JP2010153738A - Electronic device, housing, and substrate unit - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide electronic devices, a housing, and substrate units, which allow the electronic devices mounted on respective substrates to be sufficiently cooled even when not all of front panels holding the substrates are provided with a sufficient number of vents. <P>SOLUTION: The front panels 51 and 52 of the first substrate units 40B and 40C have vents. The substrates 42 and 43 of the first substrate units 40B and 40C have cutouts. The first substrate units 40B and 40C are placed in the housing 20 so that they are positioned above the second substrate unit 40A, thus allowing air taken in through the vents to be fed to the surfaces of the second substrate unit 40A through the cutouts. <P>COPYRIGHT: (C)2010,JPO&amp;INPIT

Description

  The present invention relates to an electronic device that houses a plurality of substrate units in a housing.

  In communication devices such as routers and hubs, electronic components on a substrate housed inside a housing generate heat as the devices are operated. In order to cool the electronic components that have generated heat in this way, conventionally, measures have been taken to cool the electronic components that have generated heat by taking outside air into the housing from a vent provided in the front panel of the device.

JP-A-7-231185

  An electronic device that realizes a plurality of functions by inserting a plurality of types of substrate units into one housing is used.

  In such electronic devices, in recent years, from the viewpoint of workability and convenience, front access in which switches and connector parts of communication devices are provided on the front panel of the board unit has become mainstream. Due to such circumstances, there are cases where sufficient vents cannot be provided in all of the individual front panels. For this reason, there is a problem that the electronic components mounted on the substrate of the substrate unit having a front panel that cannot sufficiently provide vent holes cannot be sufficiently cooled.

  Therefore, the present invention has been made in view of the above problems, and the present invention provides an electronic device having a plurality of substrate units, even when not enough vent holes can be provided in all of the individual front panels. An object of the present invention is to provide an electronic device that can sufficiently cool an electronic component mounted on a substrate.

  In order to solve the above problems, an electronic device according to the present invention is provided with a notch in at least one of the substrates of a plurality of substrate units housed in a housing, and another substrate unit via the notch. It is possible to send air to the surface of the substrate.

Specifically, an electronic device according to the present invention is
A first substrate unit having a substrate and a front panel attached to the front surface of the substrate, a second substrate unit having a substrate and a front panel attached to the front surface of the substrate, and at least the first substrate unit and the second substrate An electronic device having a housing for housing the unit therein,
A vent hole is formed in the front panel of the first substrate unit, a notch is formed in the substrate of the first substrate unit, and the first substrate unit is located above the second substrate unit. By being accommodated in the housing so as to be positioned at, the air taken in through the vent can be sent to the surface of the second substrate unit through the notch, It is characterized by the structure.

  According to the present invention, even when it is not possible to provide sufficient vents for all of the front panels that hold a plurality of substrates, the electronic components mounted on each substrate can be sufficiently cooled.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

  FIG. 1 is a perspective view transparently showing an electronic apparatus 10 according to the present embodiment. The electronic device 10 includes a housing 20, a rectifying member 30, and board units 40A, 40B, and 40C (in particular, the board unit 40 when not distinguished from each other). Such an electronic device 10 is used by being mounted on, for example, a 19-inch rack conforming to EIA (Electronic Industries Alliance) standard.

  FIG. 2 is a perspective view transparently showing the housing 20 according to the present embodiment. The housing 20 rises from the bottom surface 21, the front surface 27 and the back surface 23 facing each other, the side surface 24 rising from the bottom surface 21 and intersects the front surface 27 and the back surface 23, and the front surface 27 while facing the bottom surface 21. And a ceiling surface 25 intersecting the back surface 23 and the side surface 24, and is formed in a rectangular box shape as a whole.

  An opening 22 is formed in the front surface 27 of the housing 20.

  The opening 22 only needs to be formed in a size and shape that allows the board unit 40 to be inserted into the housing 20 from the front surface 27 of the housing 20.

  A first vent hole 26 that is a through hole for ventilating the casing 20 is formed on the back surface 23 of the casing 20.

  In the present embodiment, a plurality of first vent holes 26 are provided so that the housing 20 can be sufficiently ventilated.

  A fan 60 is attached to the inner side surface of the back surface 23 of the housing 20 at a position covering the first vent hole 26.

