JP2010135357A - Front and back reversing apparatus and test handler including the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a front and back reversing apparatus for a device, which can be installed in a small space and can flexibly processing in response to necessity/unnecessity of reversing of the device. <P>SOLUTION: The front and back reversing apparatus 1 includes a mounting part 2 to reverse the device D by clamping and turning it, a timing pulley 4 attached to the mounting part 2 to turn the mounting part 2, a motor M which gives a turning force to the timing pulley 4 through a timing belt 5 and a pulley 6, a casing 3 rotatably supporting the outer circumference of the mounting part 2, a support part 7 supporting the casing 3, motor M and pulley 6, and a pedestal 8 supporting the whole of the apparatus 1 and serving as the junction part with a test handler H. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a device for reversing the surface of a device such as a semiconductor device. Specifically, the semiconductor device is individually separated from a lead frame, a tray, and an adhesive sheet on which a plurality of semiconductor devices are mounted, and a characteristic test and packaging are performed. In the apparatus constituting one step of the test handler for performing the (taping) process, the means for inverting the separated individual semiconductor device is improved.

  The semiconductor device that has undergone each assembly process of dicing, mounting, bonding, and sealing is supplied to a composite processing device called a test handler. And each process such as external electrode cutting and processing, electrical property measurement, classification, marking, appearance inspection, packing (tape packing) while being picked up and held by the holding mechanism provided in the test handler and transported in the test handler Processing is performed.

  As a device to be inspected in such a test handler, a semiconductor element such as a mini-mold transistor is raised. In such a device, a large number of electronic components are manufactured in a lump using strip-shaped lead frames, and these are divided into individual electronic components before shipment. In this case, in the test handler, after taking out the electronic component from the lead frame, it is typically transported using a rotary transport mechanism composed of a rotary table. After carrying out a series of processing required for shipping such as stamping, it is inserted into the packing tape. As an apparatus for performing the tape packing process, for example, apparatuses described in Patent Documents 1 and 2 are known.

  Recently, leadless semiconductor elements such as CSP (Chip Size Package) whose demand is increasing due to the spread of portable computers have been raised as devices to be inspected in test handlers. These devices are also shipped by tape packing according to quality rank after performing composite processing such as characteristic measurement and appearance inspection of leadless semiconductor elements that are individually divided in the brazing process.

  That is, in the brazing process of the leadless semiconductor element, each leadless semiconductor element is formed in a brazing saw in a state where a thin resin-molded substrate in which a plurality of leadless semiconductor elements are formed in series at a high density is adhered to a wafer sheet. Each of the leadless semiconductor elements subdivided into millimeter sizes in this process is sent to the test handler and finally taped and packed.

  In this case, the leadless semiconductor elements subdivided into millimeter sizes on the wafer sheet are peeled off from the wafer sheet one by one and aligned on the alignment tray. When necessary, the leadless semiconductor elements are tested one by one from the alignment tray. The leadless semiconductor elements are sent to a handler, or individual leadless semiconductor elements are gathered from a wafer sheet into a parts feeder, and the leadless semiconductor elements are aligned by the parts feeder when necessary and sent to a complex processing facility. As a manufacturing apparatus of a semiconductor device miniaturized to a millimeter size such as this leadless semiconductor element, the one described in Patent Document 3 is known.

  Here, in the test handler, the device is generally transported while being sucked and held by a holding mechanism and subjected to various process processes. In particular, in the electrical characteristic inspection, since the electrode of the device is brought into contact with the contact for electrical measurement, the holding mechanism holds the electrode in a direction opposite to the surface holding the electrode surface of the device.

However, when the device cut out from the wafer sheet described above is received by a test handler, or when a device that has been subjected to various process processes is packed by a tape packing device, generally when held by a holding mechanism. Conversely, the electrode surface of the device faces upward. Therefore, when the device is cut out from the wafer sheet and transferred to the test handler and when the device is tape-packed, it is necessary to reverse the device by some means. Therefore, conventionally, various front and back reversing devices for reversing devices have been proposed (for example, Patent Documents 4 and 5).
Japanese Patent No. 2667712 Japanese Patent No. 2531006 JP 2002-246448 A JP 2002-134844 A JP 2000-315697 A

  By the way, in the front / back reversing device of Patent Document 4, the electronic component mounting substrate is reversed by a reversing mechanism including a belt and an actuator, thereby reversing the front and back of the device held on the electronic component mounting substrate. However, since there is a stroke of the electronic component mounting board at the time of reversal, the position of the device before reversal and the position of the device after reversal are shifted by the stroke of the board. The reversal process could not be completed in one position of the handler.

  In addition, since the test handler generally uses a turntable and has processing points at each position obtained by dividing the turntable into 16 parts, it is relatively easy to secure the radial space of the turntable. However, there is not much room for tangential space. However, the front / back reversing device disclosed in Patent Document 4 described above requires a space in the tangential direction of the turntable when installed as one processing step of the turntable.

  On the other hand, in the front / back reversing device of Patent Document 5, the rotating member with a nozzle called a turner is used to receive the lower part and pass the upper part to the device holding mechanism to reverse the front and back of the device. When it is installed as one processing step on the test handler's turntable, the reversal processing can be completed at one position, and the tangential space of the turntable is not so necessary. However, the turner shown in Patent Document 5 is provided with suction nozzles on the four sides of the rotating body, and requires a vertical stroke. In this case, when installing, the Z axis that is the vertical movement direction of the holding mechanism Requires space in the direction.

