JP2010082568A - Method of treating waste liquid - Google Patents
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Abstract
Description
本発明はシリコンなどの脆性材料を切削した後の廃液処理方法に関する。 The present invention relates to a waste liquid treatment method after cutting a brittle material such as silicon.
シリコンなどの脆性材料の切削には、ワイヤソーにスラリーを用いて切削が行われる。スラリーは砥粒を切削液に分散させたものであり、切削加工の際は、このスラリーがワイヤソーに供給されながら脆性材料を切断していく。 Cutting of brittle materials such as silicon is performed using a slurry for a wire saw. The slurry is obtained by dispersing abrasive grains in the cutting fluid, and the brittle material is cut while the slurry is supplied to the wire saw during the cutting process.
従来、シリコンの切削後のスラリー廃液は、遠心分離等により砥粒は大体回収できるものの回収廃液については、細かい切り粉を除去することができず、廃棄処理されていた。それでは費用がかかり環境にも負荷がかかるため廃液の再利用の検討がなされている。例えば、砥粒を遠心分離処理で除いた回収廃液を蒸留することにより切削液の主成分を回収する方法がある。一方、特許文献1にはスラリー廃液を二段階の遠心分離処理をした後、排出液に凝集剤を添加した後遠心分離をするスラリー廃液の再利用システムの記載がある。
しかしながら、廃液を蒸留して切削液の主成分を回収することは可能であるが、コストの面から実用的ではない。また、蒸留液からは、新液にはない異臭が発生することがあった。一方、特許文献1のシステムでは、遠心分離を用いるので、ある程度は砥粒や切り粉は除去できるものの有効クーラント中のシリコン微粉末を完全に除去することが困難であった。本発明は、スラリー廃液(切削廃液)からシリコン等の固形分微粉末を完全に分離し、清浄なクーラント(切削液主成分)に処理して再利用する方法を提供することを課題とする。 However, it is possible to recover the main component of the cutting fluid by distilling the waste fluid, but it is not practical in terms of cost. In addition, off-flavors that are not found in the new liquid may occur from the distillate. On the other hand, in the system of Patent Document 1, since centrifugal separation is used, it is difficult to completely remove silicon fine powder in the effective coolant although abrasive grains and chips can be removed to some extent. An object of the present invention is to provide a method for completely separating a solid fine powder such as silicon from a slurry waste liquid (cutting waste liquid), treating it into a clean coolant (cutting liquid main component), and reusing it.
本発明らは、上記課題を解決すべく鋭意検討の結果、廃スラリーを遠心分離処理した後、その回収液にケイ素化合物を添加して濾過をすることにより解決できることを知見し、本発明に至った。 As a result of intensive studies to solve the above-mentioned problems, the present inventors have found that the waste slurry can be solved by centrifuging and then adding a silicon compound to the recovered liquid and filtering it, resulting in the present invention. It was.
すなわち、脆性材料の切削廃液に遠心分離処理を行った後、その回収液にケイ素化合物を添加して濾過をすることを特徴とする脆性材料の切削廃液の処理方法である。 That is, the processing method of the brittle material cutting waste liquid is characterized in that the cutting waste liquid of the brittle material is subjected to a centrifugal separation process, and then the silicon compound is added to the recovered liquid for filtration.
また、上記廃液の処理方法において、ケイ素化合物が窒素原子および水酸基を有することを特徴とする廃液の処理方法である。 Further, in the above waste liquid treatment method, the waste liquid treatment method is characterized in that the silicon compound has a nitrogen atom and a hydroxyl group.
さらに上記廃液の処理方法において、ケイ素化合物が回収液全量に対して0.1〜2.0重量%であることを特徴とする廃液の処理方法である。
本発明は、脆性材料の切削廃液に遠心分離処理を行った後、その回収液に窒素原子および水酸基を有するケイ素化合物を添加後、遠心分離処理することを特徴とする廃液の処理方法である。
Further, in the above waste liquid treatment method, the waste liquid treatment method is characterized in that the silicon compound is 0.1 to 2.0% by weight based on the total amount of the recovered liquid.
The present invention is a waste liquid treatment method characterized by performing a centrifugal separation process on a cutting waste liquid of a brittle material, adding a silicon compound having a nitrogen atom and a hydroxyl group to the recovered liquid, and then performing a centrifugal separation process.
