JP2010139434A - Test apparatus and test method for discriminating between foreign substance and scar - Google Patents

Test apparatus and test method for discriminating between foreign substance and scar Download PDF

Info

Publication number
JP2010139434A
JP2010139434A JP2008317233A JP2008317233A JP2010139434A JP 2010139434 A JP2010139434 A JP 2010139434A JP 2008317233 A JP2008317233 A JP 2008317233A JP 2008317233 A JP2008317233 A JP 2008317233A JP 2010139434 A JP2010139434 A JP 2010139434A
Authority
JP
Japan
Prior art keywords
inspection
foreign
imaging
oblique light
scratch
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2008317233A
Other languages
Japanese (ja)
Other versions
JP5622338B2 (en
Inventor
Akio Kasai
Shoji Nagasaki
Masayuki Yoneda
雅之 米田
彰男 葛西
昇治 長崎
Original Assignee
Yamatake Corp
株式会社山武
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamatake Corp, 株式会社山武 filed Critical Yamatake Corp
Priority to JP2008317233A priority Critical patent/JP5622338B2/en
Publication of JP2010139434A publication Critical patent/JP2010139434A/en
Application granted granted Critical
Publication of JP5622338B2 publication Critical patent/JP5622338B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Abstract

<P>PROBLEM TO BE SOLVED: To provide a test apparatus and a test method for discriminating between foreign substances and scars, capable of discriminating between minute foreign substances and scars without taking time in test work. <P>SOLUTION: The test apparatus and the test method for discriminating between the foreign substances and the scars based on surface imaging data of a device element includes an oblique lighting means 10 for simultaneously irradiating the device element with oblique lights from two directions, an imaging means 20 for detecting and imaging a reflected light from the device element, and a discrimination processing means 30 for controlling each means and digitalizing a picked-up image to discriminate between the foreign substances and the scars. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a discrimination inspection apparatus and an inspection method for foreign matters and scratch marks that are preferably used in an inspection for detecting a resistance value or the like in a manufacturing process of a semiconductor device such as a pressure sensor.

  In the process of manufacturing a semiconductor device such as a pressure sensor, a test for acquiring data such as a resistance value is generally performed. This inspection process is performed by directly contacting the probe with the sensor element, but since the probe tip has a needle shape of about 0.1 μm or less, there is no effect on the product quality, but there is no probe mark at the inspection position of the semiconductor device. Remain.

  On the other hand, although semiconductor devices are manufactured in an environment such as a clean room with a predetermined cleanliness, it is difficult to completely block foreign materials and dust generated during the manufacturing process of semiconductor devices. As a result, minute foreign matter may adhere to the device surface.

  Since foreign matter adhering to the device surface adversely affects the output characteristics of the semiconductor device, it is necessary to perform an appearance inspection on the surface of the semiconductor device in the final inspection and to clean a product to which the foreign matter has adhered.

  However, although this foreign substance is larger than the probe mark, it is as small as about 20 μm, so it is difficult to reliably determine whether it is a foreign object or a probe mark, and all suspicious products must be cleaned. There is.

As an apparatus for observing (inspecting) surface irregularities of an object to be inspected, for example, apparatuses described in Patent Document 1 and Patent Document 2 are known.
JP 2005-274256 A JP 2000-266686 A

  The inspection apparatus disclosed in Patent Document 1 is a surface inspection apparatus that uses a film-like substrate material as an object to be inspected. This apparatus includes oblique illumination means, and includes a step of irradiating oblique light to an object to be inspected from one direction, and determining whether the object is concave or convex based on a difference in the location of a shadow caused by unevenness on the inspection object region. ing. However, since oblique light is applied to the object to be inspected from only one direction, the imaging result becomes dark, and it is difficult to detect a stable shadow when the object to be inspected is a minute foreign object and a probe mark. In addition, it is necessary to determine the presence or absence of a shadow while sequentially changing the irradiation direction.

  On the other hand, the inspection apparatus disclosed in Patent Document 2 is an inspection apparatus that discriminates scratch defects and spot defects formed on a metal surface. In this device, it is necessary to adjust the illumination conditions (light quantity) that can detect flaw defects and spot defects, respectively, and oblique light is irradiated from one direction to minute foreign objects and probe traces having different shapes as the inspection object It is necessary to adjust the light amount while sequentially changing the irradiation direction. Therefore, there is a problem that it takes time to work. Further, since oblique light is irradiated on the object to be inspected from only one direction, the imaging result becomes dark as in the case of the above-mentioned Patent Document 1, and there is a problem that it is difficult to detect a stable shadow.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a discrimination inspection apparatus and inspection method for foreign matters and scratch marks that can distinguish minute foreign matters and scratch marks without taking time for inspection work.

In order to solve the above-described problem, a discrimination inspection apparatus for foreign matter and scratch marks according to claim 1 of the present invention is provided.
An inspection apparatus for discriminating foreign objects and scratches based on imaging data of the device element surface,
Oblique light illuminating means for simultaneously irradiating oblique light to the device element from two directions;
Imaging means for detecting and imaging reflected light from the device element;
The image processing apparatus includes a determination processing unit that controls each of the above units and digitally processes a captured image to determine whether the image is a foreign object or a scratch mark.