  Furthermore, in any of the conventional techniques, the received device is always reversed when delivered. However, for example, when the device is separated from the wafer sheet as a means for supplying parts to the test handler, some wafer sheets are attached with the electrode surface facing downward. Can be inspected as it is in the test handler without inverting the front and back, and no inversion is required. Nevertheless, in the conventional front / back reversing device, it is not possible to select that the reversal is not performed, and in this case, there is a problem that the device itself needs to be changed and flexible processing cannot be performed. As described above, it has been desired to propose a means for deciding the necessity of reversal according to the type of device, supply mode, inspection purpose, inspection type such as appearance inspection and electrical characteristic inspection.

  The present invention has been proposed in order to solve the above-described problems of the prior art, and the object of the present invention is that it can be installed in a small space and can be processed promptly depending on the necessity of device reversal. An object of the present invention is to provide a device for inverting a device.

  In order to achieve the above object, the invention of claim 1 is a front / back reversing device that receives a device such as a semiconductor device or an electronic component, and sequentially transfers the device to a transport device that performs various process processes by reversing the front and back of the device. A first mounting unit that includes a stage for mounting the device, sandwiches and reverses the front and back of the device held by the stage, and delivers the device from one stage to the other; and a second mounting A rotation mechanism, a drive mechanism that rotates the first mounting unit, and the second mounting unit, and the first mounting unit and the second mounting unit. A cam that is displaced in the axial direction, and one of the first placement portion and the second placement portion is responsible for receiving the device to the transport device, and the other is for receiving the device to the transport device. The cam is configured to handle delivery, and the cam is a receiver or receiver. When one of the above-mentioned placement portions of the hand combination is in the receiving position or the delivery position, the first placement portion and the second placement portion are shifted from each other. In other cases, the first placement portion A cam curve is formed such that the placement portion and the second placement portion overlap each other.

  In the aspect as described above, two placement units each including a stage on which the device is placed are provided, the two placement units are rotated with the device sandwiched therebetween, and the device is inverted, By using one for receiving the device to the transport device and the other for delivery, the device can be reversed only by rotating the two placement units. At the time of reversal, for example, a stroke in the tangential direction of the turntable is not necessary, so that it can be incorporated as one process step of the test handler. At the same time, a space tangential to the turntable is not required, the apparatus can be arranged in the radial direction of the turntable, and no vertical stroke, which is the operating direction of the suction nozzle of the turntable, is required.

  Furthermore, it is not a mechanism that always reverses the received device as in the prior art, and if it is determined whether or not the mounting portion is to be rotated, the device is directly transferred to the suction nozzle without being reversed. It is possible. Thus, for example, when a device is separated from a wafer sheet as a means for supplying parts to a test handler, depending on the wafer sheet, a device attached with the electrode surface down may be used. Even if it exists, it will be possible to pass to the next process without inverting the front and back. In this way, flexible processing can be realized by means for deciding the necessity of reversal according to the type of device, supply mode, inspection purpose, inspection type such as appearance inspection and electrical characteristic inspection.

  Further, the means for inverting the device is composed of two parts, a first placement part and a second placement part, and these are moved by the cam so as to be displaced in the direction of the rotation axis. Even if the device stands up and is delivered to the stage of the placement unit due to an error in receiving from the suction nozzle of the device or a holding failure at the suction nozzle, for example, it is different from the received placement unit. When the mounting parts overlap, the device can be displaced at the tip of another mounting part. Therefore, even in such a case, there is little possibility of causing an error that affects the entire processing of the test handler, such as stopping the apparatus.

  According to a second aspect of the present invention, in the first aspect of the present invention, the stage is provided with suction holding means that can control vacuum suction and vacuum break, and suck and hold a device on the stage. Of the first placement unit and the second placement unit, when the device is received from the transfer device, the placement unit serving as a device receiving device is vacuum-sucked, and the placement unit on the other side is vacuum broken. In the delivery of the device from one placement unit to the other placement unit, the vacuum suction and the vacuum break are interchanged, and the device delivery device is placed in the delivery of the device to the transfer device. The part is made to be vacuum suction, and the mounting part on the other side is made to be a vacuum break.

  In the above-described aspect, by holding the device on the stage by suction holding means, the device can be securely held on the stage even if the mounting portion rotates, and the device is dropped. There is nothing. In addition, the vacuum holding and the vacuum break are switched according to the processing by the suction holding means, so that the device is transferred from the first placement portion to the second placement portion as the placement portion rotates. The operation can be performed reliably.

  According to a third aspect of the present invention, in the first or second aspect of the invention, the first placement portion and the second placement portion are rod-shaped bodies, and are provided on the outer periphery of the two placement portions. A single timing pulley is configured to rotate in synchronism.

  In the aspect as described above, the first placement portion and the second placement portion can be formed of a rod-like body, and these two placement portions can be rotated by the timing pulley. The two placement units can be controlled to rotate in synchronization.

  According to a fourth aspect of the present invention, in the second aspect of the invention, the first placement portion and the second placement portion are rod-shaped bodies having a semicircular cross section, and the two placement portions are semi-circular. The first mounting portion and the second mounting portion are covered with a casing that rotatably holds the periphery, and is configured as a columnar shape by being combined at a diameter portion of a circle. A flow path through which air for adsorbing and holding the device on the stage passes is formed between the first mounting section, the second mounting section, and the housing. It consists of an air hole provided in the casing, and a groove provided on a peripheral surface of the first placement portion and the second placement portion.