本発明の廃液の処理方法では、廃液中の微細な砥粒や切り粉の固形分をほとんど完全に除去できたため、切削液の主成分が清浄な状態で回収ができ、再利用が可能となるものである。 In the waste liquid processing method of the present invention, fine abrasive grains and solids of cutting chips in the waste liquid can be almost completely removed, so that the main component of the cutting liquid can be recovered in a clean state and can be reused. Is.
本発明の廃液処理方法は、まず脆性材料であるシリコン等をワイヤソーにて切削(スライシング)後のスラリー廃液を遠心分離処理にて砥粒を大体除去する工程である。シリコンの切削液は水性でも油性でもよい。また、固定砥粒のワイヤソーを用いる切削の場合は、スラリーにしないが切り粉等の固形物を除去する必要があるため遠心分離処理を行う。本発明が想定している切削廃液は、スラリー廃液とスラリーがない廃液の両者を含む。 The waste liquid treatment method of the present invention is a step of roughly removing abrasive grains by centrifugal treatment of slurry waste liquid after cutting (slicing) silicon or the like, which is a brittle material, with a wire saw. The silicon cutting fluid may be aqueous or oily. In the case of cutting using a wire saw of fixed abrasive grains, a centrifugal separation process is performed because it is necessary to remove solids such as swarf but not a slurry. The cutting waste liquid assumed by the present invention includes both slurry waste liquid and waste liquid without slurry.
水性切削液の主成分としては、エチレングリコール、ジエチレングリコール、プロピレングリコール、その他のポリアルキレングリコールやポリアルキレングリコールモノアルキルエーテル(分子量100〜2000)等が挙げられる。油性切削液の主成分は精製鉱油である。 Examples of the main component of the aqueous cutting fluid include ethylene glycol, diethylene glycol, propylene glycol, other polyalkylene glycols and polyalkylene glycol monoalkyl ethers (molecular weight: 100 to 2000). The main component of the oil-based cutting fluid is refined mineral oil.
この遠心分離処理では、通常大きな砥粒やシリコン切り粉は除去できるが微粉状のシリコンや砥粒はまだ液中に分散している。この遠心分離処理は、複数回繰り返してもよく、例えば1度目に100〜1000Gで大まかな砥粒を除去し、2度目に1000〜10000Gでより微細な分散固形物を除去する。 In this centrifugal separation process, normally large abrasive grains and silicon chips can be removed, but fine powder silicon and abrasive grains are still dispersed in the liquid. This centrifugation process may be repeated a plurality of times. For example, coarse abrasive grains are removed at 100 to 1000 G for the first time, and finer dispersed solids are removed at 1000 to 10,000 G for the second time.
次に遠心分離処理後の回収廃液にケイ素化合物を添加する工程である。 Next, it is a step of adding a silicon compound to the recovered waste liquid after the centrifugal separation treatment.
ケイ素化合物は、シリコン系消泡剤、シランカップリング剤などが例示される。この中でシランカップリング剤が好ましく、とりわけ窒素原子および水酸基を有するケイ素化合物がより好ましい。具体的には、
その添加量は、ケイ素化合物が回収液全量に対して0.1〜2.0重量%、好ましくは0.5〜1.5重量%である。
Examples of the silicon compound include silicon-based antifoaming agents and silane coupling agents. Among these, a silane coupling agent is preferable, and a silicon compound having a nitrogen atom and a hydroxyl group is particularly preferable. In particular,
The amount of silicon compound added is 0.1 to 2.0% by weight, preferably 0.5 to 1.5% by weight, based on the total amount of the recovered liquid.
ケイ素化合物を添加する際の回収廃液の温度は室温〜70℃で行われ、好ましくは50℃〜70℃である。そしてケイ素化合物を添加後、1〜60分程度攪拌し、濾過工程に移る。 The temperature of the recovered waste liquid when adding the silicon compound is room temperature to 70 ° C, preferably 50 ° C to 70 ° C. And after adding a silicon compound, it stirs for about 1 to 60 minutes, and moves to a filtration process.
