JP2010156574A - Mems and method of manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a MEMS precisely and reliably setting a gap between a movable part and a stopper with high manufacturing yield. <P>SOLUTION: The MEMS is provided with: a die including a support part and the movable part moving relative to the support part; a stopper disposed opposite the movable part at a position limiting the moving range of the movable part; a spacer that is a resin held between the stopper and the support part in the direction limiting the moving range of the movable part and including a hard resin harder than a sealing resin; and an adhesive layer connecting the support part to the stopper on a side opposite the movable part from the spacer. The spacer extends between the adhesive layer and the movable part in a direction blocking a space between the adhesive layer and the movable part. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

The present invention relates to MEMS (Micro Electro Mechanical Systems) and a method for manufacturing MEMS.

  2. Description of the Related Art Conventionally, a MEMS sensor that detects acceleration or the like by detecting deformation of a flexible portion caused by an inertial force acting on a weight portion with a piezoresistive element or the like is known. However, when excessive acceleration is applied to such a MEMS sensor, the deformation of the flexible part reaches a limit, and the flexible part may be damaged. Therefore, various configurations have been devised that limit the range of motion of movable parts such as weights and flexible parts.

  Patent Document 1 describes a configuration in which a cover for limiting the range of motion of a movable portion of a die is anodically bonded to the die. Patent Documents 2 and 3 describe acceleration sensors in which a gap between a stopper and a movable part of a die is set using a solid spacer. Patent Document 4 describes an acceleration sensor that sets a gap between a stopper and a movable part of a die by mixing beads in an adhesive for bonding the stopper and the die. Patent Document 5 describes an acceleration sensor in which a recess for fastening an adhesive for joining a stopper and a die is formed.

JP 2006-208272 A JP 2006-317180 A JP 2006-317181 A JP 2004-233072 A JP 2006-153519 A

  However, in the configuration described in Patent Document 1, stress remains in the die due to anodic bonding between the die on which the movable part is formed and the cover, and the manufacturing cost increases due to anodic bonding. In the configurations described in Patent Documents 2 and 3, the adhesive around the spacer may adhere to the movable part of the die. Further, in the configuration described in Patent Document 4, it is difficult to uniformly mix the beads with the adhesive, and thus there may be a case where a gap between the stopper and the movable portion of the die cannot be secured. Moreover, in the structure described in patent document 5, the yield falls by the adhesive agent overflowing from the recessed part adhering to the movable part of die | dye. Further, in the configurations described in Patent Documents 2 to 5, even if the adhesive does not adhere to the movable part, the pattern of the adhesive is not constant, so the stress generated at the interface between the adhesive and the die varies, and as a result. Variations in sensor characteristics occur.

  The present invention has been created in view of these problems, and an object of the present invention is to provide a MEMS that can accurately and reliably set the gap between the movable portion and the stopper and has a high manufacturing yield.

  (1) The MEMS for achieving the above object includes a die having a support portion, a movable portion that moves relative to the support portion, and the movable portion at a position that limits a movement range of the movable portion. A stopper opposed to the part, a spacer sandwiched between the stopper and the support part in a direction in which the range of motion of the movable part is limited, and a spacer made of a hard resin harder than the sealing resin, An adhesive layer that joins the support portion and the stopper, and the spacer extends between the adhesive layer and the movable portion in a direction that blocks between the adhesive layer and the movable portion.

  According to the present invention, since the spacer made of hard resin harder than the sealing resin is sandwiched between the stopper and the support portion compared to the case where the spacer is made of thermosetting sealing resin, the movable portion of the die And the stopper can be set accurately and reliably. In addition, since the spacer extends in a direction that blocks between the adhesive layer and the movable part between the adhesive layer and the movable part, it is possible to prevent the adhesive constituting the adhesive layer from flowing and adhering to the movable part. . For this reason, a manufacturing yield increases.

(2) In the MEMS for achieving the above object, the spacer may be interrupted on the side opposite to the movable part from the adhesive layer.
According to the present invention, an adhesive that does not fit in the space surrounded by the spacer, the support portion, and the stopper among the adhesive constituting the adhesive layer can be released to the side opposite to the movable portion. Therefore, it can prevent that an adhesive agent adheres to a movable part. Note that the spacer may extend from the adhesive layer to the opposite side of the movable part, and the spacer does not extend from the adhesive layer to the opposite side of the movable part, so there is a spacer on the opposite side of the adhesive layer from the movable part. You don't have to.

