JP2010120068A - Joining apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To reliably dechuck an object to be joined which is held by a chuck. <P>SOLUTION: A joining apparatus comprises a chuck 12, a member 24, and a supply and exhaust device. A holding face 21, a cylinder chamber 23 and a hole 27 are formed in the chuck 12. The holding face 21 comes into contact with an object 22 to be joined when the chuck 12 holds the object 22. The cylinder chamber 23 is formed inside the chuck 12. The member 24 separates the cylinder chamber 23 to a first chamber 26 and a second chamber 25. The hole 27 connects the second chamber 25 to the holding face 21. The supply and exhaust device supplies air to the first chamber 26, or exhausts air from the first chamber 26. The member 24 has a projection part which is projected from the holding face 21 via the hole 27 by supplying air to the first chamber 26. The joining apparatus can reliably dechuck the object 22 to be held by the holding face 21 by projecting the projection part from the holding face 21. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a bonding apparatus, and more particularly to a bonding apparatus that bonds objects to be bonded held by a chuck.

  A MEMS (Micro Electro Mechanical Systems) in which fine electrical parts and mechanical parts are integrated is known. Examples of the MEMS include a micromachine, a pressure sensor, and a micro motor. The MEMS is formed by sealing a vibration structure exemplified by a cantilever. Such a MEMS is manufactured by joining chips together. In a bonding apparatus that performs such bonding, the two chips to be bonded are mainly held and bonded to the electrostatic chuck by electrostatic attraction. When a large amount of product is produced using such bonding, it is desired to bond the chips in a shorter time, and it is desirable to reliably dechuck the chips from the electrostatic chuck in a shorter time.

  Japanese Patent Application Laid-Open No. 05-329731 discloses a vacuum chuck that always holds and holds a to-be-held body with a stable suction force without causing a decrease in the degree of vacuum due to adhesion of foreign matters such as chips. The vacuum chuck is provided with a retractable elastic valve in a valve chamber provided with an arc-shaped valve seat having a small hole communicating with the vacuum chamber, and a small hole shielding portion for shielding the small hole of the valve seat on the elastic valve. Except for this, it is characterized in that a plurality of fine holes that can be expanded in diameter are formed.

JP 05-329731 A

  The subject of this invention is providing the joining apparatus which dechucks the joining object hold | maintained at a chuck | zipper more reliably from the chuck | zipper.

  In the following, means for solving the problems will be described using the reference numerals used in the best modes and embodiments for carrying out the invention in parentheses. This reference numeral is added to clarify the correspondence between the description of the claims and the description of the best mode for carrying out the invention / example, and is described in the claims. It should not be used to interpret the technical scope of the invention.

  The joining device (1) according to the present invention includes a chuck (12) (30) (40) (50) (60), a member (24) (33) (43) (53) (63), and an air supply / exhaust device (17). And. The chucks (12), (30), (40), (50), and (60) include the holding surfaces (21), (31), (41), (51), and (61) and the cylinder chambers (23), (32), (42), and (52). ) (62) and holes (27) (37) (47) (58) (68-1 to 68-n) are formed. The holding surfaces (21), (31), (41), (51), and (61) are the objects to be joined when the chucks (12), (30), (40), (50), and (60) hold the joining object (22). 22). The cylinder chambers (23) (32) (42) (52) (62) are formed inside the chucks (12) (30) (40) (50) (60). The members (24), (33), (43), (53), and (63) are formed by replacing the cylinder chambers (23), (32), (42), (52), and (62) with the first chambers (26), (35), (45), and (55). ) (65) and the second chamber (25) (34) (44) (54) (64). The holes (27) (37) (47) (58) (68-1 to 68-n) are formed in the second chamber (25) (34) (44) (54) (64) and the holding surface (21) (31). ) (41) (51) (61). The air supply / exhaust device (17) supplies air to the first chamber (26) (35) (45) (55) (65), or the first chamber (26) (35) (45) (55) ( 65) Exhaust air. The members (24), (33), (43), (53), and (63) are provided with holes (27) and (37) by supplying air to the first chambers (26), (35), (45), (55), and (65). ) (47) (58) (68-1 to 68-n) through the holding surfaces (21) (31) (41) (51) (61) projecting portions (36) (46) (56) (68-1 to 68-n) are formed. At this time, the joining device (1) projects the protrusions (36) (46) (56) (68-1 to 68-n) from the holding surfaces (21) (31) (41) (51) (61). By doing so, the joining object (22) held by the holding surfaces (21) (31) (41) (51) (61) can be more reliably dechucked.