濾過は自然濾過、減圧濾過、加圧濾過のいずれでもよいが濾過速度を上げるためには減圧または加圧濾過が好ましい。 Filtration may be any of natural filtration, vacuum filtration, and pressure filtration, but pressure reduction or pressure filtration is preferred to increase the filtration rate.
濾過装置は、減圧濾過はヌッチェ(ブフナーロート)が、加圧濾過はフィルタープレス、スクリュープレス、ベルトプレスを用いることができる。ヌッチェ上には濾紙または濾布を敷いて用いられ、濾過助剤をその上に敷き詰められるか又はケイ素化合物に添加して用いてもよい。濾過助剤はケイソウ土や白土等である。 As the filtration device, Nutsche (Buchner funnel) can be used for vacuum filtration, and a filter press, screw press, and belt press can be used for pressure filtration. A filter paper or filter cloth is laid on the Nutsche, and a filter aid may be laid on the filter or added to the silicon compound. The filter aid is diatomaceous earth or white clay.
回収した濾液は、切削液の主成分として再利用に供される。 The collected filtrate is reused as the main component of the cutting fluid.
本発明の他の形態は、上記の濾過工程に代えて遠心分離処理をする工程が入る。ここでの遠心分離は100〜3000G以上の遠心力が必要になり、好ましくは10000G程度である。 Another embodiment of the present invention includes a step of performing a centrifugal separation process instead of the above filtration step. Centrifugation here requires a centrifugal force of 100 to 3000 G or more, preferably about 10000 G.
以下に本発明を実施例によりさらに具体的に説明するが、本発明はこれに限定されるものではない。 The present invention will be described more specifically with reference to the following examples, but the present invention is not limited thereto.
単結晶シリコンインゴットをワイヤソーを用いて切削加工した後、スラリー廃液が得られた。切削加工の際には水を含有するジエチレングリコールが主成分の切削液が用いられた。このスラリー廃液に遠心分離処理(3000G)を行い、砥粒および加工くず層と回収廃液層に分離した。以下この回収廃液を用いて処理した。回収廃液の状態は、灰色の濁色であった。なお、実施例中で用いた添加剤は以下のとおりである。また、収率は以下のように求めた。 After cutting the single crystal silicon ingot using a wire saw, a slurry waste liquid was obtained. In the cutting process, a cutting fluid mainly composed of diethylene glycol containing water was used. The slurry waste liquid was subjected to a centrifugal separation process (3000 G), and separated into abrasive grains and a processing waste layer and a recovered waste liquid layer. Thereafter, this recovered waste liquid was used for treatment. The state of the recovered waste liquid was a gray turbid color. In addition, the additive used in the Example is as follows. Moreover, the yield was calculated | required as follows.
〔添加剤〕
シランカップリング剤: 3−アミノプロピルトリヒドロキシシラン縮合物の50%水溶液(チッソ製サイラエースSF−330)
シリコン系消泡剤:ポリオルガノシロキサン(ダウコーニングアジア製FSアンチフォーム#544)
凝集剤1(比較例):水溶性高分子凝集剤(日油製マリアリムAKM−0531)
凝集剤2(比較例):油溶性高分子凝集剤(日油製マリアリムAAB−0851)
〔収率〕
油分回収率=濾液量÷採取廃液量÷油分率*
*廃液中に含まれる油分の量
〔Additive〕
Silane coupling agent: 50% aqueous solution of 3-aminopropyltrihydroxysilane condensate (Chiasso Silaace SF-330)
Silicone defoamer: Polyorganosiloxane (FS Antifoam # 544 from Dow Corning Asia)
Flocculant 1 (Comparative Example): Water-soluble polymer flocculant (Marilim AKM-053 made by NOF)
Flocculant 2 (Comparative Example): Oil-soluble polymer flocculant (NOF Mariarim AAB-0851)
〔yield〕
Oil recovery rate = filtrate volume ÷ collection waste liquid volume ÷ oil content ratio *
* Amount of oil contained in the waste liquid
〔実施例1〕
回収廃液100gをビーカーに採り、50℃に加温し、それぞれの添加剤を回収廃液全量に対して1%加え30分攪拌後、直径10.5cmの大きさのヌッチェにNo.2の濾紙を置き、その上にケイソウ土30gを敷き詰めた上に溶液を流し、減圧濾過を行った。真空ポンプで2〜3mmHg程度まで減圧した。
[Example 1]
100 g of the collected waste liquid is put in a beaker, heated to 50 ° C., 1% of each additive is added to the total amount of the collected waste liquid, stirred for 30 minutes, and then added to a Nutsche having a diameter of 10.5 cm. The filter paper of No. 2 was placed, and 30 g of diatomaceous earth was laid on top of the filter paper. The pressure was reduced to about 2-3 mmHg with a vacuum pump.