  In the present embodiment, the fan 60 promotes ventilation in the housing 20 by generating an air flow from the inside to the outside of the housing 20. Note that the rotation speed of the fan 60 may be set so as to change according to the temperature in the housing 20, or may be set so as to maintain a constant rotation speed.

  A pair of rectifying members 30 to be described later are attached to both side surfaces 24 in the housing 20. In addition, the both side surfaces 24 may be provided with guide members (not shown) for regulating the insertion position of the substrate unit 40 inserted into the housing 20 from the opening 22, for example.

  For example, the guide member includes a rail portion that protrudes from one side surface 24 toward the other side surface 24, and the operator places the board unit 40 on the rail portion and inserts it into the housing 20. By doing so, these board units 40 can be easily accommodated in appropriate positions in the housing 20.

  In FIG. 3, the rectification | straightening member 30 which concerns on this embodiment is shown. The rectifying member 30 includes a rectifying plate main body 31 and a hinge portion 32 that holds the rectifying plate main body 31 and is attached to the side surface of the housing 20.

  The rectifying plate body 31 is formed of, for example, a single plate material, and one end thereof is fixed to the hinge portion 32.

  Further, the height H of the rectifying plate main body 31 is determined from the surface of the substrate of the substrate unit 40 where the front panel 50, 51, 52 cannot be provided with sufficient vent holes when mounted in the housing 20. From a predetermined position between the substrate unit 40 located above the unit 40 and the back surface of the substrate, the front panel 50, 51, 52 can be provided with sufficient ventilation holes from the surface of the substrate of the substrate unit 40 to the substrate. The substrate of the substrate unit 40 that can be sufficiently provided with vent holes 56, 57 in the front panel 50, 51, 52 up to a predetermined position between the substrate 40 and the rear surface of the substrate located above the unit 40. To a predetermined position between the surface of the ceiling surface 25 and the inner surface of the ceiling surface 25.

  The height H of the rectifying plate main body 31 can be arbitrarily selected from the heights described above depending on the position of the board unit 40 where the vent holes 56 and 57 cannot be sufficiently provided in the front panels 50, 51 and 52. May be selected and formed.

  For example, in the present embodiment, the board unit 40 </ b> A in which the vent holes 56 and 57 cannot be sufficiently provided in the front panel 50 is disposed at the lowermost part of the casing 20, and the front panel 50 is ventilated at the uppermost part of the casing 20. A substrate unit 40C capable of providing sufficient openings 56 and 57 is arranged. Therefore, the height H of the rectifying plate body 31 is a predetermined position between the surface of the substrate 41 of the substrate unit 40A and the back surface of the substrate 42 of the substrate unit 40B when the substrate unit 40A is accommodated in the housing 20. Accordingly, the substrate unit 40 </ b> C is formed so as to reach a predetermined position between the surface of the substrate 43 and the inner surface of the ceiling surface 25.

  Further, as shown in FIG. 7, the length L of the rectifying plate main body 31 is such that when the rectifying member 30 is attached to the side surface 24 of the casing 20 and the substrate unit 40 is accommodated in the casing 20, The length of the tip 31 may be set at a predetermined position between the side 42a of the substrates 42 and 43 and the third side 45c of the notch 45 provided in the substrates 42 and 43. .

  The hinge part 32 of the rectifying member 30 has a first hinge 33A and a second hinge 33B.

  Each of the first hinge 33A and the second hinge 33B includes a rotation shaft 34, a fixed portion 35, a holding portion 36, and a spring 37 (the holding portion 36 and the spring 37 of the second hinge 33B are rectified. The fixed portion 35 and the holding portion 36 are rotatable with respect to the rotation shaft 34 because they are located behind the plate body 31 (not shown).

  In addition, the hinge part 32 is not restricted to the thing of this embodiment, For example, you may be comprised only from either one of the 1st hinge 33A or the 2nd hinge 33B.

  The spring 37 is provided so as to hold a specific position including a position where the fixing portion 35 and the holding portion 36 are vertical. That is, when at least one of the fixing portion 35 and the holding portion 36 is rotated in the rotation direction of the rotating shaft 34, the elastic force is applied to return to the specific position described above.

