JP2010040548A5 - - Google Patents
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- JP2010040548A5 JP2010040548A5 JP2008198150A JP2008198150A JP2010040548A5 JP 2010040548 A5 JP2010040548 A5 JP 2010040548A5 JP 2008198150 A JP2008198150 A JP 2008198150A JP 2008198150 A JP2008198150 A JP 2008198150A JP 2010040548 A5 JP2010040548 A5 JP 2010040548A5
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Claims (20)
環状の開口を形成され前記開口から気体を噴き出し可能になった治具を準備する準備工程と、
基板の表面の直交方向から基板を見て基板の表面に付着した液滴を前記開口で囲う様に前記治具を保持して前記開口から噴き出した気体を基板の表面に吹き付けながら前記治具を基板の表面に沿って相対移動させる走査工程と、
を備えることを特徴とする基板処理方法。 A substrate processing method for processing a substrate with droplets,
A preparation step of preparing a jig formed with an annular opening and capable of ejecting gas from the opening;
The jig is held while blowing the gas blown from the opening onto the surface of the substrate while holding the jig so as to surround the opening with droplets attached to the surface of the substrate when viewed from the direction orthogonal to the surface of the substrate. A scanning process for relative movement along the surface of the substrate;
A substrate processing method comprising:
前記走査工程が前記端面を基板の表面に付着した液滴に接触させて基板の表面の直交方向から基板を見て基板の表面に付着した液滴を前記開口で囲う様に前記治具を保持して前記開口から噴き出した気体を基板の表面に吹き付けながら前記治具を基板の表面に沿って相対移動させる、
ことを特徴とする請求項１に記載の基板処理方法。 Preparing a jig in which the preparation step has an end surface part forming an end surface and an annular opening surrounding the end surface is formed and gas can be ejected from the opening;
The scanning step holds the jig so that the end surface is brought into contact with a droplet attached to the surface of the substrate and the droplet attached to the surface of the substrate is surrounded by the opening when viewed from the direction orthogonal to the surface of the substrate. The jig is relatively moved along the surface of the substrate while blowing the gas blown from the opening to the surface of the substrate.
The substrate processing method according to claim 1 .
を備え、
前記治具が前記開口に囲われた内側に貫通穴を形成され、
前記付着工程が前記開口を基板の表面に向けて前記治具を保持し前記開口から噴き出した気体を基板の表面に吹き付けている際に液滴を前記貫通穴を通過して基板の表面に付着させる、
ことを特徴とする請求項２に記載の基板処理方法。 An attachment process for attaching droplets to the surface of the substrate;
With
A through hole is formed inside the jig surrounded by the opening;
When the attaching step holds the jig with the opening directed toward the surface of the substrate and the gas blown from the opening is sprayed onto the surface of the substrate, the droplet passes through the through hole and adheres to the surface of the substrate. Let
The substrate processing method according to claim 2.
を備え、
前記治具が前記開口に囲われた内側に貫通穴を形成され、
前記回収工程が前記開口を基板の表面に向けて前記治具を保持し前記開口から噴き出した気体を基板の表面に吹き付けている際に基板の表面に付着している液滴を前記貫通穴を通過して回収する、
ことを特徴とする請求項３に記載の基板処理方法。 A recovery process for recovering droplets adhering to the substrate;
With
A through hole is formed inside the jig surrounded by the opening;
When the recovery step holds the jig with the opening facing the surface of the substrate and the gas blown from the opening is sprayed on the surface of the substrate, the droplets attached to the surface of the substrate are removed from the through holes. Pass through and collect,
The substrate processing method according to claim 3 .
前記走査工程において、前記開口を基板の表面に向けたとき基板の表面と前記内周部の端部との距離が基板の表面と前記外周部の端部との距離より短い、
ことを特徴とする請求項４に記載の基板処理方法。 The jig has an outer peripheral part forming the outer periphery of the opening and an inner peripheral part forming the inner periphery of the opening,
In the scanning step, when the opening is directed to the surface of the substrate, the distance between the surface of the substrate and the end of the inner peripheral portion is shorter than the distance between the surface of the substrate and the end of the outer peripheral portion,
The substrate processing method according to claim 4 .
前記端面部が前記開口の内周を形成し、
前記走査工程において、前記開口を基板の表面に向けたとき基板の表面と前記端面との距離が基板の表面と前記外周部の端部との距離よりも短い、
ことを特徴とする請求項５に記載の基板処理方法。 The jig has an outer periphery that forms an outer periphery of the opening;
The end face portion forms the inner periphery of the opening;
In the scanning step, when the opening is directed to the surface of the substrate, the distance between the surface of the substrate and the end surface is shorter than the distance between the surface of the substrate and the end of the outer peripheral portion.
The substrate processing method according to claim 5 .
