioned above, one advantage of shifting the conductors is that, among other things, crosstalk within the connector can be reduced.

  As shown in FIG. 42, each conductor on each substrate 120-C is aligned with the groove on the spacer immediately adjacent to the conductor. That is, each groove on each spacer 110 -C is designed to follow a corresponding conductor on the adjacent substrate 120. Thus, since each conductor is aligned with the corresponding groove, there is a space between the conductor and the spacer.

  When the modified connector 100 is fully assembled, each conductor on the substrate 120-C makes physical and electrical contact with two contact members 1530-C (best shown in FIG. 43). Each of these contact members is contained in the housing 1522-C of the cell 122-C and is located in the corresponding recess 110r in the spacer on both sides of the substrate 120-C. Specifically, the first end of each conductor is in physical and electrical contact with the contact portion of the first contact member, and the second end of each conductor is physically and electrically in contact with the contact portion of the second contact member. Touch. The contact portions of the first and second contact members are each placed in the space between the corresponding end portion of the conductor and the spacer. Although FIG. 43 shows such a contact member located at one end of the conductor, it will be understood that in a preferred embodiment, a similar contact member is also provided at the other end of the conductor. Each contact member acts to electrically connect the conductor that the contact member contacts to a trace on the circuit board to which the connector 100 is attached.

  Further, FIG. 43 illustrates contact members 1530a-C and 1530b- according to one embodiment of the present invention for electrically connecting each conductor on the board 120-C to each trace on the circuit board to which the connector 100 is attached. C (Note: each of the contact members is also collectively referred to as reference number 1530-C). Although this partial cross-sectional view shows the full length of the contact member, in the preferred embodiment, a portion is located within the housing 1522-C, so that only a portion of the contact member is exposed. It will be understood.

  As shown in FIG. 43, the contact members 1530a-C contact the ends of the conductors (not shown) in the same manner as described above with reference to FIG. In some embodiments, as shown in FIG. 39, the end of the conductor can be wider than the middle, allowing a larger surface area to receive the contact portion of each contact member. As shown in FIG. 43, the contact member 1530b-C is generally the same as the contact member 1530a-C, and the bottom is also housed in the housing 1522-C.

  Like the housing described above with reference to the embodiment shown in FIGS. 1-36, the housing 1522-C is preferably made of an electrically insulating or dielectric material such as plastic. In manufacture, the electrical contacts 1530-C of each housing 1522-C can be placed in the housing during manufacture or can be subsequently fitted into the housing.

  Contact member 1530-C may be manufactured by commonly available techniques utilizing any material having suitable electrical and mechanical properties. For example, the contact member may be made of a laminate material such as gold-plated scale bronze. Although the contact members of these embodiments are preferably illustrated as having a substantially unitary structure, it is also conceivable that they comprise multiple components.

  Unlike the above described embodiment using springs, in the preferred embodiment of the embodiment shown in FIGS. 37-46, the housing is preferably against the interposer during use (eg, press fit into the interposer, And / or otherwise secured by being held against the interposer). In the embodiment shown in FIGS. 37 to 46, the combination of the housing 1522-C and the contact member 1530-C is referred to as a cell 122-C.

  In some preferred embodiments, the housing 1522-C is generally similar to that shown in FIG. 15 if the housing 1522-C is configured to be placed substantially fixed within the interposer. It can be similar. As best shown in FIGS. 41 and 45, the housing 1522-C may include, for example, a substantially square opening 1522r for receiving the contact member 1530-C. The openings extend from the top surface of the housing to the bottom surface so that the proximal ends 1641a-C and 1641b-C of the contact members can protrude beyond the bottom surface of the housing 1522-C, for example as shown in FIG. ing. As shown in FIG. 45, in some preferred embodiments, a substantially square opening is provided in a generally I-shaped passage 1522I that extends through the housing 1522-C. In particular, the use of the generally I-shaped passage 1522I can facilitate the insertion of the contact member into the housing, for example by increasing the expansion capability of the housing 1522-C. Similar to the term V shape, the term I shape is generally interpreted and need not be exactly I shape, so that a wide portion (eg, 1522r, etc.) is connected or substantially connected through another portion. Including various configurations.

