JP2010173136A - Recording head and recording apparatus equipped with the same - Google Patents

Recording head and recording apparatus equipped with the same Download PDF

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Publication number
JP2010173136A
JP2010173136A JP2009016524A JP2009016524A JP2010173136A JP 2010173136 A JP2010173136 A JP 2010173136A JP 2009016524 A JP2009016524 A JP 2009016524A JP 2009016524 A JP2009016524 A JP 2009016524A JP 2010173136 A JP2010173136 A JP 2010173136A
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Prior art keywords
wiring
control
heat generating
protective layer
layer
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JP2009016524A
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JP5317723B2 (en
Inventor
Yoshihiro Iguma
Yoshihide Ikegami
Hidenobu Nakagawa
Tomoshi Nakamura
Yoshihiro Rokusha
Shiro Sakushima
秀信 中川
知史 中村
史朗 作島
義宏 六車
佳秀 池上
嘉寛 猪熊
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Kyocera Corp
京セラ株式会社
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Abstract

PROBLEM TO BE SOLVED To provide a recording head and a recording apparatus capable of satisfactorily covering a control wiring with a protective material.
A thermal head 10 according to the present invention includes a heat storage layer, a plurality of heat generating portions 41 arranged on the heat storage layer along main scanning directions D1 and D2, and a control IC 70 that controls the plurality of heat generating portions 41. A plurality of first conductive layers 51 that electrically connect the plurality of heat generating portions 41 and the control IC 70; a plurality of heat generating portions 41 and a protective layer 60 that covers a part of the plurality of conductive layers on the heat generating portion 41 side; The heat storage layer 30 has a plurality of depressions 31 a extending along the gaps between the plurality of conductive layers 50, and the surface roughness of the plurality of depressions is the first conductive layer 51. The surface roughness of the side surface 512a of the two wiring parts 512 is smaller than the surface roughness of the first conductive layer 51 and the gap between the control wiring 51 and the control wiring 51 is a fluid precursor. To the second protective layer 62 formed by curing More covered.
[Selection] Figure 2

Description

  The present invention relates to a heat generating element, a control element for the heat generating element, a recording head having a control wiring for connecting the control element and the heat generating element, and a recording apparatus including the recording head.

  As a printer such as a facsimile or a register, a thermal printer that includes a thermal head and a platen roller, and prints using thermal paper or a thermal transfer ink ribbon and plain paper as a recording medium is used. A thermal head mounted on such a thermal printer includes a plurality of heating elements arranged on a substrate and a control element arranged on the substrate and controlling the driving of the heating elements. There is. The platen roller has a function of pressing a recording medium such as thermal paper on the heating element. In the thermal printer having such a configuration, the heat generating element generates heat according to a desired image, and the heat generated by the heat generating element is well transmitted to the recording medium by pressing the recording medium on the heat generating element with a platen roller. I am letting. By repeating this process, a desired image is printed on the recording medium.

  In such a thermal head, the heating element is covered with a control wiring electrically connected to the control element, and a protective material formed by coating the control wiring with a fluid precursor and curing it. There are some which are further configured. A thermal head having such a configuration is disclosed in Patent Document 1, for example.

  However, in the thermal head disclosed in Patent Document 1, when the separation distance between the individual electrode patterns (corresponding to the above-mentioned “control wiring”) is shortened, this precursor is applied when the precursor of the protective layer is applied. In some cases, the body did not reach the lower surface of the gap between the individual electrode patterns. In this way, the precursor does not reach the lower surface, and a gap is generated between the lower surface and the protective layer, and the adhesion of the protective layer may be reduced.

JP-A-7-186428

  The present invention has been conceived under such circumstances, and an object thereof is to provide a recording head capable of satisfactorily covering a control wiring with a protective material and a recording apparatus including the recording head. To do.

  The recording head of the present invention includes a substrate, a heat storage layer provided on the substrate, a plurality of heating elements arranged on the heat storage layer along the main scanning direction, and a sub-scanning direction on the substrate. A control element for controlling the plurality of heating elements, which is disposed apart from the plurality of heating elements, and the plurality of heating elements and the control element provided on the substrate. A plurality of control wirings connected to each other, and a plurality of heating elements and a protective layer covering a part of the plurality of control wirings on the heating element side, wherein the heat storage layer is a gap between the plurality of control wirings And the surface roughness of the plurality of depressions is smaller than the surface roughness of the side surface of the control wiring, and covers the protective layer of the plurality of control wirings. Unidentified parts and multiple controls Gap between lines is characterized by being covered with a protective material formed by curing a precursor having fluidity.

