JP2010123585A - Block type capacitor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To efficiently manufacture a block type capacitor which has high voltage resistance and high capacitance. <P>SOLUTION: A plurality of chip type multilayer capacitors 5 are prepared and bundled to form a capacitor aggregation group A. Two pairs of the capacitor aggregation groups A are arranged in parallel and housed in a non-conductive container 11. In the non-conductive container 11, one first outside terminal 12 is connected to a pair of first outside electrodes 4a positioned inward and two pairs of second outside electrodes 4b exposed outside in the back surface of the first outside electrodes are connected to second outside terminals 13a, 13b, respectively, thereby forming the block type capacitor 10. The block type capacitor is incorporated in a power supply circuit, the one pair of first outside electrodes are connected to positive potential and the two pairs of second outside electrodes are connected to a ground potential. In this way, the block type capacitor having high capacitance and excellent frequency characteristics is obtained. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a block type capacitor having a structure in which a condenser bundling group obtained by bundling a large number of chip type multilayer capacitors is arranged in a plurality of rows and non-conductive containers via predetermined external terminals. is there.

Conventionally, a plurality of chip capacitors in which a first external electrode is in contact with a set of first external terminals are arranged, and two external electrodes of the chip capacitor existing on the back side of the first external electrode are arranged. A block type capacitor divided into two sets of second external terminals is known, for example, from Japanese Utility Model Laid-Open No. 3-95619. According to this known technique, two sets of external electrodes can be joined to one set of external terminals. Therefore, when a block type capacitor according to this known technique is incorporated in a power supply circuit, the first and second external electrodes of a large number of capacitors. Compared to the capacitor group of the related art prior to joining the first and second external terminals corresponding to them, it is considered that they can withstand high voltage and have a high capacity.
Japanese Utility Model Publication No. 3-95619

  However, since the chip-type capacitor used in this known example technique is an electrolytic capacitor, the external terminal has polarity, that is, one external terminal is an anode and the other external terminal is a cathode. When assembling individual chip capacitors in a block shape, there is a problem that it is impossible to avoid the work complexity of having to combine the same poles together, and as a result, there is a limit to improving the productivity of block capacitors .

  Therefore, the present inventor diligently studied whether or not a large number of chip-type capacitors can be used to withstand a high voltage and a high-capacity block capacitor can be manufactured with high productivity. A chip capacitor, that is, one external terminal (hereinafter referred to as “first external terminal”) and another external terminal (hereinafter referred to as “second external terminal”) in the positional relationship of the back surface of the external terminal. If a chip-type multilayer capacitor having a capacitor is used, since the multilayer capacitor has no polarity, the first external electrode or the second external electrode is connected to the first external electrode without being conscious of the polarity of the first and second external terminals. The present invention has been completed by finding the fact that it can be joined to a terminal or a second external terminal. Accordingly, an object of the present invention is to efficiently produce a block capacitor having a high withstand voltage and a high capacity.

  In order to solve the above-described problems, the present invention accommodates a plurality of chip-type multilayer capacitors in which a first external electrode is joined to one first external terminal in a non-conductive container. The second external electrode existing on the back side of the external electrode is divided into two sets and each is joined to the second external terminal. By adopting this means, since the chip type multilayer capacitor has no polarity, a plurality of chip type multilayer capacitors can be incorporated into the non-conductive container without being conscious of the polarity of the external terminal.

  Similarly, in order to solve the above problems, the present invention accommodates a plurality of chip-type multilayer capacitors in which a first external electrode is joined to one first external terminal in a non-conductive container in a three-dimensional direction, The second external electrode existing on the back side of the first external electrode is divided into two groups, and each is joined to the second external terminal. By adopting this means, even when a large number of chip-type multilayer capacitors are stacked three-dimensionally in a non-conductive container, the chip-type multilayer capacitor has no polarity, so it is not conscious of the polarity of the external terminals. Many more chip-type multilayer capacitors can be assembled to the non-conductive container.

  In the present invention, in addition to the above means, means for allowing the first external electrode to be connected to a positive potential and for enabling the second external electrode to be connected to a ground potential are used in combination. By adopting this means, the total capacitance of a large number of chip-type multilayer capacitors that are three-dimensionally incorporated in the non-conductive container can be obtained.