  The protrusions (46) (56) (68-1 to 68-n) are formed by the members (24), (43), (53), and (63) on the wall surfaces of the cylinder chambers (23), (42), (52), and (62). It is preferable to protrude from the holding surfaces (21), (41), (51), and (61) by sliding and moving.

  The holding surfaces (21) (41) (51) (61) are vertically downward. At this time, the members (24), (43), (53), and (63) are moved to the holding surfaces (21), (41), (51), and (61) by gravity, and the joining device (1) is moved to the members (24). ) (43) (53) (63) need not be provided with a mechanism for moving the holding surfaces (21), (41), (51), and (61) to the holding surfaces (21), (41), (61). The members (24), (43), (53), and (63) can be more easily arranged on the (61) side. As a result, the joining apparatus (1) can depressurize the second chambers (25), (44), (54), and (64) more reliably and can hold the joining object (22) more reliably.

  The joining device (1) according to the present invention further includes a throat for connecting the first chamber (26) (45) (55) (65) and the second chamber (25) (44) (54) (64). Yes. At this time, the joining device (1) can depressurize the second chamber (25) (44) (54) (64) by depressurizing the first chamber (26) (45) (55) (65). It is possible to hold the joining object (22) more reliably.

  The throat is preferably formed inside the members (24) (43) (53) (63).

  The member (24) is formed in a sphere. Such a member (24) can be produced more easily, and the joining device (1) can be produced more easily.

  The chuck (60) has a plurality of holes (68-1 to 68-n) formed in the member (63). The member (63) has a plurality of protrusions (68-1 to 68-n) protruding from the holding surface (61) through the plurality of holes (68-1 to 68-n), respectively. Is preferred.

  The member (33) is fixed to the wall surface. The protrusion (36) preferably protrudes from the holding surface (31) when the member (33) is elastically deformed.

  The air supply / exhaust device (17) changes the pressure in the first chamber (35) by supplying and exhausting air to and from the first chamber (35). At this time, the joining apparatus (1) can change the extent to which the projection part (36) protrudes from a holding surface (31) by changing the pressure of a 1st chamber (35).

  The bonding apparatus according to the present invention can dechuck the chip more reliably from the chuck.

  Embodiments of a joining apparatus according to the present invention will be described with reference to the drawings. As shown in FIG. 1, the joining device 1 includes a gantry 2, a base 3, a press drive device 5, a stage 6, a leaf spring 7, an alignment drive device 8, a lower chuck 11, and an upper chuck 12. Piezoelectric elements 14-1 to 14-3, load cells 15-1 to 15-3, a control device 16 and an air supply / exhaust device 17 are provided.

  The control device 16 is a computer and includes a CPU, a storage device, an input device, a display device, and an interface (not shown). The CPU executes a computer program installed in the control device 16 to control the storage device, the input device, the output device, and the interface. The storage device records the computer program, records information used by the CPU, and records information generated by the CPU. The input device outputs information generated by being operated by the user to the CPU. Examples of the input device include a keyboard and a mouse. The display device displays a screen generated by the CPU. The interface outputs information generated by an external device connected to the control device 16 to the CPU, and outputs information generated by the CPU to the external device.

  The base 3 is supported by the bottom plate 10 so as to be movable in the vertical direction. The base 3 has a flat support surface at its upper end. The support surface is perpendicular to the vertical direction. The pressure contact driving device 5 is controlled by the control device 16 to drive the base 3 in parallel to the bottom plate 10 in the vertical direction. The stage 6 is formed in a plate shape and is disposed on the upper side of the base 3 so as to face the support surface of the base 3. The leaf spring 7 is formed of an elastic body and is joined to a part of the stage 6. The alignment driving device 8 is supported by the base 3 and is supported by a leaf spring 7 so that the stage 6 is separated from the support surface of the base 3 by about 100 μm. The alignment driving device 8 is controlled by the control device 16 so that the stage 6 translates in parallel in the horizontal direction, or the stage 6 rotates around a rotation axis parallel to the vertical direction. The leaf spring 7 is driven.

  The lower chuck 11 is generally formed in a disc shape. The piezoelectric elements 14-1 to 14-3 are respectively arranged at three positions that divide the circumference of the disk of the lower chuck 11 into three equal parts. Each of the piezoelectric elements 14-1 to 14-3 has one end joined to the base 3 and the other end joined to the lower chuck 11. Each of the piezoelectric elements 14-1 to 14-3 is controlled by the control device 16 to expand and contract. The load cell 15-i (i = 1, 2, 3) measures the force applied to the piezoelectric element 14-i and outputs the force to the control device 16.