  In the recording head according to the aspect of the invention, it is preferable that the plurality of depressions have a width in the main scanning direction that increases from the lower side to the upper side in the thickness direction.

  In the recording head according to the aspect of the invention, it is preferable that in the plurality of control wirings, the separation distance between the side surfaces of the adjacent control wirings in the main scanning direction is longer from the lower side to the upper side in the thickness direction.

  In the recording head of the present invention, it is preferable that the plurality of control wirings have grooves extending in the thickness direction on the side surface.

  A recording apparatus of the present invention includes any one of the recording heads described above and a transport mechanism that transports a recording medium.

  The recording head of the present invention includes a substrate, a heat storage layer provided on the substrate, a plurality of heating elements arranged on the heat storage layer along the main scanning direction, and a sub scanning direction on the substrate. A control element for controlling the plurality of heating elements, which is arranged apart from the plurality of heating elements, and a plurality of control wirings provided on the substrate for electrically connecting the plurality of heating elements and the control element. And a protective layer that covers a portion of the plurality of heating elements and the plurality of control wirings on the heating element side, and the heat storage layer includes a plurality of depressions extending along the gaps of the plurality of control wirings. In addition, the surface roughness of the plurality of depressions is smaller than the surface roughness of the side surface of the control wiring, the portion not covered by the protective layer of the plurality of control wiring and the gap between the plurality of control wiring, Formed by curing a fluid precursor It is covered by the Mamoruzai. Therefore, in the recording head according to the present invention, when the precursor of the protective material is applied to the gap of the control wiring, the capillary phenomenon can be favorably generated below the gap above the gap. Therefore, in the recording head of the present invention, the precursor can be satisfactorily spread to the lower surface of the gap, and the control wiring can be satisfactorily covered with the protective material.

  In the recording head of the present invention, when the plurality of depressions are wide in the main scanning direction from the lower side to the upper side in the thickness direction, when the protective material precursor is applied, Capillary phenomenon can be generated satisfactorily. Therefore, in this recording head, the control wiring can be better coated with the protective material.

  In the recording head of the present invention, the plurality of control wires are coated with a precursor of a protective material when the separation distance between the side surfaces of adjacent control wires in the main scanning direction becomes longer from the lower side to the upper side in the thickness direction. In this case, the capillary phenomenon can be favorably generated below the gap of the control wiring. Therefore, in this recording head, the control wiring can be better coated with the protective material.

  In the recording head of the present invention, when the plurality of control wirings have grooves extending in the thickness direction on the side surfaces, for example, even when the recording medium is slid in the direction in which the control wiring extends, a protective material is provided for the control wiring. Can be deposited satisfactorily and peeling can be reduced. Therefore, in this recording head, the control wiring can be better coated with the protective material.

  The recording apparatus of the present invention includes the recording head of the present invention and a transport mechanism for transporting a recording medium. Therefore, the recording apparatus of the present invention can enjoy the effects of the above-described recording head. Therefore, according to the recording apparatus of the present invention, since the control wiring can be satisfactorily covered with the protective material, the influence of the outside atmosphere can be reduced, and the driving can be stably performed for a long time.

FIG. 2 is a plan view showing a schematic configuration of a thermal head that is an example of an embodiment of a recording head of the present invention, with a protective layer omitted. FIG. 2 is an enlarged plan view of a main part of the thermal head shown in FIG. 1. It is the top view which expanded the principal part of the thermal head shown in FIG. 1, and abbreviate | omitted the protective layer. FIG. 4 is a sectional view taken along line IV-IV shown in FIG. 2. (A) is sectional drawing along the Va-Va line | wire shown in FIG. 2, (b) is sectional drawing along the Vb-Vb line | wire shown in FIG. (A)-(d) is explanatory drawing which shows the manufacturing process of the thermal head shown in FIG. (A)-(c) is explanatory drawing which shows the continuation of the manufacturing process of the thermal head shown in FIG. 1 is a diagram illustrating a schematic configuration of a thermal printer which is an example of an embodiment of a recording apparatus of the present invention. It is a figure which shows schematic structure of the modification of the thermal head shown in FIG. It is a perspective view including the cross section which shows schematic structure of the modification of the thermal head shown in FIG.

<Recording head>
A thermal head 10 which is an example of an embodiment of the recording head of the present invention shown in FIG. 1 includes a substrate 20, a heat storage layer 30, an electric resistance layer 40, a conductive layer 50, a protective layer 60, and a control element. And a control IC 70.

