JP2010122001A - Method of manufacturing pressure sensor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a pressure sensor which simplifies a manufacturing process by eliminating a vacuuming process in comparison with a conventional method of manufacturing the pressure sensor. <P>SOLUTION: The pressure sensor includes: a case 10 having a recess 11; a sensor 21 mounted to the recess 11; a diaphragm 16 for occluding the recess 11, and receiving a pressure from a measurement medium; and a terminal 12 for electrically connecting the sensor 21 to the outside, and provided on the case 10. The method of manufacturing the pressure sensor includes: a step of placing the sensor 21 in the recess 11, and electrically connecting the sensor 21 to the terminal 12: a step of filling the recess 11 with an optically-cured resin 51; and a step of partially curing the optically-cured resin 51 by selectively irradiating the optically-cured resin 51 with a light, and forming the diaphragm 16 for occluding the recess 11. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention provides a pressure sensor including a sensor unit that outputs a signal according to the pressure of a measurement medium, a diaphragm that receives the measurement medium, and a pressure transmission member that transmits the pressure of the measurement medium applied to the diaphragm to the sensor unit. The present invention relates to a method for manufacturing a sensor.

  Conventionally, a pressure sensor is known in which a sensor chip is provided in a pressure detection chamber covered with a metal diaphragm so as not to be exposed to a measurement medium, and the pressure detection chamber is filled with oil so as to cover the sensor chip. .

  For example, Patent Document 1 discloses the following pressure sensor. Specifically, the sensor chip is provided in a recess provided in the metal stem, and the recess is covered with a metal diaphragm to form a pressure detection chamber, and the inside is filled with silicone oil. In addition, the metal stem is provided with a terminal protruding in the recess, and the sensor chip and the terminal are electrically connected via a wire. And the pressure sensor is comprised by arrange | positioning the metal cap provided with the pressure introduction hole on the opposite side to a metal stem on both sides of a metal diaphragm.

  In such a pressure sensor, when a pressure is applied to the metal diaphragm, the pressure is applied to the sensor chip via the silicone oil filling the pressure detection chamber, and the sensor chip outputs a sensor signal corresponding to the pressure to thereby control the pressure. Detection is performed.

  In such a pressure sensor, for example, a pipe is provided on a metal stem, a metal diaphragm is disposed between the metal stem and the metal cap, silicone oil is injected into the recess from the pipe, and then the pipe is cut. It is manufactured by deforming and closing the pipe.

However, in such a manufacturing method, when a pipe is cut and closed, air may be mixed into the silicone oil from the pipe. When air is mixed in the silicone oil, the air becomes bubbles, and there is a problem that the pressure is prevented from being transmitted by the bubbles, or the bubbles contact the wire and the wire is disconnected. For this reason, such a pressure sensor is manufactured under a vacuum condition so that air is not mixed into the silicone oil when the pipe is cut and closed.
JP-A-5-332865

  However, such a pressure sensor manufacturing method requires a vacuum evacuation process, and there is a problem that the manufacturing process becomes complicated.

  In view of the above, the present invention has an object to provide a method of manufacturing a pressure sensor that can simplify the manufacturing process by eliminating the step of evacuating as compared with a conventional method of manufacturing a pressure sensor. To do.

  In order to achieve the above object, according to the first aspect of the present invention, the case (10) having the recess (11), the sensor portion (21) mounted in the recess (11), and the recess (11) are closed. And a diaphragm (16) for receiving a measurement medium, a sensor part (21) and a terminal (12) provided in the case (10) for electrically connecting the sensor part (21) and the outside, and having a recess (11 ) And the diaphragm (16) is defined as a pressure detection chamber (17), and the pressure detection chamber (17) includes a sensor portion (21). A step of arranging the portion (21) and electrically connecting the sensor portion (21) and the terminal (12), a step of filling the concave portion (11) with the photocurable resin (51), and a photocurable resin. By selectively irradiating light on (51) Is characterized in that it comprises a step of forming a diaphragm (16) which a photocurable resin (51) partially cure closing the recess (11), the.

  In such a pressure sensor manufacturing method, the concave portion (11) is filled with the photocurable resin (51), and the photocurable resin (51) is selectively irradiated with light to thereby form the photocurable resin. (51) is partially cured to form the diaphragm (16), and the recess (11) is closed by the diaphragm (16). Therefore, when the recess (11) is filled with the photocurable resin (51), air can be removed from the interior of the recess (11). The photocurable resin (51) is cured to form the diaphragm (16) and the diaphragm (16) closes the recess (11), so that the photocurable resin filled in the pressure detection chamber (17) is filled. It is possible to prevent air from being mixed into the resin (51). That is, according to such a pressure sensor manufacturing method, air is prevented from being mixed into the photocurable resin (51) filled in the pressure detection chamber (17) without performing a vacuuming step. Therefore, the manufacturing process can be simplified.

  For example, as in the invention described in claim 2, in the step of filling the concave portion (11) with the photocurable resin (51), the case (10) is a container (42) in which the photocurable resin (51) is stored. ) Can be filled with the photocurable resin (51).

  In the step of filling the recess (11) with the photocurable resin (51) as in the invention described in claim 3, the photocurable resin (51) is injected from the outside of the case (10). The recess (11) can also be filled with a photocurable resin (51).

  Then, as in the invention described in claim 4, in the step of forming the diaphragm (16), the diaphragm (16) can be formed in a state where the concave portion (11) is filled with the photocurable resin (51). .

  Further, as in the case of the invention described in claim 5, when the sensor part (21) is arranged as the case (10), one side from the region surrounding the sensor part (21) in the side wall of the recess (11) In the step of forming the diaphragm (16) with the hollow portion (18) provided in the portion, the concave portion (11) is filled with the photocurable resin (51), and the diaphragm (16) The diaphragm (16) can be formed such that a portion enters the recess (18).

  According to such a pressure sensor manufacturing method, when the photocurable resin (51) is cured to form the diaphragm (16), even if the bonding between the diaphragm (16) and the connector case (10) is weak. Since the diaphragm (16) is formed so as to enter the recess (18), the connector case 10 and the diaphragm 16 can be reliably joined.

  Furthermore, after performing the process which fills a recessed part (11) with a photocurable resin (51) like invention of Claim 6, the light stored in the container (42) on one side of the case (10) It arrange | positions so that it may oppose the interface of curable resin (51) and external air, and by inject | pouring material (52) whose specific gravity is heavier than photocurable resin (51) into a recessed part (11), from recessed part (11) In the step of removing the photocurable resin (51) and filling the recess (11) with a material (52) heavier than the photocurable resin (51) to form the diaphragm (16), the case (10 ) Is disposed in the container (42), and the diaphragm (16) is formed in a state in which the concave portion (11) is filled with a material (52) having a higher specific gravity than the photocurable resin (51). it can.

  And after performing the process of filling a recessed part (11) with a photocurable resin (51) like invention of Claim 7, one side of a case (10) and the bottom face of a container (42) oppose By injecting a material (53) having a lighter specific gravity than the photocurable resin (51) into the recess (11), the photocurable resin (51) is removed from the recess (11) and the recess ( 11) is a state in which the case (10) is arranged in the container (42) in the step of filling the material (53) lighter than the photocurable resin (51) and forming the diaphragm (16). And the diaphragm (16) can be formed in the state which filled the material (53) whose specific gravity is lighter than a photocurable resin (51) in the recessed part (11).