  The gantry 2 is formed in a structure in which a base 3, a pressure driving device 5, a stage 6, a leaf spring 7, an alignment driving device 8, a lower chuck 11, and an upper chuck 12 are disposed inside. It is joined. The upper chuck 12 is disposed so as to face the lower chuck 11 and is joined to the gantry 2.

  At this time, when the leaf spring 7 presses the wafer held by the lower chuck 11 and the wafer held by the upper chuck 12, that is, the stage 6 is moved vertically upward by the pressing drive device 5. The stage 6 is elastically deformed so as to come into contact with the support surface of the base 3. In the bonding apparatus 1, the base 3 supports the stage 6 in this manner, so that the load held by the alignment driving device 8 exceeds the load held by the lower chuck 11 and the wafer held by the upper chuck 12. Larger loads can be applied.

  The air supply / exhaust device 17 includes a vacuum pump, a compressor, a valve, a pipe, and the like, and is controlled by the control device 16 to supply air to the upper chuck 12 or exhaust air from the upper chuck 12.

  The joining device 1 further includes an alignment device 19. The alignment device 19 is disposed inside a hole formed in the upper chuck 12. The alignment device 19 is controlled by the control device 16 to generate an image of the alignment mark formed on the lower chuck 11 and an image of the alignment mark formed on the upper chuck 12.

  The piezoelectric elements 14-1 to 14-3 can rotate and move the lower chuck 11 around a rotation axis perpendicular to the vertical direction, that is, the inclination of the lower chuck 11 can be changed. The piezoelectric elements 14-1 to 14-3 are further arranged closer to the lower chuck 11 than the alignment driving device 8 and the pressure contact driving device 5. For this reason, the joining apparatus 1 can reduce the horizontal displacement of the lower chuck 11 when the inclination of the lower chuck 11 is changed using the piezoelectric elements 14-1 to 14-3. The wafer held by the chuck 11 and the wafer held by the upper chuck 12 can be bonded with higher accuracy.

  FIG. 2 shows the upper chuck 12. The upper chuck 12 has a holding surface 21 formed of a dielectric layer at the lower end thereof. The upper chuck 12 holds the chip 22 on the holding surface 21 by an electrostatic force generated by the voltage applied between the dielectric layer and the chip 22. The upper chuck 12 has a plurality of cylinder chambers 23 formed therein. The cylinder chambers 23 are each formed in a cylindrical shape. The upper chip 22 includes a plurality of moving bodies 24. The plurality of moving bodies 24 are each formed from an elastic body exemplified by rubber and resin, and are formed in a spherical shape that is approximately equal to the diameter of the cylinder of the cylinder chamber 23. The plurality of moving bodies 24 are respectively arranged inside the plurality of cylinder chambers 23. Each of the cylinder chambers 23 is divided into a holding surface side chamber 25 and a flow path side chamber 26 by the moving body 24.

  In the upper chuck 12, a plurality of holes 27 arranged in a lattice shape are further formed in the holding surface 21. The plurality of holes 27 respectively penetrate the holding surface side chambers 25 of the plurality of cylinder chambers 23 from the holding surface 21. The plurality of holes 27 further have a diameter smaller than the diameter of the moving body 24 so that the moving body 24 does not come out of the cylinder chamber 23 and a part of the moving body 24 protrudes from the holding surface 21. It is formed in a circle. The upper chuck 12 further has a flow path 28 formed therein. The flow path 28 connects the air supply / exhaust device 17 and the flow path side chambers 26 of the plurality of cylinder chambers 23.

  In the bonding method executed using the bonding apparatus 1, the user first places the plurality of upper chips on the holding surface 21 of the upper chuck 12 so that the plurality of upper chips to be bonded cover the plurality of holes 27. Deploy. The user exhausts the flow channel side chamber 26 of the cylinder chamber 23 using the air supply / exhaust device 17 after arranging the plurality of upper chips on the holding surface 21. At this time, the moving body 24 moves from the hole 27 side of the cylinder chamber 23 to the flow path 28 side by the exhaust. The upper chuck 12 depressurizes the holding surface side chamber 25 by such movement of the moving body 24, and adsorbs the plurality of upper chips to the holding surface 21 by the depressurization to hold the plurality of upper chips. The user further applies a predetermined voltage to the dielectric layer of the upper chuck 12 and holds the plurality of upper chips on the upper chuck 12 by the electrostatic force generated by the voltage.