  The substrate 20 has a function of supporting the heat storage layer 30, the electric resistance layer 40, the conductive layer 50, the protective layer 60, and the control IC 70. The substrate 20 is configured in a rectangular shape extending in the main scanning directions D1 and D2 in plan view. Here, the “plan view” means a view in the D6 direction in the thickness directions D5 and D6. Examples of the material for forming the substrate 20 include ceramics, silicon, and sapphire. Among these materials, silicon and sapphire are preferable from the viewpoint of high density printing. Furthermore, sapphire is more preferable from the viewpoint of speeding up printing. Further, the heat storage layer 30 is provided over the entire upper surface of the substrate 20 in the thickness direction D5, D6 on the D5 direction side.

The heat storage layer 30 has a function of temporarily storing a part of heat generated in a heat generating portion 41 (to be described later) of the electric resistance layer 40. That is, the heat storage layer 30 plays a role of improving the thermal response characteristics of the thermal head 10 by shortening the time required to raise the temperature of the heat generating portion 41. As a material for forming the heat storage layer 30 of the present embodiment, for example, glass mainly containing SiO 2 can be cited. The thermal conductivity when the heat storage layer 30 is formed of glass mainly composed of SiO 2 is, for example, about 0.99 / m · K. The heat storage layer 30 includes a base portion 31 and a protruding portion 32.

The base 31 is provided in a substantially flat shape over the entire top surface of the substrate 20. The base 31 has a hollow 31a that is recessed in the direction D6 in the thickness directions D5 and D6. The recess 31a extends in the sub-scanning directions D3 and D4. Further, the recess portion 31a, the inner surface 31a 1 in the main scanning direction D1, D2 is inclined. In other words, the recess portion 31a is spaced a distance d 31a along the main scanning direction D1, D2 between the inner surface 31a 1 is composed of a D5 direction side in the thickness direction D5, D6 to be longer toward the D6 direction Has been.

  The protrusion 32 is a part that contributes to pressing the recording medium against the protective layer 60 positioned on the heat generating part 41. The protrusion 32 protrudes from the base 31 in the direction D5 in the thickness directions D5 and D6. Further, the protrusion 32 is formed in a strip shape extending in the main scanning directions D1 and D2. The protrusion 32 has a substantially semi-elliptical cross section in the sub-scanning directions D3 and D4 orthogonal to the main scanning directions D1 and D2.

  The electrical resistance layer 40 includes a heat generating portion 41 that functions as a heat generating element that generates heat when power is supplied. The electrical resistance layer 40 is configured such that the electrical resistance value per unit length is larger than the electrical resistance value per unit length of the conductive layer 50. Examples of the material forming the electric resistance layer 40 include a TaN-based material, a TaSiO-based material, a TaSiNO-based material, a TiSiO-based material, a TiSiCO-based material, and an NbSiO-based material. Here, the “material mainly comprising” means that the principal material is 50% by mass or more based on the whole, and may contain, for example, an additive. The electrical resistance layer 40 is provided on the heat storage layer 30, and a part thereof is provided on the protruding portion 32. In the present embodiment, a portion of the electrical resistance layer 40 to which a voltage is applied from the conductive layer 50 where the conductive layer 50 is not formed functions as the heat generating portion 41.

The heat generating part 41 is a part that functions as a heat generating element that generates heat by power supply. The heat generating portion 41 is configured such that the heat generation temperature due to power supply from the conductive layer 50 is in the range of, for example, 200 ° C. or more and 550 ° C. or less. The heat generating portions 41 are located on the protruding portions 32 of the heat storage layer 30 and are arranged at substantially the same separation distance d 41 along the main scanning directions D1 and D2. Further, each of the heat generating portions 41 is configured in a rectangular shape in plan view. Furthermore, the heat generating portion 41 is configured such that the width W 41 along the main scanning directions D1 and D2 has substantially the same length. Further, the heat generating portion 41 is configured so that the length L 41 along the sub-scanning directions D3 and D4 is substantially the same. Here, “substantially the same” includes those within a general manufacturing error range, for example, a range in which an error with respect to the average value of the length of each part is within 10%. Here, as the value of the distance d C41 between the center of one heat generating portion 41 and the center of another heat generating portion 41 adjacent to the heat generating portion 41, for example, a range of 5.2 μm or more and 84.7 μm or less can be given. .

