JP2010245263A5 - - Google Patents

Download PDF

Info

Publication number
JP2010245263A5
JP2010245263A5 JP2009092014A JP2009092014A JP2010245263A5 JP 2010245263 A5 JP2010245263 A5 JP 2010245263A5 JP 2009092014 A JP2009092014 A JP 2009092014A JP 2009092014 A JP2009092014 A JP 2009092014A JP 2010245263 A5 JP2010245263 A5 JP 2010245263A5
Authority
JP
Japan
Prior art keywords
layer
semiconductor substrate
barrier metal
metal pattern
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2009092014A
Other languages
English (en)
Japanese (ja)
Other versions
JP5419525B2 (ja
JP2010245263A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2009092014A priority Critical patent/JP5419525B2/ja
Priority claimed from JP2009092014A external-priority patent/JP5419525B2/ja
Priority to US12/752,736 priority patent/US8598684B2/en
Publication of JP2010245263A publication Critical patent/JP2010245263A/ja
Publication of JP2010245263A5 publication Critical patent/JP2010245263A5/ja
Application granted granted Critical
Publication of JP5419525B2 publication Critical patent/JP5419525B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2009092014A 2009-04-06 2009-04-06 半導体装置及びその製造方法 Active JP5419525B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009092014A JP5419525B2 (ja) 2009-04-06 2009-04-06 半導体装置及びその製造方法
US12/752,736 US8598684B2 (en) 2009-04-06 2010-04-01 Semiconductor device, and method of manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009092014A JP5419525B2 (ja) 2009-04-06 2009-04-06 半導体装置及びその製造方法

Publications (3)

Publication Number Publication Date
JP2010245263A JP2010245263A (ja) 2010-10-28
JP2010245263A5 true JP2010245263A5 (zh) 2012-04-05
JP5419525B2 JP5419525B2 (ja) 2014-02-19

Family

ID=43097963

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009092014A Active JP5419525B2 (ja) 2009-04-06 2009-04-06 半導体装置及びその製造方法

Country Status (1)

Country Link
JP (1) JP5419525B2 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5601380B2 (ja) * 2010-12-28 2014-10-08 富士通セミコンダクター株式会社 半導体装置の製造方法
KR101278442B1 (ko) 2012-01-19 2013-07-01 한국과학기술원 관통 실리콘 비아를 이용한 수동 이퀄라이저를 구비하는 인터포저, 그 제조 방법, 인터포저를 포함하는 적층 칩 패키지, 및 그 제조 방법
JP2015153978A (ja) * 2014-02-18 2015-08-24 キヤノン株式会社 貫通配線の作製方法
KR101855607B1 (ko) * 2014-03-12 2018-05-04 가부시키가이샤 트루칩 재팬 적층 반도체 집적 회로 장치

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4131648B2 (ja) * 2002-07-10 2008-08-13 株式会社東芝 半導体装置および半導体装置の製造方法
JP4327644B2 (ja) * 2004-03-31 2009-09-09 Ｎｅｃエレクトロニクス株式会社 半導体装置の製造方法
JP2006278646A (ja) * 2005-03-29 2006-10-12 Sanyo Electric Co Ltd 半導体装置の製造方法
JP5394617B2 (ja) * 2006-06-16 2014-01-22 新光電気工業株式会社 半導体装置及び半導体装置の製造方法及び基板

Similar Documents

Publication Publication Date Title
JP2009277895A5 (zh)
TWI358799B (en) Semiconductor package substrate and method of form
JP2009194322A5 (zh)
JP2013077711A5 (zh)
JP2013004881A5 (zh)
JP2010153814A5 (zh)
TW200901407A (en) Thin double-sided package substrate and manufacture method thereof
JP2008160160A5 (zh)
JP2007013092A5 (zh)
TW201123387A (en) Thermal-electric separated metal PCB with a chip carrier.
JP2009277895A (ja) シリコンインターポーザ及びその製造方法
TWI571185B (zh) 電子封裝件及其製法
TWI743404B (zh) 用於積體電路封裝的外露式可焊接散熱器
JP2009105311A5 (zh)
JP2009076496A5 (zh)
JP2010244808A5 (zh)
JP2009044154A5 (zh)
JP2010192605A5 (zh)
JP2010245263A5 (zh)
JP2010278181A5 (zh)
JP2008205119A5 (zh)
JP2012004505A5 (zh)
TWI445100B (zh) 封裝結構及其製作方法
TW200737381A (en) Semiconductor device and method for manufacturing the same
EP2221889A2 (en) Light emitting device package