(3) In the MEMS for achieving the above object, the spacer may surround the adhesive layer in an annular shape.
According to the present invention, since the spread of the adhesive serving as the adhesive layer can be reliably contained within a certain range by the spacer, variations in the pattern of the adhesive layer can be suppressed. Therefore, it is possible to reduce the variation in stress generated at the interface between the adhesive and the die and reduce the variation in the characteristics of the MEMS.

(4) In the MEMS for achieving the above object, the hard resin may be a photosensitive resin.
According to the present invention, since the spacer can be formed by exposing and developing the photosensitive resin, the pattern of the spacer can be formed with high accuracy.

  (5) A MEMS manufacturing method for achieving the above object is a MEMS manufacturing method including a die having a support part and a movable part that moves relative to the support part. An adhesive is added to the surface of the part, and before the adhesive is added, the adhesive and the movable part are made of a hard resin harder than a sealing resin between the adhesive and the movable part. A spacer extending in a direction to block the gap is formed on the surface of the support portion, and the spacer limits the movement range of the movable portion so that a stopper faces the movable portion at a position where the movement range of the movable portion is limited. And inserting the stopper to the support portion with the adhesive.

  According to the present invention, since the adhesive can be prevented from flowing and adhering to the movable part, the manufacturing yield is increased. Specifically, the adhesive is added to the die after the spacer is formed so as to extend in the direction of blocking between the adhesive and the movable part between the adhesive and the movable part, and the support part and the stopper are the adhesive. Combined by. Since the adhesive crushed by the die and the stopper is blocked by the spacer, it is possible to prevent the adhesive from flowing to the movable part. Further, by sandwiching a spacer made of hard resin between the die and the stopper, the gap between the movable part of the die and the stopper can be set reliably.

  (6) A MEMS manufacturing method for achieving the above object includes a package and a die having a support portion and a movable portion that moves relative to the support portion and is accommodated in the package. The adhesive is added to a bonding surface to which the support portion of the package is bonded, and before the adhesive is added, the manufacturing method is made of a hard resin harder than a sealing resin and the adhesive. A spacer extending between the movable part and the adhesive and the movable part is formed on the coupling surface, and the coupling surface is located on the movable part at a position that limits a movement range of the movable part. And sandwiching the spacer in a direction that limits the range of motion of the movable part so as to face each other, and bonding the support part to the facing surface with the adhesive.

  According to the present invention, since the adhesive can be prevented from flowing and adhering to the movable part, the manufacturing yield is increased. Specifically, the adhesive is added to the package after the spacer is formed so as to extend between the adhesive and the movable part so as to block between the adhesive and the movable part, and the support part and the package are adhesive. Combined by. Since the adhesive crushed by the die and the package is dammed by the bonding wire, the adhesive can be prevented from flowing to the movable part. Further, by sandwiching a spacer made of hard resin between the die and the package, the gap between the movable part of the die and the package can be set reliably.

(7) In the MEMS manufacturing method for achieving the above object, a photosensitive resin is added to the bonding surface to block between the adhesive and the movable part between the adhesive and the movable part. The spacer made of the photosensitive resin as the hard resin may be formed by exposing and developing the photosensitive resin in a pattern extending in a direction.
According to the present invention, the spacer pattern can be formed with high accuracy.

(8) In the MEMS manufacturing method for achieving the above object, the spacer pattern may be formed so as to be interrupted on the side opposite to the movable part from the adhesive.
According to the present invention, the adhesive that does not fit in the space surrounded by the spacer, the support portion, and the surface of the package facing the support portion of the adhesive can be released from the spacer to the side opposite to the movable portion. In addition, the spacer may extend from the adhesive to the opposite side of the movable part, and the spacer does not extend from the adhesive to the opposite side of the movable part, so there is a spacer on the side opposite to the movable part from the adhesive. You don't have to.

(9) In the MEMS manufacturing method for achieving the above object, the spacer pattern may be formed so as to surround the adhesive in an annular shape.
According to the present invention, since the spread of the adhesive can be reliably accommodated within a certain range by the spacer, it is possible to suppress variations in the pattern of the adhesive layer made of the solidified adhesive. Therefore, it is possible to reduce variations in stress generated at the interface between the adhesive layer and the die, and to reduce variations in the characteristics of the MEMS.