  The conductive layer 50 contributes to supplying power to the heat generating portion 41. The conductive layer 50 is located on the electric resistance layer 40. As a material mainly forming the conductive layer 50, for example, any one metal of aluminum, gold, silver, and copper, or an alloy thereof can be given. The conductive layer 50 includes a first conductive layer 51, a second conductive layer 52, and a third conductive layer 53. In the conductive layer 50 of the present embodiment, for example, a conductive film including a region that becomes the first conductive layer 51, the second conductive layer 52, and the third conductive layer 53 is formed, and the first conductive layer is formed on the upper surface of the conductive film. A mask that covers a region to be the layer 51, the second conductive layer 52, and the third conductive layer 53 is formed, and a region exposed from the mask can be etched by a sputtering method or the like.

  The first conductive layer 51 functions as a control wiring together with the electric resistance layer 40 located on the lower layer on the D6 direction side in the thickness directions D5 and D6, and contributes to supplying power to the heat generating portion 41. ing. The first conductive layer 51 includes a first wiring part 511, a second wiring part 512, and a third wiring part 513.

The first wiring portion 511 has one end portion on the D3 direction side in the sub-scanning directions D3 and D4 connected to one end portion on the D4 direction side of the heat generating portion 41. First wiring portion 511 is the width W 11 along the main scanning direction D1, D2 are configured to the width W 41 and substantially the same length of the heat generating portion 41. Further, the first wiring part 511 is configured such that the distance d 11 between the first wiring parts 511 along the main scanning directions D 1 and D 2 is substantially the same as the distance d 41 of the heat generating part 41. By configuring the width W 11 and the separation distance d 11 of the first wiring part 511 to be substantially the same length, the uniformity of the surface shape in the vicinity of the heat generating part 41 of the protective layer 60 is enhanced.

The second wiring part 512 has one end on the D3 direction side connected to the other end of the first wiring part 511. The second wiring portion 512 are the dimensions of the main scanning direction D1, the width W 12 along the D2 is configured to be gradually narrower toward the direction D5. Further, the second wiring portion 512, the width W 12 within D4 direction (from the heating unit 41 side to the control IC70 side) of the lower surface 512b is larger toward. For this reason, the width W 12 of the lower surface 512 b of the second wiring part 512 is wider than the width W 11 of the first wiring part 511. Further, the second wiring portion 512, its is a main scanning direction D1, the distance d 12 between the lower surface 512b along the D2 is configured to be longer toward the direction D4.

In the second wiring portion 512 of the present embodiment, the side surface 512a facing the other second wiring portion 512 adjacent in the main scanning directions D1 and D2 is inclined. In other words, as this aspect 512a of the second wire unit 512, the distance d 12 along the main scanning direction D1, D2 between the side surfaces of the second wiring portion 512 adjacent 512a is directed from D6 direction to D5 direction It is configured to be long. Further, a recess 31a of the heat storage layer 30 is provided along the gap in the gap between the second wiring portions 512, and the side surface 512a continues to the recess 31a. The side surface 512a is configured to have a larger surface roughness than the recessed portion 31a.

The third wiring portion 513 has one end on the D3 direction side connected to the other end of the second wiring portion 512 and the other end connected to the control IC 70. Third wiring portion 513 of the present embodiment, the width W 13 along the main scanning direction D1, D2 is wider than the width W 11 of the first wiring portion 511. In the present embodiment, as the width along the main scanning directions D1 and D2 of each part, the width on the formation surface of the member located in the D6 direction of each part is adopted.

  The second conductive layer 52 is electrically connected to the other end on the D4 direction side of the plurality of heat generating portions 41 and a power source (not shown).

  The third conductive layer 53 is disposed away from the first conductive layer 51. One end of the third conductive layer 53 is connected to the control IC 70.