  As in the embodiment shown in FIG. 17, each contact member 1530-C according to some preferred embodiments has a proximal end 1641-C and a distal end 1749-C. In these preferred embodiments, there is a base 1743-C, a transition 1744-C and a contact 1745-C between the ends 1641-C and 1749-C. In the illustrated embodiment, the base 1743-C is disposed within an opening 1522r in the housing such that substantially the entire base is within the housing 1522-C (ie, press fit and / or friction within the housing opening 1522r). The transition 1744-C is tilted inward relative to the base (ie, movably supported within the substrate receiver of the housing), and the distal end 1749-C is relative to the transition It is tilted outwards and therefore acts as an introduction.

  In a preferred embodiment, the contact portion of the contact member is not secured to the end of the conductor that makes physical and electrical contact. For example, the contact portion is not soldered or otherwise fixed to the conductor of the substrate 120-C. Instead, in a preferred embodiment, each contact member is electrically connected to its corresponding conductor by elastic or pressing forces using connection means similar to those used in card edge connectors. That is, the contact portion of the contact member preferably presses the end portion of the corresponding conductor. In particular, in the preferred embodiment of the embodiment shown in FIGS. 37 to 46, the housing is fixed to the interposer and the board, but this connection form is particularly suitable for the contact member and the printed circuit board 120-C. Help to ensure good electrical connection between the electrical conductors to be made and facilitate the manufacture and assembly of components, for example to facilitate printed circuit board and / or other alignment it can.

  As shown in FIGS. 37 to 41, similarly to the embodiment shown in FIGS. 18 and 19, each cell 122-C is fitted into the corresponding opening 1811-C of each interposer 180-C. Designed. In these illustrated embodiments, each interposer 180-C is arranged in a first alignment set to form a first vertical and horizontal arrangement and a second alignment set. And a second set of openings to create a second vertical and horizontal arrangement. In these embodiments, each column of the second set is placed between two columns of the first set, for example, in a manner similar to that described above with reference to FIGS. As shown in the drawing, the second vertical and horizontal arrangements are the first so that the second set of openings are aligned with each other but not with the first set of openings, and vice versa. It is shifted from the vertical and horizontal arrangement.

  In the illustrated embodiment, the interposer 180-C can electromagnetically shield the conductors of the printed circuit board 120 by being made of a conductive material or a non-conductive material that is coated with a conductive material. .

  When the connector 100 is fully constructed, each opening in the first and second sets preferably receives a cell 122-C. The housing 1522-C of each cell 1570 is a tab similar to the tab 1633 shown in FIG. 16, if desired, that fits into a slot provided in a corresponding opening in the interposer 180-C. A tab may be included to help prevent cell 122-C from falling into the opening.

  As best shown in FIG. 46, in some preferred embodiments, the housing 1522-C can include a generally T-shaped construct having two laterally extending tabs 1633-C. In addition, the interposer 180-C is a groove or depression extending between the plurality of depressions 1811-C, for example, a lateral groove extending along a row of depressions as shown in FIGS. 37, 40, 41 and 44. 180g can be included.

  However, the structure of the housing can be selected according to familiar circumstances, and preferably can be configured to be securely fixed with respect to the position of the interposer in use. It should be understood that the specific shapes of the cells and corresponding interposer openings are merely exemplary. The present invention is not limited to these shapes, and a wide variety of shapes can be used.

  As shown schematically in FIG. 44, when the connector 100 is in use, the proximal end 1641-C of each contact member is connected to a respective conductive element on the circuit board 2190-C connected to the connector 100. To touch. Thus, in a preferred embodiment, there is at least one electrical signal path from the board 2190-C to the board in the connector 100. As will be appreciated by those skilled in the art, the connector 100 can provide multiple electrical signal paths from the board 2190, each signal path having two contact members 1530-C and conductors on the board 120-C. Including.

  As schematically shown in FIG. 44, each interposer 180a-C and 180b-C is arranged in parallel with each circuit board connected to the connector 100, for example, in the embodiment shown in FIGS. obtain. Specifically, the interposer 180a-C is parallel to the first circuit board (similar to the board 2190-C shown in FIG. 44), and the interposer 180b-C is connected to another circuit board (the board 2190-C shown in FIG. 44). Similar). Accordingly, in such an embodiment, one surface of the interposer 180a-C faces the first substrate and one surface of the interposer 180b-C faces the second substrate.

  Similar to the embodiment shown in FIG. 22, each proximal end 1641-C of each contact member 1530-C preferably contacts each conductive element 2194-C on the circuit board 2190-C. In a preferred embodiment, each conductive element 2194-C is a female socket for receiving the proximal end 1641-C of each contact member.