を備えることを特徴とする請求項６に記載の基板処理方法。 An initial step of bringing the end face close to the surface of the substrate with the opening facing the surface of the substrate and contacting the end face with a droplet attached to the surface of the substrate;
The substrate processing method according to claim 6 , further comprising:
環状の開口を形成され前記開口から気体を噴き出し可能な治具と、
基板の表面の直交方向から基板を見て基板の表面に付着した液滴を前記開口で囲う様に前記治具を保持して前記開口から噴き出した気体を基板の表面に吹き付けながら前記治具を基板の表面に沿って相対移動させる走査機器と、
を備えることを特徴とする基板処理装置。 A substrate inspection apparatus for processing a substrate with droplets,
A jig formed with an annular opening and capable of ejecting gas from the opening;
The jig is held while blowing the gas blown from the opening onto the surface of the substrate while holding the jig so as to surround the opening with droplets attached to the surface of the substrate when viewed from the direction orthogonal to the surface of the substrate. A scanning device for relative movement along the surface of the substrate;
A substrate processing apparatus comprising:
前記走査機器が前記端面を基板の表面に付着した液滴に接触させて基板の表面の直交方向から基板を見て基板の表面に付着した液滴を前記開口で囲う様に前記治具を保持して前記開口から噴き出した気体を基板の表面に吹き付けながら前記治具を基板の表面に沿って相対移動させる
を備えることを特徴とする請求項８に記載の基板処理装置。 The jig has an end surface part that forms an end surface, and an annular opening surrounding the periphery of the end surface is formed, and gas can be ejected from the opening,
The scanning device holds the jig so that the end surface is brought into contact with a droplet attached to the surface of the substrate and the droplet attached to the surface of the substrate is surrounded by the opening when viewed from the direction orthogonal to the surface of the substrate. The substrate processing apparatus according to claim 8, further comprising: relatively moving the jig along the surface of the substrate while blowing the gas ejected from the opening onto the surface of the substrate.
前記開口を基板の表面に向けて前記治具を保持し前記開口から噴き出した気体を基板の表面に吹き付けている際に液滴を前記貫通穴を通過して基板の表面に付着させることをできる、
ことを特徴とする請求項９に記載の基板処理装置。 A through hole is formed inside the jig surrounded by the opening;
When holding the jig with the opening directed toward the surface of the substrate and blowing the gas ejected from the opening onto the surface of the substrate, droplets can pass through the through holes and adhere to the surface of the substrate. ,
The substrate processing apparatus according to claim 9 .
前記開口を基板の表面に向けて前記治具を保持し前記開口から噴き出した気体を基板の表面に吹き付けている際に基板の表面に付着している液滴を前記貫通穴を通過して回収することをできる、
ことを特徴とする請求項１０に記載の基板処理装置。 A through hole is formed inside the jig surrounded by the opening;
While holding the jig with the opening facing the surface of the substrate and blowing the gas blown from the opening onto the surface of the substrate, the liquid droplets adhering to the surface of the substrate pass through the through hole and are collected. Can do,
The substrate processing apparatus according to claim 10 .
前記開口を基板の表面に向けたとき基板の表面と前記内周部の端部との距離が基板の表面と前記外周部の端部との距離より短い、
ことを特徴とする請求項１１に記載の基板処理装置。 The jig has an outer peripheral part forming the outer periphery of the opening and an inner peripheral part forming the inner periphery of the opening,
When the opening is directed to the surface of the substrate, the distance between the surface of the substrate and the end of the inner periphery is shorter than the distance between the surface of the substrate and the end of the outer periphery,
The substrate processing apparatus according to claim 11 .
前記端面部が前記開口の内周を形成し、
前記開口を基板の表面に向けたとき基板の表面と前記端面との距離が基板の表面と前記外周部の端部との距離よりも短い、
ことを特徴とする請求項１２に記載の基板処理装置。 The jig has an outer periphery that forms an outer periphery of the opening;
The end face portion forms the inner periphery of the opening;
When the opening is directed to the surface of the substrate, the distance between the surface of the substrate and the end surface is shorter than the distance between the surface of the substrate and the end of the outer peripheral portion,
The substrate processing apparatus according to claim 12 .
を備えることを特徴とする請求項１３に記載の基板処理装置。 The scanning device can bring the end face close to the surface of the substrate with the opening facing the surface of the substrate to bring the end face into contact with a droplet attached to the surface of the substrate.
The substrate processing apparatus according to claim 13 , comprising:
環状の開口を形成され前記開口から気体を噴き出し可能であり、
基板の表面の直交方向から基板を見て基板の表面に付着した液滴を前記開口で囲う様に保持された状態で前記開口から噴き出した気体を基板の表面に吹き付けできる様になった、
ことを特徴とする液滴保持治具。 A droplet holding jig for holding droplets attached to a substrate,
An annular opening is formed and gas can be ejected from the opening;
The gas blown out from the opening can be blown onto the surface of the substrate in a state where a droplet attached to the surface of the substrate is held so as to be surrounded by the opening when viewed from the direction orthogonal to the surface of the substrate.