  Here, it demonstrates, referring FIG. 6 for the manufacturing method of the hollow part 31a of the thermal storage layer 30 of this embodiment. First, as illustrated in FIG. 6A, the resistor film 40 x is formed on the heat storage layer 30. The resistor film 40x is formed by a film forming technique such as sputtering or vapor deposition. Next, as shown in FIG. 6B, a conductive film 50x is formed so as to be positioned on the resistor film 40x. The conductive film 50x is formed by a film formation technique such as sputtering or vapor deposition. Next, as shown in FIG. 6C, a first mask 81 is formed on the conductive film 50x by a fine processing technique such as photolithography, and the conductive layer 50 and the third conductive layer 53 are formed by the first mask 81. Cover the site. Next, as shown in FIG. 6D, the conductive film 50x and the resistor film 40x exposed from the first mask 81 are etched to form the conductive layer 50. When the conductive layer 50 is formed, the heat generating portion 41 is formed by leaving a part of the resistor film 40x. Next, as shown in FIG. 7A, the second mask 82 is formed on the conductive layer 50 by a fine processing technique such as photolithography, and the main scanning direction D1 of the side surface 512a and the upper surface 512c of the second wiring portion 512 is formed. , D2 are exposed. At this time, the exposed area of the upper surface 512c is increased from the D3 direction to the D4 direction in the sub-scanning directions D3 and D4. Next, as shown in FIG. 7B, the heat storage layer 30 exposed between the second wiring portions 512 is selectively etched to form a recess portion 31 a, and compared with the conductive layer 50. The inclination angle θ of the side surface 512a of the two wiring parts 512 is configured to increase from the D3 direction toward the D4 direction. Next, as shown in FIG. 7C, the heat storage layer 30 exposed between the second wiring portions 512 is selectively etched with, for example, an etching solution to form a recess 31 a and the conductive layer 50. Compared to smooth the surface. As described above, the recessed portion 31a of the heat storage layer 30 of the present embodiment can be formed in the gap between the second wiring portions 512.

  The protective layer 60 includes a first protective layer 61, a second protective layer 62, and a third protective layer 63. 1 and 3, the protective layer 60 is omitted from the viewpoint of easy viewing.

The first protective layer 61 has a function of protecting the heat generating portion 41 and a part of the conductive layer 50. The first protective layer 61 covers the heat generating part 41, a part of the first wiring part 511 of the first conductive layer 51 of the conductive layer 50, and the second wiring part 512. As a material mainly forming the first protective layer 61, for example, diamond-like carbon material, SiC-based material, SiN-based material, SiCN-based material, SiON-based material, SiONC-based material, SiAlON-based material, SiO 2 -based material, Ta 2 O 5 -based material, TaSiO-based material, TiC-based material, TiN-based material, TiO 2 -based material, TiB 2 -based material, AlC-based material, and AlN-based material Al 2 O 3 -based material, ZnO-based material, B 4 C-based material, and BN-based material. Here, “diamond-like carbon material” refers to a film in which the proportion of carbon atoms (C atoms) taking sp 3 hybrid orbits is in the range of 1 atomic% to less than 100 atomic%. In addition, the “material mainly composed of” herein means that the principal material is 50% by mass or more based on the whole, and for example, an additive may be included.

The second protective layer 62 has a function of protecting a part of the second wiring part 512. The second protective layer 62 covers a part of the first wiring part 511 and the second wiring part 512. Examples of the material for forming the second protective layer 62 include thermosetting or ultraviolet curable resins such as epoxy resins, silicone resins, and fluorine resins. In the present embodiment, the second protective layer 62 is formed by applying a fluidic precursor of the second protective layer 62 on the second wiring part 512 after the first protective layer 61 is formed, and curing the precursor. Is formed by. As this precursor, what diluted the above-mentioned resin material using the organic solvent is mentioned, for example. The second protective layer 62 does not cover a region including the end portion of the third wiring portion 513 on the D4 direction side in the sub-scanning directions D3 and D4, and a part of the third wiring portion 513 is the second protective layer. 62 is exposed. As the precursor of the second protective layer 62, a precursor having a smaller contact angle indicating wettability with respect to the material forming the heat storage layer 30 than the material forming the conductive layer 50 is employed. Here, the “contact angle” refers to an angle between the surface of the precursor at the contact point of the precursor, the target member, and the gas (air) and the contact surface of the precursor and the target member. . Further, when forming the second protective layer 62, the value of the distance d C41 between the centers of the heat generating portion 41 is equal to or less than 21.2 [mu] m, the extending over the gap of the plurality of first conductive layer 51 Capillary phenomenon is prominently generated in the precursor of the second protective layer 62, and the precursor can be satisfactorily extended.

  The third protective layer 63 has a function of protecting the third wiring portion 513 of the first conductive layer 51 and the control IC 70. The third protective layer 63 covers the third wiring part 513 and the control IC 70. Examples of the material for forming the third protective layer 63 include thermosetting or ultraviolet curable resins such as epoxy resins, silicone resins, and fluorine resins. The third protective layer 63 in the present embodiment is formed by applying a precursor of the third protective layer 63 having fluidity on the control IC 70 after the formation of the second protective layer 62 and curing the precursor. ing.

