JP2010245467A - Method of mounting transparent component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To precisely mount a transparent component at an object position on a substrate using a surface-mounting machine. <P>SOLUTION: A transparent component includes two or more portions where a thickness in the vertical direction is configured to be thickly or thinly formed locally. The transparent component held by a mount head 5 is photographed from the upper face side or lower face side by a components recognition camera 4 while being radiated by a single or a plurality of spot lights 7a. Then, two or more portions appear locally having different brightness. By extracting these portions as characteristic points, the holding state of the transparent component is recognized, so that it is possible to mount the component at the object position of a substrate. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a technique for mounting a transparent component at a target position on a substrate using a surface mounter.

  Conventionally, surface mounters have been widely used to mount chip components at target positions on a substrate. The surface mounter takes a picture of the chip part held by the mounting head with a part recognition camera, recognizes the holding state of the chip part (the holding position of the chip part and the rotation angle about the vertical axis) from the photographed image, and the holding state The mounting head is aligned based on the above. The holding state of the chip component is obtained by extracting a plurality of feature points of the chip component reflected in the photographed image and pattern matching the plurality of feature points. For this reason, it is important that the feature points of the chip component are clearly copied in the captured image captured by the component recognition camera.

  As a photographing method of the component recognition camera, there are typically an outline feature extraction method and an electrode extraction method. In the contour feature extraction method, light is irradiated from behind a chip part to photograph the contour and extract a feature portion of the contour. In addition, the electrode extraction method irradiates the chip component with light from the front, photographs the light irradiation surface of the chip component, and extracts the electrode location from the difference in brightness based on the difference in reflectance between the electrode and the main body. It is. In any method, the feature point of the chip part can be imprinted on the photographed image.

JP 2006-319271 A

  In recent years, a light emitting module in which a light emitting component such as an LED component is mounted on a substrate and a lens component is mounted so as to cover the light emitting component has been studied. With this type of product, the light distribution characteristics of the light emitting module can be made different by simply changing the specifications of the lens parts while maintaining the same specifications for the substrate and light emitting parts. There is a merit that various types of products can be provided at low cost. Furthermore, in order to increase the cost reduction effect, it is desired to mount the lens component using a surface mounter and improve the productivity of the product.

  However, since the entire lens component is transparent, it is difficult to photograph its outline, and since the lens component does not have an electrode, electrode extraction cannot be performed. As described above, the conventional photographing method has a problem that the characteristic point of the lens component is not reflected in the photographed image, and the lens component cannot be accurately mounted at the target position of the substrate. This problem is not limited to lens parts, but is common to other transparent parts such as prism parts.

  An object of this invention is to provide the technique which can mount a transparent component correctly in the target position of a board | substrate using a surface mounting machine.

  In the method for mounting a transparent component according to the present invention, a transparent component is held by a mounting head, the transparent component held by the mounting head is photographed with a component recognition camera from the upper surface side or the lower surface side, and the obtained image is used to Recognizing the holding state of the transparent component, moving the mounting head so as to compensate the deviation of the recognized holding state from the reference state, and then releasing the holding of the mounting head to bring the transparent component to the target position on the substrate In the mounting method of the transparent component to be mounted, the transparent component has a thickness in the photographing direction of the component recognition camera locally thick or thin at a plurality of locations, and the transparent component is photographed by the transparent component. In a state where a single or a plurality of spot lights are irradiated.

  Here, “local” means that when the transparent component is viewed from the upper surface side or the lower surface side, the ratio of the area occupied by the portion to the entire area of the transparent component is sufficiently small.

  When the transparent part is irradiated with spot light, transmission, scattering, reflection, refraction, diffraction, etc. occur in the process of passing through the transparent part, and a part of the spot light is directed to the part recognition camera. If the thickness of the plurality of transparent parts is locally thick or thin, the amount of light directed to the component recognition camera can be made different between the plurality of parts and the surrounding parts. This appears as a local brightness difference in the captured image. Therefore, the holding state of the transparent component can be recognized, and as a result, the transparent component can be accurately mounted at the target position of the substrate.