In addition, a method for discriminating and checking foreign matter and scratch marks according to claim 6 of the present invention includes:
An inspection method for discriminating foreign objects and scratches based on imaging data of the device element surface,
A first step of simultaneously irradiating the device element with oblique light from two directions;
A second step of detecting and imaging reflected light from the device element;
And at least a third step of determining whether the image captured in the second step is a foreign object or a scratch mark by digital processing.

  The conventional method of irradiating an object to be inspected obliquely from one direction and inspecting the presence or absence of unevenness on the object to be inspected with the presence or absence of unevenness tends to have insufficient light quantity, Scratch marks could not be determined accurately, but by irradiating obliquely the device element that is the object to be inspected from two directions simultaneously as in the present invention, a sufficient amount of light can be secured and stable imaging data can be obtained. Therefore, it is possible to accurately determine whether it is a foreign object or a probe mark. In addition, it is possible to determine whether a foreign object or a probe trace is obtained by changing only the irradiation direction of the two sets as a set without adjusting the amount of light and changing only the irradiation direction of the set.

Moreover, the discrimination | determination inspection apparatus of the foreign material and scratch mark which concerns on Claim 2 of this invention is the discrimination | determination inspection apparatus of the foreign material and scratch mark of Claim 1,
The discrimination processing means includes both of the at least two imaging data from at least two imaging data obtained by changing the oblique light direction among the imaging data obtained by simultaneously irradiating the device element with oblique light from two directions. And having a predetermined luminance is determined as a foreign substance, and only one of the at least two pieces of imaging data having a predetermined luminance is determined as a scratch mark.

Moreover, the discrimination | determination inspection method of the foreign material and scratch mark which concerns on Claim 7 of this invention is the discrimination | determination inspection method of the foreign material and scratch mark of Claim 6,
In the second step, after obtaining at least two imaging data obtained by changing the oblique light direction among the imaging data obtained by simultaneously irradiating the device element with oblique light from two directions, the third element In the step, both the at least two imaging data having a predetermined luminance are determined as foreign matters, and only one of the at least two imaging data having a predetermined luminance is determined as a scratch mark. It is a feature.

  By having the discrimination processing means and the discrimination processing method as in the present invention, it is possible to reliably discriminate foreign objects and scratch marks.

Moreover, the discrimination | determination inspection apparatus of the foreign material and scratch mark which concerns on Claim 3 of this invention is a discrimination | determination inspection apparatus with the foreign material and scratch mark of Claim 1 or Claim 2,
The oblique illumination means emits oblique light simultaneously from two opposing directions.

  By irradiating obliquely the object to be inspected from two opposite directions at the same time, the difference between the reflected light of the foreign object and the scratch mark can be made more conspicuous, and the foreign object and the scratch mark can be more easily distinguished.

A foreign matter and scratch mark discrimination inspection device according to claim 4 of the present invention is the foreign matter and scratch mark discrimination inspection device according to any one of claims 1 to 3,
The scratch mark is a linear probe mark having a width of 1 μm or less.

  For example, even if the scratch mark is a fine scratch such as a probe mark having a width of 1 μm or less that occurs when a probe is applied to a pad on a semiconductor device, the pad can be obtained by simultaneously irradiating oblique light from different directions according to the present invention. It can be easily distinguished from the above foreign material.

In addition, a foreign matter and scratch mark discrimination inspection device according to claim 5 of the present invention is the foreign matter and scratch mark discrimination inspection device according to any one of claims 1 to 3,
The foreign matter has an outer diameter of 20 μm or less.

  Even if the foreign matter is fine on the pad, it can be easily distinguished from scratch marks on the pad by simultaneously irradiating oblique light from different directions according to the present invention.

  ADVANTAGE OF THE INVENTION According to this invention, the discrimination | determination inspection apparatus and the inspection method of the foreign material which can discriminate | determine a minute foreign material and a crack trace without taking time and effort for an inspection work can be provided.

  Hereinafter, a discrimination inspection device and an inspection method for foreign matters and scratch marks according to an embodiment of the present invention will be described with reference to the drawings. In the description of this embodiment, the X-axis direction, the Y-axis direction, and the Z-axis direction are the three axes of the orthogonal coordinate system, that is, the X-axis and the Y-axis are axes that are orthogonal to each other on the horizontal plane, and the Z-axis is X An axis that passes through the intersection of the axis and the Y axis and is perpendicular to the horizontal plane.

  As shown in FIG. 1, the inspection apparatus for discriminating foreign objects and scratches according to the present embodiment includes an oblique illumination unit 10 that irradiates oblique light to a semiconductor sensor chip 50 that is an object to be inspected, and reflection from the object to be inspected. An imaging unit 20 comprising an IC microscope for observing light and a CCD camera for imaging an image observed with the IC microscope, and a discrimination processing unit for controlling these and digitally processing the captured image to determine whether it is a foreign object or a scratch mark 30.

