JP2010073982A - Boiling type cooling unit - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a boiling type cooling unit that improves the efficiency of cooling a heat generating material by suppressing fall of heat transferring efficiency between a heat generating material and a refrigerant. <P>SOLUTION: The boiling type cooling unit 1 includes a refrigerant tank 11 for storing the refrigerant within the internal side and an inverter circuit 23 provided at a side surface 11a in the front side of refrigerant tank 11. The inverter circuit 23 includes an element 21 for heating the refrigerant in the refrigerant tank 11 until it is boiled. Moreover, the boiling type cooling unit 1 also includes a sound wave generator 24 at a side surface 11b in the rear side of refrigerant tank 11. When the refrigerant is heated and boiled with the element 21, bubbles are deposited to a heating surface 11c within the refrigerant tank 11. The sound wave generated by the sound wave generator 24 is propagated to the refrigerant tank 11 to vibrate the refrigerant tank 11 and refrigerant. When the refrigerant tank 11 and refrigerant are vibrated, bubbles deposited to the heat transferring surface 11c are removed. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a boiling cooling device, and more particularly to a configuration around a housing portion of the boiling cooling device.

  Patent Document 1 discloses a boiling cooling device for cooling elements constituting an inverter circuit of an electric vehicle. According to this, the boiling cooling device is provided with a refrigerant tank in which a refrigerant is stored, and an element as a heating element is fixed to the outer surface of the refrigerant tank in close contact with the refrigerant tank. The refrigerant in the refrigerant tank is heated and boiled by the generated element, and cools the element by heat taken from the element when boiling, that is, latent heat of evaporation. Moreover, the boiling cooling device is provided in the upper part of a refrigerant tank, and is equipped with the heat radiator which has a some heat radiating tube inside. The refrigerant vapor boiled in the refrigerant tank is led into the radiator and flows into the radiator from one end side of the radiator pipe. The steam that has flowed into the heat radiating pipe is cooled and liquefied while flowing through the heat radiating pipe, and is returned to the refrigerant tank from the other end of the heat radiating pipe.

JP 2001-250896 A

  However, in the boiling cooling device described in Patent Document 1, bubbles generated when the refrigerant boils are formed on the heat transfer surface, which is a part where the element and the refrigerant tank are in close contact with each other, among the internal surfaces of the refrigerant tank. Adhere to. Since the heat transfer coefficient of gas is lower than that of liquid or solid, heat transfer from the element to the refrigerant is hindered when bubbles are attached to the heat transfer surface, and the cooling efficiency of the element decreases. It was.

  The present invention has been made to solve such problems, and provides a boiling cooling device that suppresses a decrease in heat transfer coefficient between the heating element and the refrigerant and improves the cooling efficiency of the heating element. For the purpose.

  The boiling cooling device according to the present invention includes an accommodating portion in which a refrigerant is accommodated, and a heating element that is cooled by exchanging heat with the refrigerant in the accommodating portion via a heat transfer surface provided in the accommodating portion. A boiling cooling device in which the heating element is cooled by latent heat of vaporization when the heating element boils the refrigerant, further comprising a vibration generating unit that generates vibration, and the vibration generated by the vibration generating unit is applied to the heat transfer surface. It transmits and vibrates a heat-transfer surface, It is characterized by the above-mentioned.

  When the heat generating body and the refrigerant exchange heat through the heat transfer surface inside the housing part, bubbles generated when the heated refrigerant boils adhere to the heat transfer surface. The boiling cooling device includes a vibration generating unit that generates vibration, and the vibration generating unit vibrates the heat transfer surface, so that bubbles attached to the heat transfer surface are separated and removed by vibration. Since the bubbles are removed from the heat transfer surface, the heat generated by the heating element is transferred to the refrigerant without being blocked by the bubbles having a low heat transfer coefficient. Therefore, in the boiling cooling device, it is possible to suppress a decrease in the heat transfer coefficient between the heating element and the refrigerant and improve the cooling efficiency of the heating element.