  The rectifying plate body 31 is fixed to the holding portion 36 of the first hinge 33A and the holding portion 36 of the second hinge 33B so that one side of the rectifying plate body 31 is sandwiched therebetween. At this time, the axis of the rotation shaft 34 of the first hinge 33A and the axis of the rotation shaft 34 of the second hinge 33B are made substantially parallel.

  The rectifying plate body 31 is attached to the side surface 24 by attaching the rectifying member 30 configured as described above to the inner side surface of the side surface 24 of the housing 20 in the fixing portion 35 of the first hinge 33A and the second hinge 33B. As a result, it is possible to maintain the upright state, and it is possible to rotate the rectifying plate body 31 about the rotation shaft 34.

  For example, as shown in FIG. 4, when the fixing portion 35 of the hinge portion 32 is attached to the side surface 24 of the housing 20, the rectifying plate main body 31 is attached to the holding portion 36 so as to stand upright with respect to the side surface 24 of the housing 20. Retained.

  Then, unless an external force is applied to the rectifying plate body 31, such an attitude is maintained based on the elastic force of the spring 37 acting between the rotating shaft 34 of the hinge portion 32 and the holding portion 36.

  On the other hand, when an external force is applied to the rectifying plate main body 31 in the direction of the back surface 23 of the housing 20, the rectifying plate main body 31 can rotate around the rotation shaft 34 of the hinge portion 32 (in the A direction). Further, when an external force is applied to the rectifying plate main body 31 in the direction of the front surface 27 of the housing 20, the rectifying plate main body 31 can rotate around the rotation shaft 34 of the hinge portion 32 (in the B direction).

  For example, as shown in FIG. 5, when the substrate unit 40A is inserted into the housing 20 from the opening 22 of the housing 20, the rectifying plate main body 31 is inserted in the direction of inserting the substrate 41 around the rotation shaft 34 (direction A in FIG. 4). ) Can be rotated. Similarly, when the substrate 41 is pulled out from the housing 20, the rectifying plate body 31 can rotate around the rotation axis 34 in the direction in which the substrate 41 (42, 43) is pulled out (direction B in FIG. 4). As a result, it is possible to prevent the substrate unit 40 from being damaged due to contact with the rectifying member 30 when the substrate unit 40 is inserted into the housing 20 or when the accommodated substrate unit 40 is pulled out. .

  Note that the rectifying member 30 is not limited to this embodiment, and may be formed of a deformable elastic rubber, for example, as shown in FIG. If the rectifying member 30 is formed of elastic rubber, the substrate unit 40 can be prevented from being damaged as described above.

As for the position where the rectifying member 30 is attached to the side surface of the housing 20, as shown in FIG. 7, the rectifying member located on the back surface 23 side of the housing 20 when the substrate unit 40 is accommodated in the housing 20. The shortest distance D ₁ from the rotation center of the 30 rotation shaft 34 to the second side 45 b of the notch 45 provided in the substrates 42 and 43 is a length L from the rotation center to the tip of the rectifying plate body 31. _What is necessary is just to attach to the position which becomes longer than _one .

  When the rectifying member 30 is attached to the side surface of the housing 20, the axis of the rotating shaft 34 of the rectifying member 30 is in a predetermined range including an angle perpendicular to the insertion direction of the substrate unit 40. To do.

  FIG. 8 is a schematic view of the substrate unit 40A. The board unit 40A includes a board 41 and a front panel 50.

  The substrate 41 has a rectangular shape, and a plurality of wiring patterns and a plurality of electrodes connected to each wiring pattern are formed on the surface (not shown). Further, a plurality of electronic components 44 such as semiconductor packages and transistors are mounted on the surface of the substrate 41, and are connected to electrodes on the substrate surface by pins and lead wires.

  A front panel 50 is fixed to one side of the substrate 41. The front panel 50 is formed with a plurality of accommodation ports 55 for accommodating module components 54 such as connectors. For example, when the module component 54 is accommodated in the accommodation port 55, electrical continuity is established with the electronic component 44 mounted on the surface of the substrate 41. Such a front panel 50 is attached to the front surface 27 of the housing 20.

  In the substrate unit 40 </ b> A in the present embodiment, the front panel 50 is provided with a plurality of accommodation ports 55, so that it is not possible to provide sufficient vents in the front panel 50.

  FIG. 9 is a schematic view of the substrate unit 40B. As shown in FIG. 1, in the housing 20, the substrate unit 40 </ b> B is accommodated in the upper portion of the substrate unit 40 </ b> A.