The figure for explaining the method of mounting the transparent component in the target position of the board using the surface mounter Diagram showing the configuration of the LED module The figure for explaining the principle that the brightness difference occurs in the photographed image The figure which shows the modification of a lens component The figure which shows the modification of a lens component The figure which shows the modification of a lens component The figure which shows the modification of a lens component The figure which shows the modification of a lens component The figure which shows an example of the photographed image The figure which shows an example of the photographed image The figure which shows the modification of an LED module

DESCRIPTION OF EMBODIMENTS Embodiments for carrying out the present invention will be described in detail with reference to the drawings.
FIG. 1 is a diagram for explaining a method of mounting a transparent component at a target position on a substrate using a surface mounter. In the present embodiment, a scene in which a lens component 21 that is an example of a transparent component is mounted on a substrate on which an LED component that is an example of a light-emitting component is mounted will be described.
<Surface mounter>
The surface mounter 1 includes a base 2, a component supply unit 3, a component recognition camera 4, a mounting head 5, a suction nozzle 6, an illumination device 7, a mounting head drive mechanism 8, a board recognition camera 9, and an LED recognition camera 10. Yes.

A substrate 12 on which the LED component 13 is mounted is placed on the base 2. A component tray 11 in which the lens component 21 is stored is placed on the component supply unit 3.
The mounting head 5 holds the lens component 21 accommodated in the component tray 11 and moves in a state where the lens component 21 is held. Thereafter, the mounting head 5 releases the holding of the lens component 21 and moves the lens component 21 to the target position on the substrate 12. It is to be implemented.

Holding and releasing the lens component 21 is realized by a negative pressure generator connected to the suction nozzle 6.
The movement of the lens component 21 in the X direction and the Y direction is realized by the mounting head drive mechanism 8. The mounting head drive mechanism 8 includes a guide rail 8a, a servo motor 8b, and a ball screw 8c. The guide rail 8a and the ball screw 8c extend in the X direction, and transmit the rotational force of the servo motor 8b to the mounting head 5 as a driving force in the X direction. In FIG. 1, only the configuration for moving the mounting head 5 in the X direction is described for simplicity of explanation, but the mounting head drive mechanism 8 also has a configuration for moving the mounting head 5 in the Y direction. Shall.

The movement of the lens component 21 in the Z direction is realized by an elevating drive mechanism built in the mounting head 5 that moves the suction nozzle 6 in the Z direction.
The rotation of the lens component 21 around the Z direction is realized by a rotation driving mechanism that is built in the mounting head 5 and rotates the suction nozzle 6 around the Z direction.
The amount of movement of the lens component 21 in the X direction and the Y direction, and the rotation angle around the Z direction are determined as amounts to compensate for the deviation of the holding state of the lens component 21 from the reference state. The reference state of the lens component 21 is information known to the surface mounter 1. On the other hand, since the holding state of the lens component 21 changes every time the lens component 21 is mounted, it is necessary to check each time.

  The component recognition camera 4 is arranged upward in the vertical direction (Z direction), and images the lens component 21 from the lower surface side when the mounting head 5 reaches the imaging position. In the photographed image of the lens component 21, a plurality of locations where the brightness is locally different appear for reasons described later. By extracting these points as feature points, the holding state of the transparent component can be recognized.

The board recognition camera 9 is arranged downward in the vertical direction (Z direction). The captured image of the substrate recognition camera 9 is used for detection of the reference mark 14 (see FIG. 2) formed on the substrate 12.
The LED recognition camera 10 is arranged downward in the vertical direction (Z direction). The captured image of the LED recognition camera 10 is used to detect the position of the LED component 13 mounted on the substrate 12.
The illuminating device 7 emits the spot light 7a toward the lens component 21 when the mounting head 5 reaches the photographing position.
<Lens parts>
The lens component 21 is made of highly transparent resin or glass and is integrally formed by injection molding or the like. The main body portion of the lens component 21 is composed of a lens portion 21a that exhibits the original optical function of the lens, such as condensing or diffused light, and an annular portion 21b that continues to the outer peripheral edge thereof. The leg portion 21c of the lens component 21 is provided to ensure a space between the main body portion of the lens component 21 and the surface of the substrate 12, and from a plurality of locations (three locations in this example) on the lower surface of the ring portion 21b. It is formed to project downward in the vertical direction (Z direction). If there are three or more legs 21c, even if one bond is removed for some reason, it can be stably fixed with the remaining legs.