  The oblique illumination unit 10 includes four oblique illumination units arranged at intervals of 90 degrees. The two oblique illumination units opposed to each other are set as one set (one set) and simultaneously inspect the inspection object from two directions.

  More specifically, for example, when viewed from above the object to be inspected, a position corresponding to the inspected area of the object to be inspected is set as the origin, and a set of first opposing oblique illumination units 11 has an X axis. Provided at the top is another set of second opposing oblique illumination units 12 above the first oblique portion and the position moved in the circumferential direction 90 degrees around the object to be inspected, that is, above the Y axis. ing.

  Note that the oblique illumination unit 10 (11, 12) in FIG. 1 is shown as directional oblique illumination, and the imaging unit 20 is shown by an IC microscope 21 and a camera 22 such as a CCD camera or a C-MOS camera. The discrimination processing unit 30 is configured in the imaging / image processing personal computer 31 in FIG. 1 and is electrically connected to the imaging unit 20 via a capture board 32. The illumination power supply 13 supplies power to the oblique illumination unit 10 and controls the irradiation direction of oblique light from the illumination power supply 13 via the I / O port 33 of the discrimination processing unit 30.

  Unlike such a configuration, a pair of oblique illumination units are provided at opposing positions, and either the one set of oblique illumination units themselves or an inspection table on which an object to be inspected is rotated by 90 degrees. The oblique light may be irradiated from substantially different directions, that is, the X-axis direction and the Y-axis direction.

  Next, the inspection principle of the foreign substance and scratch mark discrimination inspection apparatus according to this embodiment will be described. In the following description, a linear scratch mark is a probe mark attached to an object to be inspected by a probe.

  In the foreign matter and scratch mark discrimination inspection apparatus according to the present embodiment, imaging is performed by irradiating an object to be inspected in all directions (both in the X-axis direction and the Y-axis direction) and binarizing with a predetermined light intensity as a threshold value. Data is acquired and the position of an inspection candidate made up of foreign matter or probe marks is determined. Next, imaging data obtained by simultaneously irradiating oblique light from two opposing oblique illumination units arranged above the X-axis direction and binarizing with a predetermined light intensity as a threshold value for each inspection candidate determined by the above-described omnidirectional irradiation To get. Next, simultaneous irradiation is performed from two opposing oblique illumination units disposed above the Y-axis direction, and similar imaging data is acquired.

  Finally, it is determined whether each inspection candidate is a foreign object or a probe mark from the imaging data in the X-axis direction and the Y-axis direction. In the case of a foreign substance, since it has a predetermined convex portion, it is possible to detect a predetermined luminance in both oblique light irradiation from the X-axis direction and the Y-axis direction. On the other hand, the probe mark is formed in the form of a linear (scratch-shaped) concave portion due to the shape of the probe. Therefore, when oblique light is irradiated from the longitudinal direction of the linear probe mark, the irradiated light is irradiated at the bottom of the concave portion. Since it reflects in each irradiation direction, predetermined brightness | luminance cannot be detected. Based on these differences, the inspection candidate that was able to detect the predetermined luminance in both the X-axis direction and the Y-axis direction can be determined as a foreign object, and the predetermined luminance can be detected only in one of the X-axis and Y-axis. Can be determined as a probe mark, so that it is possible to determine whether each inspection candidate is a foreign object or a probe mark.

  Next, an inspection method using the inspection apparatus according to the present embodiment based on the principle of discrimination between the foreign matter and the scratch mark (probe mark) according to the present invention described above will be described based on a flowchart. In the inspection methods shown in the flowcharts of FIGS. 2 to 5 below, instead of using the above-described two sets of opposed oblique illumination devices, n sets arranged at different positions in the circumferential direction around the object to be inspected. A case where the oblique light irradiation device is used will be described. This is to clarify that the oblique illumination unit in the present invention is not limited to being arranged in only two different directions, only above the X axis and above the Y axis.

  As shown in the flowchart of FIG. 2, the present inspection method has an imaging / extraction step (imaging and extraction step) as a first processing step between the start and end of the discrimination inspection method for foreign matter and scratch marks ( Step S100) has a determination step (Step S200) as a subsequent second processing step.

  Note that the imaging / extraction step as the first processing step is a processing step in which defect candidates are extracted and imaging is performed utilizing the directivity of oblique light. The subsequent determination process as the second processing process is a process that automatically determines whether the defect candidate is a foreign object or a scratch mark by logically calculating the defect candidate extraction result and the imaging result.

  Next, the imaging / extraction process will be described based on the flowchart of FIG. Preparation for imaging starts with the start of the imaging / extraction process (step S110). Then, all the oblique illuminations arranged n around the object to be inspected are turned on (step S120), and the object to be inspected is imaged by the camera (step S130). Then, an automatic inspection A described later is performed (step S140). Then, all oblique illumination is turned off (step S150). Subsequently, the first oblique illumination unit (oblique illumination No. 1) is turned on (step S160), and this is imaged by the camera (step S170). Then, an automatic inspection B described later is performed (step S180). Then, the first oblique illumination unit (oblique illumination No. 1) is turned off (step S190).