  The board unit 40 </ b> B includes a front panel 51 and a board 42. The front panel 51 is provided with second ventilation holes 56 and 57 which are through holes for ventilating the housing 20. For example, outside air is taken into the housing 20 through the second ventilation ports 56 and 57.

  Similar to the substrate 41 of the substrate unit 40A shown in FIG. 8, the substrate 42 has a plurality of wiring patterns and a plurality of electronic components 44 on its surface. In addition, the same code | symbol is attached | subjected to the structure same as FIG. 8, and description is abbreviate | omitted.

  The substrate 42 is formed with a pair of notches 45 on each side 42 a facing both side surfaces 24 in the housing 20.

  The notch 45 has a first side 45a extending inward from the side 42a on the front side of the substrate 42 and a second side extending inward of the substrate 42 from the side 42a on the front side of the substrate 42. 45b and a third side 45c connecting the first side 45a and the second side 45b.

As shown in FIG. 9, the length _{L 2} of the first side 45a and second side 45b, when accommodating the board unit 40B to the housing 20, the tip of the rectifying plate 31 is, the side of the substrate 42, 43 The length may be a predetermined position between the side 42 a and the third side 45 c of the notch 45 provided in the substrates 42 and 43.

The length L ₃ of the third side 45c, when pulling the board unit 40 may be a length which does not interfere with the first side 45a. For example, as shown in FIG. 10, when the rectifying plate main body 31 comes into contact with the second side 45 b, the rotation center of the rotating shaft 34 of the rectifying member 30 located on the front surface 27 side of the housing 20 moves to the substrate 42. minimum distance D ₂ to the first side 45a of the notch 45 is provided may be so made longer than the length L ₄ from the center of rotation to the tip of the rectifying plate 31.

  FIG. 11 is a schematic diagram of the substrate unit 40C. As shown in FIG. 1, in the housing 20, the substrate unit 40 </ b> C is accommodated in the upper part of the substrate unit 40 </ b> B. The substrate unit 40 </ b> C includes a substrate 43 and a front panel 52. In addition, about the structure same as the board | substrate unit 40A of FIG. 8, and the board | substrate unit 40B of FIG. 9, the same code is attached and description is abbreviate | omitted.

  The substrate 43 has a shielding member 47 disposed along the third side 45 c of the notch 45. The shielding member 47 is formed from, for example, a rectangular plate material.

As shown in FIG. 10, when the shielding member 47 comes into contact with the back surface of the front panel 52 and the substrate unit 40 </ b> C is stored in the housing 20, the other end of the shielding member 47 is connected to the rectifying plate body 31. It is the length L ₅ as contact.

The height H ₂ of the shielding member 47, when the substrate unit 40C is accommodated in the housing 20, the rear surface of the substrate board unit 40 from the surface of the substrate board unit 40C above the board unit 40C Or a predetermined position between the surface of the substrate of the substrate unit 40 </ b> C and the inner surface of the ceiling surface 25.

The height H ₂ of the shielding member 47, the position for accommodating the board unit 40C to the housing 20 may be formed by selecting any of the height as described above.

For example, when in the present embodiment, since you have to place the board unit 40C at the top of the housing 20, height H ₂ of the shielding member 47, which houses the board unit 40C to the housing 20, It is formed so as to reach a predetermined position between the surface of the substrate 43 of the substrate unit 40 </ b> C and the inner surface of the ceiling surface 25.

  With such a function of the shielding member 47, the outside air taken into the housing 20 from the second vent 56 facing the rectifying plate main body 31 is prevented from entering the inside of the board unit 40C.

  A space formed by the notch 54 provided in the substrate unit 40C and the substrate unit 40B by accommodating the substrate unit 40 configured as described above, for example, in the housing 20 as shown in FIG. Thus, the air taken into the housing 20 through the front vent 52 of the front panel 52 of the board unit 40C and the second vent 56 of the front panel 51 of the board unit 40B is supplied to the board 41 of the board unit 40A. Become.

  Here, a scene in which the electronic apparatus 10 according to the present embodiment operates will be described. Outside air is taken into the housing 20 through second vents 56 and 57 formed in the front panels 51 and 52. For example, when the fan 60 in the housing 20 is operated, ventilation in the housing 20 is promoted, and more outside air is taken into the housing 20.