  In the aspect as described above, the air flow path is provided between the mounting part and the housing, and the air flow path is provided along with the rotation of the mounting part due to the way of providing the groove in the mounting part. It is possible to control opening and closing. That is, since the rotation of the mounting portion and the opening and closing of the air flow path can be performed only by the rotation control of the mounting portion, the overall apparatus configuration can be simplified.

  According to a fifth aspect of the present invention, in the fourth aspect of the present invention, the groove is provided so as to face a range of approximately 120 ° on the circumferential surface of the first mounting portion and the second mounting portion. The air holes face each other in a range of approximately 60 ° on the circumferential surface of the first placement portion and the second placement portion from one end portion to the other end portion. Provided, and the groove and the air hole overlap to form the flow path, and the vacuum at the time of delivery of the device from the one placement portion to the other placement portion. The groove and the air hole are configured not to overlap each other when the suction and the vacuum break are replaced.

  In the above aspect, the grooves are provided so as to face each other in a range of approximately 120 ° on the peripheral surfaces of the first placement portion and the second placement portion, and the air holes are provided from one end to the other end. Up to the first and second mounting portions facing each other in a range of approximately 60 ° on the circumferential surface of the first mounting portion and the second mounting portion, and the flow path is formed by overlapping the grooves and air holes. By doing so, it is possible to hold the suction at any of the mounting parts without interruption, except when the vacuum suction and the vacuum break are replaced when the device is transferred from one mounting part to the other mounting part. In addition, the vacuum suction and the vacuum break can be exchanged smoothly.

  In addition, when the device is transferred from one mounting unit to the other mounting unit, it is configured so that the groove and the air hole do not overlap when the vacuum suction and the vacuum break are replaced. The device can be delivered smoothly between the first placement unit and the second placement unit.

A sixth aspect of the invention is characterized in that the front / back reversing device according to the first to fifth aspects is included as a one-step processing device for a test handler.
In the above aspect, by incorporating the above-described front / back reversing apparatus as a one-step processing apparatus for a test handler, for example, when a device received from a wafer ring is reversed for visual inspection or electrical inspection, This process can be executed only by the position. In addition, it is not a mechanism that always reverses the received device as in the past, but if it is determined whether or not to rotate the mounting portion, the device is transferred directly to the suction nozzle without being reversed. For example, even if the device supply to the test handler is changed from a wafer ring type to a part feeder type or the like that does not require device reversal, it can be used as it is. Depending on the type of device, inspection purpose, inspection type such as appearance inspection and electrical characteristic inspection, it is possible to respond flexibly and realize flexible processing.

  ADVANTAGE OF THE INVENTION According to this invention, the front-and-back inversion apparatus of the device which can be installed in a small space and can be processed according to the necessity of the inversion of a device can be provided.

  Next, the best mode for carrying out the present invention (hereinafter referred to as the present embodiment) will be described with reference to FIGS.

[1. This embodiment]
[1-1. Constitution]
(1) Configuration of Front / Back Reversing Device in Test Handler First, the overall configuration of a test handler including the device front / back reversing device in the present embodiment as a one-process processing device will be described with reference to FIG.

  In the present embodiment, an example will be described in which a device D front / back reversing device for reversing a device D such as a semiconductor device or an electronic component is incorporated as a process processing device of one test handler. As shown in FIG. 1, the front / back reversing device 1 of this embodiment is a process processing apparatus provided on the same circumference of a test handler H that performs various process processes on a device D such as a semiconductor device or an electronic component. For example, it is provided at a position 3 on the downstream side of the wafer ring and a position 13 on the upstream side of the taping device so as to form a part.

  More specifically, the devices D cut into individual pieces from the wafer ring are aligned and conveyed via the linear feeder. The device D is picked up at a position 1 by a plurality of suction holding mechanisms (here, 16 pieces at intervals of 22.5 degrees) provided on the same circumference so as to extend below the turntable T. The turntable T rotates intermittently in the clockwise direction in the figure.

  Here, in general, in the wafer ring, since the device D is provided with the electrode surface facing upward, at the position 1, the electrode surface of the device D is as shown in FIG. Then, the pickup is picked up while facing upward (at the suction surface side of the suction holding mechanism).

  However, for example, in the subsequent appearance inspection at the position 5, in order to inspect the electrode shape of the device D, surface defects, scratches, dirt, foreign matter, etc., the image is taken by the camera from below the turntable. The surface is preferably held by the suction holding mechanism with the surface facing downward (the side opposite to the suction surface of the suction holding mechanism). Also, in the electrical property inspection at the position 6, since the contact as a contact is brought into contact with the electrode of the device D and the conduction state of current and voltage is inspected, the electrode surface is also directed downward. It is preferably held by an adsorption holding mechanism. On the other hand, at the time of taping packing, which is the final process of the test handler H, it is necessary to insert the device D into the tape stage with the electrode of the device D facing upward (the suction surface side of the suction holding mechanism).

  Therefore, in the position 3 before the appearance inspection and the electrical characteristic inspection, the front and back of the device D with the electrode surface facing upward are reversed so that the electrode surface is kept facing downward, and the taping packaging. In the position 13 before performing, the front and back of the device D with the electrode surface facing downward are reversed so that the electrode surface is maintained facing upward.

  Specifically, the flow of processing in the test handler H will be described in order. The device D picked up at the position 1 is picked up by the camera at the position 2, and the front and back of the device D picked up at the position 1, the direction of the electrodes, etc. Is determined.