  Although the present invention is configured as described above, more specifically, two groups of first outer parts exposed inward from two capacitor focusing groups obtained by bundling a plurality of chip type multilayer capacitors. Adopting a configuration in which all electrodes are joined to one first external terminal, and two groups of second external electrodes exposed outwardly from the two condenser focusing groups are joined to two second external terminals, respectively. Thus, the above-described effect is exhibited by setting the first external electrode to a positive potential.

  In the present invention, since the above action is expressed, unlike a case where a dry battery is inserted into an electronic / electrical device having an external electrode, a large number of chip-type multilayer capacitors are not conscious of the polarity of their external terminals, Since it can be accommodated in a non-conductive container, the productivity of the block type multilayer capacitor is remarkably improved. In addition, since one first external electrode is connected as a positive potential to the two sets of first external terminals, the capacitance of all the multilayer capacitors to be blocked can be obtained, and an equivalent resistance and a series equivalent inductance can be obtained. The effect that it can reduce remarkably is exhibited.

  Next, the best mode for carrying out the present invention will be described in detail with reference to the drawings. As shown in FIG. 1, when the chip-type multilayer capacitor according to the present invention has a chip-shaped ceramic body 1 that is horizontally arranged in the longitudinal direction, a large number of internal electrodes 2 are horizontally arranged therein at a predetermined interval. And one end of the odd-numbered first internal electrode 2a is exposed at the first vertical end face 3a of the ceramic body 1, and the other end is also present as a free end in the ceramic body 1. One end of each even-numbered second internal electrode 2 b exists as a free end in the ceramic body 1, and the other end is exposed to the second vertical end face 3 b of the ceramic body 1. As is well known, the chip-shaped ceramic body 1 in which the internal electrodes 2a and 2b are laminated is arranged with the first and second internal electrodes 2a and 2b having the same shape and size on one side. It is obtained by alternately stacking and firing a plurality of ceramic sheets obtained by printing.

  The first and second vertical end faces 3a and 3b of the chip-type ceramic body 1 having the above-described structure are electrically connected to the first and second internal electrodes 2a and 2b with the end portions exposed to them. The first and second external electrodes 4a and 4b are formed to form the chip-type multilayer capacitor 5 according to the present invention.

  The chip-type multilayer capacitor 5 according to the present invention composed of the above-described elements has no structural, shape, and electrical anisotropy, and is chip-type between first and second external terminals described later. When the multilayer capacitor 5 is inserted and energized, the first external electrode 4a is joined to the first external terminal, the second external electrode 4b is joined to the second external terminal, or the first external electrode 4a is made to the second external terminal. Even when the second external electrode 4b is joined to the first external terminal, the electrical characteristics of the chip-type multilayer capacitor 5 are conscious of the dry batteries that are routinely used between the first and second external terminals. There is no anisotropy, i.e. polarity.

  Next, the block type capacitor according to the present invention will be described. As shown in FIGS. 2 to 6, the block type capacitor 10 includes a bottomed non-conductive container 11 and a plane of at least arrows X and Y in the container 11. A plurality of chip-type multilayer capacitors 5 arranged in a three-dimensional shape in the vertical direction, more preferably in the vertical direction of arrow Z, and the first and second external electrodes 4a, 4b of the chip-type multilayer capacitor 5, It comprises second external terminals 12 and 13.

  However, in the block type capacitor 10 according to the present invention, the condenser focusing group A in which a plurality of chip type multilayer capacitors 5 having first and second external electrodes 4a and 4b at both ends are bundled in the X direction is provided in the Y direction. The structure is significantly different from that of a known block capacitor in that it is arranged in two rows and more preferably at least two rows are stacked in the Z direction to form a three-dimensional block.