  In the front panel 50 that holds the substrate 43, outside air that has entered the housing 20 from the second vent 56 facing the rectifying plate body 31 is guided to the rectifying plate body 31 by being guided by the shielding member 47. The outside air that has collided with one surface of the rectifying plate main body 31 passes through the continuous space formed by the notches 45 of the substrates 42 and 43 and reaches the surfaces of the substrates 41 and 42. Further, the outside air that has entered the housing 20 from the second vent 57 reaches the electronic component 44 mounted on the surface of the substrate 43. In this way, the outside air taken into the housing 20 from the second vents 56 and 57 formed in the front panel 52 that holds the substrate 43 is transferred to the surface of the substrates 41, 42, and 43. After cooling the component 44, the component 44 is discharged from the first vent 26 to the outside of the housing 20.

  In the front panel 51 that holds the substrate 42, the outside air that has entered the housing 20 from the second vent 56 facing the rectifying plate body 31 reaches one surface of the rectifying plate body 31. The outside air that has collided with the rectifying plate main body 31 passes through the continuous space formed by the notches 45 of the substrates 42 and 43 and reaches the surface of the substrate 41. Further, the outside air that has entered the housing 20 from the second vent 57 reaches the electronic component 44 mounted on the surface of the substrate 42. In this manner, the outside air taken into the housing 20 cools the electronic components 44 mounted on the surfaces of the substrates 41 and 42, and then is discharged from the first vent 26 to the outside of the housing 20. .

  As described above in detail, according to the electronic apparatus 10 according to the present embodiment, it is possible to provide sufficient vents for all the front panels 50, 51, 52 that hold the plurality of substrates 41, 42, 43. Even when there is not, the surface of each board | substrate 41,42,43 can fully be cooled.

  In the embodiment described above, the substrate unit 40B is not provided with the shielding member 47 as provided in the substrate unit 40C. However, the substrate unit 40B can also be provided with the shielding member 47.

  In such a case, the height of the shielding member 47 is such that when the substrate unit 40B is accommodated in the housing 20, the substrate unit 40C positioned above the substrate unit 40B from the surface of the substrate 42 of the substrate unit 40B. What is necessary is just to make it reach | attain to the predetermined position between the back surface of the board | substrate 43 of this.

  Note that the present invention is not limited to the present embodiment. In the first modification of the above-described embodiment, for example, the second vent holes 56 and 57 are formed only in the front panel 50 that holds the substrate 41. That is, the second ventilation ports 56 and 57 are not formed in the front panels 51 and 52 that hold the substrates 42 and 43.

  In the substrates 42 and 43 of the first modified example, the notches 45 similar to those described above are formed. However, the shielding members 47 are not provided on the substrates 42 and 43.

  Further, a rectifying member 30 is attached to the side surface inside the housing 20. At this time, the height H of the rectifying plate body 31 is a predetermined position between the surface of the substrate 41 of the substrate unit 40A and the back surface of the substrate 42 of the substrate unit 40B when the substrate unit 40A is accommodated in the housing 20. Accordingly, the substrate unit 40 </ b> C is formed so as to reach a predetermined position between the surface of the substrate 43 and the inner surface of the ceiling surface 25. Other configurations are the same as those in the above-described embodiment.

  Also in such a first modification, the outside air taken into the housing 20 from the second vent 56 facing the rectifying plate main body 31 reaches the rectifying plate main body 31. The outside air that has collided with the rectifying plate main body 31 can reach the surface of the substrates 42 and 43 through the continuous space formed by the notches 45 of the substrates 42 and 43. Further, the outside air taken into the housing 20 from the second ventilation port 57 cools the surface of the substrate 41. As a result, even in such a first modified example, the surfaces of the substrates 41, 42, and 43 can be sufficiently cooled.

  In the second modification of the above-described embodiment, for example, the second vent holes 56 and 57 are formed in the front panels 50 and 51 that hold the substrates 41 and 42. That is, the second vent holes 56 and 57 are not formed in the front panel 52 that holds the substrate 43.

  A cutout 45 similar to that described above is formed in the substrate 43 of the second modified example. However, the shielding member 47 is not provided on the substrate 43.

