JP2010234448A - Flatness correction jig, method and device for correcting flatness of flat plate member, and polishing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a flatness correction jig quickly improving flatness even if a flat plate member has a thin thickness lacking rigidity. <P>SOLUTION: The flatness correction jig 60 includes a disk 61 placed on the flat plate member 10 arranged on a lapping machine and polished. A resin film 62 is stuck to a surface of the disk 61 facing the flat plate member 10. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a method for correcting flatness of a flat member having a high aspect ratio, and a flatness correcting jig thereof.

Conventionally, a method described below has been adopted as a method for correcting the flatness of a flat plate member.
(1) Flat Plate Holding Method and Polishing Method for Polishing Optical Components Optical components include various flat plate members, and various flat plate member holding methods are employed. However, as a polishing method for correcting flatness, a common method is applied depending on the type of polishing machine.

For example, FIG. 1 shows a lens polisher. In FIG. 1, 1 is a polishing machine body, 2 is a pasting plate, 3 is a polishing plate, 4 is a kanzashi, 5 is an arm, 6 is a lever, 7 is a connecting rod, 8 is a crank, and 9 is a slide. In the case of making the flat plate member 10 convex, the polishing plate 3 having a large size of the polishing plate 3 and a density of the groove in the middle is larger than that of the periphery, and when making the flat plate member 10 concave. The polishing dish 3 is small in size and the density of the middle groove is smaller than that of the periphery. Various methods shown below are known for holding the flat plate member 10 on the attaching plate 2.
(A) A glass, ceramic or metal substrate 12 is set on the affixing plate 2 via a fat 11, and a flat plate member 10 is placed on the substrate 12 to adhere pine resin, wax, pitch, wax or the like. A method in which the material 13 is heated and dissolved to hold the flat plate member 10 on the attaching plate 2 by bonding (see FIGS. 2 and 3);
(B) A method in which the flat plate members 10 are arranged on the affixing dish 2 and are solidified by the gypsum material 14 and the wax 15 and held on the affixing dish 2 (see FIGS. 4 and 5),
(C) Place the flat plate member 10 on a metal or ceramic jig 18 provided with an annular groove 16 on the side instead of the affixing plate 2 and a relief recess 17 on the back surface, and use pine resin, wax, pitch, wax, etc. A method of holding the flat plate member 10 by adhesion to the dedicated jig 18 with the adhesive material 13 (see FIGS. 6 and 7),
(D) Sheet material such as Kyohana paper (thin Japanese paper) in which the glass substrate 19 is attached to the attaching plate 2 via the grease 11 and the glass substrate 19 is impregnated with pine resin, wax, pitch, wax, etc. 20 and laying the flat plate members 10 side by side and holding them on the pasting plate 2 (see FIGS. 8 and 9),
(E) Nittan 21 made into a sphere having a diameter of 3 to 8 mm by kneading pine resin, wax, pitch, wax, gypsum, etc. on the affixing plate 2 is arranged at an appropriate interval, and the flat plate member 10 is disposed on the Nittan 21. Then, a method of holding the flat plate member 10 on the sticking plate 2 by sticking the flat plate member 10 to the sticking plate 2 using the wax 15 (see FIGS. 10 and 11),
(F) A glass substrate 22 polished with high accuracy is set on the affixing plate 2 using the grease 11, and the flat plate member 10 is placed on the glass substrate 22, and the glass is washed with water while observing the state of the Newton ring. A method of attaching the flat plate member 10 to the substrate 22 by attaching the flat plate member 10 to the substrate 22 (see FIGS. 12 and 13), and further increasing the accuracy of this method so that the Newton ring becomes one color. A method of holding them is known.

  As described above, various methods are known for holding the flat plate member 10 of the optical component, and the flat plate member 10 is polished by these holding methods.

  However, in the method described in (a), heating and cooling operations are required before and after bonding, and operations such as removing the adhesive 13 from the substrate 12 and the flat plate member 10 by washing must be performed after polishing. The method shown in (a) is suitable for polishing a large number of flat plate members 10 at the same time, but in addition to the deformation of the substrate 12 and the flat plate member 10 due to thermal expansion, it adheres to the entire back surface of the flat plate member 10. Since the material 13 wraps around, the adhesive stress increases, and the surface accuracy obtained by polishing is lost when the adhesive state is released. Therefore, it is most inappropriate for high-precision machining.

  Next, since the method described in (b) is a block body in which the flat plate member 10 is firmly fixed using the gypsum material 14 to the side surface in addition to the back surface of the flat plate member 10, a plurality of different contour shapes and thicknesses are used. There is an advantage that the seed plate member 10 can be polished simultaneously.

  However, in the method described in (b), it takes a long time to cure the gypsum material 14, and a lot of man-hours are required for the formation of the block body and the disassembly work thereof, and a large amount of industrial waste is generated. Moreover, the flat plate member 10 may be damaged at the time of decomposition | disassembly. Furthermore, since the adhesive stress is large, the surface accuracy obtained by polishing is lost when the adhesive state is released. Therefore, the method shown in (b) is also unsuitable for high-precision machining.

  Next, according to the method described in (c), the disadvantage of (a) is eliminated by using the dedicated jig 18. Since there is no wraparound of the adhesive material 13 to the back surface of the flat plate member 10, the change in surface accuracy after the release of adhesion is slightly mitigated. However, it varies in various ways depending on the surface accuracy, thermal expansion coefficient, and type of the adhesive material 13 of the mutual bonding portion between the dedicated jig 18 and the flat plate member 10.