  Due to the difference in the configuration, the structure and area of the first and second external terminals 12 and 13 joined to the multiple first and second external electrodes 4a and 4b exposed in the X direction plane in the condenser focusing group A are as follows. It has a unique structure and shape. That is, since the condenser focusing group A is arranged in two rows in the Y direction as the first and second condenser focusing groups A1 and A2, in the block capacitor 10 according to the present invention, the first and second condenser focusing groups that are close to each other. A common external terminal 12 is interposed between two sets of first external electrodes 4a facing each other at A1 and A2, and the back side of the set of first external electrodes 4a. The two sets of second external electrodes 4b exposed outward at the position are joined to one (two in total) second external terminals 13 respectively.

  As described above, in the chip-type multilayer ceramic capacitor 5 according to the present invention, since the first and second external electrodes 4a and 4b have no electrical polarity, they are simultaneously bonded to one first external terminal 12. The external electrodes of the chip-type multilayer ceramic capacitor 5 in the first and second capacitor focusing groups A1 and A2 are the first external electrode 4a of the first capacitor focusing group A1 and the second external electrode 4b of the second capacitor focusing group A2. Similarly, the first external electrodes 4a or the second external electrodes 4b may be used. Similarly, for the external terminals, the combination of one first external terminal 12 and two second external terminals 13 is mentioned for convenience. In the present invention, two first external terminals 12 and one sheet are used. The second external terminal 13 may be combined and the latter may be disposed inside the block capacitor 10.

  Furthermore, in the present invention, the first external terminal 12 (or the second external terminal 13) disposed on the inner side of the block-shaped capacitor 10 is replaced with a bottomed non-conductive container as shown in FIGS. 2 and 3. 11, first and second flat portions 14 and 15 extending downward from the upper end of the partition plate 11a that rises in the shape of a wall from the middle of the bottom portion to the both side walls of the partition plate 11a are formed. As shown in FIG. 2, the first external electrode 4a of the first and second capacitor focusing groups A1 and A2 exposed to the inside of the block capacitor 10 is joined.

  On the other hand, a part of the middle part of the second external terminal 13 joined to the second external electrode 4b of the first and second capacitor focusing groups A1 and A2 exposed to the outside of the block capacitor 10 is shown in FIG. Thus, notches are formed at a plurality of locations to form a plurality of leaf spring portions 16, and these leaf spring portions 16 are joined to the second external electrodes 4b of the first and second capacitor focusing groups A1 and A2. The second external electrode 4b is constantly pressed inward of the block type capacitor 10, and the first and second external electrodes 4a and 4b of the chip type multilayer capacitor 5 and the first and second external terminals 12 and 13 are joined. Is sure. In the above description, the mode in which the first external electrode 4a on the inner side of the block capacitor 10 is joined to the first external electrode 12 has been described. Since it does not exist, it is naturally possible to position the second external electrode 1b inside the block capacitor 10.

  In the block type capacitor 10 having such a structure, one first external terminal 12 joined to a pair of first external electrodes 4a existing on the inside thereof can be connected to a positive potential, and is exposed to the outside. Since the two second external electrodes 4b are joined to the corresponding second external terminals 13a and 13b, the block type capacitor 10 is incorporated in the power supply circuit, the first external terminal 12 is set to a positive potential, and the second When the external terminals 13a and 13b are connected to the ground potential, the block capacitor 10 according to the present invention has an equivalent circuit as shown in FIG.

  As a result, the total capacity of the chip type multilayer capacitor 5 constituting the block type capacitor 10 is substantially equal to the capacitance in the power supply circuit, and the series equivalent resistance and the series equivalent inductance are the same as those of the chip type multilayer capacitor 5. Decreases according to the number. Therefore, the block capacitor according to the present invention exhibits excellent frequency characteristics while having a high capacity.

  In addition, when a capacitor having the same capacity as the block capacitor 10 according to the present invention is formed from a single large ceramic body according to the prior art, there is a problem that it is difficult to improve the mechanical strength. As a result, in order to obtain a capacitor having equivalent performance, a reduction in yield was inevitable. However, in the present invention, a large number of small chip-type multilayer capacitors that can easily improve mechanical strength and have a good yield. Since it is manufactured from the above, it becomes possible to solve the above problems.