  The control IC 70 has a function of controlling the heat generation of the plurality of heat generating portions 41. The control IC 70 is disposed away from the heat generating portion 41 in the sub-scanning directions D3 and D4. The control IC 70 is connected to the other end of the third wiring portion 513 of the plurality of first conductive layers 51 and one end of the third conductive layer 53. By setting it as such a structure, the electric power supplied to the heat generating part 41 can be controlled selectively, and heat generation can be controlled. In FIG. 3, the control IC 70 is omitted.

  The external connection member 71 has a function of supplying an electric signal for driving the heat generating portion 41. Examples of the external connection member 71 include a combination of a flexible cable and a connector. The external connection member 71 is electrically connected to the control IC 70 through the third conductive layer 53.

  The thermal head 10 includes a substrate 20, a heat storage layer 30 provided on the substrate 20, a plurality of heat generating portions 41 arranged on the heat storage layer 30 along the main scanning directions D <b> 1 and D <b> 2, And a control IC 70 for controlling the plurality of heat generating parts 41, which are arranged apart from the plurality of heat generating parts 41 in the sub-scanning directions D3 and D4, and a control with the plurality of heat generating parts 41 provided on the substrate 20. The heat storage layer 30 includes a plurality of first conductive layers 51 that are electrically connected to the IC 70, a plurality of heat generating portions 41, and a protective layer 60 that covers a part of the plurality of conductive layers on the heat generating portion 41 side. Has a plurality of depressions 31 a extending along the gaps between the plurality of conductive layers 50, and the surface roughness of the plurality of depressions 31 a is the same as that of the side surface 512 a of the second wiring part 512 of the first conductive layer 51. Smaller than the surface roughness Thus, the second protective layer formed by curing the fluid precursor with the portions of the plurality of first conductive layers 51 not covered by the first protective layer 61 and the gaps between the plurality of first conductive layers 51. 62. Therefore, in the thermal head 10, when the precursor of the second protective layer 62 is applied to the gap between the second wiring portions 512, the capillary phenomenon can be favorably generated below the gap above. Therefore, in the thermal head 10, the precursor can be well distributed to the lower surface of the gap, and the second conductive layer 52 can be satisfactorily covered with the second protective layer 62.

  In the thermal head 10, the plurality of hollow portions 31 a have a gap in the main scanning directions D 1 and D 2 that is longer from the D 6 direction side to the D 5 direction side in the thickness directions D 5 and D 6. When the body is applied, the capillary phenomenon can be favorably generated below the depression 31a. Therefore, in the thermal head 10, the second wiring part 512 can be better covered with the second protective layer 62.

In the thermal head 10, the plurality of second wiring portions 512 have a distance d 12 between the side surfaces 512 a of the adjacent second wiring portions 512 in the main scanning directions D 1 and D 2 in the D 5 direction from the D 6 direction side in the thickness directions D 5 and D 6. Since it becomes longer toward the side, when the precursor of the second protective layer 62 is applied, a capillary phenomenon can be favorably generated below the gap of the second wiring part 512. Therefore, in the thermal head 10, the second wiring portion 512 can be more satisfactorily covered with the second protective layer 62.

In the thermal head 10, the contact angle indicating the wettability of the material forming the heat storage layer 30 with respect to the precursor of the second protective layer 62 is smaller than the contact angle of the material forming the second wiring portion 512 with respect to the precursor. When the precursor of the second protective layer 62 is applied, the capillary phenomenon can be satisfactorily generated below the recess 31a. Therefore, in the thermal head 10, the second wiring part 512 can be better covered with the second protective layer 62.
<Recording device>
FIG. 7 is a diagram showing a schematic configuration of a thermal printer 1 which is an example of an embodiment of a recording medium of the present invention.

  The thermal printer 1 includes a thermal head 10, a transport mechanism 11, and a control mechanism 12.

  The transport mechanism 11 has a function of bringing the recording medium P into contact with the protective layer 70 located on the heat generating portion 41 of the thermal head 10 while transporting the recording medium P in the D3 direction side in the sub-scanning directions D3 and D4. It is. The transport mechanism 11 includes a platen roller 111 and transport rollers 112, 113, 114, and 115. The transport mechanism 11 is configured to transport the recording medium P in sliding contact with the third protective layer 63.

  The platen roller 111 has a function of pressing the recording medium P against the heat generating portion 41 side. The platen roller 111 is rotatably supported in contact with the first protective layer 61 located on the heat generating portion 41. The platen roller 111 has a configuration in which an outer surface of a columnar base is covered with an elastic member. This base is made of, for example, a metal such as stainless steel, and this elastic member is made of, for example, butadiene rubber having a thickness dimension in the range of 3 mm to 15 mm.