  Next, at the position 3, based on the front and back of the device D determined at the position 2, when the electrode surface faces upward, which is the suction surface side of the suction holding mechanism, Turn device D upside down. Further, at the position 4, the horizontal direction correction is performed based on information such as the positive / negative direction of the electrode of the device D determined at the position 2.

  At the position 5, the polarity of the electrode of the device D is checked by an appearance camera or the like, and at the position 6, the result of the appearance inspection at the position 5 is received, and the suction holding mechanism is in the Z-axis direction which is the vertical direction in FIG. The electrical characteristics are inspected by performing a machining operation and bringing the contacts into contact with the electrodes of the device D.

  After the electrical characteristic inspection, a stamping process is performed at a position 7 and an image inspection is performed at a position 8 to inspect a resin mold defect or an electrode defect. Then, based on the result of the image inspection, the device D that has failed or the device D that could not be identified is classified at positions 10 to 12, and is put into a box or the like without taping.

  On the other hand, tapes that have been determined to be non-defective by image inspection at position 8 are taped and packed at positions 14 and 15. As described above, in taping packing, it is necessary to insert the device D on the tape stage with the electrode facing upward (at the suction surface side of the suction holding mechanism). And the front and back of the device D with the electrode surface facing downward are reversed so that the electrode surface is maintained facing upward. Then, at positions 14 and 15, the device D held with the electrode surface facing upward is inserted into a tape stage placed on the taping apparatus, taped and packed, and the processing in the test handler is completed.

  The overall configuration of the test handler H of the present embodiment, in particular, the arrangement of the process processing apparatus and the process steps at each position is merely an example, and the order is appropriately determined according to the product specifications, the purpose of the user, and the like. The process itself is replaced or changed, and is not an essential component in the present invention. For example, in this embodiment, since the wafer ring is delivered to the linear feeder and then directly delivered to the suction nozzle N of the test handler H, the front / back reversing device 1 is disposed at the position 3 to reverse the front and back of the device. However, when adopting a configuration in which the device is reversed from the wafer ring without passing through the linear feeder and then transferred to the suction nozzle N of the test handler H, the front / back reversing device 1 is disposed at the position 3. There is no need.

(2) Configuration of Front / Back Reversing Device (2-1) Overall Configuration Next, the configuration of the front / back reversing device 1 used as a one-step processing apparatus for the test handler H will be described with reference to FIGS.

  As shown in FIG. 2, the front / back reversing device 1 includes a placement unit 2 that is reversed by sandwiching and rotating the device D, and a timing pulley 4 that is attached to the placement unit 2 and rotates the placement unit 2. A motor M that applies a rotational force to the timing pulley 4 via the timing belt 5 and the pulley 6, a housing 3 that rotatably supports the outer peripheral portion of the mounting portion 2, and the housing 3 and the motor. M and the support part 7 which supports the pulley 6, and the base 8 which supports the whole apparatus 1 and becomes a connection part with the test handler H are comprised.

  The front / back reversing device 1 according to the present embodiment is characterized by the configuration of the mounting unit 2, and the configuration of rotating the other mounting unit 2 and the configuration of supporting the device using known means, etc. Depending on the situation, it can be appropriately changed and implemented. Therefore, the configuration of the placement unit 2 will be described in detail below.

  The mounting unit 2 includes a first mounting unit 21 and a second mounting unit 22 that sandwich and reverse the device D, and the first and second mounting units 21 and 22 of the timing pulley 4. A cam 23 is provided that moves in the Y direction in the figure, which is the radial direction of the turntable T, with the rotation. Since the first placement unit 21 and the second placement unit 22 have exactly the same configuration, the following description will be made without any particular distinction.

  Both the first placement portion 21 and the second placement portion 22 are rod-like bodies having a semicircular cross section, and the two placement portions are combined at a semicircular diameter portion to form a columnar shape. . Stages 21 a and 22 a for placing the device D are provided at one end of the first placement portion 21 and the second placement portion 22, and the cam 23 is abutted at the other end portion. , Cam contact rollers 21c and 22c for moving the first placement portion 21 and the second placement portion 22 in the axial direction of the cylinder are provided.

  In the first placement unit 21 and the second placement unit 22, the first placement unit 21 is positioned on the lower side and the second placement unit 22 is positioned on the upper side. The first mounting unit 21 receives the device D from the suction nozzle N to the stage 21a, and after receiving the device D, the first mounting unit 21 and the second mounting unit rotate, so that the first mounting unit 21 rotates. The device D is transferred from the stage 21 a of the mounting unit 21 to the stage 22 a of the second mounting unit 22.

  The stages 21a and 22a are provided with suction holes 21b and 22b for the mounted device D, and are connected to a vacuum suction device via the manifolds 30a and 30b. In the suction holes 21b and 22b, as will be described later, vacuum suction and release to the atmosphere are repeated as the first placement portion 21 and the second placement portion 22 rotate.

(2-2) Configuration for Realizing Vacuum Adsorption and Release to the Air A configuration for realizing vacuum adsorption and release to the atmosphere will be described. The first mounting unit 21 and the second mounting unit 22 rotate the device 180 degrees to transfer the device D from one mounting unit to the other mounting unit. (1) Adsorption nozzle N Receiving device D from (2) 90 ° rotation, (3) delivery of device D between first mounting portion 21 and second mounting portion 22, (4) 90 ° rotation, ( 5) Transition is made to the five scenes of delivery of the device D to the suction nozzle N. Among these, the vacuum suction of the stages 21a and 22a is not performed between the time when the device D of (1) is received, the time of rotation of (2) and (4), and the time of delivery of the device D of (5). It is configured to be turned on, and is configured to be opened to the atmosphere only when the device D is delivered between the first mounting unit 21 and the second mounting unit 22 in (3).