  When the method (d) is adopted, in the case where the back surface side of the flat plate member 10 has already been polished, the sheet material 20 such as Kyohana paper becomes a buffer material, and there is an effect that the generation of scratches can be prevented. The change in surface accuracy after debonding appears relatively clearly, although it is somewhat relaxed compared to the method (a).

  In the method (e), since the back surface of the flat plate member 10 is partially held, the change in surface accuracy after the release of adhesion is relatively small. However, there is no change in surface accuracy. In some cases, a change of about one Newton ring occurs sufficiently, and the required specifications cannot be satisfied in many cases.

  The method (f) is suitable for polishing the flat plate member 10 with high accuracy. However, it is necessary to polish the back surface of the flat plate member 10 with high accuracy. Since the method shown in (f) uses the difference in thermal expansion between the glass substrate 22 and the flat plate member 10 when the adhesion is released, it may be impossible to separate if one is a low expansion material. Also, even with this method, the surface accuracy does not change at all, and in some cases, a change of about 0.5 Newton rings occurs sufficiently, and the required specifications are often not satisfied.

As described above, the methods (a) to (f) are the holding methods in the case where the flat plate member 10 is polished by the lens polishing machine, but the method for correcting the surface accuracy of the flat plate member 10 obtained by these methods. The following is known.
(2) Method of correcting surface accuracy of flat plate member (α) Method of correcting surface accuracy by increasing / decreasing the swing width of polishing plate 3 attached to Kanzashi (upper shaft) 4 with vibration amplitude screw 4 ′. By increasing the moving width, the flat plate member 10 is made convex, and the swinging width is reduced to make the flat plate member 10 concave.
(Β) Method of Correcting Surface Accuracy by Increasing or Decreasing Size of Polishing Plate 3 As shown in FIG. 14, the size of the polishing plate 3 is increased to make the flat plate member 10 convex, and as shown in FIG. The flat plate member 10 is made concave by reducing the size of the polishing plate 3.
(Γ) When a pitch material is used for the polishing plate 3, a method for correcting the surface accuracy by adjusting the number of grooves formed on the surface of the pitch material.
As shown in FIG. 16, the number of grooves in the central portion of the polishing plate 3 is increased to make the flat plate member 10 convex, and as shown in FIG. 17, the number of grooves in the outer peripheral portion of the polishing plate 3 is increased. The flat plate member 10 is made concave.
(Δ) A method of correcting the surface accuracy of the flat plate member 10 by using a pitch material for the polishing plate 3 and performing plate alignment. The flat plate member 10 is made convex by rubbing the polishing plate 3 with a plate having a convex tendency and polished. The flat plate member 10 is made concave by rubbing the plate 3 with a plate having a concave tendency.
(3) Holding method of the flat plate member 10 applied to the lapping machine The lapping machine applied to the polishing of the flat plate member 10 includes a single-sided lapping machine (see FIG. 18) and a double-sided lapping machine capable of simultaneously polishing both sides (FIG. 19). See).

  In FIG. 18, 23 is a turntable, 24 is a lap surface plate, 25 is a guide arm, 26 is a guide roller, 27 is a guide arm adjusting screw, and 28 is a ring carrier member. In FIG. 19, 30 is a central gear member, 30a is a gear formed on the outer periphery thereof, 31 is a ring-shaped gear member, 31a is a gear formed on the inner periphery of the ring-shaped gear member 31, and 32 is a lower gear. A lap surface plate, 33 is an upper lap surface plate, 34 is a toothed carrier plate, and 34a is a gear formed on the outer periphery of the toothed carrier plate.

In the case of a single-sided lapping machine, the method described below is adopted as means for holding the flat plate member 10 on the ring carrier member 28.
(G) There is a method (see FIGS. 20 and 21) in which the flat plate member 10 is fitted into the carrier plate 35 having a cut-out hole 35 a formed in the contour shape of the flat plate member 10. During the pressurization, a load member 37a is further placed on the substrate 36, and a load is applied to the flat plate member 10 (see FIGS. 22 and 23).
(H) A method in which the flat plate member 10 is placed under a glass, ceramic, or metal sticking substrate 37 and adhered by an adhesive 13 that is melted by heating such as pine resin, wax, pitch, wax, or the like (see FIGS. 24 and 25). There is also. At the time of pressurization, a load member 37a is further placed on the sticking substrate 37, and a load is applied to the flat plate member 10 (see FIGS. 26 and 27).
(I) A method in which a thick film 38 called a non-slip film having a thickness of about 1 mm to 3 mm is provided between a glass, ceramic, or metal sticking substrate 37 and a flat plate member 10, and the flat plate members 10 are aligned and pressure-bonded (FIG. 28). , See FIG. 29). At the time of pressurization, a load member 37a is further placed on the sticking substrate 37, and a load is applied to the flat plate member 10 (see FIGS. 30, 31, and Patent Document 1).

  Since the holding method of the flat plate member 10 shown in (g) holds the flat plate member 10 without using an adhesive, it is suitable for polishing the flat plate member 10 with high accuracy. Although it becomes low efficiency, if a load is not applied to the flat plate member 10, there is an advantage that the flat plate members 10 having different thicknesses can be polished simultaneously.