  A condensing unit that cools and liquefies the vapor generated when the heating element boils the refrigerant may be further provided, and the storage unit and the condensing unit may be integrally arranged without being separated from each other.

  The vibration generation unit may be a sound wave transmission unit, and the sound wave transmission unit may be a sound wave transmitter that converts electric energy into sound waves and transmits the sound waves.

  The vibration generating unit is a sound wave transmitting unit, and the sound wave transmitting unit is provided at a tubular acoustic tube in which a heat accumulator is provided and one end of the heat accumulator, and is heated at one end of the heat accumulator. A side heat exchanger and a low-temperature side heat exchanger that is provided at the other end of the regenerator and cools the other end of the regenerator, between the high-temperature side heat exchanger and the low-temperature side heat exchanger Thus, a thermoacoustic sound transmitter that transmits sound waves into the acoustic tube by generating a temperature gradient in the heat accumulator may be used. When one end of the regenerator is heated by the high temperature side heat exchanger and the other end of the regenerator is cooled by the low temperature side heat exchanger, a sound wave due to a thermoacoustic phenomenon is transmitted from the regenerator into the acoustic tube. Since a heat source capable of heating the high-temperature side heat exchanger is present in the system using the boiling cooling device, sound waves can be transmitted without requiring a power source or the like.

  The acoustic tube may be a cylindrical member whose both ends are closed. When sound waves are transmitted in a cylindrical acoustic tube whose both ends are blocked, standing waves amplified by reflecting the sound waves at the ends can be generated. The housing portion can be vibrated to the maximum by bringing the housing portion into contact with the portion where the vibration is maximum in the axial direction of the acoustic tube. Therefore, the bubble adhering to the heat transfer surface can be most efficiently removed.

  The acoustic tube may be a cylindrical member having a loop shape. For example, on the basis of the idea described in paragraph numbers [0044] to [0045] of Japanese Patent Laid-Open No. 10-325625, if a plurality of heat accumulators are arranged in the loop, etc., the sound wave is circulated in the acoustic tube. Become a wave. That is, a predetermined vibration can be applied to the housing portion regardless of which part of the acoustic tube is brought into contact with the housing portion. Therefore, the degree of freedom in arrangement at the position where the housing portion and the acoustic tube are brought into contact with each other can be increased.

  A circulation passage may be provided for circulating the refrigerant in the storage unit between the storage unit and the low temperature side heat exchanger.

  According to the present invention, in the boiling cooling device, it is possible to suppress a decrease in the heat transfer coefficient between the heating element and the refrigerant and to improve the cooling efficiency of the heating element.

Embodiments of the present invention will be described below with reference to the accompanying drawings.
Embodiment 1 FIG.
The configuration of the boiling cooling device 1 according to Embodiment 1 of the present invention will be described with reference to FIGS. 1 to 3 by taking as an example a case where it is applied for cooling an inverter circuit mounted on an automobile. In addition, the up-down direction and the front-back direction in the boiling cooling device 1 are prescribed | regulated by each arrow shown in FIGS.

  As shown in FIG. 1, the boiling cooling device 1 includes a refrigerant tank 11 that is an accommodating portion in which a refrigerant such as water is accommodated. The refrigerant tank 11 includes a layer body 12 having a flat shape with a small thickness in the front-rear direction and opening upward and downward. An end cap 13 is joined to the lower end portion of the layer body 12 and closes the opening on the lower side of the layer body 12. The refrigerant is stored in the refrigerant tank 11 configured as described above.

  An inverter circuit 23 in which a plurality of elements 21 as heating elements are arranged on a substrate 22 is provided on the side surface 11a on the front side of the refrigerant tank 11, and the adhered substrate 22 and the side surface 11a are brazed. As a result, these are fixed together. The element 21 that has generated heat is supplied to the refrigerant tank 11 via a heat transfer surface 11c that is a part of the inner surface of the refrigerant tank 11 where the substrate 22 is fixed to the outside, that is, a part to which heat from the element 21 is transmitted. Heat exchange is performed with the refrigerant inside. Therefore, the element 21 that has generated heat is configured to heat and boil the refrigerant in the refrigerant tank 11 through the substrate 22 and the heat transfer surface 11c, and evaporation that is heat taken away from the element 21 when the refrigerant boils. The element 21 is cooled by the latent heat.