  Moreover, after performing the process which fills a recessed part (11) with a photocurable resin (51) like invention of Claim 8, one surface of a case (10) and the bottom face of a container (42) oppose. The case (10) is arranged so that one surface of the case (10) is pulled up to the interface between the photocurable resin (51) stored in the container (42) and the outside air, and the recess (11) is formed into the photocurable resin. In the step of filling the gas (51) with the vaporized gas and forming the diaphragm (16), the diaphragm (16) can be formed with the recess (11) filled with the gas.

  According to the method for manufacturing a pressure sensor according to claim 6, 7 or 8, the recess (11) can be filled with a material different from that of the photocurable resin (51), and the degree of freedom in design is improved. Can do.

  Furthermore, as described in claim 9, in the step of forming the diaphragm (16), the photocurable resin (51) is cured so that a cross section in a direction parallel to the central axis of the case (10) has a wave shape. The diaphragm (16) can also be formed.

  And like invention of Claim 10, before performing the process of forming a diaphragm (16), it is the area | region with which the recessed part (11) was filled among photocurable resins (51), and In the step of partially curing the photocurable resin (51) by selectively irradiating light to a region different from the region where the diaphragm is to be formed, the step of forming the diaphragm (16) is photocurable. The diaphragm (16) can also be formed in a state where the cured portion of the resin (51) is included in the recess (11).

  In the invention according to claim 11, the step of disposing the sensor portion (21) in the recess (11) and electrically connecting the sensor portion (21) and the terminal (12), and the diaphragm (16) The step of preparing and filling the recess (11) with the photocurable resin (51) by immersing the case (10) in the container (42) in which the photocurable resin (51) is stored, and the diaphragm (16) With the step of arranging the recess (11) in the container (42) and the case (10) and the diaphragm (16) being arranged in the container (42), the photocurable resin (51) And selectively irradiating light to partially cure the photocurable resin (51) and join the diaphragm (16) and the case (10) so as to close the recess (11); It is characterized by including.

  According to such a pressure sensor manufacturing method, the diaphragm (16) can be freely selected, and the degree of freedom in design can be improved.

  For example, as in the invention described in claim 12, in the step of preparing the diaphragm (16), a mold (47) having a predetermined shape is disposed in the container (42), and the photocurable resin (51) is provided. On the other hand, by selectively irradiating light, the photocurable resin (51) can be partially cured to prepare a diaphragm (16) having a predetermined shape.

  And like invention of Claim 13, before the process of arrange | positioning a diaphragm (16) so that a recessed part (11) may be obstruct | occluded, in a recessed part (11) among photocurable resins (51). In the step of partially curing the photocurable resin (51) by selectively irradiating the filled region with light and forming the diaphragm (16), the photocurable resin (51) is formed. The diaphragm (16) can be formed in a state where the hardened portion is included in the recess (11).

  In the invention described in claim 14, a semiconductor wafer (23) on which a plurality of semiconductor elements are formed is prepared, and the semiconductor wafer (23) is placed in a container (42) in which a photocurable resin (51) is stored. The photocurable resin (51) is partially irradiated by selectively irradiating the photocurable resin (51) with the immersion step and the semiconductor wafer (23) placed in the container (42). And a step of forming a diaphragm (16) that covers each semiconductor element and does not contact the semiconductor element on the semiconductor wafer (23), and a step of dividing the semiconductor wafer (23) into chips. It is characterized by including.

  According to such a pressure sensor manufacturing method, it is possible to form the diaphragm (16) covering the respective semiconductor elements by arranging the semiconductor wafer (23) in the container (42), so that the diaphragm (16) is formed. A plurality of sensor chips (21a) having the above can be manufactured, and productivity can be improved.

  Furthermore, in invention of Claim 15, the process which electrically connects a sensor part (21) and a terminal (12), and photocurable resin (51) connects a sensor part (21) and a terminal (12). Light is selectively irradiated to the photocurable resin (51) in a state where the sensor (21) and the terminal (12) are arranged in the container (42), in the process of arranging in the stored container (42). The case (10) in which the photocurable resin (51) is partially cured and the sensor part (21) is mounted in the concave part (11), and the diaphragm (16) that closes the concave part (11) , Is characterized by forming.

  In addition, the code | symbol in the bracket | parenthesis of each means described in this column and the claim shows the correspondence with the specific means as described in embodiment mentioned later.

(First embodiment)
A first embodiment of the present invention will be described. FIG. 1 is a diagram showing a cross-sectional configuration of a pressure sensor configured by applying the manufacturing method of the pressure sensor of the present embodiment, and will be described based on this diagram.

  As shown in FIG. 1, a connector case 10 as a case is made by molding a resin such as PBT (polybutylene terephthalate) or PA (polyamide), and has a cylindrical shape in this embodiment. A recess 11 is formed on one surface of the connector case 10 (the lower end in FIG. 1). A sensor portion 21 that outputs an electrical signal in accordance with the pressure of the measurement medium is mounted on the bottom surface of the recess 11.

  The sensor unit 21 includes a sensor chip 21 a and a base 21 b made of glass or the like, and is mounted on the connector case 10 by bonding the base 21 b to the bottom surface of the recess 11. The sensor chip 21a has a diaphragm as a pressure receiving surface on the surface, and a gauge resistor (not shown) formed on the surface of the diaphragm converts the pressure received by the diaphragm into an electric signal, and the electric signal is converted into a sensor signal. The output is a semiconductor diaphragm type.

  In addition, the connector case 10 is provided with a plurality of metal rod-like terminals 12 for electrically connecting the sensor unit 21 and an external circuit or the like. In the present embodiment, the terminal 12 is made of a material obtained by plating brass (brass) (for example, Ni plating), and is held in the connector case 10 by being integrally formed with the connector case 10 by insert molding. Yes. The end of each terminal 12 on one end side (the lower end side in FIG. 1) is arranged so as to protrude from the bottom surface of the recess 11 around the mounting area of the sensor unit 21. Further, the end of each terminal 12 on the other end side (the upper end side in FIG. 1) is disposed so as to be exposed in the opening 13 of the connector case 10.

  One end of each terminal 12 disposed so as to protrude from the bottom surface of the recess 11 is electrically connected to the sensor chip 21a by a bonding wire 14 such as gold or aluminum. On the other hand, the other end of each terminal 12 protruding into the opening 13 is electrically connected to an external wiring member (not shown) such as a wire harness.

  Furthermore, a sealing material 15 made of silicone resin or the like is disposed at a portion of the recess 11 where each terminal 12 protrudes so as to seal a gap between the recess 11 and each terminal 12.

  A housing 30 is assembled to the connector case 10. Specifically, the housing 30 is provided with an accommodation recess 31, and one side of the connector case 10 where the recess 11 is formed is inserted into the accommodation recess 31, and the housing 30 has an open end of the accommodation recess 31. The connector case 10 and the housing 30 are assembled by caulking 32 to the connector case 10.

  The housing 30 is made of, for example, a metal material such as SUS, and the pressure introduction hole 33 for introducing the measurement medium, and the end of the pressure introduction hole 33 on the side of the sensor portion 21 are tapered (trumpet shape). And a chamber 34 formed by being expanded to a width, and a threaded portion 35 for fixing the pressure sensor to the outer peripheral wall surface of the pressure introducing hole 33.