  The holding method of the flat plate member 10 shown in (h) requires heating and cooling operations before and after bonding, and after polishing, the operation of washing the adhesive 13 from the adhesive substrate 37 and the flat plate member 10 is not performed. Don't be. In addition to the deformation of the adhesive substrate 37 and the flat plate member 10 due to thermal expansion, the adhesive material 13 wraps around the entire back surface of the flat plate member 10, so that the adhesive stress is large, and the surface accuracy given by polishing is lost when released from the bonded state. It is. Therefore, it is an improper holding method for high-precision machining. However, there is an advantage that the thickness variation among the plurality of flat plate members 10 can be minimized.

  The holding method of the flat plate member 10 shown in (i) is a method of holding with a thick film having surface friction and inherent viscoelasticity instead of the adhesive. Even if there is a slight variation in thickness between samples, there is an advantage that polishing can be performed without giving a step to the processed surface. Moreover, the cleaning operation of the adhesive is not necessary. However, since a strong adhesive force acts like the adhesive, the shape is greatly impaired when the flat plate member 10 is returned to a single body.

  As mentioned above, although (g)-(i) was the holding method in the case of grinding | polishing the flat member 10 with a single-sided lapping machine (refer FIG. 18), it is the correction method of the surface accuracy of these flat members 10. Are described below.

  Usually, the lap surface 24a of the lap surface plate 24 is modified in shape by using a diamond wheel 39 shown in FIGS. First, the position of the diamond wheel 39 is shifted to the center of the lap surface to create a pressure distribution gradient, and the lap surface 24a is made concave as shown in FIG. 34, whereby the flat plate member 10 is made convex. Next, the position of the diamond wheel 39 is shifted to the outer peripheral portion of the lap surface 24a, so that the lap surface 24a is convex and the flat plate member 10 is concave as shown in FIG.

  In the case of a double-sided lapping machine (see FIG. 19), since the flat plate member 10 is held on the toothed carrier plate 34 shown in FIGS. 36 and 37 without using an adhesive, the surface when released from bonding There is no change in accuracy. It is suitable for polishing the flat plate member 10 that requires a large amount of parallelism. However, in a double-sided lapping machine, it is necessary to throw in an appropriate amount of the flat plate member 10 so that it always varies evenly on the lapping surface 24a. Further, all of the flat plate members 10 as industrial products do not necessarily require the same finish on both sides.

Further, the method for correcting the surface accuracy of the flat plate member 10 on the double-sided lapping machine is limited only to the transfer of the flatness of the lapping surface 24a. For accuracy management of the lap surface 24a, the upper lap surface 24a and the lower wrap surface 24a are periodically replaced, and the eccentric lap surface is rubbed with the upper lap surface 24a and the lower lap surface 24a by decentering the upper lap surface 24a. The law is done. These maintenance histories have a great influence on the flatness of the lapping surface 24a, which is less convenient than a lens polishing machine or a single-side lapping machine capable of correcting the shape of the flat plate member 10 on the spot.
(4) Wafer substrate holding method and polishing method in the case of semiconductor polishing (a) The polishing apparatus in the semiconductor manufacturing process is provided with a pressure plate 41 at the tip of a rotary drive shaft 40, as shown in FIG. There is known a method in which a ceramic mounting plate 42 is provided on the pressure plate 41 and a 4, 6 or 8 inch diameter wafer substrate (flat plate member 10) 44 is fixed to the ceramic mounting plate 42 with an adhesive 43 such as wax. Yes.

The rotary drive shaft 40, the pressure plate 41, and the ceramic mounting plate 42 are set on the carrier ring 45, the polishing pad 47 is attached to the turntable 46, the turntable 46 is rotated while applying a load, and the carrier ring 45 is rotated. Then, there is a method of polishing the wafer substrate 44.
(B) Further, as shown in FIG. 39, the wafer substrate 44 is held by being chucked to the pressure plate 41 by a vacuum suction method in which the wafer substrate 44 is vacuum-sucked to the pressure plate 41 through the porous ceramic mounting plate 48. There is also a method of polishing the wafer substrate 44 by rotating the turntable 46 while rotating the turntable 46 while applying a load.
(C) Further, as shown in FIG. 40, the pressure plate 41 is provided with a stepped portion 49 that is cut out in the contour shape of the wafer substrate 44, and the wafer substrate holding backing material 50 is fitted into the stepped portion 49, and the surface thereof is formed. There is also a method of holding the wafer substrate 44 and rotating the turntable 46 while applying a load, and polishing the wafer substrate 44 by rotating the rotation drive shaft 40. The wafer substrate holding backing material 50 is composed of a laminate including an adhesive resin layer.
(D) Further, as shown in FIG. 41, an air bag 53 is inserted between the pressure plate 41 with the foamed urethane sheet 51 attached in the carrier ring 45 and the backing film 52, and the wafer is attached to the backing film 52. The substrate 44 is attached, the wafer substrate 44 supported by the rotary drive shaft 40 is pressed against the polishing pad 47 on the turntable 46, and the pressurizing pressure is controlled by the airbag 53, and the wafer substrate 44 and the polishing pad 47 are connected. There is also a holding method using a backing film 52 for polishing the surface 44a of the wafer substrate 44 by rubbing.