  On the other hand, a sound wave transmitter 24 that converts electric energy supplied from a power source (not shown) into sound waves and transmits the sound waves is provided on the side surface 11b on the rear side of the refrigerant tank 11 as a sound wave transmitting unit. The sound wave transmitter 24 is fixed to the side surface 11b so as to be integrated with the refrigerant tank 11, and when the sound wave transmitter 24 transmits sound waves, the sound wave is transmitted to the refrigerant tank 11, and the refrigerant tank 11 and The internal refrigerant vibrates. That is, the sound wave transmitter 24 constitutes a vibration generating unit in the boiling cooling device 1.

  Further, the sound wave transmitter 24 is provided at a portion facing the inverter circuit 23. Therefore, the vibration of the refrigerant generated by the sound wave transmitted from the sound wave transmitter 24 is a part of the inner surface of the refrigerant tank 11 where the substrate 22 is fixed to the outside, that is, a part where heat from the element 21 is transmitted. The heat transfer surface 11c is configured to be directly transmitted.

  In the upper part of the refrigerant tank 11, there is provided a condensing unit 31 for cooling and liquefying the vapor generated when the refrigerant heated by the element 21 of the inverter circuit 23 boils in the refrigerant tank 11. The condensing unit 31 includes a connecting pipe 32 joined to the upper end of the layer body 12, a shell 33 joined to the rear part of the connecting pipe 32, and a plurality of condensing pipes 34 accommodated in the shell 33. An opening on the upper side of the layer body 12 is closed by the connecting pipe 32.

  As shown in FIG. 2, a partition wall 12 a extending from the upper end portion of the layer body 12 to the lower end portion is provided inside the refrigerant tank 11, and the boiling area occupying most of the area in the refrigerant tank 11. 14 and a reflux region 15 which is the remaining region. A gap 16 is formed between the lower end 12 b of the partition wall 12 a and the inner bottom surface 13 a of the end cap 13, and the boiling region 14 and the reflux region 15 communicate with each other through the gap 16.

  On the other hand, a partition wall 32a is also provided inside the connecting pipe 32 provided on the upper part of the layer body 12, and the inside of the connecting pipe 32 communicates with the boiling region 14 through the first series chamber 32b and the reflux region. 15 is divided into a second communication chamber 32c communicating with the second communication chamber 32c. Further, on the rear wall surface of the connection pipe 32, communication holes 32d and 32e penetrating into the shell 33 joined to the rear part of the connection pipe 32 are formed in the first communication chamber 32b and the second communication chamber 32c, respectively. Has been.

  As shown in FIG. 3, the condensing tube 34 is a flat member formed by joining a pair of plates 34a and 34b, and a hollow portion 34c is formed therein. Each condensing tube 34 is stacked so as to form a gap 35 between adjacent condensing tubes 34 and to be in contact at both ends thereof. Furthermore, communication holes 34 d and 34 e communicating with adjacent condensation tubes 34 are formed at both ends of the condensation tube 34. Note that the communication holes 34 d and 34 e of the condensing pipe 34 located at the foremost side communicate with the communication holes 32 d and 32 e of the connection pipe 32, respectively. Further, in the condensing pipe 34 located on the most rear side, communication holes 34 d and 34 e are not formed in a portion facing the inner surface of the shell 33.

At both ends of the shell 33, connection ports 33a and 33b connected to cooling water passages through which engine cooling water (not shown) flows are formed. The cooling water flowing into the shell 33 through the connection port 33a passes through the gaps 35 between the plurality of condensing pipes 34 and is returned to the cooling water passage through the connection port 33b.
Further, as shown in FIG. 2, the condensing tube 34 is arranged such that the height of the end portion on the boiling region 14 side is located higher than the height of the end portion on the reflux region 15 side.