  Note that the order of operations described in the claims is not limited to the order of description as long as there is no technical obstruction factor, and may be executed at the same time, may be executed in the reverse order of the description order, or may be continuous. It does not have to be executed in order.

Hereinafter, embodiments of the present invention will be described in the following order with reference to the accompanying drawings. In addition, the same code | symbol is attached | subjected to the corresponding component in each figure, and the overlapping description is abbreviate | omitted.
1. First embodiment (Configuration)
The motion sensor 1 which is 1st embodiment of MEMS of this invention is shown in FIG. In FIG. 1B and FIG. 1C, the interface of the layer which comprises the die | dye 10 of the motion sensor 1 is shown with the broken line, and the boundary of the mechanical component which comprises the die | dye 10 of the motion sensor is shown with the continuous line.

The motion sensor 1 includes a die 10 that is a solid element including a movable part and a stopper 201. The die 10 and the stopper 201 are accommodated in a package (not shown).
The stopper 201 has a plate shape with a flat surface facing the die 10. The thickness of the stopper 201 is 2 mm. The stopper 201 is entirely opposed to the die 10. The surface of the stopper 201 facing the die 10 is smaller than the surface of the die 10 facing the stopper 201, and the center of the surface of the stopper 201 facing the die 10 and the center of the surface of the die 10 facing the stopper 201 are surfaces. In the vertical direction. Therefore, all the bonding pads 108 arranged in the vicinity of the outer periphery of the die 10 are exposed, and the entire flexible portion F and weight portion M constituting the movable portion of the die 10 are covered with the stopper 201.

  The first marker 202 is made of a deposited film formed on the surface of the stopper 201 facing the die 10. The first marker 202 is made of chromium (Cr) and has a thickness of 0.1 μm. The first marker 202 is used for alignment when the stopper 201 is coupled to the die 10. Therefore, it is preferable that two or more first markers 202 are formed on the stopper 201.

  The stopper 201 is preferably configured as a transparent plate so that the stopper 201 and the die 10 can be easily aligned. For example, quartz, sapphire, soda lime glass, transparent crystallized glass, and ceramics are used as the material of the stopper 201. An opaque plate made of silicon (Si), resin, or the like may be used as the stopper 201. Further, a stacked structure (solid element) separate from the die 10 on which the LSI connected to the die 10 is formed may be used as the stopper 201, or the stopper 201 may reduce air damping of the movable part. A through hole may be formed.

  The stopper 201 is coupled to the support portion S of the die 10 by the adhesive layer 112. The pattern of the adhesive layer 112 is divided into four regions on the surface of the die 10 as shown by hatching in FIG. 1A. Each adhesive layer 112 is located outside the spacer 114. The adhesive layer 112 is in contact with the spacer 114, the stopper 201, and the die 10.

  The spacer 114 is disposed for each adhesive layer 112 divided into four. The spacer 114 is a photosensitive resin such as photosensitive polyimide or photoresist, and is made of a hard resin harder than the sealing resin. As the material of the spacer 114, a resin that is harder than the sealing resin such as polyimide but is not photosensitive may be used. The spacer 114 crosses the region between the flexible portion F and the adhesive layer 112. Therefore, it is possible to prevent the adhesive constituting the adhesive layer 112 from adhering to the flexible part F and the weight part M. Specifically, the spacer 114 extends in a direction separating the flexible part F and the adhesive layer 112 and reaches the outer periphery of the die 10.

  The spacer 114 forms an arcuate structure. That is, the region surrounded by the spacer 114 is open toward the outside of the die 10. Therefore, the adhesive layer 112 can be separated from the flexible portion F, the weight portion M, and the bonding pad 108 and the adhesive constituting the adhesive layer 112 can be released toward the outside of the die 10.

  Further, both end portions of each spacer 114 are located outside the stopper 201, specifically, on the outer periphery of the die 10. That is, the spacer 114 completely defines the limit in which the adhesive serving as the adhesive layer 112 spreads in the range where the stopper 201 and the die 10 overlap.

  The spacer 114 is sandwiched between the stopper 201 and the die 10 in a direction perpendicular to the surface of the die 10 facing the stopper 201. That is, the gap between the stopper 201 and the die 10 is set by the thickness of the spacer 114 in contact with the stopper 201 and the support portion S of the die 10. The thickness of the spacer 114 is, for example, 10 μm. The range of movement of the flexible portion F and the weight portion M in the direction approaching the stopper 201 is limited by the stopper 201 positioned by the thickness of the spacer 114. Therefore, it can prevent that the flexible part F deform | transforms beyond the limit and is damaged.