  In this way, the n sets (n sets) of oblique illumination facing each other are sequentially changed, and the routine from step S160 to step S190 is repeated. Specifically, the nth oblique illumination unit (oblique illumination No. n) is turned on (step Sn60), and the inspection object is imaged by the camera (step Sn70). Subsequently, an automatic inspection B described later is performed (step Sn80). Subsequently, the nth oblique illumination unit (oblique illumination No. n) is turned off (step Sn90). This completes the imaging / extraction process.

  Subsequently, the processing routine of the above-described automatic inspection A and automatic inspection B will be described based on the flowchart of FIG. First, the processing routine of automatic inspection A will be described. By starting the automatic inspection A (step S140), a shining portion is extracted from the image first captured by the camera (step S141). At this time, a predetermined threshold value for distinguishing between predetermined brightness and darkness is set, and based on this, an area reflected and shining is displayed as a defect candidate image. Thereby, defect candidate image 1 to defect candidate image k (k: number of defect candidates) are displayed (step S142). Then, automatic inspection A ends.

  When setting a predetermined threshold value for distinguishing between the predetermined brightness and darkness, it is preferable to cancel a bright area with a small area as a noise component so that it is not regarded as a defect candidate image.

  Subsequently, a processing routine of automatic inspection B (step S180) will be described. By starting the automatic inspection B, an object to be inspected is imaged by a first set of cameras that simultaneously irradiate oblique light from two opposing directions, and a shining portion is extracted from the captured images (step S181). . At this time, a predetermined threshold value for distinguishing predetermined brightness and darkness is set, and based on this, only the region that is reflected and shining is displayed. Even when only this shining area is displayed, a bright area with a small area should be canceled as a noise component. Thus, the first set of sorting result images is displayed (step S182). This is repeated from the first set of cameras to the n sets of cameras as described above. In this way, the automatic inspection B performed for each of the n sets of cameras is completed.

  Next, the determination routine will be described based on the flowchart of FIG. In starting the determination routine, preparation for determination is made (step S211), and specific determination is started (step S212). In this specific determination, as shown in step S212, the logical product (AND) of the defect candidate image 1 and the sorting result image 1 is obtained and set to Ins-Image1. Then, the logical product of the defect candidate image 1 and the sorting result image 2 is obtained as Ins-Image2. Thereafter, this process is sequentially performed up to the nth selection result image, and the logical product of the defect candidate image 1 and the selection result image n is obtained as Ins-Imagen.

  Next, it is determined whether or not there is a shining portion in all the images of Ins-Image1 to Ins-Imagen (step S213). At this time, for example, if the defect candidate 1 is shining in all the images of Ins-Image1 to Ins-Imagen, it is determined that the defect candidate 1 is a foreign substance (convex) as surrounded by an ellipse in the drawing of the defect candidate 1 (step). S214). Further, if there is an image that does not shine in the defect candidate 1, it is determined that the defect is a scratch (concave) (step S215). Such a similar determination is performed for other defect candidate images.

  Here, the defect candidate image k will be described. In the specific determination in the defect candidate image k, as shown in step S2k2, the logical product of the defect candidate image k and the sorting result image 1 is obtained and set to Ins-Image1. Subsequently, the logical product of the defect candidate image k and the sorting result image 2 is obtained as Ins-Image2. This is sequentially performed, and the logical product of the defect candidate image k and the sorting result image n is obtained as Ins-Imagen.

  Next, it is determined whether or not there is a shining portion in all the images of Ins-Image1 to Ins-Imagen (step S2k3). At this time, for example, if the defect candidate k is shining in all the images of Ins-Image1 to Ins-Imagen, it is determined that the defect candidate k is a foreign substance (convex) (step S2k4). If there is an image that does not shine in the defect candidate k, it is determined as a scratch (concave) as surrounded by an ellipse in the figure (step S2k5).

  Subsequently, in order to make it easier to understand the inspection method for determining foreign matter and scratch marks described above, two sets of two oblique illumination units facing each other are prepared, and each set of oblique illumination units is inspected. A method for discriminating and checking foreign matter and scratch marks in the case where the object is arranged so as to be shifted by 90 degrees in the circumferential direction will be described as a present embodiment.

  At this time, the inspection object is a pad used for wire bonding or the like on the semiconductor chip. In addition, the pad in this case is a pad for taking out an electrical signal from the surface on the micro pressure sensor or flow sensor formed in the semiconductor chip, for example. And probe traces (scratch traces) generated when a measurement test such as the resistance value of the sensor through this pad is performed, and slight dust and dirt in the clean room, which have adhered to the pad until this inspection process It is assumed that a foreign object is discriminated.

  In the case of the present embodiment, the width of the recessed portion forming the probe mark (scratch mark in the figure) is 1 μm or less, and the foreign matter has a diameter of about 20 μm. The foreign matter in this case is a very fine foreign matter having a diameter of about 20 μm due to dust or dust in the clean room, but the pad itself is also very small, and such foreign matter adheres to the pad. If so, it will have an adverse effect during wire bonding and must be removed.