Next, the operation of the boiling cooling apparatus 1 according to Embodiment 1 of the present invention will be described.
As shown in FIG. 1, when the element 21 of the inverter circuit 23 generates heat, the heat is transmitted to the refrigerant in the refrigerant tank 11 via the substrate 22 and the heat transfer surface 11c in the refrigerant tank 11, and the refrigerant is heated. Has been boiling. When the refrigerant boils, bubbles generated at that time adhere to the heat transfer surface 11c. Here, when the sound wave transmitter 24 provided on the side surface 11b on the rear side of the refrigerant tank 11 transmits sound waves, the sound waves are transmitted and the heat transfer surface 11c of the refrigerant tank 11 vibrates. Due to this vibration, the bubbles attached to the heat transfer surface 11c are peeled off and removed from the heat transfer surface 11c.

  As shown in FIG. 2, the boiling steam of the refrigerant flows from the boiling region 14 through the first series chamber 32 b of the connection pipe 32 and the communication hole 32 d of the connection pipe 32 as indicated by an arrow A in FIG. 2. It flows into the condenser tube 34. As shown in FIG. 3, the vapor | steam guide | induced in each condensation pipe | tube 34 via 34 d of communicating holes is cooled by the cooling water which flowed in in the shell 33 via the connection port 33a, and the cavity 34c of the condensation pipe | tube 34 Liquefies inside. The liquefied refrigerant flows into the second communication chamber 32c (see arrow B in FIG. 2) through the communication holes 34e of the respective condensation pipes 34 and the communication holes 32d of the connection pipes 32, and the recirculation region 15 in the refrigerant tank 11. And returned to the boiling region 14 via the gap 16 (see arrow C in FIG. 2).

  In this way, when the element 21 of the inverter circuit 23 and the refrigerant exchange heat through the heat transfer surface 11c in the refrigerant tank 11, bubbles generated when the heated refrigerant boils out. It adheres to 11c. The boiling cooling device 1 includes a sound wave transmitter 24 that generates vibration. Since the sound wave transmitter 24 vibrates the heat transfer surface 11c, bubbles adhering to the heat transfer surface 11c are separated and removed by vibration. The Since the bubbles are removed from the heat transfer surface 11c, the heat generated by the element 21 is transmitted to the refrigerant without being blocked by the bubbles having a low heat transfer coefficient. Therefore, in the boiling cooling device 1, it is possible to suppress a decrease in the heat transfer coefficient between the element 21 of the inverter circuit 23 and the refrigerant, and to improve the cooling efficiency of the element 21.

Embodiment 2. FIG.
Next, a boiling cooling device according to Embodiment 2 of the present invention will be described. The boiling cooling device 51 according to the second embodiment is configured by using a thermoacoustic sound wave transmitter described below instead of the sound wave transmitter according to the first embodiment. In the following embodiments, the same reference numerals as those in FIGS. 1 to 3 have the same or similar configurations, and detailed description thereof will be omitted.

  As shown in FIG. 4, the boiling cooling device 51 includes the refrigerant tank 11, the inverter circuit 23, and the condensing unit 31 in the same manner as the boiling cooling device 1 in the first embodiment. Moreover, the boiling cooling device 51 includes a thermoacoustic sound wave transmitter 61 that converts the thermal energy of engine exhaust gas (not shown) into sound waves and transmits the sound waves as a sound wave transmitting unit.

  The thermoacoustic sound wave transmitter 61 includes an acoustic tube 62 having a cylindrical shape whose both ends are closed, and a sound wave generation unit 63 for transmitting sound waves into the acoustic tube 62. The refrigerant tank 11 and the acoustic tube 62 are provided. And are in contact. The sound wave generator 63 is provided at the other end of the heat accumulator 64 provided inside the acoustic tube 62, the high-temperature side heat exchanger 65 provided at one end of the heat accumulator 64, and the heat accumulator 64. And a low temperature side heat exchanger 66.