  In addition, the connector case 10 is provided with a diaphragm 16 that closes the recess 11 and receives pressure of the measurement medium on one surface including the recess 11. The diaphragm 16 is formed by curing a photocurable resin such as epoxy. And the pressure detection chamber 17 is comprised by the part enclosed by the recessed part 11 and the diaphragm 16 which were formed in the connector case 10, and the sensor part 21 is provided in the pressure detection chamber 17. The pressure detection chamber 17 is filled with a photo-curable resin 51 such as epoxy that functions as a pressure transmission member that transmits the pressure of the measurement medium applied to the diaphragm 16 to the sensor unit 21.

  Further, an annular groove 36 is formed on the bottom surface of the housing recess 31 in the housing 30 so as to surround the chamber 34. An O-ring 37 made of silicone rubber or the like is disposed in the groove 36 so that the measurement medium introduced from the pressure introducing hole 33 is sealed in the chamber 34 by the diaphragm 16 and the O-ring 37. ing.

  The basic detection operation of such a pressure sensor will be described. First, when the pressure of the measurement medium is applied to the diaphragm 16, the pressure is applied to the diaphragm formed on the sensor chip 21a via the photocurable resin 51 filled in the pressure detection chamber 17. The diaphragm is provided with a gauge resistor formed so as to form a bridge circuit. When pressure is applied to the diaphragm, the resistance value of the gauge resistor changes due to the piezoresistance effect. For this reason, in the sensor chip 21a, the output voltage of the bridge circuit changes, and a sensor signal corresponding to the applied pressure is output. This sensor signal is transmitted from the sensor chip 21a to the outside via the bonding wire 14 and the terminal 12, and based on this, the pressure of the measurement medium is detected.

  Such a pressure sensor is manufactured as follows.

  First, the connector case 10 having the above shape in which the terminal 12 is insert-molded is prepared. And the sensor part 21 provided with the sensor chip 21a and the base 21b is arrange | positioned in the recessed part 11 formed in the connector case 10. FIG. Subsequently, the sensor unit 21a and the terminal 12 are connected by the bonding wire 14 and are electrically connected.

  Thereafter, the concave portion 11 formed in the connector case 10 is filled with the photocurable resin 51, and the photocurable resin 51 is partially cured by selectively irradiating the photocurable resin 51 with light. Thus, a diaphragm 16 that closes the recess 11 is formed. Specifically, in the present embodiment, the diaphragm 16 is formed as follows. FIG. 2 is a schematic cross-sectional view of the connector case 10 provided with the diaphragm 16 in the manufacturing process according to the present embodiment.

  As shown in FIG. 2, in the present embodiment, first, the connector case 10 is fixed to the stage 41, and the stage 41 is fixed to the container 42 in which the photocurable resin 51 is stored in a state where the connector case 10 is fixed. By dipping, the recess 11 provided in the connector case 10 is filled with the photocurable resin 51. Thereafter, the photocurable resin 51 is selectively irradiated to the photocurable resin 51 by using a photocuring apparatus, whereby the photocurable resin 51 is partially cured to form the diaphragm 16. At this time, the pressure detection chamber 17 is configured by the region surrounded by the diaphragm 16 and the recess 11, and the pressure detection chamber 17 is filled with the photocurable resin 51.

  In this embodiment, the photocuring apparatus includes a laser light source 43 having a wavelength capable of curing the photocurable resin 51, and a mirror including a plurality of micromirrors that reflect the laser oscillated from the laser light source 43. 44 and a lens 45 for condensing the laser beam reflected by each micromirror provided in the mirror 44. Then, the laser oscillated from the laser light source 43 is reflected by the mirror 44 so that the laser is irradiated to the photocurable resin 51, and the laser reflected by the mirror 44 is selected by the lens 45 from the photocurable resin 51. The diaphragm 16 is formed by partially condensing the photo-curable resin 51 by condensing light in the region.

  Thereafter, the connector case 10 and the housing 30 are joined. Specifically, the housing 30 is lowered so as to be fitted into the connector case 10 while being kept horizontal. Thereafter, the connector case 10 and the housing 30 are caulked and fixed by caulking the open end 32 of the housing recess 31 in the housing 30 to the connector case 10, whereby the pressure sensor of this embodiment is manufactured.

  In such a pressure sensor manufacturing method, the connector case 10 on which the sensor unit 21 is mounted is immersed in a container 42 in which the photocurable resin 51 is stored, and the concave portion 11 is filled with the photocurable resin 51, and the photocuring is performed. By selectively irradiating the curable resin 51 with light, the photocurable resin 51 is partially cured to form the diaphragm 16 and the recess 11 is closed by the diaphragm 16.

  For this reason, when the connector case 10 is immersed in the container 42 and the recess 11 is filled with the photocurable resin 51, air can be removed from the inside of the recess 11. Then, while the connector case 10 is placed in the container 42, the photocurable resin 51 is cured to form the diaphragm 16, and the concave portion 11 is closed by the diaphragm 16, so that the step of vacuuming is not performed. However, air can be prevented from being mixed into the photocurable resin 51 filled in the pressure detection chamber 17. Therefore, according to such a pressure sensor manufacturing method, it is possible to prevent air from being mixed into the photocurable resin 51 filled in the pressure detection chamber 17 without performing a vacuuming step. The manufacturing process can be simplified.

Further, according to such a pressure sensor manufacturing method, the diaphragm 16 is formed by curing the photo-curable resin 51 stored in the container 42, and the diaphragm 16 is simultaneously formed when the diaphragm 16 is formed. Since 16 can be joined to the connector case 10, it is not necessary to perform the process of preparing the diaphragm 16 and the process of joining the diaphragm 16, and the manufacturing process can be further simplified.
(Second Embodiment)
A second embodiment of the present invention will be described. The manufacturing method of the pressure sensor according to the present embodiment uses the connector case 10 provided with a recessed portion on the wall surface of the recess 11 as compared with the first embodiment, and is otherwise the same as the first embodiment. The description is omitted here. FIG. 3 is a schematic cross-sectional view of the connector case 10 provided with the diaphragm 16 in the manufacturing process according to the present embodiment.

  As shown in FIG. 3, in this embodiment, when the sensor unit 21 is arranged as the connector case 10, the recess 11 in the connector case 10 is provided more than the region surrounding the sensor unit 21 in the side wall of the recess 11. A portion provided with a recessed portion 18 that goes around the side wall in a portion on one surface side, that is, a portion on the opening portion side opposite to the bottom surface of the recess 11 is prepared. Thereafter, the connector case 10 is immersed in a container 42 in which the photocurable resin 51 is stored, the recess 11 is filled with the photocurable resin 51, and light such as a laser is selectively photocurable using a photocuring device. By irradiating the resin 51, the photocurable resin 51 is partially cured to form the diaphragm 16 so as to enter the recess 18.

  According to such a pressure sensor manufacturing method, when the photocurable resin 51 is cured to form the diaphragm 16, the diaphragm 16 remains inside the recess 18 even if the bonding between the diaphragm 16 and the connector case 10 is weak. Since it is formed so as to enter, the connector case 10 and the diaphragm 16 can be reliably joined, and the same effect as the first embodiment can be obtained.