  The configuration of the vacuum suction line that realizes such intermittent ON / OFF will be described with reference to FIG. FIG. 3A is a plan view illustrating the configuration of the placement unit 2, the housing 3, and the cam 23, and FIG. 3B is a side view illustrating the configuration of the placement unit 2, the housing 3, and the cam 23. (C) is the side view which extracted only the mounting part 2. FIG.

  As shown in FIG. 2B, the placement unit 2 is covered with a hatched casing 3 in the center thereof, and the stage of the placement unit 2 is the end of the casing 3. Manifolds 30a and 30b are provided at the ends located on the side of 21a and 22a, and the tips of the manifolds 30a and 30b are connected to the first mounting part 21 and the second mounting part 22, respectively. . And the structure of the mounting part 2 and the housing | casing 3 implement | achieves on-off of the vacuum suction mentioned above, and it is the manifold D of the device D from the suction holes 21b and 22b of the stages 21a and 22a via the manifolds 30a and 30b. The adsorption is switched on and off.

  Specifically, as indicated by an arrow in FIG. 5B, the first mounting portion 21, the second mounting portion 22, and the housing 3 are formed from the air holes 31a and 31b provided in the housing 3. In order to realize this, a groove is provided in a certain range in the first mounting portion 21 and the second mounting portion 22, and this groove and the housing Channels 21 d and 22 d are formed between The range of the flow paths 21d and 22d with respect to the axial direction of the mounting portion 2 is from the position of the air holes 31a and 31b to the position of the manifolds 30a and 30b.

  When viewed from the front side, as shown in FIG. 4A, in the state where the first placement portion 21 is located on the lower side and the second placement portion 22 is located on the upper side, the housing 3 Are provided with two air holes 31a and 31b in the vertical direction with the mounting portion 2 interposed therebetween. As for this air hole 31a, the upper part in the figure serves as an air release line, and the lower part in the figure serves as a vacuum drawing line. This is because the lower air hole 31b serves as an adsorption line for the stage 21a in the placing portion 2 (in this case, the first placing portion 21) located on the lower side. Is a suction line that holds the device D and needs to be sucked. On the other hand, the upper air hole 31a is a line to which the stage 21 is adsorbed in the placement unit 2 (in this case, the second placement unit 22) positioned on the upper side, so that it is not necessary to vacuum and open to the atmosphere. It is what is in line.

  As shown in FIG. 4A, the flow path 21d and the flow path 22d are provided in a range of 120 ° on the circumference of the first placement portion 21 and the second placement portion 22, and FIG. ), The first placement unit 21 and the second placement unit 22 are in a state where the first placement unit 21 is located on the lower side and the second placement unit 22 is located on the upper side. It is provided at a position shifted by 60 ° on the left side in the figure, which is the rotation direction. In the state shown in FIG. 4A, the air holes 31a and 31b and the flow paths 21d and 22d overlap each other and are connected to each other. The stage 21a of the placement unit 21 is in a vacuum suction state, and the stage 22a of the second placement unit 22 is in an air release state.

  As shown in FIGS. 4A to 4C, the placement portion 2 is moved to the left from the state where the first placement portion 21 is located on the lower side and the second placement portion 22 is located on the upper side. By rotating 60 °, the state of FIG. 4 (a) is changed to the state of (b), and the ranges of the air holes 31a, 31b and the flow paths 21d, 22d do not overlap and are not connected to each other. In this case, the stage 21a of the first mounting unit 21 and the stage 22a of the second mounting unit 22 are not in a vacuum suction state, and are placed on the stage 21a. Device D is in a free state.

  Next, when it is rotated 60 ° to the state shown in FIG. 4C, this time, the ranges of the air holes 31a and 31b and the flow paths 21d and 22d are overlapped and connected to each other. In this case, the stage 21a of the first placement unit 21 is open to the atmosphere, and the stage 22a of the second placement unit 22 is in a vacuum suction state. Therefore, in the device D that is in a free state between the stage 21a of the first placement unit 21 and the stage 22a of the second placement unit 22, the stage 22a of the second placement unit 22 is vacuumed. By being in the attracted state, it is attracted to the stage 22a side, whereby the device D is delivered from the stage 21a to the stage 22a.

  The air holes 31a and 31b are each set to have a range of about 60 ° up and down with respect to the circular shape of the mounting portion 2 as shown in the figure. Here, the two air holes 31a and 31b are provided in the housing 3 at the top and bottom. When the two thin holes are provided, for example, as shown in FIG. This is because it is easier to process the housing 3 than to provide one thick hole. Also, if the ranges of the air holes 31a and 31b and the flow paths 21d and 22d do not overlap and are connected to each other, they can be adsorbed or released into the atmosphere. This is because it is possible to construct the two thin holes at positions corresponding to both ends in the range of 60 ° in the same manner as described above, but the substantial effect can be configured by an easy processing operation.

  Further, the reason that the air holes 31a and 31b are in the range of 60 ° and the flow paths 21d and 22d are in the range of 120 ° is that the delivery between the mounting portions 2 of the device D as shown in FIG. At other timings, the device D is always vacuum-sucked and held on one stage in order to prevent the device D from falling or being moved.