  The reason why the probe marks are elongated as scratch marks is due to the mechanical backlash of the mechanism that makes the probe marks contact with or separate from the pad. For example, when the probe marks are pulled away from the pad, the probe marks The tip of the mark is generated by moving away from the upper surface of the pad in a specific direction by the mechanical play described above, and does not adversely affect the function of the pad itself.

  However, since the probe mark is a very small scratch on the pad, when an unfamiliar worker inspects it, an inspection conforming semiconductor chip that originally had only the probe mark attached to the pad is not compatible with an inspection nonconforming product in which foreign matter has adhered to the pad. Although it may be erroneously determined as a pad of a semiconductor chip, this can be eliminated in the present invention.

  FIG. 6 shows a case where foreign matter adheres to the pad (FIG. 6A), a case where probe marks are generated in the vertical direction (Y-axis direction) (FIG. 6B), and a horizontal direction in the figure. When probe marks are generated in the (X-axis direction) (FIG. 6C), as shown in the corresponding diagram in the upper part of FIG. 6, the oblique light of the oblique illumination device facing from the lateral direction in FIG. 8 shows how light is reflected when it hits a probe mark (corresponding diagram in each middle stage in FIG. 6) and an imaging result (corresponding diagram in each lower stage in FIG. 6) captured by the imaging device.

  In this automatic inspection process, the acquired image is binarized, and inspection objects such as foreign matters and probe traces are indicated by white areas on the image, and the other areas are black. At this time, a small white area that does not reach a predetermined area is canceled as a noise component to be a black area.

  FIG. 7 shows a case where foreign matter adheres to the pad (FIG. 7A), a case where probe marks are generated in the vertical direction in the figure (FIG. 7B), and a case where probe marks are generated in the horizontal direction in the figure. In the case (FIG. 7C) (refer to the corresponding diagram in each upper stage in FIG. 7), the reflection of light when the oblique light of the oblique illumination device facing from the vertical direction in the figure is applied to these foreign matters or probe traces. A method (corresponding diagram in each middle stage in FIG. 7) and an imaging result (corresponding diagram in each lower stage in FIG. 6) captured by the imaging apparatus are shown.

  As is clear from these figures, the shape of the foreign matter is captured as it is regardless of whether the foreign matter is irradiated obliquely from the horizontal direction (X-axis direction) or obliquely from the vertical direction (Y-axis direction). I understand that. On the other hand, for the probe trace, the shape of the probe trace is imaged as it is only in the case of oblique light entering from the direction orthogonal to the longitudinal direction of the probe trace, and the oblique light entering from the direction parallel to the longitudinal direction of the probe trace is captured. In this case, it can be seen that the probe trace shape is not imaged at all.

  From the above, it can be seen that when these foreign objects and probe marks are simultaneously irradiated with oblique light from the horizontal direction and the vertical direction, the shapes of both the probe marks and the probe marks are imaged, respectively (FIG. 8). reference).

  FIG. 8 shows a case where the above-mentioned foreign matter adheres to an elongated rectangular pad, and a probe mark whose longitudinal direction is the longitudinal direction in the figure and a probe mark whose longitudinal direction is the lateral direction in the figure are generated. Are shown at the same time for convenience of explanation (see FIG. 8A). In this case, the horizontal direction (X-axis direction) and the vertical direction (Y-axis direction) as shown in FIG. As shown in FIG. 8 (b), the light reflection based on the oblique light simultaneously occurs with respect to the probe mark, and the shape of both the probe trace and the foreign matter as shown in FIG. Imaged. This corresponds to steps S120 to S140 in the flowchart described above.

  FIG. 9 is a diagram corresponding to FIG. 8 and shows an imaged result on the land when oblique light is irradiated in the horizontal direction (X-axis direction) in FIG. 9 as shown in FIG. As can be seen from the imaging result, only the foreign matter and the vertically long probe mark whose longitudinal direction is perpendicular to the oblique light direction are imaged (see FIG. 9C). This corresponds to steps S160 and S170 when n = 2 in the flowchart described above.

  FIG. 10 is also a diagram corresponding to FIG. 8 and shows the imaging result on the land when oblique light is irradiated in the vertical direction in FIG. 10 as shown in FIG. As can be seen from the imaging result, only the foreign object and the laterally long probe mark whose longitudinal direction is perpendicular to the oblique light direction are imaged (see FIG. 10C). This also corresponds to steps S160 and S170 when n = 2 in the flowchart described above.

  11 shows the imaging results obtained in the explanation of FIG. 8 (FIGS. 8C and 11A) and the imaging results obtained in the explanation of FIG. 9 (FIGS. 9C and 11B). )) And an image processing result (FIG. 11C) obtained by taking the logical product (AND) of both of the imaging results.

  12 shows the imaging results obtained in the explanation of FIG. 8 (FIGS. 8C and 12A) and the imaging results obtained in the explanation of FIG. 10 (FIGS. 10C and 12B). )) And an image processing result (FIG. 12C) obtained by taking the logical product (AND) of both of the imaging results. This corresponds to step S212 and step S2k2 when n = 2 and k = 3 in the above-described flowchart.