  It is preferable that three or more spacers 114 are arranged apart from each other on the surface of the die 10 facing the stopper 201 so that the stopper 201 does not tilt with respect to the die 10. In the present embodiment, four spacers 114 are arranged at the four corners of the surface of the die 10 that faces the stopper 201.

  The die 10 may be any solid element provided with a movable part. The illustrated die 10 is a laminated structure that constitutes an acceleration sensor that detects acceleration components of three axes orthogonal to each other. Note that a piezoresistive element, wiring, and the like for detecting the acceleration component are omitted in each drawing.

  The die 10 includes a silicon layer 101, an etching stopper layer 102, a silicon layer 104, an insulating layer 106, and a conductive layer 107. The thickness of the silicon layer 101 made of single crystal silicon (Si) is 625 μm. The etching stopper layer 102 is made of a silicon oxide film (SiO2). The thickness of the etching stopper layer 102 is 1 μm. The thickness of the silicon layer 104 made of single crystal silicon is 10 μm. The insulating layer 106 is made of a silicon oxide film. The thickness of the insulating layer 106 is 300 nm. The conductive layer 107 is made of aluminum. The thickness of the conductive layer 107 is 0.5 μm.

  The die 10 includes a support portion S having a rectangular frame shape, a flexible portion F having one end coupled to the support portion S and disposed inside the support portion S, and a weight portion coupled to the flexible portion F. M, a bonding pad 108 for connecting the piezoresistive element of the die 10 to an external circuit, and a second marker 110 used for alignment of the stopper 201 are provided. The movable portion of the die 10 includes a flexible portion F that forms an annular diaphragm and a weight portion M that is coupled to the inside of the flexible portion F. The support portion S includes a silicon layer 101, an etching stopper layer 102, a silicon layer 104, and an insulating layer 106. The flexible part F includes a silicon layer 104 and an insulating layer 106. The weight portion M includes a silicon layer 101, an etching stopper layer 102, a silicon layer 104, and an insulating layer 106. The bonding pad 108 and the second marker 110 include a conductive layer 107.

  Note that the die 10 has been described by taking an acceleration sensor that detects triaxial acceleration components as an example, but the present invention describes a motion sensor that functions as an angular velocity sensor, a motion sensor that detects angular velocity and acceleration, a pressure sensor, a microphone, The present invention can also be applied to MEMS constituting the actuator.

(Production method)
Hereinafter, an example of a method for manufacturing the motion sensor 1 will be described with reference to FIGS.
First, the die 10 is formed as shown in FIG. Specifically, first, an SOI wafer including a silicon layer 101, an etching stopper layer 102, and a silicon layer 104 is prepared. Next, an insulating layer 106 made of silicon dioxide (SiO ₂ ) is formed by thermally oxidizing the surface of the silicon layer 104. Next, impurity ions are implanted from the surface of the silicon layer 104 through the insulating layer 106 and activated to form a piezoresistive element (not shown) in the silicon layer 104. Next, a conductor, a bonding pad 108 and a second marker 110 (not shown) are formed on the insulating layer 106. Specifically, a metal layer made of aluminum and having a thickness of 0.5 μm is formed on the entire surface of the insulating layer 106 by a sputtering method. Thereafter, the metal layer is etched using a protective film made of a photoresist, thereby forming the conductive wire, the bonding pad 108 and the second marker 110. Next, the support part S, the flexible part F, and the weight part M are formed by selectively etching the silicon layer 101 and the etching stopper layer 102. Specifically, it is said to be a Bosch process in which a photoresist having a desired pattern is used as a protective film, and passivation using C ₄ F ₈ plasma and etching using SF ₆ plasma are alternately repeated at short intervals. Etching is performed until the silicon layer 101 is penetrated by Deep-RIE (Reactive Ion Etching) to expose the etching stopper layer 102. Next, the etching stopper layer 102 is removed from below the flexible portion F by wet etching or the like.