  Next, the user causes the lower chuck 11 to hold the plate holding the plurality of lower chips so that the plurality of lower chips face the plurality of upper chips, respectively, thereby lowering the plurality of lower chips. The chip is held on the lower chuck 11. The plurality of lower chips are coated with an adhesive on the surface facing the plurality of upper chips. After the plurality of upper chips are held by the upper chuck 12 and the plurality of lower chips are held by the lower chuck 11, the control device 16 uses the pressure contact drive device 5 to move the lower chuck 11 to the upper side. The chuck 12 is brought close to a predetermined distance. Next, the control device 16 uses the alignment device 19 to capture an alignment mark on the image. Based on the captured image, the control device 16 drives the lower chuck 11 using the alignment drive device 8 so that the plurality of lower chips face the plurality of upper chips, respectively.

  After the plurality of lower chips and the plurality of upper chips are aligned, the control device 16 brings the load cells 15-1 to 15-3 into a fully extended state. Next, the control device 16 executes the operation in the first mode and the operation in the second mode.

  In the first mode, the control device 16 measures the force applied to the piezoelectric elements 14-1 to 14-3 using the load cells 15-1 to 15-3. The control device 16 determines whether or not a portion corresponding to the piezoelectric element 14-i among the plurality of lower chips held by the lower chuck 11 is in contact with the upper chip held by the upper chuck 12. That is, the control device 16 determines whether or not the force applied to the piezoelectric element 14-i is greater than a predetermined force.

  In the control device 16, the force applied to the piezoelectric element 14-i is greater than a predetermined force, and the force applied to the piezoelectric element 14-j (j = 1, 2, 3; j ≠ i) is greater than the predetermined force. When small, the piezoelectric element 14-i is shortened by a predetermined length. The control device 16 repeatedly executes such an operation until all of the forces applied to the piezoelectric elements 14-1 to 14-3 become larger than a predetermined force. The control device 16 starts the operation in the second mode when all of the forces applied to the piezoelectric elements 14-1 to 14-3 are larger than a predetermined force.

  In the second mode, the control device 16 measures the force applied to the piezoelectric elements 14-1 to 14-3 using the load cells 15-1 to 15-3. The control device 16 drives the lower chuck 11 using the pressure contact driving device 5 so that the sum of the three measured forces becomes a predetermined value. The control device 16 expands and contracts the piezoelectric element 14-1 so that the force applied to the piezoelectric element 14-1 is に な る of the predetermined force. The control device 16 expands and contracts the piezoelectric element 14-2 so that the force applied to the piezoelectric element 14-2 is 1/3 of the predetermined force. The control device 16 expands and contracts the piezoelectric element 14-3 so that the force applied to the piezoelectric element 14-3 is 1/3 of the predetermined force. The control device 16 repeatedly executes such an operation until the time during which the sum of the three measured forces is a predetermined value exceeds a predetermined time. According to such an operation, the plurality of lower chips and the plurality of upper chips are pressed and joined to the joining chip.

  When the operation in the second mode is completed, the control device 16 grounds the dielectric layer of the upper chuck 12. At this time, the upper chuck 12 may be in a state where the bonding chip is held because a slight charge remains in the dielectric layer. The control device 16 further supplies air to the flow channel side chamber 26 of the cylinder chamber 23 using the air supply / exhaust device 17, and separates the lower chuck 11 from the upper chuck 12 to a predetermined distance. At this time, the moving body 24 moves from the flow path 28 side of the cylinder chamber 23 to the hole 27 side by supplying the air, and a part of the moving body 24 protrudes from the holding surface 21 through the hole 27. . The user takes out the joining chip dechucked from the upper chuck 12 and held by the lower chuck 11 from the joining apparatus 1.

  According to such an operation, even if the upper chuck 12 has a charge remaining in the dielectric layer, a part of the moving body 24 is mechanically moved so that the bonding chip is separated from the holding surface 21. By pushing, the bonded chip can be dechucked more reliably. As a result, the bonding apparatus 1 can take out the bonded chip earlier, and can manufacture a plurality of bonded chips faster.