  The transport rollers 112, 113, 114, and 115 have a function of transporting the recording medium P. That is, the transport rollers 112, 113, 114, and 115 supply the recording medium P between the heat generating part 41 of the thermal head 10 and the platen roller 111 and between the heat generating part 41 of the thermal head 10 and the platen roller 111. It plays a role of pulling out the recording medium P from the recording medium. These transport rollers 112, 113, 114, and 115 may be formed of, for example, a metal columnar member. For example, like the platen roller 111, the outer surface of the columnar substrate is covered with an elastic member. There may be.

  The control mechanism 12 has a function of supplying image information to the control IC 70. That is, the control mechanism 12 plays a role of supplying image information for selectively driving the heat generating portion 41 to the control IC 70 via the external connection member 71.

  The thermal printer 1 includes a thermal head 10. Therefore, the thermal printer 1 can enjoy the effects of the thermal head 10. Therefore, the thermal printer 1 can be driven stably over a long period of time by reducing the influence of the outside atmosphere by satisfactorily covering the first conductive layer 51 of the thermal head 10 with the second protective layer 62. it can.

  While specific embodiments of the present invention have been described above, the present invention is not limited to these embodiments, and various modifications can be made without departing from the spirit of the invention.

  In the present embodiment, the thermal head 10 is described as an example of the recording head, but the present invention is not limited to the thermal head. Even when the configuration of the present invention is employed in a heat-generating element such as an ink jet head or an LED head, the same effect can be obtained.

  The first conductive layer 51 of the present embodiment includes the first wiring portion 511 and the third wiring portion 513, but is not limited to such a configuration. For example, the first conductive layer 51 is the second conductive layer 51. A configuration including only the wiring portion 512 may be employed.

  The first conductive layer 51 of the present embodiment functions as a control wiring together with the electric resistance layer 40 positioned in the D6 direction in the thickness directions D5 and D6, but is not limited to such a configuration. Only one conductive layer 51 may function as a control wiring.

In the first conductive layer 51 of the present embodiment, the side surface 512a of the second wiring portion 512 may have groove 512a 1 is provided which extends in the direction of the arrow D5, D6 as shown in FIG. 10. Such a side groove 512a 1 can be formed, for example, by exposing a region to be the side groove 512a 1 when the second wiring part 512 is formed and exposing the above-described mask. In the thermal head 10 </ b> B having the side groove 512 a 1 , for example, even when the recording medium is slid in the direction in which the second wiring portion 512 extends, the second protective layer 62 is satisfactorily adhered to the second wiring portion 512. Thus, the second wiring portion 512 can be more satisfactorily covered with the second protective layer 62.

  In the second conductive layer 52 of the present embodiment, it is connected to three or more heat generating portions 41. However, the present invention is not limited to such a structure. For example, as shown in FIG. It may be configured to be connected to two heating elements.

  The first protective layer 61 of the present embodiment is configured separately from the second protective layer 62, but is not limited to such a configuration, and the first protective layer 61 and the second protective layer 62 are integrated. It may be configured.

DESCRIPTION OF SYMBOLS 1 Thermal printer 10 Thermal head 11 Conveyance mechanism 111 Platen roller 112,113,114,115 Conveyance roller 12 Drive mechanism 20 Substrate 30 Thermal storage layer 31 Base part 31a Depression part 31a 1 Inner side surface 32 Projection part 40 Electrical resistance layer 40x Resistor film 41 Heat generating portion 50 Conductive layer 50x Conductive film 51 First conductive layer (control wiring)
511 1st wiring part 512 2nd wiring part 512a Side surface 513 of 2nd wiring part 3rd wiring part 52 2nd conductive layer 53 3rd conductive layer 60 Protective layer 61 1st protective layer 62 2nd protective layer (protective material)
63 3rd protective layer 70 Control IC (control element)
71 External connection member 81 First mask 82 Second mask P Recording medium d 11 Separation distance d between first wiring sections d 12 Separation distance between second wiring sections d 13 Separation distance between third wiring sections d 31a depression Distance between side surfaces (width of recess)
d 41 Separation distance between heating parts d c41 Separation distance L between centers of the heating parts L 41 Length of the heating part along the sub-scanning direction W 11 Width of the first wiring part along the main scanning direction W 12 of the second wiring part Width W along main scanning direction 13 Width along main scanning direction of third wiring portion W 41 Width along main scanning direction of heat generating portion

Claims (5)