  In the method of holding the wafer substrate 44 in (a) and (b), it is necessary to extremely flatten the surfaces of the ceramic mounting plates 42 and 48 that are the reference for pasting, and the back surface of the wafer substrate 44 is flat on the front side. This is called the backside reference holding method because it becomes the standard for chemical polishing.

  However, the method (a) for holding the wafer substrate 44 requires an operation of dropping the adhesive 43 by the polished wafer substrate 44 and the ceramic mounting plate 42 before and after polishing, and has not been used in recent years. . In addition, the method (b) of holding the wafer substrate 44 has a drawback that dust easily adheres between the porous ceramic mounting plate 48 as the chuck member and the pressure plate 41.

  On the other hand, the method for holding the wafer substrate 44 shown in (c) and (d) is called a surface reference holding method because it is not necessary to use the back surface of the wafer substrate 44 as a reference for flattening polishing on the front surface side. It is. This method is widely used for CMP polishing of semiconductor devices in that it absorbs large waviness and thickness variation of the wafer substrate 44. In the semiconductor polishing process, “carrier ring 45” is generally called “retainer”, and “surface of turntable 46” is generally called “platen”.

JP 2003-39312 A

  In the holding method using the adhesive among the holding method and the polishing method of these flat plate members 10, when the flat plate member 10 is used alone after polishing, the change in surface accuracy is remarkable. Even if the flatness of the front surface of the sticking plate and the back surface of the flat plate member 10 is increased at a cost, the adhesive cannot be used to avoid the change in surface accuracy.

  Further, in the holding method using a thick film having viscoelasticity and a backing material, it is not necessary to excessively finish the flatness of the front surface of the sticking plate and the back surface of the flat plate member 10. When 10 is removed, the surface accuracy changes.

The flat plate member 10 is most easily held and polished by the method of holding the flat plate member 10 on the carrier plate 34 and polishing using a single-sided lapping machine shown in FIG.
However, in this case, the rigidity of the flat plate member 10 affects. If a thick member having sufficient rigidity is polished, when the lapping surface 24a is concave, the flat plate member 10 is finished to a convex surface. However, in the case of the thin flat plate member 10, even if the lap surface 24 a is concave, first, as shown in FIGS. 42 and 43, the flat plate member 10 is polished in a deformed state, so that the convex surface is finished. It takes a long time. In other words, even if a lap surface 24a with high flatness is prepared, the surface of the concave (convex) flat plate member 10 is first elastically deformed in accordance with the lap surface 24a, so that it takes a long time to improve the flatness. .
The present invention has been made in view of the above circumstances, and its purpose is limited to a high aspect ratio flat plate member typified by an ellipse, but even a thin flat plate member lacking rigidity can be quickly developed. An object of the present invention is to provide a method for improving flatness, a flatness correcting jig, a flatness correcting device, and a polishing device.

  In addition, an object of the present invention is to provide a flatness correcting device capable of reducing the manufacturing cost by reducing the setup work involved in correcting the flatness of the lapping surface and extending the life of the lapping machine.

   The flatness correcting jig according to claim 1 has a disk placed on a flat plate member disposed on a lapping machine and polished, and a resin film is provided on a surface of the disk facing the flat plate member. Affixed and used to correct the flatness of the flat plate member.

  In the flatness correcting jig according to claim 2, the resin film is made of a ring-shaped or annular film, and is attached to the periphery of the disk.

  In the flatness correcting jig according to claim 3, the resin film is a disk-shaped film and is attached to the center of the disk.

  In the flatness correcting jig according to the fourth aspect, the resin film is a disc-like film and is attached to the entire area of the disc.

  The flatness correcting method according to claim 5 is configured such that the flatness correcting jig according to any one of claims 2 to 4 is placed on the flat plate member, and the flat plate member is pressed through the resin film. The flatness of the flat plate member is corrected by polishing with a lapping machine.

  The flatness correcting method according to claim 6 is a surface having a disk placed on a flat plate member to be disposed and polished on a lapping machine, and facing the flat plate member of the disk, and A flatness correcting jig for correcting the flatness of the flat plate member by affixing a ring-shaped or annular resin film to the peripheral portion, and a flat plate member placed on a lapping machine and polished. And a flatness correcting jig for correcting the flatness of the flat plate member by attaching a disc-shaped resin film to the central portion of the disk facing the flat plate member. The flatness correction jig is prepared in advance, and the flatness of the flat plate member is corrected by using the two types of flatness correction jigs.

  The flatness correcting method according to claim 7, wherein the flatness correcting method has a disk placed on a flat plate member that is disposed and polished on a lapping machine, and is a surface facing the flat plate member of the disk, and A flatness correction jig for correcting the flatness of the flat plate member is prepared in advance by attaching a disk-shaped resin film to the entire area, and the flatness of the flat plate member is obtained by properly using three types of flatness correction jigs. To correct.

  An apparatus for correcting flatness according to claim 8 is configured such that the flatness correcting jig according to any one of claims 2 to 4 is placed on the flat plate member, and the flat plate member is added via a resin film. The flatness of the flat plate member is corrected by rotating and lapping the lapping machine while pressing.

  A polishing apparatus according to claim 9 is configured to place the flatness correcting jig according to any one of claims 2 to 4 on the flat plate member and pressurize the flat plate member through a resin film. The flatness of the flat plate member is corrected by rotating and lapping the lapping machine.