(Third embodiment)
A third embodiment of the present invention will be described. The manufacturing method of the pressure sensor of this embodiment forms the diaphragm 16 in the state which filled the recessed part 11 with the material whose specific gravity is heavier than the photocurable resin 51 with respect to 1st Embodiment. Since it is the same as that of 1st Embodiment, description is abbreviate | omitted here. FIG. 4 is a schematic cross-sectional view of the connector case 10 provided with the diaphragm 16 in the manufacturing process according to the present embodiment.

  As shown in FIG. 4, in this embodiment, a photocuring apparatus is used to selectively irradiate the photocurable resin 51 with light such as a laser, whereby the concave portion 11 has a higher specific gravity than the photocurable resin 51. The diaphragm 16 that closes the recess 11 in a state where the material 52 is filled is formed.

  Specifically, in this embodiment, first, the connector case 10 is immersed in a container 42 in which the photocurable resin 51 is stored to fill the concave portion 11 with the photocurable resin 51, and then the concave portion of the connector case 10 is formed. 11 is arranged so as to face the interface between the photocurable resin 51 stored in the container 42 and the outside air. Then, a material 52 having a higher specific gravity than the photocurable resin 51, for example, fluorine oil having a specific gravity of 1.8 when the specific gravity of the photocurable resin 51 is 1.2 is injected into the concave portion 11, The photocurable resin 51 is removed, and the recess 11 is filled with a material 52 having a higher specific gravity than the photocurable resin 51.

  Thereafter, the photocurable resin 51 is selectively cured by irradiating the photocurable resin 51 with light such as a laser selectively, thereby forming the diaphragm 16. At this time, the pressure detection chamber 17 is constituted by a portion surrounded by the diaphragm 16 and the recess 11, and the pressure detection chamber 17 is filled with a material 52 having a higher specific gravity than the photocurable resin 51. In the present embodiment, the material 52 having a specific gravity heavier than the photocurable resin filled in the pressure detection chamber 17 functions as a pressure transmission member that transmits the pressure of the measurement medium applied to the diaphragm 16 to the sensor unit 21. .

  According to such a pressure sensor manufacturing method, the inside of the pressure detection chamber 17 can be filled with the material 52 having a specific gravity heavier than that of the photocurable resin 51, and the degree of freedom in design can be improved. The same effect as in the first embodiment can be obtained.

(Fourth embodiment)
A fourth embodiment of the present invention will be described. The manufacturing method of the pressure sensor of this embodiment forms the diaphragm 16 in the state which filled the recessed part 11 with the material whose specific gravity is lighter than the photocurable resin 51 with respect to 3rd Embodiment. Since it is the same as that of 3rd Embodiment, description is abbreviate | omitted here. FIG. 5 is a schematic cross-sectional view of the connector case 10 provided with the diaphragm 16 in the manufacturing process according to the present embodiment.

  As shown in FIG. 5, in the present embodiment, a photocuring device is used to selectively irradiate the photocurable resin 51 with light such as a laser, whereby the concave portion 11 has a lighter specific gravity than the photocurable resin 51. A diaphragm 16 that closes the recess 11 in a state where the material 53 is filled is formed.

  Specifically, in this embodiment, first, the connector case 10 is immersed in a container 42 in which the photocurable resin 51 is stored to fill the concave portion 11 with the photocurable resin 51, and then the concave portion of the connector case 10 is formed. 11 and the bottom surface of the container 42 are arranged to face each other. Then, a material 53 having a lighter specific gravity than the photocurable resin 51, for example, a silicone oil having a specific gravity of 1.0 when the specific gravity of the photocurable resin 51 is 1.2 is injected into the concave portion 11. While removing the photocurable resin 51, the recess 11 is filled with a material 53 that is lighter than the photocurable resin 51.

  Thereafter, the photocurable resin 51 is selectively cured by irradiating the photocurable resin 51 with light such as a laser selectively, thereby forming the diaphragm 16. At this time, the pressure detection chamber 17 is configured by a portion surrounded by the diaphragm 16 and the recess 11, and the pressure detection chamber 17 is filled with a material 53 having a specific gravity lower than that of the photocurable resin 51. In this embodiment, a material 53 having a lighter specific gravity than the photocurable resin filled in the pressure detection chamber 17 functions as a pressure transmission member that transmits the pressure of the measurement medium applied to the diaphragm 16 to the sensor unit 21. .

  According to such a pressure sensor manufacturing method, the inside of the recess 11 can be filled with the material 53 having a specific gravity lighter than that of the photocurable resin 51, and the degree of freedom in design can be improved. Effects similar to those of the third embodiment can be obtained.

  In the present embodiment, one surface of the connector case 10 where the recess 11 is provided, that is, one surface of the connector case 10 where the diaphragm 16 is formed is disposed so as to face the bottom surface of the container 42. The reflecting plate 46 is disposed on the bottom surface of the container 42, and the photocurable resin 51 is cured by the light reflected from the reflecting plate 46.

(Fifth embodiment)
A fifth embodiment of the present invention will be described. The manufacturing method of the pressure sensor of this embodiment forms the diaphragm 16 in the state which filled the recessed part 11 with the gas which the photocurable resin 51 vaporized with respect to 1st Embodiment. Since it is the same as that of embodiment, description is abbreviate | omitted here. FIG. 6 is a schematic cross-sectional view of the connector case 10 provided with the diaphragm 16 in the manufacturing process according to the present embodiment.

  As shown in FIG. 6, in this embodiment, a gas obtained by vaporizing the photocurable resin 51 in the recess 11 by selectively irradiating the photocurable resin 51 with light such as a laser using a photocuring device. A diaphragm 16 that closes the concave portion 11 in a state filled with is formed.

  Specifically, in this embodiment, first, the connector case 10 is immersed in a container 42 in which the photocurable resin 51 is stored to fill the concave portion 11 with the photocurable resin 51, and then the concave portion of the connector 10 case is formed. 11 and the bottom surface of the container 42 are arranged to face each other. And the one side provided with the recessed part 11 among the connector cases 10 is pulled up to the interface of the photocurable resin 51 stored in the container 42 and the outside air, and the recessed part 11 is filled with the gas which the photocurable resin 51 vaporized. .

  After that, the photocurable resin 51 is cured by selectively irradiating the photocurable resin 51 with light such as a laser using a photocuring device, thereby forming the diaphragm 16. At this time, the pressure detection chamber 17 is constituted by a portion surrounded by the diaphragm 16 and the recess 11, and the pressure detection chamber 17 is filled with a gas obtained by vaporizing the photocurable resin 51. In this embodiment, the gas filled in the pressure detection chamber 17 functions as a pressure transmission member that transmits the pressure of the measurement medium applied to the diaphragm 16 to the sensor unit 21.

  In such a pressure sensor manufacturing method, a pressure sensor in which the pressure detection chamber 17 is filled with a gas obtained by vaporizing the photocurable resin 51 can be configured. In such a pressure sensor, when the pressure of the measurement medium is applied to the diaphragm 16, the gas has a compressible property, so that the pressure of the measurement medium is transmitted to the sensor unit 21 after the gas is compressed. become. Accordingly, in such a pressure sensor manufacturing method, a responsiveness is low, but a pressure sensor insensitive to noise such as vibration can be configured, and the same effect as in the first embodiment can be obtained. it can.

  In the present embodiment, one surface of the connector case 10 where the recess 11 is provided, that is, one surface of the connector case 10 where the diaphragm 16 is formed is disposed so as to face the bottom surface of the container 42. Similarly to the fifth embodiment, the reflection plate 46 is disposed on the bottom surface of the container 42, and the photocurable resin 51 is cured by the light reflected from the reflection plate 46.