  1. A substrate, a heat storage layer provided on the substrate, a plurality of heating elements arranged on the heat storage layer along the main scanning direction, and the plurality of heating elements on the substrate in the sub-scanning direction; A control element for controlling the plurality of heating elements, which are spaced apart from each other; a plurality of control wirings which are provided on the substrate and which electrically connect the plurality of heating elements and the control element; A plurality of heating elements and a protective layer covering a part of the plurality of control wirings on the heating element side,
    The heat storage layer has a plurality of depressions extending along gaps between the plurality of control wirings,
    The surface roughness of the plurality of depressions is smaller than the surface roughness of the side surface of the control wiring,
    The portions of the plurality of control wirings that are not covered with the protective layer and the gaps between the plurality of control wirings are covered with a protective material formed by curing a fluid precursor. Recording head.
  2.   2. The recording head according to claim 1, wherein the plurality of depressions have a width in the main scanning direction that increases from the lower side to the upper side in the thickness direction.
  3.   3. The plurality of control wirings according to claim 1, wherein a separation distance between the side surfaces of the adjacent control wirings in the main scanning direction is longer from the lower side to the upper side in the thickness direction. Recording head.
  4.   The recording head according to claim 1, wherein the plurality of control wirings have grooves extending in a thickness direction on the side surface.
  5.   A recording apparatus comprising: the recording head according to claim 1; and a transport mechanism that transports a recording medium onto the heating element.
JP2009016524A 2009-01-28 2009-01-28 Recording head and recording device having the same Active JP5317723B2 (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104039557A (en) * 2012-02-28 2014-09-10 京瓷株式会社 Thermal head and thermal printer equipped with same
WO2017170800A1 (en) * 2016-03-29 2017-10-05 京セラ株式会社 Thermal head and thermal printer
WO2018181734A1 (en) * 2017-03-29 2018-10-04 京セラ株式会社 Thermal head and thermal printer

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JPS62280051A (en) * 1986-05-30 1987-12-04 Futaki Itsuo Manufacture of thermal head
JPH01286864A (en) * 1988-05-14 1989-11-17 Fuji Xerox Co Ltd Thermal head
JPH0452056U (en) * 1990-09-06 1992-05-01
JPH04173353A (en) * 1990-11-07 1992-06-22 Fuji Xerox Co Ltd Thermal head and its manufacture
JPH07186428A (en) * 1993-12-28 1995-07-25 Rohm Co Ltd Thermal print head and its manufacture
JP2000255088A (en) * 1999-03-04 2000-09-19 Fuji Photo Film Co Ltd Thin film thermal head, fabrication thereof and imaging device employing it
JP2004154969A (en) * 2002-11-05 2004-06-03 Alps Electric Co Ltd Thermal head and its manufacturing process
JP2005131972A (en) * 2003-10-30 2005-05-26 Kyocera Corp Thermal head and thermal printer using the same

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Publication number Priority date Publication date Assignee Title
JPS62280051A (en) * 1986-05-30 1987-12-04 Futaki Itsuo Manufacture of thermal head
JPH01286864A (en) * 1988-05-14 1989-11-17 Fuji Xerox Co Ltd Thermal head
JPH0452056U (en) * 1990-09-06 1992-05-01
JPH04173353A (en) * 1990-11-07 1992-06-22 Fuji Xerox Co Ltd Thermal head and its manufacture
JPH07186428A (en) * 1993-12-28 1995-07-25 Rohm Co Ltd Thermal print head and its manufacture
JP2000255088A (en) * 1999-03-04 2000-09-19 Fuji Photo Film Co Ltd Thin film thermal head, fabrication thereof and imaging device employing it
JP2004154969A (en) * 2002-11-05 2004-06-03 Alps Electric Co Ltd Thermal head and its manufacturing process
JP2005131972A (en) * 2003-10-30 2005-05-26 Kyocera Corp Thermal head and thermal printer using the same

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104039557A (en) * 2012-02-28 2014-09-10 京瓷株式会社 Thermal head and thermal printer equipped with same
WO2017170800A1 (en) * 2016-03-29 2017-10-05 京セラ株式会社 Thermal head and thermal printer
WO2018181734A1 (en) * 2017-03-29 2018-10-04 京セラ株式会社 Thermal head and thermal printer
JP6419405B1 (en) * 2017-03-29 2018-11-07 京セラ株式会社 Thermal head and thermal printer
CN110461614A (en) * 2017-03-29 2019-11-15 京瓷株式会社 Thermal head and thermal printer

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