A droplet holding jig characterized by that.
備え、
前記端面の周囲を囲う環状の開口を形成され前記開口から気体を噴き出し可能であり、
前記端面を基板の表面に付着した液滴に接触させて基板の表面の直交方向から基板を見て基板の表面に付着した液滴を前記開口で囲う様に保持された状態で前記開口から噴き出した気体を基板の表面に吹き付けできる様になった、
ことを特徴とする請求項１５に記載の液滴保持治具。 The end face part that is the part forming the end face is
Prepared,
An annular opening surrounding the periphery of the end face is formed and gas can be ejected from the opening,
The end surface is brought into contact with a droplet attached to the surface of the substrate, and the droplet attached to the surface of the substrate is blown out from the opening in a state where the substrate is viewed from a direction orthogonal to the surface of the substrate and surrounded by the opening. Can be sprayed on the surface of the substrate,
The droplet holding jig according to claim 15 .
前記開口を基板の表面に向けて保持された状態で前記開口から噴き出した気体を基板の表面に吹き付けている際に液滴を前記貫通穴を通過して基板の表面に付着させることをできる様になっている、
ことを特徴とする請求項１６に記載の液滴保持治具。 A through hole is formed on the inner side surrounded by the opening,
When the gas blown from the opening is sprayed on the surface of the substrate while the opening is held toward the surface of the substrate, the droplets can pass through the through holes and adhere to the surface of the substrate. It has become,
The droplet holding jig according to claim 16 .
前記開口を基板の表面に向けて保持された状態で前記開口から噴き出した気体を基板の表面に吹き付けている際に基板の表面に付着する液滴を前記貫通穴を通過して回収できる様になっている、
ことを特徴とする請求項１７に記載の液滴保持治具。 A through hole is formed on the inner side surrounded by the opening,
When the gas blown from the opening is sprayed onto the surface of the substrate while the opening is held toward the surface of the substrate, the droplets adhering to the surface of the substrate can be collected through the through hole. Has become,
The droplet holding jig according to claim 17 .
前記開口を基板の表面に向けたとき基板の表面と前記内周部の端部との距離が基板の表面と前記外周部の端部との距離より短い、
ことを特徴とする請求項１８に記載の液滴保持治具。 An outer peripheral part forming the outer periphery of the opening and an inner peripheral part forming the inner periphery of the opening;
When the opening is directed to the surface of the substrate, the distance between the surface of the substrate and the end of the inner periphery is shorter than the distance between the surface of the substrate and the end of the outer periphery,
The droplet holding jig according to claim 18 .
前記端面部が前記開口の内周を形成し、
前記開口を基板の表面に向けたとき基板の表面と前記端面との距離が基板の表面と前記外周部の端部との距離よりも短い、
ことを特徴とする請求項１９に記載の液滴保持治具。 Having an outer periphery forming an outer periphery of the opening;
The end face portion forms the inner periphery of the opening;
When the opening is directed to the surface of the substrate, the distance between the surface of the substrate and the end surface is shorter than the distance between the surface of the substrate and the end of the outer peripheral portion,
The droplet holding jig according to claim 19 .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008198150A JP5281331B2 (en) | 2008-07-31 | 2008-07-31 | Substrate processing method, substrate processing apparatus, and droplet holding jig |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008198150A JP5281331B2 (en) | 2008-07-31 | 2008-07-31 | Substrate processing method, substrate processing apparatus, and droplet holding jig |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010040548A JP2010040548A (en) | 2010-02-18 |
| JP2010040548A5 true JP2010040548A5 (en) | 2011-09-15 |
| JP5281331B2 JP5281331B2 (en) | 2013-09-04 |
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| JP5568201B2 (en) * | 2010-06-22 | 2014-08-06 | 有限会社Ｎａｓ技研 | Substrate processing method and substrate processing apparatus |
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| JPH05283498A (en) * | 1991-11-12 | 1993-10-29 | Matsushita Electric Ind Co Ltd | Recovery device for impurity on surface of semiconductor substrate and usage thereof |
| JP3179175B2 (en) * | 1992-03-12 | 2001-06-25 | 株式会社ピュアレックス | Analysis pretreatment method |
| JP3332439B2 (en) * | 1993-01-26 | 2002-10-07 | 株式会社東芝 | Analytical sample preparation apparatus and method of using the same |
| JP4125315B2 (en) * | 2005-10-11 | 2008-07-30 | キヤノン株式会社 | Exposure apparatus and device manufacturing method |
| JP2008147577A (en) * | 2006-12-13 | 2008-06-26 | Canon Inc | Exposure apparatus, and method of manufacturing device |
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