To illustrate the dimensional relationship of the lens component 21, the diameter of the lens portion 21a is 15 [mm] and the maximum height is 4 [mm]. The inner diameter of the ring portion 21b is 15 [mm], the outer diameter is 19 [mm], and the thickness is 1.6 [mm]. The leg 21c has a diameter of 0.8 [mm] and a length of 2.5 [mm].
Since the leg portion 21c protrudes downward from the lower surface of the ring portion 21b, the thickness of the lens component 21 in the vertical direction is thick at the leg portion 21c. Further, the ratio of the area occupied by one leg 21c to the area occupied by the main body of the lens component 21 is sufficiently small. Therefore, it can be said that the lens component 21 is locally thick in the photographing direction of the component recognition camera at a plurality of locations.
<Principle>
FIG. 3 is a diagram for explaining the principle that the brightness difference occurs in the captured image.

This lens part has a part where the thickness in the photographing direction of the part recognition camera is locally thick and a part where it is locally thin.
In FIG. 3A, the illumination device and the component recognition camera are in a positional relationship facing each other with the lens component interposed therebetween. In this case, the locally thin portion (reference numeral 32) of the lens component has more light transmission than the surrounding portion, and conversely, the locally thick portion (reference numeral 31) of the lens component is more than the surrounding portion. There is little light transmission. Therefore, local brightness and darkness appear in the captured image of the component recognition camera, and these can be extracted as feature points. Note that if the end face of a locally thick portion is colored or roughened, the amount of transmitted light can be further reduced, and the brightness and darkness in the captured image can be enhanced.

  In FIG. 3B, the illuminating device is arranged such that the spot light is incident at an angle θ from obliquely above with respect to a reference plane perpendicular to the photographing direction of the component recognition camera. When the angle θ is adjusted to an appropriate range, the light incident on the locally thick part (reference numeral 31) and the thin part (reference numeral 32) of the lens component is attenuated as it is repeatedly reflected inside, and is externally reflected. It will not come out. On the other hand, most of the light incident on other peripheral portions is transmitted, but a part of the light is emitted toward the component recognition camera due to scattering and reflection. Therefore, local brightness and darkness appear in the captured image of the component recognition camera.

  In the experiment, it was found that if a single color LED is used as the light source of the illumination device 7, the brightness and darkness in the captured image becomes clearer than in the case of the white LED. This is because, in the case of white light, the angle of refraction of incident light differs from wavelength to wavelength, so the way in which the light travels inside the lens component differs from wavelength to wavelength. This is thought to be due to the phenomenon that it is offset by light of a wavelength. This is not the case with monochromatic light. Furthermore, in experiments, it was found that light and darkness becomes clearer when blue light having a short wavelength is adopted among monochromatic light. In addition, when a monochromatic LED is employed and the end face of a locally thick or thin portion is colored, a material that absorbs light in the wavelength region of the monochromatic LED should be employed.

  Further, if a light-shielding member having an opening is provided between the light source of the illumination device 7 and the lens component to reduce the spread width of the spot light irradiated to the lens component, the brightness and darkness in the captured image may become clearer. found. Even in the spot light, the central portion near the central axis and the peripheral portion thereof have different angles of incidence on the lens component, and the way in which the light travels inside the lens component is different. Then, even if light and darkness is caused by light incident at a certain angle, a phenomenon may occur in which it is canceled out by light incident at another angle. If the spread width of the spot light is narrowed, such a situation is unlikely to occur.

In addition, if there is a single illumination device 7, there may be a shadow that hinders component recognition due to locally thick or thin locations. In that case, a plurality of illumination devices 7 may be provided around the Z axis of the lens component, and the influence of shadows may be reduced by irradiating a plurality of spot lights.
<Mounting procedure>
Next, a lens component mounting procedure will be described.

  First, the substrate 12 on which the LED component 13 is mounted is placed on the base 2. The LED component 13 is mounted on the substrate 12 by printing solder on the substrate 12, placing the LED component 13 at a predetermined position on the substrate 12, and heating and melting the solder on the substrate 12. When the LED component 13 is arranged on the substrate 12, the component recognition camera 4 captures the LED component 13 to recognize the holding state of the LED component 13 from the captured image, and at the same time, the substrate recognition camera 9 captures the substrate 12. The reference mark 14 (see FIG. 2) is detected from the captured image. Then, using the obtained holding state of the LED component 13 and the reference mark 14, the movement amount and the rotation angle of the LED component 13 are determined, and the mounting head 5 is moved by that amount. Thereby, the LED component 13 can be accurately mounted at a predetermined position of the substrate 12.