  FIG. 13 compares the image processing result shown in FIG. 11C (FIG. 13A) with the image processing result shown in FIG. 12C (FIG. 13B). A process is shown in which the displayed white area is determined as a foreign object, and the white area shown only on one side is canceled as a probe mark. In this determination, the logical product of the image processing result shown in FIG. 13A and the image processing result shown in FIG. 13B is calculated, and a further image processing result as shown in FIG. 13C is obtained. The white area is determined as a foreign object. This corresponds to step S213 and step S2k3 when n = 2 and k = 3 in the above-described flowchart.

  Thus, by finally displaying only the foreign matter as a white area, it is possible to discover the presence of the foreign matter and the probe trace on the pad and to distinguish between them, and as a result, only the probe trace is displayed on the pad. It can be determined that the sensor with the mark remains as an inspection conforming product, and a sensor in which foreign matter adheres to the pad in addition to the probe mark can be determined as an inspection nonconforming product.

  As described above, the present invention that irradiates oblique light that is opposed from two different directions can solve the disadvantage that the conventional inspection apparatus that irradiates oblique light from different one-side directions and detects the shadow thereof is insufficient. it can. That is, the present invention is characterized in that a foreign object and a probe mark are discriminated based on a fundamentally different principle from the conventional technique of detecting a foreign object by irradiating oblique light from only one side and measuring a shadow. It can be said. As a result, it is possible to distinguish between foreign matters adhering to the object to be inspected and probe marks generated on the object to be inspected and those caused by noise.

  In the above description, the oblique illumination devices are arranged in two sets in two directions, the horizontal direction (above the X axis) and the vertical direction (above the Y axis). A pair of oblique illumination devices is prepared, and this oblique illumination device can be rotated 90 degrees around the object to be inspected so that the object to be inspected is imaged by irradiating oblique light from the X-axis direction and the Y-axis direction, respectively. May be.

  Also, instead of rotating the oblique illumination device by 90 degrees, a set of oblique illumination devices is fixed and the inspection table on which the object to be inspected is rotated by 90 degrees, resulting in irradiation with oblique light from the X-axis direction. Thus, an image of the object to be inspected may be obtained, and an image of the object to be inspected that is irradiated with oblique light from the Y-axis direction that makes an angle different from the circumferential direction by 90 degrees may be obtained.

  Further, as shown in the flowcharts of the inspection routines of FIGS. 3 to 5 described above, a set of oblique illumination devices can be stopped n times around the object to be inspected by a predetermined angle, and oblique light is irradiated from each of the n directions. You may make it image.

  Further, only one set of oblique illumination devices is arranged around the object to be inspected so that the inspection table on which the object to be inspected is placed can be stopped n times by a predetermined angle, and images are obtained by irradiating oblique light from the n direction. You may do it.

  Further, in the present invention, the step of irradiating oblique light from all directions by operating all of the plurality of sets of oblique illumination devices at the initial stage of the inspection process is not necessarily required. Specifically, it is not necessary to obliquely illuminate simultaneously from both the X-axis direction and the Y-axis direction described above at the beginning of the inspection process, but only from the image of the inspection object irradiated with oblique light from only the X-axis direction and only from the Y-axis direction. A logical product with the image of the object to be inspected irradiated with oblique light may be calculated, and the remaining white area in the processed image obtained by the logical product may be determined as a foreign object.

  However, in the first step of the inspection process, for example, by irradiating oblique light from both the X-axis direction and the Y-axis direction at the same time, it is possible to image a region that is not related to foreign matter or probe marks, such as the edge of the pad. It is possible to cancel this white area in the subsequent inspection process.

  Further, by obliquely illuminating the object to be inspected from all directions at the beginning of the inspection process, for example, the longitudinal direction of the probe mark can be specified. Thereby, the position of the oblique illumination device that is arranged oppositely and irradiates oblique light from two different directions can be positioned in a direction perpendicular to or parallel to the longitudinal direction of the probe mark. As a result, the probe mark can be erased by the logical product in the image processing stage, and can be prevented from being left as a white region determined as a foreign object.

  Specifically, when the above-described two sets of oblique illumination devices are arranged above the X-axis direction and above the Y-axis direction, respectively, the oblique illumination device or the inspection table on which the inspection object is placed can be rotated, In the first stage of the process, oblique light is irradiated simultaneously from the X-axis direction and the Y-axis direction by two sets of oblique illumination devices, and the longitudinal direction of the probe trace imaged at this stage is obtained by image processing. Then, the inspection table on which the oblique illumination device or the inspection target is placed is rotated so that one of the X-axis direction and the Y-axis direction of the oblique illumination device coincides with this longitudinal direction, and from each of the X-axis direction and the Y-axis direction. Irradiate oblique light separately. As a result, the probe mark can be erased by the logical product at the image processing stage defined in steps S213 and S2k3 (n = 2) in the flowchart of FIG. 5 described above, and is not left as a white region.

  In the above-described embodiment, oblique light is irradiated from two opposite directions. However, the present invention is not necessarily limited to irradiating oblique light from two strictly opposite directions. It is possible to obtain specific effects.