  Next, as shown in FIG. 3, the four corners on the insulating layer 106 avoiding the flexible portion F, the weight portion M, the bonding pad 108, the second marker 110, the wiring (not shown) and the like on the surface of the support portion S. A spacer 114 is formed. In the case where a photosensitive resin is used as the material for the spacer 114, first, a fluid photosensitive resin such as photosensitive polyimide or photoresist is applied to the entire surface of the insulating layer 106. A latent image corresponding to the pattern of the spacer 114 is formed by partially exposing the photosensitive resin using a mask or a reticle after pre-baking. Next, when the photosensitive resin is developed and post-baked, a spacer 114 having an arbitrary pattern can be formed. When a hard resin having no photosensitivity is used as the material of the spacer 114, the spacer 114 having an arbitrary pattern can be formed on the surface of the insulating layer 106 by using, for example, a polyimide, a dispenser method, an inkjet method, or a nanoimprint method.

  The gap between the stopper 201 and the movable part of the die 10 sets the range of movement of the flexible part F and the weight part M in consideration of the elastic deformation limit of the flexible part F and the dynamic range required for the sensor. It depends on what you do. The thickness of the spacer 114 may be set according to the height of the gap between the stopper 201 and the movable part of the die 10, and is set to 10 μm, for example.

  Next, as shown in FIG. 4, the adhesive 111 is dropped onto the surface of the support portion S by a dispenser within the region covered by the stopper 201 and outside the spacer 114. As shown in FIG. 4B, the adhesive 111 is dropped in an amount that is thicker than the spacer 114. More specifically, the adhesive 111 contacts the stopper 201 and the die 10 in the entire range where the stopper 201 and the die 10 overlap when crushed by the stopper 201, and the adhesive 111 spreads outside the stopper 201. It is desirable to drop the amount. Thereby, the area where the adhesive 111 is in contact with the stopper 201 and the die 10 can be completely controlled by the spacer 114. For example, a silicon rubber adhesive or an epoxy resin adhesive is used as the adhesive 111. You may spray the adhesive agent 114 on the surface of the support part S by the inkjet method.

  Next, as shown in FIG. 5, a stopper 201 on which the first marker 202 is formed is prepared. The stopper 201 is formed, for example, by forming a chromium layer having a thickness of 0.1 μm on the entire surface of the quartz plate by sputtering, and etching the chromium layer using a protective film made of a photoresist, thereby forming the first marker 202. It is a thing.

Next, the stopper 201 and the die 10 are bonded by the adhesive 111 in a state where the first marker 202 formed on the stopper 201 and the second marker 110 formed on the die 10 are aligned. At this time, the adhesive 111 is crushed by the stopper 201 and spreads. Since the adhesive 111 that tends to spread toward the flexible portion F and the bonding pad 108 is blocked by the spacer 114, it adheres to the region closer to the flexible portion F than the spacer 114 and the region closer to the bonding pad 108 than the spacer 114. The agent 111 does not spread. On the other hand, when there is much adhesive 111, it spreads toward the outer side (outer peripheral side surface) of the die | dye 10 from the part which the spacer 114 has interrupted. In particular, since both ends of each spacer 114 are located outside the stopper 201, specifically, on the outer periphery of the die 10, the upper limit of the area where the adhesive 111 contacts the stopper 201 is determined by the spacer 114. That is, the spacer 114 completely defines the limit in which the adhesive 111 serving as the adhesive layer 112 spreads in the range where the stopper 201 and the die 10 overlap. For this reason, it can suppress that the stress which arises in the interface of the die | dye 10 and the contact bonding layer 112 varies. As a result, variations in the characteristics of the motion sensor 1 can be suppressed.
The adhesive 111 is solidified to form an adhesive layer 112, and the stopper 201 and the die 10 are bonded. The gap between the movable part of the die 10 after bonding and the stopper 201 is determined by the thickness of the spacer 114. When the stopper 201 and the die 10 are combined, it is desirable to place the stopper 201 downward and bring the die 10 closer to the stopper 201 from the top because the adhesive 111 is less likely to spread than when the die 10 is placed downward. .

  Thereafter, when a process such as packaging is performed, the motion sensor 1 is completed. In addition, after the die 10 is cut from the wafer by dicing, the stopper 201 and the die 10 may be joined, or a plurality of stoppers 201 may be joined to a plurality of regions to be the die 10 in the wafer process before dicing. .