  A branch passage 52a branched from the exhaust pipe 52 of the engine (not shown) is connected to the high temperature side heat exchanger 65, and a part of the exhaust gas flowing through the exhaust pipe 52 flows into the branch passage 52a and becomes hot. It passes through the side heat exchanger 65 and is returned to the exhaust pipe 52. On the other hand, a branch passage 53a branched from a cooling water passage 53 through which cooling water for cooling the inside of the engine flows is connected to the low temperature side heat exchanger 66. The cooling water passage 53 is also connected to the condensing unit 31 so as to cool the refrigerant vapor introduced into the condensing unit 31. The cooling water passage 53 is connected to a radiator 54 for cooling the cooling water.

Here, the configuration of the sound wave generator 63 will be described with reference to FIGS.
As shown in FIG. 5, the acoustic tube 62 is divided into a first tube portion 62a, a second tube portion 62b, and a third tube portion 62c, and the first tube portion 62a and the third tube portion 62c are divided. A heat accumulator 64 is provided in the second pipe portion 62b located therebetween. The heat accumulator 64 is provided, for example, as a member in which thin plates made of a metal such as stainless steel or ceramic are laminated, or as a honeycomb-like member made of a metal or ceramic such as stainless steel, and inside thereof, along the axial direction of the acoustic tube 62. A narrow channel (not shown) extending in the direction is formed.

  The high temperature side heat exchanger 65 has a heat transfer plate 68 sandwiched between a first pipe portion 62a and a second pipe portion 62b via a pair of heat insulating members 67a and 67b, and a U-shaped cross-sectional shape. And an annular flow path forming portion 69 joined so as to cover the outer peripheral portions of the heat insulating members 67a and 67b and the heat transfer plate 68. The heat transfer plate 68 is a honeycomb-like or grid-like wire net formed of a material having high thermal conductivity such as copper (Cu), and is in contact with one end of the heat accumulator 64. As shown in FIG. 6, the flow path forming part 69 forms an annular flow path 69a on the outer periphery of the heat transfer plate 68, and a branch path 52a is connected to the flow path 69a. That is, the heat energy of the exhaust gas flowing into the branch passage 52 a from the exhaust pipe 52 is transmitted to one end of the heat accumulator 64 through the heat transfer plate 68.

  Similarly, the low temperature side heat exchanger 66 includes a heat transfer plate 71 sandwiched between the second pipe portion 62b and the third pipe portion 62c via a pair of heat insulating members 70a and 70b, and a U-shaped cross-sectional shape. And an annular flow path forming member 72 joined so as to cover the outer peripheral portions of the heat insulating members 70a and 70b and the heat transfer plate 71. The heat transfer plate 71 is in contact with the other end of the heat accumulator 64. As shown in FIG. 7, the flow path forming member 72 forms an annular flow path 72 a on the outer periphery of the heat transfer plate 71, and the cooling water path 53 is connected to the flow path 72 a. That is, the other end portion of the heat accumulator 64 is cooled by the cooling water flowing through the flow path 72 a via the heat transfer plate 71.

  In the sound wave generator 63 configured as described above, the heat energy of the exhaust gas introduced into the branch passage 52 a is transmitted to one end of the heat accumulator 64 through the high temperature side heat exchanger 65, and one end of the heat accumulator 64. Is heated. On the other hand, the other end of the heat accumulator 64 is cooled by the cooling water flowing through the cooling water passage 53 via the low temperature side heat exchanger 66. Therefore, the end of the heat accumulator 64 on the high temperature side heat exchanger 65 side becomes high temperature, the end on the low temperature side heat exchanger 66 side becomes low temperature, and a temperature gradient is generated between both ends of the heat accumulator 64. When a temperature gradient is generated between both ends of the heat accumulator 64, a working fluid in the heat accumulator 64 (for example, atmospheric pressure air or pressurized helium-argon mixed gas) self-excites and generates sound waves. About the mechanism in which a sound wave generate | occur | produces, it describes in the paragraph number [0002] of Unexamined-Japanese-Patent No. 2006-2738, for example.