  In another embodiment of the bonding apparatus according to the present invention, the upper chuck 12 in the bonding apparatus 1 of the above-described embodiment is replaced with another upper chuck. As shown in FIG. 3, the upper chuck 30 has a holding surface 31 formed of a dielectric layer at its lower end. When a voltage is applied between the dielectric layer and the chip 22, the upper chuck 30 holds the chip 22 on the holding surface 31 by an electrostatic force generated by the voltage. The upper chuck 30 has a plurality of cylinder chambers 32 formed therein. The cylinder chambers 32 are each formed in a cylindrical shape. The upper chip 22 includes a plurality of flexible films 33. Each of the plurality of flexible films 33 is formed of an elastic body exemplified by rubber and resin, and divides the cylinder chamber 32 into a holding surface side chamber 34 and a flow path side chamber 35. The plurality of flexible films 33 are each joined with a protrusion 36.

  The upper chuck 30 is further formed with a plurality of holes 37 arranged in a lattice shape on the holding surface 31. The plurality of holes 37 respectively penetrate the holding surface side chambers 34 of the plurality of cylinder chambers 32 from the holding surface 31. The plurality of holes 37 are further formed larger than the protrusions 36 so that the protrusions 36 protrude from the holding surface 31. The upper chuck 30 further has a flow path 38 formed therein. The flow path 38 connects the air supply / exhaust device 17 and the flow path side chambers 35 of the plurality of cylinder chambers 32.

  When holding the upper chip on the upper chuck 30, the user first places the plurality of upper chips on the holding surface 31 of the upper chuck 30 so that the plurality of upper chips cover the plurality of holes 37. The user exhausts the flow path side chamber 35 of the cylinder chamber 32 using the air supply / exhaust device 17 after arranging the plurality of upper chips on the holding surface 31. At this time, the flexible membrane 33 is elastically deformed by the exhaust so that the holding surface side chamber 34 of the cylinder chamber 32 expands. In the upper chuck 30, the holding surface side chamber 34 is depressurized by such elastic deformation of the flexible film 33, and the plurality of upper chips are attracted to the holding surface 31 by the depressurization, and the plurality of upper chips are held. To do. The user further applies a predetermined voltage to the dielectric layer of the upper chuck 30 and holds the plurality of upper chips on the upper chuck 30 by the electrostatic force generated by the voltage.

  When the bonded chip is dechucked from the upper chuck 30, the control device 16 grounds the dielectric layer of the upper chuck 30, supplies air to the flow path side chamber 35 of the cylinder chamber 32 using the air supply / exhaust device 17, and The chuck 11 is separated from the upper chuck 30 by a predetermined distance. At this time, the flexible membrane 33 is supplied with the air so that the flow path side chamber 35 of the cylinder chamber 32 expands and the protruding portion 36 protrudes from the holding surface 31 through the hole 37. Elastically deforms. According to such elastic deformation, the protrusion 36 causes the upper chuck 30 to move the bonding chip so that the bonding chip is separated from the holding surface 31 even when charges remain in the dielectric layer. By pushing the target, the bonded chip can be dechucked more reliably. As a result, such a joining apparatus can take out the joining chip earlier, and can manufacture a plurality of joining chips faster, in the same manner as the joining apparatus 1 in the above-described embodiment.

  The user can also adjust the pressure of the air supplied to the flow path side chamber 35 of the cylinder chamber 32 using the air supply / exhaust device 17 when the chucking chip is dechucked from the upper chuck 30. According to such adjustment, it is possible to adjust the amount by which the flexible film 33 is elastically deformed, and it is possible to adjust the amount by which the protruding portion 36 protrudes from the holding surface 31, which is preferable.

  The flexible film 33 can be replaced with another flexible film in which a small hole is formed. Such a flexible membrane is exhausted from the holding surface side chamber 34 to the flow path 38 through the hole when the upper chuck 30 holds the upper chip, and the holding surface side chamber 34 is decompressed. According to such reduced pressure, the upper chuck 30 can adsorb the upper chip to the holding surface 31 more strongly, and can hold the upper chip more reliably, which is preferable.

  In still another embodiment of the bonding apparatus according to the present invention, the upper chuck 12 in the bonding apparatus 1 of the above-described embodiment is replaced with another upper chuck. As shown in FIG. 4, the upper chuck 40 has a holding surface 41 formed of a dielectric layer at its lower end. The upper chuck 40 holds the chip 22 on the holding surface 41 by an electrostatic force generated by the voltage applied between the dielectric layer and the chip 22. The upper chuck 40 has a plurality of cylinder chambers 42 formed therein. The cylinder chambers 42 are each formed in a cylindrical shape. The upper tip 22 includes a plurality of pistons 43. Each of the plurality of pistons 43 divides the cylinder chamber 42 into a holding surface side chamber 44 and a flow path side chamber 45. Each of the plurality of pistons 43 has a protrusion 46 formed on the holding surface side chamber 44 side.