  According to the manufacturing method described above, it is possible to reliably prevent the adhesive 111 from flowing and adhering to the flexible portion F of the die 10, so that a motion sensor with high reliability and high manufacturing yield can be manufactured. In addition, since the gap between the stopper 201 and the movable part of the die 10 is set by the thickness of the solid spacer 114 itself having no fluidity, the stopper 201 and the die are surely compared with the case where the gap is set by beads mixed with the adhesive. A gap with 10 movable parts can be set. Furthermore, since the spacer 114 is formed from a hard resin that is harder than the sealing resin, the gap between the stopper 201 and the movable portion of the die 10 can be set with high accuracy. For this reason, the motion sensor 1 with high impact resistance performance can be manufactured. Further, by using a photosensitive material as the material of the spacer 114, the pattern of the spacer 114 can be formed with high accuracy, so that the pattern of the adhesive layer 112 can be controlled with high accuracy.

(Modification)
For example, as shown in FIGS. 6A and 6B, the periphery of the adhesive 111 may be completely surrounded by an annular spacer 115. Further, as shown in FIG. 7, the adhesive 111 may be surrounded by double or more annular spacers 115a and 115b. Since the spread of the adhesive 111 can be reliably accommodated within a certain range by the annular spacer 115, variations in the pattern of the adhesive layer 112 can be suppressed. Accordingly, variation in stress generated at the interface between the adhesive layer 112 and the die 10 can be reduced, and variation in characteristics of the motion sensor 1 can be reduced. Further, for example, as shown in FIG. 8, both ends of the spacer 118 may be arranged farther from the flexible portion F and the bonding pad 108. As a result, the adhesive 111 can be released at a position further away from the flexible portion F and the bonding pad 108.

2. Second embodiment (Configuration)
The motion sensor 2 which is 2nd embodiment of MEMS of this invention is shown in FIG. In FIG. 9B and FIG. 9C, the interface of the layer which comprises the die | dye 20 of the motion sensor 2 is shown with the broken line, and the boundary of the mechanical component which comprises the die | dye 20 is shown with the continuous line. In FIG. 9, wirings for connecting the die 20 and the package 30 are omitted.

The motion sensor 2 includes a die 20 and a package 30.
The movable part of the die 20 is constituted by a laminated structure in which a cross-shaped flexible part F constituting four beams and a weight part M coupled to the four beams are formed.

  The package 30 includes a box-shaped bottom portion 214 and a cover 208. The bottom 214 and the cover 208 are joined by an adhesive layer 210. In FIG. 9A, the cover 208 and the adhesive layer 210 are not shown. The adhesive layer 113 is divided into four regions as indicated by hatching in FIG. 9A. A spacer 119 surrounding each region of the adhesive layer 113 is sandwiched between the support portion S of the die 20 and the bottom portion 214 of the package 30. That is, in this embodiment, the bottom part 214 of the package 30 is configured as a stopper.

(Production method)
In the present embodiment, an example will be described in which the spacer 119 is not formed on the die 20 but is formed on the package 30 constituting the stopper.
Specifically, as shown in FIG. 10, a spacer 119 is formed by adding a hard resin to the surface of the bottom 214 of the package 30 as in the first embodiment. Next, the adhesive 111 is dropped on the surface of the bottom 214 of the package 30. Thereafter, the support portion S of the die 20 is bonded to the bottom portion 214 of the package 30 by the adhesive 111. When the adhesive 111 is solidified and the adhesive layer 113 is formed, the die 20 is bonded to the package 30. The gap between the weight part M of the die 20 after bonding and the bottom part 214 of the package 30 is determined by the thickness of the spacer 119.

  According to the present embodiment, since the bottom portion 214 of the package 30 is used as a stopper, the package 30 can be made thinner than the package for housing the die 10 and the stopper 201 of the first embodiment. In addition, you may couple | bond the die | dye 10 which the stopper 201 demonstrated in 1st embodiment has couple | bonded with the package 30 with the method of this embodiment. In this case, the spacer functions as a flow stopper for the adhesive fixed to both the front and back surfaces of the die 10, and the movement range of the weight portion M can be accurately set by the spacer in two directions.

4). Other Embodiments The technical scope of the present invention is not limited to the above-described embodiments, and it goes without saying that various modifications can be made without departing from the scope of the present invention. For example, it goes without saying that the present invention can be implemented by combining the elements of the different embodiments described above, and the materials, dimensions, film forming methods, and pattern transfer methods shown in the above embodiments are merely examples, and those skilled in the art If so, the description of the addition and deletion of processes and the replacement of the process order, which are obvious, is omitted.