Next, an adhesive is attached to the position on the substrate 12 where the leg 21c of the lens component 21 is disposed. By adjusting the amount of the adhesive, the position in the Z direction of the main body of the lens component 21 can be finely adjusted.
Next, the mounting head 5 is moved to above the component tray 11 of the component supply unit 3, the suction nozzle 6 is lowered until it contacts the upper surface of the lens component 21, and the lens component 21 is held. Then, the suction nozzle 6 is raised, and the mounting head 5 is moved to a position where the optical axis 4a of the component recognition camera 4 and the central axis of the suction nozzle 6 coincide with each other. Then, the holding state of the lens component 21 is recognized from the captured image. Further, the LED component 13 mounted on the substrate 12 is photographed by the LED recognition camera 10 from above, and the mounting position of the LED component 13 is specified from the photographed image.

  Next, using the holding state of the lens component 21 and the mounting position of the LED component 13, the X direction and the Y direction of the mounting head 5 so that the optical axis of the lens component 21 and the optical axis 13a of the LED component 13 coincide with each other. And the rotation angle of the lens component 21 is determined so that the positions of the legs 21c of the lens component 21 and the position of the adhesive adhered to the substrate 12 coincide with each other. Then, the mounting head 5 is moved by the determined movement amount, the suction nozzle 6 is rotated by the determined rotation angle, and the suction nozzle 6 is lowered until the leg portion 21c of the lens component 21 contacts the substrate 12, The holding of the suction nozzle 6 is released.

Finally, the adhesive is cured. In addition, by using a method that does not cause movement or impact in the Z-axis direction, such as a horizontal belt conveyor, to the place for curing the adhesive, the lens is mounted before curing by transporting the substrate on which the lens component is mounted. It is possible to prevent the component from shifting from a predetermined position.
<Summary>
According to this embodiment, the holding state of the lens component 21 that is a transparent component can be recognized, and as a result, the lens component 21 can be accurately mounted at the target position of the substrate 12. FIG. 9 and FIG. 10 show examples of captured images.

  The photographed image in FIG. 9 is obtained by photographing the lens parts in the positional relationship shown in FIG. The lens component has legs at three locations, and the end surfaces of these legs are colored. In this lens component, the length of the leg portion is about 0.2 [mm] with respect to the thickness of the ring portion of about 1.6 [mm]. As is apparent from the photographed image, light and dark are generated at three locally thick portions (leg portions) and the surrounding portions.

Further, the photographed image of FIG. 10 is obtained by photographing the lens parts with the positional relationship shown in FIG. 3B (angle θ is about 30 degrees). The lens component is as shown in FIG. As is clear from the photographed image, light and darkness occurs at three locally thick points (legs) and six locally thin points (projections) and their surrounding points.
According to the present embodiment, the lens component 21 is integrally formed by injection molding or the like. Therefore, the product variation in the positional relationship between the optical axis of the lens portion 21a and the leg portion 21c is extremely small. Accordingly, as long as the holding state of the lens component 21 is recognized, the lens component 21 can be accurately mounted at the target position on the substrate. On the other hand, a method of forming a metal film at a plurality of locations on the lower surface of the lens component and recognizing the holding state of the lens component by an electrode extraction method is also considered. However, this method has a problem in that when the metal film is formed on the lower surface of the lens component, variation occurs for each product, and as a result, the mounting position accuracy of the lens component becomes lower than that of the present embodiment. Therefore, it is preferable to form integrally like this embodiment.

In the present embodiment, the LED component 13 mounted on the substrate 12 is photographed by the LED recognition camera from above the substrate 12, the LED component mounting position is recognized from the obtained captured image, and the recognized mounting position is determined. This is used as a reference for positioning the lens component 21. Thereby, even if the LED component 13 is mounted with a deviation from the reference position of the substrate 12, a certain positional relationship is maintained with the LED component 13 (that is, the optical axis of the LED component 13 and the lens component 21 The lens component 21 can be mounted (with the optical axis aligned).
<Modification>
As mentioned above, although the mounting method of the transparent component was demonstrated based on embodiment, this invention is not limited to these embodiment. For example, the following modifications can be considered.
(1) In the embodiment, the portion where the thickness in the vertical direction is locally thick is only the leg portion 21c, but the present invention is not limited to this and may be provided in addition to the leg portion.

  FIG. 4 shows the lens component 22 including protrusions 22d protruding upward from a plurality of locations on the upper surface of the ring portion 22b. Thus, since the protrusion 22d is a portion where the thickness in the vertical direction is locally thick, it appears as bright and dark in the captured image. In the example of FIG. 4, the protrusion 22d is disposed so as to overlap the leg 22c when viewed in the vertical direction. However, the present invention is not limited to this, and the protrusion 22d has a certain relative positional relationship with the leg 22c. You may arrange | position by shifting in the state maintained.