  In a preferred embodiment, the connector 100 is a compliant mount connector, and each proximal end 1641-C forms a pin that fits within a respective female socket. However, in other embodiments, each element 2194-C may be a via or other conductive element that can compliantly receive a contact member.

  In a preferred embodiment, the substrate 2190-C includes a differential signal path that includes a first signal path (eg, a first trace) and a second signal path (eg, a second trace). As in the embodiment shown in FIG. 22, the first element 2194-C is connected to the first signal path and the second conductive element 2194-C is connected to the second signal path. The second circuit board (eg, near the other interposer) may also have a conductive element pair, such as element 2194-C, that is electrically connected to the signal path pair in a similar manner.

  With reference to FIGS. 37 to 41, each cell 122-C is inserted into an opening of each interposer 180-C. In some embodiments, the distal end of each contact member 1530-C of cell 122-C extends beyond the top surface of each interposer (see FIGS. 38-39 and 43-44), and each contact The proximal end 1641-C of the member extends beyond the bottom surface of each interposer (see FIGS. 37, 40 and 41). As described above, when fully assembled, the interposer 180-C faces each board (e.g., a motherboard, a daughter board, etc.) and is substantially parallel thereto. As an example, FIG. 42 shows an interposer 180-C that faces and is substantially parallel to the substrate 2190-C.

  When the end 1641-C of the contact member 1530-C is pressed within the corresponding element 2194-C, the normal force generated by the element is applied to the contact member. In use, the contact member 1530-C is fixedly attached to the housing and the housing is fixedly attached to the interposer so that the contact member is easily and subordinately connected to the element 2194-C. can do.

  As described above, in some embodiments, the apparatus shown in FIGS. 37-46 may be configured to be attached to an elongated backbone similar to the backbone 150 described above with reference to FIGS. 1-36. it can. In addition, the modified connector 100 can also include two end caps similar to the end cap 199 (199a and 199b) described above, each designed to be attached to each end of the backbone 150, for example. As in the embodiments described above with reference to FIGS. 1-36, both the end caps and spacers are manufactured from an insulating material such as plastic covered with a conductive material to provide electromagnetic shielding, or Or the whole can be manufactured with conductive materials, such as a metal. In some embodiments, various features relating to the backbone, end caps and related structures may be similar to those described above with reference to FIGS. However, in the preferred two-piece connector embodiment, one of the interposers is connected to the connector body while the second interposer is inserted into the card cage as described above. As a second connector part that can be connected to the connector body, care can be taken to keep it away from the connector body.

  Further, in some embodiments, the modified connector 100 can also be configured to include one or more mounting clips similar to the mounting clips 190a and 190b described above and a shield similar to the shield 160 described above. . As described above with reference to the embodiment illustrated in FIGS. 1-36, in some embodiments, the mounting clip and shield can be combined with the above-described portions of the connector 100 to form a composite arrangement. . As described above, in some embodiments, the mounting clip and shield may be conductive so as to electromagnetically shield the signal carrying element of the connector 100. In some embodiments, the various features associated with the mounting clip and shield may be similar to those described above with reference to FIGS. However, in the preferred two-piece connector embodiment, again, one of the interposers is connected to the connector body while the second interposer is connected to the card cage as described above. Consideration can be given to keep the connector body away from the connector body as a second connector portion that can be connected to the connector body when inserted.

  As in the embodiment described above with reference to FIGS. 1-36, the two illustrated interposers 180a-C and 180b-C are shown as being substantially perpendicular to each other, but the invention is not limited thereto. . That is, depending on the application, the surfaces of the two interposers 180 may be at a 45 degree angle or other angles, for example. Thus, the modified connector 100 need not be a “right angle” connector.

  In some embodiments, as in the embodiments described above with reference to FIGS. 1-36, in some embodiments, the entire interconnect system is preferably printed circuit board 120 when both connector portions are assembled together. -Conductors on -C form a substantially rigid structure that can be electromagnetically shielded.

  As shown in FIGS. 38, 39, 43, 44 and 46, in some embodiments, the housing 122-C includes a receiving slot 122s adapted to receive an edge of the printed circuit board. It is formed. In this regard, FIG. 39 illustrates the printed circuit board 120-C as received within a plurality of housings. Preferably, as shown in FIGS. 39, 43 and 44, the housing protrudes from within the interposer 180-C, and the receiving slot 122s extends within the housing to near the surface of the interposer so that the substrate 120-C can be Or substantially up to the surface. In some embodiments, the housing 122-C can be angled or chamfered from the edge 122i into one or more faces of the slot 122s to facilitate insertion of the printed circuit board 120-C.