(2-3) Configuration of axial movement of cam and mounting portion Next, a description will be given of a configuration in which the mounting portion 2 moves in the cylindrical axis direction of the mounting portion 2 by the action of the cam as the cam rotates. To do. The cam 23 is configured by a cam curve as shown in FIG. 5B, and as shown in a perspective image diagram in FIG. 5A, the donut-shaped circular cam 23 is 60 ° on the circumference. In this range, the stroke is 2 to 3 mm.

  As shown in FIG. 1 or FIG. 2, the cam 23 is installed so that the portion having the stroke of 2 to 3 mm is positioned on the lower side. Therefore, as shown in these drawings, in the state where the first placement portion 21 is located on the lower side and the second placement portion 22 is located on the upper side, the cam of the first placement portion 21 Since the contact roller 21c comes into contact with the stroke portion of the cam curve, the first mounting portion 21 is moved in the direction of the suction nozzle N of the turntable T, and the stage 21a is located immediately below the suction nozzle N. It is like that. On the other hand, in this case, since the cam contact roller 22c of the second mounting portion 22 is in contact with a portion of the cam curve where there is no stroke, the turntable is 2 to 3 mm longer than the protruding first mounting portion 21. T is located away from the suction nozzle N side.

  This will be described together with the rotation transition diagram of the placement unit 2 shown in FIG. 3. The first placement unit 21 in FIG. 3A is located on the lower side, and the second placement unit 22. Is located on the upper side, the lower first placement portion 21 protrudes toward the suction nozzle N on the near side in the drawing of 2 to 3 mm from the upper second placement portion 22. ing. Since the stroke range of the cam 23 is 60 ° left and right from the state shown in FIG. 10A, in the state rotated 60 ° from the state shown in FIG. Since both the cam contact roller 21c of the first placement portion 21 and the cam contact roller 22c of the second placement portion 22 are in contact with a position where there is no stroke of the cam 23, the stage of the first placement portion 21 21a and the stage of the second placement unit 22 are in a state of overlapping each other.

[1-2. Effect]
The effects of the front / back reversing device 1 of the present embodiment having the above-described configuration are as follows. As shown in FIG. 1, the device D picked up from the wafer ring and separated into individual pieces is held by the suction nozzle N of the turntable T, and various process processing devices installed at circumferentially equidistant positions. While being processed, it is conveyed to the front / back reversing device 1 provided at the position 3 or the position 13.

  Hereinafter, the device D front / back reversing process of the front / back reversing apparatus 1 at the position 13 will be described as an example. It should be noted that the front and back of the device D being transported are opposite at positions 3 and 13, that is, at the position 3, the electrode surface of the device D is transported upward, and at the position 13, the device D is transported. However, the other processing contents are the same.

  As shown in FIG. 7A, the suction nozzle N descends in the Z-axis direction, which is the vertical direction, at the position 13 to place the device D on the stage 21 a of the first placement unit 21. At this time, as shown in FIG. 4A, the ranges of the air holes 31a and 31b and the flow paths 21d and 22d overlap each other and are connected to each other. The stage 21a of the placement unit 21 is in a vacuum suction state, and the stage 22a of the second placement unit 22 is in an air release state. Therefore, when the device D is placed on the stage 21a by the suction nozzle N, the device D on the stage 21a is in a state of being sucked and held on the stage 21a.

  At this time, since the first placement portion 21 is located on the lower side and the second placement portion 22 is located on the upper side, the cam contact roller 21c of the first placement portion 21 is In order to come into contact with the stroke portion of the cam curve, the first mounting portion 21 is moved in the direction of the suction nozzle N of the turntable T, and the stage 21a is positioned immediately below the suction nozzle N. Yes. On the other hand, in this case, since the cam contact roller 22c of the second mounting portion 22 is in contact with a portion of the cam curve where there is no stroke, the turntable is 2 to 3 mm longer than the protruding first mounting portion 21. T is located away from the suction nozzle N side.

  Next, as shown in FIG. 7B, the placement portion 2 is moved 90 to the left from the state where the first placement portion 21 is located on the lower side and the second placement portion 22 is located on the upper side. By rotating at this time, the vacuum is switched, the stage 21a of the first placement unit 21 is opened to the atmosphere, and the stage 22a of the second placement unit 22 is in a vacuum suction state.

  Therefore, in the device D that is in a free state between the stage 21a of the first placement unit 21 and the stage 22a of the second placement unit 22, the stage 22a of the second placement unit 22 is vacuumed. By being in the attracted state, it is attracted to the stage 22a side, whereby the device D is delivered from the stage 21a to the stage 22a.

  If this transition is shown in FIG. 4, first, from the state of FIG. 4 (a), when the mounting portion 2 is rotated 60 degrees to the left, the state of FIG. 4 (a) is transitioned to the state of (b). Since the ranges of the air holes 31a and 31b and the flow paths 21d and 22d do not overlap and are not connected to each other, in this case, the stage 21a of the first mounting portion 21 and the first Both the stage 22a of the second mounting unit 22 are not in the vacuum suction state, and the device D mounted on the stage 21a is in a free state.

  Next, as a stage before the state shown in FIG. 4 (c), when it is further rotated by 30 °, the ranges of the air holes 31a and 31b and the flow paths 21d and 22d are overlapped and connected to each other. In this case, the stage 21a of the first placement unit 21 is in an air release state, and the stage 22a of the second placement unit 22 is in a vacuum suction state.

  In addition, when this state is shown in FIG. 3, the cam contact roller 21 c of the first placement portion 21 and the cam contact roller 22 c of the second placement portion 22 are in contact with a position where there is no stroke of the cam 23. Therefore, since the stage 21a of the first placement unit 21 and the stage of the second placement unit 22 are in a state of overlapping each other, the device D as described above can be delivered.