  In addition, the scope of application of the present invention is not limited to the use of inspection for acquiring data such as resistance values in the process of manufacturing a semiconductor device such as a pressure sensor or a flow sensor described above, but is caused by a handling error of an object to be inspected. It can also be applied to automatic visual inspection for distinguishing between scratches (concave defect) on the surface and foreign matters and deposits (convex protrusion).

It is a schematic block diagram of the discrimination | determination inspection apparatus with the foreign material which concerns on one Embodiment of this invention, and a crack trace. It is a whole processing routine explaining the discrimination | determination inspection method of the foreign material and scratch mark which concern on one Embodiment of this invention. It is a processing routine explaining the imaging and extraction process in FIG. It is a processing routine explaining the automatic inspection A and the automatic inspection B in FIG. It is a processing routine explaining the determination process in FIG. It is explanatory drawing explaining easily the discrimination | determination inspection method of the foreign material and scratch mark which concerns on one Embodiment of this invention. It is a figure corresponding to FIG. 6, and is explanatory drawing which changed the irradiation direction of oblique light. The figure which shows the imaging result at the time of irradiating oblique light simultaneously from the vertical direction and horizontal direction in a figure in the state where a foreign object adheres to a pad which has an elongated rectangular shape, and a vertical probe mark and a horizontal probe mark are generated It is. FIG. 10 is a diagram corresponding to FIG. 8, and is a diagram illustrating an imaging result when only the oblique light from the lateral direction in the drawing is irradiated on the pad of FIG. 9. It is a figure corresponding to FIG. 8, and is a figure which shows the imaging result at the time of irradiating only the oblique light from the vertical direction in the figure on the pad of FIG. The imaging result (FIG. 11 (a)) obtained in the step shown in FIG. 8, the imaging result (FIG. 11 (b)) obtained in the step shown in FIG. 9, and the logical product (AND) of both of these imaging results. It is a figure which shows the image processing result (FIG.11 (c)) which took (). The imaging result obtained in the step shown in FIG. 8 (FIG. 12A), the imaging result obtained in the step shown in FIG. 10 (FIG. 12B), and the logical product (AND) of these imaging results. It is a figure which shows the image processing result (FIG.12 (c)) which took (). The image processing result shown in FIG. 11C (FIG. 13A), the image processing result shown in FIG. 12C (FIG. 13B), and the logical product ( It is a figure which shows the further image processing result (FIG.13 (c)) which took AND).

Explanation of symbols

10 (11, 12) Oblique illumination unit 13 Illumination power supply 20 Imaging unit 21 IC microscope 22 Camera such as CCD camera or C-MOS camera 30 Discrimination processing unit 31 Computer for imaging / image processing 32 Capture board 33 I / O port 50 Semiconductor sensor chip

Claims (7)

  1. An inspection apparatus for discriminating foreign objects and scratches based on imaging data of the device element surface,
    Oblique light illuminating means for simultaneously irradiating oblique light to the device element from two directions;
    Imaging means for detecting and imaging reflected light from the device element;
    An apparatus for discriminating and detecting foreign matter and scratch marks, comprising: a discrimination processing means for controlling each of the above means and digitally processing a captured image to discriminate between a foreign matter and a scratch mark.
  2.   The discrimination processing means includes both of the at least two imaging data from at least two imaging data obtained by changing the oblique light direction among the imaging data obtained by simultaneously irradiating the device element with oblique light from two directions. 2. The foreign object according to claim 1, wherein a foreign object having a predetermined luminance is determined as a foreign object, and one of the at least two pieces of imaging data having a predetermined luminance is determined as a scratch mark. And inspection device for scratch marks.
  3.   The discrimination inspection apparatus according to claim 1 or 2, wherein the oblique illumination unit irradiates oblique light simultaneously from two opposing directions.
  4.   4. The foreign matter and scratch mark discrimination inspection apparatus according to claim 1, wherein the scratch mark is a linear probe mark having a width of 1 [mu] m or less.
  5.   The discrimination | determination inspection apparatus of the foreign material in any one of Claims 1 thru | or 3 characterized by the above-mentioned.
  6. An inspection method for discriminating foreign objects and scratches based on imaging data of the device element surface,
    A first step of simultaneously irradiating the device element with oblique light from two directions;
    A second step of detecting and imaging reflected light from the device element;
    A method for discriminating between a foreign object and a scratch mark, comprising at least a third step of digitally processing the image captured in the second step to determine whether the image is a foreign object or a scratch mark.
  7. In the second step, after obtaining at least two imaging data obtained by changing the oblique light direction among the imaging data obtained by simultaneously irradiating the device element with oblique light from two directions, the third element In the step, both the at least two imaging data having a predetermined luminance are determined as foreign matters, and only one of the at least two imaging data having a predetermined luminance is determined as a scratch mark. The distinctive inspection method for foreign matter and scratch marks according to claim 6, wherein

JP2008317233A 2008-12-12 2008-12-12 Method for discriminating and checking foreign matter and scratch marks in semiconductor device manufacturing process Expired - Fee Related JP5622338B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008317233A JP5622338B2 (en) 2008-12-12 2008-12-12 Method for discriminating and checking foreign matter and scratch marks in semiconductor device manufacturing process