  As shown in FIGS. 38, 39, 43, 44 and 46, the housing preferably receives the flexible end of the contact member including the aforementioned portions 1744-C, 1745-C and 1749-C. Including an internal channel 122c.

  In a preferred embodiment, an interposer loaded with an insert can be provided (ie, cell 122-C is referred to herein as an insert inserted into the interposer). Further, in a preferred embodiment, the contacts are preferably pre-assembled into these “inserts” during manufacture. For example, in some embodiments, contacts can be pushed into these dielectric or plastic “inserts”, eg, by pushing the contacts in the direction of arrow A1 shown in FIG. The “insert” can then be loaded into the interposer, for example, by pushing the cell in the direction of arrow A2 shown in FIG. Further, as described above, the spacer preferably includes a recess 110r that houses these “inserts”.

  Further, as described above, when assembled, these “inserts” essentially act as guides for the printed circuit board, eg, by slots 122s (and possibly beveled edges 122i) of cell 122-C. Can do. In this way, the preferred embodiment specifically helps to ensure that the printed circuit board is in the correct position with respect to the contacts. In this way, the problems encountered so far in connection with achieving contact with the printed circuit board can be substantially reduced. In addition, these embodiments also eliminate overstress that can cause problems if errors occur during assembly (eg, by confining the contacts within the housing 1522-C rather than extending outward from the housing). Contacts can be protected. As described above, this structure includes, for example, the assembly of the first connector portion having the first interposer connected to the connector body, and the second connector when the daughter card is connected to the motherboard using the two-piece connector. It can be advantageous both in connection with the connector body of the part.

  In some suitable applications, embodiments described herein are, for example, higher than 2.5 GBPS, or in some embodiments higher than 5 GBPS, or in some embodiments up to about 10 GBPS, and in some embodiments, more than 10 GBPS. It can be designed for high, ultrafast, high density differential applications. In some exemplary embodiments, the connector has more than 25 differential signal pairs per linear inch, or in some embodiments more than 35 differential signal pairs per linear inch, or in some embodiments 45 per linear inch. Includes more differential signal pairs than pairs.

  In some exemplary and non-limiting embodiments, the apparatus has the following dimensional size: a) inter-substrate distance (indicated by reference number 0.080 in FIG. 42) about 0.080 inch, b) Spacer groove depth (indicated by reference number 0.039 in FIG. 42) about 0.039 inch, c) Spacer groove width (indicated by reference number 0.044 in FIG. 42) about 0.044 inch, d) Staggered spacer groove Spacing distance (indicated by reference number 0.094 in FIG. 42) about 0.094 inch, e) depth distance of housing 1522-C (indicated by reference number 0.24 in FIG. 43) about 0.24 inch, f) Housing 1522-C width distance (indicated by reference numeral 0.13 in FIG. 43) about 0.13 inch, g) Contact pin extension distance (indicated by reference numeral 0.04 in FIG. 43) 0.04 inches, and h) the contact pin spacing distance (indicated by reference numeral 0.06 in FIG. 43) about 0.06 inch, at least some or preferably of the may include components having all.

  In some preferred embodiments, the proximal ends 1641a-C and 1641b-C of the contacts may be formed to have a configuration that is substantially similar to the configuration shown in FIGS. 37, 40, and 41. it can. In this regard, referring to the enlarged view shown in FIG. 41, the pin can be formed in a shape referred to herein as a v-pin shape. In such a v-pin shape, the pin is formed with a substantially V-shaped cross section (as shown). In this disclosure, the terms v-pin shape and / or v-shape are general terms encompassing a u-shape and other shapes with two arm portions extending from the base. The term encompasses that the arms extend outward at an angle with respect to each other, but this need not be the case, and includes parallel arms, inwardly inclined arms and / or other variations.

  In some exemplary embodiments, the v-shape can be achieved by molding techniques such as casting, cold forming, forging, press molding, and the like. In some exemplary embodiments, for v-shaped molding, the contact member is first molded from a substantially flat member (eg, can be about 20 inches thick), and then the contact member is further Pressing or stamping is performed to form the reduced thickness (eg, can be about 4 thousandths of an inch thick) end. The v-shape can then be imparted by folding the reduced end using suitable shaping and / or other techniques.