  In the upper chuck 40, a plurality of holes 47 arranged in a lattice shape are further formed in the holding surface 41. The plurality of holes 47 respectively penetrate the holding surface side chambers 44 of the plurality of cylinder chambers 42 from the holding surface 41. The plurality of holes 47 are further formed larger than the protrusions 46 so that the protrusions 46 protrude from the holding surface 41. The upper chuck 40 further has a flow channel 48 formed therein. The flow path 48 connects the air supply / exhaust device 17 and the flow path side chambers 45 of the plurality of cylinder chambers 42.

  When holding the upper chip on the upper chuck 40, the user first places the plurality of upper chips on the holding surface 41 of the upper chuck 40 so that the plurality of upper chips cover the plurality of holes 47. The user exhausts the flow channel side chamber 45 of the cylinder chamber 42 using the air supply / exhaust device 17 after arranging the plurality of upper chips on the holding surface 41. At this time, the piston 43 moves from the holding surface 41 side of the cylinder chamber 42 to the flow path 38 side by the exhaust. In the upper chuck 40, the holding surface side chamber 44 is depressurized by such movement of the piston 43, and the plurality of upper chips are attracted to the holding surface 41 by the depressurization, and the plurality of upper chips are held. The user further applies a predetermined voltage to the dielectric layer of the upper chuck 40 and holds the plurality of upper chips on the upper chuck 40 by the electrostatic force generated by the voltage.

  When the bonded chip is dechucked from the upper chuck 40, the control device 16 grounds the dielectric layer of the upper chuck 40, supplies air to the flow path side chamber 45 of the cylinder chamber 42 using the air supply / exhaust device 17, and The chuck 11 is separated from the upper chuck 40 by a predetermined distance. At this time, the piston 43 moves from the flow path 48 side of the cylinder chamber 42 to the holding surface 41 side so that the protrusion 46 protrudes from the holding surface 41 through the hole 47 due to the supply of air. According to such movement, the protrusion 46 mechanically moves the bonding chip so that the bonding chip is separated from the holding surface 41 even when the charge remains in the dielectric layer. By pushing to, the bonded chip can be dechucked more reliably. As a result, such a joining apparatus can take out the joining chip earlier, and can manufacture a plurality of joining chips faster, in the same manner as the joining apparatus 1 in the above-described embodiment.

  In still another embodiment of the bonding apparatus according to the present invention, the upper chuck 12 in the bonding apparatus 1 of the above-described embodiment is replaced with another upper chuck. As shown in FIG. 5, the upper chuck 50 has a holding surface 51 formed of a dielectric layer at its lower end. The upper chuck 50 holds the chip 22 on the holding surface 51 by an electrostatic force generated by the voltage applied between the dielectric layer and the chip 22. The upper chuck 50 has a plurality of cylinder chambers 52 formed therein. The cylinder chambers 52 are each formed in a cylindrical shape. The upper tip 22 includes a plurality of pistons 53. Each of the plurality of pistons 53 divides the cylinder chamber 52 into a holding surface side chamber 54 and a flow path side chamber 55.

  Each of the plurality of pistons 53 has a protrusion 56 formed on the holding surface side chamber 54 side. Each of the plurality of pistons 53 further has a throat 57 formed therein. The throat 57 connects the holding surface side chamber 54 and the flow path side chamber 55. The throat 57 further gives a predetermined resistance to the air flow so that the piston 53 can move in the cylinder chamber 52 when the flow path side chamber 55 is depressurized or pressurized.

  In the upper chuck 50, a plurality of holes 58 arranged in a lattice shape are further formed in the holding surface 51. The plurality of holes 58 respectively penetrate the holding surface side chambers 54 of the plurality of cylinder chambers 52 from the holding surface 51. The plurality of holes 58 are further formed larger than the protrusions 56 so that the protrusions 56 protrude from the holding surface 51. The upper chuck 50 further has a flow path 59 formed therein. The flow path 59 connects the air supply / exhaust device 17 and the flow path side chambers 55 of the plurality of cylinder chambers 52.