FIG. 1A is a top view according to the first embodiment of the present invention. 1B is a cross-sectional view taken along line BB shown in FIG. 1A. 1C is a cross-sectional view taken along line CC shown in FIG. 1A. FIG. 2A is a top view according to the first embodiment of the present invention. 2B is a cross-sectional view taken along line BB shown in FIG. 2A. FIG. 3A is a top view according to the first embodiment of the present invention. 3B is a cross-sectional view taken along line BB shown in FIG. 3A. FIG. 4A is a top view according to the first embodiment of the present invention. 4B is a cross-sectional view taken along line BB shown in FIG. 4A. FIG. 5A is a top view according to the first embodiment of the present invention. 5B is a cross-sectional view taken along line BB shown in FIG. 5A. It is a top view concerning a first embodiment of the present invention. It is a top view concerning a first embodiment of the present invention. It is a top view concerning a first embodiment of the present invention. FIG. 9A is a top view according to the second embodiment of the present invention. FIG. 9B is a cross-sectional view corresponding to the line BB shown in FIG. 9A. FIG. 9C is a cross-sectional view corresponding to the CC line shown in FIG. 9A. FIG. 10A is a top view according to the third embodiment of the present invention. 10B is a cross-sectional view corresponding to the line BB shown in FIG. 10A.

Explanation of symbols

1: motion sensor, 2: motion sensor, 10: die, 20: die, 30: package, 101: silicon layer, 102: etching stopper layer, 104: silicon layer, 106: insulating layer, 107: conductive layer, 108: Bonding pad, 110: marker, 111: adhesive, 112: adhesive layer, 113: adhesive layer, 114: spacer, 115: spacer, 115a: spacer, 115b: spacer, 118a: spacer, 119: spacer, 201: stopper, 202: Marker, 208: Cover, 210: Adhesive layer, 214: Bottom part, F: Flexible part (movable part), M: Weight part (movable part), S: Support part

Claims (9)

A support part;
A movable part that moves relative to the support part;
A die having
A stopper that faces the movable part at a position that limits the range of motion of the movable part;
A spacer made of a hard resin harder than a sealing resin, which is a resin sandwiched between the stopper and the support part in a direction in which the range of motion of the movable part is limited;
An adhesive layer connecting the support and the stopper;
With
The spacer extends between the adhesive layer and the movable part in a direction that blocks between the adhesive layer and the movable part.
MEMS. The spacer is interrupted on the side opposite to the movable part from the adhesive layer,
The MEMS according to claim 1. The spacer surrounds the adhesive layer annularly,
The MEMS according to claim 1. The hard resin is a photosensitive resin.
The MEMS according to any one of claims 1 to 3. A MEMS manufacturing method comprising a die having a support part and a movable part that moves relative to the support part,
Add an adhesive to the surface of the support,
Before adding the adhesive, the support is made of a hard resin harder than a sealing resin and extends between the adhesive and the movable part and extends in a direction blocking the adhesive and the movable part. Formed on the surface of the part,
The spacer is sandwiched in a direction that limits the movement range of the movable part so that the stopper faces the movable part at a position that limits the movement range of the movable part, and the stopper is coupled to the support part by the adhesive. ,
The manufacturing method of MEMS including this. A MEMS manufacturing method comprising: a package; and a die having a support portion and a movable portion that moves relative to the support portion, and is housed in the package,
Adding an adhesive to the bonding surface to which the support of the package is bonded;
Before adding the adhesive, the spacer is made of a hard resin harder than a sealing resin and extends between the adhesive and the movable part and extends in a direction blocking the adhesive and the movable part. Formed on the surface,
The spacer is sandwiched in a direction that limits the movement range of the movable part so that the coupling surface faces the movable part at a position that restricts the movement range of the movable part, and the support part is bonded to the facing surface. Combined with agents,
The manufacturing method of MEMS including this. By adding a photosensitive resin to the bonding surface, exposing and developing the photosensitive resin in a pattern extending in a direction that blocks between the adhesive and the movable part between the adhesive and the movable part Forming the spacer made of the photosensitive resin as the hard resin;
The method for producing a MEMS according to claim 5 or 6. The spacer pattern is formed so as to be interrupted on the side opposite to the movable part from the adhesive.
The manufacturing method of MEMS as described in any one of Claim 5 to 7. Forming a pattern of the spacers so as to surround the adhesive in an annular shape;
The manufacturing method of MEMS as described in any one of Claim 5 to 7.

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