  Further, a rectifying member 30 is attached to the side surface inside the housing 20. At this time, as shown in FIG. 12, the height H of the rectifying plate main body 31 is such that when the substrate unit 40B is accommodated in the housing 20, from the surface of the substrate 42 of the substrate unit 40B to the back surface of the substrate 43 of the substrate unit 40C. Is formed so as to reach a predetermined position between the surface of the substrate 43 of the substrate unit 40C and the inner surface of the ceiling surface 25.

  Further, the second embodiment is not limited to the above-described configuration. For example, the substrate 42 may be provided with a notch. At this time, the height H of the rectifying plate body 31 is a predetermined position between the surface of the substrate 41 of the substrate unit 40A and the back surface of the substrate 42 of the substrate unit 40B when the substrate unit 40A is accommodated in the housing 20. Thus, it may be formed so as to reach a predetermined position between the surface of the substrate 43 of the substrate unit 40 </ b> C and the inner surface of the ceiling surface 25. Other configurations are the same as those in the above-described embodiment.

  Even in this case, the surfaces of the substrates 41, 42, and 43 can be sufficiently cooled as in the above-described embodiment and the first modification.

  In the third modification of the above-described embodiment, for example, the second vent holes 56 and 57 are formed in the front panels 50 and 52 that hold the substrates 41 and 43. That is, the second vent holes 56 and 57 are not formed in the front panel 51 that holds the substrate 42.

  A cutout 45 similar to that described above is formed in the substrate 42 of the third modified example. However, the substrate 42 is not provided with the shielding member 47.

  Further, a rectifying member 30 is attached to the side surface inside the housing 20. At this time, as shown in FIG. 13, the height H of the rectifying plate main body 31 is such that when the substrate unit 40A is accommodated in the housing 20, the front surface of the substrate 41 of the substrate unit 40A and the back surface of the substrate 42 of the substrate unit 40B. Is formed so as to reach a predetermined position between the surface of the substrate 42 of the substrate unit 40B and the back surface of the substrate 43 of the substrate unit 40C.

  Further, the third embodiment is not limited to the above-described configuration, and for example, the substrate 43 may be provided with a notch. At this time, the height H of the rectifying plate body 31 is a predetermined position between the surface of the substrate 41 of the substrate unit 40A and the back surface of the substrate 42 of the substrate unit 40B when the substrate unit 40A is accommodated in the housing 20. Thus, it may be formed so as to reach a predetermined position between the surface of the substrate 43 of the substrate unit 40 </ b> C and the inner surface of the ceiling surface 25. Other configurations are the same as those in the above-described embodiment.

  Even in this case, the surfaces of the substrates 41, 42, and 43 can be sufficiently cooled as in the above-described embodiment and the first and second modifications.

1 is a perspective view transparently showing an electronic apparatus according to an embodiment of the present invention. 1 is a perspective view transparently showing a housing of an electronic device according to an embodiment of the present invention. The perspective view of the rectification | straightening member attached to the electronic device which concerns on one Embodiment of this invention. The perspective view which showed the movable direction of the rectification | straightening member attached to the electronic device which concerns on one Embodiment of this invention. The perspective view which showed the movable direction of the rectification | straightening member at the time of accommodating a board | substrate unit in the electronic device which concerns on one Embodiment of this invention. The perspective view of the modification of the rectifying member attached to the electronic device which concerns on one Embodiment of this invention. The front view which showed the positional relationship of the board | substrate accommodated in the electronic device which concerns on one Embodiment of this invention, and a rectification | straightening member. Schematic of the board | substrate unit A of the electronic device which concerns on one Embodiment of this invention. Schematic of the board | substrate unit B of the electronic device which concerns on one Embodiment of this invention. The front view which showed the positional relationship with the notch of the board | substrate accommodated in the electronic device which concerns on one Embodiment of this invention, and a baffle plate main body. Schematic of the board | substrate unit C of the electronic device which concerns on one Embodiment of this invention. The side view of the electronic device which concerns on the 2nd modification of one Embodiment of this invention. The side view of the electronic device which concerns on the 3rd modification of one Embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Electronic device, 20 ... Housing | casing, 30 ... Rectifying member, 40 ... Board | substrate 45 ... Notch (of board | substrate), 50, 51, 52 ... Front panel, 60 ... Fan,

Claims (13)