  When holding the upper chip on the upper chuck 50, the user first places the plurality of upper chips on the holding surface 51 of the upper chuck 50 so that the plurality of upper chips cover the plurality of holes 58. The user exhausts the flow path side chamber 55 of the cylinder chamber 52 using the air supply / exhaust device 17 after arranging the plurality of upper chips on the holding surface 51. At this time, the piston 53 moves from the holding surface 51 side of the cylinder chamber 52 to the flow path 38 side by the exhaust. The upper chuck 50 depressurizes the holding surface side chamber 54 by such movement of the piston 53. The piston 53 further circulates air from the holding surface side chamber 54 to the flow path side chamber 55 via the throat 57 to further depressurize the holding surface side chamber 54. The reduced pressure attracts the plurality of upper chips to the holding surface 51 and holds the plurality of upper chips. The user further applies a predetermined voltage to the dielectric layer of the upper chuck 50, and holds the plurality of upper chips on the upper chuck 50 by the electrostatic force generated by the voltage.

  When the bonded chip is dechucked from the upper chuck 50, the control device 16 grounds the dielectric layer of the upper chuck 50, supplies air to the flow path side chamber 55 of the cylinder chamber 52 using the air supply / exhaust device 17, and The chuck 11 is separated from the upper chuck 50 by a predetermined distance. At this time, the piston 53 moves from the flow path 59 side of the cylinder chamber 52 to the holding surface 51 side so that the projection 56 protrudes from the holding surface 51 through the hole 58 by the supply of air. According to such movement, even if the upper chuck 50 has a charge remaining in the dielectric layer, the protrusion 56 mechanically moves the bonding chip so that the bonding chip is separated from the holding surface 51. By pushing to, the bonded chip can be dechucked more reliably. As a result, such a joining apparatus can take out the joining chip earlier, and can produce a plurality of joining chips faster, in the same manner as the joining apparatus 1 in the above-described embodiment.

  The throat 57 can be replaced with a flow path formed on the surface of the piston 53 that slides on the inner wall of the cylinder chamber 52. The throat 57 can also use the clearance as a flow path connecting the holding surface side chamber 54 and the flow path side chamber 55 by adjusting the clearance between the piston 53 and the cylinder chamber 52. Such a flow path can produce the same effect as that obtained by the throat 57.

  In still another embodiment of the bonding apparatus according to the present invention, the upper chuck 12 in the bonding apparatus 1 of the above-described embodiment is replaced with another upper chuck. As shown in FIG. 6, the upper chuck 60 has a holding surface 61 formed of a dielectric layer at its lower end. The upper chuck 60 holds the chip 22 on the holding surface 61 by an electrostatic force generated by the voltage applied between the dielectric layer and the chip 22. The upper chuck 60 has a plurality of cylinder chambers 62 formed therein. The cylinder chambers 62 are each formed in a cylindrical shape. The upper chip 22 includes a plurality of pistons 63. Each of the plurality of pistons 63 divides the cylinder chamber 62 into a holding surface side chamber 64 and a flow path side chamber 65.

  Each of the plurality of pistons 63 has protrusions 66-1 to 66-n (n = 2, 3, 4,...) Formed on the holding surface side chamber 64 side. Each of the plurality of pistons 63 further has a throat 67 formed therein. The throat 67 connects the holding surface side chamber 64 and the flow path side chamber 65. The throat 67 further provides a predetermined resistance to air flow so that the piston 63 can move in the cylinder chamber 62 when the flow path side chamber 65 is depressurized or pressurized.

  In the upper chuck 60, a plurality of holes arranged in a lattice shape are further formed in the holding surface 61. The plurality of holes are divided into a plurality of groups corresponding to the plurality of pistons 63. The plurality of holes 68-1 to 68-n included in one of the plurality of groups penetrates the holding surface side chambers 64 of the plurality of cylinder chambers 62 from the holding surface 61, respectively. Each of the holes 68-i (i = 1, 2, 3,..., N) of the plurality of holes 68-1 to 68-n further has a protruding portion so that the protruding portion 66-i protrudes from the holding surface 61. It is formed larger than 66-i. The upper chuck 60 further has a flow channel 69 formed therein. The flow path 69 connects the air supply / exhaust device 17 and the flow path side chambers 65 of the plurality of cylinder chambers 62.

  When holding the upper chip on the upper chuck 60, the user first places the plurality of upper chips on the holding surface 61 of the upper chuck 60 so that the plurality of upper chips cover the plurality of holes. The user exhausts the flow channel side chamber 65 of the cylinder chamber 62 using the air supply / exhaust device 17 after arranging the plurality of upper chips on the holding surface 61. At this time, the piston 63 moves from the holding surface 61 side of the cylinder chamber 62 to the flow path 38 side by the exhaust. The upper chuck 60 depressurizes the holding surface side chamber 64 by such movement of the piston 63. The piston 63 further circulates air from the holding surface side chamber 64 to the flow path side chamber 65 via the throat 67 to further depressurize the holding surface side chamber 64. The reduced pressure attracts the plurality of upper chips to the holding surface 61 and holds the plurality of upper chips. The user further applies a predetermined voltage to the dielectric layer of the upper chuck 60 and holds the plurality of upper chips on the upper chuck 60 by the electrostatic force generated by the voltage.