(Sixth embodiment)
A sixth embodiment of the present invention will be described. The manufacturing method of the pressure sensor of the present embodiment forms a corrugated diaphragm 16 in the cross section of the first embodiment, and the rest is the same as the first embodiment. Description is omitted. FIG. 7 is a schematic cross-sectional view of the connector case 10 provided with the diaphragm 16 in the manufacturing process according to the present embodiment.

  As shown in FIG. 7, in the present embodiment, a cross section in a direction parallel to the central axis of the connector case 10 is obtained by selectively irradiating the photocurable resin 51 with light such as a laser using a photocuring device. The diaphragm 16 is formed by curing the photo-curable resin 51 so as to have a wave shape. Specifically, in the present embodiment, a diaphragm 16 having a corrugated cross section is formed by changing a region where the laser is focused by the lens 45.

  According to such a pressure sensor manufacturing method, a pressure sensor having a wave-shaped diaphragm 16 can be configured, and the deflection of the diaphragm 16 can be increased. The same effect as in the first embodiment can be obtained.

(Seventh embodiment)
A seventh embodiment of the present invention will be described. The manufacturing method of the pressure sensor of this embodiment adds the process of selectively irradiating light with respect to the photocurable resin 51 with which the recessed part 11 was filled with respect to 1st Embodiment. Since this is the same as that of the first embodiment, description thereof is omitted here. FIG. 8 is a schematic cross-sectional view of the connector case 10 provided with the diaphragm 16 in the manufacturing process according to the present embodiment.

  As shown in FIG. 8, in the present embodiment, first, light is selectively emitted from a region of the photocurable resin 51 that is filled in the recess 11 and that is different from the region where the diaphragm is to be formed. , The photocurable resin 51 is partially cured. Thereafter, the photocurable resin 51 is cured by selectively irradiating light such as a laser using a photocuring apparatus to form the diaphragm 16. At this time, the pressure detection chamber 17 is constituted by a portion surrounded by the diaphragm 16 and the recess 11, and the pressure detection chamber 17 can be filled with a portion obtained by partially curing the photocurable resin 51.

  In the case where the photocurable resin 51 is partially cured by selectively irradiating the photocurable resin 51 filled in the recess 11 with, for example, a laser for forming the diaphragm 16. Different lasers may be used, and the output of the laser may be weaker than when the diaphragm 16 is formed or a pulse laser may be irradiated.

  According to the manufacturing method of such a pressure sensor, the entire characteristics of the photocurable resin 51 filled in the recess 11 can be obtained by partially curing the photocurable resin 51 filled in the recess 11. The effect similar to the said 1st Embodiment can be acquired, making it change. In the case where the overall characteristics of the photocurable resin 51 are changed by partially curing the photocurable resin 51 filled in the recess 11, for example, the viscosity of the photocurable resin 51 is increased. Thus, the movement of the bonding wire 14 can be suppressed, and a pressure sensor that can suppress the characteristic variation of the sensor unit 21 by reducing the thermal expansion coefficient of the photocurable resin 51 can be manufactured.

(Eighth embodiment)
An eighth embodiment of the present invention will be described. The manufacturing method of the pressure sensor of this embodiment forms the diaphragm 16 without arrange | positioning the connector case 10 in the container 42 in which the photocurable resin 51 was stored with respect to 1st Embodiment. Since this is the same as that of the first embodiment, description thereof is omitted here. FIG. 9 is a schematic cross-sectional view of the connector case 10 provided with the diaphragm 16 in the manufacturing process according to the present embodiment.

  As shown in FIG. 9, in this embodiment, the photocurable resin 51 is injected into the concave portion 11 provided in the connector case 10 from the outside of the connector case 10 with a dispenser or the like, thereby forming the concave portion 11 in the photocurable resin. Fill at 51. Then, by using a photocuring device and selectively irradiating the photocurable resin 51 with light such as a laser, the photocurable resin 51 is partially cured to form the diaphragm 16 that closes the recess 11. The diaphragm 16 and the side wall of the recess 11 are joined.

  In such a pressure sensor manufacturing method, the same effect as that of the first embodiment can be obtained while suppressing the amount of the photocurable resin 51 used. In such a pressure sensor manufacturing method, the bonding strength between the diaphragm 16 and the recess 11 can be increased by increasing the thickness of the portion of the diaphragm 16 to be bonded to the side wall of the recess 11.

(Ninth embodiment)
A ninth embodiment of the present invention will be described. The manufacturing method of the pressure sensor according to the present embodiment is the same as the first embodiment except that the diaphragm 16 is prepared separately from the first embodiment. FIG. 10 is a schematic cross-sectional view of the connector case 10 provided with the diaphragm 16 in the manufacturing process according to the present embodiment.

  As shown in FIG. 10, in this embodiment, a diaphragm 16 that closes the concave portion 11 is prepared, and the connector case 10 is immersed in a container 42 in which the photocurable resin 51 is stored, thereby making the concave portion 11 the photocurable resin. 51 and the diaphragm 16 is placed in the container 42 so that the recess 11 is closed. Thereafter, the photocurable resin 51 is selectively irradiated to the photocurable resin 51 by using a photocuring device, thereby partially curing the photocurable resin 51 and joining the diaphragm 16 and the connector case 10 together. At this time, the pressure detection chamber 17 is configured by the portion surrounded by the diaphragm 16 and the recess 11, and the pressure detection chamber 17 is filled with the photocurable resin 51.

  In addition, the diaphragm 16 of this embodiment uses what was formed by hardening | curing the photocurable resin 51 previously. When the diaphragm 16 is formed in advance by curing the photocurable resin 51, for example, the diaphragm 16 can be formed as follows. FIG. 11 is a schematic cross-sectional view in the middle of forming the diaphragm 16 using the photocurable resin 51.

  As shown in FIG. 11, a mold 47 having a predetermined shape is placed in a container 42 in which a photocurable resin 51 is stored, and a photocuring device is used to selectively emit light such as a laser. By irradiating the resin 51, the photocurable resin 51 can be partially cured to form the diaphragm 16 along the shape of the mold 47. In this embodiment, since light needs to pass through the mold 47, it is preferable to configure the mold 47 using, for example, acrylic.

  According to such a pressure sensor manufacturing method, the connector case 10 is arranged in the container 42 in which the photocurable resin 51 is stored, the concave portion 11 is filled with the photocurable resin 51, and the diaphragm 16 is formed in the concave portion 11. Since the diaphragm 16 and the connector case 10 are joined after being arranged so as to be closed, the pressure sensor can be manufactured without performing a vacuuming step.

  Furthermore, according to such a pressure sensor manufacturing method, the diaphragm 16 can be freely selected. When the diaphragm 16 is cured using the photocurable resin 51 along the shape of the mold 47, the diaphragm 16 is formed by curing the photocurable resin 51 without using the mold 47. As compared with the above, the shape of the diaphragm 16 can be set in detail, and the accuracy of the pressure sensor can be improved.

(10th Embodiment)
A tenth embodiment of the present invention will be described. The manufacturing method of the pressure sensor of this embodiment forms the diaphragm 16 with respect to 1st Embodiment so that the gauge resistance with which the sensor chip 21a was equipped may be protected, and others are 1st Embodiment. Since it is the same, description is abbreviate | omitted here. FIG. 12 is a diagram showing a cross-sectional configuration of a pressure sensor configured by applying the pressure sensor manufacturing method of the present embodiment.