  Further, as shown in FIG. 8, since both ends of the acoustic tube 62 are closed, the acoustic tube 62 includes a sound wave transmitted from the sound wave generating unit 63 and a sound wave reflected by the end of the acoustic tube 62. As a result, the standing waves W appear to stop and vibrate on the spot without causing the waveforms to proceed. The refrigerant tank 11 and the acoustic tube 62 are arranged so as to be in contact with each other at a portion P separated from the end of the acoustic tube 62 by a distance that is ¼ of the wavelength λ of the standing wave W.

Next, the operation of the boiling cooling device 51 according to Embodiment 2 of the present invention will be described. In addition, since the operation | movement which cools the element of an inverter circuit with the evaporation latent heat at the time of boiling the refrigerant | coolant in the refrigerant tank 11 is the same as that of Embodiment 1, the description is abbreviate | omitted.
As shown in FIG. 4, a part of the exhaust gas discharged from the engine (not shown) into the exhaust pipe is introduced into the high temperature side heat exchanger 65 via the branch passage 52a and passes through the outer peripheral portion of the acoustic pipe 62. Then, it is returned into the exhaust pipe 52. When passing through the high temperature side heat exchanger 65, the heat energy of the exhaust gas is transmitted to one end of the heat accumulator 64 via the heat transfer plate 68 of the high temperature side heat exchanger 65, and one end of the heat accumulator 64 is Heated. On the other hand, when the cooling water circulating in the cooling water passage 53 passes through the low temperature side heat exchanger 66, the other end of the heat accumulator 64 is cooled. The end portion on the high temperature side heat exchanger 65 side is overheated, and the end portion on the low temperature side heat exchanger 66 side is cooled, so that a temperature gradient is generated between both end portions of the heat accumulator 64. When a temperature gradient is generated between both ends of the heat accumulator 64, the working fluid in the heat accumulator 64 is self-excited to transmit sound waves. Since both ends of the acoustic tube 62 are closed, a standing wave W having a wavelength λ is generated inside the acoustic tube 62 as shown in FIG.

  Here, the refrigerant tank 11 and the acoustic tube 62 have a maximum vibration in the portion P that is separated from the end of the acoustic tube 62 by a distance that is ¼ of the wavelength λ of the standing wave W. At a certain position (that is, the portion where the antinode of the standing wave W is located). Therefore, the maximum vibration due to the transmitted sound wave is transmitted to the refrigerant tank 11, and the refrigerant in the refrigerant tank 11 and the refrigerant tank 11 vibrates and adheres to the heat transfer surface 11c (see FIG. 1) in the refrigerant tank 11. Air bubbles are removed.

  As described above, when one end of the heat accumulator 64 is heated by the high temperature side heat exchanger 65 and the other end of the heat accumulator 64 is cooled by the low temperature side heat exchanger 66, sound waves due to a thermoacoustic phenomenon are transmitted from the heat accumulator 64 to the acoustic tube 62. Since the sound waves are transmitted to the refrigerant tank 11, the same effect as in the first embodiment can be obtained. Further, the system using the boiling cooling device 51 has a heat source that can heat the high-temperature side heat exchanger 65 such as an engine that exhausts exhaust gas, so that a power source or the like is not required. Sound waves can be transmitted.

In addition, since the acoustic tube 62 is a cylindrical member whose both ends are closed, when a sound wave is transmitted within the acoustic tube 62, the standing wave W amplified by reflecting the sound wave at the end portion may be generated. it can. And the refrigerant tank 11 can be vibrated to the maximum by making the site | part P and the refrigerant tank 11 which become the largest vibration in the axial direction of the acoustic tube 62 contact. Therefore, it is possible to most efficiently remove bubbles adhering to the heat transfer surface 11c.
In addition, a general vibration generator is consumed due to wear or the like, but a thermoacoustic sound wave transmitter has an advantage that it is difficult to wear because there is little wear or the like.