FIG. 5 shows a lens component 23 that includes a protrusion 23d that is thinner than the thickness of the ring 23b that protrudes radially outward from a plurality of locations on the side surface of the ring 23b. Thus, since the protrusion 23d is a portion where the thickness in the vertical direction is locally thin, it appears as bright and dark in the photographed image.
FIG. 6 shows a lens component 24 in which depressions 24d are formed so as to reduce the thickness of the ring portion 24b at a plurality of locations on the upper surface of the ring portion 24b. As described above, the depression 24d is a portion where the thickness in the vertical direction is locally thin, and thus appears as bright and dark in the photographed image.

7 includes protrusions 25d and 25e that are thinner than the thickness of the ring part 25b that protrudes radially outward from a plurality of locations on the side surface of the ring part 25b, and is formed by the protrusions 25d and 25e. The lens components 25 having different positions are shown. The lens portion 25a has a concave curved surface and functions as a diffuser lens.
FIG. 8 shows a lens component 26 that includes protrusions 26d that protrude upward from a plurality of locations on the upper surface of the ring part 26b, and the protrusions 26d are conical. Since the protruding portion 26d has an inclined surface, the transmission and reflection modes of the spot light are different from the surrounding portions, and appear as bright and dark in the photographed image.
(2) The end surface of the portion where the thickness of the lens component in the vertical direction is locally thick or thin may be colored or roughened. When applied to the embodiment, the lower end surface of the leg portion 21c of the lens component 21 is colored or roughened. If it does in this way, it will suppress that the stray light in the surface mounting machine 1 injects from the lower end face of leg part 21c, and that a part of spot light 7c emits light from the lower end face of leg part 21c. Can emphasize light and dark.
(3) Further, when coloring the lower end surface of the leg portion 21c of the lens component 21, the leg of the lens component 21 is taken after the lens component 21 is held by the mounting head 5 until the lens component 21 is photographed. A colored adhesive is attached to the lower end surface of the part 21c, and photographing by the component recognition camera 4 is performed in a state where the colored adhesive is attached to the lower end surface of the leg part 21c of the lens component, and is applied to the substrate 12 of the lens component 21. This mounting may be performed by bringing the leg 21c to which the adhesive is attached into contact with the surface of the substrate 12. Thereby, the process of apply | coating an adhesive agent to the board | substrate 12 can be skipped, and productivity can be improved. For example, the surface mounter 1 is provided with a container containing a liquid adhesive, and the mounting head 5 is moved to immerse the lower end of the leg 21c of the lens component 21 in the liquid adhesive. It can be implemented depending on the situation. It should be noted that the colored adhesive only needs to be colored at the time of photographing with the component recognition camera 4, and it does not matter whether it remains colored or changes to colorless after drying.
(4) Alternatively, the component recognition camera 4 may be provided on the mounting head 5 and moved together with the mounting head 5 to photograph the lens component 21 from the upper surface side. Furthermore, in this case, the mounting head 5 is moved to a position where the light from the LED component 13 mounted on the substrate 12 is irradiated onto the lens component 21, and the light from the LED component 13 is captured by the component recognition camera 4. It is good also as performing in the state irradiated to the lens component 21 from the downward direction. The lighting of the LED component 13 can be performed, for example, by supplying power from a power supply pad to the LED component 13 formed on the substrate 12. Thus, the illumination device 7 can be omitted from the surface mounter 1 by using the LED component 13 mounted on the substrate 12 as a light source of spot light.
(5) Moreover, you may perform imaging | photography with the LED recognition camera 10 in the state which turned on the LED component 13 mounted in the board | substrate 12. FIG. The optical axis 13a of the LED component 13 can be specified from the peak position of the luminance distribution of the obtained captured image. Thereby, the optical axis can be detected directly rather than the optical axis 13a of the LED component 13 is identified from the photographed image obtained by photographing the outer shape of the LED component 13, and the accuracy of optical axis detection is improved. be able to. The LED component 13 is composed of an LED element and a housing. When the housing color and the substrate color are similar colors, the outer shape (contour) of the LED from the captured image of the LED recognition camera. Is difficult to identify. Even in such a case, according to the above direction, the optical axis can be accurately specified.
(6) In the embodiment, the lens component 21 includes the ring portion 21b. However, the ring portion 21b may not be provided.
(7) Further, the LED modules are not limited to those shown in FIG. 2, but may be arranged in a line as shown in FIG. 11, for example. In the example of FIG. 11, the rotation angles of the lens components around the Z axis are the same, but the present invention is not limited to this. In particular, when the substrate is long in one direction and the lens components are aligned in the longitudinal direction of the substrate, it is preferable that the rotation angle is shifted for each lens component. When the substrate heat shrinks or expands in the longitudinal direction due to changes in the environmental temperature, stress that acts in the direction to peel off the adhesion of the lens components is generated, but by shifting the rotation angle, all the lens components are peeled off at the same time. You can avoid that.
(8) In the embodiment, the lens component holding state recognition step and the lens component mounting step are performed for each lens component, but the present invention is not limited to this. For example, the lens component holding state is recognized, and the lens component position and rotation angle are adjusted and temporarily placed at a predetermined position of the adhesive tray. After temporarily placing a plurality of lens components on an adhesive tray, the tray is transported near the substrate, and the lens components placed on the tray are sequentially mounted on the substrate. At this time, since the position and the rotation angle of the lens component placed on the tray are adjusted, it is mechanically mounted without recognizing the holding state immediately before mounting. In this case, the process of recognizing the holding state of the lens component and the mounting process of another lens component can be performed simultaneously, and productivity can be improved.