  As shown in FIG. 12, in the present embodiment, the end portion on one end side (the lower end side in FIG. 12) of the terminal 12 is exposed from the bottom surface of the recess 11 around the mounting region of the sensor portion 21. Has been placed.

  Further, the sensor unit 21 is provided with a diaphragm 16 that receives a measurement medium. Specifically, the diaphragm 16 is provided in the sensor unit 21 so as to cover the gauge resistance formed on the sensor chip 21a and not to contact the gauge resistance. A portion between the diaphragm 16 and the sensor chip 21a is filled with a photocurable resin 51. In the present embodiment, the gauge resistance corresponds to the semiconductor element of the present invention.

  Furthermore, a through electrode 22 is disposed in the sensor chip 21a and the base 21b. A portion of the through electrode 22 exposed from the pedestal 21 b is electrically connected to one end side of the terminal 12.

  In addition, an annular groove 19 is formed in the connector case 10 so as to surround the recess 11, and an O-ring 20 made of silicone rubber or the like is disposed in the groove 19. As a result, the measurement medium introduced from the pressure introduction hole 33 is sealed in the chamber 34.

  Such a pressure sensor is manufactured as follows. FIG. 13 is a schematic cross-sectional view in the middle of providing the diaphragm 16 on the semiconductor wafer 23 including the sensor unit 21 according to the present embodiment.

  As shown in FIG. 13, in this embodiment, a plurality of gauge resistors constituting the semiconductor element are formed, the semiconductor wafer 23 provided with the pedestal 21 b is fixed to the stage 41, and the stage 41 is stored by the photocurable resin 51. The semiconductor wafer 23 is immersed in the photo-curable resin 51 by being disposed in the container 42 that is provided. After that, by using a photocuring device and selectively irradiating the photocurable resin 51 with light such as a laser, the photocurable resin 51 is partially cured to cover each gauge resistance and contact the gauge resistance. The diaphragm 16 that is not to be formed is formed. At this time, the portion between the diaphragm 16 and the gauge resistance is filled with the photocurable resin 51.

  Subsequently, using a laser or the like, a plurality of through holes penetrating the semiconductor wafer 23 and the pedestal 21b are formed, and after insulating the through holes, each of the through holes is filled with a metal so that each gauge resistance and electrical A through electrode 22 connected to is formed. Next, the sensor part 21 provided with the diaphragm 16 and the through electrode 22 is formed by dividing the semiconductor wafer 23 into chips.

  Thereafter, the connector case 10 including the terminal 12 having the above-described shape is prepared, and the pressure sensor of the present embodiment is configured by electrically connecting the through electrode 22 and the terminal 12 by disposing the sensor portion 21 in the recess 11. Manufactured.

  Also in the manufacturing method of such a pressure sensor, when forming the diaphragm 16 provided in the sensor unit 21, the semiconductor wafer 23 is formed soaked in the photo-curable resin 51, and a step of evacuating is performed. Without it, the pressure sensor can be manufactured. Further, since the diaphragm 16 is formed so that the semiconductor wafer 23 is disposed in the container 42 and the respective gauge resistances are covered, the sensor chip 21a including a plurality of diaphragms 16 can be manufactured at a time. Can be improved.

(Eleventh embodiment)
An eleventh embodiment of the present invention will be described. The manufacturing method of the pressure sensor of the present embodiment is the same as that of the first embodiment except that the connector case 10 is formed of the photocurable resin 51 with respect to the first embodiment. Description is omitted. FIG. 14 is a schematic cross-sectional view in the middle of forming the connector case 10 and the diaphragm 16 of the present embodiment.

  As shown in FIG. 14, in the present embodiment, a photocuring device is used to selectively irradiate the photocurable resin 51 with light such as a laser, thereby curing the photocurable resin 51 and thereby the connector case 10. And the diaphragm 16 is formed. Specifically, after the sensor unit 21 and the terminal 12 are electrically connected, the terminal 12 is fixed to the stage 41, and the stage 41 is immersed in a container 42 in which the photocurable resin 51 is stored. Thereafter, the photo-curing resin 51 is partially cured by selectively irradiating the photo-curing resin 51 with light such as a laser using a photo-curing device, and the connector having the shape described in the first embodiment. Case 10 and diaphragm 16 are formed.

  Even with such a pressure sensor, since the pressure sensor can be manufactured without performing the vacuuming step, the same effect as the first embodiment can be obtained.

  In the present embodiment, since the connector case 10 and the diaphragm 16 are formed by partially curing the photocurable resin 51, a material that transmits light through the stage 41 and the container 42, for example, acrylic is used. It is preferable to be able to irradiate light from a plurality of directions.

(Other embodiments)
In each of the above embodiments, the manufacturing method in which the housing 30 is assembled to the connector case 10 and the pressure sensor is configured has been described as an example. However, the pressure sensor manufacturing method in which the housing 30 is not assembled to the connector case 10 is used. You can also. In this case, for example, a connector case 10 provided with a screw portion for fixing the pressure sensor to the outer peripheral wall surface may be prepared.

  Moreover, it can also be set as the manufacturing method of the pressure sensor which combined said each embodiment. For example, the sixth embodiment is combined with the first, second, seventh, and eighth embodiments, and the photocurable resin 51 is used so that the cross section in the direction parallel to the central axis of the connector case 10 has a wave shape. It can also be set as the manufacturing method of the pressure sensor which forms the diaphragm 16 by making it harden | cure. And when the said 2nd Embodiment is combined with the said 8th Embodiment, the photocurable resin 51 which was not hardened | cured remains on one surface on the opposite side to the bottom face of the recessed part 11 among the diaphragms 16. However, for example, the remaining photocurable resin 51 can be removed with an organic solvent such as ethanol or ketone.

  Furthermore, before combining the said 7th Embodiment with the said 1st, 2nd, 8th embodiment and forming the diaphragm 16, it is the area | region with which the recessed part 11 was filled among the photocurable resins 51, And it can also be set as the manufacturing method of the pressure sensor which hardens the photocurable resin 51 partially by irradiating light selectively to the area | region different from a diaphragm formation scheduled area | region. Further, the seventh embodiment is combined with the ninth embodiment, and before the diaphragm 16 is disposed so that the concave portion 11 is closed, the region of the photocurable resin 51 filled in the concave portion 11 is compared. It can also be set as the manufacturing method of the pressure sensor which hardens photocuring resin 51 partially by irradiating light selectively.

  Moreover, in each embodiment except the said 8th, 10th embodiment, the pressure sensor using the connector case 10 comprised by joining the case provided with the recessed part 11 and the case provided with the opening part 13 is used. By using the manufacturing method, the amount of the photocurable resin 51 stored in the container 42 can be reduced. Specifically, in the case of the manufacturing method of such a pressure sensor, after the case having the recess 11 is immersed in the container 42 to form the diaphragm 16, the case is joined to the case having the opening 13. Thus, the connector case 10 including the diaphragm 16 can be formed.

  In particular, in the eleventh embodiment, the manufacturing process can be simplified by adopting the following manufacturing method. That is, first, a case provided with the opening 13 in advance is prepared. Then, the sensor unit 21 and the terminal 12 are dipped in the container 42 to form a peripheral region of the connector case 10 on which the sensor unit 21 is mounted and the diaphragm 16 to form a case having the recess 11 having the diaphragm 16. This case may be joined to the case having the opening 13 to form the connector case 10 having the diaphragm 16.