  According to the first to ninth aspects of the present invention, since the pressure distribution can be changed in the flat plate member, the flatness can be quickly improved even with a thin flat plate member lacking rigidity. . Further, it is possible to reduce the manufacturing cost by reducing the setup work related to the correction of the flatness of the lapping surface and extending the life of the lapping machine.

  In other words, since it is not necessary to finely modify the lapping surface using an electrodeposited diamond wheel and finish it to a high degree of flatness, it is possible to adopt a production system that does not depend on highly skilled skills. Reduces lap surface wear and reduces lap life.

  In particular, according to the second aspect of the invention, it is effective to improve the flatness of the flat plate member to a convex tendency.

  In particular, according to the third aspect of the present invention, it is effective to improve the flatness of the flat plate member to a concave tendency.

  In particular, according to the invention described in claim 4, it is effective to make the flatness of the flat plate member follow the lapping surface.

  In particular, according to the invention described in claims 6 and 7, the flatness can be improved quickly and with high accuracy by properly using two or more kinds of flatness correction jigs.

FIG. 1 is a perspective view schematically showing a schematic structure of a lens polishing machine. FIG. 2 is a plan view of the flat plate member attached to the attaching plate. 3 is a cross-sectional view taken along the line AA in FIG. FIG. 4 is a plan view of a flat plate member hardened with gypsum. FIG. 5 is a sectional view taken along the line BB in FIG. FIG. 6 is a plan view of a flat plate member attached to a dedicated jig. FIG. 7 is a cross-sectional view taken along the line CC in FIG. FIG. 8 is a plan view of a flat plate member attached via Kyohana paper. FIG. 9 is a sectional view taken along the line DD in FIG. FIG. 10 is a plan view of a flat plate member pasted through Niton. 11 is a cross-sectional view taken along the line EE in FIG. FIG. 12 is a plan view of a flat plate member attached via a glass substrate. 13 is a cross-sectional view taken along the line FF in FIG. FIG. 14 is a schematic view showing an example of a polishing dish having a large diameter. FIG. 15 is a schematic diagram showing an example of a polishing dish having a small diameter. FIG. 16 is a schematic diagram showing an example of a polishing dish having a large density of grooves in the middle. FIG. 17 is a schematic diagram showing an example of a polishing dish having a large density of peripheral grooves. FIG. 18 is a perspective view schematically showing an example of the structure of a single-sided lapping machine. FIG. 19 is a perspective view schematically showing an example of the structure of a double-sided lapping machine. 20 is a plan view of a flat plate member set on the lapping machine shown in FIG. 21 is a cross-sectional view taken along line GG in FIG. FIG. 22 is a plan view showing a state in which the load member is placed on the flat plate member shown in FIG. 23 is a cross-sectional view taken along the line G′-G ′ of FIG. FIG. 24 is a plan view showing a state in which a flat plate member is attached to the attachment substrate via an adhesive material. 25 is a cross-sectional view taken along the line HH in FIG. FIG. 26 is a plan view showing a state in which a load member is placed on the flat plate member shown in FIG. 27 is a cross-sectional view taken along the line H-H ′ of FIG. FIG. 28 is a plan view showing a state in which a non-slip film is interposed between the flat plate member and the substrate. 29 is a cross-sectional view taken along the line II of FIG. 30 is a plan view showing a state in which a load member is added to the flat plate member of FIG. 28 via a substrate. 31 is a cross-sectional view taken along the line I'-I 'of FIG. FIG. 32 is a cross-sectional view schematically showing an example of correction of the lapping surface of the lapping machine. FIG. 33 is a perspective view schematically showing an example of correction of the lapping surface of the lapping machine. FIG. 34 is a cross-sectional view schematically showing an example of a modified lap surface. FIG. 35 is a cross-sectional view showing another example of the modified lapping surface. FIG. 36 is a plan view of a flat plate member set on a carrier plate of a double-sided lapping machine. FIG. 37 is a sectional view taken along the line JJ in FIG. FIG. 38 is an explanatory view of a method applied to a single-sided lapping machine, and is a sectional view schematically showing an outline of a semiconductor holding method for fixing a wafer substrate to a ceramic mounting plate with an adhesive such as wax. . FIG. 39 is an explanatory view of a method applied to a single-sided lapping machine, and is a cross-sectional view schematically showing an outline of a semiconductor holding method for vacuum chucking a wafer substrate by depressurizing a porous ceramic mounting plate. FIG. 40 is an explanatory view of a method applied to a single-sided lapping machine, in which a pressure plate is provided with a step formed in the contour shape of the wafer substrate and a wafer substrate holding backing material is fitted, and the wafer substrate is held on the surface. It is sectional drawing which shows the outline | summary of the holding method of the semiconductor to perform typically. FIG. 41 is an explanatory view of a method applied to a single-sided lapping machine. A semiconductor in which an air bag is inserted between a pressure plate with a foamed urethane sheet attached in a ring and a backing film, and a wafer substrate is attached to the film surface. It is sectional drawing which shows the outline | summary of the holding | maintenance method typically. FIG. 42 is a cross-sectional view schematically showing a flat plate member deformed following the lapping surface of the lapping machine. FIG. 43 is a perspective view schematically showing the lapping machine and the flat plate member shown in FIG. FIG. 44 is a plan view of a flatness correcting jig in which a ring-shaped resin film is attached to the periphery of the disk. FIG. 45 is a cross-sectional view schematically showing a state in which the flatness is corrected by setting the flatness correcting jig shown in FIG. 44 on a single-sided lapping machine and performing polishing. FIG. 46 is a perspective view for explaining a state in which the flatness of the flat plate member is corrected using the single-sided lapping machine, flat plate member, and flatness correcting jig shown in FIG. FIG. 47 is a cross-sectional view schematically showing the distribution of pressure applied to the flat plate member when the flatness correcting jig shown in FIG. 44 is placed on the flat plate member. FIG. 48 is an explanatory diagram showing the state of interference fringes before flatness correction and the state of interference fringes after flatness correction. FIG. 49 is a schematic diagram for explaining the pressure applied when the rotational phase relationship between the flatness correcting jig provided with the ring-shaped resin film and the flat plate member is shifted. FIG. 50 is a schematic diagram for explaining the pressure applied when the rotational phase relationship between the flatness correcting jig having a notch-shaped resin film different from the ring-shaped resin film and the flat plate member is shifted. . FIG. 51 is a schematic diagram showing a state in which a resin film is attached to an end surface portion in the major axis direction of a flat plate member. FIG. 52 shows a cross section of a flatness correcting jig in which a disk-shaped resin film is attached to the central portion of the disk, its flat surface, interference fringes of a flat plate member before flatness correction, and a flat plate member after flatness correction. It is a figure which shows these interference fringes. FIG. 53 shows a cross section of a flatness correcting jig in which a ring-shaped resin film is attached to the periphery of the disk, its plane, interference fringes of the flat plate member before flatness correction, and a flat plate member after flatness correction It is a figure which shows these interference fringes. FIG. 54 is a view showing a cross section of a flatness correcting jig in which a disk-shaped resin film is bonded to the entire surface of the disk and its plane.