  Although such a v-pin shape has been described, it is contemplated that various other pin shapes may be used in other embodiments. In other embodiments of the present invention, pins having virtually any suitable cross-sectional shape can be used. Further, the illustrated pins have a substantially constant cross-sectional shape in some exemplary embodiments (ie, other than the front chamfer in the illustrated example), but in other embodiments are discontinuous or various other It can have pins with various cross-sectional shapes.

  Further, in some preferred embodiments, a compliant portion having a diameter of less than about 0.025 inches, or in some embodiments less than about 0.020 inches, or in some embodiments no more than about 0.018 inches. Compliant pins can be produced.

  Unlike the embodiment of the compression mount connector described above with reference to FIGS. 1-36, for example, the compliant mount connector is associated with compression contact coplanarity, latch strength and accuracy issues, and compression, for example. The advantage is that some obstacles related to the control required in the axis perpendicular to the engagement interface can be avoided to maintain a stable interface in the mount connection.

  Although compliant pins are widely used in a variety of other high speed interconnects, the embodiments described herein are a significant improvement over current systems. For example, due to the size and wiring of compliant functions, current systems typically have performance issues such as impedance discontinuities and crosstalk. In contrast, the preferred embodiments described herein can improve the adjustment of compliant pin termination performance to a printed circuit board. In particular, as described above, in the preferred embodiment, the connector uses a broadside coupled transmission line having a spatial relationship that can promote a particularly high degree of crosstalk isolation.

  Although various embodiments / variants of the present invention have been described above, it should be understood that these are given by way of illustration only and not limitation. Accordingly, the breadth and scope of the present invention should not be limited by any of the above-described exemplary embodiments, but should be defined only in accordance with the following claims and their equivalents.

Claims (31)