  Furthermore, in the said 2nd Embodiment, as the connector case 10, the hollow part 18 which goes around a side wall in the part of the one surface side provided with the recessed part 11 among the areas surrounding the sensor part 21 among the side walls of the recessed part 11 is provided. Although the manufacturing method of the pressure sensor using what was provided was demonstrated, of course, it can also be set as the manufacturing method of the pressure sensor using the connector case 10 provided with another hollow part 18. FIG. For example, the connector case 10 in which a plurality of depressions 18 are scattered in the same part as the part where the depressions 18 are formed in the side wall of the depressions 11 is prepared, and the diaphragm 16 so as to enter the depressions 18. It can also be set as the manufacturing method of the pressure sensor which forms.

  In the fourth and fifth embodiments, the method of manufacturing the pressure sensor in which the reflecting plate 46 is disposed on the bottom surface of the container 42 to form the diaphragm 16 has been described, but the stage 41 is similar to the eleventh embodiment. In addition, the container 42 may be made of acrylic or the like that transmits light, and a method of manufacturing a pressure sensor that forms the diaphragm 16 by irradiating light from the bottom surface side of the container 42 may be used.

  Moreover, in the said 4th Embodiment, it can also be set as the manufacturing method of the pressure sensor which used inert gas, such as Ar, as the material 53 with light specific gravity, for example. When the pressure sensor manufacturing method using an inert gas is used, the pressure detection chamber 17 is filled with an inert gas such as Ar, so that the bonding wire 14 is prevented from corroding. It is possible to manufacture a pressure sensor that can Furthermore, in the case of the pressure sensor manufacturing method using an inert gas, a pressure sensor that is low in responsiveness but insensitive to noise such as vibration can be configured as in the fifth embodiment. .

  Furthermore, in the sixth embodiment, the region where the laser is condensed by the lens 45 is changed to cure the photocurable resin 51 so that the cross section in the direction parallel to the central axis of the connector case 10 has a wave shape. Although the manufacturing method of the pressure sensor for forming the diaphragm 16 has been described, it is of course possible to form the diaphragm 16 having a corrugated cross section by another method. For example, by selectively irradiating the photocurable resin 51 with light, the photocurable resin 51 is cured to form a plurality of cured resin layers, and the plurality of cured resin layers form the central axis of the connector case 10. It can also be set as the manufacturing method of the pressure sensor which forms the diaphragm 16 from which the cross section of a parallel direction becomes a waveform.

  In the ninth embodiment, the manufacturing method of the pressure sensor using the diaphragm 16 formed by curing the photocurable resin 51 in advance has been described. However, as the diaphragm 16, for example, a pressure sensor using a metal diaphragm is used. It can also be set as this manufacturing method.

  Moreover, in the said 10th Embodiment, although the penetration electrode 22 was formed in the sensor part 21 and the structure of the pressure sensor which electrically connects the penetration electrode 22 and the terminal 12 was demonstrated, for example, the said 1st Embodiment In this manner, a configuration of a pressure sensor that electrically connects the sensor unit 21 and the terminal 12 via the bonding wire 14 may be employed. In this case, for example, a pad that is electrically connected to the bonding wire 14 is provided on the outer edge portion of the surface of the sensor chip 21a, and is an area inside the pad and covers the gauge resistance. What is necessary is just to make the manufacturing method of the pressure sensor which forms the diaphragm 16 which does not contact.

  Furthermore, in the tenth embodiment, the method for manufacturing the pressure sensor in which the semiconductor wafer 23 provided with the pedestal 21b is immersed in the container 42 has been described. However, only the semiconductor wafer 23 is immersed in the container 42 to form the diaphragm 16, and the diaphragm 16 It is also possible to configure the sensor unit 21 by joining the semiconductor wafer 23 provided with the base 21b and the through electrode 22 and then dividing the semiconductor wafer 23 into chips.

It is a figure which shows the cross-sectional structure of the pressure sensor comprised by applying the manufacturing method of the pressure sensor concerning 1st Embodiment of this invention. It is a cross-sectional schematic diagram in the middle of having provided the diaphragm in the connector case shown in FIG. It is a cross-sectional schematic diagram in the middle of having provided the diaphragm in the connector case among the manufacturing processes of the pressure sensor concerning 2nd Embodiment of this invention. It is a cross-sectional schematic diagram in the middle of having provided the diaphragm in the connector case among the manufacturing processes of the pressure sensor concerning 3rd Embodiment of this invention. It is a cross-sectional schematic diagram in the middle of having provided the diaphragm in the connector case among the manufacturing processes of the pressure sensor concerning 4th Embodiment of this invention. It is a cross-sectional schematic diagram in the middle of having provided the diaphragm in the connector case among the manufacturing processes of the pressure sensor concerning 5th Embodiment of this invention. It is a cross-sectional schematic diagram in the middle of having provided the diaphragm in the connector case among the manufacturing processes of the pressure sensor concerning 6th Embodiment of this invention. It is a cross-sectional schematic diagram in the middle of having provided the diaphragm in the connector case among the manufacturing processes of the pressure sensor concerning 7th Embodiment of this invention. It is a cross-sectional schematic diagram in the middle of having provided the diaphragm in the connector case among the manufacturing processes of the pressure sensor concerning 8th Embodiment of this invention. It is a cross-sectional schematic diagram in the middle of having provided the diaphragm in the connector case among the manufacturing processes of the pressure sensor concerning 9th Embodiment of this invention. It is a cross-sectional schematic diagram in the middle of forming the diaphragm shown in FIG. It is a figure which shows the cross-sectional structure of the pressure sensor comprised by applying the manufacturing method of the pressure sensor concerning 10th Embodiment of this invention. It is a cross-sectional schematic diagram in the middle of having provided the diaphragm in the semiconductor wafer containing the sensor part shown in FIG. It is a cross-sectional schematic diagram in the middle of forming the connector case and diaphragm among the manufacturing processes of the pressure sensor concerning 11th Embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Connector case 11 Recessed part 12 Terminal 16 Diaphragm 17 Pressure detection chamber 21 Sensor part 30 Housing 31 Housing recessed part 41 Stage 42 Container 43 Laser light source 44 Mirror 45 Lens 51 Photocurable resin

Claims (15)