Example 1
FIG. 44 is a plan view showing an example of a flatness correcting jig according to the present invention. In FIG. 44, reference numeral 60 denotes a flatness correcting jig. A disk 61 is used for this flatness correction jig. The lower surface 61a and upper surface 61b of the disk 61 are parallel planes as shown in FIG. As the disk 61, for example, a ceramic substrate, a glass substrate, a SUS substrate, or a metal substrate subjected to rust prevention treatment is used. Here, the description will be made assuming that the lower surface 61a faces the flat plate member 10 shown in FIGS.

  The lower surface 61a has a flatness of 10 μm or less. A thin plate-like resin film 62 having a thickness of about 0.3 mm to 1 mm is attached to the lower surface 61a. The resin film 62 has an annular or annular shape. It is desirable that the resin film 62 is attached to the disk 61 so that the center O of the resin film 62 and the center O ′ of the disk 61 are substantially coincident with each other. The lower surface 61a of the disk 61 is covered at its peripheral portion 61c by the resin film 62, and its central portion 61d is exposed. This resinous film 62 is desirably free of stickiness and has a good sliding property (low coefficient of friction), and the material of the resinous film 62 is not limited.

  The flatness correcting jig 60 is used when the flat plate member 10 set on a single-sided lapping machine as a polishing apparatus shown in FIG. 18 is polished. The flattened member 10 and the flatness correcting jig 60 are attached to the single-sided lapping machine. The set state is shown in FIGS. 45 and 46, the same components as those shown in FIG. 18 are denoted by the same reference numerals, and detailed description thereof is omitted.

  Here, the flat plate member 10 is an elliptical flat plate sample. The flat plate sample has a high aspect ratio with a large ratio of the major axis (major axis) to the minor axis (minor axis). The ring member 28 is guided by two guide rollers 26 and 26. The flat plate member 10 is set in the ring member 28. The shape of the flat plate member 10 is a concave surface. That is, when the flat plate member 10 is placed on the lap surface 24a with the lower surface 10a facing downward, the periphery of the lower surface 10a facing the lap surface 24a is in contact with the lap surface 24a, and the central portion of the lower surface 10a is lifted from the lap surface 24a. The shape is in a state. The flatness correction polishing jig 60 is placed on the elliptical flat plate member 10 with the lower surface 61a to which the resin film 62 is attached facing downward so that the resin film 62 contacts the upper surface 10b of the flat plate member 10. It is done.

  When such a flatness correcting jig 60 is set on the flat plate member 10, there is no resin film 62 at the central portion 61d of the disk 61. Therefore, the upper surface 10a of the flat plate member 10 and the lower surface of the disk 61 corresponding to the central portion 61d. As shown in FIG. 47, an air gap 63 is formed in the central portion of 61b, and the long axis direction of the resin flat plate 10 is caused by the action of the resin film 62 affixed to the peripheral portion 61c of the flatness correcting jig 62. The peripheral part is selectively pressurized. In FIG. 47, the symbol F indicates the pressure distribution. In the pressure distribution F, since the air gap 63 exists in the central portion, the flat plate member 10 has no applied pressure and moves from the central portion toward the peripheral portion. In this way, the pressure gradually increases.

  In FIG. 46, when the turntable 23 is rotated in the direction of the arrow X1 with the flatness correcting jig 60 set on the ring member 28, the ring member 28 is supported by the two guide rollers 26 and 26 and in the direction of the arrow X2. Accordingly, the lower surface 10a of the flat plate member 10 is polished while being rotated with respect to the lapping surface 24a.