  Further, when the mounting portion 2 is rotated 90 ° to the left from the state of FIG. 7B, the second mounting portion 22 is now positioned on the lower side as shown in FIG. In this state, the stage 22a of the second mounting unit 22 is opened to the atmosphere, and the stage 21a of the first mounting unit 21 is in a vacuum state as described above. Adsorption state.

  At this time, since the cam contact roller 22c of the second placement portion 22 contacts the stroke portion of the cam curve, the second placement portion 22 is moved in the direction of the suction nozzle N of the turntable T. The stage 22a is positioned immediately below the suction nozzle N. On the other hand, since the cam contact roller 21c of the first placement portion 21 is in contact with a portion where the stroke of the cam curve is not present, the turntable T is attracted by 2 to 3 mm from the protruding second placement portion 22. It is located away from the nozzle N side.

  With the above operation, as shown in FIG. 7 (d3), the device D is in a state where the electrode surface is on the upper side, and the reversing process of the device D is completed. From this state, the suction nozzle N descends again in the Z-axis direction, receives the device D sucked and held on the stage 22a of the second mounting portion 22, and the suction nozzle N moves the device D to the next step. It is transported to a certain position 14 or 15, and taping packing is performed.

  In the front / back reversing device 1 of the present embodiment as described above, by providing two mounting portions each including a stage on which the device is mounted, by rotating the two mounting portions while sandwiching the device, By reversing the device and using one for receiving the device to the transport device and the other for delivery, the device can be reversed only by rotating the two mounting portions. At the time of reversal, for example, a stroke in the tangential direction of the turntable is not necessary, so that it can be incorporated as one process step of the test handler. At the same time, a space tangential to the turntable is not required, the apparatus can be arranged in the radial direction of the turntable, and no vertical stroke, which is the operating direction of the suction nozzle of the turntable, is required.

  Furthermore, it is not a mechanism that always reverses the received device as in the prior art, and if it is determined whether or not the mounting portion is to be rotated, the device is directly transferred to the suction nozzle without being reversed. It is possible. Thus, for example, when a device is separated from a wafer sheet as a means for supplying parts to a test handler, depending on the wafer sheet, a device attached with the electrode surface down may be used. Even if it exists, it will be possible to pass to the next process without inverting the front and back. In this way, flexible processing can be realized by means for deciding the necessity of reversal according to the type of device, supply mode, inspection purpose, inspection type such as appearance inspection and electrical characteristic inspection.

  Further, the means for inverting the device is composed of two parts, a first placement part and a second placement part, and these are moved by the cam so as to be displaced in the direction of the rotation axis. Even if the device stands up and is delivered to the stage of the placement unit due to an error in receiving from the suction nozzle of the device or a holding failure at the suction nozzle, for example, it is different from the received placement unit. When the mounting parts overlap, the device can be displaced at the tip of another mounting part. Therefore, even in such a case, there is little possibility of causing an error that affects the entire processing of the test handler, such as stopping the apparatus.

  By holding the device on the stage by suction holding means consisting of suction holes provided on the stage, the device can be securely held on the stage and dropped even if the mounting part rotates. There is no such thing. Moreover, by such vacuum holding and exchanging means, the vacuum suction and the vacuum break are switched according to the processing, so that the rotation of the mounting unit causes the first mounting unit to move to the second mounting unit. The device delivery operation can be performed reliably.

  The first placement portion and the second placement portion are formed by a rod-like body having a semicircular cross section, and the two placement portions are combined by a semicircular diameter portion to form a cylinder, which is a timing. It can be rotated by a pulley, and the rotation of the two mounting parts can be controlled synchronously with a simple configuration.

  By providing an air flow path between the mounting part and the housing, the opening and closing of the air flow path can be controlled according to the rotation of the mounting part, depending on how the groove is provided in the mounting part. It becomes possible. That is, since the rotation of the mounting portion and the opening and closing of the air flow path can be performed only by the rotation control of the mounting portion, the overall apparatus configuration can be simplified.

  Specifically, the grooves are provided so as to face each other in a range of approximately 120 ° on the peripheral surfaces of the first placement portion and the second placement portion, and the air holes are provided from one end to the other end. Up to the first and second mounting portions facing each other in a range of approximately 60 ° on the circumferential surface of the first mounting portion and the second mounting portion, and the flow path is formed by overlapping the grooves and air holes. By doing so, it is possible to hold the suction at any of the mounting parts without interruption, except when the vacuum suction and the vacuum break are replaced when the device is transferred from one mounting part to the other mounting part. In addition, the vacuum suction and the vacuum break can be exchanged smoothly.

  In addition, when the device is transferred from one mounting unit to the other mounting unit, when the vacuum suction and the vacuum break are replaced, the groove and the air hole are not overlapped. The device can be delivered smoothly between the mounting unit and the second mounting unit.

  Furthermore, by incorporating the above-described front / back reversing device as a one-step processing device for a test handler, for example, when reversing a device received from a wafer ring for visual inspection or electrical inspection, the test handler can be operated in only one position of the test handler. This process can be executed. In addition, it is not a mechanism that always reverses the received device as in the past, but if it is determined whether or not to rotate the mounting portion, the device is transferred directly to the suction nozzle without being reversed. For example, even if the device supply to the test handler is changed from a wafer ring type to a part feeder type or the like that does not require device reversal, it can be used as it is. Depending on the type of device, inspection purpose, inspection type such as appearance inspection and electrical characteristic inspection, it is possible to respond flexibly and realize flexible processing.