A case (10) having a recess (11) on one side;
A sensor part (21) mounted in the recess (11) and outputting an electrical signal corresponding to the pressure of the measurement medium;
A diaphragm (16) for closing the recess (11) and receiving the measurement medium;
Electrically connecting the sensor part (21) and the outside, and a terminal (12) provided in the case (10),
An area surrounded by the recess (11) and the diaphragm (16) is a pressure detection chamber (17), and the pressure detection chamber (17) includes the sensor unit (21). ,
Disposing the sensor part (21) in the recess (11) and electrically connecting the sensor part (21) and the terminal (12);
Filling the concave portion (11) with a photocurable resin (51);
By selectively irradiating the photocurable resin (51) with light, the photocurable resin (51) is partially cured to form a diaphragm (16) that closes the recess (11). A process for manufacturing the pressure sensor.   In the step of filling the concave portion (11) with the photocurable resin (51), the concave portion (11) is obtained by immersing the case (10) in a container (42) in which the photocurable resin (51) is stored. The method of manufacturing a pressure sensor according to claim 1, wherein the photocurable resin is filled with the photocurable resin.   In the step of filling the concave portion (11) with the photocurable resin (51), the photocurable resin (51) is injected from the outside of the case (10) to inject the concave portion (11) with the photocurable resin. The method for manufacturing a pressure sensor according to claim 1, wherein the pressure sensor is filled with a resin (51).   The diaphragm (16) is formed in a state in which, in the step of forming the diaphragm (16), the concave portion (11) is filled with the photocurable resin (51). The manufacturing method of the pressure sensor as described in any one. When the sensor part (21) is arranged as the case (10), a depression (18) is formed in a portion of the side surface of the recess (11) that is on the one surface side of the region surrounding the sensor part (21). Prepare a thing with
In the step of forming the diaphragm (16), the concave portion (11) is filled with the photocurable resin (51) so that a part of the diaphragm (16) enters the hollow portion (18). The method of manufacturing a pressure sensor according to any one of claims 1 to 3, wherein the diaphragm (16) is formed. After performing the step of filling the concave portion (11) with the photocurable resin (51), the one surface of the case (10) and the photocurable resin (51) stored in the container (42) and the outside air The material (52) having a heavier specific gravity than the photocurable resin (51) is injected into the concave portion (11), so that the photocurable resin is introduced from the concave portion (11). (51) is removed and the recess (11) is filled with a material (52) heavier than the photocurable resin (51).
In the step of forming the diaphragm (16), the case (10) is disposed in the container (42), and the concave portion (11) has a higher specific gravity than the photocurable resin (51). 3. The method of manufacturing a pressure sensor according to claim 2, wherein the diaphragm (16) is formed in a state of being filled with a material (52). After the step of filling the concave portion (11) with the photocurable resin (51), the one surface of the case (10) and the bottom surface of the container (42) are arranged to face each other, and the photocuring is performed. The material (53) having a lighter specific gravity than the curable resin (51) is injected into the concave portion (11), thereby removing the photocurable resin (51) from the concave portion (11) and removing the concave portion (11) from the concave portion (11). Filling with a lighter material (53) than the photocurable resin (51),
In the step of forming the diaphragm (16), the case (10) is placed in the container (42), and the concave portion (11) is lighter in specific gravity than the photocurable resin (51). 3. The method of manufacturing a pressure sensor according to claim 2, wherein the diaphragm (16) is formed in a state of being filled with a material (53). After performing the step of filling the concave portion (11) with the photocurable resin (51), the case (10) is placed so that the one surface of the case (10) and the bottom surface of the container (42) face each other. And the one surface of the case (10) is pulled up to the interface between the photocurable resin (51) stored in the container (42) and the outside air, and the recess (11) is raised to the photocurable resin (51). ) Is filled with vaporized gas,
The method for manufacturing a pressure sensor according to claim 2, wherein in the step of forming the diaphragm (16), the diaphragm (16) is formed in a state where the recess (11) is filled with the gas.   In the step of forming the diaphragm (16), the photocurable resin (51) is cured so that the cross section in the direction parallel to the central axis of the case (10) has a wave shape, thereby forming the diaphragm (16). The method for manufacturing a pressure sensor according to claim 1, wherein: Before performing the step of forming the diaphragm (16), the region of the photocurable resin (51) filled in the recess (11) and different from the region where the diaphragm is to be formed By selectively irradiating with light, partially curing the photocurable resin (51),
In the step of forming the diaphragm (16), the diaphragm (16) is formed with the cured portion of the photocurable resin (51) included in the recess (11). Item 10. The method for manufacturing a pressure sensor according to any one of Items 1 to 5 and 9. A case (10) having a recess (11) on one side;
A sensor part (21) mounted in the recess (11) and outputting an electrical signal corresponding to the pressure of the measurement medium;
A diaphragm (16) for closing the recess (11) and receiving the measurement medium;
Electrically connecting the sensor part (21) and the outside, and a terminal (12) provided in the case (10),
An area surrounded by the recess (11) and the diaphragm (16) is a pressure detection chamber (17), and the pressure detection chamber (17) includes the sensor unit (21). ,
Disposing the sensor part (21) in the recess (11) and electrically connecting the sensor part (21) and the terminal (12);
Preparing the diaphragm (16);
By immersing the case (10) in a container (42) in which a photocurable resin (51) is stored, the recess (11) is filled with the photocurable resin (51), and the diaphragm (16) is Placing the container (42) such that the recess (11) is closed;
By selectively irradiating light to the photocurable resin (51) in a state where the case (10) and the diaphragm (16) are disposed in the container (42), the photocurable resin is obtained. Joining the diaphragm (16) and the case (10) so as to partially harden (51) and close the recess (11). .   In the step of preparing the diaphragm (16), a mold (47) having a predetermined shape is disposed in the container (42), and the photocurable resin (51) is selectively irradiated with light. The method of manufacturing a pressure sensor according to claim 11, wherein the diaphragm (16) having the predetermined shape is prepared by partially curing the photocurable resin (51). Prior to the step of disposing the diaphragm (16) so as to close the recess (11), the photocurable resin (51) is selectively selected from the region filled in the recess (11). Irradiating with light, a step of partially curing the photocurable resin (51),
In the step of forming the diaphragm (16), the diaphragm (16) is formed with the cured portion of the photocurable resin (51) included in the recess (11). Item 13. A method for manufacturing a pressure sensor according to Item 11 or 12. A case (10) having a recess (11) on one side;
A sensor part (21) mounted in the recess (11) and outputting an electrical signal corresponding to the pressure of the measurement medium;
A diaphragm (16) provided in the sensor unit (21) and receiving the measurement medium;
A sensor (21) electrically connected to the outside, and a terminal (12) provided in the case (10), and a pressure sensor manufacturing method comprising:
Preparing a semiconductor wafer (23) on which a plurality of semiconductor elements are formed, and immersing the semiconductor wafer (23) in a container (42) in which a photocurable resin (51) is stored;
The light curable resin (51) is partially irradiated by selectively irradiating the light curable resin (51) with the semiconductor wafer (23) disposed in the container (42). Forming the diaphragm (16) on the semiconductor wafer (23) so as to cover each of the semiconductor elements and not to contact the semiconductor elements;
And a step of dividing the semiconductor wafer (23) into chips. A case (10) having a recess (11) on one side;
A sensor part (21) mounted in the recess (11) and outputting an electrical signal corresponding to the pressure of the measurement medium;
A diaphragm (16) for closing the recess (11) and receiving the measurement medium;
Electrically connecting the sensor part (21) and the outside, and a terminal (12) provided in the case (10),
An area surrounded by the recess (11) and the diaphragm (16) is a pressure detection chamber (17), and the pressure detection chamber (17) includes the sensor unit (21). ,
Electrically connecting the sensor unit (21) and the terminal (12);
Arranging the sensor part (21) and the terminal (12) in a container (42) in which a photocurable resin (51) is stored;
By selectively irradiating light to the photocurable resin (51) in a state where the sensor unit (21) and the terminal (12) are arranged in the container (42), the photocurable resin is obtained. (51) is partially cured to form the case (10) in which the sensor portion (21) is mounted in the recess (11) and the diaphragm (16) that closes the recess (11). A method of manufacturing a pressure sensor.

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