  Here, the material of the flat plate member 10 is a glass ceramic having a major axis of 140 mm, a minor axis of 55 mm, and a thickness of 8 mm. The diameter of the lapping surface 24a of the lapping surface plate 24 is 380 mm, and the lapping surface plate 24 is a commercial product made of a composite material of a metal material and a resin material. Here, a diamond slurry having a particle diameter of 1 μm was used as the abrasive.

  As a result, at first, wear occurs selectively at the end surface portion in the major axis direction of the elliptical flat plate member 10 whose bottom surface 10a has a concave shape, and the flatness is improved. In FIGS. 45 and 47, reference numeral 10 c indicates an end surface portion of the flat plate member 10.

  48A shows a photograph of interference fringes before polishing the lower surface 10a of the high aspect ratio flat plate member 10, and FIG. 48B shows the high aspect ratio by the lapping machine shown in FIGS. 45, 46, and 47. FIG. The interference fringe photograph after grind | polishing the lower surface 10a of the flat plate member 10 of the ratio is shown. The flatness is determined based on the number of interference fringes.

  Both ends of the interference fringes K of the elliptical flat plate member 10 before the correction polishing are warped upward, and the flatness of the flat plate member 10 is about 1.6 interference fringes (≈0.8λ≈0.48 μm). . When this flat plate member 10 is polished for about 10 minutes using the flatness correcting jig 60, the longitudinal end surfaces 10c and 10c of the elliptical flat plate member 10 are selectively depleted. Further, the warping of both ends of the interference fringe K is reduced to about 0.4 interference fringes (≈0.2λ≈0.12 μm). That is, in terms of the number of interference fringes, the number of interference fringes K was improved by about 1.2 before and after flatness correction.

  By the way, when the flatness correcting jig 60 to which the annular resin film 62 is attached is used, the rotational phase relationship between the elliptical flat plate member 10 and the annular resin film 62 is in the ring member 28. As shown by the broken line in FIG. 49, even if it is displaced during polishing, the back surface portion corresponding to the end surface portions 10c and 10c in the major axis direction is selectively pressurized even if it is displaced during polishing. Even if the rotational phase relationship is deviated, a pressing force is always applied to the end faces 10c, 10c in the major axis direction during polishing, and the flatness can be corrected without any trouble.

  On the other hand, as shown in FIG. 50, a resin film 62 ′ cut out in a semicircular arc shape is pasted symmetrically on a part of the lower surface 61a of the flatness correcting jig 60 to form an annular resin film. When a resin film 62 ′ in which a part of 62 is cut out is used, the rotational phase relationship between the resin film 62 ′ and the flat plate member 10 is shifted as shown by a solid line in the ring member 28 during polishing. In this case, the target pressure state cannot be maintained, and the flatness cannot be corrected.

  Generally, the outer diameter of a plate (not shown) for holding the flat plate member 10 and the outer diameter of the flatness correcting jig 60 are slightly different from the inner diameter of the ring member 28, and the material of the flat plate member 10 and the material of the plate are different. Since the material of the flatness correction jig 60 is different, the frictional force with respect to the lap surface plate 24 is different, and the rotational phase between the flat plate member 10 and the flatness correction jig 60 is always shifted during polishing.

As a method for eliminating the rotational phase relationship deviation between the flat plate member 10 and the flatness correcting jig 60 during polishing, as shown in FIG. 51, the upper surface 10b of the flat plate member 10 is an end surface portion in the major axis direction. When the resin films 62 ″ and 62 ″ are pasted on the back surfaces corresponding to 10 c and 10 c, the same pressure as when the annular resin film 62 is pasted along the outer periphery of the flatness correcting jig 60. Even if the distribution is obtained and the rotational phase relationship between the flat plate member 10 and the flatness correcting jig 60 is deviated, there is no problem in correcting the flatness.
However, when this method is employed, the resin film 62 "must be pasted for each sample whose flatness is to be corrected, and it takes time and effort to attach the resin film 62" from the flat plate member 10 after polishing. However, even if the flatness has been corrected, there is a change in the surface accuracy with the resin film 62 ″ attached and the surface accuracy with the resin film 62 ″ removed. Not practical.
(Example 2)
52A and 52B show a flatness correcting jig 60 in which a disc-shaped resin film 62 is attached to the center of the lower surface 61a of the disc 61. FIG.

  52 (a) and 52 (b), instead of the flatness correcting jig 60 shown in FIG. 44 in which an annular resin film 62 is attached to the periphery of the disk 61. When the flatness of the flat plate member 10 is corrected using the flatness correction jig 60 in which the disk-shaped resin film 62 is attached to the central portion of the lower surface 61a of the disk 61 as described above, The central portion is selectively pressurized. As a result, the central portion of the elliptical flat plate member 10 which is initially convex is selectively depleted, and the flatness is improved. FIG. 52 (c) shows an interference fringe photograph before polishing the lower surface 10a of the high aspect ratio flat plate member 10, and FIG. 52 (d) shows the state after the lower surface 10a of the high aspect ratio flat plate member 10 is polished. An interference fringe photograph is shown.