  According to the front / back reversing apparatus 1 of the present embodiment as described above, it is possible to provide a device front / back reversing apparatus that can be installed in a small space and that can be processed on an occasional basis depending on the necessity of device reversal.

[2. Other Embodiments]
The present invention is not limited to the above embodiment, and includes, for example, the following aspects. In the above-described embodiment, the mounting unit 2 has a semicircular cross section of the first mounting unit 21 and the second mounting unit 22 and a cylindrical shape. However, this is an optimal embodiment. It is only shown, for example, the cross section of each section is square, or the polygonal shape is formed in half, and as long as the mounting part 2 can rotate, the balance with the arrangement configuration of the stage and the suction holes, It can be configured in any shape depending on the balance of the device space.

  Moreover, in the said embodiment, although the timing pulley 4, the timing belt 5, the pulley 6, and the motor M are used as a structure which rotates the mounting part 2, this invention is not restricted to such an aspect, A mounting part Any configuration may be used as long as the configuration rotates the 2. Similarly, the support portion 7, the pedestal 8, and the attachment portion 9 that support the placement portion also show only one embodiment, and depending on the specifications of the test handler or the like in which the front / back reversing device is used, the shape, height, The size and the like can be changed as appropriate.

The figure which shows the whole structure of the test handler provided with the front-back inversion apparatus in embodiment of this invention. The schematic diagram which shows the front-back inversion apparatus whole structure in embodiment of this invention. The top view (a) which shows the partial structure of the front-back inversion apparatus in embodiment of this invention, side sectional drawing (b), and the side view (c) which shows the structure of a mounting part. The schematic diagram which shows three states of the mounting part of the front-back inversion apparatus in embodiment of this invention. The schematic diagram which shows the other structure of the mounting part of the front-back inversion apparatus in embodiment of this invention. The figure which shows the cam curve of the front-back inversion apparatus in embodiment of this invention. The schematic diagram which shows the effect | action of the front-back inversion apparatus in embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Front-reverse inversion apparatus 2 ... Mounting part 21 ... 1st mounting part 22 ... 2nd mounting part 21a, 22a ... Stage 21b, 22b ... Adsorption hole 21c, 22c ... Cam contact roller 21d, 22d ... Flow path 23 ... Cam 3 ... Housing 30a, 30b ... Manifold 31a, 31b ... Air hole 4 ... Timing pulley 5 ... Timing belt 6 ... Pulley 7 ... Supporting part 8 ... Base D ... Device H ... Test handler M ... Motor N ... Adsorption nozzle T ... Turntable

Claims (6)

A front / back reversing device that receives a device such as a semiconductor device or an electronic component, and sequentially transfers the device to a transport device that performs various process processes by reversing the front and back of the device,
A first placement unit that includes a stage on which the device is placed, sandwiches and reverses the front and back of the device held on the stage, and delivers the device from one to the other; and a second placement unit; ,
A drive mechanism for rotating the first placement portion and the second placement portion;
A cam that shifts the first placement portion and the second placement portion in the direction of the rotation axis with rotation;
The first placement unit and the second placement unit are configured such that either one is responsible for receiving the device to the transport device and the other is responsible for delivering the device to the transport device,
The cam is configured so that the first mounting portion and the second mounting portion are misaligned when either the receiving portion or the placement portion of the delivery portion is in the receiving position or the delivery position. In the case, the front and back reversing device is characterized in that a cam curve is formed so that the first placement portion and the second placement portion overlap each other. The stage can control vacuum suction and vacuum break, and is provided with suction holding means for holding the device on the stage by suction,
This adsorption holding means
Of the first placement unit and the second placement unit, when the device is received from the transfer device, the placement unit serving as a device receiving device is vacuum-sucked, and the placement unit on the other side is vacuum broken. age,
Upon delivery of the device from one mounting unit to the other mounting unit, the vacuum suction and the vacuum break are replaced,
2. The front / back reversing device according to claim 1, wherein when the device is delivered to the transport device, the placement portion serving as a device delivery device is vacuum-sucked and the placement portion on the other side is subjected to vacuum break.   The first placement portion and the second placement portion are rod-shaped bodies, and are configured to rotate synchronously by one timing pulley provided on the outer periphery of the two placement portions. The front / back reversing device according to claim 1 or 2, characterized in that. The first mounting portion and the second mounting portion are rod-shaped bodies having a semicircular cross section, and the two mounting portions are combined at a semicircular diameter portion, and are configured as a columnar shape.
The first placement portion and the second placement portion are covered with a casing that rotatably holds the periphery.
Between the first placement portion, the second placement portion, and the housing, a flow path through which air for adsorbing and holding the device on the stage passes is formed,
The flow path includes an air hole provided in the housing and a groove provided on a peripheral surface of the first placement portion and the second placement portion. Item 2. The front / back reversing device according to Item 2. The grooves are provided to face each other in a range of approximately 120 ° on the circumferential surface of the first placement portion and the second placement portion,
The air holes are provided so as to face each other in a range of approximately 60 ° on the circumferential surface of the first placement portion and the second placement portion from one end portion to the other end portion. ,
The flow path is formed by overlapping the groove and the air hole,
The groove and the air hole are configured not to overlap each other when the vacuum suction and the vacuum break are replaced when the device is transferred from the one mounting unit to the other mounting unit. The front / back reversing device according to claim 4.   6. A test handler comprising the front / back reversing device according to claim 1 as a one-step processing device.

Images