  The present invention can be carried out by changing a part of the above-described embodiment as long as it follows the fundamental technical idea and does not significantly impair the effects of the invention. For example, as shown in FIG. 8, first and second capacitor focusing groups A1 and A2 in which a plurality of chip type multilayer capacitors 5 are bundled in the direction of arrow X are arranged in two rows in the direction of arrow Y, and these are shown in FIG. As shown in FIG. 9, a block type capacitor is manufactured by disposing the bottomed non-conductive container 11 having the partition plate 11a and incorporating the first and second external terminals having the functions shown in FIG. You can also. The block type capacitor obtained in this manner also has an equivalent circuit as shown in FIG. Although not shown, the first and second condenser focusing groups can be stacked in three or more stages in the vertical direction.

  The present invention can be widely used in the field of blocking a chip-type multilayer capacitor in which two types of external electrodes are exposed at positions where the back surface relationship is maintained at both ends without intending the presence of polarity.

It is a side view of the chip type multilayer capacitor incorporated in the block type capacitor concerning the present invention. It is a partially broken perspective view of the block type capacitor. It is a partially broken perspective view which shows the state which assembled | attaches the 1st external terminal of the said block type capacitor to a bottomed nonelectroconductive container. It is a partial fracture perspective view of the 2nd external terminal of a block type capacitor. It is a perspective view which shows the stacking state of the capacitor | condenser focusing group in 1st embodiment of this invention. It is a partially broken perspective view which shows the state by which the condenser condensing group is accommodated in a bottomed nonelectroconductive container in the same aspect. It is the equivalent circuit schematic of the block-shaped capacitor | condenser which concerns on this invention in the same aspect. It is a perspective view which shows the stacked state of the capacitor | condenser focusing group in 2nd embodiment of this invention. It is a partially broken perspective view which shows the state in which a condenser condensing group is similarly accommodated in a bottomed nonelectroconductive container in 2nd embodiment. FIG. 3 is an equivalent circuit diagram of a block capacitor according to the present invention in the same mode.

Explanation of symbols

1: Chip-type ceramic body,
2a, 2b: first and second internal electrodes,
3a, 3b: first and second vertical end faces,
4a, 4b: first and second external electrodes 5: chip type multilayer capacitor 10: block type capacitor 11: non-conductive container, 11a: partition plate 12: first external terminal 13: second external terminal 14: first plane Part 15: Second plane part 16: Spring part A: Condenser focusing group A1, A2: First and second condenser focusing groups X, Y, Z: Arrows

Claims (8)

  A plurality of chip type multilayer capacitors (5) in which a first external electrode (4a) is joined to one first external terminal (12) are accommodated in a non-conductive container (11), and the first external electrode A block type capacitor in which the second external electrodes (4b) existing on the back side of the substrate are divided into two sets and joined to the second external terminals (13), respectively.   A plurality of chip-type multilayer capacitors (5) in which the first external electrode (4a) is joined to one first external terminal (12) are accommodated in a non-conductive container (11) in a three-dimensional direction, A block type capacitor characterized in that the second external electrode (4b) existing on the back side of the first external electrode is divided into two sets and joined to the second external terminal (13), respectively.   The block capacitor according to claim 1 or 2, wherein the first external electrode (4a) is connectable to a positive potential, and the second external electrode (4b) is connectable to a ground potential.   The block type capacitor according to claim 1 or 2, wherein the second external terminal (13) is divided into two sets.   Two groups of first external electrodes (4a) exposed inward from two capacitor focusing groups (A1, A2) obtained by bundling a plurality of chip type multilayer capacitors (5) are all formed into one first external A second group of second external electrodes (4b) exposed to the outside from the two condenser focusing groups are bonded to the two second external terminals (13), respectively. A block capacitor.   The block type capacitor according to claim 5, wherein the two condenser focusing groups (A1, A2) are accommodated in a bottomed non-conductive container (11).   The block type capacitor according to claim 5, wherein the two condenser focusing groups (A1, A2) accommodated in the bottomed non-conductive container (11) are partitioned by a non-conductive partition plate (11a).   The spring part (16) for pressing the chip-type multilayer capacitor (5) toward the other external electrode is provided on at least one of the first external electrode (4a) and the second external electrode (4b). The block type capacitor according to claim 2 or 5.

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