A first substrate unit having a substrate and a front panel attached to the front surface of the substrate;
A second substrate unit having a substrate and a front panel attached to the front surface of the substrate;
A housing that houses at least the first substrate unit and the second substrate unit, and an electronic device comprising:
A vent hole is formed in the front panel of the first substrate unit,
A cutout is formed in the substrate of the first substrate unit,
By housing the first substrate unit in the housing so as to be positioned above the second substrate unit, the air taken in through the vent is allowed to pass through the notch to the second substrate unit. To be able to be fed into the surface of the
Electronic equipment characterized by The electronic device according to claim 1,
The housing is adapted to accommodate a substrate unit other than the first substrate unit and the second substrate unit,
The substrate of the substrate unit housed between the first substrate unit and the second substrate unit is provided with a notch at a position corresponding to the notch provided in the first substrate unit. thing,
Electronic equipment characterized by The electronic device according to claim 1,
A rectifying member having a rectifying plate body extending toward the other side surface is attached to the inner side surface of the side surface of the housing,
When the first substrate unit is accommodated in the housing, the front end of the rectifying plate main body is located on the inner side of the notch than the side surface of the substrate.
Electronic equipment characterized by The electronic device according to claim 3,
The height of the current plate body is higher than the surface of the first substrate unit from the surface of the second substrate unit when the first substrate unit and the second substrate unit are accommodated in the housing. And the height above the first substrate unit is lower than the object covering the notch formed in the first substrate unit,
Electronic equipment characterized by The electronic device according to claim 3,
The rectifying plate main body is adapted to displace the front end of the rectifying plate main body in the front or back direction of the housing.
When the first board unit is accommodated in the case or when the first board unit is taken out of the case, the tip of the current plate body is displaced in the front or back direction of the case. The first substrate unit is accommodated in the housing, or the first substrate unit can be taken out of the housing;
Electronic equipment characterized by The electronic device according to claim 5,
The rectifying plate main body includes a position that is perpendicular to the side surface of the casing when an elastic force is applied when the front end of the rectifying plate main body is displaced in a front or rear direction of the casing. To return to the position of
Electronic equipment characterized by The electronic device according to claim 1,
The substrate of the first substrate unit is provided with a shielding member protruding upward from the surface of the substrate at a position adjacent to the notch,
The height of the shielding member is above the surface of the first substrate unit and below the object covering the notch formed in the first substrate unit above the first substrate unit. The height of the
Electronic equipment characterized by A first substrate unit having a substrate, a front panel attached to the front side of the substrate and a notch formed on a side of the substrate, and a second having a front panel attached to the front side of the substrate and the substrate A housing that houses at least a substrate unit,
A rectifying member having a rectifying plate body extending toward the other side surface is attached to the inner side surface of the side surface,
When the first substrate unit is accommodated in the housing, the front end of the rectifying plate main body is located on the inner side of the notch than the side surface of the substrate.
A housing characterized by. A housing according to claim 8,
The height of the current plate body is higher than the surface of the first substrate unit from the surface of the second substrate unit when the first substrate unit and the second substrate unit are accommodated in the housing. And the height above the first substrate unit is lower than the object covering the notch formed in the first substrate unit,
A housing characterized by. A housing according to claim 8,
The rectifying plate main body is adapted to displace the front end of the rectifying plate main body in the front or back direction of the housing.
When the first board unit is accommodated in the case or when the first board unit is taken out of the case, the tip of the current plate body is displaced in the front or back direction of the case. The first substrate unit is accommodated in the housing, or the first substrate unit can be taken out of the housing;
A housing characterized by. The housing according to claim 10,
The rectifying plate main body includes a position that is perpendicular to the side surface of the casing when an elastic force is applied when the front end of the rectifying plate main body is displaced in a front or rear direction of the casing. To return to the position of
A housing characterized by. A substrate unit housed in a housing,
A board and a front panel attached to the front of the board;
The front panel is formed with a vent,
A cutout is formed on the side of the substrate,
The air taken in through the vent can be sent to the surface of another substrate unit through the notch,
A board unit characterized by The board unit according to claim 12, wherein
The substrate is provided with a shielding member protruding upward from the surface of the substrate at a position adjacent to the notch,
The height of the shielding member is above the surface of the first substrate unit and below the object covering the notch formed in the first substrate unit above the first substrate unit. Up to the height,
A board unit characterized by

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