An interposer assembly (FIGS. 37-46) for high speed and high density differential applications,
a) comprising an interposer (180-C1, FIG. 37) having a first surface and a second surface opposite to the first surface;
b) the interposer includes an array of openings (1811-C, FIG. 38) extending from the first surface of the interposer to the second surface of the interposer;
c) a plurality of cells (122-C, FIG. 37) located within the array of openings, each of which includes a first elongate contact member (1530a-C, FIG. 43) and a second elongate contact member ( 1530b-C, FIG. 43) and a housing comprising a housing (1522-C, FIG. 45),
d) the interposer is made of or coated with a conductive material;
e) the housing is made of a dielectric material;
f) The first elongate contact having a conductor contact portion (1745-C, FIG. 43), a substrate contact portion (1641-C, FIG. 41), and an intermediate portion between the conductor contact portion and the substrate contact portion. A first contact member of the members, wherein the conductor contact portion is not attached to the first conductor and is adapted to make a pressure contact, and the substrate contact portion has a diameter less than about 0.04 inches. Comprising a first contact member of the first elongate contact member comprising a client pin and at least a portion of the intermediate portion engaging a first housing of the housing; and g) a conductor contact portion (1745-C), a substrate contact portion (1641-C), and a first contact portion of the second elongated contact member having an intermediate portion between the conductor contact portion and the substrate contact portion. And wherein the conductor contact is not attached to the second conductor for pressure contact, the substrate contact includes a compliant pin having a diameter of less than about 0.04 inches, and At least a portion of the intermediate portion includes a first contact member of the second elongate contact member that engages a first housing of the housing;
Interposer assembly.   The interposer assembly according to claim 1, wherein the first of the housings includes a slot adapted to receive an edge of a circuit board positioned substantially perpendicular to the interposer.   The interposer assembly according to claim 2, wherein the first of the housings further includes a channel adapted to receive the conductor contacts of the first and second elongate contact members.   4. The interposer assembly according to claim 3, wherein the conductor contact is flexibly housed within the channel and the channel extends beyond the distal end of each of the first and second elongate contact members.   The interposer assembly of claim 1, wherein the pin has a diameter of less than about 0.03 inches.   The interposer assembly according to claim 1, wherein the pin has a diameter of less than about 0.02 inches.   The interposer assembly of claim 1, wherein the housings each have a width less than about 0.3 inches.   The interposer assembly of claim 1, wherein the housings each have a width less than about 0.2 inches.   The interposer assembly of claim 1, wherein the assembly supports differential applications higher than about 5 GBPS.   The interposer assembly of claim 1, wherein the assembly supports differential applications higher than about 10 GBPS. A connector for high speed and high density differential applications that electrically connects a signal path on a first circuit board with a signal path on a second circuit board,
a) comprising an interposer (180-C1, FIG. 37) having a first surface and a second surface opposite to the first surface;
b) the interposer includes an array of openings extending from the first surface of the interposer to the second surface of the interposer;
c) a plurality of cells (122-C, FIG. 37) located within the array of openings, each of which includes a first elongate contact member (1530a-C, FIG. 43) and a second elongate contact member ( 1530b-C, FIG. 43) and a housing comprising a housing (1522-C, FIG. 45),
d) the interposer is made of or coated with a conductive material;
e) the housing is made of a dielectric material;
f) comprising a plurality of circuit boards (120-C, FIG. 39) extending substantially perpendicular to the interposer;
g) a plurality of spacers (110a-C, 110b-C, FIG. 39) between the circuit boards, and h) the housings each having a slot (122s, adapted to receive a respective edge of the circuit board. Including FIG.
connector.   The connector of claim 11, wherein the first and second elongated contact members include leaf springs that press each conductor on the circuit board.   The circuit board includes a plurality of signal conductors, and the number of signal conductors arranged on one first surface of the circuit board is the same as the number of signal conductors arranged on the first surface of the second circuit board. The connector according to claim 11, which is not.   The number of signal conductors disposed on the second surface of the first circuit board is one less than or one more than the number of signal conductors disposed on the first surface of the second circuit board. The connector according to 13.   The connector of claim 11, wherein each housing includes at least one tab adapted to engage with at least one corresponding slot of the interposer.   The connector according to claim 13, wherein the conductors of adjacent circuit boards are alternately arranged so as to increase a distance between the conductors of the adjacent printed circuit boards.   The connector of claim 11, further comprising a backbone including a slot adapted to receive the plurality of spacers.   The connector of claim 11, further comprising an end plate adapted to receive one of the interposers.   The connector according to claim 11, further comprising a shield plate adapted to cover two surfaces of the connector. A method of manufacturing a connector comprising:
a) an interposer (180-C1, FIG. 37) having an array of openings (1811-C, FIG. 38) extending from a first surface of the interposer to a second surface of the interposer; Providing an interposer made of or coated with a conductive material;
b) Housings (1522-C, FIG. 45) that support the first elongate contact members (1530a-C, FIG. 43) and the second elongate contact members (1530b-C, FIG. 43), each of which Providing a cell (122-c, FIG. 38) comprising a housing made of a dielectric material and having a slot (122s, FIG. 38) adapted to receive an edge of a circuit board;
c) inserting the cell into one of the openings (1811-C);
d) a printed circuit board (120-C, FIG. 39), such that an edge of the printed circuit board is received in the slot of the housing, and the first and second elongated contact members are the printed circuit. Moving in a direction substantially perpendicular to the interposer and toward the interposer to engage with the respective conductors on both sides of the substrate;
Including the method.   The first and second elongate contact members are disposed on the printed circuit board by deploying leaf spring portions on the first and second elongate contact members that are displaced by the printed circuit board when inserted into the slot. 21. The method of claim 20, wherein each of the conductors on each side is engaged with a conductor.   21. The method of claim 20, further comprising aligning a plurality of spacers between the printed circuit boards by inserting protrusions extending from the spacers into engaging recesses of the interposer. Method.   21. The method of claim 20, further comprising inserting the housing into the interposer until an outwardly extending tab is received in each slot of the interposer.   21. The method of claim 20, wherein a first of the housings further includes a channel adapted to receive conductor contacts of the first and second elongate contact members.   25. The method of claim 24, wherein the conductor contact is flexibly housed within the channel and the channel extends beyond the distal end of each of the first and second elongate contact members.   21. The method of claim 20, wherein the first and second elongate contact members include compliant pins having a diameter less than about 0.03 inches.   27. The method of claim 26, wherein the pin has a diameter that is less than about 0.02 inches.   The method of claim 20, wherein the housing has a width less than about 0.3 inches.   30. The method of claim 28, wherein the housing has a width that is less than about 0.2 inches.   21. The method of claim 20, wherein the connector is adapted to support differential applications higher than about 5 GBPS.   32. The method of claim 30, wherein the connector is adapted to support differential applications higher than about 10 GBPS.