Embodiment 3 FIG.
Next, a boiling cooling device according to Embodiment 3 of the present invention will be described. The boiling cooling device 81 according to the third embodiment is configured by using the acoustic tube described below instead of the acoustic tube of the thermoacoustic acoustic wave transmitter with respect to the boiling cooling device in the second embodiment. is there.
As shown in FIG. 9, the boiling cooling device 81 includes a thermoacoustic sound wave transmitter 91. The thermoacoustic acoustic wave transmitter 91 has a tubular acoustic tube 92 in a loop shape and a sound wave generating unit 63 similar to that of the second embodiment, so that the refrigerant tank 11 and the acoustic tube 92 are in contact with each other. Is arranged. Other configurations are the same as those in the second embodiment.

  In the boiling cooling device 81 configured as described above, the exhaust gas flowing through the exhaust pipe 52 heats one end of the heat accumulator 64 via the high temperature side heat exchanger 65 and flows through the cooling water passage 53. The cooling water to be cooled cools the other end of the heat accumulator 64 through the low temperature side heat exchanger 66. When a temperature gradient is generated in the heat accumulator 64 in this manner, the heat accumulator 64 transmits sound waves that travel in the direction indicated by the arrow D in FIG. 9 into the loop-shaped acoustic tube. This sound wave is transmitted to the refrigerant tank 11 through the contact portion between the refrigerant tank 11 and the acoustic tube 92, and the refrigerant tank 11 vibrates to remove bubbles generated when the refrigerant boils from the heat transfer surface 11c. Is done.

  Thus, when sound waves are transmitted in the loop-shaped acoustic tube 92, the sound waves become traveling waves that circulate in the acoustic tube 92. That is, even if the refrigerant tank 11 is brought into contact with any part of the acoustic tube 92, the refrigerant tank 11 can be given a predetermined vibration. Therefore, the degree of freedom in arrangement at the position where the refrigerant tank 11 and the acoustic tube 92 are brought into contact with each other can be increased.

Embodiment 4 FIG.
Next, a boiling cooling apparatus according to Embodiment 4 of the present invention will be described. The boiling cooling device 101 according to the fourth embodiment is configured to supply the refrigerant in the refrigerant tank to the low temperature side heat exchanger with respect to the boiling cooling device 51 according to the second embodiment.
As shown in FIG. 10, the boiling cooling device 101 includes a circulation passage 111 that connects the refrigerant tank 11 and the low temperature side heat exchanger 66 of the thermoacoustic acoustic wave transmitter 61. Circulation path 111 is connected to annular flow path 72a (see FIG. 7) of low-temperature side heat exchanger 66 instead of cooling water path 53 in the second embodiment. That is, the end of the heat accumulator 64 opposite to the side heated by the exhaust gas is cooled by the refrigerant introduced from the refrigerant tank 11 through the circulation passage 111. Other configurations are the same as those in the second embodiment.
As described above, even when the low temperature side heat exchanger 66 of the thermoacoustic acoustic wave transmitter 61 is configured to be cooled by the refrigerant in the refrigerant tank 11, the same effect as in the second embodiment can be obtained.

In the first to fourth embodiments, the inverter circuit is fixed so that the substrate is in close contact with the refrigerant tank, and the heat generated by the element that is a heating element is transmitted to the refrigerant tank through the substrate. However, the direction in which the inverter circuit is arranged is not limited, and the refrigerant tank and the element can be directly in contact with each other.
In the first to fourth embodiments, the condensing unit is configured as a water-cooled type that cools the refrigerant vapor by introducing engine cooling water into the interior, but the cooling method for the refrigerant is not limited. It is also possible to provide a cooling fan in the part and to make it air-cooled.

In Embodiments 1 to 4, the storage unit is configured as a refrigerant tank in which the refrigerant is stored. However, the present invention is not limited to the configuration in which the refrigerant is stored in the inside. It is also possible to adopt a configuration in which the refrigerant is not stored in the storage unit, that is, a configuration in which the refrigerant circulates without staying in the storage unit.
In the first to fourth embodiments, the heating element is arranged outside the refrigerant tank that is the housing portion. However, the heating element can be arranged in the refrigerant tank.