As described above, the flatness of the convex flat plate member 10 can be improved by using the flatness correcting jig 60 in which the disc-shaped resin film 62 is attached to the center of the lower surface 61a of the disc 61.
Example 3
When the flatness of the flat plate member 10 is corrected using the flatness correction jig 60 shown in FIGS. 52 (a) and 52 (b), as shown in FIGS. 52 (c) and 52 (d), a convex shape is obtained. When the flat plate member 10 can be corrected in the concave direction, the flatness correction jig 60 shown in FIG. 44, that is, the flatness correction jig 60 shown in FIGS. 53 (a) and 53 (b) is used. As shown in FIGS. 53 (c) and 53 (d), the concave flat plate member 10 can be corrected in a convex shape. Therefore, the unevenness of the flat plate member 10 can be corrected by properly using the two types of flatness correcting jigs 60 depending on the uneven state of the flat plate member 10, and the flatness of the flat plate member 10 is appropriately corrected.

  Depending on the unevenness of the flat plate member 10, it is determined whether to use the ring-shaped resin film 62 or the disk-shaped resin film 62, and the resin film 62 affixed to the disk 61 is replaced. It is also conceivable to

  However, when there is a large amount of the flat plate member 10 whose flatness is to be corrected and the uneven shape of the flat plate member 10 also varies, an annular resin film 62 (FIG. 44, FIG. 53 (a), FIG. 53 (b)) and the flatness correction jig 60 to which the disc-shaped resin film 62 is attached (see FIGS. 52 (a) and 52 (b)). If two types of flatness correction jigs 60 are prepared in advance, and the two types of flatness correction jigs 60 are properly used depending on the shape of the unevenness of the flat plate member 10, without performing the reworking operation of the resin film 62, Corrective polishing with flatness can be performed quickly.

  Further, in addition to the two types of flatness correction jigs 60, flatness correction jigs 60 shown in FIGS. 54A and 54B that can uniformly press the entire surface of the flat plate member 10 are used. For example, a more appropriate flatness correction jig 60 can be selected depending on the unevenness of the flat plate member 10. In the flatness correcting jig 60 shown in FIGS. 54 (a) and 54 (b), a disk-shaped resin film 62 is attached to the entire lower surface 61a of the disk 61.

  As shown in FIGS. 54 (a) and 54 (b), when a flatness correcting jig 60 in which a resin film 62 is bonded to the entire surface of the disk 61 is used, FIGS. 44, 53 (a) and FIG. A flatness correcting jig 60 in which a ring-shaped resin film 62 shown in 53 (b) is attached to the periphery of the disk 61, and a disk in the center of the disk 61 shown in FIGS. 52 (a) and 52 (b). The flatness correction is slower than the flatness correction jig 60 to which the resin film 62 is attached, but it tends to follow the shape of the wrap surface 24a.

10 ... Flat plate member 60 ... Flatness correction jig 61 ... Disk 61
62 ... Resin film

Claims (9)

  It has a disk placed on a flat plate member that is placed and polished on a lapping machine, a resin film is attached to the surface of the disk facing the flat plate member, and the flatness of the flat plate member is increased. A flatness correction jig characterized in that it is used for correction.   The flatness correcting jig according to claim 1, wherein the resin film is made of a ring-shaped or annular film and is attached to a peripheral portion of the disk.   The flatness correcting jig according to claim 1, wherein the resin film is made of a disk-like film and is attached to a central portion of the disk.   The flatness correcting jig according to claim 1, wherein the resin film is made of a disk-shaped film and is attached to the entire area of the disk. In the flatness correction method for a flat plate member that corrects the flatness of the flat plate member by polishing the flat plate member with a lapping machine,
The flatness correcting jig according to any one of claims 2 to 4 is placed on the flat plate member and polished by the lapping machine while pressing the flat plate member through a resin film. A flatness correction method for a flat plate member, wherein the flatness of the flat plate member is corrected.   A disk-shaped or annular resin film having a disk placed on a flat plate member to be disposed and polished on a lapping machine and facing the flat plate member of the disk and having a ring-shaped or annular ring at the periphery And a flatness correcting jig for correcting the flatness of the flat plate member, and a flat plate member placed on the flat plate member to be polished on the lapping plate, the flat plate member of the disc Two types of flatness correction jigs are prepared in advance, such as a flatness correction jig that corrects the flatness of the flat plate member by attaching a disk-shaped resin film to the center portion of the flat plate member. A flatness correction method for a flat plate member, wherein the flatness of the flat plate member is corrected by using different types of flatness correction jigs.   A disk-shaped resin film is attached to the entire surface of the disk that has a disk placed on a flat plate member to be polished by being placed on a lapping machine and is opposed to the flat plate member of the disk. The flatness correction jig for correcting the flatness of the flat plate member is prepared in advance, and the flatness of the flat plate member is corrected by properly using three types of flatness correction jigs. The flatness correction method of the flat plate member of description. In a flatness correcting device comprising a lapping machine for polishing a flat plate member, setting the flat plate member on a ring member and correcting the flatness of the flat plate member,
The flatness correcting jig according to any one of claims 2 to 4 is placed on the flat plate member, and the lapping machine is rotated and polished while pressing the flat plate member through a resin film. The flatness correcting device according to claim 1, wherein the flatness of the flat plate member is corrected. In a polishing apparatus comprising a lapping machine for polishing a flat plate member, setting the flat plate member to a ring member and correcting the flatness of the flat plate member,
The flatness correcting jig according to any one of claims 2 to 4 is placed on the flat plate member, and the lapping machine is rotated and polished while pressing the flat plate member through a resin film. By this, the flatness of the flat plate member is corrected.