  The present invention can be used for, for example, a light emitting module in which a light emitting component such as an LED component is mounted on a substrate and a lens component is mounted so as to cover the light emitting component.

DESCRIPTION OF SYMBOLS 1 Surface mounter 2 Base 3 Component supply part 4 Component recognition camera 5 Mounting head 6 Suction nozzle 7 Illumination device 8 Mounting head drive mechanism 9 Substrate recognition camera 10 LED recognition camera 11 Component tray 12 Substrate 13 LED component 14 Reference mark 21 22, 23, 24, 25, 26 Lens parts

Claims (7)

A transparent component is held by the mounting head, the transparent component held by the mounting head is photographed by a component recognition camera from the upper surface side or the lower surface side, and the holding state of the transparent component is recognized and recognized from the obtained captured image. In the mounting method of the transparent component, the mounting head is moved so as to compensate for the deviation of the held state from the reference state, and then the holding of the mounting head is released to mount the transparent component at a target position on the substrate.
In the transparent component, the thickness in the shooting direction of the component recognition camera is locally thick or thin at a plurality of locations,
The method of mounting a transparent component, wherein the photographing by the component recognition camera is performed in a state where a single or a plurality of spot lights are irradiated on the transparent component.   2. The method of mounting a transparent component according to claim 1, wherein an end surface of a portion of the transparent component that is locally thick or thin is colored or roughened. The location where the transparent component is locally thick is a leg portion protruding downward from a plurality of locations on the lower surface of the body portion of the transparent component,
The end face of the part formed locally thick of the transparent part is colored,
The coloring of the end surface is performed by attaching a colored adhesive to the lower end portion of the leg portion of the transparent component from when the transparent component is held by the mounting head to when the transparent component is photographed.
The method of mounting a transparent component according to claim 2, wherein the mounting of the transparent component on the substrate is performed by arranging a leg portion to which the adhesive is attached on the surface of the substrate. A light emitting component that irradiates light in a direction perpendicular to the substrate is mounted at a target position of the substrate, and the transparent component is mounted on the substrate so as to cover the top of the light emitting component. ,
Between holding the transparent component on the mounting head and photographing the transparent component, moving the mounting head to a position where light from the light emitting component mounted on the substrate is irradiated to the transparent component,
The imaging by the component recognition camera is performed from the upper surface side of the transparent component in a state in which the light from the light emitting component is irradiated to the transparent component from below as the spot light. Mounting method for transparent parts. A light emitting component that irradiates light in a direction perpendicular to the substrate is mounted at a target position of the substrate, and the transparent component is mounted on the substrate so as to cover the top of the light emitting component. ,
In the movement of the mounting head, the light emitting component mounted on the substrate is photographed by the light emitting component recognition camera from above the substrate, the mounting position of the light emitting component is recognized from the obtained photographed image, and the recognized mounting position The method for mounting a transparent component according to claim 1, wherein the transparent component is used as a reference for positioning the transparent component.   6. The method of mounting a transparent component according to claim 5, wherein photographing with the light-emitting component recognition camera is performed in a state where the light-emitting component mounted on the substrate is turned on.   The method of mounting a transparent component according to claim 1, wherein the light source of the spot light is a monochromatic LED.