  When the bonded chip is dechucked from the upper chuck 60, the control device 16 grounds the dielectric layer of the upper chuck 60, supplies air to the flow channel side chamber 65 of the cylinder chamber 62 using the air supply / exhaust device 17, and The chuck 11 is separated from the upper chuck 60 by a predetermined distance. At this time, the piston 63 has a flow path 69 in the cylinder chamber 62 so that the protrusions 66-1 to 66-n protrude from the holding surface 61 through the holes 68-1 to 68-n by supplying air. It moves from the side to the holding surface 61 side. According to such movement, even if the upper chuck 60 has a charge remaining in the dielectric layer, the protrusions 66-1 to 66-n are separated from the holding surface 61 so that the joining chip is separated from the holding surface 61. By mechanically pushing the joining tip, the joining tip can be more reliably dechucked. As a result, such a joining apparatus can take out the joining chip earlier, and can manufacture a plurality of joining chips faster, in the same manner as the joining apparatus 1 in the above-described embodiment.

FIG. 1 is a cross-sectional view showing a bonding apparatus. FIG. 2 is a cross-sectional view showing the upper chuck. FIG. 3 is a cross-sectional view showing another upper chuck. FIG. 4 is a sectional view showing still another upper chuck. FIG. 5 is a sectional view showing still another upper chuck. FIG. 6 is a cross-sectional view showing still another upper chuck.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1: Joining device 2: Mounting base 3: Base 5: Driving device for pressure welding 6: Stage 7: Leaf spring 8: Driving device for alignment 10: Bottom plate 11: Lower chuck 12: Upper chuck 14-1 to 14-3: Piezoelectric Elements 15-1 to 15-3: Load cell 16: Control device 17: Air supply / exhaust device 19: Alignment device 21: Holding surface 22: Tip 23: Cylinder chamber 24: Moving body 25: Holding surface side chamber 26: Channel side chamber 27: Hole 28: Channel 30: Upper chuck 31: Holding surface 32: Cylinder chamber 33: Flexible membrane 34: Holding surface side chamber 35: Channel side chamber 36: Projection portion 37: Hole 38: Channel 40: Upper chuck 41: Holding surface 42: Cylinder chamber 43: Piston 44: Holding surface side chamber 45: Channel side chamber 46: Protrusion 47: Hole 48: Channel 50: Upper chuck 51: Holding surface 52: Siri Die chamber 53: Piston 54: Holding surface side chamber 55: Flow channel side chamber 56: Protruding portion 57: Throat 58: Hole 59: Channel 60: Upper chuck 61: Holding surface 62: Cylinder chamber 63: Piston 64: Holding surface side chamber 65 : Channel side chamber 66-1 to 66-n: Projection 67: Throat 68-1 to 68-n: Hole 69: Channel

Claims (9)

A chuck in which a cylinder chamber is formed;
A member for separating the cylinder chamber into a first chamber and a second chamber;
An air supply / exhaust device for supplying air to the first chamber or exhausting air from the first chamber;
The chuck further comprises:
A holding surface for holding the joining target;
A hole connecting the second chamber and the holding surface is formed;
The member is formed with a protrusion protruding from the holding surface through the hole when air is supplied to the first chamber. In claim 1,
The protruding portion protrudes from the holding surface when the member slides and moves on the wall surface of the cylinder chamber. In claim 2,
The holding surface is vertically downward. In claim 3,
The joining apparatus which further comprises the throat which connects the said 1st chamber and the said 2nd chamber. In claim 4,
The throat is a joining device formed inside the member. In claim 3,
The member is formed into a sphere. In claim 2,
The chuck has a plurality of holes formed in the member,
The member is formed with a plurality of protrusions that protrude from the holding surface through the plurality of holes, respectively. In claim 1,
The member is fixed to a wall surface;
The protruding portion protrudes from the holding surface when the member is elastically deformed. In claim 8,
The said air supply / exhaust apparatus changes the pressure of the said 1st chamber by supplying and exhausting the said 1st chamber.

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