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008317233A JP5622338B2 (en) 2008-12-12 2008-12-12 Method for discriminating and checking foreign matter and scratch marks in semiconductor device manufacturing process

Publications (2)

Publication Number Publication Date
JP2010139434A true JP2010139434A (en) 2010-06-24
JP5622338B2 JP5622338B2 (en) 2014-11-12

Family

ID=42349688

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008317233A Expired - Fee Related JP5622338B2 (en) 2008-12-12 2008-12-12 Method for discriminating and checking foreign matter and scratch marks in semiconductor device manufacturing process

Country Status (1)

Country Link
JP (1) JP5622338B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014517914A (en) * 2011-04-18 2014-07-24 イスメカ セミコンダクター ホールディング エス アーIsmeca Semiconductor Holding Sa Inspection device
WO2016035381A1 (en) * 2014-09-05 2016-03-10 株式会社Screenホールディングス Inspection device and inspection method
US10705029B2 (en) 2014-09-05 2020-07-07 SCREEN Holdings Co., Ltd. Inspection apparatus and inspection method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07103905A (en) * 1993-10-07 1995-04-21 Toyo Commun Equip Co Ltd Flaw inspecting equipment
JP2003240730A (en) * 2002-02-15 2003-08-27 Hitachi Electronics Eng Co Ltd Semiconductor chip examining apparatus
JP2007199066A (en) * 2006-01-26 2007-08-09 Orbotech Ltd System and method for inspecting patternized device with micro conductor
JP2008251975A (en) * 2007-03-30 2008-10-16 Toray Eng Co Ltd Visual inspection method for object being inspected, and equipment provided with the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07103905A (en) * 1993-10-07 1995-04-21 Toyo Commun Equip Co Ltd Flaw inspecting equipment
JP2003240730A (en) * 2002-02-15 2003-08-27 Hitachi Electronics Eng Co Ltd Semiconductor chip examining apparatus
JP2007199066A (en) * 2006-01-26 2007-08-09 Orbotech Ltd System and method for inspecting patternized device with micro conductor
JP2008251975A (en) * 2007-03-30 2008-10-16 Toray Eng Co Ltd Visual inspection method for object being inspected, and equipment provided with the same

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014517914A (en) * 2011-04-18 2014-07-24 イスメカ セミコンダクター ホールディング エス アーIsmeca Semiconductor Holding Sa Inspection device
WO2016035381A1 (en) * 2014-09-05 2016-03-10 株式会社Screenホールディングス Inspection device and inspection method
JP2016057075A (en) * 2014-09-05 2016-04-21 株式会社Screenホールディングス Inspection device and inspection method
EP3190401A4 (en) * 2014-09-05 2018-05-09 SCREEN Holdings Co., Ltd. Inspection device and inspection method
US10705029B2 (en) 2014-09-05 2020-07-07 SCREEN Holdings Co., Ltd. Inspection apparatus and inspection method

Also Published As

Publication number Publication date
JP5622338B2 (en) 2014-11-12

Similar Documents

Publication Publication Date Title
US8559000B2 (en) Method of inspecting a semiconductor device and an apparatus thereof
TW583389B (en) A surface conduction examination method and a substrate examination device
EP0501683B1 (en) Technique for enhanced two-dimensional imaging
US6198529B1 (en) Automated inspection system for metallic surfaces
US7505619B2 (en) System and method for conducting adaptive fourier filtering to detect defects in dense logic areas of an inspection surface
TWI512865B (en) Wafer edge inspection
JP3051279B2 (en) Bump appearance inspection method and bump appearance inspection device
US6710868B2 (en) Optical inspection system with dual detection heads
US20020186878A1 (en) System and method for multiple image analysis
TWI247123B (en) System and method for inspecting electrical circuits utilizing reflective and fluorescent imagery
JP5520434B2 (en) System and method for inspecting patterned devices with fine conductors
US8179524B2 (en) Hard disk inspection apparatus
US5862973A (en) Method for inspecting solder paste in printed circuit board manufacture
JP2010197367A (en) Detection apparatus for particle on glass and detection method using the same
EP1277042B1 (en) Directional lighting and method to distinguish three dimensional information
KR101078781B1 (en) Method of inspecting a three dimensional shape
JP2004012325A (en) Method and apparatus for inspection of defect
JP2010025713A (en) Flaw inspection method and flaw inspection device
KR101249619B1 (en) Method and apparatus for examining a semiconductor wafer
JPWO2008139735A1 (en) Surface inspection apparatus and surface inspection method
JP3709426B2 (en) Surface defect detection method and surface defect detection apparatus
KR20070040722A (en) Substrate inspection apparatus
KR100442071B1 (en) Nondestructive inspection method and an apparatus thereof
JP2007010620A (en) Screw part inspection device and screw part test method
KR101146081B1 (en) Detection of macro-defects using micro-inspection inputs

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20110928

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20121116

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20121221

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130218

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20130924

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20140424

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20140507

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20140829

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20140920

R150 Certificate of patent or registration of utility model

Ref document number: 5622338

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

LAPS Cancellation because of no payment of annual fees