The sound wave transmitting unit may be provided on the side surface 11a on the front side of the refrigerant tank 11 (the surface on which the inverter circuit 23 in which a plurality of elements 21 that are heating elements are arranged on the substrate 22 is provided). By directly vibrating the heat transfer surface, it is possible to efficiently remove bubbles.
In the second to fourth embodiments, the low-temperature side heat exchanger of the thermoacoustic sound wave transmitting unit is configured as a water-cooled type that is cooled by cooling water that circulates in the cooling water passage or refrigerant that circulates in the circulation passage. However, the cooling method is not limited, and an air-cooled structure may be used.

It is a cross-sectional side view which shows the structure of the boiling cooling device which concerns on Embodiment 1 of this invention. It is a front view which shows the structure of the boiling cooling device which concerns on Embodiment 1. FIG. It is sectional drawing which shows the III-III cross section of FIG. It is the schematic which shows the structure of the boiling cooling device which concerns on Embodiment 2 of this invention. It is the schematic which shows the structure of the thermoacoustic acoustic wave transmitter of the boiling cooling device which concerns on this Embodiment 2. FIG. It is the schematic which shows the VI-VI cross section of FIG. It is the schematic which shows the VII-VII cross section of FIG. It is the schematic which shows the structure of the thermoacoustic acoustic wave transmitter of the boiling cooling device which concerns on this Embodiment 2. FIG. It is the schematic which shows the structure of the boiling cooling device which concerns on Embodiment 3 of this invention. It is the schematic which shows the structure of the boiling cooling device which concerns on Embodiment 4 of this invention.

Explanation of symbols

  1, 51, 81, 101 Boiling cooler, 11 Refrigerant tank (container), 11c Heat transfer surface, 21 Inverter circuit element (heating element), 24 Sonic generator (vibration generator, sonic transmitter), 31 Condensation Part, 61,91 thermoacoustic sound wave transmitter (vibration generation part, sound wave wave transmission part), 62,92 acoustic tube, 64 heat accumulator, 65 high temperature side heat exchanger, 66 low temperature side heat exchanger, 111 circulation path.

Claims (7)

An accommodating portion in which a refrigerant is accommodated;
A heating element that is cooled by exchanging heat with the refrigerant in the housing portion via a heat transfer surface provided in the housing portion;
In the boiling cooling device in which the heating element is cooled by latent heat of vaporization when the heating element boils the refrigerant,
A vibration generator for generating vibration;
The boiling cooling device, wherein the vibration generated by the vibration generating unit is transmitted to the heat transfer surface to vibrate the heat transfer surface. Further comprising a condensing unit that cools and liquefies the vapor generated when the heating element boils the refrigerant;
The boiling cooling device according to claim 1, wherein the housing portion and the condensing portion are integrally arranged without being separated from each other.   The boiling cooling device according to claim 1 or 2, wherein the vibration generating unit is a sound wave transmitting unit, and the sound wave transmitting unit is a sound wave transmitter that converts electric energy into the sound wave and transmits the sound wave. The vibration generating unit is a sound wave transmitting unit, and the sound wave transmitting unit is
A tubular acoustic tube provided with a heat accumulator inside;
A high temperature side heat exchanger that is provided at one end of the regenerator and heats the one end of the regenerator;
A low temperature side heat exchanger that is provided at the other end of the heat accumulator and cools the other end of the heat accumulator, between the high temperature side heat exchanger and the low temperature side heat exchanger. The boiling cooling device according to claim 1, wherein the boiling cooling device is a thermoacoustic acoustic wave transmitter that transmits the sound wave into the acoustic tube by generating a temperature gradient in the heat accumulator.   The boiling cooling device according to claim 4, wherein the acoustic tube is a cylindrical member whose both ends are closed.   The boiling cooling device according to claim 4, wherein the acoustic tube is a cylindrical member having a loop shape.   The boiling cooling device according to any one of claims 4 to 6, wherein a circulation passage is provided to circulate the refrigerant in the housing portion between the housing portion and the low-temperature side heat exchanger.

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