清浄性の評価は以下の実施例2〜4でも同様である。
比較例の収率は、清浄性が×なので出していない。
上記のシランカップリング剤添加の濾液の成分は、GPC(ゲル浸透クロマトグラフィー)にて分析を行った結果、ジエチレングリコールが検出された。また、カールフィッシャー法により水分量を測定した結果、水を約7%含有していた。また、臭気はほとんどなかった。
The yield of the comparative example is not given because the cleanliness is x.
Diethylene glycol was detected as a result of analysis by GPC (gel permeation chromatography) on the components of the filtrate with the silane coupling agent added. Further, as a result of measuring the water content by the Karl Fischer method, it contained about 7% of water. Moreover, there was almost no odor.
〔実施例2〕
実施例1においてシランカップリング剤の添加量を変化させて観察した。
[Example 2]
In Example 1, it observed by changing the addition amount of a silane coupling agent.
〔実施例3〕
実施例1において回収廃液の攪拌温度を変化させてシランカップリング剤1.0%を添加して観察した。
但し、実施例1および2とは別の回収廃液を用いたため同じ条件でも若干数値が異なっている。
Example 3
In Example 1, the stirring temperature of the recovered waste liquid was changed, and 1.0% of a silane coupling agent was added and observed.
However, since a recovered waste liquid different from those in Examples 1 and 2 was used, the numerical values were slightly different even under the same conditions.
〔実施例4〕
実施例1のシランカップリング剤において濾紙に代えて濾布を用いて濾過を行った。
Example 4
The silane coupling agent of Example 1 was filtered using a filter cloth instead of filter paper.
〔実施例5〕
回収廃液にシランカップリング剤を添加し下記の条件で遠心分離処理を行い観察した。
(条件1)高速冷却遠心分離機(回転半径 9.63cm、遠心力 3000G、5000G、10000G)を用いた。温度(25℃ 室温)、遠心時間:10分間、試料量:50ml、シランカップリング剤の添加量:0%、1%、2%
(条件2)条件1の各試料を5日間静置した。
Example 5
The recovered effluent was added with a silane coupling agent and centrifuged and observed under the following conditions.
(Condition 1) A high-speed cooling centrifuge (rotating radius: 9.63 cm, centrifugal force: 3000 G, 5000 G, 10000 G) was used. Temperature (25 ° C room temperature), centrifugation time: 10 minutes, sample volume: 50 ml, addition amount of silane coupling agent: 0%, 1%, 2%
(Condition 2) Each sample of Condition 1 was allowed to stand for 5 days.
(条件1)遠心分離後の液の清浄性を観察した。
(Condition 1) The cleanliness of the liquid after centrifugation was observed.
(条件2)条件1で行った遠心分離後の液を5日間静置して清浄性を観察した。
Claims (4)
その回収液にケイ素化合物を添加して濾過をすることを特徴とする廃液の処理方法。 After centrifuging the cutting waste liquid of brittle material,
A method for treating a waste liquid, comprising adding a silicon compound to the recovered liquid and performing filtration.
その回収液に窒素原子および水酸基を有するケイ素化合物を添加後、遠心分離処理することを特徴とする廃液の処理方法。 After centrifuging the cutting waste liquid of brittle material,
A method for treating a waste liquid, comprising adding a silicon compound having a nitrogen atom and a hydroxyl group to the recovered liquid and then performing a centrifugal separation process.
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JP2006035039A (en) * | 2004-07-23 | 2006-02-09 | Touzai Kagaku Sangyo Kk | Water treating method |
JP2007083226A (en) * | 2005-08-24 | 2007-04-05 | Tokuyama Corp | Method for treatment of wastewater containing fumed silica |
JP2007185647A (en) * | 2005-08-24 | 2007-07-26 | Tokuyama Corp | Method of treating silicon powder-containing drainage |
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